CN215421315U - Heat sink device - Google Patents
Heat sink device Download PDFInfo
- Publication number
- CN215421315U CN215421315U CN202120943533.9U CN202120943533U CN215421315U CN 215421315 U CN215421315 U CN 215421315U CN 202120943533 U CN202120943533 U CN 202120943533U CN 215421315 U CN215421315 U CN 215421315U
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- fan
- heat
- sub
- heat sink
- feather
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a heat dissipating double-fuselage, especially a heat dissipating double-fuselage suitable for dispelling the heat to the thyristor, including a radiator, a fan, the front of the heat sink of the radiator is used for installing the thyristor, the fan is used for blowing to the reverse side of the heat sink, the radiator includes two installation fins used for installing and fixing, fan fin used for fixing the fan, several sub-fins, the fan carries on the air cooling to sub-fin and heat sink, the utility model is reasonable in design, it is simple to have the fan to fix, with low costs, advantage with good heat-dissipating effects.
Description
Technical Field
The present invention relates to a heat dissipation device, and more particularly, to a simple heat dissipation device suitable for dissipating heat from a thyristor.
Background
At present, in an electric control and power distribution system, a thyristor switch (regulator) is generally used for controlling the on-off of loads such as a capacitor and the like, because the thyristor switch has large power consumption and high temperature, a radiator and a fan are required to be adopted for air cooling, at present, two heat dissipation devices are adopted for air cooling, one is a heat dissipation mode of only carrying out air cooling on a feather of the radiator, the heat dissipation device can not realize effective air cooling on a heat sink with the highest temperature, and the defect of low cooling speed exists; the other is a heat sink of the radiator in an air cooling heat dissipation mode, the fan is fixed on the radiator by a metal plate, and the defects of complex fan installation and high cost exist.
Disclosure of Invention
The utility model aims to solve the problems and realize a heat dissipation device with low cost and high heat dissipation speed.
The purpose of the utility model is achieved by the following technical scheme:
a heat dissipation device comprises a heat radiator and a fan, wherein the front side of a heat sink of the heat radiator is used for installing a thyristor, the fan is used for blowing air to the back side of the heat sink, the heat radiator comprises an installation feather used for installing and fixing (namely fixing an assembly consisting of the heat radiator, the fan and the thyristor), a fan feather used for fixing the fan and a plurality of sub-feathers, and the fan is used for air cooling the sub-feathers and the heat sink.
The installation vane and the fan vane are L-shaped.
A heat dissipation device, the height of the sub-feather is lower than that of the fan feather.
A heat dissipating device, the height of the sub-vane is lower than that of the installation vane.
The installation feather, the fan feather and the sub-feather are positioned on the reverse side of the heat sink.
The installation surface of the installation vane is higher than the height of the sub vane.
The mounting surface of the mounting feather is higher than an air channel formed by the fan for the sub-feather and the heat sink.
The fan fixing device has the advantages of reasonable design, simple fan fixing, low cost and good heat dissipation effect.
Drawings
Fig. 1 is a schematic view of a heat dissipation device according to an embodiment of the utility model.
Detailed Description
In the first embodiment of the heat dissipation device of the present invention, as shown in fig. 1:
a heat dissipating double-fuselage, including the heat sink, fan F, the front of heat sink A of the heat sink is used for installing the thyristor, the fan F is used for blowing to the reverse side of the heat sink A, the heat sink includes two installation fins (B1, B2; namely is used for fixing the assembly formed by fan, heat sink), fan fin (D1, D2) used for fixing the fan, several sub-fins C (the fin located between two fan fins, the quantity is 6 in figure 1), the fan F carries on the air cooling to sub-fin C and heat sink A; the installation vanes (B1, B2) and the fan vanes (D1, D2) are L-shaped; the height of the sub-vane C is lower than that of the fan vanes (D1, D2); the height of the sub-vane C is lower than that of the installation vanes (B1, B2); the mounting fins (B1, B2), the fan fins (D1, D2) and the sub-fins C are positioned on the reverse side of the heat sink; the installation surface of the installation pinna (B1, B2) is higher than the height of the sub-pinna C; the mounting surface of the mounting feather (B1, B2) is higher than the air channel formed by the fan to the sub feather C and the heat sink A.
The fan fixing device has the advantages of reasonable design, simple fan fixing, low cost and good heat dissipation effect.
Claims (7)
1. A heat dissipation device comprises a heat radiator and a fan, wherein the front side of a heat sink of the heat radiator is used for installing a thyristor, and the fan is used for blowing air to the back side of the heat sink, and the heat dissipation device is characterized in that: the radiator comprises two installation feathers for installation and fixation, a fan feather for fixation of the fan and a plurality of sub-feathers, and the fan cools the sub-feathers and the heat sink in an air cooling mode.
2. The heat dissipating device of claim 1, wherein: the installation feather and the fan feather are L-shaped.
3. The heat dissipating device of claim 1, wherein: the height of the sub-vane is lower than that of the fan vane.
4. The heat dissipating device of claim 1, wherein: the height of the sub-pinna is lower than that of the installation pinna.
5. The heat dissipating device of claim 1, wherein: the installation feather, the fan feather and the sub-feather are positioned on the reverse side of the heat sink.
6. The heat dissipating device of claim 1, wherein: the installation surface of the installation vane is higher than the height of the sub vane.
7. The heat dissipating device of claim 1, wherein: the mounting surface of the mounting feather is higher than an air channel formed by the fan for the sub-feather and the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120943533.9U CN215421315U (en) | 2021-05-06 | 2021-05-06 | Heat sink device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120943533.9U CN215421315U (en) | 2021-05-06 | 2021-05-06 | Heat sink device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215421315U true CN215421315U (en) | 2022-01-04 |
Family
ID=79674118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120943533.9U Active CN215421315U (en) | 2021-05-06 | 2021-05-06 | Heat sink device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215421315U (en) |
-
2021
- 2021-05-06 CN CN202120943533.9U patent/CN215421315U/en active Active
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |