CN2916925Y - Contact device for testing electronic component - Google Patents
Contact device for testing electronic component Download PDFInfo
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- CN2916925Y CN2916925Y CN 200620115150 CN200620115150U CN2916925Y CN 2916925 Y CN2916925 Y CN 2916925Y CN 200620115150 CN200620115150 CN 200620115150 CN 200620115150 U CN200620115150 U CN 200620115150U CN 2916925 Y CN2916925 Y CN 2916925Y
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- heat
- contact device
- electronic component
- electronic element
- testing
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Abstract
A contact device for testing the electronic component is provided, which comprises a heat conduction unit, a heat dispersion unit and a fixing stand. The heat conduction unit is provided with a movable heat conduction body that is propped to the electronic component; the heat dispersion unit is positioned on the heat conduction body; the heat produced by the electronic component can be transmitted to the heat conduction body and be conducted to the outside via the heat dispersion unit; a control component can control the fixing stand and realizes the joint movement of the heat dispersion unit and heat conduction unit, so as to impose the contact force onto the electronic component. With the adoption of the heat dispersion unit and the heat conduction unit, the electronic component can stay at an environment resembling the actual operation of the whole system, simulate the actual operational status of the electronic component and provide excellent heat dispersion solution, so as to ensure the precision of testing result that will reflect the product qualification rate under actual operational status.
Description
[technical field]
The utility model relates to a kind of contact device, when particularly relating to a kind of testing electronic element, can apply a contact strength and touch the contact device that is used for testing electronic element to this electronic component.
[background technology]
General sub-element in each stage, all can carry out element test via wafer manufacturing, encapsulation, in the processing procedure that is mounted to substrate, with the standard that determines whether to meet the requirements of the customers, just can be sent to next processing procedure then.Yet, along with science and technology is maked rapid progress, the electric crystal quantity of semiconductor electronic element internal is constantly climbed to a higher point, the speed of service that requires also is multiple and grows up, incident is that electronic component can produce a large amount of heat energy when running, if fail to get rid of immediately the heat energy that the semi-conductor electricity sub-element is distributed in test process, gently then causes electronic component to work as machine, so that can't pass through test program, the test yield is low; Heavy then cause electronic component to burn even cause disaster.
Product test with central processing unit (hereinafter to be referred as CPU) is an example, and the structure in its when test is with to make flowing mode as described below:
Consult Fig. 1,2, general test contact system 1, when a testing element 2 (CPU) is installed on a test jack (figure does not show) when going up, be to apply a contact strength, to keep the electrical connection of this testing element 2 and test jack in this testing element 2 (normally between 10～30ft-1b/in2).
This testing element 2 has a substrate 21, and a wafer 22 that is positioned at these substrate 21 central authorities.This test contact system 1 includes the main contact plate of a fuselage 11, four pulling force screws 12, four tension springs 13, one 14, two elastic component 15, one less important contact plates 16, and most vacuum seal 17.Wherein, described vacuum seal 17 is to contact with the substrate 21 of this testing element 2, and through the suction that it applied this testing element 2 is come up from a conveyer belt (figure does not show) absorption, so that it is installed in this test jack.
This contact strength or most contact strength are to adjust the pressure of described tension spring 13 by described pulling force screw 12, and be applied to this main contact plate 14, and pass to this less important contact plate 16 with seeing through described elastic component 15 bufferings, and then be applied on the substrate 21 of this testing element 2, avoid excessive contact strength directly to oppress on the wafer 22 of this testing element 2 whereby, thereby damage this wafer 22.
Yet above-mentioned design, but have no idea to simulate the fully situation of this testing element 2 actual operation in total system, if these testing element 2 more high-speed computations especially at present, the heat that this wafer 22 the is produced height of also can healing, and general test contact system 1 lacks the design of heat radiation, cause the heat of wafer 22 promptly to be pulled away, the situation of these testing element 2 actual operations is difficult for reaching default result and is underestimated its usefulness, therefore make its test result distortion, can not guarantee that test result reflects the product fine rate of similar actual operation state.
[utility model content]
The purpose of this utility model is to provide a kind of contact device that is used for testing electronic element, have heat conduction and heat sinking function, so that the high heat that this electronic component is produced in test process, can be taken away rapidly, not only the possibility of effectively avoiding electronic component to be burnt can also be simulated the test of carrying out similar actual operation state simultaneously.
For achieving the above object, a kind of contact device that is used for testing electronic element of the present utility model, be electrically connected with testing equipment formation, this testing equipment has one can install and form the pedestal that is electrically connected for this electronic component, and one be electrically connected to this contact device and touch control piece to this electronic component so that it applies a contact strength, this contact device comprises a holder that is electrically connected with the control piece formation of this testing equipment, it is characterized in that:
This contact device also comprises a heat-conducting unit, an and heat-sink unit, this heat-conducting unit has a heat carrier that touches removedly to this electronic component, this heat-sink unit then is installed on this heat carrier, the heat that this electronic component produced can conduct on this heat carrier, and by this heat-sink unit so that the heat on this heat carrier conducts to the external world, this this holder of control piece may command, this heat-sink unit of interlock and heat-conducting unit apply contact strength to this electronic component.
Effect of the present utility model is, setting by this heat-conducting unit and heat-sink unit, the high heat that is produced when making this electronic component running, can be taken away rapidly, the possibility of effectively avoiding electronic component to be burnt not only, can also give test environment simultaneously is the environment that is similar to actual operation, the actual operation situation of simulation electronic component, and provide electronic component good heat radiation solution, can reflect the product fine rate of similar actual operation state really.
[description of drawings]
Fig. 1 is a three-dimensional exploded view, and the general test contact system is described.
Fig. 2 is a side view cutaway drawing, in order to aid illustration general test contact system shown in Figure 1.
Fig. 3 is a user mode schematic diagram, illustrates that the utility model is used for first preferred embodiment of the contact device of testing electronic element.
Fig. 4 is a user mode schematic diagram, illustrates that the utility model is used for second preferred embodiment of the contact device of testing electronic element.
Fig. 5 is a user mode schematic diagram, illustrates that the utility model is used for the 3rd preferred embodiment of the contact device of testing electronic element.
[embodiment]
Below by preferred embodiment and accompanying drawing the contact device that the utility model is used for testing electronic element is elaborated.
Before the utility model is described in detail, be noted that in the following description similar elements is to represent with identical numbering.
Consult Fig. 3, the utility model is used for first preferred embodiment of the contact device 3 of testing electronic element, be electrically connected with a testing equipment 4 formation, this testing equipment 4 has one can install and form the pedestal 41 that is electrically connected for this electronic component 5, and one is electrically connected to this contact device 3 and touches control piece 42 to this electronic component 5 so that it applies a contact strength.
This contact device 3 comprises a heat-conducting unit 31, a heat-sink unit 32, a holder 33, and a temperature sensing spare 34.
This heat-conducting unit 31 has a heat carrier 311 that touches removedly to this electronic component 5, and a soft heat conduction material 312 between this heat carrier 311 and electronic component 5, these heat carrier 311 bottom surfaces are formed with one can be for the ccontaining groove 313 of this electronic component 5, and this soft heat conduction material 312 is to be attached at this groove 313 tops.
In this preferred embodiment, this electronic component 5 is to be introduction for example with a CPU, and during still actual enforcement, the dealer also can be used for other semi-conductor electricity sub-elements, for example: painting processor (GPU), wafer set (CHIPSET) or the like should not be limited to the explanation of this preferred embodiment.
This electronic component 5 has a substrate 51, an and wafer 52 that is positioned at these substrate 51 central authorities, when reality is used, because this wafer 52 is very easy to produce the high heat of high temperature when running, therefore this soft heat conduction material 312 is closely to be posted by on this wafer 52, promptly be passed on this heat carrier 311 in order to the high heat that this wafer 52 is produced, and this temperature sensing spare 34 is to be positioned at this groove 313 and contact with this wafer 52, in order to measure this wafer 52 in testing the temperature that is produced when operating.
This heat-sink unit 32 is to be mounted on the heat carrier 311 of this heat-conducting unit 31, and lay respectively at the two opposite sides of this heat carrier 311 with this electronic component 5, in this preferred embodiment, this heat-sink unit 32 is a radiator fan, 311 of the heat carriers of this heat-conducting unit 31 are a fin shape radiator, and the material of the soft heat conduction material 312 of this heat-conducting unit 31 then is a heat conductive silica gel.And above-mentioned radiator fan, fin shape radiator can certainly utilize other general equivalent structures to be replaced with heat conductive silica gel, and this kind design is easy to understand by being familiar with this skill personage, so should not be limited to the explanation of present embodiment.
This holder 33 has uses the pedestal 331 that is provided with and is electrically connected with control piece 42 formation of this testing equipment 4 for this heat-sink unit 32, and it is most in order to fix the fixture 332 of this pedestal 331 and heat-sink unit 32, and these pedestal 331 inside are hollow form, can directly blow to this heat-sink unit 32 for adding air-flow (shown in arrow among the figure), to quicken the radiating efficiency of this heat-sink unit 32, and in this preferred embodiment, it is the aspect of exposing most fixtures 332, but can certainly only utilize single fixture 332 just this pedestal 331 can be fixed together with heat-sink unit 32, so should not be limited to the explanation of present embodiment.
In this preferred embodiment, each fixture 332 is that the aspect with a latch closure presents, but during actual enforcement, also can use combined fixed design, Dui Ying intercalation mechanism for example, or both are locked in heat-sink unit 32 with this pedestal 331 directly to use screw.
By above-mentioned design, the pedestal 331 of this holder 33 of control piece 42 may command of this testing equipment 4 vertically moves, with interlock this heat-sink unit 32 and heat-conducting unit 31, this electronic component 5 is applied contact strength, in order to keep the electrical connection of this electronic component 5 and pedestal 41.Especially this preferred embodiment is to be illustrated as electronic component 5 with CPU, the CPU of high-speed computation if heal, the heat that the is produced height of also can healing, and this preferred embodiment is wafer 52 places that directly contact this electronic component 5 by the soft heat conduction material 312 of this heat-conducting unit 31, the heat of this wafer 52 can be conducted to apace on this heat carrier 311, and utilize this heat-sink unit 32 directly this heat carrier 311 to be carried out airflow blow, the heat of this heat carrier 311 is taken rapidly to external environment, mode whereby, can effectively avoid this electronic component 5 because this wafer 52 is overheated and cause the possibility of burning, improve the stable testing degree and the test process security of this electronic component 5 in the test process.Moreover, can also give test environment is the environment that is similar to actual operation, the actual operation situation of simulation electronic component 5, and provide electronic component 5 good heat radiation solution, guarantee that its test result is difficult for distortion, so can reflect the product yield of similar actual operation state really.
Consult Fig. 4, the utility model is used for second preferred embodiment of the contact device 3 of testing electronic element, be identical with this first preferred embodiment haply, wherein different places is to be: this holder 33 also has one, and to be fixedly arranged on this pedestal 331 inner and be positioned at the substrate 333 of heat carrier 311 tops of this heat-conducting unit 31.This contact device 3 also comprises a buffering group 35 between this heat carrier 311 and this substrate 333, and this buffering group 35 has most elastic components 351, and the two ends of each elastic component 351 are then touched respectively and are butted on this heat carrier 311 and this substrate 333.This heat carrier 311 is the liquid cooling seat that an inside is provided with a plurality of dividing plates, this heat-sink unit 32 is a conduit that is connected and can flows for liquid with this heat carrier 311, the flow of liquid in this heat-sink unit 32 through this heat carrier 311 just the heat of this heat carrier 311 can be taken from.
By above-mentioned design, not only can reach the effect of similar this first preferred embodiment, but also can provide a good buffer gear for this electronic component 5, especially a little less than present electronic component 5 (for example CPU) is highly brittle in these wafer 52 places, in case this wafer 52 bears excessive contact strength, just be easy to form and break and can't use, produce for fear of above-mentioned situation, when this holder 33 drives this heat carrier 311 to this wafer 52 of lower compression, because this electronic component 5 maintains static, 32 of this heat-sink units can by this electronic component 5 touch to and move with respect to this substrate 333, make described elastic component 351 can effectively absorb the contact strength that this wafer 52 is born whereby, reduce this wafer 52 and formed the chance of breaking, guarantee this fail safe of electronic component 5 in test process by compression failure.
Consult Fig. 5, the utility model is used for the 3rd preferred embodiment of the contact device 3 of testing electronic element, be identical haply with this first preferred embodiment, wherein different places is to be: but this heat-sink unit 32 is the tracheae of air feed stream circulation, the heat carrier 311 of this heat-conducting unit 31 is by this fixture 332, and be fixed together with the pedestal 331 of this holder 33, and the inside of this heat carrier 311 is formed with a runner 314, and an end of this runner 314 is the wafer 52 relative tops that are open shape and are positioned at this electronic component 5, and the other end then is to be connected with this heat-sink unit 32.And in this preferred embodiment, the periphery of this heat carrier 311 is directly to touch on the substrate 51 of this electronic component 5, then be formed with most on these heat carrier 311 periphery bottom surfaces and be communicated with this groove 313 and extraneous passage 315, and do not have soft heat conduction material 312 shown in Figure 3 between this heat carrier 311 and the wafer 52.
By above-mentioned design, just can utilize additional gas stream by this heat-sink unit 32 and runner 314, directly the wafer 52 to this electronic component 5 blows, so that conducting to, the heat that this wafer 52 is produced adds air-flow, and then air-flow is sent to external environment by described passage 315, mode whereby, make this wafer 52 can reach the purpose of air cooling fast, and the heat on this heat carrier 311 also can flow by conducting to the external world along with additional gas, make this heat carrier 311 also can obtain better heat radiating effect, moreover, this preferred embodiment need not as this first, radiator fan is additionally installed in two preferred embodiments, heat radiation such as liquid-cooled heat sink product is so also can effectively save the implementation cost of this contact device 3.
Conclude above-mentioned, by of the setting of this heat-conducting unit 31 with heat-sink unit 32, the high heat that is produced when making these electronic component 5 runnings can be taken away rapidly, the possibility of not only effectively avoiding electronic component 5 to be burnt, simultaneously can also give test environment is the environment that is similar to actual operation, the actual operation situation of simulation electronic component 5, and provide electronic component 5 good heat radiation solution, guarantee that its test result is difficult for distortion, can reflect the product yield of similar actual operation state really, so can reach the purpose of this utility model really.
Claims (18)
1. contact device that is used for testing electronic element, be electrically connected with testing equipment formation, this testing equipment has one can install and form the pedestal that is electrically connected for this electronic component, and one be electrically connected to this contact device and touch control piece to this electronic component so that it applies a contact strength, this contact device comprises a holder that is electrically connected with the control piece formation of this testing equipment, it is characterized in that:
This contact device also comprises a heat-conducting unit, an and heat-sink unit, this heat-conducting unit has a heat carrier that touches removedly to this electronic component, this heat-sink unit then is installed on this heat carrier, this control piece is controlled this holder, this heat-sink unit of interlock and heat-conducting unit apply contact strength to this electronic component.
2. be used for the contact device of testing electronic element according to claim 1, it is characterized in that:
This heat-conducting unit also has a soft heat conduction material between this heat carrier and electronic component.
3. as being used for the contact device of testing electronic element as described in the claim 2, it is characterized in that:
This contact device also comprises the temperature sensing spare of this electronic component temperature of measurement.
4. as being used for the contact device of testing electronic element as described in the claim 3, it is characterized in that:
The heat carrier bottom surface of this heat-conducting unit is formed with one for the ccontaining groove of this electronic component, and this soft heat conduction material is to be attached at this groove top.
5. as being used for the contact device of testing electronic element as described in the claim 4, it is characterized in that:
This temperature sensing spare is to be positioned at the groove of this heat carrier and to contact with this electronic component.
6. as being used for the contact device of testing electronic element as described in the claim 5, it is characterized in that:
The material of the soft heat conduction material of this heat-conducting unit is a heat conductive silica gel.
7. as being used for the contact device of testing electronic element as described in the claim 6, it is characterized in that:
This holder has a pedestal, and at least one in order to fix the fixture of this pedestal and heat-sink unit.
8. as being used for the contact device of testing electronic element as described in the claim 7, it is characterized in that:
Each fixture of this holder is a latch closure.
9. as being used for the contact device of testing electronic element as described in the claim 6, it is characterized in that:
This holder has a pedestal, and at least one fixture in order to the heat carrier of fixing this pedestal and this heat-conducting unit.
10. as being used for the contact device of testing electronic element as described in the claim 9, it is characterized in that:
Each fixture of this holder is a latch closure.
11., it is characterized in that as being used for the contact device of testing electronic element as described in the claim 10:
This holder also has one, and to be fixedly arranged on this pedestal inner and be positioned at the substrate of the heat carrier top of this heat-conducting unit.
12., it is characterized in that as being used for the contact device of testing electronic element as described in the claim 11:
This contact device also comprises a buffering group between this heat carrier and this substrate.
13., it is characterized in that as being used for the contact device of testing electronic element as described in the claim 12:
This buffering group has a plurality of elastic components, and the two ends of each elastic component are then touched respectively and are butted on this heat carrier and this substrate.
14., it is characterized in that as being used for the contact device of testing electronic element as described in claim 9 or 13:
The heat carrier of this heat-conducting unit is the liquid cooling seat that an inside is provided with a plurality of dividing plates, and this heat-sink unit is a conduit that is connected and flows for liquid with this heat carrier, and the flow of liquid in this heat-sink unit is through this heat carrier.
15., it is characterized in that as being used for the contact device of testing electronic element as described in the claim 7:
This heat-sink unit is a radiator fan.
16., it is characterized in that as being used for the contact device of testing electronic element as described in the claim 15:
The heat carrier of this heat-conducting unit is a fin shape radiator.
17., it is characterized in that as being used for the contact device of testing electronic element as described in the claim 16:
The pedestal inside of this holder is hollow form, directly blows to this heat-sink unit for adding air-flow.
