CN220857895U - High-frequency switch power supply module - Google Patents
High-frequency switch power supply module Download PDFInfo
- Publication number
- CN220857895U CN220857895U CN202322194296.2U CN202322194296U CN220857895U CN 220857895 U CN220857895 U CN 220857895U CN 202322194296 U CN202322194296 U CN 202322194296U CN 220857895 U CN220857895 U CN 220857895U
- Authority
- CN
- China
- Prior art keywords
- heat
- circuit board
- power supply
- supply module
- connecting plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims abstract description 6
- 238000005057 refrigeration Methods 0.000 claims description 7
- 238000013016 damping Methods 0.000 claims description 4
- 230000007246 mechanism Effects 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- 230000035939 shock Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000001816 cooling Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B70/00—Technologies for an efficient end-user side electric power management and consumption
- Y02B70/10—Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a high-frequency switch power supply module which comprises a shell, wherein a connecting plate is arranged on one side of the shell, a circuit board is arranged in the shell, a miniature semiconductor refrigerating sheet is arranged at the bottom of the circuit board, and heat-conducting plates are fixedly embedded on the front surface and the back surface of the shell. The heat generated by the circuit board during operation is absorbed by the cold side of the micro semiconductor refrigerating sheet when current passes through the micro semiconductor refrigerating sheet, the heat generated by the circuit board during operation is transferred to the hot side (namely the contact surface with the heat conducting rod), the heat conducting rod can guide and convey the heat of the hot side to the two heat conducting plates, and the outer side surface of the heat conducting plate is directly contacted with the outside, and copper has good heat conducting property, so that the heat can be quickly transferred to the surrounding environment.
Description
Technical Field
The utility model relates to the technical field of power supply modules, in particular to a high-frequency switch power supply module.
Background
The power module is a power supply which can be directly attached to a printed circuit board and is characterized by being capable of providing power for an application specific integrated circuit, a digital signal processor, a microprocessor, a memory, a field programmable gate array and other digital or analog loads.
The utility model discloses an exchange high frequency switch power module that chinese patent discloses is CN214900624U, it includes casing and circuit board, the regulating tank has been seted up to casing one side, regulating tank inside is provided with the baffle, the baffle top is connected with ventilative net, the casing is hollow structure, equal fixedly connected with support bar on the inner wall of casing both sides, two support bar tops are provided with the circuit board, adjusting part sets up inside the regulating tank for adjust the casing gas permeability in order to improve the heat dispersion of casing, damping part sets up between the inner wall of circuit board and casing bottom, be used for the security to circuit board shock attenuation in order to improve the casing. This kind of exchange high frequency switch power module promotes the movable plate through first magnet and second magnet in order to reach the regulation casing gas permeability, improves the shock attenuation effect through supporting seat, supporting shoe and damping spring simultaneously.
For the above related art, there are some disadvantages, in the actual use process, when the power module needs to be cooled, the user needs to move the moving plate downwards to promote heat transfer and dissipation, and the passive cooling mode is complex in operation and inconvenient to use, so that it is necessary to provide a high-frequency switch power module to solve the above technical problems.
Disclosure of utility model
The present utility model is directed to a high frequency switching power supply module, which solves the above-mentioned problems of the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
The utility model provides a high frequency switch power module, includes the casing, one side of casing is provided with the connecting plate, the inside of casing is provided with the circuit board, the bottom of circuit board is provided with miniature semiconductor refrigeration piece, the front of casing is all fixed mosaic and is installed the heat-conducting plate with the back, the equal equidistant evenly fixed mounting of front side and rear side of miniature semiconductor refrigeration piece bottom has a plurality of heat-conducting rod, and the one end that miniature semiconductor refrigeration piece was kept away from to the heat-conducting rod and the medial surface fixed connection of corresponding heat-conducting plate.
