CN117538735A - Linear high-temperature high-pressure testing machine - Google Patents
Linear high-temperature high-pressure testing machine Download PDFInfo
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- CN117538735A CN117538735A CN202410026321.2A CN202410026321A CN117538735A CN 117538735 A CN117538735 A CN 117538735A CN 202410026321 A CN202410026321 A CN 202410026321A CN 117538735 A CN117538735 A CN 117538735A
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- 238000012360 testing method Methods 0.000 title claims abstract description 56
- 230000007246 mechanism Effects 0.000 claims abstract description 150
- 239000000463 material Substances 0.000 claims abstract description 71
- 238000010438 heat treatment Methods 0.000 claims abstract description 62
- 238000000034 method Methods 0.000 claims abstract description 12
- 230000008569 process Effects 0.000 claims abstract description 10
- 230000000149 penetrating effect Effects 0.000 claims description 15
- 238000005259 measurement Methods 0.000 claims description 11
- 238000007599 discharging Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 abstract description 10
- 238000012545 processing Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 22
- 229910052757 nitrogen Inorganic materials 0.000 description 11
- 238000010586 diagram Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000003405 preventing effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2881—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to environmental aspects other than temperature, e.g. humidity or vibrations
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- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to the technical field of semiconductor product processing, and particularly provides a linear high-temperature high-pressure testing machine which comprises a machine body, wherein a workbench is arranged at the upper end of the machine body; the upper end of the workbench is provided with a support, the upper end of the support is provided with a first linear guide rail, a linear motor is slidably matched with the first linear guide rail, the linear motor is provided with a first material moving mechanism and a second material moving mechanism, and the second material moving mechanism is provided with a heating module; the workbench is also provided with a feeding mechanism, a preheating mechanism, a high-voltage testing mechanism and a receiving mechanism; according to the invention, the chip product can be preheated through the preheating mechanism, so that the chip product is quickly heated in the subsequent high-temperature test process, and the heating efficiency is improved; through setting up heating module, the chip product is preheated the back and is removed the pay-off by the second and move material mechanism, can keep heating chip product at pay-off in-process heating module, keeps with the temperature of even chip product, improves the preheating effect of chip product.
Description
Technical Field
The invention relates to the technical field of semiconductor product processing, in particular to a linear high-temperature high-pressure testing machine.
Background
In the integrated circuit manufacturing process, the performance of chip products including SMA/B/C products is required to be tested and sorted; in order to ensure that the chip used in a high-temperature environment can normally operate, the chip needs to be subjected to high-temperature pressure measurement and sorting.
In the prior art, a heating device is generally used for directly applying high temperature to a chip product to be tested so as to test the performance of the chip product under high pressure, but the chip product needs to be continuously heated for a long time to reach a high temperature state, so that the temperature rising speed is low, and the testing efficiency is greatly influenced; in addition, the heating device is used for heating the chip, the problems of high external temperature and low internal temperature exist in the heating process, the whole temperature of the chip product is not uniform, and the chip used in the high-temperature environment is continuously in a uniform high-temperature state, so that the test effect can be influenced.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide a linear high-temperature high-pressure tester for solving the problems of slow heating rate and uneven heating of a chip heated by a heating device in the prior art.
To achieve the above and other related objects, the present invention provides a linear high temperature and high pressure tester, comprising a machine body, wherein a workbench is arranged at the upper end of the machine body;
the upper end of the workbench is provided with a support, the upper end of the support is provided with a first linear guide rail, and the first linear guide rail is provided with a first material moving mechanism and a second material moving mechanism;
the workbench is provided with:
the feeding mechanism is used for feeding chip products;
the preheating mechanism is used for preheating the chip product;
the high-voltage testing mechanism is used for carrying out high-voltage electrifying test on the chip product;
the receiving mechanism is used for outputting the tested chip products;
the feeding mechanism, the preheating mechanism, the high-pressure testing mechanism and the discharging mechanism are respectively and sequentially distributed on one side, close to the first linear guide rail, of the first material moving mechanism can be in reciprocating movable fit between the feeding mechanism and the preheating mechanism, and the second material moving mechanism can be in reciprocating movable fit between the preheating mechanism, the high-pressure testing mechanism and the material receiving mechanism;
and the second material moving mechanism is provided with a heating module which is used for continuously heating the chip product in the material moving process between the preheating mechanism and the high-voltage testing mechanism so as to maintain the temperature of the chip product.
