CN218445816U - Semiconductor chip testing device - Google Patents
Semiconductor chip testing device Download PDFInfo
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- CN218445816U CN218445816U CN202221973277.9U CN202221973277U CN218445816U CN 218445816 U CN218445816 U CN 218445816U CN 202221973277 U CN202221973277 U CN 202221973277U CN 218445816 U CN218445816 U CN 218445816U
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Abstract
The embodiment of the utility model discloses a semiconductor chip testing device, which comprises a substrate, a temperature adjusting component, a testing component and a material moving mechanism, wherein the temperature adjusting component, the testing component and the material moving mechanism are positioned on the substrate; the temperature adjusting component comprises a temperature adjusting plate which is erected on the substrate through a supporting plate, and a first buckling piece and a second buckling piece which are arranged on two opposite sides of the temperature adjusting plate; the temperature adjusting plate can cool or heat the product; the first and second crimping pieces are configured to cooperate with each other to enable the product to be closely attached to the temperature-adjusting plate; move material mechanism and be used for carrying the product to the test component by the temperature regulation subassembly, including driving piece, follow sharp module and the cantilever that the first direction extension set up, sharp module is fixed in on the base plate for drive cantilever is along the first direction motion, and the driving piece is connected with cantilever transmission, is used for driving the cantilever and moves along the second direction. The semiconductor chip can be ensured to be rapidly cooled/heated, the sealing performance is good, and good temperature uniformity is kept during testing.
Description
Technical Field
The utility model relates to a semiconductor chip tests technical field. And more particularly, to a semiconductor chip testing apparatus.
Background
When semiconductor chips are tested in batches, in order to eliminate test errors caused by temperature differences of the chips, the ambient temperature of each chip in each batch of semiconductor chips needs to be kept within a certain range during testing, and therefore a special high-temperature and low-temperature incubator is needed to provide a stable temperature environment. In addition, due to the heat generated by the semiconductor chip itself, ventilation is required to continuously remove the heat dissipated by the semiconductor chip, so as to keep the temperature of all chips within a certain range. However, the heat dissipation method adopted in the prior art is to ventilate the semiconductor chip, and the heat dissipation method cannot guarantee the requirement of the semiconductor chip on a relatively closed test environment during testing, and cannot meet good temperature uniformity.
SUMMERY OF THE UTILITY MODEL
In view of the above problem, an object of the present invention is to provide a semiconductor chip testing apparatus capable of ensuring the uniformity of the temperature of a semiconductor chip during a test, wherein the semiconductor chip is rapidly cooled/heated and the sealing performance is good.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a semiconductor chip testing apparatus, comprising:
the device comprises a substrate, and a temperature adjusting assembly, a testing assembly and a material moving mechanism which are positioned on the substrate;
the temperature adjusting assembly comprises a temperature adjusting plate arranged on the substrate through a supporting plate frame, and a first buckling piece and a second buckling piece which are arranged on two opposite sides of the temperature adjusting plate;
the temperature adjusting plate can cool or heat the product;
the first and second crimping pieces are configured to cooperate with each other to enable the product to be closely attached to the temperature-regulating plate;
the material moving mechanism is used for carrying a product to the testing assembly through the temperature adjusting assembly and comprises a driving piece, a linear module and a cantilever, wherein the linear module is arranged in a first direction in an extending mode and fixed on the base plate and used for driving the cantilever to move in the first direction, and the driving piece is connected with the cantilever in a transmission mode and used for driving the cantilever to move in the second direction.
In addition, preferably, the temperature adjusting assembly is used for reducing the temperature of the product and is provided with a refrigerating station;
the refrigeration station is provided with a temperature adjusting plate, and the temperature adjusting plate is a TEC refrigeration chip.
In addition, it is preferable that a cooling fin is formed on a side surface of the temperature adjustment plate close to the base plate, and the cooling fin is configured to cool down the temperature adjustment plate.
In addition, preferably, the temperature adjusting assembly is used for increasing the temperature of the product and is provided with a preheating station and a temperature increasing station;
temperature adjusting plates are arranged at the preheating station and the heating station, and are configured to bear and heat products;
the temperature adjusting plate is a mica sheet heating plate.
Further, it is preferable that the temperature regulation plate at the warming-up station has a temperature higher than that at the preheating station.
In addition, preferably, the material moving mechanism further comprises a guide rail assembly;
the guide rail assembly comprises a first guide rail arranged along a first direction and a second guide rail arranged along a second direction, the first guide rail is fixed on the linear module, the second guide rail and the driving piece are arranged on the first guide rail through a first sliding block, and the cantilever is arranged on the second guide rail through a second sliding block;
the cantilever is configured to be movable along the extending direction of the first guide rail under the driving of the linear module and along the extending direction of the second guide rail under the driving of the driving piece.
In addition, it is preferable that the number of the suspension arms is two, and the two suspension arms are respectively configured on the second slider through a stepping motor;
the stepper motor is configured to adjust a spacing of the two cantilevers in a first direction;
two the cantilever can snatch the product on temperature regulation subassembly and the test assembly simultaneously to move backward in the same direction and move a station, carry the product on the temperature regulation subassembly to the test assembly, carry the unloading with original product on the test assembly.
Furthermore, it is preferable that the two cantilevers are a first cantilever and a second cantilever, respectively;
the first cantilever is in a shape of a 'L', the second cantilever is in a shape of a 'L', and the first cantilever is positioned on one side of the second cantilever, which is far away from the test component.
In addition, the preferred scheme is that the test component comprises a test tool and a pressure head correspondingly matched with the test tool, and one side, away from the test tool, of the pressure head is provided with a TEC cooling fin.
In addition, preferably, the semiconductor chip testing device further comprises a box body, and the temperature adjusting assembly, the testing assembly and the material moving mechanism are all located in the box body;
the feed inlet and the discharge outlet of the box body are provided with gates which can be opened and closed and are used for the product to enter and exit.
The beneficial effects of the utility model are as follows:
to solve the technical problem in the prior art, the embodiment of the application provides a semiconductor chip testing device, which is used for high-temperature/low-temperature testing of a semiconductor chip, can ensure that the semiconductor chip is rapidly cooled/heated, has good tightness and keeps good temperature uniformity during testing. The mica plate heating plate/TEC refrigerating chip is arranged to heat or cool the product, so that the environment is fully utilized to adjust the temperature, the cost is saved, and the working efficiency is improved. Still be equipped with pressure disk mechanism simultaneously, make charging tray and temperature regulation board's contact more abundant, promoted product temperature homogeneity. Furthermore, the utility model discloses a move material mechanism and dispose each other through sharp module and driving piece and realize the cantilever whole at X axle and the ascending motion of Z axle side, the interval between two cantilevers is adjustable simultaneously, has both saved operating space and reasonable evaded the interference between moving material mechanism and the test component again.
Drawings
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of a semiconductor chip testing apparatus according to a first embodiment.
Fig. 2 is a schematic structural diagram of a semiconductor chip testing apparatus according to a second embodiment.
Fig. 3 shows a schematic structural diagram of a refrigeration station of a temperature regulation assembly provided by the first embodiment.
FIG. 4 is a schematic structural diagram of a preheating station or a heating station of a temperature adjustment assembly according to a second embodiment
Fig. 5 shows a schematic structural diagram of the material moving mechanism provided by the embodiment of the present invention.
Fig. 6 shows a schematic structural diagram of a test assembly according to an embodiment of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
In the description of the present invention, unless otherwise explicitly specified or limited, the terms "connected", "connected" and "fixed" are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are used based on the orientations and positional relationships shown in the drawings, and are only for convenience of description and simplification of operation, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.
In order to overcome the defects existing in the prior art, the embodiment of the utility model provides a semiconductor chip testing device, it is shown in combination with fig. 1-6, semiconductor chip testing device includes base plate 1 and is located temperature regulation subassembly 2, test component 3 and material moving mechanism 4 on the base plate 1. Temperature regulation subassembly 2 includes through backup pad 21, erects in temperature regulation board on the base plate 1, temperature regulation board is used for bearing the charging tray that is equipped with the product, and can make the product cooling or heat up, moves material mechanism 4 and then is used for carrying the charging tray that is equipped with the product, the charging tray that will be equipped with the product is carried to temperature regulation subassembly 2 by material loading department, after temperature regulation subassembly 2 is the required temperature of test with product temperature regulation, move material mechanism 4 and will be equipped with the charging tray of product and carry to test component 3 by temperature regulation subassembly 2 and test, after the test was accomplished, move material mechanism 4 and carry the charging tray that is equipped with the product to next process.