As a further scheme of the utility model: the utility model discloses a motor, including connecting plate, locating plate and fixed slot's inner wall sliding connection, the locating slot has all been seted up to the top of casing one side opening part and bottom, the inside fixed mounting of locating slot has the gag lever post, the cover is equipped with the stopper on the outer wall of gag lever post, the spring has been cup jointed on the outer wall of gag lever post, one side fixed mounting of stopper has the locating plate, and the inner wall sliding connection of locating plate and fixed slot, the locating slot has all been seted up to the top and the bottom of casing one side opening part, one side of connecting plate is provided with operating device.
As still further aspects of the utility model: the operation mechanism comprises two guide grooves, the two guide grooves are symmetrically distributed on one side of the connecting plate, the guide grooves are communicated with the inside of the corresponding fixing groove, pull ropes are fixedly connected to opposite sides of the positioning plate, one ends of the pull ropes penetrate through the inside of the corresponding guide grooves and extend to one side of the connecting plate, one ends of the pull ropes are fixedly connected with check blocks, and pull rings are rotatably arranged on one sides of the check blocks.
As still further aspects of the utility model: the both sides of the inside bottom of casing are all fixed mounting has a plurality of snubber block, and the top of snubber block and the bottom fixed connection of circuit board, the top of miniature semiconductor refrigeration piece is laminated with the bottom of circuit board.
As still further aspects of the utility model: and a sealing gasket is arranged at the joint of the connecting plate and the shell.
As still further aspects of the utility model: the top of stopper has seted up the slide hole with gag lever post looks adaptation, and the stopper passes through slide hole and gag lever post sliding connection that its top was seted up.
As still further aspects of the utility model: the material of the heat conducting plate is copper.
Compared with the prior art, the utility model has the beneficial effects that:
1. According to the utility model, through the cooperation of the shell, the circuit board, the heat conducting rod, the micro semiconductor refrigerating sheet and the heat conducting plate, heat generated by the circuit board during operation can be quickly transferred to the surrounding environment due to the fact that the cold side of the micro semiconductor refrigerating sheet is in contact with the bottom of the circuit board, when current passes through the micro semiconductor refrigerating sheet, the cold side of the micro semiconductor refrigerating sheet can absorb heat generated by the circuit board during operation and transfer the heat to the hot side (namely the contact surface with the heat conducting rod), the heat conducting rod can guide and transfer the heat of the hot side to the two heat conducting plates, and the heat conducting plate has good heat conducting performance due to the fact that the outer side surface of the heat conducting plate is directly in contact with the outside, so that the heat can be quickly transferred to the surrounding environment, the active heat radiating effect of the power module is achieved, the whole radiating process is unnecessary to be manually involved, the use of people is convenient, noise is avoided, and the radiating effect is good.
2. According to the utility model, through the cooperation of the connecting plate, the pull ring, the stop block, the guide groove, the limiting rod, the spring, the limiting block, the locating plate, the locating groove, the fixing groove, the limiting groove and the pull rope, the detachable structure of the connecting plate is simple, the operation is convenient, the quick assembly and disassembly of the connecting plate are convenient for workers, the maintenance work of the power supply module becomes very convenient, and compared with the existing fixing through the screw, the quick assembly and disassembly method is more practical.
Drawings
FIG. 1 is a schematic diagram of a high frequency switching power supply module;
FIG. 2 is a schematic diagram of a front cross-sectional configuration of a high frequency switching power supply module;
FIG. 3 is a schematic diagram showing a side view connection structure of a micro semiconductor cooling plate and a heat conducting rod in a high frequency switching power supply module;
fig. 4 is an enlarged schematic diagram of the structure of fig. 2 a of a high-frequency switching power supply module.
