WO2023131149A1

WO2023131149A1 - Heat dissipation apparatus, test system, and test method for single event effect tests

Info

Publication number: WO2023131149A1
Application number: PCT/CN2023/070300
Authority: WO
Inventors: 潘国杰; 周建; 张龙
Original assignee: 华为技术有限公司
Priority date: 2022-01-05
Filing date: 2023-01-04
Publication date: 2023-07-13
Also published as: CN116413526A

Abstract

A heat dissipation apparatus, test system, and test method for single event effect tests, belonging to the field of device testing. The heat dissipation apparatus comprises: a bearing structure (10) and a heat dissipation structure (20); the bearing structure (10) is used for bearing an electronic device (1); the heat dissipation structure (20) is connected to the bearing structure (10), and the heat dissipation structure (20) is in contact with a partial area of the surface (1a) of the electronic device (1), the surface (1a) being the surface of the electronic device (1) furthest from the bearing structure (10), and an exposed area of the surface (1a) being used for carrying out a single event effect test. The present heat dissipation apparatus can implement heat dissipation for the electronic device (1) during the process of a single event effect test.

Description

Heat sinks, test systems and test methods for single event effects testing

This application claims the priority of the Chinese patent application filed with the State Intellectual Property Office of China on January 5, 2022, with the application number 202210006408.4, and the title of the application is "Heating device, test system and test method for single event effect test", which The entire contents are incorporated by reference in this application.

technical field

The present application relates to the technical field of device testing, in particular to a heat sink for single event effect testing, a single event testing system and a testing method.

Background technique

Single event effects, also known as single event effects (SEE), are a general term for a type of radiation effect caused by ionization effects after high-energy particles are injected into electronic devices. In order to improve the reliability of electronic devices, it is necessary to conduct single event effect tests on electronic devices. During the single event effect test, the electronic device is provided with the electrical signal required for normal operation through the power supply device, and the electronic device is radiated by the test source.

As the power consumption of electronic devices continues to increase, the heat generated during normal operation of electronic devices is also increasing. Therefore, during the single event effect test, it is necessary to dissipate heat from the electronic device through the heat sink.

In the related art, the heat dissipation device used for the single event effect test includes a load-bearing structure and a heat dissipation structure. The carrying structure is used to carry electronic devices. The heat dissipation structure is connected with the carrying structure and is located on the surface of the carrying structure opposite to the electronic device. The heat generated by electronic devices needs to be transferred to the heat dissipation structure through the load-bearing structure, and the heat dissipation capacity is limited.

Contents of the invention

The present application provides a heat dissipation device for a single event effect test, a single event effect test system and a method, which can improve the ability to dissipate heat for electronic devices in the single event effect test.

On the one hand, the embodiment of the present application provides a heat dissipation device for a single event effect test. The heat dissipation device includes a bearing structure and a heat dissipation structure. The carrying structure is used for carrying electronic devices. The heat dissipation structure is connected to the carrying structure, and the heat dissipation structure is in contact with a partial area of the surface of the electronic device. The surface is the surface of the electronic device away from the carrying structure, and the exposed area of the surface is used for single event effect test.

By contacting the heat dissipation structure with a part of the surface of the electronic device, the heat dissipation structure can quickly conduct away the heat generated during the operation of the electronic device, which is beneficial to improving the heat dissipation capability of the electronic device. At the same time, since part of the surface of the electronic device is exposed, the electronic device can be irradiated in the exposed area, so as to conduct a single event effect test. Therefore, the heat dissipation device provided by the embodiment of the present application can improve the heat dissipation capability of the electronic device while performing the single event effect test on the electronic device.

In the present application, an electronic device includes a plurality of electronic components, at least some of which are semiconductor electronic components.

In some examples, some electronic components in the electronic device need to undergo a single event effect test, and these electronic components are concentrated in one or more areas of the electronic device, such as in the middle of the electronic device or on both sides of the electronic device. In this case, the heat dissipation structure and the load-carrying structure can be fixedly connected, and the surface of the area where the electronic components are located is exposed through the heat dissipation structure at the same time, and then the exposed surface is radiated to complete the single event effect test.

In some other examples, at least part of the electronic components in the electronic device need to undergo a single event effect test, and the electronic components that need to be irradiated cannot be exposed through the heat dissipation structure at one time. In this case, the heat dissipation structure can be configured to move relative to the surface during the heat dissipation process to expose different areas of the surface, so that the electronic components in different areas can be irradiated until the single event effect test is completed.

In order to facilitate the movement of the heat dissipation structure relative to the surface, the heat dissipation structure may be slidably connected to the carrying structure. For example, at least one of the heat dissipation plate and the bearing structure has a chute, and the heat dissipation device further includes a connecting piece arranged in the chute, and the heat dissipation plate and the bearing structure pass through the connecting piece connect. Through the cooperation of the sliding groove and the connecting piece, the sliding connection between the heat dissipation structure and the bearing structure is realized.

In some examples, the chute includes a first chute extending along a first direction. Exemplarily, the chute includes two first chute groups. Each first chute group includes at least one first chute. The centerlines of the first chutes in the same first chute group are located on the same straight line. The centerlines of the first chute in different first chute groups are parallel, and the centerlines of the first chute in different first chute groups are located on opposite sides of the electronic device. A connecting piece is arranged in each first chute. By providing two first chute groups, the heat dissipation structure and the carrying structure can be connected on both sides of the electronic device, so that the electronic device is interposed between the heat dissipation structure and the carrying structure. This is beneficial to improving the stability of the mechanical connection and reducing the mechanical vibration of the electronic device.

In some other examples, the chute includes a first chute and a second chute, and an extending direction of the first chute intersects with an extending direction of the second chute. For example, the extending direction of the first chute is perpendicular to the extending direction of the second chute. Exemplarily, the chute includes two first chute groups and two second chute groups. Each first chute group includes at least one first chute. The centerlines of the first chutes in the same first chute group are located on the same straight line. The centerlines of the first chute in different first chute groups are parallel, and the centerlines of the first chute in different first chute groups are located on opposite sides of the electronic device. A connecting piece is arranged in each first chute. The setting method of the second chute group is similar to that of the first chute group.

By arranging two first chute groups and two second chute groups, the heat dissipation structure and the carrying structure can be connected on both sides of the electronic device, so that the electronic device is sandwiched between the heat dissipation structure and the carrying structure. This is beneficial to improving the stability of the mechanical connection and reducing the mechanical vibration of the electronic device.

Exemplarily, the heat dissipation structure includes a heat dissipation plate, and the slide groove is a through groove opened on the heat dissipation plate, which has a simple structure and is easy to manufacture.

In some examples, the heat dissipation plate has a hollow structure for exposing a partial area of the surface. The use of the heat dissipation plate with a hollow structure to dissipate heat from the electronic device is beneficial to simplifying the structure of the heat dissipation device and reducing the cost.

In some examples, the hollow structure is an opening located in the middle of the heat dissipation plate; or, the hollow structure is an opening located on one side of the heat dissipation plate; or, the hollow structure includes two openings, The two openings are respectively located on opposite sides of the heat dissipation plate.

In the present application, the shape and position of the opening cooperate with the extending direction of the chute, so that the regions where all the electronic components that need to be radiated in the electronic device can be exposed by moving the heat dissipation structure.

In this application, the heat dissipation plate is made of high thermal conductivity material. In some examples, the heat dissipation plate is a metal plate, and the metal plate can be made of a single metal material such as silver, copper, aluminum or steel, or an alloy material such as aluminum alloy or copper-tin alloy. In some other examples, the heat dissipation plate is a non-metallic plate, such as a graphene plate or a diamond plate.

Exemplarily, the connecting member includes a screw, or, the connecting member includes a nut and a bolt or the like.

In some examples, the heat dissipation structure further includes a thermal pad. The heat conduction gasket is located between the surface and the heat dissipation plate, and the heat conduction gasket is connected with the heat dissipation plate and is in contact with the surface. Here, the heat dissipation plate is in contact with the surface through a heat conduction pad. Since the heat conduction pad can fill the air gap between the surface of the heat dissipation plate and the surface of the electronic device, it can conduct the heat generated by the electronic device to the heat sink more quickly. plate.

In some examples, the heat conduction pad is an integral structure arranged along at least one side of the hollow structure; or, the heat dissipation structure includes a plurality of heat conduction pads, and the plurality of heat conduction pads At least one side of the hollow structure is arranged at intervals.

In some examples, the thermal pad is a thermally conductive silicone pad, or a thermally conductive silicone grease pad.

In some other examples, the heat dissipation plate may be in direct contact with the surface of the electronic device if the heat dissipation capability can meet the requirement.

In some examples, the heat dissipation structure further includes: heat pipes and heat dissipation fins, both ends of the heat pipes are respectively connected to the heat dissipation plate and the heat dissipation fins. The heat pipe is a heat transfer element with high thermal conductivity, which can quickly transfer the heat from the electronic device to the heat sink to the heat sink fins, and use the heat sink fins to quickly dissipate the heat. Moreover, the heat can be released at a position far away from the electronic device through the heat pipe and the heat dissipation fin, which can reduce the ambient temperature near the electronic device and is beneficial to the heat dissipation of the electronic device.

In some other examples, the heat dissipation structure further includes heat dissipation fins, and the heat dissipation fins are directly connected to the heat dissipation plate, for example, disposed on a surface of the heat dissipation plate away from the electronic device. The heat dissipation area can be increased by arranging the heat dissipation fins, which is beneficial to improve the heat dissipation capability of the heat dissipation device.

In some examples, a cooling medium channel is provided in the heat dissipation structure, and the heat dissipation device further includes a cooling unit and a pipeline, and the cooling unit and the cooling medium channel are communicated through the pipeline. The cooling unit is used to realize the storage, driving and cooling of the coolant, and the pipeline is used for the transmission of the coolant. The cooling unit delivers the cooling medium to the cooling medium channel through the pipeline, so that the cooling medium flows in the cooling medium channel. During the flow of the cooling medium, the heat of the cooling plate is taken away, and the cooling medium flows through the pipeline to the cooling unit to release the heat, so as to achieve the effect of heat dissipation.

In some examples, the heat dissipation device further includes: a blower component or a draft component, configured to form an airflow passing through the heat dissipation structure. Blowing components such as fans or air compressors with cold air guns, etc. The exhaust component is for example an exhaust fan or an exhaust fan. The flow speed of the air passing through the heat dissipation structure is accelerated by using the blowing component or the ventilation component, so that the heat dissipation capability of the heat dissipation device can be improved.

In some examples, the carrying structure is a circuit board, and the circuit board is also used to provide electrical signals for the electronic device. By providing electrical signals for electronic devices through the load-carrying structure, the number of components required for single event effect experiments can be reduced and the system structure can be simplified.

In other examples, the supporting structure acts as a support, and the electrical signal is provided through another power supply device. Exemplarily, the power supply device includes a circuit board, the circuit board is electrically connected to the electronic device, and is located on the carrying structure. The circuit board and the electronic device are sandwiched together between the carrying structure and the heat dissipation structure.

On the other hand, the embodiment of the present application provides a single event effect testing system. The single event effect test system includes a cooling device and a test source. The heat dissipation device is any one of the foregoing heat dissipation devices. The test source is used to irradiate exposed areas of the surface. Optionally, the test source is a heavy ion source or a pulsed laser source.

In yet another aspect, the embodiment of the present application provides a single event effect test method. The single event effect test method includes: connecting the heat dissipation structure with the carrying structure carrying the electronic device, so that the heat dissipation structure is in contact with a partial area of the surface of the electronic device, and the surface is a part of the electronic device away from The surface of the carrying structure; during the working process of the electronic device, a single event effect test is performed on the exposed area of the surface through a test source.

In some examples, the single event effect test method further includes: moving the heat dissipation structure relative to the surface to expose different regions of the surface. After different areas of the surface have been exposed, single event effect tests can be performed on newly exposed areas until all areas requiring testing have been tested for single event effects.

Description of drawings

Fig. 1 is a schematic diagram of the front view of a heat sink for single event effect test provided by the embodiment of the present application;

Fig. 2 is a schematic cross-sectional structure diagram of the heat dissipation device shown in Fig. 1 along plane A-A;

Fig. 3 is a schematic diagram of the front view of another heat sink for single event effect test provided by the embodiment of the present application;

Fig. 4 is a front view structural schematic diagram of another heat dissipation device for single event effect test provided by the embodiment of the present application;

Fig. 5 is a schematic cross-sectional structure diagram of the heat dissipation device shown in Fig. 4 along the B-B plane;

Fig. 6 is a schematic structural view of another heat dissipation device used for single event effect test provided by the embodiment of the present application;

Fig. 7 is a schematic structural diagram of a single event effect testing system provided in the embodiment of the present application;

Fig. 8 is a schematic flowchart of a single event effect test method provided in the embodiment of the present application.

Detailed ways

In order to facilitate the understanding of this application, the relevant content of the single event effect test will be briefly explained below.

SEE is a general term for a class of radiation effects caused by ionization effects after high-energy particles are injected into electronic devices. Single event effects can cause abnormal changes in the state of electronic devices or damage to electronic devices. Single event effects can be divided into single event flipping, single event locking and single event burning.

The single event effect test, also known as the single event effect test, refers to the use of a test source to irradiate the surface of the electronic device during the working process of the electronic device, and to monitor whether the electronic device can work normally. Through the single event effect test, the reliability of electronic devices working in the space radiation environment (such as space) can be improved.

In the single event effect test, the test source is used to simulate various high-energy ray particles existing in the space radiation environment, such as protons, electrons, heavy ions or alpha particles, etc. Since the penetration ability of the radiation generated by the test source is weaker than that of the actual high-energy ray particles, the heat dissipation structure and packaging structure in the electronic device are usually removed, and then the surface of the electronic device is irradiated .

With the performance of electronic devices getting stronger and more integrated, the power consumption of a single electronic device is also increasing, and the heat generated by electronic devices during work is increasing. After the heat dissipation structure is removed, the heat dissipation ability of the electronic device itself is weak, and the temperature of the electronic device is too high, which will cause the electronic device to fail to work normally, thus affecting the normal progress of the single event effect test.

For this reason, the embodiment of the present application provides a heat dissipation device for a single event effect test, which is used to dissipate heat for electronic devices during the single event effect test. The heat dissipation device is especially suitable for the aforementioned electronic devices whose heat dissipation capability is insufficient due to the removal of the heat dissipation structure. It should be noted that the heat dissipation device provided in the embodiment of the present application is also applicable to electronic devices that do not remove the heat dissipation structure but have insufficient heat dissipation capability.

In the embodiment of the present application, the electronic device is a semiconductor device. Here, a semiconductor device refers to an electronic device that includes a plurality of electronic components and at least some of the electronic components in the plurality of electronic components are semiconductor electronic components. Exemplarily, electronic devices include, but are not limited to, various integrated circuits such as microprocessors, microcontrollers, and digital signal processors. Since semiconductor devices are susceptible to state abnormalities or damage due to single event effects, single event effect tests are more necessary.

Fig. 1 is a front structural schematic diagram of a heat dissipation device used in a single event effect test provided in an embodiment of the present application. As shown in FIG. 1 , the heat dissipation device includes: a carrying structure 10 and a heat dissipation structure 20 . The carrying structure 10 is used for carrying the electronic device 1 . The heat dissipation structure 20 is connected to the carrying structure 10 , and the heat dissipation structure 20 is in contact with a partial area of the surface 1 a of the electronic device 1 . The surface 1 a is the surface of the electronic device 1 away from the carrying structure 10 , and the exposed area of the surface 1 a is used for the single event effect test.

In some examples, the surface 1a is the surface of the packaged electronic device after removing part of the packaging structure and the heat dissipation structure in the packaging structure. In some other examples, the surface 1 a is the surface of the heat dissipation structure exposed after removing part of the packaging structure of the packaged electronic device.