18. be used for the contact device of testing electronic element according to claim 1, it is characterized in that:
This heat-sink unit is the tracheae of air feed stream circulation, the heat carrier of this heat-conducting unit is to be fixed together with this holder, its inside is formed with a runner, and an end of this runner is to be open shape and to be positioned at the relative top of this electronic component, and the other end then is to be connected with this heat-sink unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620115150 CN2916925Y (en) | 2006-05-15 | 2006-05-15 | Contact device for testing electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620115150 CN2916925Y (en) | 2006-05-15 | 2006-05-15 | Contact device for testing electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2916925Y true CN2916925Y (en) | 2007-06-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620115150 Expired - Lifetime CN2916925Y (en) | 2006-05-15 | 2006-05-15 | Contact device for testing electronic component |
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| CN (1) | CN2916925Y (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101581625B (en) * | 2008-05-15 | 2011-01-12 | 中茂电子(深圳)有限公司 | Detection machine station with optical feedback device |
| CN102238843A (en) * | 2010-04-23 | 2011-11-09 | 建准电机工业股份有限公司 | Radiating module |
| US20110284199A1 (en) * | 2010-05-18 | 2011-11-24 | Alex Horng | Cooling Module |
| CN102944830A (en) * | 2012-09-28 | 2013-02-27 | 威盛电子股份有限公司 | Chip testing method and testing chuck |
| CN103913602A (en) * | 2013-01-09 | 2014-07-09 | 技嘉科技股份有限公司 | electronic component test fixture and test method |
| CN104502637A (en) * | 2014-12-05 | 2015-04-08 | 上海兆芯集成电路有限公司 | Method for reconditioning test head module |
| CN105334407A (en) * | 2014-08-12 | 2016-02-17 | 致茂电子(苏州)有限公司 | Electronic load testing device |
| CN106909186A (en) * | 2015-10-16 | 2017-06-30 | 鸿劲科技股份有限公司 | Temperature control device and method for testing equipment splicer |
| WO2023131149A1 (en) * | 2022-01-05 | 2023-07-13 | 华为技术有限公司 | Heat dissipation apparatus, test system, and test method for single event effect tests |
| TWI817505B (en) * | 2022-05-17 | 2023-10-01 | 致茂電子股份有限公司 | Method of aging test for thermal interface material and electronic device testing apparatus with thermal interface material aging test function |
-
2006
- 2006-05-15 CN CN 200620115150 patent/CN2916925Y/en not_active Expired - Lifetime
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101581625B (en) * | 2008-05-15 | 2011-01-12 | 中茂电子(深圳)有限公司 | Detection machine station with optical feedback device |
| CN102238843B (en) * | 2010-04-23 | 2013-10-30 | 建准电机工业股份有限公司 | Radiating module |
| CN102238843A (en) * | 2010-04-23 | 2011-11-09 | 建准电机工业股份有限公司 | Radiating module |
| US20110284199A1 (en) * | 2010-05-18 | 2011-11-24 | Alex Horng | Cooling Module |
| CN102944830B (en) * | 2012-09-28 | 2015-01-21 | 威盛电子股份有限公司 | Chip testing method and testing chuck |
| CN102944830A (en) * | 2012-09-28 | 2013-02-27 | 威盛电子股份有限公司 | Chip testing method and testing chuck |
| CN103913602A (en) * | 2013-01-09 | 2014-07-09 | 技嘉科技股份有限公司 | electronic component test fixture and test method |
| CN105334407A (en) * | 2014-08-12 | 2016-02-17 | 致茂电子(苏州)有限公司 | Electronic load testing device |
| CN104502637A (en) * | 2014-12-05 | 2015-04-08 | 上海兆芯集成电路有限公司 | Method for reconditioning test head module |
| CN104502637B (en) * | 2014-12-05 | 2017-10-13 | 上海兆芯集成电路有限公司 | Method for reconditioning test head module |
| CN106909186A (en) * | 2015-10-16 | 2017-06-30 | 鸿劲科技股份有限公司 | Temperature control device and method for testing equipment splicer |
| WO2023131149A1 (en) * | 2022-01-05 | 2023-07-13 | 华为技术有限公司 | Heat dissipation apparatus, test system, and test method for single event effect tests |
| TWI817505B (en) * | 2022-05-17 | 2023-10-01 | 致茂電子股份有限公司 | Method of aging test for thermal interface material and electronic device testing apparatus with thermal interface material aging test function |
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| C14 | Grant of patent or utility model | ||
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| CX01 | Expiry of patent term |
Granted publication date: 20070627 |
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| EXPY | Termination of patent right or utility model |