In the figure: 1. a housing; 2. a connecting plate; 3. a circuit board; 4. a heat conduction rod; 5. a micro semiconductor refrigerating sheet; 6. a heat conductive plate; 7. a pull ring; 8. a stop block; 9. a guide groove; 10. a limit rod; 11. a spring; 12. a limiting block; 13. a positioning plate; 14. a positioning groove; 15. a sealing gasket; 16. a fixing groove; 17. a limit groove; 18. a pull rope; 19. and a shock absorption block.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1 to 4, in an embodiment of the present utility model, a high-frequency switching power supply module includes a casing 1, a connecting plate 2 is disposed on one side of the casing 1, a circuit board 3 is disposed inside the casing 1, a micro semiconductor cooling plate 5 is disposed at the bottom of the circuit board 3, heat conducting plates 6 are fixedly embedded on the front and back sides of the casing 1, a plurality of heat conducting rods 4 are uniformly and fixedly mounted on the front and back sides of the bottom of the micro semiconductor cooling plate 5 at equal intervals, and one end of the heat conducting rod 4 far away from the micro semiconductor cooling plate 5 is fixedly connected with the inner side of the corresponding heat conducting plate 6.
Referring to fig. 4, in the application, the top and bottom of the connecting plate 2 are both provided with a fixed slot 16, one side of the inner wall of the fixed slot 16 is provided with a limit slot 17, the inside of the limit slot 17 is fixedly provided with a limit rod 10, the outer wall of the limit rod 10 is sleeved with a limit block 12, the limit block 12 is in sliding connection with the inner wall of the limit slot 17, the outer wall of the limit rod 10 is sleeved with a spring 11, one side of the limit block 12 is fixedly provided with a positioning plate 13, the positioning plate 13 is in sliding connection with the inner wall of the fixed slot 16, the top and the bottom of the opening at one side of the shell 1 are both provided with positioning slots 14, the positioning slots 14 are clamped with the positioning plate 13, and one side of the connecting plate 2 is provided with an operating mechanism.
Referring to fig. 1, 2 and 4, in the present application, the operating mechanism includes two guide grooves 9, the number of the guide grooves 9 is two, the two guide grooves 9 are symmetrically distributed and arranged on one side of the connecting plate 2, the guide grooves 9 are communicated with the interiors of the corresponding fixing grooves 16, opposite sides of the two positioning plates 13 are fixedly connected with pull ropes 18, one ends of the pull ropes 18 extend to one side of the connecting plate 2 through the interiors of the corresponding guide grooves 9, one ends of the pull ropes 18 are fixedly connected with stop blocks 8, one side of each stop block 8 is rotatably provided with a pull ring 7, so that the positions of the two positioning plates 13 are conveniently operated, and rapid assembly and disassembly of the connecting plate 2 are realized.
Referring to fig. 2, in the application, a plurality of shock absorbing blocks 19 are fixedly installed on two sides of the bottom inside a casing 1, the top of each shock absorbing block 19 is fixedly connected with the bottom of a circuit board 3, the top of a micro semiconductor refrigerating sheet 5 is attached to the bottom of the circuit board 3, and the circuit board 3 has a certain shock absorbing effect through the arrangement of the shock absorbing blocks 19, so that the shock absorbing effect of the circuit board 3 is improved, and damage to the circuit board 3 caused by vibration in the use process is prevented.
Referring to fig. 4, in the application, a sealing gasket 15 is arranged at the joint of the connecting plate 2 and the casing 1, so that the tightness of the joint of the connecting plate 2 and the casing 1 is ensured, and the stable use of the power module is prevented from being influenced by external dust.
Referring to fig. 4, in the present application, a sliding hole adapted to the stop lever 10 is formed at the top of the stop block 12, and the stop block 12 is slidably connected to the stop lever 10 through the sliding hole formed at the top of the stop block.
Referring to fig. 1, in the present application, the heat conducting plate 6 is made of copper, and the copper has good heat conducting property, so that heat can be quickly transferred to the surrounding environment, which is beneficial to quick heat dissipation of the power module.