In the embodiment shown in FIG. 1 , in addition to supporting the electronic device 1 , the carrying structure 10 is also used to provide electrical signals for the electronic device 1 . For example, the carrying structure 10 is a circuit board, such as a printed circuit board (printed circuit board, PCB), and the heat dissipation structure 20 is connected to the PCB. The electronic device 1 is sandwiched between the PCB and the heat dissipation structure 20, and the electronic device 1 is electrically connected to the PCB. By providing electrical signals for electronic devices through the load-carrying structure, the number of components required for single event effect experiments can be reduced and the system structure can be simplified.

Alternatively, in some other examples, the carrying structure 10 functions to support the electronic device 1 , and the electronic device 1 and a power supply device for providing electrical signals to the electronic device 1 are located on the carrying structure 10 . The carrying structure 10 is, for example, a support plate, and the heat dissipation structure 20 is connected to the support plate. Exemplarily, the power supply device includes a circuit board, such as a PCB. The electronic device 1 is arranged on the PCB and electrically connected with the PCB, and the PCB is arranged on the carrying structure 10 . The PCB and the electronic device 1 are sandwiched between the carrying structure 10 and the heat dissipation structure 20 .

In the embodiment of the present application, the connection method between the electronic device 1 and the PCB includes but not limited to welding or crimping.

Here, the electrical signals include power signals and various external signals required by the electronic device 1 to work normally. The quantity and type of electrical signals are determined by the type and function of the electronic device 1 , which is not limited in this application.

As shown in FIG. 1 , the heat dissipation structure 20 includes a heat dissipation plate 21 . The cooling plate 21 has a hollow structure 211 . The size of the hollow structure 211 is smaller than that of the surface 1 a of the electronic device 1 , so that the cooling plate 21 can cover a part of the surface 1 a and expose another part of the surface 1 a. The use of the heat dissipation plate with a hollow structure to dissipate heat from the electronic device is beneficial to simplifying the structure of the heat dissipation device and reducing the cost.

Exemplarily, the hollow structure 211 is an opening located in the middle of the cooling plate 21 . In the embodiment shown in FIG. 1 , the opening is rectangular, but the present application does not limit it, and the shape of the opening can be adjusted according to actual needs, such as a circle, a rhombus, or a triangle. It should be noted that the present application does not limit the number and positions of the openings, and the number and positions of the openings can also be adjusted according to actual needs, for example, including 2 or 3 openings.

In the embodiment of the present application, the heat dissipation plate 21 is made of high thermal conductivity material. In some examples, the high thermal conductivity material may be a metal material, such as a single metal material such as silver, copper, aluminum or steel, or an alloy material such as aluminum alloy or copper-tin alloy. In other examples, the high thermal conductivity material may be a non-metallic material, such as graphene or diamond.

In some examples, one surface of the heat dissipation plate 21 is in direct contact with the surface 1 a of the electronic device 1 , so that the heat generated by the electronic device 1 can be quickly dissipated through the heat dissipation plate 21 .

In some other examples, the heat dissipation structure 20 further includes a thermal pad 22 . The heat conduction pad 22 is located between the surface 1 a of the electronic device 1 and the heat dissipation plate 21 , the heat conduction pad 22 is connected with the heat dissipation plate 21 and is in contact with the surface 1 a. The thermal pad 22 can fill the air gap between the surface of the heat sink 21 and the surface 1 a of the electronic device 1 , so as to conduct the heat generated by the electronic device 1 to the heat sink 21 quickly and efficiently.

In some examples, the thermal pad 22 is an integral structure arranged along at least one side of the opening. For example, in the embodiment shown in FIG. 1 , the thermal pad 22 is a rectangular frame structure surrounding the opening. Alternatively, in other embodiments, the thermal pad 22 may be an integral structure arranged along three adjacent sides or adjacent two sides or one side of the opening.

Alternatively, in other embodiments, the heat dissipation structure 20 may include a plurality of thermal pads 22 arranged at intervals along at least one side of the opening. For example, the heat dissipation structure 20 includes two heat conduction pads 22 , each heat conduction pad 22 is elongated, and the two heat conduction pads 22 are respectively arranged along opposite sides of the opening. For another example, the heat dissipation structure 20 includes four heat conduction pads 22 , each heat conduction pad 22 is elongated, and the four heat conduction pads 22 are respectively arranged along four sides of the opening. For another example, the heat dissipation structure 20 includes a plurality of block-shaped heat conduction pads 22, and at least two heat conduction pads 22 are arranged at intervals on each side of the opening, or at least two heat conduction pads are arranged at intervals on opposite sides of the opening. slice 22.

It should be noted that since the thermal pad 22 is connected to the heat sink 21 , when the heat sink 21 moves relative to the surface 1 a, the thermal pad 22 will move along with the heat sink 21 . At the same time, since the heat conduction pad 22 is generally viscous and/or elastic, the frictional force between the heat conduction pad 22 and the surface 1a of the electronic device 1 is relatively large. Therefore, in the embodiment of the present application, the quantity and position of the thermal pads may be determined after comprehensively considering the friction force between the heat sink and the electronic device and the heat dissipation capability of the heat sink.

Optionally, the thermal pad 22 is a thermally conductive silicone pad or a thermally conductive silicone grease pad.

In some examples, the heat dissipation structure 20 is configured to move relative to the surface 1a during the heat dissipation process, so as to expose different regions of the surface 1a. In this way, the electronic components in different regions of the electronic device can be irradiated separately until the electronic components in the electronic device that need to be tested for single event effects are all tested. For example, as shown in the left half of FIG. 1 , the heat dissipation structure 20 exposes the area A1 of the surface 1a. After performing the single event effect test on the A1 area, the heat dissipation structure 20 is moved to the right relative to the surface 1a, and the A2 area of the surface 1a of the electronic device 1 is exposed, as shown in the right half of FIG. 1 . Continue with single event effect testing for area A2.

