CN210986851U

CN210986851U - Heat dissipation support for server mainframe room

Info

Publication number: CN210986851U
Application number: CN201922132257.3U
Authority: CN
Inventors: 周家一
Original assignee: Nanjing Institute of Mechatronic Technology
Current assignee: Nanjing Institute of Mechatronic Technology
Priority date: 2019-12-03
Filing date: 2019-12-03
Publication date: 2020-07-10
Anticipated expiration: 2029-12-03

Abstract

The utility model provides a server is heat dissipation support for large-scale computer lab, this application main body frame outside is provided with the rubber frame that the one deck was used for laminating quick-witted case, the main body frame rear side has the rear panel, there is the scattered gas pocket of rear side on rear panel upper portion, there is the downside gas pocket that looses in the rear panel lower part, there is regulation formula heat dissipation frame in the main body frame, there is the top panel in the main body frame of upper portion front side, the refrigeration piece clamps in the draw-in groove of refrigeration piece rack, the refrigeration piece rack is connected with corresponding upper bracket or under bracing frame, the upper bracket lower extreme outside links to each other through the rotary rod with the under bracing frame upper end outside, there is the blade in the main body frame of lower part front side, the end that stretches out at blade both. This application semiconductor refrigeration piece is according to the corresponding heat dissipation support of quick-witted case condition design, realizes carrying out the laminating formula heat dissipation to quick-witted case lateral wall, and whole design total branch is two-layer, and the upper strata is fixed heat dissipation, and the lower floor is for adjusting the formula heat dissipation to can improve whole radiating effect.

Description

Heat dissipation support for server mainframe room

Technical Field

The utility model relates to a heat dissipation corollary equipment field especially relates to a server is heat dissipation support for mainframe room.

Background

Often can place a large amount of quick-witted casees side by side in the large-scale computer lab, quick-witted case can produce a large amount of heats at the operation in-process, overheated can influence the further use of quick-witted case, consequently the computer lab mainly dispels the heat through the air conditioner at present, but because the air conditioner is external radiating effect often very limited, the Peltier effect means when the return circuit that the electric current passes through different conductors and constitutes, except producing irreversible Joule heat, the heat absorption can appear respectively along with the difference of current direction in the joint department of different conductors, exothermic phenomenon, the semiconductor refrigeration piece of making with it has simple structure, a series of characteristics such as simple to operate refrigeration effect is good

At present, a semiconductor refrigerating piece comprises an upper ceramic piece and a lower ceramic piece, P-type semiconductors are uniformly distributed on the upper ceramic piece, N-type semiconductors are uniformly distributed on the lower ceramic piece, the upper ceramic piece and the lower ceramic piece are mutually attached to enable the P-type semiconductors to be in contact with the N-type semiconductors in series, a connecting wire is arranged on the semiconductor refrigerating piece and used for being connected with a power supply, and refrigeration is carried out through heat absorption.

SUMMERY OF THE UTILITY MODEL

In order to solve the existing problems, the utility model provides a heat dissipation bracket for server large-scale machine room, which utilizes semiconductor refrigeration sheets to design a corresponding heat dissipation bracket according to the condition of the machine room, so as to realize the attaching type heat dissipation of the side wall of the machine room, the whole design is divided into two layers, the upper layer is fixed heat dissipation, the lower layer is adjustable heat dissipation, thereby improving the whole heat dissipation effect, in order to achieve the purpose, the utility model provides a heat dissipation bracket for server large-scale machine room, which comprises a rubber frame, a main body frame, an upper panel, blades, a rear panel, a refrigeration sheet placing frame, refrigeration sheets, an upper support frame and a lower support frame, wherein the outer side of the main body frame is provided with a layer of rubber frame for attaching the machine room, the rear side of the main body frame is provided with the rear panel, the upper part of the rear panel is provided with rear side air holes, the lower part of the, the adjustable heat dissipation frame is provided with an upper part and a lower part, an upper panel is arranged in a main body frame on the front side of the upper part, the refrigerating sheet placing frame is provided with a row of clamping grooves, the refrigerating sheets are clamped in the clamping grooves of the refrigerating sheet placing frame, wire grooves for placing refrigerating sheet wires are arranged in the clamping grooves of the refrigerating sheet placing frame, two sides of the refrigerating sheet placing frame are provided with extending ends, the refrigerating sheet placing frame is connected with a corresponding upper support frame or a lower support frame through the extending ends, the outer side of the lower end of the upper support frame and the outer side of the upper end of the lower support frame are both provided with connecting threaded rods and are connected through rotating rods, at least 2 rows of blades are arranged in the main body frame on the front side of the lower part, the extending ends at two ends of each blade are connected with a pull rod through a rocker, a positioning stop rod is arranged above the pull rod, the side wall of, the side wall of the middle part of the main body frame is provided with a temperature sensor, and the temperature sensor is connected with an electromagnetic pushing device through a connecting wire.

The utility model discloses a further improvement, the refrigeration piece is the semiconductor refrigeration piece, the semiconductor refrigeration piece includes potsherd and lower potsherd, and evenly distributed has P type semiconductor on the last potsherd, and evenly distributed has N type semiconductor on the lower potsherd, goes up the potsherd and makes P type semiconductor and N type semiconductor contact series connection with laminating each other with lower potsherd, is provided with the connecting wire on the semiconductor refrigeration piece and is used for connecting, and this application semiconductor refrigeration piece adopts the semiconductor refrigeration piece commonly used at present.

The utility model discloses a further improvement, there is the side gas pocket that looses in the main body frame both sides, can provide whole radiating effect through the gas pocket that looses in both sides.

The utility model discloses a further improvement, upper bracket front side has cooperation protrusion end, the bottom suspension strut rear side has cooperation recess end, upper bracket cooperates with cooperation recess end mutually with cooperation protrusion end after putting with the bottom suspension strut parallel, when the upper strata need be put the rear of lower floor and come the reinforcing radiating effect, rotatory to parallel with it, insert in the upper bracket upper end hole shape, and upper bracket front side cooperation protrusion end can cooperate with the bottom suspension strut rear side cooperation recess end, realize two-layer parallel and increase substantially the radiating effect.

The utility model discloses a further improvement, the stretching out of refrigeration piece rack is served and is equipped with convex recess and place the elastic ring, places the board and is connected with upper bracket through stretching out the end, because of its adoption elastic ring connected mode, easy dismounting, but manual regulation places the angle of board and changes the radiating effect.

The utility model discloses a further improvement, be provided with power and a row of fan on the support of rear panel and link to each other through the connecting wire, the rear panel inboard is provided with the fan, blows away heat scattered gas pocket and downside scattered gas pocket from the side.

The utility model is further improved, the electromagnetic pushing device comprises a telescopic rod, a spring, a moving frame, an electromagnet and a mounting groove, the other end of the telescopic rod is bent and sleeved with the spring, the bent end of the telescopic rod is inserted into the moving frame, the moving frame is fixed on the mounting groove of the side wall of the main body frame, the electromagnet is arranged at the rear side of the moving frame to adsorb the telescopic rod through the electromagnet to realize the reciprocating motion of the telescopic rod, a temperature sensor is arranged on the main body frame between the two layers, when the sensor detects that the surface temperature of the case reaches a certain value, the power is turned on, a refrigeration sheet works to draw away the heat on the surface of the case, when the temperature is too low, the electromagnetic device is started, a rotating pair is connected between the lower support frame and the bottom plate of the main frame, the iron part at the rear part of the telescopic rod is attracted by, the moving frame of the electromagnetic pushing device moves backwards along the mounting groove.

The utility model provides a server is heat dissipation support for mainframe room mainly realizes carrying out the laminating formula heat dissipation to quick-witted lateral wall. The design is always divided into two layers, the upper layer is a fixed type heat dissipation, and the lower layer is an adjustable type heat dissipation. A layer of rubber frame for fitting the chassis is arranged on the outer side of the main body frame. The refrigeration piece sets up in the draw-in groove of rack, and two are listed as and arrange, carry out twice exchange to thermal current and cold flow, realize the cooling, place the board in the middle of have the metallic channel to be used for placing the refrigeration piece wire, both sides are equipped with the end that stretches out, stretch out to serve and be equipped with convex recess and place the elastic ring. The placing plate is connected with the upper supporting frame through the extending end, and the angle of the placing plate can be manually adjusted to change the heat dissipation effect due to the fact that the placing plate is connected with the upper supporting frame in an elastic ring connection mode. The lower carriage is fixed in the support frame through connecting threaded rod and rotary rod on, the rotary rod is rotatable, when the lower floor rear is put to upper strata needs to strengthen the radiating effect, with its rotation to parallel, insert in the upper bracket upper end hole shape, and upper bracket front side cooperation protrusion end can with the lower carriage after cooperation groove end cooperation, realize that two-layer parallel increases substantially the radiating effect. When the upper panel is dismounted, the heat converted by the upper layer flows away through the rear side air-dispersing holes of the rear panel. The lower floor is provided with the multilayer blade, is used for blockking that the dust dyes the refrigeration piece on the one hand, and pull rod, rocker, the spacing pin that on the other hand accessible set up come angle regulation formula heat dissipation, improve the adaptability, are provided with the fan in the rear panel inboard simultaneously, blow away heat scattered gas pocket and the downside gas pocket of loosing from the side. Be provided with temperature sensor on the main part frame between two-layer, when the sensor detects quick-witted case surface temperature and reaches a certain value, the power is switched on, refrigeration piece work, draw away quick-witted case surface's heat, when the temperature crosses lowly, electromagnetic means starts, be connected for the revolute pair between lower carriage and the main frame bottom plate, telescopic link rear iron system part is attracted compression spring by magnet, make the support after shake and slow down heat radiating area in order to adjust the radiating effect, when the upper strata needs to the lower floor, electromagnetic thrust unit's removal frame is followed the mounting groove and is removed to the rear. The main body frame, the upper panel and the rear panel are made of materials with better heat insulation performance.

Drawings

FIG. 1 is a first overall view of the present invention;

FIG. 2 is a second overall view of the present invention;

fig. 3 is a schematic view of a refrigerating sheet placing unit of the present invention;

fig. 4 is a schematic view of the refrigerating fin placing frame of the present invention;

FIG. 5 is a schematic view of an angle adjustment part of the cold plate placing rack of the present invention;

FIG. 6 is a schematic view of a portion of an electromagnetic apparatus of the present invention;

FIG. 7 is a schematic view of a heat dissipating portion of the fan of the present invention;

illustration of the drawings;

1. a rubber frame; 2. side air diffusing holes; 3. a main body frame; 4. an upper panel; 5. A blade; 6. Rear side air diffusing holes; 7. a rear panel; 8. a lower side air dispersing hole; 9. a refrigerating sheet placing frame; 10. a wire guide groove; 11. a refrigeration plate; 12. an elastic ring; 13. an upper support frame; 14. fitting the protruding end; 15. rotating the rod; 16. connecting a threaded rod; 17. a mating groove end; 18. a lower support frame; 19. a temperature sensor; 20. a pull rod; 21. a rocker; 22. a limit stop lever; 24. a spring; 25. Moving the plate; 26. A magnet; 27. A chute; 28. a power source; 29. a fan.

Detailed Description

The invention will be described in further detail with reference to the following detailed description and accompanying drawings:

the utility model provides a server is heat dissipation support for mainframe room, application semiconductor refrigeration piece design corresponding heat dissipation support according to the quick-witted case condition, realize carrying out the laminating formula heat dissipation to quick-witted case lateral wall, and whole design total score is two-layer, and the upper strata is fixed heat dissipation, and the lower floor is for adjusting the formula heat dissipation to can improve whole radiating effect.

As an embodiment of the utility model, the utility model provides a heat dissipation bracket for server large-scale machine room, which comprises a rubber frame 1, a main body frame 3, an upper panel 4, blades 5, a rear panel 7, a refrigerating sheet placing rack 9, refrigerating sheets 11, an upper support frame 13 and a lower support frame 18, wherein the outer side of the main body frame 3 is provided with a layer of rubber frame 1 for fitting the machine case, the rear side of the main body frame 3 is provided with the rear panel 7, the upper part of the rear panel 7 is provided with rear side air dispersing holes 6, the lower part of the rear panel 7 is provided with lower side air dispersing holes 8, an adjustable heat dissipation frame is arranged in the main body frame 3, the adjustable heat dissipation frame is provided with an upper part and a lower part, the main body frame 3 at the front side of the upper part is provided with the upper panel 4, the refrigerating sheet placing rack 9 is provided with a row of clamping grooves, the refrigerating sheets 11 are clamped in the clamping grooves of the refrigerating sheet placing rack 9, a, the utility model discloses a refrigerator, including refrigeration piece rack 9, including upper strut frame 13 or lower carriage 18, upper strut frame 13 lower extreme outside and lower carriage 18 upper end outside all have connecting threaded rod 16 and link to each other through rotary rod 15, have 2 at least rows of blades 5 in the main body frame 3 of lower part front side, the end that stretches out at blade 5 both ends links to each other with pull rod 20 through rocker 21, there is spacing pin 22 pull rod 20 top pull rod 20, 3 lateral walls of main body frame have electromagnetic thrust device, electromagnetic thrust device's telescopic link 23 links to each other with pull rod 20, promotes the motion of pull rod 20 by electromagnetic thrust device and realizes the angle modulation, 3 middle part lateral walls of main body frame are provided with temperature sensor 19, temperature sensor 19 connects electromagnetic thrust device through the connecting wire.

