CN113281592A - Electronic element performance testing device and testing method - Google Patents
Electronic element performance testing device and testing method Download PDFInfo
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- CN113281592A CN113281592A CN202110516018.7A CN202110516018A CN113281592A CN 113281592 A CN113281592 A CN 113281592A CN 202110516018 A CN202110516018 A CN 202110516018A CN 113281592 A CN113281592 A CN 113281592A
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- 238000012360 testing method Methods 0.000 title claims abstract description 121
- 230000017525 heat dissipation Effects 0.000 claims abstract description 77
- 230000007246 mechanism Effects 0.000 claims abstract description 70
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 37
- 239000007788 liquid Substances 0.000 claims abstract description 24
- 238000001125 extrusion Methods 0.000 claims description 15
- 238000010521 absorption reaction Methods 0.000 claims description 10
- 230000001105 regulatory effect Effects 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 238000010926 purge Methods 0.000 claims 1
- 230000033228 biological regulation Effects 0.000 abstract description 4
- 238000003780 insertion Methods 0.000 abstract description 4
- 230000037431 insertion Effects 0.000 abstract description 4
- 230000001360 synchronised effect Effects 0.000 abstract description 3
- 230000006978 adaptation Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 6
- 230000008878 coupling Effects 0.000 description 5
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 238000009423 ventilation Methods 0.000 description 4
- 238000007664 blowing Methods 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000011056 performance test Methods 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000010408 sweeping Methods 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses an electronic element performance testing device and a testing method, belonging to the technical field of electronic element testing, and comprising a testing base provided with a lead sleeve, wherein a plurality of connecting mechanisms are limited on two sides of the top of the testing base through adjustable clamping mechanisms, the inner cavities of the connecting mechanisms are subjected to heat circulation through heat dissipation water pumped by a heat dissipation mechanism, the heat dissipation mechanism is fixedly arranged on one side of the testing base, an adjustable bearing mechanism is fixedly connected on the rear side of the testing base, and the connecting mechanism comprises a wire holder. According to the invention, through the designed clamping mechanism, the limiting and the attaching heat dissipation of the circuit boards on the side are realized, and the stability of the insertion connection of a plurality of circuit boards and the synchronous heat dissipation effect are improved; through the heat dissipation mechanism who designs, realize the water liquid circulation regulation and control to a plurality of wire holders and bottom cold liquid water cavity, satisfy the heat-sinking capability under the subregion control and adjust, the adaptation is to the heat dissipation treatment of the electronic component of different calorific capacities, improves the measuring accuracy.
Description
Technical Field
The invention belongs to the technical field of electronic element testing, and particularly relates to an electronic element performance testing device and a testing method.
Background
Electronic components are basic components in a circuit, and generally need to be tested to ensure the normal operation of the electronic components for the performance consideration of an integrated circuit, and the electronic components need to be integrated on a circuit board for performance test due to small volume.
Chinese patent document CN108957034A discloses an electronic component testing system, which includes a rack, a tray placing area, a testing area, a front area transferring device and a testing area transferring device. The tray placing area is adjacently arranged on the frame. The test area is adjacently arranged on the rack and comprises an electronic element test device for testing the electronic element in a tray. The front area shifting device can be arranged on the rack in a displacement manner in the tray placing area and the testing area and is used for taking and placing the tray in the tray placing area. The test area shifting device can be arranged on the rack in a test area displacement mode and is used for replacing the tray to be tested and the tested tray.
The above background art still has the following defects in practical use: 1) when the electronic element is inserted, the electronic element is easy to deviate from the wiring terminal, so that the insertion positioning of the circuit board is influenced, and when the multiple circuit boards are subjected to integrated test and material loading, the multiple circuit boards are easy to collide with each other, so that the test precision is influenced; 2) the electronic element produces more heat easily during operation, and integrated electronic element's circuit board produces a large amount of heats easily when testing, influences electronic element's consumption performance, but the amasss heat between the different circuit boards is different, and the common heat dissipation of single mode leads to mutual temperature to influence each other easily, leads to the test result to appear the deviation, can not be fine satisfies the user demand.
In view of the above, the present invention provides an apparatus and a method for testing performance of an electronic device, so as to solve at least one of the problems in the background art.
Disclosure of Invention
The invention aims to: the device and the method for testing the performance of the electronic element are provided to solve the problems that more heat is easily generated when the electronic element works, a circuit board integrating the electronic element easily generates a large amount of heat when testing, the power consumption performance of the electronic element is influenced, the heat accumulation between different circuit boards is different, the mutual temperature influence is easily caused by common heat dissipation in a single mode, and the deviation of a test result is caused.