In an embodiment of the invention, a vibration disc is further assembled on the workbench, a feeding track extending spirally from bottom to top is arranged on the side wall of the vibration disc, the upper end of the feeding track is connected with a direct vibration feeder, and the output end of the direct vibration feeder is connected with a feeding mechanism.
In an embodiment of the invention, the feeding mechanism includes:
a vertical frame;
the lower end of the vertical frame is provided with an air cylinder, the upper end of the vertical frame is provided with an air floatation seat, and the output end of the direct vibration feeder is connected to the air floatation seat;
the output end of the air cylinder is provided with a movable joint, a thimble is arranged through the movable joint, and the output end of the thimble is movably matched in the air floatation seat.
In an embodiment of the invention, the air floating seat is provided with a cavity, the upper end of the air floating seat is provided with an air port, and the chip product is arranged on the air port, so that the chip product is kept in a floating state; the side end of the air floatation seat is provided with a connector which is connected with an air source.
In an embodiment of the present invention, a fixing seat is disposed at a side end of the stand, a linear bearing is assembled in the fixing seat, and the movable joint is movably matched in the linear bearing.
In an embodiment of the invention, the preheating mechanism includes:
the second linear guide rail is arranged at the lower end of the support in a penetrating manner and vertically crosses the first linear guide rail space;
an electric cylinder is assembled at one end of the second linear guide rail, a lead screw is connected to the output end of the electric cylinder, and the lead screw penetrates through the second linear guide rail;
a movable sliding seat is matched on the second linear guide rail and is engaged and connected on the screw rod in a penetrating way;
the upper end of the sliding seat is provided with a first temperature controller, a first thermocouple, a first heating rod and a high Wen, the first thermocouple is electrically connected with the first temperature controller, the first heating rod is connected in the first thermocouple in a penetrating way, and the high Wen is arranged at the upper end of the first thermocouple and is heated by the first heating rod to generate high temperature;
the Gao Wen is provided with a plurality of slots for placing chip products.
In one embodiment of the present invention, the high voltage testing mechanism comprises:
a support base;
the upper end of the supporting seat is provided with a second thermocouple, a second heating rod and a hot air nozzle, the second heating rod is connected in the second thermocouple in a penetrating way, and the hot air nozzle is connected to the second thermocouple;
a measurement and control area is further arranged at the upper end of the supporting seat, and the output end of the hot blast nozzle corresponds to the measurement and control area;
a terminal block is assembled at the lower end of the supporting seat, and high-voltage power is supplied to the measurement and control area through the terminal block;
the lower end of the supporting seat is also provided with a second temperature controller, and the second thermocouple is electrically connected with the second temperature controller.
In an embodiment of the present invention, the material receiving mechanism includes an OK bin and an NG bin, and is configured to receive the tested qualified chip product and the tested unqualified chip product respectively.
In an embodiment of the present invention, the first material moving mechanism and the second material moving mechanism each include:
a linear motor;
the connecting plate is arranged on the linear motor;
a rotating motor is assembled on the connecting plate, an eccentric wheel is sleeved on the output end of the rotating motor, a lifting plate is connected to the eccentric wheel, a floating seat is connected to the lifting plate through a spring, a pneumatic suction head is arranged on the floating seat, and the upper end of the pneumatic suction head is connected with an air source;
the lifting plate is driven to move up and down by eccentric rotation of the eccentric wheel.
In an embodiment of the invention, the heating module comprises a third thermocouple, a third heating rod and a third temperature controller, wherein the third thermocouple is assembled on the floating seat of the second material moving mechanism, and the third heating rod is connected in the third thermocouple in a penetrating way; the third temperature controller is assembled on the connecting plate of the second material moving mechanism, and the third thermocouple is electrically connected with the third temperature controller.