As a specific embodiment of the present invention, the present invention provides a heat dissipation rack for server large-scale machine room as shown in FIGS. 1-7, which comprises a rubber frame 1, a main frame 3, an upper panel 4, blades 5, a rear panel 7, a refrigerating sheet placing rack 9, a refrigerating sheet 11, an upper supporting rack 13 and a lower supporting rack 18, wherein the outer side of the main frame 3 is provided with a layer of rubber frame 1 for fitting the machine case, the rear side of the main frame 3 is provided with a rear panel 7, the rack of the rear panel 7 is provided with a power supply 28 and a row of fans 29 and connected by connecting wires, the inner side of the rear panel is provided with fans for blowing away heat from the side air dissipation holes and the lower air dissipation holes, the two sides of the main frame 3 are provided with side air dissipation holes 2 for providing the whole heat dissipation effect through the air dissipation holes at the two sides, the upper portion of the rear panel 7 is provided with rear side air dissipation holes 6, the lower, the semiconductor refrigerating sheet is characterized in that an adjustable radiating frame is arranged in the main body frame 3, the adjustable radiating frame is provided with an upper part and a lower part, an upper panel 4 is arranged in the main body frame 3 at the front side of the upper part, the refrigerating sheet placing frame 9 is provided with a row of clamping grooves, the refrigerating sheet is a semiconductor refrigerating sheet, the semiconductor refrigerating sheet comprises an upper ceramic sheet and a lower ceramic sheet, P-type semiconductors are uniformly distributed on the upper ceramic sheet, N-type semiconductors are uniformly distributed on the lower ceramic sheet, the upper ceramic sheet and the lower ceramic sheet are mutually attached to enable the P-type semiconductors to be in contact series connection with the N-type semiconductors, a connecting wire is arranged on the semiconductor refrigerating sheet and used for connecting a power supply, the semiconductor refrigerating sheet adopts a semiconductor refrigerating sheet which is commonly used at present, the refrigerating sheet 11 is clamped in the clamping grooves of the refrigerating sheet placing frame 9, wire grooves 10 for placing refrigerating sheet, the refrigeration sheet placing frame is characterized in that an arc-shaped groove placing elastic ring 12 is arranged on the extending end of the refrigeration sheet placing frame 9, the refrigeration sheet placing frame 9 is connected with a corresponding upper support frame 13 or a corresponding lower support frame 18 through the extending end, the refrigeration sheet placing frame is convenient to assemble and disassemble due to the adoption of an elastic ring connecting mode, the angle of a placing plate can be manually adjusted to change the heat dissipation effect, connecting threaded rods 16 are arranged on the outer side of the lower end of the upper support frame 13 and the outer side of the upper end of the lower support frame 18 and are connected through rotating rods 15, a matching convex end 14 is arranged on the front side of the upper support frame 13, a matching groove end 17 is arranged on the rear side of the lower support frame 18, the matching convex end 14 is matched with the matching groove end 17 after the upper support frame 13 and the lower support frame 18 are placed in parallel, when the upper layer needs to be placed behind the lower layer to enhance the heat dissipation effect, the upper layer is, the heat dissipation effect is greatly improved by realizing two layers of parallelism, at least 2 rows of blades 5 are arranged in a main body frame 3 at the front side of the lower part, the extending ends at the two ends of each blade 5 are connected with a pull rod 20 through a rocker 21, a limit stop rod 22 is arranged above the pull rod 20, an electromagnetic pushing device is arranged on the side wall of the main body frame 3, a telescopic rod 23 of the electromagnetic pushing device is connected with the pull rod 20, the pull rod 20 is pushed by the electromagnetic pushing device to move to realize angle adjustment, a temperature sensor 19 is arranged on the side wall of the middle part of the main body frame 3, the temperature sensor 19 is connected with the electromagnetic pushing device through a connecting wire, the electromagnetic pushing device comprises a telescopic rod 23, a spring 24, a moving frame 25, an electromagnet 26 and a mounting groove 27, the other end of the telescopic rod 23 is bent and sleeved with the spring 24, the bent end of the telescopic rod 23 is, remove frame 25 rear side and have electro-magnet 26 to adsorb telescopic link 23 through electro-magnet 26 and realize telescopic link 23 back and forth movement, be provided with temperature sensor between two-layer on the main part frame, when the sensor detects quick-witted case surface temperature and reaches a certain value, the power is turned on, refrigeration piece work, draw away quick-witted case surface's heat, when the temperature is crossed lowly, electromagnetic means starts, be connected for the revolute pair between lower carriage and the main frame bottom plate, the iron system part in telescopic link rear is attracted compression spring by magnet, make the support shake behind the support and slow down heat radiating area in order to adjust the radiating effect, when the upper strata needs to the lower floor, electromagnetism thrust unit's removal frame is followed the mounting groove and.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, but also to cover any modifications or equivalent changes made in the technical spirit of the present invention, which fall within the scope of the present invention.

Claims

1. The utility model provides a server is heat dissipation support for mainframe room, includes rubber frame (1), main body frame (3), top panel (4), blade (5), rear panel (7), refrigeration piece rack (9), refrigeration piece (11), top support frame (13) and under bracing frame (18), its characterized in that: the refrigerator is characterized in that a rubber frame (1) used for being attached to a cabinet is arranged on the outer side of a main body frame (3), a rear panel (7) is arranged on the rear side of the main body frame (3), rear side air dispersing holes (6) are formed in the upper portion of the rear panel (7), lower side air dispersing holes (8) are formed in the lower portion of the rear panel (7), an adjustable heat dissipation frame is arranged in the main body frame (3), the adjustable heat dissipation frame is provided with an upper portion and a lower portion, an upper panel (4) is arranged in the main body frame (3) in the front of the upper portion, a row of clamping grooves are formed in a refrigerating sheet placing frame (9), refrigerating sheets (11) are clamped in the clamping grooves of the refrigerating sheet placing frame (9), wire grooves (10) used for placing refrigerating sheet wires are formed in the clamping grooves of the refrigerating sheet placing frame (9), extending ends are arranged on two sides of the refrigerating sheet placing frame (9), and the refrigerating sheet placing frame (9) is connected, go up support frame (13) lower extreme outside and bottom suspension strut (18) upper end outside all have connecting threaded rod (16) and link to each other through rotary rod (15), have 2 at least row blade (5) in main body frame (3) of lower part front side, the end that stretches out at blade (5) both ends links to each other with pull rod (20) through rocker (21), pull rod (20) top has spacing pin (22), main body frame (3) lateral wall has electromagnetic thrust unit, electromagnetic thrust unit's telescopic link (23) link to each other with pull rod (20), promote pull rod (20) motion by electromagnetic thrust unit and realize angle modulation, main body frame (3) middle part lateral wall is provided with temperature sensor (19), temperature sensor (19) connect electromagnetic thrust unit through the connecting wire.

2. The heat dissipation mount for a server mainframe according to claim 1, wherein: the refrigerating piece is a semiconductor refrigerating piece.

3. The heat dissipation mount for a server mainframe according to claim 2, wherein: the semiconductor refrigeration piece comprises an upper ceramic piece and a lower ceramic piece, wherein P-type semiconductors are uniformly distributed on the upper ceramic piece, N-type semiconductors are uniformly distributed on the lower ceramic piece, the upper ceramic piece and the lower ceramic piece are mutually attached to enable the P-type semiconductors to be in contact with the N-type semiconductors in series, and a connecting wire is arranged on the semiconductor refrigeration piece and used for being connected with a power supply.

4. The heat dissipation mount for a server mainframe according to claim 1, wherein: side air dispersing holes (2) are formed in two sides of the main body frame (3).

5. The heat dissipation mount for a server mainframe according to claim 1, wherein: the front side of the upper support frame (13) is provided with a matching protruding end (14), the rear side of the lower support frame (18) is provided with a matching groove end (17), and the upper support frame (13) and the lower support frame (18) are placed in parallel and then are matched with the matching protruding end (14) and the matching groove end (17).

6. The heat dissipation mount for a server mainframe according to claim 1, wherein: and the extending end of the refrigerating sheet placing frame (9) is provided with an arc-shaped groove placing elastic ring (12).

7. The heat dissipation mount for a server mainframe according to claim 1, wherein: the bracket of the rear panel (7) is provided with a power supply (28) and a row of fans (29) which are connected through a connecting wire.

8. The heat dissipation mount for a server mainframe according to claim 1, wherein: electromagnetism thrust unit includes telescopic link (23), spring (24), removes frame (25), electro-magnet (26) and mounting groove (27), telescopic link (23) other end is buckled and the cover has spring (24), the end of buckling of telescopic link (23) inserts and removes frame (25), remove frame (25) and fix on mounting groove (27) of main body frame (3) lateral wall, it has electro-magnet (26) to adsorb telescopic link (23) through electro-magnet (26) and realizes telescopic link (23) round trip movement to remove frame (25) rear side.