CN114449756B

CN114449756B - Manipulating component carrier structure during temperature processing to inhibit deformation of component carrier structure

Info

Publication number: CN114449756B
Application number: CN202011231684.8A
Authority: CN
Inventors: 黎振川
Original assignee: AT&S Chongqing Co Ltd
Current assignee: AT&S Chongqing Co Ltd
Priority date: 2020-11-06
Filing date: 2020-11-06
Publication date: 2024-03-26
Anticipated expiration: 2040-11-06
Also published as: CN114449756A; JP3235830U; KR200497050Y1; TWM628025U; KR20220001075U

Abstract

A handling device (100) for handling a component carrier structure (102) of a preform comprising a plurality of component carriers (104) during temperature processing, wherein the handling device (100) comprises: a first clamp (108) and a second clamp (110) configured for receiving a component carrier structure (102) therebetween; an array of magnets (112) forming part of one of the first clamp (108) and the second clamp (110); and a plate (114) forming part of the other of the first clamp (108) and the second clamp (110), wherein the magnet (112) is configured to create an attractive force with the plate (114) to inhibit deformation of the component carrier structure (102) therebetween.

Description

Manipulating component carrier structure during temperature processing to inhibit deformation of component carrier structure

Technical Field

The invention relates to a handling device and a method for handling a component carrier structure during temperature processing, an arrangement and a reflow oven.

Background

As the product functions of component carriers equipped with one or more electronic components and miniaturization of such components increase, as well as the number of more and more components (such as printed circuit boards) connected to the component carrier increases, more and more powerful array-like components or packages with several components are being used, which have a plurality of contacts or connections, and the spacing between these contacts is smaller and smaller. In particular, the component carrier should have mechanical robustness and electrical reliability in order to operate even under severe conditions.

In particular, deformation, bending or warping of the component carrier is a problem in terms of reliability and performance. This is particularly important during reflow soldering, especially when soldering on the panel level.

Disclosure of Invention

A component carrier that can be manufactured with low warpage may be required.

According to an exemplary embodiment of the present invention, a handling device is provided for handling a component carrier structure of a preform comprising a plurality of (in particular still integrally connected) component carriers during a temperature treatment, in particular in a reflow oven, wherein the handling device comprises: a first clamp and a second clamp configured to receive a component carrier structure therebetween; an array of magnets forming part of one of the first and second clamps; and a plate (particularly a metal plate, such as a continuous or substantially continuous metal plate, or another highly mechanically stable (preferably thermally redirecting) material or body) forming part of the other of the first and second clamps, wherein the magnets are configured to create an attractive force with the plate (e.g., with the plate itself when the plate is made of a metal material, or with magnets attached to the plate when the plate is made of a non-magnetic material) to inhibit deformation of the component carrier structure therebetween.

According to another exemplary embodiment of the present invention, a handling device for a component carrier structure of a preform comprising a plurality of (in particular still integrally connected) component carriers during a temperature treatment, in particular in a reflow oven, is provided, wherein the handling device comprises: a first clamp and a second clamp configured for receiving a component carrier structure therebetween; and a support structure forming part of at least one of the first clamp and the second clamp and comprising a plurality of bars arranged between the preforms of different component carriers and supporting the component carrier structure.

According to yet another exemplary embodiment of the present invention, there is provided an arrangement comprising: an operating device having the above-described features; and a component carrier structure comprising a plurality of (especially still integrally connected) component carrier preforms of component carriers received between the first and second clamps.

According to still another exemplary embodiment of the present invention, there is provided a reflow oven for a component carrier structure of a preform including a plurality of component carriers, wherein the reflow oven includes: a handling device for handling a component carrier structure having the above-described features; and a heating unit for heating the manipulating device of the preform in which the component carrier is mounted.

According to a further exemplary embodiment of the present invention, a method for handling a component carrier structure of a preform comprising a plurality of component carriers during temperature processing, in particular in a reflow oven, is provided, wherein the method comprises: accommodating a component carrier structure between a first clamp and a second clamp of an operating device (in particular an operating device having the above-mentioned features); creating an attractive force between the array of magnets forming part of one of the first and second clamps and a plate (preferably a metal plate) forming part of the other of the first and second clamps; and heating the handling device of the preform with the component carrier for temperature treatment, in particular for reflow soldering.

According to a further exemplary embodiment of the present invention, a method of handling a component carrier structure comprising a plurality of component carrier preforms during a temperature process, in particular in a reflow oven, is provided, wherein the component carrier structure is accommodated in a first fixture and a second fixture of a handling device, in particular a handling device having the above-mentioned features, the component carrier structure is supported by a support structure of at least one of the first fixture and the second fixture, the support structure comprising a plurality of bars arranged between the preforms of different component carriers, and the handling device is heated with the component carrier preforms for the temperature process, in particular for reflow soldering.

In the context of the present application, the term "component carrier" may particularly denote any support structure capable of accommodating one or more components thereon and/or therein to provide mechanical support and/or electrical connection. In other words, the component carrier may be configured as a mechanical and/or electrical carrier for the component. In particular, the component carrier may be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. The component carrier may also be a hybrid board combining different ones of the above types of component carriers.

In the context of the present application, the term "component carrier structure" may particularly denote a sheet that is handled and processed during the manufacture of a component carrier, such as a panel or an array of component carriers. In particular, the preforms of the component carrier may be integrally connected and may thus form part of an integral component carrier structure, for example still be present on the panel level.

In the context of the present application, the term "handling device for handling a component carrier structure" may particularly denote the following apparatus: the apparatus is configured for holding a component carrier structure (such as a PCB panel) while the component carrier is being processed, particularly at the high temperatures that may occur in a reflow oven. Such manipulation may be performed in a controlled manner, in particular for maintaining the component carrier structure in a predefined shape, position and orientation.

In the context of the present application, the term "clip" may particularly denote a base or cover member configured for cooperation with another clip to define a receiving space therebetween configured for holding a sheet-shaped component carrier structure, such as a PCB panel. In other words, each clip may contribute to a receiving space defined between two mating clips and shaped and sized to receive a component carrier structure. Furthermore, mating the clips may include providing in a manner that is capable of holding the clips together in a stable, predefined configuration.

In the context of the present application, the term "deformation-inhibiting" or "planarizing" component carrier structure may particularly denote a tendency of attractive magnetic forces for inhibiting warpage, bending and wrinkling of e.g. a PCB panel light sheet-shaped component carrier structure, such as a PCB panel. To achieve this, the arrangement of clamps may apply a force to the component carrier structure to maintain the planar flat shape of the component carrier structure.

In the context of the present application, the term "rod" may particularly denote an elongated physical body, e.g. configured as a strip or web (web), and configured for supporting a component carrier structure while being accommodated between the clamps. For example, the width of the individual bars may be in the range of 0.1mm to 1mm, in particular in the range of 0.3mm to 0.5 mm.

In the context of the present application, the term "temperature treatment" may particularly denote a heat treatment or one or more processes (e.g. in a reflow oven) subject to (particularly significant) temperature variations of the component carrier structure.

In the context of the present application, the term "reflow oven" may particularly denote a device for handling component carrier structures such as PCB panels during reflow soldering. In other words, the reflow oven may be configured to bring the component carrier structure being manipulated by the manipulating device to a temperature at which solder of the component carrier structure may melt. In particular, the reflow oven may be configured for heating the component carrier structure to a temperature of at least 200 ℃, in particular at least 250 ℃, more in particular at least 270 or even 290 ℃ or higher. The reflow oven may include multiple zones that may be individually temperature controlled. For example, the reflow oven may include several heating zones followed by one or more cooling zones, wherein the component carrier structure may be moved through the reflow oven on a conveyor belt or the like, and thus may be subjected to a controlled time-temperature profile. The one or more heating units of the reflow oven may be embodied as one or more infrared heaters (which may transfer heat to the component carrier structure by radiation in the infrared wavelength range). The heating unit of the reflow oven that uses one or more fans to push heated air toward the component carrier structure may be denoted as an infrared convection heating unit. Reflow soldering may refer to a process of temporarily attaching one or more electronic components to their contact pads using a solder paste (such as a viscous mixture of powdered solder and flux), after which the entire assembly is subjected to controlled heating. The solder paste reflows in a molten state to form a permanent solder joint.

According to an exemplary embodiment of the present invention, a handling device for handling a component carrier structure, such as a panel of a preform comprising a plurality of component carriers, such as PCBs, printed circuit boards, is provided, which helps to stabilize the structure of the handled component carrier structure during high temperature processing, such as reflow soldering.

According to an exemplary embodiment of the first aspect of the invention, this may be achieved by holding the component carrier structure between two opposing clamps of the handling device, the clamps defining the receiving space of the component carrier structure and comprising a spatially distributed arrangement of magnets on one of the clamps. The magnet may utilize a (preferably metallic) plate of another clamp to create the attractive force. Such a clamp arrangement can be simply manufactured and allows for reliable prevention of undesired warping, wrinkling or bending of the manipulated component carrier structure. Thus, a well-defined and stable configuration of the component carrier structure is possible, allowing a high precision reflow soldering process.

According to embodiments of the second aspect of the invention, the handling device comprising two cooperating clamps for handling the component carrier structure during a heat treatment (e.g. reflow soldering) may be provided with an arrangement of bars located at least one of the clamps, which may in particular extend parallel and/or perpendicular to each other to define a mechanically stable support structure. This may ensure that the component carrier structure is reliably held in the predefined configuration during handling, whereby undesired warping, wrinkling or bending of the component carrier structure may be reliably prevented. The array of bars located at least one of the clamps may also positively influence the thermal performance of the handling device during high temperature processing (e.g. about 100 ℃, in particular above 200 ℃) because proper heat transfer to the accommodated component carrier structure can be achieved by this design.

Thus, according to an exemplary embodiment of the present invention, a handling device is provided, comprising two mating clamps for holding and transporting a plate-type component carrier structure. The handling device may include a bottom clamp and a top clamp. The bottom clamp may include an embedded magnet capable of magnetically attracting the top clamp to the bottom clamp. An advantage of such a magnetic connection is that the component carrier structure can be easily attached to or detached from the handling device. Further, undesired deformation (such as warpage) of the plate-like member carrier structure can be reliably prevented. In addition, undesired disassembly of the handling device can be prevented by the magnetic biasing force. Furthermore, the effective heat capacity can be reduced by the frame-shaped design of at least one of the clamps, which can be provided by the provision of the rods. The component carriers, in particular substrates or printed circuit boards, can be placed on the jigs on the panel level and after the heat treatment, in particular reflow treatment, the panel or the individual component carriers can be removed from the jigs.

Detailed description of exemplary embodiments

Hereinafter, further exemplary embodiments of the handling device, method, arrangement and reflow oven will be explained.

When the handling device is configured with an arrangement of cooperating magnets and metal plates, levers are provided with recesses between them, which can cooperate for flattening and supporting the component carrier structure during handling in the reflow oven, while ensuring reliable reflow soldering. The mating metal plates and magnets may create attractive magnetic forces, while the stem of at least one of the clamps may promote thermal performance. Together, these two measures ensure that component carriers with high thermal, mechanical and electrical reliability are produced.

In an embodiment, the array of magnets is formed as part of only one of the first or second clamps, without magnets being arranged at the respective other clamp. This may be suitable, for example, when the other clamp comprises a metal plate.

In other embodiments, the array of magnets is formed as part of each of the first clamp and the second clamp. For example, if no metal plate is used for the respective clamps, magnets may be provided on both clamps (in particular on both clamp plates). Instead of metal, non-metallic materials may be used for the plates. The nonmetallic material may cooperate with a magnet to provide a magnetic force to manipulate the substrate.

In one embodiment, the plate is made of a material that supports heat distribution and/or redirection of component carrier structures. Preferably, the plate is a metal plate. However, the plate may also comprise a material such as a glass compound.

In one embodiment, the magnet is connected to the support structure. The connection of the magnets to the support structure may ensure that an attractive magnetic force and a supporting mechanical force are provided at corresponding areas of the handling device, so that the corresponding forces may act together to hold the component carrier structure in a flat and predefined configuration while being able to reliably heat. In particular, when the support structure comprises an array of first and second bars oriented perpendicular to each other, a high mechanical retention force can be produced when the resulting grid-like arrangement cooperates with magnets arranged at the intersection of each horizontal bar with each vertical bar.

In one embodiment, the magnet forms part of the bottom clamp and the metal plate forms part of the top clamp. For example, the bottom clamp may comprise the entire arrangement of magnets and may be devoid of a continuous metal plate, while the top clamp may comprise a substantially continuous metal plate and may be devoid of magnets. Thus, a high magnetic coupling force can be generated, but the top jig can be kept thin, which is advantageous in terms of stability. Furthermore, this configuration may ensure that the temperature gradient across the panel may remain small.

In one embodiment, the magnet is made of a material having a curie temperature of at least 200 ℃, in particular at least 250 ℃. As known to those skilled in the art, the curie temperature or curie point is the temperature at which a material loses its permanent magnetic properties. To be suitable for use in a reflow oven, the curie temperature of the magnet should be higher than the temperature of reflow soldering. When magnets with curie temperatures above 250 ℃ are used, the magnets and thus the whole handling device may be suitable for reflow soldering.

In an embodiment, the force applied to the component carrier structure by the attractive force generated by the magnet and the metal plate is at least 10N, in particular at least 20N. By generating a force of at least 10N, and preferably at least 20N, the handling device can ensure that the sheet-shaped component carrier structure is reliably held in a flat or planar structure and does not tend to bend or buckle during handling and in particular during reflow soldering. At the same time, such forces are sufficiently modest to prevent undesirable mechanical shock deterioration of the structure of the component carrier structure.

In one embodiment, the magnet is made of a permanent magnet material. When the magnet is made of a permanent magnetic material, such as a ferromagnetic material or a ferrimagnetic material, it is sufficient to avoid the necessity of a continuous re-magnetization of the magnet. This results in a simple configuration of the handling device.

In one embodiment, the support structure is made of a thermally conductive material. For example, the material of the support structure may be made of a material having a thermal conductivity of at least 10W/mK, in particular at least 50W/mK, preferably at least 100W/mK. In a preferred embodiment, the metal clip may be made of an aluminum alloy because it has a high thermal conductivity of, for example, 200W/mK or more. In general, the higher the thermal conductivity, the better. For example, the support structure may be made of metal to provide such good thermal conductivity. Thus, for example, a grid-like support structure may thus function to thermally balance potential temperature differences along the manipulated component carrier structure. For example, heat may be removed from hot spots of the component carrier structure by the support structure and may be provided to cold spots thereof. This avoids any undesirable thermal gradients of the component carrier structure that may cause undesirable phenomena such as warpage.

In one embodiment, the rods extend parallel to each other. For example, all the rods may extend parallel to each other horizontally or vertically. This may ensure a simple configuration of the handling device while at the same time ensuring that the supporting forces are properly applied from the handling device to the component carrier structure.

In another embodiment, the bars comprise first bars extending parallel to each other along a first direction and comprise second bars extending parallel to each other along a second direction perpendicular to the first direction, such that the bars form a grid with recesses. In particular, each recess in the grid may correspond to one component carrier or its central portion. The surface portions of the respective component carriers corresponding to the respective recesses may correspond to component carrier regions on which components (such as semiconductor dies) are to be surface-mounted. Solder paste may be applied to the component carrier area. According to such a preferred arrangement, the grid of bars extending in two perpendicular directions may form a grid for reliably supporting the component carrier structure. When the dimensions of each recess defined by the pair of first bars and the pair of second bars correspond to the dimensions of the currently manufactured component carrier or preform of the component carrier, it can be ensured that the holding means do not contact the component carrier structure in its functional part. In contrast, it can then be ensured that the support structure is only in contact with the component carrier structure to be planarized and supported in the region between such functionally useful regions of the component carrier.

In an embodiment, each of the first and second clamps comprises a pin that applies a connecting force from two opposite main surfaces to the component carrier structure, in particular pressing on the component carrier structure. In particular, such pins, which are sandwiched between the component carriers, may be the only physical bodies in direct physical contact with the component carrier structure housed in the handling device. Advantageously, the pins provided at one or both of the two clamps may define a position where the component carrier structure is in direct physical contact with the handling device during use, for example clamped between the pins. Preferably, the component carrier structure may be free of any physical contact with the handling device at other locations than the pins. This can reliably prevent any damage to the component carrier structure at positions other than the pins during handling and reflow soldering.

In an embodiment, the pin of one of the first clamp and the second clamp including the magnet is integrally formed with the magnet. In other words, a magnetic pin may be provided. Combining the pin and the magnet by combining them into a common structure can make the handling device compact and simple in construction. Furthermore, this can reduce the interval between the magnet and the metal plate, so that the provision of the magnetic pins can also enhance the connection force between the jigs and improve the force affecting the component carrier structure.

In an embodiment, at least part of the magnets are mounted on a grid at the intersection between a first bar extending parallel to each other along a first direction and a second bar extending parallel to each other along a second direction perpendicular to the first direction. The force transmission between the handling device and the component carrier structure is particularly advantageous when the magnet is mounted at its holder at the intersection of the grid of said holder.

In an embodiment, each of the first and second clamps comprises a support structure, each support structure comprising a plurality of rods, and in particular forms a grid. Preferably, a grid may be provided on both jigs, which grid may expose the preform of the component carrier on both opposite main surfaces of the component carrier during reflow soldering.

In an embodiment, only one of the first clamp and the second clamp comprises an array of magnets. This allows keeping the other clamp free of magnets, preferably the top clamp, simple and compact and allows reducing the thickness of the other clamp and the whole handling device.

In an embodiment, only one of the first clamp and the second clamp comprises a metal plate. Advantageously, the clamp with magnets (preferably the bottom clamp) may be devoid of continuous metal plates, which further contributes to the compact nature of the handling device.

In an embodiment, the first clamp and the second clamp are configured for applying a vertical fixing force to the component carrier structure only at a plurality of point connections, wherein in particular the point connections are located between preforms of adjacent component carriers. The point connection may be established by pins of two clamps, which pins are preferably aligned with each other. Providing a plurality of point connections rather than a large surface area connection may keep the clamping impact on the component carrier structure small.

In an embodiment, the heating unit is configured for heating the handling device of the preform with the component carrier up to at least 200 ℃, in particular at least 250 ℃. When the heating unit of the reflow oven is configured to heat the component carrier structure to above 200 ℃ and preferably above 250 ℃, the reflow oven may support reflow soldering with a number of different solder materials that may be applied to the component carrier structure.

In one embodiment, the surface of each of the component carrier preforms is provided with solder paste prior to reflow soldering. For example, solder paste may be applied to the component carrier structure by printing or dispensing or by stencil. In particular, the method may include surface mounting the component on solder paste of the preform of the component carrier before moving the component carrier structure in the reflow oven for reflow soldering. Such solder paste may contain solderable particles in a matrix of solvent or the like. Such solder paste may be processed in a reflow oven to enable the component carrier structure, and in particular its component carrier, to be soldered with surface mounted components such as capacitor components or semiconductor chips.

In an embodiment, the component carrier comprises a stack of at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier may be a laminate of the mentioned electrically insulating layer structure(s) and electrically conductive layer structure(s), which is formed in particular by the application of mechanical pressure and/or thermal energy. The mentioned stack may provide a plate-shaped component carrier that is capable of providing a large mounting surface for further components and that is still very thin and compact.

In one embodiment, the component carrier is shaped as a plate. This contributes to a compact design, wherein the component carrier still provides a larger base for mounting components thereon. Further, in particular, the bare die, as an example of the embedded electronic component, can be conveniently embedded in a thin plate such as a printed circuit board due to its small thickness.

In an embodiment, the component carrier is configured as one of the group consisting of a printed circuit board, a substrate (in particular an IC substrate) and an interposer.

In the context of the present application, the term "printed circuit board" (PCB) may particularly denote a board-shaped component carrier, which is formed by laminating a number of electrically conductive layer structures with a number of electrically insulating layer structures (e.g. by applying pressure and/or by supplying thermal energy). As a preferred material for PCB technology, the electrically conductive layer structure is made of copper, whereas the electrically insulating layer structure may comprise resin and/or glass fibres, so-called prepreg or FR4 material. The various conductive layer structures may be connected to each other in a desired manner by: forming a through hole through the laminate, for example by laser drilling or mechanical drilling; and partially or fully filling them with a conductive material, in particular copper, to form a via or any other via connection. The filled holes connect the entire stack (through-hole connections extending through several layers or the entire stack), or the filled holes connect at least two conductive layers, called vias. Similarly, optical interconnects may be formed through the various layers of the stack to receive an electro-optic circuit board (EOCB). In addition to one or more components that may be embedded in a printed circuit board, the printed circuit board is typically configured to house the one or more components on one or both opposing surfaces of the board-shaped printed circuit board. These components may be attached to the respective major surfaces by welding. The dielectric portion of the PCB may be composed of a resin with reinforcing fibers (e.g., glass fibers).

In the context of the present application, the term "substrate" may particularly denote a small component carrier. The substrate may be a relatively small component carrier, relative to the PCB, on which one or more components may be mounted, and which may act as a connection medium between the chip(s) and another PCB. For example, the substrate may have substantially the same dimensions as the components to be mounted thereon (particularly electronic components) (e.g., in the case of Chip Scale Packages (CSPs)). More specifically, a substrate may be understood as a carrier for an electrical connection or electrical network as well as a component carrier comparable to a Printed Circuit Board (PCB), but having a rather high density in laterally and/or vertically arranged connections. The lateral connection may be, for example, a conductive path, while the vertical connection may be, for example, a borehole. These lateral and/or vertical connections are arranged within the substrate and may be used to provide electrical, thermal and/or mechanical connection of packaged or unpackaged components, such as bare dies, in particular an IC chip, to a printed circuit board or an intermediate printed circuit board. Thus, the term "substrate" also includes "IC substrate". The dielectric portion of the substrate may be composed of a resin with reinforcing particles, such as reinforcing spheres, particularly glass spheres.

The substrate or interposer may include or consist of: at least one layer of glass; silicon (Si) and/or photoimageable or dry etchable organic materials such as epoxy-based laminates (such as epoxy-based laminates films) or polymeric compounds (which may or may not contain photosensitive and/or thermosensitive molecules), such as polyimides or polybenzoxazoles.

In an embodiment, the at least one electrically insulating layer structure comprises at least one of the group consisting of: resins or polymers such as epoxy resins, cyanate ester resins, benzocyclobutene resins, bismaleimide-triazine resins, polyphenylene ether derivatives (e.g., based on polyphenylene ether, PPE), polyimide (PI), polyamide (PA), liquid Crystal Polymers (LCP), polytetrafluoroethylene (PTFE), and/or combinations thereof. Reinforcing structures made of glass (multiple layer glass), such as webs, fibers, spheres or other types of filler particles, for example, may also be used to form the composite. The combination of a semi-cured resin and a reinforcing agent (e.g., fibers impregnated with the above resins) is referred to as a prepreg. These prepregs are generally named for their properties, such as FR4 or FR5, which are used to describe their flame retardant properties. While prepregs, particularly FR4, are generally preferred for rigid PCBs, other materials, particularly epoxy-based laminates (such as laminates) or photoimageable dielectric materials, may also be used. For high frequency applications, high frequency materials such as polytetrafluoroethylene, liquid crystal polymers, and/or cyanate ester resins may be preferred. In addition to these polymers, low Temperature Cofired Ceramics (LTCC) or other low, very low or ultra low DK materials may also be used as electrically insulating structures in component carriers.

In an embodiment, the at least one conductive layer structure comprises at least one of the group consisting of: copper, aluminum, nickel, silver, gold, palladium, tungsten, and magnesium. Although copper is generally preferred, other materials or coated versions thereof are also possible, particularly coated with a superconducting material or conductive polymer, such as graphene or poly (3, 4-ethylenedioxythiophene) (PEDOT), respectively.

The at least one component that may be surface mounted on and/or may be embedded within the component carrier may be selected from the group consisting of: a non-conductive inlay, a conductive inlay (e.g., a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (e.g., a heat pipe), a photoconductive element (e.g., an optical waveguide or a photoconductive connector), an electronic component, or a combination thereof. The inlay may be, for example, a metal block with or without a coating of insulating material (IMS inlay), which may be embedded or surface mounted for facilitating heat dissipation. Suitable materials are defined in terms of their thermal conductivity, which should be at least 2W/mK. Such materials are typically based on, but are not limited to, metals, metal oxides and/or ceramics, such as copper, aluminum oxide (Al ₂ O ₃ ) Or aluminum nitride (AlN). Other geometries with increased surface area are also often used in order to increase heat exchange capacity. Furthermore, the components may be active electronic components (having implemented at least one p-n junction), passive electronic components (such as resistors, inductors, or capacitors), electronic chips, memory devices (e.g., DRAM or other data storage device), filters, integrated circuits (such as Field Programmable Gate Array (FPGA), programmable Array Logic (PAL), general purpose array logic (GAL), and Complex Programmable Logic Device (CPLD)), signal processing components, power management components (such as Field Effect Transistors (FETs), metal Oxide Semiconductor Field Effect Transistors (MOSFETs), complementary Metal Oxide Semiconductors (CMOS), junction Field Effect Transistors (JFETs), or Insulated Gate Field Effect Transistors (IGFETs)), all based on semiconductor materials such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga ₂ O ₃ ) Indium gallium arsenide (InGaAs) and/or anyOther suitable inorganic compounds), optoelectronic interface elements, light emitting diodes, photocouplers, voltage converters (e.g., DC/DC converters or AC/DC converters), cryptographic components, transmitters and/or receivers, electromechanical converters, sensors, actuators, microelectromechanical systems (MEMS), microprocessors, capacitors, resistors, inductors, batteries, switches, cameras, antennas, logic chips, and energy harvesting units. However, other components may be embedded in the component carrier. For example, a magnetic element may be used as the member. Such magnetic elements may be permanent magnetic elements (such as ferromagnetic elements, antiferromagnetic elements, multiferroic elements or ferrimagnetic elements, e.g. ferrite cores) or may be paramagnetic elements. However, the component may also be an IC substrate, interposer or another component carrier, for example in a board-to-board configuration. The component may be surface mounted on the component carrier and/or may be embedded within it. In addition, other components, particularly those that generate and emit electromagnetic radiation and/or are sensitive to electromagnetic radiation propagating from the environment, may also be used as components.

In one embodiment, the component carrier is a laminate component carrier. In such embodiments, the component carriers are composites of multi-layer structures that are stacked and joined together by the application of pressure and/or heat.

After the treatment of the inner layer structure of the component carrier, one or both opposite main surfaces of the treated layer structure may be symmetrically or asymmetrically covered (in particular by lamination) with one or more further electrically insulating layer structures and/or electrically conductive layer structures. In other words, lamination may continue until the desired number of layers is achieved.

After the formation of the stack of electrically insulating and electrically conductive layer structures is completed, the resulting layer structure or component carrier may be surface treated.

In particular, an electrically insulating solder resist may be applied to one or both opposite major surfaces of the layer stack or component carrier. For example, such a solder resist may be formed over the entire major surface and the solder resist layer then patterned to expose one or more conductive surface portions that will serve to electrically couple the component carrier to the electronics periphery. The surface portion of the component carrier, particularly the surface portion containing copper, which remains covered with the solder resist can be effectively protected from oxidation or corrosion.

In terms of surface treatment, surface modification may also be selectively applied to the exposed conductive surface portions of the component carrier. Such surface modification may be a conductive covering material on exposed conductive layer structures (such as pads, conductive tracks, etc., in particular comprising or consisting of copper) on the surface of the component carrier. If such exposed conductive layer structures are not protected, the exposed conductive component carrier material (particularly copper) may oxidize, thereby reducing the reliability of the component carrier. The surface finish may then be formed, for example, as an interface between a surface mounted component and a component carrier. The surface modification has the function of protecting the exposed conductive layer structure, in particular the copper circuit, and enables the joining process with one or more components, for example by soldering. Examples of suitable materials for surface modification are Organic Solderability Preservative (OSP), electroless Nickel Immersion Gold (ENIG), electroless nickel immersion palladium gold (eniig), gold (particularly hard gold), electroless tin, nickel-gold, nickel-palladium, and the like.

Drawings

The aspects defined above and further aspects of the invention are apparent from the examples of embodiment to be described hereinafter and are explained with reference to these examples of embodiment.

Fig. 1 shows a cross-sectional view of a portion of a steering device according to an exemplary embodiment of the present invention.

Fig. 2 shows a side view of a component carrier structure before and after heat treatment in a handling device according to an exemplary embodiment of the invention.

Fig. 3 shows a side view of the component carrier structure before and after heat treatment in a conventional handling device.

Fig. 4 shows a plan view of a first gripper at the bottom side of a handling device according to an exemplary embodiment of the invention.

Fig. 5 shows a plan view of a topside second clamp for cooperation with the first clamp according to fig. 4.

Fig. 6 shows a bottom side first clamp of a handling device according to an exemplary embodiment of the invention.

Fig. 7 shows a top second clamp comprising a handling device according to the first clamp of fig. 6.

Fig. 8 shows different manufacturing stages to be performed during the method of manufacturing a component carrier according to an exemplary embodiment of the invention, including a reflow soldering stage.

Fig. 9 shows a detailed view of the lever of the second clamp of the manipulating device according to an exemplary embodiment of the present invention.

The illustrations in the figures are schematic. In different drawings, similar or identical elements are provided with the same reference signs.

Detailed Description

The exemplary embodiments will be described in further detail before referring to the accompanying drawings, which will be summarized based on some basic considerations of having developed exemplary embodiments of the present invention.

According to an exemplary embodiment of the first aspect of the present invention, a handling device with two cooperating clamps may be provided for facilitating planarization of a sheet-shaped component carrier structure during reflow soldering, wherein such handling device may comprise a magnet on one of the clamps and a metal plate on the other clamp. The attractive force between the magnet and the metal plate can reliably prevent warpage, wrinkling and bending of the component carrier structure. During reflow soldering, solder paste, solder bumps, or any other solder on the component carrier structure may be melted in order to surface mount the component on the component carrier of the component carrier structure (particularly the panel of the preform comprising the component carrier that is still integrally connected), such as a printed circuit board or an integrated circuit substrate.

According to an exemplary embodiment of the second aspect of the present invention, a handling device for handling a component carrier structure during reflow soldering is provided, the handling device comprising a pair of opposing clamps, one arranged above the component carrier structure to be handled and the other arranged below the component carrier structure to be handled. At least one (and preferably both) of the bottom clamp and the top clamp may comprise a grid-shaped support structure, for example, for applying a support force to the component carrier structure. At the same time, the recess in the support structure may leave at least part of the preform of the component carrier exposed, which may facilitate heat transfer back during flow welding and may inhibit the risk of damaging the preform of the component carrier due to excessive contact with the handling device.

Preferably, a grid of first bars extending in a first direction and second bars extending in another (preferably perpendicular) direction may be provided at one or both of the two clamps. The arrangement of such bars may be configured according to the panel dimensions such that each opening of such a grid may correspond to one printed circuit board or card or unit of, for example, a panel-type component carrier structure. Thus, not only the individual component carriers but also the entire panel can be properly supported by the grid. In particular, when such a grid is combined with an array of magnets on only one of the clamps, which cooperate in a manner that attracts the metal plate on the other clamp, a simple and compact handling device can be provided, wherein in particular the thickness of the clamp with the metal plate, preferably the top clamp, can be made very small. By avoiding magnets on the top clamp (which are preferably very thin), proper stability can be achieved. Furthermore, the described configuration may ensure that no significant temperature gradients are generated across the panel. Preferably, the metal plate of the top clamp may be made of iron or an aluminum alloy, i.e. a material that is magnetically attractable by the magnets of the other clamp. The magnet may be made of a permanent magnet material. During reflow soldering of the component carrier structure handled by the handling device, temperatures in the range of 200 ℃ to 290 ℃ may be applied, for example. Preferably, the permanent magnet material of the magnet is configured such that the attractive magnetic force of the magnet is maintained even at such high temperatures. Therefore, a magnetic material having a sufficiently high curie temperature should be used. Thanks to the arrangement of the handling device described above, an improved, in particular balanced, temperature profile of the component carrier structure during reflow soldering can be achieved.

Advantageously, each of the clamps may be provided with one or preferably more restraining pins which may clamp between the component carrier structures during use. Such pins may be positioned between surface areas of the component carrier structure where components such as semiconductor die are to be mounted by soldering. Correspondingly, the area of the solder bump or the like may also be located separately from the area of the clamp where the pin is engaged. This ensures proper stability and protects the component carrier structure from damage. Preferably, the bars of the support structure as well as the pins may be arranged at the parting line of the component carrier structure, i.e. the region where the component carrier structure is to be subsequently divided into individual component carriers. For example, the width of the bars may thus be in the range of 0.3mm to 0.5mm, i.e. the width of the grid lines may be very small.

When the support structure is configured as a grid comprising rods extending in a first direction and additional rods extending perpendicular thereto, the handling device may be made particularly suitable for high temperature applications, as such grid design may facilitate uniform heat supply, heat removal, heat balance and heat diffusion. In other words, a suitable heat conducting grid with a matrix-like array of recesses between the bars constituting the grid may facilitate temperature balancing across the component carrier structure.

For high performance component carrier applications, particularly with respect to printed circuit boards and integrated circuit substrates, it is desirable to meet stringent specifications in terms of ground coplanarity (i.e., the level of warpage obtained). Meeting such stringent requirements typically involves a substantial risk of yield loss.

To overcome such drawbacks, exemplary embodiments provide a handling device for handling component carrier structures such as panels, which provides complete mechanical support for the processed component carrier structure based on two cooperating clamps. In particular, such handling devices are capable of pressing or clamping each substrate unit of the component carrier structure in place during high temperature processing to obtain excellent results in terms of ground coplanarity. At the same time, the yield obtained can be significantly increased when producing component carriers. In particular, exemplary embodiments of the present invention may improve efficiency and may keep manufacturing time short. Ground coplanarity can be achieved with very low effort. Accordingly, exemplary embodiments of the present invention provide a magnetic clamp pair for improving ground coplanarity of a manufactured component carrier.

For example, one of the clamps may be equipped with a plurality of magnets, for example 80 magnets of thickness 2 mm. The magnets may be embedded in a bottom clamp, for example 5mm thick, to hold a component carrier structure comprising a plurality of substrate units with the top clamp.

Furthermore, one or both of the clamps may be configured with a frame and pocket design to ensure that a preform of a component carrier of the component carrier structure is manufactured without shape bending during high temperature processing. In particular, providing magnets embedded in the bottom clamp may support even pressure exerted on the substrate unit from the top clamp. By the pocket design, each substrate unit can be supported by a bottom clamp. For example, a magnetic clamp having a pocket design may exert a force of about 20N on a substrate-type component carrier structure.

During high temperature processing (particularly during reflow soldering), the handling device according to exemplary embodiments of the present invention may ensure that all substrate units of the component carrier structure may be maintained in shape without risk of bending or warping. Highly advantageously, ground coplanarity (i.e., deviation of the ground or pads on the major surfaces of the stack from horizontal orientation) may be significantly improved.

Fig. 1 shows a cross-sectional view of a portion of a steering device 100 according to an exemplary embodiment of the present invention.

The handling device 100 is only partially shown in fig. 1 for handling a component carrier structure 102, such as a panel of dimensions 12 x 18 square inches or more, comprising a preform, such as a Printed Circuit Board (PCB) or an Integrated Circuit (IC) substrate, of a plurality of component carriers 104 at an elevated temperature of, for example, at least 200 ℃ during manufacturing. The handler 100 containing the component carrier structure 102 may preferably be processed in a reflow oven (see reference numeral 106 in fig. 8).

In the illustrated embodiment, the handling device 100 includes a first clamp 108 and a second clamp 110 that may be assembled with one another. The clips 108, 110 are configured for receiving the component carrier structure 102 therebetween. The first clamp 108 may be a bottom side clamp that supports the component carrier structure 102 from below. In contrast, the second clamp 110 may be a topside clamp disposed above the component carrier structure 102.

Advantageously, an array of magnets 112 forming part of the first clamp 108 may be provided for applying an attractive magnetic force to the second clamp 110. To make this possible, the second clamp 110 includes a metal plate 114 (e.g., made of iron) that is attracted to the magnet 112 of the first clamp 108. In the illustrated embodiment, the second clamp 110 does not have an embedded magnet. Thus, the magnets 112 may be configured to create an attractive force with the metal plate 114 to hold the clips 108, 110 together with the component carrier structure 102 clamped therebetween. This configuration allows the component carrier structure 102 to be kept flat during reflow soldering by suppressing any tendency to deform. In particular, any undesirable tendency to warp can be effectively suppressed, and excellent performance in terms of ground coplanarity can be obtained by the component carrier 104 that is easy to manufacture.

Fig. 1 shows a side view of the handling device 100, and in particular the position of the bottom side first clamp 108 and the position of the top side second clamp 110. The thickness D of the component carrier structure 102 handled by the handling device 100 may be, for example, about 0.6mm. The component carrier structure 102 is held between the constraining pins 124 formed at corresponding locations of both the bottom side first clamp 108 and the top side second clamp 110 such that respective portions of the component carrier structure 102 are engaged (e.g., clamped) between two opposing constraining pins 124 of the first clamp 108 and the second clamp 110, respectively.

Advantageously, the array of pins 124 of the first clamp 108 and the array of pins 124 of the second clamp 110 are spatially aligned with each other. This keeps the contact of the surface portions of the component carrier structure 102 with the clamps 108, 110 small and ensures that the force transfer from the handling device 100 to the component carrier structure 102 does not result in deformation of the component carrier structure.

Thus, the arrangement of the aligned constraining pins 124 of the clamps 108, 110 may ensure proper manipulation of the component carrier structure 102 at well-defined locations, while physical contact is avoided at other locations of the component carrier structure 102. This protects the portion 104 of the component carrier structure 102 that is subsequently formed (i.e., after the manufacturing process is completed and after separation) from damage. In addition to the direct physical pin contact holding the component carrier structure 102 in place and applied by the mating constraining pins 124, the attractive magnetic force between the lower magnet 112 and the upper metal plate 114 can create a connecting force between the clamps 108, 110. The fact that the pin 124 of the first clamp 108 is integrally formed with the magnet 112 further reduces the vertical distance between the magnet 112 and the metal plate 114, thereby also contributing to a high coupling force.

As can be derived from fig. 1, the first clamp 108 and the second clamp 110 are configured for applying a vertical fixation force to the component carrier structure 102 only at the plurality of point connections. Advantageously, the point connections may be located between the preforms of adjacent component carriers 104 (e.g., in the region of the separation line separating the panels into individual component carriers 104). By taking this measure, it can be ensured that the component carrier 104 is not damaged by the clamping forces exerted between the clamps 108, 110 on the component carrier structure 102. Preferably, the point connection is established by alignment pins 124 on two opposite sides of the component carrier structure 102. Further advantageously, the pin 124 of the first clamp 108 is configured as a magnetic pin, i.e. a pin formed by the magnet 112.

The support grid 120 (not shown in fig. 1, but shown in fig. 4-7) formed by the array of bars 118 may further increase stability and may aid in heat spreading and heat distribution during reflow soldering. Such a grid structure can also be provided in an operating device 100 according to fig. 1.

Fig. 2 shows a side view of the component carrier structure 102 before and after heat treatment in the handling device 100 according to an exemplary embodiment of the invention. Fig. 3 shows a side view of a component carrier structure 202 before and after heat treatment in a conventional handling device.

Referring first to the conventional method according to fig. 3, during the heat treatment, the treated component carrier structure 202 may be significantly deformed. In particular, as schematically indicated by arrow 204, the center of the component carrier structure 202 may be susceptible to excessive bending. This may be due to the design of the clamps of the manipulator without any support in the centre of the panel. Therefore, the shape of the substrate cannot be properly controlled according to fig. 3, which may cause significant defects. In particular, thermal loads acting on the component carrier structure 202 during reflow soldering may generally result in significant warpage of the component carrier structure 202.

To overcome such drawbacks, a handling device 100 schematically shown in fig. 2 is provided according to an exemplary embodiment of the present invention. Due to the illustrated pocket design, the component carrier structure 102 may remain substantially planar. Due to the precise retention of the component carrier structure 102 during reflow soldering, the handling device 100 ensures a substantially flat configuration of the properly supported component carrier structure 102 such that any tendency of the component carrier structure 102 to warp, buckle or bend can be strongly suppressed.

Fig. 4 shows a plan view of the bottom side first clamp 108 of the manipulator 100 according to an exemplary embodiment of the invention. Fig. 5 shows a plan view of a topside second gripper 110 of the handling device 100 with the first gripper 108 according to fig. 4.

As described above, the handling device 100 is used for handling a component carrier structure 102 comprising a plurality of preforms of component carriers 104 in a reflow oven 106 during the manufacture of the component carriers 104. The handler 100 includes a first clamp 108 and a second clamp 110 configured for receiving the component carrier structure 102 therebetween.

Further, a support structure 116 is provided at both the first clamp 108 and the second clamp 110. Each support structure 116 includes a plurality of rods 118 that are disposed between the preforms of the different component carriers 104 (when the assigned component carrier structure 102 is assembled to the handler 100) and support the component carrier structure 102. Preferably, the support structure 116 may be made of a thermally conductive material to improve thermal management during reflow soldering. For example, the material of the support structure 116 of each of the clamps 108, 110 may have a thermal conductivity of at least 10W/mK, preferably at least 50W/mK.

