CN105979760A - Substrate supporting device and electronic part installation device - Google Patents
Substrate supporting device and electronic part installation device Download PDFInfo
- Publication number
- CN105979760A CN105979760A CN201610140640.1A CN201610140640A CN105979760A CN 105979760 A CN105979760 A CN 105979760A CN 201610140640 A CN201610140640 A CN 201610140640A CN 105979760 A CN105979760 A CN 105979760A
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- China
- Prior art keywords
- suction nozzle
- magnet
- pin
- contact surface
- base plate
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0015—Orientation; Alignment; Positioning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0495—Mounting of components, e.g. of leadless components having a plurality of work-stations
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention provides a substrate supporting device capable of quickly performing the sorting operation. The substrate supporting device includes a pin member having a lower surface and an upper surface, a magnet and a moving mechanism. The lower surface is supported by the support surface of a base plate, and the upper surface can support the back surface of the substrate of a to-be-installed electronic part. The pin member can be held by the suction nozzle of an installation head and the electronic part can be held by the suction nozzle of the installation head. The magnet is arranged on the pin member and generates a magnetic force for fixing the base plate and the pin member. The moving mechanism is arranged on the pin member. When the lower surface is supported by the support surface, the magnet is capable of moving between a first position and a second position, wherein the first position is closer to the support surface relative to the second surface and the second position is far away from the support surface relative to the first position. The moving mechanism is operated by the suction nozzle.
Description
Technical field
The present invention relates to baseplate support device and electronic component mounting apparatus.
Background technology
Electronic component mounting apparatus, this electronic unit is used in the manufacturing process of electronic equipment
Erecting device uses mounting head to be installed to substrate by electronic unit.At electronic component mounting apparatus
In, sometimes use the baseplate support device being referred to as supporting pin.Support pin to suppress substrate
Flexure, is supported the back side of substrate.Support pin and be releasably arranged at base plate.Based on
Being backed with without electronic unit etc., enforcement support pin of the size of substrate, the thickness of substrate and substrate
Sequence.Patent Document 1 discloses use processing head (mounting head) and carry out supporting pin
The technology of sequence.Patent Document 2 discloses following technology, i.e. install at electronic unit
Support pin is installed on gripper shoe (base plate) by the outside of device, by substrate carrying mechanism to this
Gripper shoe carries.
Patent documentation 1: Japanese Unexamined Patent Publication 03-108800
Patent documentation 2: Japanese Unexamined Patent Publication 2000-124690
Use mounting head to supporting the method that pin is ranked up, it is possible to be ranked up supporting pin
Without causing the complication of electronic component mounting apparatus.By promptly implementing to support the row of pin
Sequence operation such that it is able to the product that changes terminating electronic component mounting apparatus as soon as possible processes, as soon as possible
Start installation process.Mounting head can be used promptly to implement to support pin therefore, it is intended that a kind of
The technology of scheduling.
Summary of the invention
The purpose of the mode of the present invention is that providing a kind of can promptly implement scheduling
Baseplate support device.It addition, the purpose of the mode of the present invention is that offer one can be promptly
Implement the electronic component mounting apparatus of the scheduling of baseplate support device.
The 1st mode according to the present invention, it is provided that a kind of baseplate support device, this substrate supports
Device possesses: pin parts, and it has lower surface and upper surface, this lower surface propping up by base plate
Support face supports, and the back side of the substrate installing electronic unit can be supported by this upper surface, should
Pin parts can be kept by the suction nozzle of mounting head, and the suction nozzle of this mounting head can keep described
Electronic unit；Magnet, it is arranged at described pin parts, produces for by described base plate and institute
State the magnetic force that pin parts are fixing；And travel mechanism, it is arranged at described pin parts, described
Under the state that lower surface is supported by described supporting surface, it is possible to by described magnet the 1st position and with
Described 1st position is compared and is moved away between the 2nd position of described supporting surface, and this moves
Mechanism is operated by described suction nozzle.
The 1st mode according to the present invention, is set to utilizing the magnetic force of magnet by base plate and pin
In the case of parts are fixing, use the travel mechanism operated by suction nozzle to make magnet in the 1st position and
Move away between the 2nd position of supporting surface compared with the 1st position, therefore, it is possible to make base
Produce in the magnetic force of magnet changes bed knife fixing to base plate and pin parts.In sequence
Will be by baseplate support device when base plate unload in operation, by magnet is moved to the 2nd
Position and make base plate and pin parts between bed knife reduce such that it is able to use suction nozzle by base
Plate supporting device promptly unloads from base plate.Therefore, baseplate support device is promptly implemented
Scheduling.
In the 1st mode of the present invention, described travel mechanism can also have: spindle unit,
It has upper end, and this upper end comprises the 1st contact surface contacted with described suction nozzle, this axle portion
Part is moved along the vertical direction by the operation of described suction nozzle；And slide unit, it has
3 contact surfaces and the 4th contact surface, the 3rd contact surface and the bottom being arranged in described spindle unit
The 2nd contact surface contact, being arranged at least partially under described magnet of the 4th contact surface
Side, and described magnet contact, this slide unit by the movement of described spindle unit edge relative to
The radiation direction of the central shaft of described spindle unit moves, make described magnet in described 1st position and
Move between described 2nd position.
Thus, only by utilizing suction nozzle that spindle unit is operated, it becomes possible to move simply
Magnet.
In the 1st mode of the present invention, it is also possible to moved downwards by described spindle unit and
Moving described magnet to the 2nd position, possess elastomeric element, the generation of this elastomeric element makes described
Magnet moves the power to described 1st position.
Thus, only by making suction nozzle decline, spindle unit is moved downwards, it is possible to simply
Magnet is moved to the 2nd position from the 1st position.It addition, utilization can produce make magnet move to
The elastomeric element of the power of the 1st position, only by making suction nozzle rise, it becomes possible to make magnet simply
Move to the 1st position from the 2nd position.
In the 1st mode of the present invention, it is also possible to be that described pin parts have side, this side
Face is arranged in the surrounding of described upper surface and is kept by described suction nozzle, and described upper surface is arranged in institute
State around the 1st contact surface.
Thus, opening is set in pin parts, configures the 1st of spindle unit in the openings and connect
Contacting surface, it is possible to use the upper surface of the pin parts configured around this opening stably to support
Substrate.It addition, suction nozzle can make operating travel mechanism via the opening of pin parts
After bed knife reduces, the side of the pin parts configured around upper surface is promptly protected
Hold.
In the 1st mode of the present invention, described slide unit can also be at described central shaft
It is arranged around multiple.