In order to achieve the purpose, the invention adopts the following technical scheme:
a performance testing device for electronic elements comprises a testing base provided with a lead sleeve, wherein a plurality of connecting mechanisms are limited on two sides of the top of the testing base through adjustable clamping mechanisms, heat circulation is carried out on cooling water liquid pumped out by a cooling mechanism through an inner cavity of each connecting mechanism, the cooling mechanism is fixedly arranged on one side of the testing base, and an adjustable bearing mechanism is fixedly connected to the rear side of the testing base;
coupling mechanism includes the connection terminal, connection terminal one side is linked together through pipeline and heat dissipation mechanism one side, and connection terminal inner chamber both sides are deflectable to be connected with splint, and connection terminal top fixedly connected with can sweep the elasticity gasbag, and connection terminal one side is laminated spacing with the extrusion board of fixture top one side mutually, and extrusion board one side adjustable connection has the connecting rod, the connecting rod sets firmly in the test base top through articulated seat, connecting rod one side fixedly connected with heating panel, and the heating panel is located coupling mechanism one side and corresponds the position.
As a further description of the above technical solution:
lead to the groove has all been seted up to the connection terminal both sides, and lead to groove and splint sliding connection, and equal fixedly connected with second heat absorption pad between the splint opposite face of both sides, the articulated piece of equal fixedly connected with in connection terminal one side both ends and logical groove corresponding position, and articulated through round pin axle and splint terminal one side between the articulated piece of both sides.
As a further description of the above technical solution:
the elastic air bag top is encircled and communicated with a plurality of nozzles, the nozzles face upwards, the elastic air bag is attached to one side of the clamping plate and is an elastic plastic air bag, and the bottom of the wire holder is communicated with the terminal of the testing base element through a wiring terminal.
As a further description of the above technical solution:
the connecting rod has one side opened the spout, and sliding connection has the slider in the spout, and the slider top inlays and is equipped with the sliding sleeve, and sliding connection has the slide bar in the sliding sleeve, the slide bar both ends correspond position fixed connection with spout inner chamber both sides respectively, sliding sleeve one side and stripper plate one side fixed connection, the slide bar lateral wall cover is equipped with the elastic component, and the elastic component is elasticity rubber spare packing ring.
As a further description of the above technical solution:
the testing base comprises a testing base inner cavity, a testing base outer cavity, a testing base inner cavity, a heat absorption plate and a heat dissipation plate, wherein the testing base inner cavity is communicated with the testing base inner cavity, and the testing base inner cavity is communicated with the testing base inner cavity.
As a further description of the above technical solution:
bear the mechanism and include sharp module, and sharp module fixed connection is in test base one side, sharp module top transmission is connected with bears the seat, bear an inner chamber sliding connection and have two grip blocks, and spacing joint between the grip block of both sides, and the first fan of sharp module top one side fixedly connected with.
As a further description of the above technical solution:
two bear the seat and pass through gag lever post sliding connection in the gag lever post, and gag lever post fixed connection is in one side grip block, and the gag lever post end passes through fixed plate fixed connection in grip block one side, and gag lever post one side inlays and is equipped with the screw cap, and screw cap female connection has fixing bolt, and fixing bolt and gag lever post one side friction surface extrusion are fixed, a plurality of centre gripping grooves have been seted up to the grip block inner chamber, and a plurality of ventilation holes have all been seted up to centre gripping inslot inner chamber both sides, and the ventilation hole is align to grid, and the cross sectional shape that just ventilates is the arc.
As a further description of the above technical solution:
the heat dissipation mechanism comprises a heat dissipation water tank, a second fan is fixedly connected to one side of the heat dissipation water tank, a heat dissipation water liquid is filled in an inner cavity of the heat dissipation water tank, a connection header pipe is communicated with the inner cavity of the heat dissipation water tank through a water pump, a plurality of flow regulating valves are arranged at the tops of the connection header pipe, a plurality of connection bent pipes are communicated with the bottom of each regulating valve, the connection bent pipes are communicated with the inner cavity of the test base, and the other side of the test base is communicated with the.
A test method of an electronic element performance test device is characterized by comprising the following steps:
s1, placing the element to be tested between the clamping plates on the two sides, and pushing the clamping plates to slide so that the clamping plates on the two sides can move to attach the electronic element;
s2, the linear module works to drive the electronic element placed at the top to move to one side of the testing base, the electronic element is inserted into the wire holder at the corresponding position, and the bottom terminal of the wire holder and the testing part are subjected to electric connection testing;
s3, the two side connecting rods are rotated to drive the extrusion plate on one side to be occluded and fixed with the electronic element circuit board, the bottom heat dissipation plate is attached to the circuit board for heat dissipation, the rear heat dissipation mechanism works to drive heat dissipation water liquid to circularly dissipate heat in the connecting header pipe, the connecting bent pipe and the communicating pipe, and after the test is finished, the electronic element is pulled out from the wiring seat, and the test is finished.