As described above, the linear high-temperature high-pressure testing machine has the following beneficial effects:
according to the invention, the chip product can be preheated through the preheating mechanism, so that the chip product can be quickly heated in the subsequent high-temperature test process, and the heating efficiency is improved; the heating module is arranged on the second material moving mechanism, and the chip products are moved and fed by the second material moving mechanism after being preheated, so that the heating module can continuously heat the chip products in the feeding process, keep and even the temperature of the chip products, and improve the preheating effect of the chip products; the chip product is sent to a high-voltage testing mechanism after being preheated, and the high-voltage testing performance of the chip product at high temperature can be tested by carrying out high-temperature heating and high-voltage electrifying on the chip product, so that the testing effect on the chip product is improved; in addition, the temperature controllers are arranged in the preheating mechanism, the heating module and the high-voltage testing mechanism, so that the whole-course temperature control tracking can be realized, the accuracy of chip product testing is ensured, and the testing effect on the chip product is further improved.
Drawings
Fig. 1 is a schematic structural view of a linear high-temperature and high-pressure tester according to the present disclosure.
Fig. 2 is a schematic view of the structure of fig. 1 with the body removed.
Fig. 3 is a schematic diagram showing an enlarged structure of a feeding mechanism of the linear high-temperature high-pressure testing machine and a vibrating plate.
Fig. 4 is a schematic diagram showing a partially exploded structure of a first material moving mechanism of the linear high-temperature and high-pressure tester according to the present invention.
Fig. 5 is a schematic diagram showing a partially exploded structure of a second material moving mechanism of the linear high-temperature and high-pressure tester according to the present invention.
Fig. 6 is a schematic diagram showing a partially exploded structure of a loading mechanism of the linear high-temperature and high-pressure tester according to the present invention.
Fig. 7 is a schematic structural view of a preheating mechanism of the linear high-temperature and high-pressure testing machine matched with a nitrogen protection cover.
FIG. 8 is a schematic view showing the preheating mechanism and the nitrogen protection cap in FIG. 7 separated
Fig. 9 is a partially exploded view of a preheating mechanism of the linear high-temperature and high-pressure tester according to the present invention.
Fig. 10 is an enlarged schematic view of a high-voltage testing mechanism of the linear high-temperature high-voltage testing machine according to the present invention.
Description of element reference numerals
A machine body 1; a work table 2; a support 3; a first linear guide 4; a linear motor 5; a first material moving mechanism 6; a second material moving mechanism 7; a heating module 8; a third thermocouple 81; a third heating rod 82; a third temperature controller 83; a feeding mechanism 9; a stand 91; a cylinder 92; an air floating seat 93; a union 94; thimble 95; a fixing base 96; a linear bearing 97; a preheating mechanism 10; a second linear guide 101; an electric cylinder 102; a screw 103; a slider 104; a first thermostat 105; a first thermocouple 106; a first heating rod 107; a high temperature seat 108; a high-voltage test mechanism 11; a support base 111; a second thermocouple 112; a second heating rod 113; a hot blast nozzle 114; a measurement and control region 115; a terminal block 116; a second thermostat 117; a receiving mechanism 12; OK box 121; NG bin 122; a vibration plate 13; a loading rail 14; a direct vibration feeder 15; a connection plate 16; a rotating electric machine 17; a lifting plate 18; a spring 19; a floating seat 20; a pneumatic suction head 21; an eccentric 22; a negative pressure gauge 23; a nitrogen shield 24.
Detailed Description
Further advantages and effects of the present invention will become apparent to those skilled in the art from the disclosure of the present invention, which is described by the following specific examples.
Please refer to fig. 1 to 10. It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the invention to the extent that it can be practiced, since modifications, changes in the proportions, or otherwise, used in the practice of the invention, are not intended to be critical to the essential characteristics of the invention, but are intended to fall within the spirit and scope of the invention. Also, the terms such as "upper," "lower," "left," "right," "middle," and "a" and the like recited in the present specification are merely for descriptive purposes and are not intended to limit the scope of the invention, but are intended to provide relative positional changes or modifications without materially altering the technical context in which the invention may be practiced.
Referring to fig. 1-3, the embodiment provides a linear high-temperature high-pressure tester, which comprises a machine body 1, wherein a workbench 2 is arranged at the upper end of the machine body 1; the upper end of the workbench 2 is provided with a support 3, the upper end of the support 3 is provided with a first linear guide rail 4, the first linear guide rail 4 is provided with a first material moving mechanism 6 and a second material moving mechanism 7, and the second material moving mechanism 7 is provided with a heating module 8; the workbench 2 is provided with a feeding mechanism 9, a preheating mechanism 10, a high-voltage testing mechanism 11 and a receiving mechanism 12, the workbench 2 is also provided with a vibration disc 13, the side wall of the vibration disc 13 is provided with a feeding track 14 extending spirally from bottom to top, the upper end of the feeding track 14 is connected with a direct vibration feeder 15, and the output end of the direct vibration feeder 15 is connected with the feeding mechanism 9; the chip products are placed in the vibrating plate 13 in batches, the vibrating plate 13 vibrates, and the chip products are continuously fed to the feeding mechanism 9 along the feeding track 14 extending spirally; the feeding mechanism 9 is used for feeding chip products; the preheating mechanism 10 is used for preheating the chip product; the high-voltage testing mechanism 11 is used for carrying out high-voltage power-on test on the chip product; the receiving mechanism 12 is used for outputting the tested chip products; the feeding mechanism 9, the preheating mechanism 10, the high-voltage testing mechanism 11 and the discharging mechanism 12 are respectively and sequentially distributed at one side close to the first linear guide rail 4, the first material moving mechanism 6 can be in reciprocating movable fit between the feeding mechanism 9 and the preheating mechanism 10, and the second material moving mechanism 7 can be in reciprocating movable fit between the preheating mechanism 10, the high-voltage testing mechanism 11 and the receiving mechanism 12; the heating module 8 arranged on the second material moving mechanism 7 is used for continuously heating the chip product in the material moving process between the preheating mechanism 10 and the high-voltage testing mechanism so as to keep the temperature of the chip product.
Referring to fig. 6, the feeding mechanism 9 includes: the vertical frame 91, the lower end of the vertical frame 91 is provided with an air cylinder 92, the upper end is provided with an air floating seat 93, and the output end of the direct vibration feeder 15 is connected to the air floating seat 93; the air floating seat 93 is provided with a cavity, the upper end of the air floating seat is provided with an air port, and a chip product is arranged on the air port, so that the chip product is kept in a floating state; the side end of the air floatation seat 93 is provided with a connector which is connected with an air source; the output end of the cylinder 92 is provided with a movable joint 94, the movable joint 94 is also called union or union, is a common pipeline connecting piece which can be conveniently installed and detached, and mainly comprises a nut, a cloud head and a butt joint; the output end of the cylinder 93 is provided with a thimble 95 through the movable joint 94, the output end of the thimble 95 is movably matched in the air floatation seat 93, and specifically, the thimble 95 passes through the lower seat 931 to abut against the upper seat 932; a fixed seat 96 is arranged at the side end of the vertical frame 91, a linear bearing 97 is assembled in the fixed seat 96, the movable joint 94 is movably matched in the linear bearing 97, and the fixed seat 96 can fix the movable joint 94 by matching with the linear bearing 97 without influencing the up-down linear movement of the movable joint 94; the feeding mechanism 9 provides power through the air cylinder 92 to push the movable joint 94 and the ejector pin 95 to move upwards, so that the upper seat 932 of the air floating seat 93 is jacked up, and the chip products are close to the first material moving mechanism 6, so that the material is taken out.
Referring to fig. 4-5, the first material moving mechanism 6 and the second material moving mechanism 7 each include: a linear motor 5 and a connection plate 16 provided on the linear motor 5; the connecting plate 16 is assembled on the linear motor 5; a rotating motor 17 is assembled on the connecting plate 16, a lifting plate 18 is connected to the output end of the rotating motor 17, a floating seat 20 is connected to the lifting plate 18 through a spring 19, a pneumatic suction head 21 is arranged on the floating seat 20, and the upper end of the pneumatic suction head 21 is connected with an air source; an eccentric wheel 22 is sleeved on the output end of the rotating motor 17, the lifting plate 18 is specifically assembled on the eccentric wheel 22, and the lifting plate 18 is driven to lift and move by eccentric rotation of the eccentric wheel 22; specifically, the first material moving mechanism 6 and the second material moving mechanism 7 have the same displacement principle, the eccentric wheel 22 is driven to rotate by the rotating motor 17, and due to different distances between the wheel center and the wheel edge of the eccentric wheel 22, periodic up-and-down power movement can be generated, so that the lifting plate 18 is driven to move up and down, and the material taking and discharging actions are completed by the pneumatic suction head 21.
The first linear guide rail 4 is provided with a magnetic plate, and the first material moving mechanism 6 and the second material moving mechanism 7 slide on the magnetic plate through the active cells of the respective linear motors 5 to realize movement.
The heating module 8 comprises a third thermocouple 81, a third heating rod 82 and a third temperature controller 83, wherein the third thermocouple 81 is assembled on the floating seat 20 of the second material moving mechanism 7, and the third heating rod 82 is connected in the third thermocouple 81 in a penetrating way; the third temperature controller 83 is assembled on the connecting plate 16 of the second material moving mechanism 7, and the third thermocouple 81 is electrically connected with the third temperature controller 83; the third thermocouple 81 is matched with the third heating rod 82 to heat the floating seat 20 and the pneumatic suction head 21 of the second material moving mechanism 7, so that the chip product is continuously heated in the material moving process of the second material moving mechanism 7, the temperature of the chip product is kept and uniform, and the preheating effect of the chip product is improved.
Referring to fig. 7-9, the preheating mechanism 10 includes: the second linear guide rail 101 is arranged at the lower end of the support 3 in a penetrating manner and vertically crosses the first linear guide rail 4 in a space; an electric cylinder 102 is assembled at one end of the second linear guide rail 101, a lead screw 103 is connected to the output end of the electric cylinder 102, and the lead screw 103 is arranged in the second linear guide rail 101 in a penetrating manner; a movable sliding seat 104 is matched on the second linear guide rail 101, and the sliding seat 104 is meshed and connected on the screw rod 103; the upper end of the sliding seat 104 is provided with a first temperature controller 105, a first thermocouple 106, a first heating rod 107 and a high temperature seat 108, the first thermocouple 106 is electrically connected with the first temperature controller 105, the first heating rod 107 is connected in the first thermocouple 106 in a penetrating way, and the high temperature seat 108 is arranged at the upper end of the first thermocouple 106 and is heated by the first heating rod 107 to generate high temperature; the high temperature seat 108 is provided with a plurality of slots for placing chip products; the first material moving mechanism 6 is sent to a high-temperature seat 108 of the preheating mechanism 10 after taking materials from the feeding mechanism 9, and the first thermocouple 106 and the first heating rod 107 are matched to heat the high-temperature seat 108 so as to preheat a chip product arranged on the high-temperature seat 108; because the high-temperature seat 108 is provided with a plurality of slots, a plurality of chip products can be preheated at one time, and the preheating efficiency of the chip products is greatly improved; for discharging conveniently, the preheating mechanism 10 drives the screw rod 103 to rotate through the electric cylinder 102, and the sliding seat 104 meshed with and connected with the screw rod 103 moves along the second linear guide rail 101 so as to sequentially discharge on the high-temperature seat 108.
The preheating mechanism is matched with a nitrogen protection cover 24, an opening is arranged at the upper end of the nitrogen protection cover 24, and a slot of the high-temperature seat 108 is movably corresponding to the opening so as to facilitate the discharging and taking of chip products; the upper end of the nitrogen protection cover 24 is also connected with a nitrogen connector and is connected with a nitrogen source through the nitrogen connector; after the product is placed in the preheating mechanism 10, nitrogen is filled in the nitrogen protection cover 24 to have the heating and oxidation preventing effects.
Referring to fig. 10, the high voltage testing mechanism 11 includes: the support seat 111 is provided with a second thermocouple 112, a second heating rod 113 and a hot air nozzle 114 at the upper end of the support seat 111, the second heating rod 113 is connected in the second thermocouple 112 in a penetrating way, and the hot air nozzle 114 is connected to the second thermocouple 112; a measurement and control area 115 is further arranged at the upper end of the supporting seat 111, and the output end of the hot blast nozzle 114 corresponds to the measurement and control area 115; a terminal block 116 is arranged at the lower end of the supporting seat 111, and the terminal block 116 supplies power to the measurement and control area 115 at high voltage; a second temperature controller 117 is also arranged at the lower end of the supporting seat 111, and a second thermocouple 112 is electrically connected with the second temperature controller 117; the second material moving mechanism 7 sucks preheated chip products from the preheating mechanism 10 and moves the preheated chip products to the measurement and control area 115 of the high-voltage testing mechanism 11, and the heating module 8 can continuously heat the chip products in the material moving process, so that the temperature of the chip products is kept and uniform; the second thermocouple 112 of the high-voltage testing mechanism 11 is heated in cooperation with the second heating rod 113 and applies high temperature to the chip product through the hot blast nozzle 114, and the terminal block 116 applies high voltage to the chip product to test the high-voltage testing performance of the chip product at the high temperature.
The material receiving mechanism 12 comprises an OK material box 121 and an NG material box 122, and is used for receiving the qualified chip products and the unqualified chip products after the test respectively; specifically, the tested chip products are transferred to the receiving mechanism 12 through the second transferring mechanism 7, the qualified products are placed in the OK material box 121, and the unqualified products are placed in the NG material box 122.
In embodiment 2, based on embodiment 1, the first material moving mechanism 6 and the second material moving mechanism 7 are both provided with a negative pressure meter 23 for detecting a negative pressure value during material suction, so as to ensure reliability of material taking.
In summary, the preheating mechanism 10 of the invention can preheat the chip product, so that the chip product can be quickly heated in the subsequent high-temperature test process, and the heating efficiency is improved; the heating module 8 is arranged on the second material moving mechanism 7, and after the chip products are preheated, the chip products are moved and fed by the second material moving mechanism 7, and the heating module 8 can continuously heat the chip products in the feeding process, so that the temperature of the chip products is kept and uniform, and the preheating effect of the chip products is improved; the chip products are sent to the high-voltage testing mechanism 11 after being preheated, and the high-voltage testing performance of the chip products at high temperature can be tested by carrying out high-temperature heating and high-voltage electrifying on the chip products, so that the testing effect on the chip products is improved; in addition, the temperature controllers are arranged in the preheating mechanism 10, the heating module 8 and the high-voltage testing mechanism 11, so that the whole-course temperature control tracking can be realized, the accuracy of chip product testing is ensured, and the testing effect on chip products is further improved. Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (10)
1. A linear high-temperature high-pressure testing machine comprises a machine body, wherein a workbench is arranged at the upper end of the machine body;
the method is characterized in that: the upper end of the workbench is provided with a support, the upper end of the support is provided with a first linear guide rail, and the first linear guide rail is provided with a first material moving mechanism and a second material moving mechanism;
the workbench is provided with:
the feeding mechanism is used for feeding chip products;
the preheating mechanism is used for preheating the chip product;
the high-voltage testing mechanism is used for carrying out high-voltage electrifying test on the chip product;
the receiving mechanism is used for outputting the tested chip products;
the feeding mechanism, the preheating mechanism, the high-pressure testing mechanism and the discharging mechanism are respectively and sequentially distributed on one side, close to the first linear guide rail, of the first material moving mechanism can be in reciprocating movable fit between the feeding mechanism and the preheating mechanism, and the second material moving mechanism can be in reciprocating movable fit between the preheating mechanism, the high-pressure testing mechanism and the material receiving mechanism;
and the second material moving mechanism is provided with a heating module which is used for continuously heating the chip product in the material moving process between the preheating mechanism and the high-voltage testing mechanism so as to maintain the temperature of the chip product.
2. The in-line high temperature and high pressure tester according to claim 1, wherein: the workbench is also provided with a vibration disc, a feeding rail which extends spirally from bottom to top is arranged on the side wall of the vibration disc, the upper end of the feeding rail is connected with a direct vibration feeder, and the output end of the direct vibration feeder is connected with a feeding mechanism.
3. The linear high temperature and high pressure tester according to claim 2, wherein the loading mechanism comprises:
a vertical frame;
the lower end of the vertical frame is provided with an air cylinder, the upper end of the vertical frame is provided with an air floatation seat, and the output end of the direct vibration feeder is connected to the air floatation seat;
the output end of the air cylinder is provided with a movable joint, a thimble is arranged through the movable joint, and the output end of the thimble is movably matched in the air floatation seat.
4. A straight-line high-temperature high-pressure tester according to claim 3, wherein: the air floating seat is provided with a cavity, the upper end of the air floating seat is provided with an air port, and a chip product is arranged on the air port, so that the chip product is kept in a floating state; the side end of the air floatation seat is provided with a connector which is connected with an air source.
5. The linear high-temperature and high-pressure testing machine according to claim 3, wherein a fixed seat is arranged on the side end of the vertical frame, a linear bearing is assembled in the fixed seat, and the movable joint is movably matched in the linear bearing.
6. The in-line high temperature and high pressure tester according to claim 1, wherein the preheating mechanism comprises:
the second linear guide rail is arranged at the lower end of the support in a penetrating manner and vertically crosses the first linear guide rail space;
an electric cylinder is assembled at one end of the second linear guide rail, a lead screw is connected to the output end of the electric cylinder, and the lead screw penetrates through the second linear guide rail;
a movable sliding seat is matched on the second linear guide rail and is engaged and connected on the screw rod in a penetrating way;
the upper end of the sliding seat is provided with a first temperature controller, a first thermocouple, a first heating rod and a high Wen, the first thermocouple is electrically connected with the first temperature controller, the first heating rod is connected in the first thermocouple in a penetrating way, and the high Wen is arranged at the upper end of the first thermocouple and is heated by the first heating rod to generate high temperature;
the Gao Wen is provided with a plurality of slots for placing chip products.
7. The in-line high temperature and high pressure tester according to claim 1, wherein the high pressure testing mechanism comprises:
a support base;
the upper end of the supporting seat is provided with a second thermocouple, a second heating rod and a hot air nozzle, the second heating rod is connected in the second thermocouple in a penetrating way, and the hot air nozzle is connected to the second thermocouple;
a measurement and control area is further arranged at the upper end of the supporting seat, and the output end of the hot blast nozzle corresponds to the measurement and control area;
a terminal block is assembled at the lower end of the supporting seat, and high-voltage power is supplied to the measurement and control area through the terminal block;
the lower end of the supporting seat is also provided with a second temperature controller, and the second thermocouple is electrically connected with the second temperature controller.
8. The in-line high temperature and high pressure tester according to claim 1, wherein: the receiving mechanism comprises an OK material box and an NG material box and is used for receiving qualified chip products and unqualified chip products after testing respectively.
9. The in-line high temperature and high pressure tester according to claim 1, wherein: the first material moving mechanism and the second material moving mechanism both comprise:
a linear motor;
the connecting plate is arranged on the linear motor;
a rotating motor is assembled on the connecting plate, an eccentric wheel is sleeved on the output end of the rotating motor, a lifting plate is connected to the eccentric wheel, a floating seat is connected to the lifting plate through a spring, a pneumatic suction head is arranged on the floating seat, and the upper end of the pneumatic suction head is connected with an air source;
the lifting plate is driven to move up and down by eccentric rotation of the eccentric wheel.
10. The in-line high temperature and high pressure tester according to claim 9, wherein: the heating module comprises a third thermocouple, a third heating rod and a third temperature controller, the third thermocouple is assembled on the floating seat of the second material moving mechanism, and the third heating rod is connected in the third thermocouple in a penetrating way; the third temperature controller is assembled on the connecting plate of the second material moving mechanism, and the third thermocouple is electrically connected with the third temperature controller.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202410026321.2A CN117538735A (en) | 2024-01-09 | 2024-01-09 | Linear high-temperature high-pressure testing machine |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202410026321.2A CN117538735A (en) | 2024-01-09 | 2024-01-09 | Linear high-temperature high-pressure testing machine |
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| CN202410026321.2A Pending CN117538735A (en) | 2024-01-09 | 2024-01-09 | Linear high-temperature high-pressure testing machine |
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