The working principle of the utility model is as follows:
Referring to fig. 1 to 4, when the device is used, the parts not related to the device are the same as or can be realized by adopting the prior art, when the power module is used, the micro semiconductor refrigerating sheet 5 is electrified, the heat generated by the circuit board 3 during operation can be quickly transferred to the surrounding environment due to the fact that the cold side of the micro semiconductor refrigerating sheet 5 is contacted with the bottom of the circuit board 3, when current passes through the micro semiconductor refrigerating sheet 5, the cold side of the micro semiconductor refrigerating sheet 5 can absorb the heat generated by the circuit board 3 during operation and transfer the heat to the hot side (namely the contact surface with the heat conducting rod 4), the heat conducting rod 4 can guide and transfer the heat of the hot side to the two heat conducting plates 6, and copper has good heat conducting performance, so that the heat can be quickly transferred to the surrounding environment, the heat dissipation effect on the power module is achieved, the whole heat dissipation process is unnecessary to be manually intervened, the use of people is convenient, noise is avoided, and the heat dissipation effect is good.
Referring to fig. 1, 2 and 4, in use, the power module is inevitably subject to faults and needs to be overhauled during use, when the maintenance is needed, the connecting plate 2 on one side of the casing 1 needs to be disassembled, in the dismounting mode of the connecting plate 2, a worker can directly pull the pull ring 7, the pull ring 7 pulls the two pull ropes 18 to move to one side of the connecting plate 2 through the stop block 8, under the guidance of the guide groove 9, the pull rope 18 pulls the two positioning plates 13 to move relatively, the movement of the positioning plates 13 drives the limiting block 12 to slide on the outer wall of the limiting rod 10 and extrude the spring 11, along with the relative movement of the two positioning plates 13, the positioning plates 13 can be separated from the inside of the positioning groove 14, the connecting plate 2 can be directly detached from one side of the machine shell 1 after the clamping limit of the positioning groove 14 and the positioning plates 13 is lost, the circuit board 3 in the shell 1 can be overhauled, when the connecting plate 2 is installed, the same operation principle is adopted, the pull ring 7 is pulled firstly, so that the two positioning plates 13 move into the fixed groove 16, then the connecting plate 2 is clamped with one side of the shell 1, and the limit of the pull ring 7 is released at the same time, the positioning plate 13 is driven by the limiting block 12 to be directly clamped into the positioning groove 14 on the shell 1 under the elastic action of the spring 11, so that the connecting plate 2 is firmly fixed on one side of the shell 1, the installation of the connecting plate 2 is completed, therefore, the detachable structure of the connecting plate 2 is simple, the operation is convenient, the quick assembly and disassembly of the connecting plate 2 can be conveniently carried out by staff, make the maintenance work to power module become very convenient, compare current fixed through the screw, this kind of quick detach mode, more practical.
Although the present utility model has been described with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and changes may be made without departing from the spirit and principles of the present utility model.
Claims (7)
1. A high frequency switching power supply module comprising a housing (1), characterized in that: one side of casing (1) is provided with connecting plate (2), the inside of casing (1) is provided with circuit board (3), the bottom of circuit board (3) is provided with miniature semiconductor refrigeration piece (5), the front of casing (1) is all fixed mosaic and is installed heat-conducting plate (6) with the back, the equal equidistant evenly fixed mounting of front side and rear side of miniature semiconductor refrigeration piece (5) bottom has a plurality of heat-conducting rod (4), and the one end that miniature semiconductor refrigeration piece (5) was kept away from to heat-conducting rod (4) and the medial surface fixed connection of corresponding heat-conducting plate (6).
2. A high frequency switching power supply module according to claim 1, wherein: fixed slot (16) have all been seted up to the top and the bottom of connecting plate (2), spacing groove (17) have been seted up to one side of fixed slot (16) inner wall, the inside fixed mounting of spacing groove (17) has gag lever post (10), the cover is equipped with stopper (12) on the outer wall of gag lever post (10), cup jointed spring (11) on the outer wall of gag lever post (10), one side fixed mounting of stopper (12) has locating plate (13), and the inner wall sliding connection of locating plate (13) and fixed slot (16), constant head tank (14) have all been seted up to the top and the bottom of casing (1) one side opening part, one side of connecting plate (2) is provided with operating mechanism.