As mentioned above, the electronic device 1 includes a plurality of electronic components, and at least some of the electronic components in the plurality of electronic components need to be irradiated for single event effect test. When the electronic components that need to be irradiated cannot be exposed through the heat dissipation structure 20 at one time, the heat dissipation structure 20 is configured to move relative to the surface 1a during the heat dissipation process, and the areas where these electronic components are located can be exposed in batches to complete the single event effect test. Moreover, during the movement of the heat dissipation structure 20 relative to the surface, it remains in contact with a partial area of the surface 1a of the electronic device 1, thereby ensuring that the energy generated by the electronic device 1 during the single event effect test can be quickly transmitted to the heat dissipation structure 20, and passed through The heat dissipation structure 20 emits heat.

In order to facilitate the movement of the heat dissipation structure 20 relative to the surface 1a, in the embodiment of the present application, the heat dissipation structure 20 and the carrying structure 10 may be slidably connected. The present application does not limit the implementation of the sliding connection, and the following takes the sliding connection of the heat dissipation structure 20 and the bearing structure 10 through the sliding groove and the connecting piece as an example for illustration.

In the embodiment of the present application, at least one of the heat dissipation structure 20 and the carrying structure 10 has a sliding groove 212, and the heat dissipation device further includes a connecting piece 30 arranged in the sliding groove 212, and the heat dissipation structure 20 and the carrying structure 10 are connected through the connecting piece 30 .

Exemplarily, as shown in FIG. 1 and FIG. 2 , the slide groove 212 is located on the cooling plate 21 . The sliding groove 212 is a through groove penetrating through two opposite surfaces of the heat dissipation plate 21 . One end of the connecting piece 30 is fixedly connected to the carrying structure 10 , and the middle part of the connecting piece 30 is located in the slide groove 212 , and the connecting piece 30 plays the role of connecting the cooling plate 21 and the carrying structure 10 and guiding.

Exemplarily, the connecting member 30 is a screw. One end of the screw is connected to the bearing structure 10 , and the nut of the screw is against the surface of the cooling plate 21 , thereby connecting the cooling plate 21 and the bearing structure 10 together.

In FIG. 1 , the sliding slot 212 includes a first sliding slot 212a and a second sliding slot 212b. The extending direction of the first sliding slot 212a and the extending direction of the second sliding slot 212b intersect, for example, be perpendicular to each other. As shown in FIG. 1 , the first sliding slot 212a extends along the X direction, and the second sliding slot 212b extends along the Y direction. In use, according to the movement requirements, a connecting piece can be set in the first chute 212a so that the cooling plate 21 can move in the X direction; or a connecting piece can be set in the second chute 212b so that the cooling plate 21 can move in the Y direction .

Exemplarily, the chute 212 includes two first chute groups and two second chute groups. Each first chute group includes at least one first chute 212a, for example, two first chute 212a in FIG. 1 . Centerlines of the first chute 212a in the same first chute group are located on the same straight line. The centerlines of the first chute 212 a in different first chute groups are parallel, and the centerlines of the first chute 212 a in different first chute groups are located on opposite sides of the electronic device 1 . A connecting piece 30 is disposed in each first sliding slot 212a.

The setting method of the second chute group is similar to that of the first chute group. Each second chute group includes at least one second chute 212b, for example, two second chute 212b in FIG. 1 . The centerlines of the second chute 212b in the same second chute group are located on the same straight line. The centerlines of the second chute 212 b in different second chute groups are parallel, and the centerlines of the second chute 212 b in different second chute groups are located on opposite sides of the electronic device 1 . A connecting piece is disposed in each second sliding slot 212b.

By setting two first chute groups and two second chute groups, the heat dissipation structure 20 and the carrying structure 10 can be connected on both sides of the electronic device 1, so that the electronic device 1 is sandwiched between the heat dissipation structure 20 and the carrying structure. Between structures 10. This is beneficial to improve the stability of the mechanical connection and reduce the mechanical vibration of the electronic device 1 .

In some other examples, the chute can also be arranged on the carrying structure 10 . In some other examples, the sliding grooves may be correspondingly provided on the carrying structure 10 and the heat dissipation plate 21 . Connectors can also be replaced by bolts and nuts.

It should be noted that, in some other examples, some electronic components in the electronic device 1 need to be tested for single event effects, and these electronic components are concentrated in one or more regions of the electronic device 1 . In this case, the heat dissipation structure and the load-carrying structure can be fixedly connected, and the surface of the area where the electronic components are located is exposed through the heat dissipation structure at the same time, and then the exposed surface is radiated to complete the single event effect test. For example, the electronic component that needs to be subjected to the single event effect test is located in the middle region of the electronic device 1 , and the middle part of the heat dissipation structure 20 has a hollow structure, thereby exposing the middle region of the surface of the electronic device 1 .

Fig. 3 is a front structural schematic diagram of another heat dissipation device used for single event effect test provided by the embodiment of the present application. Compared with the heat dissipation device shown in FIG. 1 and FIG. 2 , the difference lies in the structure of the heat dissipation plate 21 and the arrangement of the sliding slots 212 . As shown in FIG. 3 , the hollow structure in the heat dissipation plate 21 is an opening on one side of the heat dissipation plate 21 . Exemplarily, in FIG. 3 , the cooling plate 21 is H-shaped.

Exemplarily, the sliding slots 212 in the cooling plate 21 include a first sliding slot 212a, and the first sliding slot 212a extends along the first direction X. As shown in FIG. For the structure of the first chute 212a, refer to the embodiment shown in FIG. 1 , and a detailed description is omitted here.

Fig. 4 is a front structural schematic diagram of another heat dissipation device used for single event effect test provided by the embodiment of the present application. FIG. 5 is a schematic cross-sectional structure diagram of the heat dissipation device shown in FIG. 4 along plane B-B. As shown in FIG. 4 and FIG. 5 , compared with the heat dissipation structure in FIG. 1 , the heat dissipation structure further includes: a heat pipe 24 and a heat dissipation fin 23 , and the two ends of the heat pipe 24 are connected to the heat dissipation plate 21 and the heat dissipation fin 23 respectively.

A heat pipe is a heat transfer element with extremely high thermal conductivity. A heat pipe generally includes a shell, a wick and an end cap. The inside of the tube is pumped to a negative pressure and filled with a suitable liquid. This liquid has a low boiling point and is easily volatile. The wick is attached to the inner wall of the shell and is usually composed of a capillary porous material. The heat pipe mainly uses the phase change process of the medium condensing at the cold end after evaporating at the hot end (that is, using the latent heat of evaporation and latent heat of condensation of the liquid) to conduct heat quickly.

When one end of the heat pipe (which can be called the evaporating end) receives heat from the heat sink, the liquid inside the heat pipe vaporizes rapidly, and the vapor flows to the end of the heat pipe connected to the heat dissipation fins (which can be called the heat sink) under the power of thermal diffusion. Condensation end), and condense at the other end to release heat, and the liquid flows back to the heated end along the porous material by capillary action, and the cycle continues until the temperature at both ends of the heat pipe is equal (at this time, the thermal diffusion of steam stops). In this way, the heat pipe can quickly conduct the heat conducted by the electronic device to the heat dissipation plate to the heat dissipation fins, and use the heat dissipation fins to quickly dissipate the heat, thereby improving the heat dissipation capability of the heat dissipation device. Moreover, the heat can be released at a position far away from the electronic device through the heat pipe and the heat dissipation fin, which can reduce the ambient temperature near the electronic device and is beneficial to the heat dissipation of the electronic device.

Exemplarily, the heat dissipation fins 23 include a base and a plurality of fins, and the plurality of fins are arranged on the base in parallel and at intervals to increase the heat dissipation area. Optionally, the cooling fins 23 may be made of high thermal conductivity materials, such as single metal materials such as silver, copper, aluminum or steel, or alloy materials such as aluminum alloy or copper-tin alloy.

Optionally, the heat pipe 24 may be connected to the heat dissipation plate or the heat dissipation fins by means of welding or crimping.

It should be noted that, in the embodiment shown in FIG. 4 and FIG. 5 , the heat dissipation fins 23 are connected to the heat dissipation plate 21 through heat pipes 24 . In other embodiments, the cooling fins 23 may be directly connected to the cooling plate 21 . For example, the cooling fins 23 are arranged on the surface of the cooling plate 21 away from the electronic device 1 . The heat dissipation area can be increased by arranging the heat dissipation fins, which is beneficial to improve the heat dissipation capability of the heat dissipation device.

Fig. 6 is a schematic structural diagram of another heat dissipation device used in single event effect tests provided by the embodiment of the present application. The heat dissipation device further improves the heat dissipation capability of the heat dissipation device through water cooling. As shown in FIG. 6 , the heat dissipation structure 20 has a cooling medium passage 20a, and the heat dissipation device further includes a cooling unit 31 and a pipeline 32 , and the cooling unit 31 communicates with the cooling medium passage 20a through the pipeline 32 .

In the embodiment shown in FIG. 6 , the heat dissipation structure further includes a liquid cooling fin 25 . The cooling medium channel 20 a is provided in the liquid cooling fin 25 . The liquid cooling plate 25 is disposed on the surface of the heat sink 21 away from the electronic device 1 . The arrangement of the liquid cooling fin 25 on the surface of the heat sink 21 includes but not limited to welding, crimping or placing. Exemplarily, the liquid cooling plate 25 may be made of metal or non-metal material (such as plastic, etc.). Alternatively, in other embodiments, the heat dissipation structure may not include the liquid cooling fins 25 , and the cooling medium channel 20 a is provided in the heat dissipation plate 21 .

The embodiment of the present application does not limit the arrangement of the cooling medium channel 20 a on the liquid cooling fin 25 or on the heat dissipation plate 21 , as long as it can meet the heat dissipation requirement.

The cooling unit 31 is used to realize the storage, driving and cooling of the cooling liquid. Exemplarily, the cooling unit 31 includes a water tank, a water pump and cooling liquid (such as water or other materials). The cooling liquid is stored in the water tank, and the cooling liquid in the water tank is transported to the cooling medium passage through a pipeline by using a water pump. When the cooling liquid flows in the cooling medium channel, it takes away the heat from the cooling plate 21, so as to achieve the effect of cooling. Then, the cooling fluid passing through the cooling medium channel flows back into the water tank to release the heat quickly. The cooled low-temperature coolant is re-delivered to the cooling medium passage through the pipeline by the water pump. This cycle is repeated to realize liquid cooling and heat dissipation. When the power consumption of the electronic device is large, the heat release of the coolant in the water tank can be accelerated by adding a heat exchanger or an ice pack.