Thus, travel mechanism can move smoothly.
The 2nd mode according to the present invention, it is provided that a kind of electronic component mounting apparatus, this electronics
Apparatus for mounting component possesses: the baseplate support device of the 1st mode；And mounting head, it has
Keep the suction nozzle of electronic unit, by the described electronic unit that kept by described suction nozzle to by described base
The substrate that plate supporting device supports is installed.
The 2nd mode according to the present invention, it is possible to promptly implement the sequence of baseplate support device
Operation.
The 3rd mode according to the present invention, it is provided that a kind of electronic component mounting apparatus, this electronics
Apparatus for mounting component possesses: base plate；Baseplate support device, its have pin parts, magnet with
And travel mechanism, these pin parts have the lower surface and energy supported by the supporting surface of described base plate
Enough upper surfaces being supported the back side of substrate, this magnet is arranged at described pin parts, produces
For by magnetic force fixing to described base plate and described pin parts, this travel mechanism is arranged at described
Pin parts, when described lower surface is supported by described supporting surface, it is possible to by described magnet
The 1st position and compared with described 1st position away from the 2nd position of described supporting surface between enter
Row is mobile；And mounting head, it has the suction nozzle keeping electronic unit, will be protected by described suction nozzle
The described electronic unit held is installed to described substrate, and described suction nozzle is in the described travel mechanism of operation
Described magnet is moved to described 2nd position from described 1st position, keeps described pin parts
And separate from described base plate.
The 3rd mode according to the present invention, it is possible to promptly implement following a series of process,
That is, consolidating between base plate and pin parts is made using suction nozzle to move magnet to the 2nd position
After determining power reduction, this suction nozzle is used to keep baseplate support device and separate from base plate.Therefore,
Promptly implement the scheduling of baseplate support device.
In the 3rd mode of the present invention, it is also possible to be that described travel mechanism has: spindle unit,
It has upper end, and this upper end comprises the 1st contact surface that can contact with described suction nozzle, should
Spindle unit can move along the vertical direction；And slide unit, it has the 3rd contact surface and
4 contact surfaces, the 2nd contact surface of the 3rd contact surface and the bottom being arranged in described spindle unit
Contact, the lower section being arranged in described magnet at least partially of the 4th contact surface, with described magnetic
Body contact, this slide unit by the movement of described spindle unit edge relative to described spindle unit
The radiation direction of central shaft moves, and makes described magnet in described 1st position and described 2nd position
Between move, described pin parts have the side of the surrounding being configured at described upper surface, institute
Stating upper surface to be arranged in around described 1st contact surface, described suction nozzle has and the described 1st
The protuberance of contact surface contact and the maintaining part that the side of described pin parts is kept,
Under the state that described protuberance contacts with described 1st contact surface, described suction nozzle moves downwards, described
Spindle unit moves downwards, thus moves to the 2nd position at described magnet, described side by
Described maintaining part keeps.
Thereby, it is possible to promptly implement following a series of process, i.e. using moving machine
Magnet is moved to the 2nd position after making bed knife reduce by structure, by the maintaining part of this suction nozzle to base
Plate supporting device carries out keeping and separating from base plate.
The effect of invention
Mode according to the present invention, it is provided that a kind of substrate that can promptly implement scheduling
Support means.It addition, according to the mode of the present invention, it is provided that one can promptly implement substrate
The electronic component mounting apparatus of the scheduling of support means.
Accompanying drawing explanation
Fig. 1 is the example representing the electronic component mounting apparatus involved by present embodiment
Oblique view.
Fig. 2 is the figure of the example showing schematically the mounting head involved by present embodiment.
Fig. 3 is the figure of the example showing schematically the suction nozzle involved by present embodiment.
Fig. 4 is the figure of the example representing the baseplate support device involved by present embodiment.
Fig. 5 is the side of the example representing the baseplate support device involved by present embodiment
Sectional view.
Fig. 6 is to represent the travel mechanism of the baseplate support device involved by present embodiment
The figure of one example of the state operated by suction nozzle.
Fig. 7 is to represent the shape that the travel mechanism involved by present embodiment is not operated by suction nozzle
The figure of a part for baseplate support device under state.
Fig. 8 is the schematic diagram of the baseplate support device observing Fig. 7 from downside.
Fig. 9 is to represent the shape that the travel mechanism involved by present embodiment is being operated by suction nozzle
The figure of a part for baseplate support device under state.
Figure 10 is the schematic diagram of the baseplate support device observing Fig. 9 from downside.
The explanation of label
30 suction nozzles
31 protuberances
32 maintaining parts
106 mounting heads
300 support pin (baseplate support device)
301 lower surfaces
302 upper surfaces
303 pin parts
304 magnets
305 travel mechanisms
306 sides
307 elastomeric elements
310 spindle units
311 upper ends
312 bottoms
321 the 1st contact surfaces
322 the 2nd contact surfaces
323 the 3rd contact surfaces
324 the 4th contact surfaces
325 the 5th contact surfaces
330 slide units
400 base plates
401 supporting surfaces
AX central shaft
C electronic unit
P substrate
Pa surface
The Pb back side
PZ1 the 1st position
PZ2 the 2nd position
Detailed description of the invention
Below, referring to the drawings, embodiment involved in the present invention is illustrated, but this
Invention is not limited to this.The structural element of embodiment described below can be fitted
Work as combination.The most do not use the structural element of a part.
In the following description, XYZ orthogonal coordinate system is set, with reference to the orthogonal seat of this XYZ
The position relationship in each portion is also illustrated by mark system.By the side parallel with the 1st axle in predetermined surface
To being set to X-direction (the 1st direction of principal axis), in predetermined surface will orthogonal with the 1st axle and
The direction parallel with the 2nd axle is set to Y direction (the 2nd direction of principal axis), will be respectively with the 1st
Axle and orthogonal and parallel with the 3rd axle direction of the 2nd axle are set to Z-direction (the 3rd axle
Direction).Direction of rotation (incline direction) centered by the 1st axle (X-axis) is set to θ X
Direction, is set to θ Y by the direction of rotation (incline direction) centered by the 2nd axle (Y-axis)
Direction, is set to θ Z by the direction of rotation (incline direction) centered by the 3rd axle (Z axis)
Direction.Predetermined surface is X/Y plane.In the present embodiment, predetermined surface is set to and horizontal plane
Parallel.Z-direction is the direction orthogonal with predetermined surface.In the present embodiment, Z-direction
It is vertical (above-below direction).
[summary of electronic component mounting apparatus]
Fig. 1 is represent electronic component mounting apparatus 100 involved by present embodiment one
The oblique view of example.As it is shown in figure 1, electronic component mounting apparatus 100 possesses: pedestal 114；
Electronic part feeder 200, it supplies electronic unit C；Setting unit 102, it is used for setting
Put electronic part feeder 200；Base board delivery device 103, its conveying substrate P；Substrate
Clamp system 104, it is arranged at the transport path of base board delivery device 103, enters substrate P
Row keeps；Baseplate support device 300, its substrate P to being held in substrate clamp system 104
The back side be supported；Mounting head 106, it has the suction nozzle that can keep electronic unit C
30；Mounting head mobile device 107, it can make mounting head 106 move in X/Y plane；
Suction nozzle mobile device 140, it is arranged at mounting head 106, it is possible to make suction nozzle 30 relative to installation
106 move along Z-direction and θ Z-direction；Detection device 10, it is arranged at mounting head
106, the position of the suction nozzle 30 of Z-direction is detected；And control device 120, its
Electronic component mounting apparatus 100 is controlled.
Electronic part feeder 200 also referred to as feeder.Setting unit 102 is also referred to as
Feeder receptacle.Setting unit 102, base board delivery device 103, mounting head 106 and peace
Dress head moving device 107 etc. is supported in pedestal 114.
[base board delivery device]
Base board delivery device 103 has: base plate 400；And conveyer belt, it is at base plate
The top of 400 can conveying substrate P.In the present embodiment, substrate P is by substrate conveying dress
Put the conveyer belt of 103 to carry along X-direction.Substrate clamp system 104 is at substrate conveying dress
Put in the transport path of 103 and substrate P is kept.Substrate clamp system 104 is by Y-axis
The both ends clamping of the substrate P in direction.
Substrate P is fixed on the installation site implementing installation process by substrate clamp system 104
PJb.Installation site PJb is the installation process implementing to install electronic unit C to substrate P
Position.Installation site PJb comprises the position relative with the substrate P being mounted electronic unit C.
[mounting head]
Mounting head 106 has the suction nozzle 30 keeping electronic unit C, will be kept by suction nozzle 30
Electronic unit C install to the substrate P that supported by baseplate support device 300.Mounting head 106
Utilize suction nozzle 30 that the electronic unit C supplied from electronic part feeder 200 is kept
And install to the surface of substrate P.Mounting head 106 can process comprising enforcement parts supply
Parts supply position PJa and implement installation process installation site PJb interior XY put down
Move in face.Parts supply position PJa is to implement to supply electronic unit C from electronic unit
The position that the parts supply that device 200 supplies to mounting head 106 processes.Parts supply position
PJa comprise with electronic part feeder 200 at least partially relative to position, comprise with
Position relative for electronic unit C from electronic part feeder 200 supply.
Mounting head mobile device 107 is above substrate P and electronic part feeder 200
Top, make mounting head 106 move.Mounting head mobile device 107 is comprising and from the ministry of electronics industry
Parts supply position PJa, Yi Jiyu relative for electronic unit C of part feedway 200 supply
Relative installation site PJb of the substrate P of mounted electronic unit C is in interior X/Y plane
Mounting head 106 can be made to move.The mounting head 106 realized by mounting head mobile device 107
Movable range comprise the operating area of mounting head 106.By mounting head mobile device 107
Work, mounting head 106 can move in X/Y plane.
Mounting head mobile device 107 possesses: X-axis guide rail 107a, and it is by mounting head 106 edge
X-direction guides；Y-axis guide rail 107b, X-axis guide rail 107a is drawn by it along Y direction
Lead；X drive division 109, it produces the power for making mounting head 106 move along X-direction；
And Y drive division 110, it produces for making mounting head 106 along moving that Y direction moves
Power.
In the present embodiment, mounting head 106 is supported by X-axis guide rail 107a.X drive division
109 actuators comprising such as motor, produce for making by X-axis guide rail 107a support
The power that mounting head 106 moves along X-direction.By the work of X drive division 109, peace
Dress 106 is while being moved by X-axis guide rail 107a guiding, an edge X-direction.
X-axis guide rail 107a is supported by Y-axis guide rail 107b.Y drive division 110 comprises such as
The actuator of motor, produces for making the X-axis guide rail 107a supported by Y-axis guide rail 107b
The power moved along Y direction.By the work of Y drive division 110, X-axis guide rail 107a
While being moved by Y-axis guide rail 107b guiding, an edge Y direction.If X-axis guide rail
107a moves along Y direction, then the mounting head 106 and X supported by this X-axis guide rail 107a
Axis rail 107a moves along Y direction together.In the present embodiment, Y drive division 110
Via X-axis guide rail 107a, mounting head 106 is made to move along Y direction.
Fig. 2 is the example showing schematically the mounting head 106 involved by present embodiment
Figure.Mounting head 106 has the suction nozzle 30 detachably keeping electronic unit C.Install
106 can move in X/Y plane, supply so that suction nozzle 30 is arranged respectively at parts
At position PJa and installation site PJb.Mounting head 106 utilizes suction nozzle 30 to from electronics
The electronic unit C of assembly supply device 200 supply carries out keeping and installing to substrate P.
Suction nozzle 30, at the PJa of parts supply position, supplies from electronic part feeder 200
The electronic unit C given keeps.Suction nozzle 30 keeps electronics at the PJa of parts supply position
After parts C, electronic unit C is delivered to installation site PJb and installs to substrate P.?
At installation site PJb by electronic unit C after substrate P is installed, suction nozzle 30 discharges the ministry of electronics industry
Part C.Thus, to substrate P, electronic unit C is installed.
Mounting head 106 supports suction nozzle 30, makes the suction nozzle 30 can be along Z-direction and θ Z side
To movement.Mounting head 106 has suction nozzle mobile device 140, this suction nozzle mobile device 140 energy
Suction nozzle 30 is enough made to move along Z-direction and θ Z-direction.Suction nozzle mobile device 140 comprises:
Z drive division 150, it makes suction nozzle 30 move along Z-direction；And θ Z drive division 160,
It makes suction nozzle 30 move (rotation) along θ Z-direction.Z drive division 150 comprises such as motor
Actuator, produce for making the power that suction nozzle 30 moves along Z-direction.θ Z drive division
160 actuators comprising such as motor, produce for making suction nozzle 30 move along θ Z-direction
Power.