3. A high frequency switching power supply module according to claim 2, wherein: operating device includes guiding groove (9), and the quantity of guiding groove (9) is two, two guiding groove (9) are the symmetric distribution and offer in one side of connecting plate (2), and guiding groove (9) are linked together with the inside of corresponding fixed slot (16), two equal fixedly connected with stay cord (18) of opposite side of locating plate (13), and the one end of stay cord (18) runs through the inside of corresponding guiding groove (9) and extends to one side of connecting plate (2), one end fixedly connected with dog (8) of stay cord (18), pull ring (7) are installed in one side rotation of dog (8).
4. A high frequency switching power supply module according to claim 1, wherein: the two sides of the inner bottom of the shell (1) are fixedly provided with a plurality of damping blocks (19), the tops of the damping blocks (19) are fixedly connected with the bottom of the circuit board (3), and the tops of the miniature semiconductor refrigerating sheets (5) are attached to the bottom of the circuit board (3).
5. A high frequency switching power supply module according to claim 1, wherein: a sealing gasket (15) is arranged at the joint of the connecting plate (2) and the shell (1).
6. A high frequency switching power supply module according to claim 2, wherein: the top of the limiting block (12) is provided with a sliding hole matched with the limiting rod (10), and the limiting block (12) is in sliding connection with the limiting rod (10) through the sliding hole formed in the top of the limiting block.
7. A high frequency switching power supply module according to claim 1, wherein: the heat conducting plate (6) is made of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322194296.2U CN220857895U (en) | 2023-08-14 | 2023-08-14 | High-frequency switch power supply module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322194296.2U CN220857895U (en) | 2023-08-14 | 2023-08-14 | High-frequency switch power supply module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220857895U true CN220857895U (en) | 2024-04-26 |
Family
ID=90772217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322194296.2U Active CN220857895U (en) | 2023-08-14 | 2023-08-14 | High-frequency switch power supply module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220857895U (en) |
-
2023
- 2023-08-14 CN CN202322194296.2U patent/CN220857895U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210142942U (en) | Vertical cabinet type generator set | |
| CN220857895U (en) | High-frequency switch power supply module | |
| CN217562000U (en) | Quick heat dissipation machine case for computer | |
| CN210986851U (en) | Heat dissipation support for server mainframe room | |
| CN114585226A (en) | Energy-saving power amplifier cooling device with heat exchange | |
| CN208720132U (en) | A kind of green energy conservation LED light cooling fin | |
| CN111864576A (en) | Water-cooling and air-cooling integrated heat dissipation type power distribution cabinet for electric power engineering construction | |
| CN220440170U (en) | Waterproof outdoor electric power cabinet | |
| CN220253912U (en) | Auxiliary heat dissipation mechanism for power engineering equipment | |
| CN216218522U (en) | Heat dissipation mechanism of frequency converter | |
| CN217115168U (en) | Detachable power pack | |
| CN216791428U (en) | Wireless temperature measuring device for hydropower station electromechanical equipment | |
| CN215643987U (en) | Lead-type power transformer convenient to radiate | |
| CN220754968U (en) | Switch for photoelectric information conversion | |
| CN216525983U (en) | Mounting bracket for electric power metering device | |
| CN112713686B (en) | Motor installation structure convenient for heat dissipation and installation method thereof | |
| CN219605724U (en) | Cooling device for hydraulic system | |
| CN218735448U (en) | Signal shielding device for 5G network | |
| CN220874958U (en) | Assembled industrial portable case | |
| CN218352569U (en) | Integrated video server | |
| CN216600616U (en) | Small-size low-power-consumption switching power supply | |
| CN220402243U (en) | Safety monitoring cabinet for water conservancy hydropower station | |
| CN217769857U (en) | Intelligent power panel capable of performing overcurrent protection | |
| CN213039442U (en) | Silencing device for liquid pump | |
| CN220156046U (en) | Assembled high-low voltage switch cabinet |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |