CN218445818U

CN218445818U - Semiconductor chip test equipment

Info

Publication number: CN218445818U
Application number: CN202221992296.6U
Authority: CN
Inventors: 杨胜利; 史赛
Original assignee: Suzhou HYC Technology Co Ltd
Current assignee: Suzhou HYC Technology Co Ltd
Priority date: 2022-07-28
Filing date: 2022-07-28
Publication date: 2023-02-03
Anticipated expiration: 2032-07-28

Abstract

The embodiment of the utility model discloses a semiconductor chip testing device, which comprises a first detection unit, a second detection unit and a buffer cooling unit arranged between the first detection unit and the second detection unit; the first detection unit is configured to heat the product and detect the heated product, and comprises a heating station, a first detection assembly and a first material moving mechanism; the second detection unit is configured to cool the product and detect the cooled product, and comprises a refrigeration station, a second detection assembly and a second material moving mechanism; the cooling unit is configured to reduce the temperature difference of the product entering the second detection unit from the first detection unit and comprises a pre-cooling station and a cooling station; the first detection unit, the second detection unit and the buffering and cooling unit are independent from each other, and a gate capable of opening a product to pass through is arranged between every two adjacent units. Has the advantages of reasonable structure, good sealing performance and capability of ensuring the temperature uniformity of the product.

Description

Semiconductor chip test equipment

Technical Field

The utility model relates to a semiconductor chip tests technical field. And more particularly, to a semiconductor chip testing apparatus.

Background

When semiconductor chips are tested in batches, in order to eliminate test errors caused by temperature differences of the chips, the ambient temperature of each chip in each batch of semiconductor chips needs to be kept within a certain range during testing, and therefore a special high-low temperature incubator is needed to provide a stable temperature environment. In addition, due to the self-heating of the semiconductor chip, ventilation is required to continuously remove the heat dissipated from the semiconductor chip, so as to keep the temperature of all chips within a certain range. However, the heat dissipation method adopted in the prior art is to ventilate the semiconductor chip, and this heat dissipation method cannot guarantee the requirement of the semiconductor chip on a relatively airtight test environment during testing, and cannot meet good temperature uniformity.

SUMMERY OF THE UTILITY MODEL

In view of the above problem, an object of the present invention is to provide a semiconductor chip testing apparatus capable of testing high and low temperatures of a semiconductor chip and having good sealing performance and capable of ensuring uniformity of product temperature during testing.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

semiconductor chip test apparatus comprising:

a test area and a device area;

the equipment area comprises a test case and an air pressure source;

the test area comprises a first detection unit, a second detection unit and a buffer cooling unit arranged between the first detection unit and the second detection unit;

the first detection unit is configured to heat up products and detect the heated products, and comprises a heating station, a first detection assembly and a first material moving mechanism, wherein the first material moving mechanism is configured to convey the products at the heating station to the first detection assembly and convey the products detected and detected by the first detection assembly to the buffer cooling unit;

the second detection unit is configured to cool the products and detect the cooled products, and comprises a refrigeration station, a second detection assembly and a second material moving mechanism, wherein the second material moving mechanism is configured to convey the products cooled by the buffer cooling unit to the refrigeration station for refrigeration and convey the products refrigerated by the refrigeration station to the second detection assembly for detection;

the cooling unit is configured to reduce the temperature difference of the product entering the second detection unit from the first detection unit and comprises a pre-cooling station and a cooling station which are arranged side by side along a first direction;

the first detection unit, the second detection unit and the buffering cooling unit are independent from each other, and a gate which can be opened to allow a product to pass through is arranged between every two adjacent units.

In addition, preferably, the first detection unit comprises two heating stations arranged side by side along a first direction, namely a preheating station and a heating station;

the preheating station is provided with a first heating plate for bearing products, the heating station is provided with a second heating plate for bearing the products, and the temperature of the second heating plate is higher than that of the first heating plate.

In addition, preferably, the refrigeration station comprises a first cold plate, and a cooling fin is arranged on one side of the first cold plate, which is far away from the product placement surface.

In addition, the preferable scheme is that the first material moving mechanism and the second material moving mechanism have the same structure and respectively comprise a driving part, a linear module and a cantilever, wherein the linear module is arranged in a manner of extending along a first direction, and the linear module is used for driving the cantilever to move along the first direction, and the driving part is in transmission connection with the cantilever and is used for driving the cantilever to move along a second direction.

In addition, preferably, the cantilever is provided with two cantilevers, the relative position of the two cantilevers is adjustable, and the two cantilevers can grab and carry the product at the same time.

Furthermore, it is preferred that the pre-cooling station comprises a second cold plate for carrying the product, and the cooling station comprises a third cold plate for carrying the product, the third cold plate having a temperature lower than the temperature of the second cold plate.

Furthermore, it is preferable that the first cold plate and the second cold plate are provided with cooling fins on the sides facing away from the product bearing surface.

In addition, it is preferable that the buffer cooling unit further includes a third material moving mechanism configured to move the product on the pre-cooling station to the cooling station.

In addition, preferably, the first detection assembly and the second detection assembly are respectively communicated with the test chassis through adapter plates;

the adapter plate is hermetically arranged on the partition plate between the equipment area and the detection area.

In addition, preferably, the semiconductor chip testing equipment further comprises a feeding area positioned on one side of the first detection unit far away from the buffer cooling unit and a blanking accommodating area positioned on one side of the second detection unit far away from the buffer cooling unit;

the feeding area and the first detection unit are arranged in a separated mode, and an openable gate for a product to pass through is arranged between the feeding area and the first detection unit;

the blanking containing area and the second detection unit are arranged in a separated mode, and a gate which is used for allowing products to pass through and can be opened and closed is arranged between the blanking containing area and the second detection unit.

The beneficial effects of the utility model are as follows:

to the technical problem that exists among the prior art, this application embodiment provides a semiconductor chip test equipment, through setting up first detecting element, second detecting element and buffering cooling unit, set up material transmission structure between adjacent monomer check out test set, establish ties a plurality of monomer test equipment for the detection assembly line, first detecting element and second detecting element can survey each other simultaneously and do not influence each other and make the efficiency of product detection show and improve, first detecting element, second detecting element and buffering cooling unit all are in the environment sealed relatively, all threading interfaces all adopt the socket switching mode, whole seal is showing and is promoted, make the heat in first detecting element and the second detecting element can not run off easily. The first material moving mechanism, the second material moving mechanism and the third material moving mechanism are reasonable in structure, space can be saved, and interference is avoided.

Drawings

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.

Fig. 1 is a schematic structural diagram of a semiconductor chip testing apparatus according to an embodiment of the present invention.

Fig. 2 shows a schematic structural diagram of a test area provided by an embodiment of the present invention.

Fig. 3 shows a schematic structural diagram of a first detection unit provided in an embodiment of the present invention.

Fig. 4 shows a schematic structural diagram of a second detection unit provided in the embodiment of the present invention.

Fig. 5 shows a schematic structural diagram of a buffer cooling unit provided in an embodiment of the present invention.

Fig. 6 shows a schematic structural diagram of a heating station provided in an embodiment of the present invention.

Fig. 7 shows a schematic structural diagram of a refrigeration station provided by an embodiment of the present invention.

Fig. 8 shows a schematic structural diagram of the first material moving mechanism provided in the embodiment of the present invention.

Fig. 9 shows a schematic structural diagram of a first detection assembly provided in an embodiment of the present invention.

Fig. 10 shows a schematic structural diagram of a third material moving mechanism provided in the embodiment of the present invention.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the recitation of a first feature "on" or "under" a second feature may include the recitation of the first and second features being in direct contact, and may also include the recitation of the first and second features not being in direct contact, but being in contact with another feature between them. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are used based on the orientations and positional relationships shown in the drawings, and are only for convenience of description and simplification of operation, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only as elements in the description, and have no special meaning.

In order to overcome the defects in the prior art, embodiments of the present invention provide a semiconductor chip testing apparatus, which is shown in fig. 1-10 and includes an apparatus area 100, a testing area 200, and a compressor placing area 300. The detection area 200 is separated from the device area 100 by a first partition plate, and is separated from the compressor placement area 300 by a second partition plate, the whole semiconductor chip testing device is relatively sealed, and the requirement on the sealing performance during the semiconductor chip testing can be ensured. The equipment area 100 is located at the upper part of the semiconductor chip testing equipment, and electronic equipment such as a testing cabinet 11 and a pressure source 12 are arranged in the equipment area 100; the test area 200 is a middle area of the semiconductor test equipment and is used for transmitting products and performing compression test; the compressor placing area 300 is a bottom area of the semiconductor test apparatus, and is mainly used for placing a compressor (not shown) for providing an ambient temperature for the test area 200.

In a specific embodiment, as shown in connection with fig. 2, the test zone 200 comprises a first detection unit 2, a second detection unit 3, and a buffer cooling unit 4 located between the first detection unit 2 and the second detection unit 3. The first detection unit 2 is configured to heat up a product and detect the heated product, as shown in fig. 3, the first detection unit 2 includes a heating station, a first detection assembly 22 and a first material moving mechanism 23, and the first material moving mechanism 23 is mainly used for feeding the heating station, conveying a material tray heated by the heating station to the first detection assembly 22 for detection, and conveying a product detected by the first detection assembly 22 to the buffer cooling unit 4 for cooling.

As shown in fig. 4, the second detection unit 3 is configured to cool down products and detect the cooled products, the second detection unit 3 includes a refrigeration station 31, a second detection assembly 32 and a second material moving mechanism 33, and the second material moving mechanism 33 is mainly used for transporting the products cooled by the buffer cooling unit 4 to the refrigeration station 31 for cooling down, transporting the products cooled by the refrigeration station 31 to the second detection assembly 32 for detection, and transporting the products detected by the second detection assembly 32 to a blanking area for blanking.

As shown in fig. 5, the buffer cooling unit 4 is configured to reduce the temperature difference when the product enters the second detection unit 3 from the first detection unit 2, the buffer cooling unit 4 includes a pre-cooling station 41 and a cooling station 42 arranged in the first direction, the pre-cooling station 41 is used for pre-cooling the product, the cooling station 42 is used for cooling the product to room temperature, because the temperature of the product reaches about 55 ℃ after the high temperature detection of the first detection unit 2, the direct transportation of the product to the second detection unit 3 for low temperature detection may cause product damage due to a sudden temperature drop, and therefore, a buffer cooling unit 4 is required to be arranged between the first cooling unit 2 and the second cooling unit 3 to cool the product to room temperature. In the process that the product is cooled to the room temperature by the buffer cooling unit 4, in order to protect the product and save cost, a pre-cooling station 41 and a cooling station 42 are arranged to cool the product step by step. Specifically, the buffer cooling unit 4 further includes a third material transferring mechanism 43, which is mainly used for conveying the cooled product at the pre-cooling station 41 to the cooling station 42 for further cooling.

In one embodiment, the heating station is provided with a heating assembly, as shown in fig. 6, comprising a heating plate 52 mounted on the second partition by a support plate 51, the heating plate 52 being intended to carry and heat trays containing the products. Specifically, as shown in fig. 3, the second detection unit 2 includes two heating stations arranged side by side along the first direction, namely a preheating station 211 and a temperature-raising station 212, where the preheating station 211 is used to preheat a product, and the temperature-raising station 212 is used to heat the product to a temperature required by the test, and then the first detection assembly 22 detects the product. In this embodiment, the temperature required for the high temperature detection is 55 ℃, and the temperature of the product needs to be raised to 55 ℃ by the heating station. And the product is directly heated to 55 ℃ at one time, which may cause damage to the product due to sudden temperature rise, the preheating station 211 and the heating station 212 are arranged in the embodiment, the product is heated step by step, the product is preheated through the preheating station 211, and then the product is heated to the temperature required by high temperature detection through the heating station 212, so that the product can be effectively protected. First detecting element 2 adopts two heating stations to preheat and heat up the product respectively in this embodiment, in other embodiments, first detecting element 2 also can adopt one or be more than two heating stations to heat the product, and specific quantity can design according to the test demand, the utility model discloses do not restrict.

In this embodiment, preheat station 211 and the structure of rising temperature station 212 the same, all dispose heating element, it is provided with first hot plate to preheat station 211 department, it is provided with the second hot plate to rise temperature station 212 department, first hot plate and second hot plate all erect through backup pad 51 on the second baffle, do not contact with the second baffle, avoid the temperature conduction between hot plate 52 and the second baffle, influence the heating efficiency of hot plate 52. Specifically, the heating plate 52 is a mica sheet heating plate, and the product is heated by an electric heating wire and a high temperature resistant motor.

Preferably, the temperature of the second heating plate is higher than the temperature of the first heating plate. Preheating station 211 is used for preheating the product, intensification station 212 is used for heating the product to the required temperature of test, preheating station 211 and intensification station 212 can simultaneous working, heat the product that is in different heating state, the product that needs the heating is put in preheating station 211 earlier, treat to preheat the back, carry the product that will preheat to intensification station 212 department by first material shifting mechanism 23, place the new charging tray that is equipped with the product in preheating station 211 department simultaneously and preheat, preheating station 211 and intensification station 212 simultaneous working can effectively save the required time of product intensification, and improve work efficiency, and can avoid the product temperature to rise suddenly and lead to the product to damage.

In one embodiment, a refrigeration assembly is disposed at the refrigeration station 31, and cooling assemblies are disposed at the pre-cooling station 41 and the cooling station 42, and the refrigeration assembly and the cooling assemblies have the same structure, as shown in fig. 7, and each of the refrigeration assembly and the cooling assemblies includes a cold plate 62 erected on a second partition plate through a support plate body 61, and the cold plate 62 is configured to carry and cool a tray containing products. The cooling module adopts TEC air cooling technology to cool down the product, cold plate 62 is erect by supporting plate body 61 on the second baffle, not contact with the second baffle, avoids the temperature conduction between cold plate 62 and the second baffle, influences the cooling effect of cold plate 62, also makes the heat dissipation that cold plate 62 can be better simultaneously, improves its cooling performance.

In one embodiment, as shown in conjunction with fig. 7, a side surface of the cold plate 62 adjacent to the second partition is provided with fins 60, and the fins 60 are configured to cool the cold plate 62 to improve the cooling performance of the cold plate 62. Specifically, the cold plate 62 is a TEC refrigeration chip, and a TEC air cooling technology is adopted to refrigerate the product, so that the environment can be fully utilized to dissipate heat, the cost can be effectively saved, and the cooling efficiency can be improved. Compared with a cooling machine adopted in the prior art, the cooling machine has the advantages of simple structure, lower cost, no risk of leakage of the refrigerant liquid and higher safety performance.

In a specific embodiment, the second detection unit 3 is required to adjust the temperature of the product to-5 ℃ when performing the low temperature test, so the refrigeration station 31 is used to reduce the temperature of the product to-5 ℃. A first cold plate is arranged at the refrigeration station 31 and is erected on the second partition plate through a support plate body 61. The first cold plate adopts TEC air cooling technology to cool down the product, can make full use of environment dispel the heat, can effectively practice thrift the cost, improves cooling efficiency. Compared with the cooling machine adopted in the prior art, the cooling machine has the advantages of simple structure, lower cost, no risk of leakage of the refrigerant liquid and higher safety performance. In this embodiment, second detecting element 3 is provided with a refrigeration station 31, and in other embodiments, the quantity of refrigeration station also can be a plurality of, and specific quantity can be adjusted according to the test demand, and this the utility model discloses do not do the restriction.

In one embodiment, a second cold plate is disposed at the pre-cooling station 41, and a third cold plate is disposed at the cooling station 42, the second cold plate and the third cold plate being disposed side by side along the first direction, the third cold plate having a temperature lower than the temperature of the second cold plate but higher than the temperature of the first cold plate. The pre-cooling station 41 is used for pre-cooling the product and primarily cooling the product, the cooling station 42 is used for cooling the product to room temperature on the basis of pre-cooling, and the pre-cooling station 41 and the cooling station 42 can work simultaneously to cool the product in different cooling stages. Products to be cooled are placed in the material trays, the material trays to be filled with the products are placed on the second cold plate of the pre-cooling station 41, after pre-cooling is completed, the pre-cooled material trays filled with the products are conveyed to the third cold plate of the cooling station 42 through the third material moving mechanism 43, and meanwhile, new material trays filled with the products are placed in the pre-cooling station 41 for pre-cooling. The pre-cooling station 41 and the cooling station 42 work simultaneously, so that the cooling time of the product can be effectively saved, the working efficiency is improved, and the time required for cooling a group of products is only 90s in the embodiment.

In a specific embodiment, the heating plate 52 is used for carrying and heating a tray containing products, and the cold plate 62 is used for carrying and cooling a tray containing products, and in order to ensure uniformity of the temperature of the products, as shown in fig. 6 and 7, a platen mechanism is disposed on the heating plate 52 and the cold plate 62, and the platen mechanism can make the tray containing the products closely fit with the heating plate 52 or the cold plate 62, so that the heating plate 52 and the cold plate 62 can uniformly adjust the temperature of the products. The pressing plate mechanism comprises a first pressing piece and a second pressing piece, wherein the first pressing piece and the second pressing piece are matched with each other to press the material tray filled with the product on the heating plate 52 or the cold plate 62, so that the heating plate 52 or the cold plate 62 is tightly attached to the material tray filled with the product.

In this embodiment, as shown in fig. 6 and fig. 7, the first pressing member is located at the front end of the heating plate 52 or the cold plate 62, and includes a first supporting block 71 and a first pressing block 72 rotatably connected to the first supporting block 71, the first pressing block 72 is driven by a first air cylinder (not shown), when a tray with a product is placed on the heating plate 52 or the cold plate 62, the first air cylinder drives the first pressing block 72 to rotate relative to the first supporting block 71, and the loose state is changed into the buckled state, and when the temperature of the product reaches a set value, the first air cylinder drives the first pressing block 72 to rotate relative to the first supporting block 71, and the buckled state is changed into the loose state, so that the tray with the product can be taken away conveniently. The second buckling piece is located at the tail end of the heating plate 52 or the cold plate 62, is arranged opposite to the first buckling piece and comprises a second supporting block 81 and a second pressing block 82 rotatably connected with the second supporting block 81, the second pressing block 82 is driven by a second cylinder 83, when a material tray filled with products is placed on the heating plate 52 or the cold plate 62, the second cylinder 83 drives the second pressing block 82 to rotate relative to the second supporting block 81, the loosening state is changed into the buckling state, the tail end of the material tray filled with the products is pressed, when the temperature of the products reaches a set value, the second cylinder 83 drives the second pressing block 82 to rotate relative to the second supporting block 81, the buckling state is changed into the loosening state, and the material tray filled with the products is convenient to take away. The first buckling piece and the second buckling piece are loosened or buckled at the same time to fix the front end and the rear end of the material tray containing the product, so that the material tray containing the product is tightly attached to the temperature adjusting plate, and the uniformity of the temperature is ensured.

In one embodiment, as shown in fig. 6-7, the platen mechanism further includes a first sensor 91, the first sensor 91 is located on the second presser member, and the first sensor 91 is a temperature sensor for detecting whether the temperature of the product on the hot plate 52 or the cold plate 62 reaches a set value. After the charging tray that the pressure disk mechanism will be equipped with the product compressed tightly on hot plate 52 or cold drawing 62, first sensor 91 and charging tray contact and the temperature of the charging tray to monitor, when the temperature of the charging tray that is equipped with the product reached the setting value, first sensor 91 gave the feedback, and pressure disk mechanism resets, and first briquetting 72 and second briquetting 82 change into the state of loosening by withholding promptly, make things convenient for taking off of charging tray.

In one embodiment, the heating plate 52 and the cold plate 62 are further provided with a second sensor 92, the second sensor 92 is used for detecting whether a tray is on the heating plate 52 or the cold plate 62, if a tray is on the heating plate 52 or the cold plate 62, feedback is given, the first cylinder and the second cylinder of the pressure plate mechanism act, the first pressing block 72 and the second pressing block 82 are changed from a loose state to a buckling state and are in contact with the upper surface of the tray, so that the tray filled with products is tightly attached to the heating plate 52 or the cold plate 62, meanwhile, the temperature of the tray is monitored by using the first sensor 91 on the pressure plate mechanism, when the temperature of the tray filled with products reaches a set value, the first sensor 91 gives feedback, and the pressure plate mechanism is reset, namely, the first pressing block 72 and the second pressing block 82 are changed from the buckling state to the loose state, so that the tray is convenient to take down.

In a specific embodiment, the first material moving mechanism 23 and the second material moving mechanism 33 have the same structure, as shown in fig. 8, taking the first material moving mechanism 23 as an example for description, the first material moving mechanism 23 includes a driving member 231, a linear module 232, and a cantilever, the driving member 231 is a Z-axis motor, and is in transmission connection with the cantilever, and can drive the cantilever to move along a second direction, which is understood to be the Z-axis direction shown in the drawing. The linear module 232 is fixed to the second partition plate and extends along a first direction, and the linear module is driven by an X-axis motor and is used for driving the cantilever to move along the first direction, which can be understood as the X-axis direction shown in the figure.

In this embodiment, the first material moving mechanism 23 further includes a first guide rail assembly, the first guide rail assembly includes a first guide rail 233 disposed along a first direction and a second guide rail 234 disposed to extend along a second direction, the first guide rail 233 is fixed to the linear module 232, the second guide rail 234 and the driving element 231 are disposed on the first guide rail 233 via a first slider, the suspension arm is disposed on the second guide rail 234 via a second slider, the suspension arm is configured to be movable along the extending direction of the first guide rail 233 under the driving of the linear module 232 and movable along the extending direction of the second guide rail 234 under the driving of the driving element 231, so that the product can be conveyed to the first detection assembly 22 from the heating plate 52. Specifically, the linear module 232 is a pulley assembly, and the second guide rail 234 and the driving member 231 are fixed to a point on the belt of the pulley assembly through a connecting block, and the second guide rail 234 and the driving member 231 move along the first guide rail 233 along with the movement of the pulley assembly. Further, in order to ensure the stability of the cantilever moving in the first direction, two first guide rails 233 are fixed to the linear module 232, the two first guide rails 233 are arranged in the second direction, and the second guide rail 234 and the driving member 231 are respectively engaged with the two first guide rails 233 through two first sliders.

In one embodiment, as shown in fig. 8, the number of the suspension arms is two, and the two suspension arms are a first suspension arm 235 and a second suspension arm 236, and the first suspension arm 235 and the second suspension arm 236 are respectively configured on the second slider through a stepping motor, and the stepping motor is used for adjusting the distance between the first suspension arm 235 and the second suspension arm 236. Specifically, the first suspension 235 and the second suspension 236 are disposed on the second slider via the coupling plate 237, and the first suspension 235 and the second suspension 236 as a whole can move in the first direction and the second direction, while the relative positions of the first suspension 235 and the second suspension 236 to each other can be adjusted.

In a specific embodiment, in order to avoid interference between the cantilever and the first detecting component 22 when the tested product of the first detecting component 22 is transported to the blanking position for blanking, or interference between the cantilever and the equipment in the feeding area when the cantilever is fed, the first cantilever 235 is designed to be "L" shaped, the second cantilever 236 is designed to be "L" shaped, the first cantilever 235 and the second cantilever 236 are mirror images of each other, and the first cantilever 235 is located on a side of the second cantilever 236 away from the first detecting component 22.

In one embodiment, the ends of the first and

second cantilever arms

235, 236 are each configured with suction cups for grasping a tray containing product. The first and

second cantilever arms

235, 236 are capable of simultaneously grasping a product.

In an embodiment, the first detecting component 22 and the second detecting component 32 have the same structure, taking the first detecting component 22 as an example, as shown in fig. 9, the first detecting component 22 includes a testing station 220, the testing station 220 is provided with a testing fixture 221 and a pressing head 222 correspondingly matched with the testing fixture 221, and the pressing head 222 can perform adjustment in the X-axis direction, the Z-axis direction and the Y-axis direction, can be accurately aligned with a product to be tested, ensures the accuracy of the test, and avoids interference with the first material moving mechanism 23. Preferably, a TEC air cooling structure is used on the ram 222, so that the temperature of the product can be precisely controlled during testing. Specifically, the TEC air cooling structure is embodied as a TEC heat sink 223 disposed on a side of the ram 222 away from the test fixture 221. In addition, the first detection assembly 22 further includes an adapter plate 224 and an air pressure tester 225.

In a specific embodiment, as shown in fig. 10, the third material moving mechanism 43 includes a vertical plate 431, a driving motor 432, and a cantilever assembly, where the vertical plate 431 is fixed on the second partition plate, the driving motor 432 is fixed on the vertical plate 431, an output end of the driving motor 432 penetrates through the vertical plate 431 and is connected to the cantilever assembly, and the driving motor 432 can drive the cantilever assembly to move. The cantilever assembly is provided with a sucker 433 used for grabbing a tray filled with a product, and the cantilever assembly moves under the driving of the driving motor 432 to further drive the sucker 433 to convey the tray filled with the product from the pre-cooling station 41 to the cooling station 42.

In this embodiment, the cantilever assembly includes a third cantilever 434 and a fourth cantilever 435, an output end of the driving motor 432 is fixed to one end of the third cantilever 434 and drives the third cantilever 434 to rotate around an axis of the output end, the other end of the third cantilever 434 is rotatably connected to the fourth cantilever 435 through a rotating shaft, and the driving motor 432 can drive the third cantilever 434 to rotate so as to drive the fourth cantilever 435 to move along the first direction or the second direction. It can be understood that, the above-mentioned rotating shaft can be one end and third cantilever 434 fixed connection other end and fourth cantilever 435 rotatable coupling, also can be one end and fourth cantilever 435 fixed connection other end and third cantilever 434 rotatable coupling, can realize third cantilever 434 and fourth cantilever 435 relative rotation can, to this the utility model discloses do not do the restriction.

Specifically, the suction cup 433 is disposed at an end of the fourth suspension arm 435 away from the third suspension arm 434, and is connected to the fourth suspension arm 435 through a connecting member 430. While the third arm 434 and the fourth arm 435 move along with the output of the drive motor 432, the suction cups 433 move between the pre-cooling station 41 and the cooling station 42, carrying the trays with the products from the pre-cooling station 41 to the cooling station 42. It should be noted that, in the process of moving the fourth suspension arm 435, the fourth suspension arm 435 is always perpendicular to the plane where the second partition plate is located, so that the suction cup 433 is always parallel to the plane where the second partition plate is located, and the tray containing the product can be stably grabbed.

In this embodiment, the driving motor 432 performs a 180 ° reciprocating motion, the driving motor 432 rotates 180 ° clockwise, the suction cup 433 moves from the first cooling module to the second cooling module along with the suspension assembly, the driving motor 432 rotates 180 ° counterclockwise, and the suction cup 433 moves from the second cooling module to the first cooling module along with the suspension assembly.

In one embodiment, the fourth suspension 435 is disposed on the riser 431 via a second rail assembly, which includes a third rail 436 disposed along a first direction and a fourth rail 437 disposed along a second direction; the third rail 436 is fixed to the vertical plate 431, the fourth rail 437 is disposed on the third rail 436 by a third slider, and the fourth suspension 435 is disposed on the fourth rail 437 by a fourth slider. The third arm 434 is connected to the output end of the driving motor 432, the third arm 434 moves along with the output end and drives the fourth arm 435 to move, and the movement of the fourth arm 435 can be decomposed into a movement in a first direction and a movement in a second direction, that is, the fourth arm 435 can move along the third rail 436 and the fourth rail 437 under the driving of the driving motor 432, so that the suction cup can reciprocate between the pre-cooling station 41 and the cooling station 42. It will be appreciated that, with reference to fig. 2, the first direction is the X-axis direction and the second direction is the Z-axis direction.

In one embodiment, the vertical plate 431 further includes limiting structures 438 at left and right ends of the vertical plate 431, and the limiting structures 438 are located at two opposite sides of the vertical plate 431, and are used for limiting the stroke of the cantilever assembly in the first direction. Further, the vertical plate 431 is further provided with two buffers 439, the number of the buffers 439 is two, and the two buffers correspond to the position of the third cantilever 434 when the output end of the driving motor 432 is at the initial position and the position of the third cantilever 434 when the output end of the driving motor 432 rotates clockwise by 180 degrees, respectively, and the buffers 439 can play a certain role in buffering when the cantilever assembly reaches the position corresponding to the pre-cooling station 41 or the cooling station 42, so as to prevent the product from being damaged by pressing fork pressure.

In one embodiment, the vertical plate 431 is an L-shaped plate, the bottom of the vertical plate 431 is fixedly combined with the second partition plate, and the vertical part and the bottom of the vertical plate 431 are connected through a connecting beam to ensure the stability of the vertical plate 431.

In a specific embodiment, in order to meet the requirement of tightness to the test environment during the detection of the semiconductor chip, the first detection unit 2, the second detection unit 3 and the buffer cooling unit 4 are independent areas, and specifically, an openable and closable gate for allowing the product to enter the buffer cooling unit 4 from the first detection unit 2 is arranged between the first detection unit 2 and the buffer cooling unit 4; an openable gate for the product to enter the second detection unit 3 from the buffer cooling unit 4 is arranged between the buffer cooling unit 4 and the second detection unit 3.

Further, semiconductor chip test equipment still holds the district including material loading district and unloading, the material loading district is located one side that buffering cooling unit 4 was kept away from to first detecting element 2, the unloading holds the district and is located one side that buffering cooling unit 4 was kept away from to second detecting element 3, but be provided with the open closed gate that supplies the product to get into in the first detecting element 2 between material loading district and the first detecting element 2, but be provided with the open closed gate that supplies the product to get into the unloading and hold the district between second detecting element 3 and the unloading district.

In one embodiment, the first detection assembly 22 and the second detection assembly 23 are respectively in communication with the test chassis through an adapter plate, the adapter plate is provided with an adapter socket, and the adapter plate is hermetically mounted on the first partition plate. In addition, the semiconductor chip testing apparatus further includes an operation table 400 and an air dryer 500 for drying air to prevent moisture from being condensed when the temperature of the product is changed.

The utility model provides a semiconductor chip test equipment's working process is as follows, first cantilever 235 of moving material mechanism 23 removes to intensification station 212 and snatchs the charging tray that the intensification was accomplished, second cantilever 236 removes to first determine module 22's test station 220 and snatchs the charging tray that the test was accomplished, first cantilever 235 and second cantilever 236 move a station backward simultaneously, first cantilever 235 carries the charging tray that the intensification was accomplished to first determine module 22's test station 220 department, second cantilever 236 carries the charging tray that the test was accomplished to the precooling station 41 department of buffering cooling unit 4, then first cantilever 235 and second cantilever 236 move to heating station department, first determine module 22 tests the product that is in test station 220, interfere first determine module 22 in order to prevent the cantilever, interval adjustment between first cantilever 235 and the second cantilever 236 is minimum this moment. In the testing process, the first material moving mechanism 23 replenishes the material trays to the preheating station 211 and the warming station 212, conveys the material trays which are preheated in the preheating station 211 to the warming station 212, and then grabs new material trays filled with products in the material loading area and places the new material trays in the preheating station 211 for preheating. After the first testing group 22 tests the product at the testing station 220, the first cantilever 235 is moved to the temperature-raising station 212, and the second cantilever 236 is moved to the testing station 220, and the above operations are repeated.

A second sensor 92 at the pre-cooling station 41 of the buffer cooling unit 4 detects that a material tray exists on the second cold plate, feedback is given, the pressing plate mechanism is changed from a loose state to a buckling state and is in contact with the upper surface of the material tray, so that the material tray filled with products is tightly attached to the second cold plate, meanwhile, the first sensor 91 on the pressing plate mechanism is used for monitoring the temperature of the material tray, when the temperature reaches a set value, the first sensor 91 gives feedback, the pressing plate mechanism is reset, the third material moving mechanism 43 grabs the material tray of the pre-cooling station 41 and carries the material tray to the cooling station 42 for further cooling; the second sensor 92 of the cooling station 42 detects that a material tray exists on the third cold plate, feedback is given, the pressure plate mechanism is changed from a loose state to a buckling state and is in contact with the upper surface of the material tray, so that the material tray is tightly attached to the third cold plate, meanwhile, the temperature of the material tray is monitored by using the first sensor 91 on the pressure plate mechanism, when a set value is reached, the first sensor 91 gives feedback, the pressure plate mechanism resets, and the second material moving mechanism 33 of the second detection unit 3 carries the material tray to the refrigeration station 31.

The second material moving mechanism 32 of the second detection unit 3 transports the material tray cooled to room temperature to the refrigeration station 31 through the buffer cooling unit 4 for refrigeration, the first cantilever of the second material moving mechanism 32 moves to the refrigeration station 31 to grab the material tray which is cooled, the second cantilever of the second material moving mechanism 32 moves to the test station of the second detection assembly 32 to grab the material tray which is detected, the first cantilever and the second cantilever move backwards at the same time by one station, the first cantilever transports the material tray which is cooled to the test station of the second detection assembly 32, the second cantilever transports the material tray which is tested to the blanking containing area for blanking, then the first cantilever and the second cantilever move to the refrigeration station 31, the second detection assembly 32 tests the product, and in order to prevent the cantilever from interfering with the second detection assembly 32, the distance between the first cantilever and the second cantilever is adjusted to be minimum. In the testing process, the second material moving mechanism 33 supplements the material discs to the refrigerating station 31, and the material discs cooled by the grabbing and buffering cooling unit 4 are placed at the refrigerating station 31 for cooling. After the product test of the second detection assembly 32 is completed, the first cantilever is moved to the refrigeration station 31, the second cantilever is moved to the test station, and the operations are repeated.

It should be noted that the utility model provides a semiconductor detection equipment all is the charging tray that bears the weight of the product at whole in-process transmission, and product and charging tray transmit in the lump promptly, the above-mentioned charging tray acquiescence be for bearing the weight of the product.

The semiconductor chip test equipment that this embodiment provided is through setting up first detecting element, second detecting element and buffering cooling unit, set up material transmission structure between adjacent monomer check out test set, establish ties a plurality of monomer test set for detecting the assembly line, first detecting element and second detecting element can be simultaneously and survey each other and do not influence the efficiency that makes the product detect and show the improvement, first detecting element, second detecting element and buffering cooling unit all are in relatively sealed environment, all threading interfaces all adopt the switching socket mode, whole seal is showing and is promoting. The first material moving mechanism, the second material moving mechanism and the third material moving mechanism are reasonable in structure, space can be saved, and interference is avoided.

Obviously, the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it is obvious for those skilled in the art to make other variations or changes based on the above descriptions, and all the embodiments cannot be exhausted here, and all the obvious variations or changes that belong to the technical solutions of the present invention are still in the protection scope of the present invention.

Claims

1. A semiconductor chip test device is characterized by comprising a test area and a device area;

the equipment area comprises a test case and an air pressure source;

the first detection unit is configured to heat up products and detect the heated products, and comprises a heating station, a first detection assembly and a first material moving mechanism, wherein the first material moving mechanism is configured to convey the products at the heating station to the first detection assembly and convey the products detected by the first detection assembly to the buffer cooling unit;

the second detection unit is configured to cool the product and detect the cooled product, and comprises a refrigeration station, a second detection assembly and a second material moving mechanism, wherein the second material moving mechanism is configured to convey the product cooled by the buffer cooling unit to the refrigeration station for refrigeration and convey the product refrigerated by the refrigeration station to the second detection assembly for detection;

2. The semiconductor chip testing apparatus according to claim 1, wherein the first detecting unit includes two heating stations arranged side by side in a first direction, a preheating station and a temperature raising station;

3. The semiconductor chip testing apparatus according to claim 1, wherein the cooling station comprises a first cold plate, and a heat sink is disposed on a side of the first cold plate facing away from the product placement surface.

4. The semiconductor chip testing apparatus according to claim 1, wherein the first material transferring mechanism and the second material transferring mechanism have the same structure, and each of the first material transferring mechanism and the second material transferring mechanism includes a driving member, a linear module extending along the first direction, and a cantilever, the linear module is configured to drive the cantilever to move along the first direction, and the driving member is in transmission connection with the cantilever and configured to drive the cantilever to move along the second direction.

5. The semiconductor chip testing apparatus according to claim 4, wherein the cantilever is provided with two cantilevers, the relative positions of the two cantilevers are adjustable, and the two cantilevers can simultaneously grab and carry the product.

6. The semiconductor chip testing apparatus of claim 3, wherein the pre-cooling station includes a second cold plate for carrying the product, the cooling station includes a third cold plate for carrying the product, the third cold plate having a temperature lower than the temperature of the second cold plate.

7. The semiconductor chip testing apparatus of claim 6, wherein the sides of the first and second cold plates facing away from the product carrying surface thereof are each configured with a heat sink.

8. The semiconductor chip testing apparatus of claim 1, wherein the buffer cooling unit further comprises a third material moving mechanism configured to convey the product on the pre-cooling station to the cooling station.

9. The semiconductor chip testing apparatus according to claim 1, wherein the first and second inspection assemblies are respectively communicated with the tester chassis through an interposer;

10. The semiconductor chip testing apparatus of claim 1, further comprising a loading area located at a side of the first inspection unit away from the buffer cooling unit and a unloading accommodating area located at a side of the second inspection unit away from the buffer cooling unit;

the blanking accommodating area and the second detection unit are arranged in a separated mode, and a gate which is used for allowing products to pass through and can be opened and closed is arranged between the blanking accommodating area and the second detection unit.