I.e., in the present embodiment, suction nozzle 30 utilizes mounting head mobile device 107 and sets
Be placed in the suction nozzle mobile device 140 of mounting head 106, it is possible to along X-direction, Y direction,
Z-direction and these 4 directions of θ Z-direction are moved.Additionally, suction nozzle 30 can also edge
X-direction, Y direction, Z-direction, θ X-direction, θ Y-direction and θ Z-direction this 6
Individual direction is moved.
Additionally, in the present embodiment, mounting head 106 possesses: mounting head photographing unit 170,
It can obtain the view data of object；Range sensor 180, its to relative object it
Between distance detect；And detection device 10, its position to the suction nozzle 30 of Z-direction
Put and detect.Moved by mounting head 106, so that mounting head photographing unit 170, distance
Sensor 180 and detection device 10 move together with mounting head 106.
[suction nozzle]
Fig. 3 is the figure of the example representing the suction nozzle 30 involved by present embodiment.Suction nozzle
30 have: suction nozzle main body 35；Maintaining part 32, it is supported by suction nozzle main body 35, keeps electricity
Subassembly C；And protuberance 31, it is arranged at maintaining part 32.Maintaining part 32 has: fixing
Arm 32A；Moveable arm 32B；And drive division 33, it can make moveable arm 32B move.
Moveable arm 32B is supported by suction nozzle main body 35.Moveable arm 32B can be centered by fulcrum 34
Rotate.Fulcrum 34 comprises linkage, and this linkage can be rotatably by moveable arm 32B
It is connected with suction nozzle main body 35.Moveable arm 32B can rotate with fulcrum 34 as rotary shaft,
So that the part relative with fixed arm 32A from close to fixed arm 32A direction and away from
A direction in the direction of fixed arm 32A is moved to the opposing party direction.Drive division 33 can
Moveable arm 32B is made to move, so that the portion relative with fixed arm 32A in moveable arm 32B
Divide from the direction close to fixed arm 32A and away from a side the direction of fixed arm 32A
Move to another direction.
Maintaining part 32 can keep electronic unit C with discharging.Maintaining part 32 utilizes fixed arm
32A and moveable arm 32B, clips and keeps electronic unit C.Suction nozzle 30 is at electronic unit C
The state being present at least partially between fixed arm 32A and moveable arm 32B under, pass through
Reduce the distance between fixed arm 32A and moveable arm 32B, thus keep electronic unit C.
Protuberance 31 is arranged at the supporting surface of fixed arm 32A downward.Protuberance 31 is solid
Between arms 32A and moveable arm 32B, it is set to protrude downwards from supporting surface.
[baseplate support device]
Below, the baseplate support device 300 involved by present embodiment is illustrated.Fig. 4
It it is the figure of the example representing the baseplate support device 300 involved by present embodiment.Such as figure
Shown in 4, electronic component mounting apparatus 100 possesses baseplate support device 300, and this substrate supports
The back side Pb of substrate P is supported by device 300.Baseplate support device 300 is to by substrate
The back side Pb of the substrate P that clamp system 104 keeps is supported.Baseplate support device 300
It is pin-shaped component, also referred to as supports pin 300.In the following description, substrate is supported dress
Put 300 to be properly termed as supporting pin 300.
Electronic unit C is kept by clamp system 104, to by supporting the substrate that pin 300 supports
The surface Pa of P installs.
Electronic component mounting apparatus 100 has base plate 400.Support pin 300 by base plate
The supporting surface 401 of 400 supports.Support pin 300 to have: lower surface 301, it is by base plate
The supporting surface 401 of 400 supports；And upper surface 302, it can be to installing electronic unit C
The back side Pb of substrate P be supported.In the present embodiment, supporting surface 401 and XY
Plane is parallel.Support pin 300 and arrange multiple in the X/Y plane parallel with supporting surface 401.
By the back side Pb of substrate P being supported by multiple support pins 300, thus suppress substrate
The flexure of P.
Fig. 5 is the side section view representing the example supporting pin 300 involved by present embodiment
Figure.Possess as it is shown in figure 5, support pin 300: pin parts 303；Magnet 304, it is arranged
In pin parts 303, produce for by base plate 400 and the fixing magnetic force of pin parts 303；With
And travel mechanism 305, it is arranged at pin parts 303, it is possible to moving magnet 304.
Pin parts 303 have: lower surface 301, it is by the supporting surface 401 of base plate 400
Support；And upper surface 302, it can be to the back side Pb of the substrate P installing electronic unit C
It is supported.Pin parts 303 work as the housing with inner space.By supporting surface
Under 401 states supported, pin parts 303 extend along Z-direction.
Pin parts 303 comprise: top 303A, it comprises upper end；Bottom 303C, its bag
Containing bottom；And pars intermedia 303B, its be configured in the Z-axis direction top 303A and under
Between portion 303C.The upper end of pin parts 303 comprises upper surface 302.Pin parts 303 times
End comprises lower surface 301.In X/Y plane, the overall dimensions of bottom 303C is maximum, in
Between portion 303B overall dimensions inferior to bottom 303C and second largest, the profile chi of top 303A
Very little minimum.The profile of the pin parts 303 in X/Y plane is circular.Pin parts 303 have and Z
The central shaft that axle is parallel.
Magnet 304 is arranged in the inner space of pin parts 303.In the present embodiment,
Magnet 304 is arranged in the inner space of bottom 303C.Bottom 303C has bottom 303C
Inner space carry out the base plate that specifies.Under the state shown in fig. 5, magnet 304 and base plate
Contact.In the present embodiment, magnet 304 is disposed on week of central shaft of pin parts 303
The ring-type parts enclosed.
Travel mechanism 305 makes magnet 304 along the Z axis parallel with the central shaft of pin parts 303
Direction is moved.Travel mechanism 305 when lower surface 301 is supported by supporting surface 401,
Can by magnet 304 the 1st position PZ1 of Z-direction and with the 1st position PZ1 phase
Ratio moves away between the 2nd position PZ2 of supporting surface 401.2nd position PZ2 is
Position above compared with the 1st position PZ1.
In the present embodiment, travel mechanism 305 is operated by suction nozzle 30.Fig. 6 is to represent shifting
The figure of one example of the state that motivation structure 305 is being operated by suction nozzle 30.Additionally, Fig. 5
It it is the figure of the state representing that travel mechanism 305 do not operates by suction nozzle 30.
As shown in Figures 5 and 6, travel mechanism 305 has: spindle unit 310, on it has
End 311, this upper end 311 comprises the 1st contact surface that the protuberance 31 with suction nozzle 30 contacts
321, this spindle unit 310 is moved along the vertical direction by the operation of suction nozzle 30；And slide
Parts 330, its by the movement of the Z-direction of spindle unit 310 along relative to spindle unit
The radiation direction of the central shaft of 310 moves, and makes magnet 304 at the 1st position PZ1 and the 2nd
Move between the PZ2 of position.
Spindle unit 310 is arranged in the inner space of pin parts 303.Spindle unit 310 is along Z
Direction of principal axis extends.The profile of the spindle unit 310 in X/Y plane is circular.Spindle unit 310 has
There is the central shaft parallel with Z axis.The central shaft of spindle unit 310 and the center of pin parts 303
Axle is consistent (coaxially).In the following description, by central shaft and the pin parts of spindle unit 310
The central shaft of 303 is properly termed as central shaft AX together.
Spindle unit 310 comprises: top 310A, and it is arranged in the top 303A of pin parts 303
Inner space and pars intermedia 303B inner space in；And bottom 310B, its configuration
In the inner space of the bottom 303C of pin parts 303.In X/Y plane, bottom 310B
Overall dimensions more than the overall dimensions of top 310A.
1st contact surface 321, the 1st contact are set at the upper end 311 of spindle unit 310
Face 321 contacts with the protuberance 31 of suction nozzle 30.Upper end in the inner space of pin parts 303
Opening is set.1st contact surface 321 is arranged in the opening of these pin parts 303.Pin parts
The upper surface 302 of 303 is arranged in the 1st contact surface 321 of spindle unit 310 around.
2nd contact surface 322, the 2nd contact are set at the bottom 312 of spindle unit 310
Face 322 contacts with slide unit 330.2nd contact surface 322 is relative to central shaft AX's
Towards lateral inclined upward in radiation direction.
Slide unit 330 central shaft AX be arranged around multiple.In the present embodiment,
Slide unit 330 is arranged around 3 at central shaft AX.Slide unit 330 is arranged in pin
In the inner space of the bottom 303C of parts 303.
Slide unit 330 can be propped up by the base plate of the bottom 303C of pin parts 303 movably
Support.Slide unit 330 is when by backplanes support, it is possible to along relative to central shaft AX
Radiation direction move (slip).
Slide unit 330 has: the 3rd contact surface 323, itself and the 2nd of spindle unit 310
Contact surface 322 contacts；And the 4th contact surface 324, it is arranged in magnet 304 at least partially
Lower section and contact with magnet 304.3rd contact surface 323 is putting relative to central shaft AX
The side of penetrating is upwardly toward lateral inclined upward.4th contact surface 324 is relative to central shaft AX
Radiation direction on towards lateral inclined downward.
What magnet 304 had that the 4th contact surface 324 with slide unit 330 contacts the 5th connects
Contacting surface 325.5th contact surface 325 in the radiation direction relative to central shaft AX towards outward
Lateral inclined downward.
Pin parts 303 are kept by suction nozzle 30.Pin parts 303 have side 306, this side
306 are arranged in upper surface 302 around, suction nozzle 30 keep.As shown in Figure 6, comprise
Fixed arm 32A and moveable arm 33B in the maintaining part 32 of interior suction nozzle 30 to pin parts 303
Side 306 keep.Maintaining part 32 utilizes fixed arm 32A and moveable arm 33B to clip
And the top 303A of retaining pin parts 303.
Supporting pin 300 and have elastomeric element 307, this elastomeric element 307 applies to magnet 304
Power downward.Elastomeric element 307 comprises helical spring.Elastomeric element 307 is arranged in magnetic
The upper surface of body 304 and the upper surface with magnet 304 of the bottom 303C of pin parts 303
Between relative end face.Elastomeric element 307 produces and makes magnet 304 move from the 2nd position PZ2
Move the power to the 1st position PZ1.
In the present embodiment, pin parts 303, spindle unit 310 and slide unit 330 are by pressing down
The nonmagnetic substance making the attraction to magnet 304 is formed.Nonmagnetic substance can be rustless steel,
Can also be synthetic resin.
As shown in Figure 6, the protuberance 31 of suction nozzle 30 is inserted in the upper end of pin parts 303
In the opening that portion is arranged.When supporting pin 300 and being supported by supporting surface 401, if inhaled
The protuberance 31 of mouth 30 inserts in the opening of pin parts 303, and suction nozzle 30 moves downwards,
Then spindle unit 310 moves downwards.That is, insert in the opening of pin parts 303 at protuberance 31,
Under the state that protuberance 31 contacts with the 1st contact surface 321 of spindle unit 310, if suction nozzle 30
Move downwards, then spindle unit 310 moves downwards.
[action of travel mechanism]
Below, an example to the action of the travel mechanism 305 involved by present embodiment
Illustrate.Fig. 7 is to represent under the state that travel mechanism 305 is not operated by suction nozzle 30
Support the figure of a part for pin 300.Fig. 8 be observe Fig. 7 from downside support the showing of pin 300
It is intended to.Fig. 9 is to represent the support under the state that travel mechanism 305 is being operated by suction nozzle 30
The figure of a part for pin 300.Figure 10 is the signal supporting pin 300 observing Fig. 9 from downside
Figure.
The state that travel mechanism 305 is not operated by suction nozzle 30 refers to, as it is shown in figure 5, inhale
The protuberance 31 of mouth 30 is not inserted into the opening of the upper end of pin parts 303, protuberance 31 and axle
The state that 1st contact surface 321 of parts 310 is not in contact with.
The state that travel mechanism 305 is being operated by suction nozzle 30 refers to, as shown in Figure 6,
The protuberance 31 of suction nozzle 30 inserts the opening of the upper end of pin parts 303, protuberance 31 and axle portion
Under the state of the 1st contact surface 321 contact of part 310, suction nozzle 30 moves downwards, axle portion
The state that part 310 moves downwards.
With reference to Fig. 7 and Fig. 8, the state not operated travel mechanism 305 by suction nozzle 30 is entered
Row explanation.When travel mechanism 305 is not operated by suction nozzle 30, utilize by elasticity
The power that parts 307 produce, magnet 304 moves downwards.If, with elastomeric element 307
Make magnet 304 move downwards, then have what the 5th contact surface 325 with magnet 304 contacted
The slide unit 330 of the 4th contact surface 324 due to the power being subject to from magnet 304, relative to
To medial movement in the radiation direction of central shaft AX.If slide unit 330 relative in
To medial movement in the radiation direction of mandrel AX, then have and the 3rd of slide unit 330 the
The spindle unit 310 of the 2nd contact surface 322 of contact surface 323 contact, due to from multiple sliding parts
Power that part 330 is subject to and be moved upward.
When travel mechanism 305 is not operated by suction nozzle 30, magnet 304 is arranged in
The 1st position PZ1 of the supporting surface 401 of close base plate 400 compared with the 2nd position PZ2.
The distance ratio being arranged between magnet 304 and the base plate 400 of the 1st position PZ1 is arranged in
Distance between magnet 304 and the base plate 400 of the 2nd position PZ2 is short.In travel mechanism
Under 305 states not operated by suction nozzle 30, magnet 304 moves downwards, with bottom 303C
Contacts baseplate.Owing to the distance between magnet 304 and base plate 400 is short, therefore based on magnetic
The magnetic force of body 304 and produce for by base plate 400 and the fixing bed knife of pin parts 303
Increase.
With reference to Fig. 9 and Figure 10, the state operated travel mechanism 305 by suction nozzle 30 is entered
Row explanation.Utilize the power produced by the Z drive division 150 of suction nozzle mobile device 140,
Under the state that protuberance 31 contacts with the 1st contact surface 321 of spindle unit 310, make suction nozzle 30
Move downwards, utilize the power of this suction nozzle 30 to make spindle unit 310 move downwards.If it is sharp
Make spindle unit 310 move downwards with suction nozzle 30, then have and connect with the 2nd of spindle unit 322
The slide unit 330 of the 3rd contact surface 323 of contacting surface 322 contact, due to from spindle unit 310
The power that is subject to and move laterally in the radiation direction relative to central shaft AX.If slided
Parts 330 move in the radiation direction relative to central shaft AX laterally, then have with sliding
The magnet 304 of the 5th contact surface 325 of the 4th contact surface 324 contact of dynamic component 330, by
It is moved upward in the power being subject to from multiple slide units 330.Via spindle unit 310 and cunning
Dynamic component 330 and be transferred to the power (power of Z drive division 150) of the suction nozzle 30 of magnet 304,
Bigger than the power being transferred to magnet 304 from elastomeric element 307.Therefore, magnet 304 is by upward
Boost.
When travel mechanism 305 is operated by suction nozzle 30, magnet 304 is arranged in
Away from the 2nd position PZ2 of supporting surface 401 of base plate 400 compared with the 1st position PZ1.
The distance ratio being arranged between magnet 304 and the base plate 400 of the 2nd position PZ2 is arranged in
Distance between magnet 304 and the base plate 400 of the 1st position PZ1.In travel mechanism
Under 305 states operated by suction nozzle 30, magnet 304 is moved upward, away from bottom
The base plate of 303C.Due to the distance between magnet 304 and base plate 400, therefore based on
The magnetic force of magnet 304 and produce for by fixing to base plate 400 and pin parts 303 fixing
Power reduces.
As it has been described above, in the present embodiment, by the spindle unit 310 of travel mechanism 305
Move along the vertical direction, so that magnet 304 is from the 1st position PZ1 and the 2nd position PZ2
In a position move to another position, based on the magnetic force produced by magnet 304 by base
Seat board 400 and the fixing bed knife of pin parts 303 change.Magnet 304 is arranged in the 1st
The bed knife during PZ1 of position is stronger than the bed knife that magnet 304 is arranged in during the 2nd position PZ2.
Moved downwards by spindle unit 310, so that magnet 304 moves to the 2nd position PZ2,
Bed knife reduces.It is moved upward by spindle unit 310, so that magnet 304 moves to
1 position PZ1, bed knife increases.
[sort method]
Below, the sort method supporting pin 300 involved by present embodiment is illustrated.
Size based on substrate P, the thickness of substrate P, substrate P back side Pb with or without electronic unit
The position etc. of the electronic unit C at the back side Pb of C and substrate P, implements to support pin 300
Sequence.
In order to be sorted by support pin 300, implement to be fixed the magnetic force due to magnet 304
In the operation that the support pin 300 of base plate 400 unloads from this base plate 400.Support pin 300
It is fixed on base plate 400 owing to being arranged in the magnetic force of the magnet 304 of the 1st position PZ1.Will
The operation that support pin 300 unloads from base plate 400 is carried out by suction nozzle 30.
In order to be unloaded from base plate 400 by support pin 300, the protuberance 31 of suction nozzle 30 is made to insert
Enter the opening of the upper end of pin parts 303.First, mounting head mobile device 107 is controlled
System, the position of the suction nozzle 30 in adjustment X/Y plane, so that the protuberance 31 of suction nozzle 30 is inserted
Enter the opening of the upper end of pin parts 303.The position of the suction nozzle 30 in X/Y plane is entered
After Row sum-equal matrix, suction nozzle mobile device 140 is controlled, makes the protuberance 31 of suction nozzle 30 insert
The opening of the upper end of pin parts 303.Thus, the protuberance 31 of suction nozzle 30 and spindle unit 310
The 1st contact surface 321 of upper end 311 contact.
At the protuberance 31 of suction nozzle 30 and the 1st contact surface of the upper end 311 of spindle unit 310
After 321 contacts, utilize the power produced by the Z drive division 150 of suction nozzle mobile device 140,
Suction nozzle 30 is made to move downwards.Thus, the spindle unit 310 contacted with suction nozzle 30 and suction nozzle
30 is square mobile downwardly together.
By making suction nozzle 30 downward when protuberance 31 contacts with the 1st contact surface 321
Fang Yidong, makes spindle unit 310 move downwards, so that magnet 304 is from the 1st position PZ1
Mobile to the 2nd position PZ2.Thus, the bed knife between pin 300 and base plate 400 is supported
Reduce.
By by the suction nozzle 30 operation to travel mechanism 305, making magnet 304 from the 1st position
PZ1 moves to the 2nd position PZ2, at the bed knife supported between pin 300 and base plate 400
After reduction, suction nozzle 30 utilizes maintaining part 32 to keep the side 306 of pin parts 303.
When protuberance 31 inserts the opening of pin parts 303, maintaining part 32 utilizes fixed arm
32A and moveable arm 33B clips and retaining pin parts 303.At pin parts 303 by suction nozzle 30
After holding, by the work of suction nozzle mobile device 140, make to maintain the suction nozzle supporting pin 300
30 rise.Thus, support pin 300 is unloaded from base plate 400.
By support pin 300 from the operation that base plate 400 unloads, magnet 304 is from the 1st
Position PZ1 moves to the 2nd position PZ2, and produce at magnetic force based on magnet 304 props up
After bed knife between support pin 300 and base plate 400 reduces, the maintaining part 32 of suction nozzle 30
Keep supporting pin 300 and unload from base plate 400.Thus, even if by maintaining part
32 pairs support pins 300 retentivitys weak, suction nozzle 30 also be able to simply by support pin 300 from
Base plate 400 unloads.
The pin 300 that supports unloaded from base plate 400 is arranged on any position of base plate 400
Put.The operation that support pin 300 is arranged at base plate 400 is also implemented by suction nozzle 30.Suction nozzle
30 utilize maintaining part 32 to keep and carry support pin 300.Protuberance 31 is being inserted by suction nozzle 30
Under the state of the opening of pin parts 303, conveying supports pin 300.Support pin 300 by suction nozzle 30
The operation of protuberance 31, at the base plate of bottom 303C and the magnet 304 points of pin parts 303
From state under, suction nozzle 30 carry.
Mounting head mobile device 107 is controlled, to maintaining the suction nozzle supporting pin 300
Position in the X/Y plane of 30 is adjusted, so that support pin 300 is arranged on pedestal
The desired locations of the supporting surface 401 of plate 400.The position of the suction nozzle 30 in adjusting X/Y plane
Postpone, suction nozzle mobile device 140 is controlled, so that the support kept by suction nozzle 30
The lower surface 301 of pin 300 contacts with the supporting surface 401 of base plate 400.Suction nozzle is utilized to move
Device 140 makes the suction nozzle 30 maintaining support pin 300 decline.Kept by suction nozzle 30 by making
Support pin 300 decline, so that supporting the lower surface 301 of pin 300 and base plate 400
Supporting surface 401 contact.
After the lower surface 301 supporting pin 300 contacts with the supporting surface 401 of base plate 400,
By the maintaining part 32 of suction nozzle 30, the holding supporting pin 300 is released from.
After the holding supporting pin 300 being released from by maintaining part 32, suction nozzle is utilized to move dress
Putting 140 makes suction nozzle 30 rise.Risen by suction nozzle 30, by protuberance 31 from pin parts 303
Opening extract.By protuberance 31 is extracted from the opening of pin parts 303, from travel mechanism
305 states operated by suction nozzle 30 are changed to the state not operated, so that magnetic
Body 304 moves to the 1st position PZ1 from the 2nd position PZ2.Thus, base plate 400 He
Support pin 300 utilize magnetic force based on magnet 304 and the strong bed knife that produces and fixed.By
Being firmly fixed at base plate 400 in supporting pin 300, therefore this support pin 300 can be steady
Determine twelve Earthly Branches support substrate P.
[effect]
As described above, according to present embodiment, will at the magnetic force using magnet 304
In the case of support pin 300 and base plate 400 are fixed, use the movement operated by suction nozzle 30
Mechanism 305, make magnet 304 the 1st position PZ1 and compared with the 1st position PZ1 away from
Move between 2nd position PZ2 of supporting surface 401, therefore, it is possible to by this magnet 304
Movement, make magnetic force based on magnet 304 and produce by base plate 400 and support pin 300
Fixing bed knife changes.
To support in the operation sorted of pin 300, by support pin 300 from base plate 400
When unloading, make magnet 304 move to the 2nd position PZ2 from the 1st position PZ1, make based on
The magnetic force of magnet 304 and the bed knife supported between pin 300 and base plate 400 that produces subtracts
Little, it is possible to use suction nozzle 30 promptly to be unloaded from base plate 400 by support pin 300.
Therefore, promptly implement to support the scheduling of pin 300.
If the bed knife supported between pin 300 and base plate 400 is strong, then by support pin 300
The operation unloaded from base plate 400 requires time for, it is possible to be difficult with suction nozzle 30 promptly
Support pin 300 is unloaded from base plate 400.Such as, by the maintaining part 32 of suction nozzle 30
To the retentivity supporting pin 300 weak in the case of, if supporting pin 300 and base plate 400
Between bed knife strong, it is likely that be difficult with suction nozzle 30 promptly by support pin 300 from
Base plate 400 unloads.In the present embodiment, maintaining part 32 be utilize fixed arm 32A and
Moveable arm 33B clips and the structure of retaining pin parts 303, it is possible to cannot obtain enough
Retentivity.
According to present embodiment, the travel mechanism 205 operated by suction nozzle 30 is arranged at support pin
300, therefore when being kept supporting pin 300 by suction nozzle 30, by utilizing this suction nozzle 30 to shifting
Motivation structure 205 operates such that it is able to make support pin 300 and base plate 400 simply
Between bed knife reduce.
In the present embodiment, travel mechanism 305 is operated by suction nozzle 30, makes magnet 304
Move to the 2nd position PZ2 from the 1st position PZ1, make support pin 300 and base plate 400
Between bed knife reduce after, utilize maintaining part 32 promptly keeps support pin 300, it is possible to
Support pin 300 is unloaded from base plate 400.That is, under suction nozzle 30 can promptly comprise
State a series of process of process, i.e. make process that bed knife reduces, keep supporting pin 300
Process and the process that separates from base plate 400 of pin 300 will be supported.Thus, promptly
Implement scheduling.
It addition, according to present embodiment, moved downwards by spindle unit 320, so that
Magnet 304 moves to the 2nd position PZ2 from the 1st position PZ1.Therefore, only by making suction
Mouth 30 declines, it becomes possible to make magnet 304 move to the 2nd position PZ2 from the 1st position PZ1.
It addition, according to present embodiment, arrange elastomeric element 307, this elastomeric element 307
Producing makes magnet 304 move the power to the 1st position PZ1.Thus, only by making suction nozzle 30
Rise, it becomes possible to make magnet 304 move to the 1st position PZ1 from the 2nd position PZ2.
It addition, according to present embodiment, pin parts 303 have: upper surface 302, its configuration
Around the 1st contact surface 321 of spindle unit 310；And side 306, it is arranged in
Surface 302 around, is kept by suction nozzle 30.That is, opening is set at pin parts 303,
Configure the 1st contact surface 321 of spindle unit 310 in the openings, it is possible to use is arranged in this and opens
The upper surface 32 of the pin parts 303 of the surrounding of mouth stably supports substrate P.It addition, suction nozzle
30 can make to fix operating travel mechanism 305 via the opening of pin parts 303
After power reduces, the promptly side selling parts 303 to the surrounding being arranged in upper surface 302
306 keep.
Additionally, in the above-described embodiment, mounting head 106 can also be by also link mechanism
Support.
Claims (9)
1. a baseplate support device, it possesses:
Selling parts, it has lower surface and upper surface, and this lower surface is by the supporting surface of base plate
Supporting, the back side of the substrate installing electronic unit can be supported by this upper surface, this pin portion
Part can be kept by the suction nozzle of mounting head, and the suction nozzle of this mounting head can keep described electronics
Parts；
Magnet, it is arranged at described pin parts, produces for by described base plate and described pin
The magnetic force that parts are fixing；And
Travel mechanism, it is arranged at described pin parts, at described lower surface by described supporting surface
Under the state supported, it is possible to by described magnet the 1st position and compared with described 1st position remote
Moving between the 2nd position of described supporting surface, this travel mechanism is grasped by described suction nozzle
Make.
Baseplate support device the most according to claim 1, wherein,
Described travel mechanism has:
Spindle unit, it has upper end, and this upper end comprises the 1st contacted with described suction nozzle
Contact surface, this spindle unit is moved along the vertical direction by the operation of described suction nozzle；And
Slide unit, it has the 3rd contact surface and the 4th contact surface, the 3rd contact surface with
Being arranged in the 2nd contact surface contact of the bottom of described spindle unit, the 4th contact surface is at least
A part is arranged in the lower section of described magnet, and with described magnet contact, this slide unit passes through institute
State the movement of spindle unit and move along the radiation direction of central shaft relative to described spindle unit, make
Described magnet moves between described 1st position and described 2nd position.
Baseplate support device the most according to claim 2, wherein,
Moved downwards by described spindle unit and described magnet moved to the 2nd position,
This baseplate support device possesses elastomeric element, and this elastomeric element produces and makes described magnet move
Move the power to described 1st position.
4. according to the baseplate support device described in Claims 2 or 3, wherein,
Described pin parts have side, and this side is arranged in the surrounding of described upper surface and by institute
State suction nozzle to keep,
Described upper surface is arranged in around described 1st contact surface.
5. according to the baseplate support device described in Claims 2 or 3, wherein,
Described slide unit described central shaft be arranged around multiple.
Baseplate support device the most according to claim 4, wherein,
Described slide unit described central shaft be arranged around multiple.
7. an electronic component mounting apparatus, it possesses:
Baseplate support device according to any one of claim 1 to 6；And
Mounting head, it has the suction nozzle keeping electronic unit, the institute that will be kept by described suction nozzle
State electronic unit to install to the substrate supported by described baseplate support device.
8. an electronic component mounting apparatus, it possesses:
Base plate；
Baseplate support device, it has pin parts, magnet and travel mechanism, these pin parts
There is the lower surface supported by the supporting surface of described base plate and the back side of substrate can be carried out
The upper surface supported, this magnet is arranged at described pin parts, produce for by described base plate and
The magnetic force that described pin parts are fixing, this travel mechanism is arranged at described pin parts, in described following table
Under the state that face is supported by described supporting surface, it is possible to by described magnet in the 1st position with described
1st position is compared and is moved away between the 2nd position of described supporting surface；And
Mounting head, it has the suction nozzle keeping electronic unit, the institute that will be kept by described suction nozzle
State electronic unit to install to described substrate,
Described magnet is moved from described 1st position by described suction nozzle in the described travel mechanism of operation
Move to described 2nd position, keep described pin parts to separate from described base plate.
Electronic component mounting apparatus the most according to claim 7, wherein,
Described travel mechanism has:
Spindle unit, it has upper end, and this upper end comprises and can contact with described suction nozzle
1st contact surface, this spindle unit can move along the vertical direction；And
Slide unit, it has the 3rd contact surface and the 4th contact surface, the 3rd contact surface with
Being arranged in the 2nd contact surface contact of the bottom of described spindle unit, the 4th contact surface is at least
A part is arranged in the lower section of described magnet, and with described magnet contact, this slide unit passes through institute
State the movement of spindle unit and move along the radiation direction of central shaft relative to described spindle unit, make
Described magnet moves between described 1st position and described 2nd position,
Described pin parts have the side of the surrounding being configured at described upper surface,
Described upper surface is arranged in around described 1st contact surface,
Described suction nozzle has the protuberance contacted with described 1st contact surface and to described pin portion
The side of part carries out the maintaining part kept,
When described protuberance contacts with described 1st contact surface, described suction nozzle moves downwards
Dynamic, described spindle unit moves downwards, thus moves to the 2nd position at described magnet, institute
State side to be kept by described maintaining part.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015048501A JP6521678B2 (en) | 2015-03-11 | 2015-03-11 | Substrate supporting apparatus and electronic component mounting apparatus |
| JP2015-048501 | 2015-03-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105979760A true CN105979760A (en) | 2016-09-28 |
| CN105979760B CN105979760B (en) | 2020-01-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610140640.1A Active CN105979760B (en) | 2015-03-11 | 2016-03-11 | Substrate supporting device and electronic component mounting device |
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| Country | Link |
|---|---|
| JP (1) | JP6521678B2 (en) |
| CN (1) | CN105979760B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114451079B (en) * | 2019-10-02 | 2024-02-02 | 株式会社富士 | Substrate support pin installation jig and substrate support pin installation method |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019130422A1 (en) * | 2017-12-26 | 2019-07-04 | 株式会社Ｆｕｊｉ | Working machine |
| CN114449756B (en) * | 2020-11-06 | 2024-03-26 | 奥特斯科技(重庆)有限公司 | Manipulating component carrier structure during temperature processing to inhibit deformation of component carrier structure |
| DE102021124498B3 (en) | 2021-09-22 | 2023-01-26 | Asm Assembly Systems Gmbh & Co. Kg | Support pin for supporting a substrate in a placement area of a placement machine and placement machine with a magazine with a plurality of such support pins. |
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| JP6019406B2 (en) * | 2013-05-17 | 2016-11-02 | パナソニックＩｐマネジメント株式会社 | Electronic component mounting apparatus and electronic component mounting method |
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| JP2004228249A (en) * | 2003-01-21 | 2004-08-12 | Yamaha Motor Co Ltd | Backup device and surface mounting machine |
| CN103404251A (en) * | 2011-08-08 | 2013-11-20 | 松下电器产业株式会社 | Bottom reception pin module for electronic component mounting device, substrate bottom reception device, and substrate bottom reception method |
| CN103416117A (en) * | 2011-08-08 | 2013-11-27 | 松下电器产业株式会社 | Electronic component mounting device, electronic component mounting method, and method for changing arrangement of bottom reception pin module |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2016171126A (en) | 2016-09-23 |
| JP6521678B2 (en) | 2019-05-29 |
| CN105979760B (en) | 2020-01-31 |
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