CN113567599A - Efficient and stable heat dissipation system for temperature-controllable device - Google Patents
Efficient and stable heat dissipation system for temperature-controllable device Download PDFInfo
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- CN113567599A CN113567599A CN202110831860.XA CN202110831860A CN113567599A CN 113567599 A CN113567599 A CN 113567599A CN 202110831860 A CN202110831860 A CN 202110831860A CN 113567599 A CN113567599 A CN 113567599A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N30/00—Investigating or analysing materials by separation into components using adsorption, absorption or similar phenomena or using ion-exchange, e.g. chromatography or field flow fractionation
- G01N30/02—Column chromatography
- G01N30/50—Conditioning of the sorbent material or stationary liquid
- G01N30/52—Physical parameters
- G01N30/54—Temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses a high-efficiency stable heat dissipation system for a temperature-controllable device, which comprises: the box comprises a lower cover shell, a left side plate, a right side plate and an upper side plate, wherein a plurality of ventilation grooves are formed in the positions, close to the radiating fins, of the lower cover shell, the left side plate and the right side plate, the ventilation grooves are of a U-shaped structure, a main fan is installed at the rear portion of the lower cover shell, and a main circulation loop is formed among the lower cover shell, the left side plate, the right side plate, the upper side plate and the main fan. The heat dissipation system of the invention greatly meets the working characteristics of the semiconductor aiming at the characteristics of the semiconductor element such as sensitivity to the environmental temperature, high efficiency of heat dissipation, timeliness of heat dissipation and the like. The semiconductor component can exert the functions of the semiconductor component to a great extent, the temperature control accuracy and the lower limit of the temperature control are greatly improved, the requirements of part of customers on testing at extremely low temperature are met, and the application range of the instrument is wider. And simultaneously, the stability of the instrument is greatly increased.
Description
Technical Field
The invention relates to the technical field of heat dissipation systems, in particular to a high-efficiency stable heat dissipation system for a temperature-controllable device.
Background
The existing temperature control component applied to the chromatographic instrument is mainly a heating rod, and although the heating efficiency is high, the practical application has a plurality of problems. The heating rod can only heat, the cooling can only depend on natural cooling, the temperature control range is larger than the room temperature, and the test process has larger limitation.
With the progress of the technical level, more and more manufacturers adopt semiconductors as temperature control components to realize the heating and refrigerating functions, and the application range of the chromatographic instrument is expanded. However, due to the characteristics of the semiconductor component, the sensitivity to the ambient temperature, the high efficiency of heat dissipation, the timeliness of heat dissipation and the like, the temperature control device using the semiconductor as the temperature control component has extremely high requirements on heat preservation and installation modes, particularly heat dissipation. Semiconductor components and parts are low in refrigeration efficiency in an environment with low heat dissipation efficiency, difficult to reach balance in a short time, and easy to damage in a full-load working state. Most manufacturers, including the top world instrument manufacturers, have semiconductor refrigeration ranges of 10 degrees celsius at room temperature, which makes it difficult to lower the temperature to a lower temperature, and there are still significant limitations on some specific samples. For this reason, a new scheme needs to be designed to give improvements.
Disclosure of Invention
The invention aims to provide an efficient and stable heat dissipation system for a temperature control device, which solves the problems that a semiconductor element generates a large amount of heat during refrigeration, the heat cannot be discharged in time, the semiconductor element is easily damaged, the temperature control device has high precision requirement and limited space, and a heat dissipation system needs to work stably for a long time, and meets the actual use requirement.
In order to achieve the purpose, the invention provides the following technical scheme: an efficient and stable heat dissipation system for a temperature controllable device, comprising: the box body consists of a lower cover shell, a left side plate, a right side plate and an upper side plate, wherein a plurality of ventilation grooves are formed in the positions, close to radiating fins, of the lower cover shell, the left side plate and the right side plate, the ventilation grooves are of U-shaped structures, a main fan is installed at the rear part of the lower cover shell, and a main circulation loop is formed among the lower cover shell, the left side plate, the right side plate, the upper side plate and the main fan;
the lower end of the temperature control main body is provided with three support columns which are fixedly connected with the lower encloser through the support columns and nuts, the temperature control main body is processed by an aluminum block, which comprises a working cavity, a semiconductor wafer, a secondary fan, a fan fixing frame, heat insulation cotton, supporting columns, radiating fins and a heat insulation cover, the periphery of the working cavity is wrapped with heat insulation materials, the rear end of the working cavity is connected with four semiconductor wafers in an attaching way, the rear end of the semiconductor chip is tightly attached to the radiating fin which is fixed on the working cavity by bolts, the fan fixing frame is arranged at the rear end of the radiating fin and is fixed with two secondary fans, the fan fixing frame is wrapped outside the secondary fan, the secondary fan is tightly attached to the radiating fins, so that the secondary fan can only pull out air flowing through the radiating fins, and the heat-insulating cover is arranged at the front end of the working cavity by adopting a quick-release structure;
the control circuit is installed on the lower housing and comprises a switching power supply, a control panel and a temperature controller, the temperature controller is installed on the temperature control fixing plate, the temperature control fixing plate is fixedly connected with the lower housing through bolts, the control panel fixing plate is vertically installed on the left side plate, and the control panel is fixed on the control panel fixing plate.
In a preferred embodiment of the present invention, the semiconductor wafer is provided with a plurality of gaps, and the gaps are formed between adjacent semiconductor wafers.
In a preferred embodiment of the present invention, the temperature control body is lifted and has a gap with the lower cover, and the height of the gap is smaller than the length of the support column.
In a preferred embodiment of the present invention, the heat insulation cotton is included on an outer wall of the working chamber, the heat insulation cotton is disposed outside the semiconductor wafer, and a surface of the semiconductor wafer, which is attached to the heat dissipation plate, is exposed and higher than the heat insulation cotton.
As a preferred embodiment of the present invention, three air inlets are provided to the box body and are located at the lower casing, the left side plate and the right side plate, respectively, and the air inlets are located at the lower side, the left side and the right side of the heat sink.
In a preferred embodiment of the present invention, the semiconductor chip transfers a large amount of heat to the heat sink during operation, and then transfers the heat from the heat sink to the inside of the case through the secondary fan to form a secondary circuit.
In a preferred embodiment of the present invention, two surfaces of the semiconductor chip are respectively attached to the working cavity and the heat sink via a thermal conductive paste.
In a preferred embodiment of the present invention, the switching power supply is mounted on a power supply fixing plate, a bottom surface of the power supply fixing plate is closely attached to the lower casing and fixed by bolts, and a height of the switching power supply does not exceed that of the secondary fan and the main fan.
Compared with the prior art, the invention has the following beneficial effects:
the heat dissipation system of the temperature-controllable device provided by the invention greatly meets the working characteristics of the semiconductor by aiming at the characteristics of the semiconductor element such as sensitivity to the environmental temperature, high heat dissipation efficiency, timeliness of heat dissipation and the like. The semiconductor component can exert the functions of the semiconductor component to a great extent, the temperature control accuracy and the lower limit of the temperature control are greatly improved, the requirements of part of customers on testing at extremely low temperature are met, and the application range of the instrument is wider. And simultaneously, the stability of the instrument is greatly increased.
Drawings
FIG. 1 is a general expanded schematic view of the present invention;
FIG. 2 is an expanded view of the temperature controlled body member of the present invention;
FIG. 3 is a schematic cross-sectional view of the general structure of the present invention;
FIG. 4 is a schematic view of a semiconductor package according to the present invention;
FIG. 5 is a schematic view of a gas circulation loop according to the present invention.
In the figure, 1, a lower cover shell; 2. an upper side plate; 3. a left side plate; 4. a right side plate; 5. a main fan; 6. a heat preservation cover; 7. a temperature controller; 8. a heat sink; 9. a temperature control fixing plate; 10. a secondary fan; 11. a fan fixing frame; 12. a support pillar; 13. heat preservation cotton; 14. a semiconductor wafer; 15. a working cavity; 16. a control panel fixing plate; 17. a switching power supply; 18. and a power supply fixing plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides a technical solution: an efficient and stable heat dissipation system for a temperature controllable device, comprising: the box body comprises a lower housing 1, a left side plate 3, a right side plate 4 and an upper side plate 2, wherein a plurality of ventilation grooves are formed in the positions, close to radiating fins 8, of the lower housing 1, the left side plate 3 and the right side plate 4, the ventilation grooves are of a U-shaped structure, a main fan 5 is installed at the rear part of the lower housing 1, a main circulation loop is formed among the lower housing 1, the left side plate 3, the right side plate 4, the upper side plate 2 and the main fan 5, external air flows through the radiating fins 8 to take away heat to the maximum extent, the upper part and the left part of the whole box body are detachable, and internal parts can be conveniently installed and maintained at a later stage;
the lower extreme of control by temperature change main part is provided with three support column 12 and through support column 12 and adopt nut and lower housing 1 fixed connection, the control by temperature change main part is formed by aluminium block processing, the design wall thickness of working cavity 15 can not be too big, the too big load that can increase semiconductor wafer 14 of wall thickness, it includes working cavity 15, semiconductor wafer 14, second grade fan 10, fan mount 11, heat preservation cotton 13, support column 12, fin 8 and heat preservation lid 6 are constituteed, working cavity 15 has insulation material all around, there is heat preservation lid 6 openly, inside dress chromatographic column, there is a plurality of semiconductor wafers 14 to distribute behind. The spacing between each of the pieces of semiconductor wafer 14 is kept reasonable to allow uniform heating of the working chamber 15 while allowing the loading of the semiconductor wafer 14 to be close. Except the contact surface of a semiconductor and an aluminum block, the rest part of the back of the working cavity 15 is provided with heat insulation materials, the back end of the working cavity 15 is connected with four semiconductor fins 14 in a fitting way, the back ends of the semiconductor fins 14 are tightly attached to a radiating fin 8, the radiating fin 8 is fixed on the working cavity 15 by bolts, a fan fixing frame 11 is arranged at the back end of the radiating fin 8, two secondary fans 10 are fixed on the fan fixing frame 11, the fan fixing frame 11 is wrapped outside the secondary fans 10, and the secondary fans 10 are tightly attached to the radiating fin 8, so that the secondary fans 10 can only pull out the gas flowing through the radiating fin 8 and take away the heat of the radiating fin 8 rapidly and in time, a heat insulation cover 6 is arranged at the front end of the working cavity 15 by adopting a quick-disassembly structure and can take away the heat of the radiating fin 8 rapidly and effectively, thereby allowing the semiconductor wafer 14 to operate efficiently and the temperature of the chamber to reach the set temperature quickly. The heat preservation cover 6 door is arranged in front of the working cavity, can be freely detached, and is convenient for installing the chromatographic column in the working cavity, so that the heat preservation effect on the working cavity 15 can be achieved, and the chromatographic column can be conveniently installed, and the whole radiating fin 8 can enter external air under the action of the secondary fan 10 in the left and right upper directions through the left side plate 3, the right side plate 4 and the lower housing 1 to take away the heat of the radiating fin 8 to the maximum extent;
the radiating fins 8 are made of radiating aluminum profiles, so that the heat transfer is fast and the price is low. The heat sink 8 is fixed to the working chamber 15 by screws, and the semiconductor chip 14 is pressed therebetween. Two surfaces of the semiconductor chip 14 are respectively clung to the working cavity 15 and the radiating fin 8 through heat conducting paste, so that heat can be transferred to the three to the maximum extent, and the efficiency is improved;
control circuit installs on lower housing 1 and includes switching power supply 17, control panel and temperature controller 7, and temperature controller 7 installs on control by temperature change fixed plate 9 and control by temperature change fixed plate 9 adopts bolt and lower housing 1 fixed connection, and it has control panel fixed plate 16 still to vertically install on left panel 3, and the control panel is fixed on control panel fixed plate 16.
In a further improvement, the semiconductor wafers 14 are provided with a plurality of gaps with ventilation between adjacent semiconductor wafers 14, so that the load of each semiconductor wafer 14 is balanced, and the phenomenon that the damage of individual semiconductor wafers 14 caused by large load can be avoided in operation, thereby causing the breakdown of the whole temperature control system can be avoided, and the load can be averagely distributed. The semiconductor wafer 14 transfers a large amount of heat to the radiating fin 8 when in work, and then transfers the heat of the radiating fin 8 into the box body through the secondary fan 10 to form a secondary loop, so that the heat of the radiating fin 8 can be brought out at the highest speed, the temperature of the heating surface of the semiconductor wafer 14 is ensured to be instantly reduced, and the problem that the semiconductor wafer 14 is damaged due to overhigh temperature and slow radiating of the semiconductor wafer 14 is solved. The heat brought out by the secondary fan 10 is brought to the environment under the action of the main fan 5, and due to the reasonable layout of the switching power supply 17 and the control circuit part, the air channel is not blocked, so that the heat transferred out by the secondary fan 10 is directly brought out by the main fan 5, and the temperature in the box body is not too high, and the whole system can stably work. Two surfaces of the semiconductor chip 14 are respectively clung to the working cavity 15 and the radiating fin 8 through heat conducting paste, so that the heat conducting efficiency is improved
In a further improvement mode, the temperature control main body is lifted, a gap exists between the temperature control main body and the lower housing 1, the height of the gap is smaller than the length of the supporting column 12, the temperature control main body is lifted by one height, a plurality of U-shaped ventilation grooves are formed in the lower housing 1 corresponding to the lower portion of the cooling fin 8 in the temperature control main body, and therefore outside air can take away the temperature of the cooling fin 8 under the action of the secondary fan 10 through the ventilation grooves of the lower housing 11.
Further improved, the heat preservation cotton 13 is included on the outer wall of working cavity 15, and the heat preservation cotton 13 sets up in the outside of semiconductor wafer 14, and the face of semiconductor wafer 14 and the 8 laminating of fin exposes and exceeds heat preservation cotton 13, restricts carrying out the heat exchange between working cavity 15 and the air through strict heat preservation measure to quick messenger working cavity 15's temperature reaches stably, avoids semiconductor wafer 14 to be in full load state for a long time, has promoted the stability and the reliability of whole device greatly.
In a further improvement, the air inlets of the box body are three and are respectively positioned at the lower housing 1, the left side plate 3 and the right side plate 4, and the air inlets are positioned at the lower side, the left side and the right side of the radiating fins 8.
Specifically, the switching power supply 17 is installed on the power supply fixing plate 18, the bottom surface of the power supply fixing plate 18 is tightly attached to the lower housing 1 and fixed by bolts, and the height of the switching power supply 17 is not more than that of the secondary fan 10 and the main fan 5, so that the switching power supply 17 is not blocked by the air duct of the cavity, heat generated by the switching power supply 17 can be taken away through the lower housing 1, and the overall heat dissipation efficiency is greatly improved.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. An efficient and stable heat dissipation system for a temperature controllable device, comprising: box, accuse temperature main part and control circuit, its characterized in that: the box body is composed of a lower encloser (1), a left side plate (3), a right side plate (4) and an upper side plate (2), a plurality of ventilation grooves are formed in positions, close to radiating fins (8), of the lower encloser (1), the left side plate (3) and the right side plate (4), the ventilation grooves are of U-shaped structures, a main fan (5) is installed at the rear portion of the lower encloser (1), and a main circulation loop is formed among the lower encloser (1), the left side plate (3), the right side plate (4), the upper side plate (2) and the main fan (5);
the lower extreme of control by temperature change main part is provided with three support column (12) and through support column (12) and adopt nut and lower housing (1) fixed connection, the control by temperature change main part is formed by aluminium block processing, and it includes work cavity (15), semiconductor wafer (14), second grade fan (10), fan mount (11), heat preservation cotton (13), support column (12), fin (8) and heat preservation lid (6) are constituteed, all wrap up insulation material around work cavity (15), the rear end laminating of work cavity (15) is connected with four semiconductor wafer (14), fin (8) are hugged closely to the rear end of semiconductor wafer (14), fin (8) adopt the bolt fastening to work cavity (15), fan mount (11) are installed and are fixed with two second grade fans (10) on fin (8) rear end and fan mount (11), the fan fixing frame (11) is wrapped outside the secondary fan (10), the secondary fan (10) is tightly attached to the radiating fins (8), the secondary fan (10) can only pull out gas flowing through the radiating fins (8), and the heat-insulating cover (6) is arranged at the front end of the working cavity (15) by adopting a quick-release structure;
control circuit installs on lower housing and includes switching power supply (17), control panel and temperature controller (7), temperature controller (7) are installed on control by temperature change fixed plate (9) and control by temperature change fixed plate (9) adopt bolt and lower housing (1) fixed connection, still vertically install control panel fixed plate (16) on left side board (3), the control panel is fixed on control panel fixed plate (16).