In summary, due to the adoption of the technical scheme, compared with the prior art, the invention has the following beneficial effects and advantages:
1. according to the invention, the flexible guiding and limiting of the circuit board can be realized through the designed connecting mechanism, and the portability and the safety of inserting, mounting and positioning are improved; by the designed bearing mechanism, the laminating, limiting and fixing capacity of the feeding and discharging materials of the test circuit board is ensured, the mutual limiting and fixing among electronic elements in the test process is improved, and the electronic elements are prevented from falling off or being damaged due to the mutual collision of the circuit boards in the feeding process; the limiting, the attaching and the heat dissipation of the circuit boards on the side are realized through the designed clamping mechanism, and the stability of the insertion connection of the circuit boards and the synchronous heat dissipation effect are improved; through the heat dissipation mechanism who designs, realize the water liquid circulation regulation and control to a plurality of wire holders and bottom cold liquid water cavity, satisfy the heat-sinking capability under the subregion control and adjust, the adaptation is to the heat dissipation treatment of the electronic component of different calorific capacities, improves the measuring accuracy.
2. Through the coupling mechanism who designs, insert the test element behind the wire holder, the circuit board can realize flexibility spacing through the contact with both sides elasticity gasbag, test element can realize elasticity spacing fixed through the splint of both sides L shape simultaneously, electronic component when avoiding testing takes place the skew and rocks, realize the synchronous detection to a plurality of electronic component through a plurality of coupling mechanism simultaneously, and can bulge to the nozzle through self elasticity when the elasticity gasbag is extruded and realize blowing and sweeping inserting electronic component, guarantee blowing and sweeping the dust removal behind electronic component and the circuit board insertion, avoid the dust to pile up the influence electronic component heat dissipation treatment efficiency.
3. According to the invention, through the designed bearing mechanism, a circuit board to be tested can be placed in the clamping plates at the corresponding positions, the clamping plates at two sides can realize the limiting and fixing of the circuit board through the internal clamping grooves, and after the fixing bolt is screwed and separated from the limiting rod, the limiting sleeve can be pulled to slide outside the limiting rod and drive the clamping plates to move to adapt to the relative spacing of the circuit board, and the air can be blown through the second fan at the rear side to work, so that the air can be blown to dissipate the heat of the tested circuit board, and the top bearing seat and the clamping plates can be moved through the linear module, so that the circuit board to be tested and the tested circuit board can be conveyed and fixed.
4. According to the invention, through the designed clamping mechanism, after the circuit board is inserted and connected, the connecting rod on one side can be deflected to rotate around the pin shaft and drive the top to extrude to be attached to the top of the circuit board main body, the deflectable connecting rod is adapted to the attachment of the circuit board and the external special-shaped surface of the circuit element, and meanwhile, the extruding plate with the slidable top can be adapted to the heights of different circuit boards, so that the clamping limit of the test circuit board is ensured, the external test element is prevented from being deflected and falling off, and the test stability is improved.
5. According to the invention, through the designed heat dissipation mechanism, water liquid in the heat dissipation water tank can be sent into the plurality of connecting bent pipes through the connecting header pipe, meanwhile, cooling water liquid is sent into the connecting bent pipes at the corresponding positions through the flow regulating valves, the cooling water liquid circularly flows in the wire holders of the heat conduction materials to lead out heat, then, the water liquid of different wire holders can be circularly dissipated through different flow regulating valves, the heat dissipation of different circuit boards can be adjusted in a matching manner, the heat dissipation capability of different heat productivity test circuit boards can be adjusted in a matching manner through regional heat dissipation, the heat dissipation efficiency is effectively improved, and the influence of heat accumulation on the test precision of electronic elements is avoided.
Drawings
Fig. 1 is a schematic view of a three-dimensional splitting structure of an electronic component performance testing apparatus according to the present invention;
fig. 2 is a schematic perspective view of an electronic component performance testing apparatus according to the present invention;
FIG. 3 is a schematic view of a three-dimensional structure of a testing base of the electronic device performance testing apparatus according to the present invention;
FIG. 4 is a schematic perspective view of a supporting mechanism of an apparatus for testing performance of electronic components according to the present invention;
FIG. 5 is a schematic perspective view of a clamping plate of an apparatus for testing electronic device performance according to the present invention;
FIG. 6 is a schematic three-dimensional structure of a clamping mechanism of the device for testing performance of electronic components according to the present invention;
fig. 7 is a schematic perspective view of a heat sink plate of an electronic component performance testing apparatus according to the present invention.
Illustration of the drawings:
1. testing the base; 2. a clamping mechanism; 201. a hinged seat; 202. a connecting rod; 203. a pressing plate; 204. a heat dissipation plate; 205. a communicating pipe; 206. a first heat absorption pad; 3. a carrying mechanism; 301. a linear module; 302. a bearing seat; 303. a clamping plate; 304. a vent hole; 305. a limiting sleeve; 306. a limiting rod; 307. fixing the bolt; 308. a fixing plate; 309. a first fan; 4. a connecting mechanism; 401. a wire holder; 402. a hinged block; 403. a through groove; 404. an elastic air bag; 405. a nozzle; 406. a splint; 407. a second heat absorption pad; 5. a heat dissipation mechanism; 501. a heat radiation water tank; 502. a second fan; 503. connecting a main pipe; 504. a flow regulating valve; 505. connecting a bent pipe; 6. and a lead sleeve.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
referring to fig. 1-7, the embodiment discloses an electronic component performance testing device, which includes a testing base 1 having a lead sheath 6, wherein two sides of the top of the testing base 1 are both limited by adjustable clamping mechanisms 2, and a plurality of connection mechanisms 4 are disposed, and the inner cavities of the connection mechanisms 4 are circulated by heat dissipation water pumped by a heat dissipation mechanism 5, and the heat dissipation mechanism 5 is fixedly disposed at one side of the testing base 1, the rear side of the testing base 1 is fixedly connected with an adjustable bearing mechanism 3, the connection mechanisms 4 include a wire holder 401, one side of the wire holder 401 is communicated with one side of the heat dissipation mechanism 5 through a pipeline, and two sides of the inner cavity of the wire holder 401 are connected with a clamp plate 406 in a deflecting manner, and the top of the wire holder 401 is fixedly connected with a blowing elastic airbag 404, and one side of the wire holder 401 is abutted against and limited by a pressing plate 203 at one side of the top of the clamping mechanism 2, and one side of the pressing plate 203 is adjustably connected with a connecting rod 202, the connecting rod 202 is fixedly arranged at the top of the testing base 1 through a hinge seat 201, one side of the connecting rod 202 is fixedly connected with a heat dissipation plate 204, the heat dissipation plate 204 is positioned at a corresponding position at one side of a connecting mechanism 4, both sides of the wire holder 401 are respectively provided with a through groove 403, the through grooves 403 are in sliding connection with a clamping plate 406, a second heat absorption pad 407 is fixedly connected between opposite surfaces of the clamping plates 406 at both sides, both ends at one side of the wire holder 401 correspond to the through grooves 403, hinge blocks 402 are fixedly connected at positions between the hinge blocks 402 at both sides and at one side of the tail end of the clamping plate 406 through pin shafts, the top of the elastic air bag 404 is communicated with a plurality of nozzles 405 in a surrounding manner, the nozzles 405 face upwards, the elastic air bag 404 is jointed with one side of the clamping plate 406, the elastic air bag 404 is an elastic plastic air bag, the bottom of the wire holder 401 is communicated with element terminals of the testing base 1 through a wiring terminal, one side of the connecting rod 202 is provided with a sliding groove, and sliding connection has the slider in the spout, and the slider top inlays and is equipped with the sliding sleeve, and sliding connection has the slide bar in the sliding sleeve, the slide bar both ends correspond position fixed connection with spout inner chamber both sides respectively, sliding sleeve one side and stripper plate 203 one side fixed connection, the slide bar lateral wall cover is equipped with the elastic component, and the elastic component is elasticity rubber spare packing ring, the first heat absorption pad 206 of heating panel 204 one side fixedly connected with, and heating panel 204 both sides fixedly connected with communicating pipe 205, and one side communicating pipe 205 is linked together with one side heat dissipation mechanism 5, and opposite side communicating pipe 205 is linked together with test base 1 inner chamber heat dissipation water cavity.
The positioning adaptability of the circuit board when the circuit board is inserted is improved through the hinging block 402 and the clamping plate 406 deflected by the pin shaft, the clamping plate 406 can avoid the separation and the fracture when the circuit board is inserted through the through groove 403 arranged on one side of the wire holder 401, the L-shaped clamping plate 406 can ensure the limiting and positioning of the circuit board when the circuit board is inserted, the second heat absorption pad 407 in the inner cavity of the clamping plate 406 can absorb heat while ensuring the circuit board to be attached, the extrusion plate 203 is more stable through the sliding of the rear side sliding block in the sliding groove, the sliding block can drive the sliding sleeve to move outside the sliding rod to avoid the deviation of extrusion, meanwhile, the top elastic part can be extruded when the sliding sleeve moves, the pulling and the limiting of the top extrusion plate 203 can be ensured through the self-pulling force of the elastic part, the test base 1 can realize the electrical test of the inserted circuit board through the internal circuit, and a plurality of cold liquid cavities corresponding to the wire holder 401 are arranged behind the test base 1, guarantee the heat dissipation of cold liquid circulation to the circuit board, wire holder 401 can realize demountable assembly through bottom binding post simultaneously, improve the incorruptibility, and side heating panel 204 when contacting with the circuit board, can realize the contact heat transfer to the circuit board through first heat absorption pad 206, and heating panel 204 can realize through both sides communicating pipe 205 with the water liquid circulation of test base 1 cold liquid chamber, guarantee the heat dissipation treatment to the circuit board side, satisfy the test needs to the circuit board of a large amount of productions.
