KR101646546B1 - Jig for printed circuit board - Google Patents

Jig for printed circuit board Download PDF

Info

Publication number
KR101646546B1
KR101646546B1 KR1020150049166A KR20150049166A KR101646546B1 KR 101646546 B1 KR101646546 B1 KR 101646546B1 KR 1020150049166 A KR1020150049166 A KR 1020150049166A KR 20150049166 A KR20150049166 A KR 20150049166A KR 101646546 B1 KR101646546 B1 KR 101646546B1
Authority
KR
South Korea
Prior art keywords
circuit board
printed circuit
terminal
frame
upper frame
Prior art date
Application number
KR1020150049166A
Other languages
Korean (ko)
Inventor
백운재
Original Assignee
주식회사 큐디씨솔루션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 큐디씨솔루션 filed Critical 주식회사 큐디씨솔루션
Priority to KR1020150049166A priority Critical patent/KR101646546B1/en
Application granted granted Critical
Publication of KR101646546B1 publication Critical patent/KR101646546B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for a printed circuit board capable of fixing a printed circuit board and protecting a terminal during a process of manufacturing a printed circuit board, And a terminal protecting portion formed at a position corresponding to the terminal of the frame and protecting the terminal to prevent contamination of the terminal due to contamination.

Description

A jig for printed circuit board

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a jig for a printed circuit board, and more particularly, to a jig for a printed circuit board capable of fixing a printed circuit board and protecting a terminal during a process of manufacturing a printed circuit board.

A printed circuit board (PCB) can be regarded as a kind of electronic component element printed with wiring and arrangement space necessary for mounting a predetermined electronic component. Recently, a multi-layer substrate having two or more layers has been used.

When connecting electronic components to such a printed circuit board, a method of connecting the connection pattern of the surface through soldering without depending on the component hole is referred to as surface mounted technology. The surface mount technology can cope with the miniaturization of the parts and the tendency of the lead pins to be narrowed, and it is a very useful technology for the high density mounting and is now rapidly spreading.

Surface mount techniques are typically implemented using a reflow soldering machine. The reflow soldering machine melts the cream solder as it passes through the furnace where the soldering temperature is set with the chip parts mounted on the printed circuit board printed with the lead on the cream. This is a device that causes soldering to take place.

Meanwhile, in order to improve the productivity, the soldering operation is simultaneously performed on a plurality of printed circuit boards. Therefore, it is necessary to use a jig for a printed circuit board which can be mounted on a reflow soldering machine while fixing and supporting a plurality of printed circuit boards during a soldering operation by a reflow soldering machine.

However, in such a conventional jig for a printed circuit board, a flux phenomenon occurs due to a high temperature during the reflow process, and the flux is buried in the terminals of the printed circuit board. In addition, the terminal of the printed circuit board may be contaminated by the scattered contaminants when the other printed circuit board manufacturing process is proceeded, and the defects often occur due to terminal contamination of the printed circuit board.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a jig for a printed circuit board capable of fixing a printed circuit board and protecting a terminal during a process of manufacturing a printed circuit board, in order to solve various problems including the above problems. However, these problems are exemplary and do not limit the scope of the present invention.

According to an aspect of the present invention, there is provided a jig for a printed circuit board, comprising: a frame capable of receiving a printed circuit board having terminals formed on one side thereof; And a terminal protector formed at a position corresponding to the terminal of the frame and protecting the terminal to prevent contamination of the terminal due to contaminants scattered during the process.

According to an aspect of the present invention, the terminal protecting portion includes: a shielding portion spaced from the terminal of the printed circuit board by a distance in the first direction above the terminal; A first step protruding from the terminal of the printed circuit board by a first protruding length from a lower portion of the terminal so as to be spaced apart from the terminal by a second directional distance laterally of the terminal and being formed lower than an upper surface of the terminal; And a second step protruding from a lower side of the cover to a second protruding length so as to be spaced apart from the terminal of the printed circuit board by the second directional distance that is the side of the terminal and lower than the upper surface of the terminal; . ≪ / RTI >

According to an aspect of the present invention, the second height of the second step may be higher than the first height of the first step.

According to an aspect of the present invention, the frame further includes: a lower frame having the printed circuit board accommodating groove formed therein to accommodate a portion of the lower surface of the printed circuit board; And an upper frame on which the printed circuit board receiving groove is formed to receive a portion of the upper surface of the printed circuit board, A lower terminal protecting portion formed at a position corresponding to the terminal; And an upper terminal protector formed at a position corresponding to the terminal of the upper frame so as to protect the terminal on the upper surface of the printed circuit board.

According to an aspect of the present invention, the lower frame includes a printed circuit board inserted into a guide hole of the printed circuit board and guided to an alignment position of the printed circuit board so that the printed circuit board can be aligned in position, Alignment pins; An upper frame separation hole portion formed through the lower frame so as to allow the operator or the pickup device to push the upper frame through the lower frame at the lower surface of the lower frame to facilitate separation of the upper frame; An upper frame alignment pin for guiding the upper frame to a coupling position so that the upper frame can be coupled to a predetermined position when the upper frame is coupled to the lower frame; A fixing member for fixing the upper frame to the lower frame so that the upper frame is not separated after the upper frame is coupled to the lower frame; And a rail groove flap formed on a side surface of the lower frame so as to move along the rail groove of the process automation line when the process is performed.