As described above, the first jig 108 is provided with the plurality of magnets 112 for generating the magnetic force attracting the metal plate 114 of the second jig 110. The magnets 112 create an attractive force with the metal plate 114 to planarize the component carrier structure 102 therebetween. In the illustrated embodiment, the magnet 112 is coupled to a support structure 116 of the first clamp 108. Preferably, the magnet 112 is made of a permanent magnet material. Advantageously, the magnet 112 is made of a material having a curie temperature of at least 250 ℃ such that the magnet 112 continues to generate attractive magnetic forces even at high temperatures, i.e., at the operating temperature of the reflow oven 106. The magnets 112 and the metal plates 114 may be configured such that the magnetic force applied to the component carrier structure 102 by the attractive force generated by the magnets 112 and the metal plates 114 is, for example, approximately 20N.

As shown in fig. 4 and 5, the rods 118 include first rods 118a extending parallel to each other along a first direction and include second rods 118b extending parallel to each other along a second direction perpendicular to the first direction such that the rods 118a, 118b form a grid 120 with recesses 122. Each recess 122 in the grid 120 may correspond to one component carrier 104 of the component carrier structure 102.

Very advantageously, as shown in fig. 1, each of the first clamp 108 of fig. 4 and the second clamp 110 of fig. 5 includes a pin 124 that applies a connecting force to the component carrier structure 102 from two opposing major surfaces. The pin 124 may be the only physical body of the handler 100 in direct physical contact with the component carrier structure 102 housed in the handler 100. This prevents the preform of the component carrier 104 from being damaged during handling.

Additional holes may be opened in the first clamp 108, as indicated at 150 in fig. 4, to further improve the reflow profile and handling. As indicated by reference numeral 112', edge magnets may be provided at corresponding locations of the first clamp 108 very close to the component carrier structure 102. As indicated by reference numeral 154, the size of the manually manipulated aperture may be increased (e.g., by forming one or more rectangular apertures) by the illustrated configuration of the bottom side first clamp 108.

Referring now to fig. 5, a top cover or second clamp 110 may allow for a widened hole (see reference numeral 156) to further improve the temperature profile and handling of the component carrier structure 102. As indicated by reference numeral 158, additional holes (e.g., 5 x 5 mm) may be opened during reflow soldering to optimize the temperature profile of the component carrier structure 102.

Fig. 6 shows the bottom side first clamp 108 of the manipulator 100 according to an exemplary embodiment of the invention. Fig. 7 shows a top second gripper 110 of the handling device 100 comprising the first gripper 108 according to fig. 6.

As shown in fig. 6, each recess 122 of the illustrated first clamp 108 corresponds to one component carrier 104 (e.g., a printed circuit board or an integrated circuit substrate) of the component carrier structure 102 that is manipulated by the corresponding manipulating device 100. During assembly reflow, the illustrated frame-shaped first clamp 108 may apply a connecting force of, for example, 20N to the component carrier structure 102 or the substrate. This is a sufficiently large value for ensuring planarization of the component carrier structure 102 and a sufficiently small value for avoiding excessive mechanical impact to the component carrier structure 102 to reliably prevent damage.

Fig. 8 illustrates various manufacturing stages during a production line process of manufacturing component carrier 104, including a reflow soldering stage, according to an exemplary embodiment of the present invention.

As indicated by reference numeral 170, the panel-type component carrier structure may first be subjected to solder paste printing, during which solder paste may be printed onto desired surface portions of the component carrier structure.

As can be further seen in fig. 8, the component carrier structure may then be moved along the wire conveyor direction 172. Next, the component carrier structure may be processed by a chip capacitor attaching unit that attaches a chip capacitor on the solder paste of each component carrier of the component carrier structure. This is indicated by reference numeral 174.

As can also be seen from fig. 9, the component carrier structure with solder paste applied and components attached (in this embodiment chip capacitors) can then be transported into a reflow oven 106, through which the component carrier structure held by the handling device according to an exemplary embodiment of the invention can then be transported. Reflow oven 106 is used to process the component carrier structure and includes a handling device and a heating unit 126 configured to heat the handling device holding the component carrier structure. By means of the heating unit 126, the handling device 100 with the component carrier structure 102 can be heated to preferably at least 250 ℃, so that an effective reflow soldering takes place.

On the inlet side of the reflow oven 106, the component carrier structure may be assembled in a handling device, see reference numeral 176.

As shown in reference numeral 178, the component carrier structure in the handler may be unloaded from the handler after reflow soldering, i.e., on the exit side of the reflow oven 106.

The combination of the magnetic attraction mechanism between the clamps 108, 110 and the grid support structure 116 described above may be advantageously implemented during a high temperature reflow oven process. Thanks to this implementation, the ground coplanarity of the obtained component carrier can be significantly improved and the yield can be significantly increased.

Fig. 9 is a detailed view of the lever 118 of the second clamp 110 of the manipulating device 100 according to an exemplary embodiment of the present invention.

As shown, the rods 118 include first rods 118a extending parallel to each other along a first direction and second rods 118b extending parallel to each other along a second direction perpendicular to the first direction such that the rods 118a, 118b form a grid 120 with recesses 122.

With respect to the vertical rods 118b, each of the vertical rods may include a central rod portion 160 disposed between two peripheral rod portions 162. Advantageously, the central shaft portion 160 may have a greater thickness than each of the two peripheral shaft portions 162. For example, the central shaft portion 160 may have a thickness of 5mm and a width L of 0.5 mm. Each of the peripheral stem portions 162 may have a thickness of 3mm and a width B of 0.25 mm. Other dimensions are also possible.

With reference to the horizontal bars 118a, each of them may accordingly include a central bar portion 164 disposed between two peripheral bar portions 166. Advantageously, the central stem portion 164 may have a greater thickness than the two peripheral stem portions 166. For example, the central stem portion 164 may have a thickness of 5mm and a width of 0.5 mm. Each of the peripheral stem portions 166 may have a thickness of 3mm and a width of 0.25 mm. Other dimensions are also possible.

Advantageously, the configuration of fig. 9 may result in a high rigidity of the second clamp 110.

It should be noted that the term "comprising" does not exclude other elements or steps and the "a" or "an" does not exclude a plurality. Furthermore, elements described in association with different embodiments may be combined.

It should also be noted that reference signs in the claims shall not be construed as limiting the scope of the claims.

The implementation of the invention is not limited to the preferred embodiments shown in the drawings and described above. On the contrary, many variations using the illustrated solutions and according to the principles of the present invention are possible even in the case of radically different embodiments.

Claims

1. A handling device (100) for handling a component carrier structure (102) of a preform comprising a plurality of component carriers (104) during a temperature treatment, wherein the handling device (100) comprises:

-a first clamp (108) and a second clamp (110) configured for receiving the component carrier structure (102) therebetween;

an array of magnets (112) forming part of one of the first clamp (108) and the second clamp (110);

-a plate (114), the plate (114) forming part of the other of the first clamp (108) and the second clamp (110); and

-a support structure (116) forming part of at least one of the first clamp (108) and the second clamp (110), and comprising a plurality of bars (118) for being arranged between preforms of different component carriers (104) and supporting the component carrier structure (102);

wherein the magnet (112) is configured for generating an attractive force with the plate (114) to inhibit deformation of the component carrier structure (102) between the magnet and the plate;

wherein the rods (118) comprise first rods (118 a) extending parallel to each other along a first direction, and the rods (118) comprise second rods (118 b) extending parallel to each other along a second direction perpendicular to the first direction, such that the rods (118) form a grid (120) with recesses (122); and

Wherein at least one of the first rod (118 a) and the second rod (118 b) has a central rod portion (160; 164) arranged between two peripheral rod portions (162; 166).