In the first embodiment, referring to fig. 1, the semiconductor chip testing apparatus is specifically a semiconductor chip low-temperature testing apparatus, and the temperature adjustment assembly 2 is used for reducing the temperature of the product to the temperature required for low-temperature testing, and then the testing assembly 3 performs testing. For example, the temperature required for the low temperature test in this embodiment is-5 deg.C, the temperature regulating assembly 2 is used to lower the temperature of the product to-5 deg.C. Temperature regulation subassembly 2 is provided with a refrigeration station C, temperature regulation board sets up in refrigeration station C department, erects through backup pad 21 on the base plate 1. The temperature adjusting plate is a TEC refrigeration chip 221, a TEC air cooling technology is adopted for cooling the product, the environment can be fully utilized for heat dissipation, the cost can be effectively saved, and the cooling efficiency is improved. Compared with a cooling machine adopted in the prior art, the cooling machine has the advantages of simple structure, lower cost, no risk of leakage of the refrigerant liquid and higher safety performance. In this embodiment, temperature regulation subassembly 2 is provided with a refrigeration station, in other embodiments, the quantity of refrigeration station can be a plurality of, and concrete quantity can be adjusted according to the test demand, this the utility model discloses do not do the restriction.
In this embodiment, as shown in fig. 3, a heat dissipation fin 23 is disposed on a side surface of the TEC refrigeration chip 221 close to the substrate 1, and the heat dissipation fin 23 is configured to cool down and dissipate heat of the TEC refrigeration chip 221, so as to improve a cooling performance of the TEC refrigeration chip 221. The TEC refrigeration chip 221 is erected on the substrate 1 by the supporting plate 21 and is not in contact with the substrate 1, so that temperature conduction between the TEC refrigeration chip 221 and the substrate 1 is avoided, the cooling effect of the TEC refrigeration chip 221 is achieved, meanwhile, the TEC refrigeration chip 221 can dissipate heat better, and the cooling performance is improved.
In a second embodiment, as shown in fig. 2, the semiconductor chip testing apparatus is specifically a semiconductor chip high temperature testing apparatus, the temperature adjusting assembly 2 is configured to raise the temperature of a product to a temperature required by high temperature detection and detect the product, the temperature adjusting assembly 2 includes a preheating station a and a temperature raising station B, which are disposed on the substrate 1 along a first direction, the preheating station a is configured to preheat the product, and the temperature raising station B is configured to heat the product to a temperature required by testing, and then the testing assembly 3 performs testing. In this embodiment, the temperature required for the high temperature detection is 55 ℃, and the temperature adjusting assembly 2 needs to raise the temperature of the product to 55 ℃. And directly and once only heating the product to 55 ℃ may cause product damage because the temperature rises suddenly, the embodiment sets the preheating station A and the warming station B, the product is warmed step by step, the product is preheated through the preheating station A, and then the product is heated to the temperature required by high temperature detection through the warming station B, so that the product can be effectively protected. Temperature regulation subassembly 2 preheats and heaies up the product respectively including two stations in this embodiment, in other embodiments, 2 departments of temperature regulation subassembly are used for still can be for one or more to the station of product heating, and specific quantity can design according to the test demand, the utility model discloses do not do the restriction.
In this embodiment, as shown in fig. 2 and 4, temperature adjusting plates are disposed at the preheating station a and the warming station B, and the temperature adjusting plates are mica sheet heating plates 222, which heat the product through heating wires and a high temperature resistant motor. The mica sheet heating plate 222 is erected on the substrate 1 by the support plate 21 and is not in contact with the substrate 1, so that the heating effect of the mica sheet heating plate is prevented from being influenced by temperature conduction between the mica sheet heating plate 222 and the substrate 1.
Preferably, the temperature of the temperature adjusting plate of the warming-up station B is higher than that of the temperature adjusting plate of the preheating station a. Preheating station A is used for preheating the product, intensification station B is used for heating the product to the required temperature of test, preheating station A and intensification station B can simultaneous working, heat the product that is in different heating state, the product that needs the heating is put in preheating station A department earlier, treat to preheat the back, carry the product that will preheat to intensification station B department by moving material mechanism 4, place the new charging tray that is equipped with the product in preheating station A department and preheat simultaneously, preheating station A and intensification station B simultaneous working can effectively save the required time of product intensification, and improve work efficiency, and can avoid the product temperature to rise suddenly and lead to the product to damage.
In a specific embodiment, the temperature adjusting plate is used for bearing a material tray filled with products and heating or cooling the products, and in order to ensure the uniformity of the temperature of the products, as shown in fig. 3 and 4, a pressure plate mechanism is configured on the temperature adjusting plate and can enable the material tray filled with the products to be tightly attached to the temperature adjusting plate, so that the temperature adjusting plate can uniformly adjust the temperature of the products. The pressure plate mechanism comprises a first buckling piece and a second buckling piece which are positioned on two opposite side sides of the temperature adjusting plate, the first buckling piece and the second buckling piece are matched with each other to tightly press a material tray filled with a product on the temperature adjusting plate, so that the temperature adjusting plate is tightly attached to the material tray filled with the product.
In this embodiment, as shown in fig. 3 and 4, the first pressing member is located at the front end of the temperature adjustment plate, and includes a first supporting block 51 and a first pressing block 52 rotatably connected to the first supporting block 51, the first pressing block 52 is driven by a first air cylinder (not shown), when the tray with the product is placed on the temperature adjustment plate, the first air cylinder drives the first pressing block 52 to rotate relative to the first supporting block 51, and the first pressing block 52 is changed from the loose state to the buckled state, and when the temperature of the product reaches a set value, the first air cylinder drives the first pressing block 52 to rotate relative to the first supporting block 51, and the first pressing block 52 is changed from the buckled state to the loose state, so that the tray with the product can be conveniently taken away. The second buckling piece is located at the tail end of the temperature adjusting plate and is arranged opposite to the first buckling piece and comprises a second supporting block 61 and a second pressing block 62 rotatably connected with the second supporting block 61, the second pressing block 62 is driven by a second air cylinder 63, when a material tray filled with products is placed on the temperature adjusting plate, the second air cylinder 63 drives the second pressing block 62 to rotate relative to the second supporting block 61, the loosening state is changed into the buckling state, the tail end of the material tray filled with the products is pressed, when the temperature of the products reaches a set value, the second air cylinder 63 drives the second pressing block 62 to rotate relative to the second supporting block 61, the buckling state is changed into the loosening state, and the material tray filled with the products is convenient to take away. The first buckling and pressing piece and the second buckling and pressing piece are loosened or buckled at the same time to fix the front end and the rear end of the material tray filled with the product, so that the material tray filled with the product is tightly attached to the temperature adjusting plate, and the uniformity of the temperature is ensured.
In a specific embodiment, as shown in fig. 3 to 4, the platen mechanism further includes a first sensor 7, the first sensor 7 is located on the second pressing member, and the first sensor 7 is a temperature sensor for detecting whether the temperature of the product on the temperature adjustment plate reaches a set value. After the charging tray that pressure disk mechanism will be equipped with the product compresses tightly on temperature regulation board, the temperature of first sensor 7 and charging tray contact and charging tray to is monitored, and when the temperature of the charging tray that is equipped with the product reached the setting value, first sensor 7 gave the feedback, and pressure disk mechanism resets, and first briquetting 52 and second briquetting 62 change into the unclamping state by the withholding state promptly, make things convenient for taking off of charging tray.
In one embodiment, the temperature adjusting plate is further provided with a second sensor 8, the second sensor 8 is used for detecting whether a material tray is arranged on the temperature adjusting plate or not, if the material tray is arranged, feedback is given, the first cylinder and the second cylinder of the pressure plate mechanism act, the first pressing block 52 and the second pressing block 62 are changed from a loose state to a buckling state and are in contact with the upper surface of the material tray, the material tray filled with products is tightly attached to the temperature adjusting plate, meanwhile, the temperature of the material tray is monitored by using the first sensor 7 on the pressure plate mechanism, when the temperature of the material tray filled with the products reaches a set value, the first sensor 7 gives feedback, the pressure plate mechanism resets, namely, the first pressing block 52 and the second pressing block 62 are changed from the buckling state to the loose state, and the material tray is convenient to take down.
In a specific embodiment, as shown in fig. 5, the material moving mechanism 4 is used for transporting a tray containing a product from the temperature adjustment assembly 2 to the testing assembly 3, the material moving mechanism 4 includes a driving member 41, a linear module 42, and a cantilever, the driving member 41 is a Z-axis motor, and is in transmission connection with the cantilever, and can drive the cantilever to move along a second direction, which is understood to be the Z-axis direction shown in the figure. The linear module 42 is fixed on the substrate 1 and extends along a first direction, and the linear module is driven by an X-axis motor and is used for driving the cantilever to move along the first direction, which can be understood as the X-axis direction shown in the figure.
In this embodiment, the material moving mechanism 4 further includes a guide rail assembly, the guide rail assembly includes a first guide rail 43 disposed along a first direction and a second guide rail 44 extending along a second direction, the first guide rail 43 is fixed on the linear module 42, the second guide rail 44 and the driving element 41 are disposed on the first guide rail 43 through a first slider, the suspension arm is disposed on the second guide rail 44 through a second slider, the suspension arm is configured to be capable of moving along the extending direction of the first guide rail 43 under the driving of the linear module 42 and to move along the extending direction of the second guide rail 44 under the driving of the driving element 41, so that the product can be conveyed from the temperature adjustment assembly 2 to the testing assembly 3. Specifically, the linear module 42 is a pulley assembly, and the second guide rail 44 and the driving member 41 are fixed to a point on a belt of the pulley assembly through a connecting block, and the second guide rail 44 and the driving member 41 move along the first guide rail 43 as the pulley assembly moves. Further, in order to ensure the stability of the suspension arm moving in the first direction, two first guide rails 43 are fixed on the linear module 42, the two first guide rails 43 are arranged in the second direction, and the second guide rail 44 and the driving member 41 are respectively engaged with the two first guide rails 43 through two first sliders.
In one embodiment, as shown in fig. 5, the number of the suspension arms is two, and the two suspension arms are respectively a first suspension arm 45 and a second suspension arm 46, and the first suspension arm 45 and the second suspension arm 46 are respectively configured on the second slider through a stepping motor, and the stepping motor is used for adjusting the distance between the first suspension arm 45 and the second suspension arm 46. Specifically, the first suspension 45 and the second suspension 46 are arranged on the second slider through a connecting plate 47, the first suspension 45 and the second suspension 46 as a whole can move in the first direction and the second direction, and at the same time, the relative positions of the first suspension 45 and the second suspension 46 to each other can be adjusted.
In a specific embodiment, in order to avoid interference between the cantilever and the test component 3 when the product tested by the test component 3 is transported to the blanking position for blanking, or interference between the cantilever and the device in the feeding area when the cantilever is used for feeding, the first cantilever 45 is designed to be "L" shaped, the second cantilever 46 is designed to be "L" shaped, the first cantilever 45 and the second cantilever 46 are mirror images of each other, and the first cantilever 45 is located on a side of the second cantilever 46 away from the test component 3.
In one embodiment, the ends of the first and second arms 45, 46 are each provided with suction cups for gripping a tray containing products. The first and second arms 45, 46 are capable of simultaneously grasping a product. In the first embodiment, the semiconductor chip testing apparatus is a semiconductor chip low-temperature testing apparatus, the temperature adjusting assembly 2 includes a refrigeration station C, in the working process, the first cantilever of the material moving mechanism 4 moves to the refrigeration station C to grab a material tray which has been cooled, the second cantilever 46 moves to the testing station D to grab a material tray which has been detected, the first cantilever 45 and the second cantilever 46 move backwards to a station at the same time, the first cantilever 45 transports the material tray which has been cooled to the testing station D of the testing assembly 3, the second cantilever 46 transports the material tray which has been tested to the blanking area for blanking, then the first cantilever 45 and the second cantilever 46 move to the temperature adjusting assembly 2, the testing assembly 3 tests a product at the testing station D, and in order to prevent the cantilever from interfering with the testing assembly 3, at this time, the distance between the first cantilever 45 and the second cantilever 46 is adjusted to be the minimum. In the test process, the material moving mechanism 4 supplements the material tray to the refrigerating station C, picks a new material tray filled with products at the material loading area, and places the material tray at the refrigerating station C for cooling. After the testing assembly 3 tests the product on the testing station D, the first cantilever 45 is moved to the refrigerating station C, the second cantilever 46 is moved to the testing station D, and the above operations are repeated.
When the material moving mechanism 4 is used in cooperation with the temperature adjusting assembly 2 in the second embodiment, the 2-position heating assembly of the temperature adjusting assembly in the second embodiment comprises a preheating station a and a heating station B, when in work, the first cantilever 45 of the material moving mechanism 4 moves to the heating station B to grab a tray subjected to heating, the second cantilever 46 moves to the testing station D to grab a tray subjected to detection, the first cantilever 45 and the second cantilever 46 move backwards to one station at the same time, the first cantilever 45 transports the tray subjected to heating to the testing station D of the testing assembly 3, the second cantilever 46 transports the tray subjected to testing to a blanking area for blanking, then the first cantilever 45 and the second cantilever 46 move to the temperature adjusting assembly 2, the testing assembly 3 tests a product positioned at the testing station D, and in order to prevent the cantilevers from interfering with the testing assembly 3, at this time, the distance between the first cantilever 45 and the second cantilever 46 is adjusted to be the minimum. In the testing process, the material moving mechanism 4 supplements material trays to the preheating station A and the warming station B, conveys the material trays which are preheated in the preheating station A to the warming station B, and then grabs new material trays containing products in the material loading area and places the material trays in the preheating station A for preheating. After the test assembly 3 tests the product on the test station D, the first cantilever 45 is moved to the temperature-raising station B, the second cantilever 46 is moved to the test station D, and the above operations are repeated.
In a specific embodiment, as shown in fig. 6, the testing component 3 includes a testing station D, a testing tool 31 and a pressure head 32 correspondingly and cooperatively arranged with the testing tool 31 are disposed at the testing station D, and the pressure head 32 can be adjusted in the X-axis direction, the Z-axis direction and the Y-axis direction, and can be accurately aligned with a product to be tested, so as to ensure the testing accuracy and avoid interference with the material moving mechanism 4. Preferably, a TEC air cooling structure is used on the ram 32, so that the temperature of the product can be precisely controlled during testing. Specifically, the TEC air cooling structure is embodied as a TEC heat sink 33 disposed on a side of the ram 32 away from the test fixture 31. In addition, the test assembly 3 further comprises an adapter plate 34 and a pneumatic pressure monitor 35. When testing the product, pressure head 32 pushes down and test fixture 31 merges, can form an inclosed space between pressure head 32 and the test fixture 31, atmospheric pressure detector 35 is used for monitoring the pressure in this inclosed space, guarantees that test assembly 3 can stable work.
In an embodiment, the semiconductor chip testing apparatus is a relatively closed environment, and specifically, the semiconductor chip testing apparatus further includes a box (not shown), the temperature adjusting component 2, the testing component 3, and the material moving mechanism 4 are all located in the box, and the substrate 1 is a bottom plate of the box. Wherein, the position of the box body corresponding to the feeding area and the discharging area is provided with a gate which can be opened and closed and is used for the product to enter and exit. The outlet interfaces of all components of the semiconductor chip testing device adopt a switching socket mode, so that the overall sealing performance of the semiconductor chip testing device is effectively improved, and in the embodiment, the airtight leakage rate of the semiconductor chip testing device is less than 10pa/s.
The utility model provides a semiconductor chip testing arrangement is used for semiconductor chip high temperature/low temperature test, heats or cools down the product through setting up mica sheet hot plate/TEC refrigeration chip, and the make full use of environment carries out temperature regulation, has not only practiced thrift the cost but also improved work efficiency. Meanwhile, a pressure plate mechanism is also arranged, so that the charging tray is more fully contacted with the temperature adjusting plate, the temperature uniformity of the product is improved, and the temperature uniformity reaches +/-0.5 ℃ during product testing. Furthermore, the utility model discloses a move material mechanism dispose each other through sharp module and driving piece and realize the cantilever whole at X axle and the ascending motion of Z axle side, the interval between two cantilevers is adjustable simultaneously, has both saved operating space and reasonable evaded the interference of moving between material mechanism and the test component again.
It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and that other variations or modifications of different forms can be made on the basis of the above description for those skilled in the art, and all the embodiments cannot be exhausted here, and all the obvious variations or modifications led out by the technical solutions of the present invention are still in the scope of the present invention.
Claims (10)
1. The semiconductor chip testing device is characterized by comprising a substrate, a temperature adjusting assembly, a testing assembly and a material moving mechanism, wherein the temperature adjusting assembly, the testing assembly and the material moving mechanism are positioned on the substrate;
the temperature adjusting assembly comprises a temperature adjusting plate arranged on the substrate through a supporting plate frame, and a first buckling piece and a second buckling piece which are arranged on two opposite sides of the temperature adjusting plate;
the temperature adjusting plate can cool or heat the product;
the first and second crimping pieces are configured to cooperate with each other to enable the product to be tightly attached to the temperature regulation plate;
the material moving mechanism is used for carrying a product to the testing assembly through the temperature adjusting assembly and comprises a driving piece, a linear module and a cantilever, wherein the linear module is arranged in a first direction in an extending mode and fixed on the base plate and used for driving the cantilever to move in the first direction, and the driving piece is connected with the cantilever in a transmission mode and used for driving the cantilever to move in the second direction.
2. The semiconductor chip testing apparatus according to claim 1, wherein the temperature adjusting assembly is used for lowering the temperature of the product, and is provided with a refrigerating station;
the refrigeration station is provided with a temperature adjusting plate, and the temperature adjusting plate is a TEC refrigeration chip.
3. The semiconductor chip testing apparatus according to claim 2, wherein a side surface of the temperature adjustment plate adjacent to the substrate is formed with a heat sink configured to cool the temperature adjustment plate.
4. The semiconductor chip testing apparatus according to claim 1, wherein the temperature adjusting assembly is configured to raise a temperature of the product, and is provided with a preheating station and a temperature raising station;
temperature adjusting plates are arranged at the preheating station and the heating station, and are configured to bear and heat products;
the temperature adjusting plate is a mica sheet heating plate.
5. The semiconductor chip testing apparatus according to claim 4, wherein a temperature of the temperature adjusting plate at the warming-up station is higher than a temperature of the temperature adjusting plate at the preheating station.
6. The semiconductor chip testing apparatus of claim 1, wherein the material moving mechanism further comprises a guide rail assembly;
the guide rail assembly comprises a first guide rail arranged along a first direction and a second guide rail arranged along a second direction, the first guide rail is fixed on the linear module, the second guide rail and the driving piece are configured on the first guide rail through a first sliding block, and the cantilever is configured on the second guide rail through a second sliding block;
the cantilever is configured to be movable along the extending direction of the first guide rail under the driving of the linear module and along the extending direction of the second guide rail under the driving of the driving piece.
7. The semiconductor chip testing apparatus according to claim 6, wherein the number of the suspension arms is two, and the two suspension arms are respectively disposed on the second slider by a stepping motor;
the stepper motor is configured to adjust a spacing of the two cantilevers in a first direction;
two the cantilever can snatch the product on temperature regulation subassembly and the test assembly simultaneously to move backward in the same direction and move a station, carry the product on the temperature regulation subassembly to the test assembly, carry the unloading with original product on the test assembly.
8. The semiconductor chip testing apparatus according to claim 7, wherein the two cantilevers are a first cantilever and a second cantilever, respectively;
the first cantilever is in a shape of a 'L', the second cantilever is in a shape of a 'L', and the first cantilever is positioned on one side of the second cantilever, which is far away from the test component.
9. The semiconductor chip testing device of claim 1, wherein the testing component comprises a testing tool and a pressing head correspondingly matched with the testing tool, and one side of the pressing head, which is far away from the testing tool, is provided with a TEC heat sink.
10. The semiconductor chip testing device according to claim 1, further comprising a case, wherein the temperature adjusting assembly, the testing assembly and the material moving mechanism are located in the case;
the feed inlet and the discharge outlet of the box body are provided with gates which can be opened and closed and are used for the product to enter and exit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221973277.9U CN218445816U (en) | 2022-07-28 | 2022-07-28 | Semiconductor chip testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN117538735A (en) * | 2024-01-09 | 2024-02-09 | 无锡昌鼎电子有限公司 | Linear high-temperature high-pressure testing machine |
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