Further, the bearing mechanism 3 comprises a linear module 301, the linear module 301 is fixedly connected to one side of the test base 1, the top of the linear module 301 is in transmission connection with a bearing seat 302, the inner cavity of the bearing seat 302 is in sliding connection with two clamping plates 303, the clamping plates 303 at two sides are in limit clamping connection, one side of the top of the linear module 301 is fixedly connected with a first fan 309, the two bearing seats 302 are in sliding connection in a limiting sleeve 305 through a limiting rod 306, a limiting sleeve 305 is fixedly connected to one side of the clamping plate 303, the tail end of the limiting rod 306 is fixedly connected to one side of the clamping plate 303 through a fixing plate 308, a threaded cap is embedded in one side of the limiting sleeve 305, a fixing bolt 307 is in threaded connection with the threaded cap, the fixing bolt 307 is fixed with the friction surface on one side of the limiting rod 306 in an extrusion manner, a plurality of clamping grooves are formed in the inner cavity of the clamping plate 303, and a plurality of ventilation holes 304 are formed in both sides of the inner cavity of the clamping grooves, the vent holes 304 are uniformly arranged, and the cross section of the vent hole is arc-shaped.
Further, as shown in fig. 3-5, the clamping plate 303 can ensure the limitation of the load through the U-shaped bearing grooves on both sides, the rectangular limiting rod 306 and the limiting sleeve 305 can ensure the stability of the movement of the bearing seat 302 on both sides, the U-shaped bearing seat 302 can ensure the stability of the movement of the clamping plate 303, the clamping plate 303 is prevented from shaking and shifting, and the fixing bolt 307 can ensure the limitation of the distance adjustment of the clamping plate 303 on both sides through the extrusion and the fitting on one side of the limiting rod 306.
Further, heat dissipation mechanism 5 includes heat dissipation water tank 501, heat dissipation water tank 501 one side fixedly connected with second fan 502, heat dissipation water tank 501 inner chamber is filled with heat dissipation water liquid, heat dissipation water tank 501 inner chamber has connecting house steward 503 through the water pump intercommunication, connecting house steward 503 top is equipped with a plurality of flow regulating valves 504, regulating valve bottom intercommunication has a plurality of connecting elbow 505, connecting elbow 505 is linked together with test base 1 inner chamber, test base 1 opposite side is linked together with coupling mechanism 4 through connecting elbow 505.
Further, as shown in fig. 1-3, a ventilation slot for keeping air circulation is disposed on one side of the heat dissipation water tank 501, so as to ensure that the second fan 502 on the rear side can discharge the circulating heat-absorbing coolant liquid when working and rotating, and the flow regulating valve 504 on the top can realize the liquid distribution circulation of the communication pipe 205 on the rear side of the wire holder 401 through a three-way pipeline, thereby avoiding the insufficient water pressure of the circulating liquid, improving the flow regulation of the coolant liquid of a plurality of wire holders 401, adapting to the regulation of the heat dissipation capacity of different areas, and meeting the test requirements.
Example 2:
the embodiment discloses a test method of an electronic element performance test device, which specifically comprises the following steps:
s1, placing the element to be tested between the clamping plates 303 on the two sides, and pushing the clamping plates 303 to slide, so that the clamping plates 303 on the two sides move to attach the electronic element;
s2, the linear module 301 works to drive the electronic element placed at the top to move to one side of the test base 1, the electronic element is inserted into the wire holder 401 at the corresponding position, and the terminal at the bottom of the wire holder 401 and the test part are subjected to electric connection test;
s3, the two side connecting rods 202 are rotated to drive the one side extrusion plate 203 to be meshed and fixed with the electronic element circuit board, the extrusion plate 203 slides more stably in the sliding groove through the rear side sliding block, the sliding block can move to drive the sliding sleeve to move outside the sliding rod, meanwhile, the bottom heat dissipation plate 204 is used for heat dissipation of the circuit board in a laminating mode, meanwhile, the rear side heat dissipation mechanism 5 works to drive heat dissipation water liquid to circularly dissipate heat in the connecting header pipe 503, the connecting bent pipe 505 and the communicating pipe 205, after the test is completed, the electronic element is drawn out from the wiring seat 401, and the test is completed.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (9)
1. The electronic element performance testing device is characterized by comprising a testing base (1), a clamping mechanism (2), a bearing mechanism (3), a connecting mechanism (4) and a heat dissipation mechanism (5); the testing base (1) is provided with a lead sleeve (6), the two sides of the top of the testing base (1) are limited by the adjustable clamping mechanisms (2) and are provided with a plurality of connecting mechanisms (4), the inner cavity of each connecting mechanism (4) is subjected to heat circulation through heat dissipation water liquid pumped out by the heat dissipation mechanism (5), the heat dissipation mechanism (5) is fixedly arranged on one side of the testing base (1), and the rear side of the testing base (1) is fixedly connected with the adjustable bearing mechanism (3).
2. The device for testing the performance of the electronic element according to claim 1, wherein the connection mechanism (4) comprises a wire holder (401), one side of the wire holder (401) is communicated with one side of the heat dissipation mechanism (5) through a pipeline, clamping plates (406) are connected to two sides of an inner cavity of the wire holder (401) in a deflectable manner, a purging elastic air bag (404) is fixedly connected to the top of the wire holder (401), one side of the wire holder (401) is abutted and limited to the extrusion plate (203) on one side of the top of the clamping mechanism (2), one side of the extrusion plate (203) is adjustably connected with a connecting rod (202), the connecting rod (202) is fixedly connected to the top of the testing base (1) through a hinge seat (201), one side of the connecting rod (202) is fixedly connected with a heat dissipation plate (204), the heat dissipation plate (204) is located at a corresponding position on one side of the connection mechanism (4), through grooves (403) are formed in two sides of the wire holder (401), and lead to groove (403) and splint (406) sliding connection, and equal fixedly connected with second heat absorption pad (407) between splint (406) the opposite face of both sides, the articulated piece (402) of equal fixedly connected with in the corresponding position of wire holder (401) one side both ends and logical groove (403), and articulated through round pin axle and splint (406) terminal one side between the articulated piece (402) of both sides.
3. The device for testing the performance of the electronic element is characterized in that a plurality of nozzles (405) are communicated around the top of the elastic air bag (404), the nozzles (405) face upwards, the elastic air bag (404) is attached to one side of the clamping plate (406), the elastic air bag (404) is an elastic plastic air bag, and the bottom of the wire holder (401) is communicated with element terminals of the testing base (1) through wire connecting terminals.
4. The device for testing the performance of the electronic element according to claim 2, wherein a sliding groove is formed in one side of the connecting rod (202), a sliding block is slidably connected in the sliding groove, a sliding sleeve is embedded in the top of the sliding block, a sliding rod is slidably connected in the sliding sleeve, two ends of the sliding rod are respectively fixedly connected with two corresponding positions on two sides of an inner cavity of the sliding groove, one side of the sliding sleeve is fixedly connected with one side of the extrusion plate (203), an elastic member is sleeved on the outer side wall of the sliding rod, and the elastic member is an elastic rubber gasket.
5. The device for testing the performance of the electronic element according to claim 2, wherein a first heat absorption pad (206) is fixedly connected to one side of the heat dissipation plate (204), a communication pipe (205) is fixedly connected to both sides of the heat dissipation plate (204), the communication pipe (205) at one side is communicated with the heat dissipation mechanism (5) at one side, and the communication pipe (205) at the other side is communicated with the heat dissipation water chamber in the inner cavity of the testing base (1).
6. The device for testing the performance of the electronic element according to claim 1, wherein the carrying mechanism (3) comprises a linear module (301), the linear module (301) is fixedly connected to one side of the testing base (1), the top of the linear module (301) is in transmission connection with a carrying seat (302), the inner cavity of the carrying seat (302) is in sliding connection with two clamping plates (303), the clamping plates (303) on two sides are in limit clamping connection, and one side of the top of the linear module (301) is fixedly connected with a first fan (309).
7. The device for testing the performance of the electronic element according to claim 6, wherein the two bearing seats (302) are slidably connected in the position-limiting sleeve (305) through a position-limiting rod (306), the position-limiting sleeve (305) is fixedly connected to the clamping plate (303) at one side, the end of the position-limiting rod (306) is fixedly connected to the clamping plate (303) at one side through a fixing plate (308), a threaded cap is embedded at one side of the position-limiting sleeve (305), a fixing bolt (307) is connected to the threaded cap in a threaded manner, the fixing bolt (307) is fixed to a friction surface of one side of the position-limiting rod (306) in a pressing manner, a plurality of clamping grooves are formed in an inner cavity of the clamping plate (303), a plurality of vent holes (304) are formed in two sides of the inner cavity of the clamping grooves, the vent holes (304) are uniformly arranged, and the cross-sectional shape of the vent holes is arc.
8. The device for testing the performance of the electronic component according to claim 1, wherein the heat dissipation mechanism (5) comprises a heat dissipation water tank (501), a second fan (502) is fixedly connected to one side of the heat dissipation water tank (501), an inner cavity of the heat dissipation water tank (501) is filled with a heat dissipation water liquid, the inner cavity of the heat dissipation water tank (501) is communicated with a connection header pipe (503) through a water pump, a plurality of flow regulating valves (504) are arranged at the top of the connection header pipe (503), a plurality of connection bent pipes (505) are communicated with the bottom of the regulating valves, the connection bent pipes (505) are communicated with an inner cavity of the test base (1), and the other side of the test base (1) is communicated with the connection mechanism (4) through the connection bent pipes (505).
9. The method for testing the device for testing the performance of the electronic element according to the claims 1 to 8, characterized by comprising the following steps:
s1, placing the element to be tested between the clamping plates (303) on the two sides, and enabling the clamping plates (303) on the two sides to move to attach the electronic element by pushing the clamping plates (303) to slide;
s2, the linear module (301) works to drive the electronic element placed at the top to move to one side of the testing base (1), the electronic element is inserted into the wire holder (401) at the corresponding position, and the bottom terminal of the wire holder (401) and the testing part are subjected to electric connection testing;
s3, the two side connecting rods (202) are rotated to drive the extrusion plate (203) on one side to be meshed and fixed with the electronic element circuit board, meanwhile, the bottom heat dissipation plate (204) is attached to the circuit board for heat dissipation, meanwhile, the rear heat dissipation mechanism (5) works to drive heat dissipation water liquid to circularly dissipate heat in the connecting header pipe (503), the connecting bent pipe (505) and the communicating pipe (205), and after the test is finished, the electronic element is drawn out from the wire holder (401), and the test is finished.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114062182A (en) * | 2021-11-23 | 2022-02-18 | 德州晶华药用玻璃有限公司 | Cold and hot resistant detection device of well borosilicate glass |
| CN114710945A (en) * | 2022-06-07 | 2022-07-05 | 广东电网有限责任公司广州供电局 | Rapid heat dissipation device and method for winding heating head of distribution transformer |
| CN115072002A (en) * | 2022-08-02 | 2022-09-20 | 哈尔滨理工大学 | Multifunctional spoiler test bench |
| WO2023131149A1 (en) * | 2022-01-05 | 2023-07-13 | 华为技术有限公司 | Heat dissipation apparatus, test system, and test method for single event effect tests |
| CN116709752A (en) * | 2023-08-01 | 2023-09-05 | 常州市武进三维电子有限公司 | Detection test fixture equipment based on flexible circuit board |
| CN117169698A (en) * | 2023-11-02 | 2023-12-05 | 深圳市凌航达电子有限公司 | Circuit board processing production testing arrangement and test system |
Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1607394A (en) * | 2003-10-16 | 2005-04-20 | 中国人民解放军总参谋部第五十四研究所 | Universal open type testing clamp for circuit board |
| JP2007005685A (en) * | 2005-06-27 | 2007-01-11 | Fujitsu Ltd | Package cooling method and device thereof |
| TWM317573U (en) * | 2007-03-12 | 2007-08-21 | Sunup Trading Co Ltd | Testing fixture for memory card module |
| US20080205005A1 (en) * | 2007-02-22 | 2008-08-28 | Inventec Corporation | Circuit board testing jig |
| KR101173192B1 (en) * | 2011-05-17 | 2012-08-10 | 주식회사 오킨스전자 | Test socket assembly for heat package |
| CN103824826A (en) * | 2014-02-21 | 2014-05-28 | 电子科技大学 | Micro-channel type cooling method |
| US20140203829A1 (en) * | 2011-10-04 | 2014-07-24 | Fujitsu Limited | Test jig and semiconductor device test method |
| CN207399720U (en) * | 2017-08-10 | 2018-05-22 | 上海英奇电气科技有限公司 | It is a kind of that there is the cooling system of detection blower fan |
| CN108990387A (en) * | 2018-08-23 | 2018-12-11 | 东莞市捷新检测设备有限公司 | A kind of water-cooling plate |
| CN209028175U (en) * | 2018-09-27 | 2019-06-25 | 深圳市金道微电子有限公司 | A kind of arrangement for testing integrated circuit |
| CN209038129U (en) * | 2018-12-03 | 2019-06-28 | 重庆汇鼎电子电路有限公司 | A kind of circuit board flashboard rack |
| CN209767933U (en) * | 2018-12-05 | 2019-12-10 | 信丰文峰电子科技有限公司 | Clamping device for printed circuit board |
| CN111081665A (en) * | 2019-10-31 | 2020-04-28 | 中南大学 | Device for heat dissipation of multi-heat-source device |
| CN210867542U (en) * | 2019-12-27 | 2020-06-26 | 浙江罗卡电气有限公司 | Built-in bypass soft starter |
| CN111438924A (en) * | 2020-04-29 | 2020-07-24 | 浙江新连宇电子有限公司 | Flattening device and method for circuit board processing |
| CN211348536U (en) * | 2019-11-26 | 2020-08-25 | 安徽芯智科技有限公司 | Clamping equipment for chip test |
| US20200359525A1 (en) * | 2018-01-12 | 2020-11-12 | Nec Platforms, Ltd. | Heat dissipation structure and heat dissipation method |
| CN112367809A (en) * | 2020-11-02 | 2021-02-12 | 中国电子科技集团公司第二十研究所 | Directional efficient heat dissipation device based on deep learning and installation monitoring method |
| CN212808464U (en) * | 2020-08-14 | 2021-03-26 | 厦门亿亨电子有限公司 | Testing jig for switching power supply adapter |
-
2021
- 2021-05-12 CN CN202110516018.7A patent/CN113281592B/en active Active
Patent Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1607394A (en) * | 2003-10-16 | 2005-04-20 | 中国人民解放军总参谋部第五十四研究所 | Universal open type testing clamp for circuit board |
| JP2007005685A (en) * | 2005-06-27 | 2007-01-11 | Fujitsu Ltd | Package cooling method and device thereof |
| US20080205005A1 (en) * | 2007-02-22 | 2008-08-28 | Inventec Corporation | Circuit board testing jig |
| TWM317573U (en) * | 2007-03-12 | 2007-08-21 | Sunup Trading Co Ltd | Testing fixture for memory card module |
| KR101173192B1 (en) * | 2011-05-17 | 2012-08-10 | 주식회사 오킨스전자 | Test socket assembly for heat package |
| US20140203829A1 (en) * | 2011-10-04 | 2014-07-24 | Fujitsu Limited | Test jig and semiconductor device test method |
| CN103824826A (en) * | 2014-02-21 | 2014-05-28 | 电子科技大学 | Micro-channel type cooling method |
| CN207399720U (en) * | 2017-08-10 | 2018-05-22 | 上海英奇电气科技有限公司 | It is a kind of that there is the cooling system of detection blower fan |
| US20200359525A1 (en) * | 2018-01-12 | 2020-11-12 | Nec Platforms, Ltd. | Heat dissipation structure and heat dissipation method |
| CN108990387A (en) * | 2018-08-23 | 2018-12-11 | 东莞市捷新检测设备有限公司 | A kind of water-cooling plate |
| CN209028175U (en) * | 2018-09-27 | 2019-06-25 | 深圳市金道微电子有限公司 | A kind of arrangement for testing integrated circuit |
| CN209038129U (en) * | 2018-12-03 | 2019-06-28 | 重庆汇鼎电子电路有限公司 | A kind of circuit board flashboard rack |
| CN209767933U (en) * | 2018-12-05 | 2019-12-10 | 信丰文峰电子科技有限公司 | Clamping device for printed circuit board |
| CN111081665A (en) * | 2019-10-31 | 2020-04-28 | 中南大学 | Device for heat dissipation of multi-heat-source device |
| CN211348536U (en) * | 2019-11-26 | 2020-08-25 | 安徽芯智科技有限公司 | Clamping equipment for chip test |
| CN210867542U (en) * | 2019-12-27 | 2020-06-26 | 浙江罗卡电气有限公司 | Built-in bypass soft starter |
| CN111438924A (en) * | 2020-04-29 | 2020-07-24 | 浙江新连宇电子有限公司 | Flattening device and method for circuit board processing |
| CN212808464U (en) * | 2020-08-14 | 2021-03-26 | 厦门亿亨电子有限公司 | Testing jig for switching power supply adapter |
| CN112367809A (en) * | 2020-11-02 | 2021-02-12 | 中国电子科技集团公司第二十研究所 | Directional efficient heat dissipation device based on deep learning and installation monitoring method |
Non-Patent Citations (2)
| Title |
|---|
| DAI MEI 等: "Control and Protective Switching Device PCB Test System Based on Virtual Instrument", 2011 THIRD INTERNATIONAL CONFERENCE ON MEASURING TECHNOLOGY AND MECHATRONICS AUTOMATION, 28 February 2011 (2011-02-28) * |
| 刘鹏祥 等: "PCB电路板质量自动检测装置设计", 电子测试, 1 November 2013 (2013-11-01) * |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114062182A (en) * | 2021-11-23 | 2022-02-18 | 德州晶华药用玻璃有限公司 | Cold and hot resistant detection device of well borosilicate glass |
| WO2023131149A1 (en) * | 2022-01-05 | 2023-07-13 | 华为技术有限公司 | Heat dissipation apparatus, test system, and test method for single event effect tests |
| CN114710945A (en) * | 2022-06-07 | 2022-07-05 | 广东电网有限责任公司广州供电局 | Rapid heat dissipation device and method for winding heating head of distribution transformer |
| CN115072002A (en) * | 2022-08-02 | 2022-09-20 | 哈尔滨理工大学 | Multifunctional spoiler test bench |
| CN116709752A (en) * | 2023-08-01 | 2023-09-05 | 常州市武进三维电子有限公司 | Detection test fixture equipment based on flexible circuit board |
| CN116709752B (en) * | 2023-08-01 | 2023-11-03 | 常州市武进三维电子有限公司 | Detection test fixture equipment based on flexible circuit board |
| CN117169698A (en) * | 2023-11-02 | 2023-12-05 | 深圳市凌航达电子有限公司 | Circuit board processing production testing arrangement and test system |
| CN117169698B (en) * | 2023-11-02 | 2024-05-14 | 深圳市凌航达电子有限公司 | Circuit board processing production testing arrangement and test system |
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