The pipeline 32 is used for circulating the cooling liquid, and metal pipelines or plastic pipelines can be used, which are not limited in this application.

Other structures of the heat sink in FIG. 6 are the same as those shown in FIG. 1 or FIG. 3 , and detailed descriptions are omitted here.

In order to further improve the heat dissipation capability of the heat dissipation device, the heat dissipation device may also adopt air cooling to dissipate heat.

In some examples, the heat dissipation device further includes a blower component (not shown in the figure), and the blower component is used to form an airflow passing through the heat dissipation structure. For example, the air blowing component is used to blow air to the aforementioned heat dissipation plate and/or heat dissipation fins, so as to increase the velocity of air flow, thereby increasing the heat dissipation rate. Exemplarily, the blowing component includes a fan, or, the blowing component includes an air compressor and a cold air gun connected to the air compressor. When the air compressor is used to cooperate with the cold air gun to achieve blowing, the air at the outlet of the cold air gun is blown to the heat dissipation structure after being reduced in speed and pressure, which can further improve the heat dissipation capacity of the heat dissipation device under the condition of small mechanical vibration, which is conducive to meeting the requirements of laser radiation. Sources need to conduct single event effects experiments.

In some other examples, the heat dissipation device also has a ventilation component (not shown in the figure), and the ventilation component is used to form an airflow passing through the heat dissipation structure. The exhaust component is an exhaust fan or an exhaust fan or the like. Adopting the air extraction method can further improve the heat dissipation capacity of the heat dissipation device while reducing mechanical vibration, which is conducive to meeting the needs of single event effect experiments using laser radiation sources.

It should be noted that the blowing component and the exhausting component can be used in conjunction with any of the aforementioned heat dissipation structures.

The embodiment of the present application also provides a single event effect test system, which may also be called a single event effect test system. Fig. 7 is a schematic structural diagram of a single event effect testing system provided in an embodiment of the present application. As shown in FIG. 7 , the single event effect test system includes a heat sink 2 and a test source 3 . The cooling device 2 is any one of the aforementioned cooling devices. The test source 3 is used to irradiate the exposed area of the surface of the electronic device 1 to conduct a single event effect test.

Optionally, the test source 3 is a heavy ion source or a pulsed laser source. When the test source is a pulsed laser source, since the laser needs to be focused on a specified position such as the surface of the electronic device, the mechanical vibration of the electronic device is required to be small. Therefore, when the test source is a pulsed laser source, the heat sink with less mechanical vibration among the aforementioned heat sinks can be used. When the test source is a heavy ion source, the requirement for mechanical vibration is relatively low, and any of the aforementioned cooling devices can be used for heat dissipation.

As shown in FIG. 7 , the single event effect test system further includes a support platform 4 on which the heat sink 2 and the electronic device 1 are placed. The structure of the support platform 4 in FIG. 7 is only for illustration, and any structure of the support platform can be used.

It should be noted that when the test source 3 is a heavy ion source, the cooling device 2 and the electronic device 1 can also be vertically arranged on the support surface of the support platform 4 after being turned over 90 degrees. The test source 3 irradiates the exposed surface of the electronic device 1 along a direction parallel to the supporting surface of the supporting platform 4 .

The present application provides a single event effect test method. Fig. 8 is a schematic flowchart of a single event effect test method provided in the embodiment of the present application. As shown in Figure 8, the single event effect test method includes:

S801: Connect the heat dissipation structure to the carrying structure carrying the electronic device, so that the heat dissipation structure is in contact with a partial area of the surface of the electronic device, the surface being the surface of the electronic device away from the carrying structure;

S802: During the working process of the electronic device, conduct a single event effect test on the exposed area of the surface through the test source.

In some examples, the single event effect test method further includes: S803: Moving the heat dissipation structure relative to the surface to expose different regions of the surface. For example, the heat dissipation structure may be moved parallel to the surface. After different areas of the surface have been exposed, single event effects tests can be performed on newly exposed areas until all areas requiring testing have been tested for single event effects.

It should be noted that, in the embodiment of the present application, the manner of moving the heat dissipation structure includes manual movement and automatic movement, which is not limited in the present application.

Under the condition of a normal temperature of 25° C., a heat dissipation test was performed on an electronic device with a power consumption of 30 W to verify the heat dissipation capability of the heat dissipation device provided in the embodiment of the present application.

1) After the electronic device removes its own heat dissipation structure and packaging structure, an external ordinary fan is used to blow air. The electronic device is powered on and running, and the temperature of the electronic device is continuously monitored. After about 3 minutes, the junction temperature of the electronic device rises to 133 degrees, and the electronic device resets and cannot operate normally.

2) After the heat dissipation structure and packaging structure of the electronic device are removed, a heat dissipation device provided in the embodiment of the present application is used to dissipate heat from the device. The structure of the heat dissipation device adopts the heat dissipation device shown in Figure 4, and replaces the heat dissipation plate in Figure 4 with the heat dissipation plate in Figure 3, and cooperates with an ordinary fan to blow air. The electronic device is powered on and running, and the temperature of the electronic device is continuously monitored. The temperature is stable at about 85 degrees, and the electronic device can operate normally. Replacing ordinary fans with cold air guns or liquid cooling structures can further reduce the temperature of electronic devices.

It can be seen that the heat dissipation device provided by the embodiment of the present application can meet the heat dissipation requirements of electronic devices with large power consumption.

Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by those having ordinary skill in the art to which the present disclosure belongs. "First", "second" and similar words used in the specification and claims of this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Likewise, words like "a" or "one" do not denote a limitation in quantity, but indicate that there is at least one. Words such as "comprises" or "comprises" and similar terms mean that the elements or items preceded by "comprises" or "comprises" include the elements or items listed after "comprises" or "comprises" and their equivalents, and do not exclude other component or object. "A and/or B" means that the following three situations exist: A, B, and A and B.

The above is only an embodiment of the present application, and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made on the basis of the present application shall be included within the protection scope of the present application.

Claims

A heat dissipation device for a single event effect test, characterized in that the heat dissipation device comprises: a bearing structure (10) and a heat dissipation structure (20);

The carrying structure (10) is used to carry the electronic device (1);

The heat dissipation structure (20) is connected to the carrying structure (10), and the heat dissipation structure (20) is in contact with a partial area of the surface (1a) of the electronic device (1), and the surface (1a) is The surface of the electronic device (1) away from the carrying structure (10) and the exposed area of the surface (1a) is used for single event effect test.
The heat dissipation device according to claim 1, characterized in that the heat dissipation structure (20) is configured to move relative to the surface (1a) during heat dissipation, so as to expose different regions of the surface (1a).
The heat dissipation device according to claim 2, characterized in that at least one of the heat dissipation structure (20) and the bearing structure (10) has a sliding groove (212), and the heat dissipation device further includes The connecting piece (30) in the chute (212), the heat dissipation structure (20) is connected to the carrying structure (10) through the connecting piece (30).
The heat dissipation device according to claim 3, characterized in that, the sliding slot (212) comprises a first sliding slot (212a), and the first sliding slot (212a) extends along a first direction; or,

The chute (212) includes a first chute (212a) and a second chute (212b), the extension direction of the first chute (212a) intersects the extension direction of the second chute (212b) .
The heat dissipation device according to any one of claims 1 to 4, characterized in that, the heat dissipation structure (20) comprises a heat dissipation plate (21), the heat dissipation plate (21) has a hollow structure (211), and the hollow structure (211) for exposing a partial area of said surface (1a).
The heat dissipation device according to claim 5, characterized in that, the hollow structure (211) is an opening located in the middle of the heat dissipation plate (21); or, the hollow structure (211) is an opening located in the heat dissipation plate An opening on one side of the (21); or, the hollow structure (211) includes two openings, and the two openings are respectively located on opposite sides of the heat dissipation plate (21).
The heat dissipation device according to claim 5 or 6, characterized in that, the heat dissipation structure (20) further comprises a heat conduction pad (22), and the heat conduction pad (22) is located between the surface (1a) and the Between the heat dissipation plates (21), the heat conduction gasket (22) is connected to the heat dissipation plate (21) and is in contact with the surface (1a).
The heat dissipation device according to claim 7, characterized in that, the heat conduction pad (22) is an integral structure arranged along at least one side of the hollow structure (211); or, the heat dissipation structure includes a plurality of As for the thermal conduction pad (22), a plurality of the thermal conduction pads (22) are arranged at intervals along at least one side of the hollow structure (211).
The heat dissipation device according to claim 7, characterized in that, the thermally conductive gasket (22) is a thermally conductive silicone gasket, or a thermally conductive silicone grease gasket.
The heat dissipation device according to any one of claims 5 to 9, wherein the heat dissipation plate is a metal plate, a diamond plate or a graphene plate.
The heat dissipation device according to claim 3 or 4, characterized in that, the connecting member (30) comprises screws or bolts.
The heat dissipation device according to any one of claims 5 to 10, characterized in that, the heat dissipation structure (20) further comprises: heat pipes (24) and heat dissipation fins (23), the two ends of the heat pipes (24) respectively connected to the heat dissipation plate (21) and the heat dissipation fins (23); or,

The heat dissipation structure further includes heat dissipation fins (23), and the heat dissipation fins (23) are connected with the heat dissipation plate (21).
The heat dissipation device according to any one of claims 1 to 12, characterized in that, the heat dissipation structure (20) has a cooling medium channel (20a), and the heat dissipation device also includes a cooling unit (31) and a pipeline (32 ), the cooling unit (31) communicates with the cooling medium channel (20a) through the pipeline (32).
The heat dissipation device according to any one of claims 1 to 13, characterized in that, the heat dissipation device further comprises: a blower component or a draft component for forming an airflow passing through the heat dissipation structure (20).
The heat dissipation device according to any one of claims 1 to 14, characterized in that the carrying structure (10) is a circuit board, and the circuit board is also used to provide electrical signals for the electronic device (1).
A single event effect test system, characterized in that the single event effect test system includes a heat sink (2) and a test source (3);

The heat dissipation device (2) is the heat dissipation device according to any one of claims 1 to 15; the test source (3) is used to radiate the exposed area of the surface (1a).
The system according to claim 16, characterized in that the test source (3) is a heavy ion source or a pulsed laser source.
A single event effect test method, characterized in that the single event effect test method comprises:

Connecting the heat dissipation structure (20) to the carrying structure (10) carrying the electronic device (1), so that the heat dissipation structure (20) is in contact with a partial area of the surface (1a) of the electronic device (1), so The surface (1a) is a surface of the electronic device (1) away from the carrying structure (10);

During the operation of the electronic device, the exposed area of the surface (1a) is subjected to a single event effect test by means of a test source (3).
Single event effect test method according to claim 18, is characterized in that, described single event effect test method also comprises:

The heat dissipation structure (20) is moved relative to the surface (1a) to expose different regions of the surface (1a).