2. A handling device (100) for handling a component carrier structure (102) of a preform comprising a plurality of component carriers (104) during a temperature treatment, wherein the handling device (100) comprises:

and a support structure (116) forming part of at least one of the first clamp (108) and the second clamp (110) and comprising a plurality of bars (118) for being arranged between preforms of different component carriers (104) and supporting the component carrier structure (102),

3. The handling device (100) of claim 2, comprising an array of magnets (112) forming part of one of the first clamp (108) and the second clamp (110), and comprising a plate (114), the plate (114) forming part of the other of the first clamp (108) and the second clamp (110); wherein the magnet (112) is configured for generating an attractive force with the plate (114) to inhibit deformation of the component carrier structure (102) between the magnet and the plate.

4. A handling device (100) according to claim 1 or 3, wherein the plate (114) is made of the following materials: the material facilitates thermal distribution and/or thermal redirection of the component carrier structure (102).

5. A handling device (100) according to claim 1 or 3, wherein the plate (114) is a metal plate (114).

6. A handling device (100) according to claim 1 or 3, wherein the magnet (112) is connected to the support structure (116).

7. A handling device (100) according to claim 1 or 3, wherein the magnet (112) forms part of the first clamp (108) configured as a bottom side clamp, and wherein the plate (114) forms part of the second clamp (110) configured as a top side clamp.

8. A handling device (100) according to claim 1 or 3, wherein the magnet (112) is made of a material having a curie temperature of at least 200 ℃.

9. A handling device (100) according to claim 1 or 3, wherein the magnet (112) is made of a material having a curie temperature of at least 250 ℃.

10. A handling device (100) according to claim 1 or 3, wherein the attractive force generated by the magnet (112) and the plate (114) and applied to the component carrier structure (102) is at least 10N.

11. A handling device (100) according to claim 1 or 3, wherein the attractive force generated by the magnet (112) and the plate (114) and applied to the component carrier structure (102) is at least 20N.

12. A handling device (100) according to claim 1 or 3, wherein the magnet (112) comprises a permanent magnet material.

13. A handling device (100) according to claim 1 or 3, wherein the support structure (116) is made of a thermally conductive material.

14. The handling device (100) of claim 13, wherein the thermally conductive material has a thermal conductivity of at least 10W/mK.

15. The handling device (100) of claim 13, wherein the thermally conductive material has a thermal conductivity of at least 50W/mK.

16. The handling device (100) of claim 13, wherein the thermally conductive material has a thermal conductivity of at least 100W/mK.

17. The handling device (100) according to claim 1, wherein the central rod portion (160;

164 Has a greater than the two peripheral stem portions (162; 166 A) each of the large thicknesses.

18. The handling device (100) according to claim 1 or 2, wherein each recess (122) in the grid (120) corresponds to one component carrier (104).

19. The handling device (100) according to claim 1 or 2, wherein each of the first clamp (108) and the second clamp (110) comprises a pin (124) pressed against the component carrier structure (102) from two opposite main surfaces.

20. The handler (100) of claim 19, wherein the pin is the only physical body in direct physical contact with the component carrier structure (102) when the component carrier structure is housed in the handler (100).

21. The handling device (100) of claim 19, wherein the pin (124) of the one of the first clamp (108) and the second clamp (110) that includes the magnet (112) is integrally formed with the magnet (112).

22. The handling device (100) according to claim 1 or 2, wherein each of the first clamp (108) and the second clamp (110) comprises a support structure (116) comprising a plurality of rods (118).

23. The handling device (100) of claim 22, wherein the support structure forms the grid (120).

24. The handling device (100) according to claim 1 or 2, wherein only one of the first clamp (108) and the second clamp (110) comprises an array of magnets (112).

25. The handling device (100) according to claim 1 or 2, wherein only one of the first clamp (108) and the second clamp (110) comprises a plate (114).

26. A handling device (100) according to claim 1 or 3, wherein at least a portion of the magnets (112) are mounted on the grid (120) at an intersection between a first rod (118 a) extending parallel to each other in a first direction and a second rod (118 b) extending parallel to each other in a second direction perpendicular to the first direction.

27. The handling device (100) according to claim 1 or 2, wherein the first clamp (108) and the second clamp (110) are configured for applying a vertical fixing force to the component carrier structure (102) only at a plurality of point connections.

28. The handling device (100) of claim 27, wherein the point connection is located between preforms of adjacent component carriers (104).

29. A handling device (100) according to claim 1 or 3, wherein an array of magnets (112) is formed as part of only one of the first clamp (108) or the second clamp (110), or an array of magnets (112) is formed as part of each of the first clamp (108) and the second clamp (110).

30. An arrangement, comprising:

the handling device (100) according to any one of claims 1 to 29; and

a component carrier structure (102), the component carrier structure (102) comprising a preform of a plurality of component carriers (104) accommodated between the first clamp (108) and the second clamp (110).

31. The arrangement of claim 30, wherein the component carrier structure (102) comprises a unitary plate structure comprising a preform of the connected component carrier (104).

32. A reflow oven (106) for a component carrier structure (102), the component carrier structure (102) comprising a plurality of preforms of component carriers (104), wherein the reflow oven (106) comprises:

the handling device (100) according to any one of claims 1 to 29, for handling the component carrier structure (102) during reflow soldering; and

-a heating unit (126) configured for heating the component carrier structure (102) in the handling device (100) for reflow soldering.

33. The reflow oven (106) according to claim 32, wherein the heating unit (126) is configured for heating the component carrier structure (102) in the handling device (100) up to at least 200 ℃.

34. The reflow oven (106) according to claim 32, wherein the heating unit (126) is configured for heating the component carrier structure (102) in the handling device (100) up to at least 250 ℃.

35. A method of manipulating a component carrier structure (102) of a preform comprising a plurality of component carriers (104) during temperature processing, wherein the method comprises:

-accommodating the component carrier structure (102) between a first clamp (108) and a second clamp (110) of a handling device (100), the handling device being a handling device (100) according to any one of claims 1 to 29;

generating an attractive force between an array of magnets (112) forming part of one of the first clamp (108) and the second clamp (110) and a plate (114) forming part of the other of the first clamp (108) and the second clamp (110); and

the component carrier structure (102) in the handling device (100) is heated for reflow soldering.

36. A method of manipulating a component carrier structure (102) of a preform comprising a plurality of component carriers (104) during temperature processing, wherein the method comprises:

-supporting the component carrier structure (102) by a support structure (116) of at least one of the first clamp (108) and the second clamp (110), the support structure comprising a plurality of bars (118) arranged between preforms of different component carriers (104); and

37. The method according to claim 35 or 36, wherein the method comprises performing the temperature treatment in a reflow oven (106).

38. The method of claim 37, wherein the method comprises: solder paste is provided to a surface of a preform of each of the component carriers (104) prior to reflow soldering.

39. The method according to claim 38, wherein the method comprises: the component is surface mounted on the solder paste prior to reflow soldering.