2. The system of claim 1, wherein the system further comprises: the semiconductor wafers (14) are provided with a plurality of gaps, and ventilation gaps are reserved between the adjacent semiconductor wafers (14).
3. The system of claim 1, wherein the system further comprises: the temperature control main body is lifted up, a gap exists between the temperature control main body and the lower cover shell (1), and the height of the gap is smaller than the length of the supporting column (12).
4. The system of claim 1, wherein the system further comprises: the heat preservation cotton (13) is arranged on the outer wall of the working cavity (15), the heat preservation cotton (13) is arranged on the outer side of the semiconductor wafer (14), and the surface, attached to the radiating fin (8), of the semiconductor wafer (14) is exposed and is higher than the heat preservation cotton (13).
5. The system of claim 1, wherein the system further comprises: the air inlet of box is provided with three and is located encloser (1), left side board (3) and right side board (4) department respectively, the air inlet is located downside, left side and the right side of fin (8).
6. The system of claim 1, wherein the system further comprises: the semiconductor fin (14) transfers a large amount of heat to the radiating fin (8) when in work, and then transfers the heat of the radiating fin (8) to the inside of the box body through the secondary fan (10) to form a secondary loop.
7. The system of claim 1, wherein the system further comprises: two surfaces of the semiconductor wafer (14) are respectively attached to the working cavity (15) and the radiating fin (8) through heat conducting paste.
8. The system of claim 1, wherein the system further comprises: the switch power supply (17) is installed on the power supply fixing plate (18), the bottom surface of the power supply fixing plate (18) is tightly attached to the lower housing (1) and fixed through bolts, and the height of the switch power supply (17) does not exceed the height of the secondary fan (10) and the height of the main fan (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110831860.XA CN113567599A (en) | 2021-07-22 | 2021-07-22 | Efficient and stable heat dissipation system for temperature-controllable device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110831860.XA CN113567599A (en) | 2021-07-22 | 2021-07-22 | Efficient and stable heat dissipation system for temperature-controllable device |
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| Publication Number | Publication Date |
|---|---|
| CN113567599A true CN113567599A (en) | 2021-10-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110831860.XA Pending CN113567599A (en) | 2021-07-22 | 2021-07-22 | Efficient and stable heat dissipation system for temperature-controllable device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114527225A (en) * | 2022-02-23 | 2022-05-24 | 上海天美科学仪器有限公司 | Wide-range rapid constant-temperature chromatographic column box |
| CN114987898A (en) * | 2022-06-02 | 2022-09-02 | 上海天美科学仪器有限公司 | Efficient stable temperature compensation system for temperature-controllable device |
-
2021
- 2021-07-22 CN CN202110831860.XA patent/CN113567599A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114527225A (en) * | 2022-02-23 | 2022-05-24 | 上海天美科学仪器有限公司 | Wide-range rapid constant-temperature chromatographic column box |
| CN114987898A (en) * | 2022-06-02 | 2022-09-02 | 上海天美科学仪器有限公司 | Efficient stable temperature compensation system for temperature-controllable device |
| CN114987898B (en) * | 2022-06-02 | 2023-08-15 | 上海天美科学仪器有限公司 | Efficient stable temperature compensation system for temperature controllable device |
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