According to an aspect of the present invention, the printed circuit board alignment pin is formed to have an upper diameter smaller than a lower diameter so that the printed circuit board alignment pin can be easily inserted into the guide hole of the printed circuit board, An inclined surface may be formed such that the outer surface of the printed circuit board alignment pin is inclined.

According to an aspect of the present invention, the upper frame alignment pin is disposed asymmetrically with respect to the center line of the frame so that the upper frame is not coupled in reverse when the upper frame is coupled to the lower frame .

According to an aspect of the present invention, the fixing member includes: a first magnetic body formed on the lower frame and having magnetic properties; And a second magnetic body formed on the upper frame and magnetically coupled to the first magnetic body so that the upper frame can be coupled by the magnetic force of the first magnetic body.

According to an aspect of the present invention, the lower frame is formed on the opposite side of the first magnetic body so that the lower frames are not attached to each other due to the magnetic force of the first magnetic body when the plurality of lower frames are stacked and stored, And a spacer spaced apart from the stacked lower frame so that the magnetic force of the first magnetic body does not pass.

According to an aspect of the present invention, the fixing member may include a coupling hook formed on a side surface of the lower frame and including a hook shape hooked to the upper frame, or a coupling hook having an elastic force, And may include a coupling clamp.

According to an embodiment of the present invention as described above, a printed circuit board terminal protecting portion is formed on a jig for a printed circuit board to prevent contamination of a printed circuit board terminal due to scattered contaminants in the process of manufacturing a printed circuit board . In addition, in order to connect electronic components to the printed circuit board, the terminal of the printed circuit board is protected by the terminal protecting part to prevent the flux from adhering to the printed circuit board terminal even if fluxing due to high temperature occurs during the reflow process . Therefore, it is possible to realize a jig for a printed circuit board having an effect of preventing a defect caused by contamination of a printed circuit board terminal and increasing the yield of a printed circuit board. Of course, the scope of the present invention is not limited by these effects.

1 is an exploded perspective view schematically showing a jig for a printed circuit board according to some embodiments of the present invention.
2 is a perspective view schematically showing a jig for a printed circuit board according to some embodiments of the present invention.
3 is a cross-sectional view schematically showing a jig for a printed circuit board according to some embodiments of the present invention.
4 is an exploded perspective view schematically illustrating a lower frame of a jig for a printed circuit board according to some embodiments of the present invention.
5 and 6 are cross-sectional views schematically showing a lower frame of a jig for a printed circuit board according to some embodiments of the present invention.
7 is an exploded perspective view schematically illustrating an upper frame of a jig for a printed circuit board according to some embodiments of the present invention.
8 is a cross-sectional view schematically showing an upper frame of a jig for a printed circuit board according to some embodiments of the present invention.
9 is a cross-sectional view schematically illustrating a terminal protection portion of a jig for a printed circuit board according to some embodiments of the present invention.
10 is a cross-sectional view schematically showing a terminal protecting portion of a jig for a printed circuit board according to another embodiment of the present invention.
11 is a cross-sectional view schematically showing a fixing member of a jig for a printed circuit board according to another embodiment of the present invention.
12 is a cross-sectional view schematically showing a fixing member of a jig for a printed circuit board according to still another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, It is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

FIG. 1 is an exploded perspective view schematically showing a jig 100 for a printed circuit board according to some embodiments of the present invention, FIG. 2 is an external perspective view schematically showing the jig 100 for the printed circuit board of FIG. 1 And Fig. 3 is a cross-sectional view schematically showing the jig 100 for the printed circuit board shown in Fig.

1 to 3, the jig 100 for a printed circuit board according to some embodiments of the present invention may largely include a frame 10 and a terminal protection portion 20. [ More specifically, for example, as shown in FIGS. 1 to 3, the jig 100 for a printed circuit board includes a frame 100 capable of accommodating a printed circuit board P having a terminal C formed on one side thereof (C) formed at a position corresponding to the terminal (C) of the frame (10) so as to prevent contamination of the terminal (C) And may include a terminal protection portion 20.

Here, the frame 10 may be a structure having adequate strength and durability capable of receiving and supporting the printed circuit board P. For example, the frame 10 may be a structure selected from a material selected from the group consisting of steel, stainless steel, aluminum, magnesium, and zinc. However, the frame 10 is not necessarily limited to those shown in Figs. 1 to 3, and members of extremely various materials capable of receiving and supporting the printed circuit board P can be applied.

1 to 3, the frame 10 of the jig 100 for a printed circuit board is mounted on the printed circuit board P so as to accommodate a part of the lower surface of the printed circuit board P, A lower frame 10-1 on which a substrate receiving groove is formed and an upper frame 10-2 on which the printed circuit board receiving groove is formed to receive a part of the upper surface of the printed circuit board P, The terminal protection unit 20 includes a lower terminal 10-1 formed at a position corresponding to the terminal C of the lower frame 10-1 so as to protect the terminal C on the lower surface of the printed circuit board P, The upper portion 10-2 of the upper frame 10-2 is formed at a position corresponding to the terminal C so as to protect the protection portion 20-1 and the terminal C on the upper surface of the printed circuit board P. [ And a protection unit 20-2.

Therefore, the jig 100 for a printed circuit board accommodates the printed circuit board P, and the terminal of the printed circuit board P, which is caused by contaminants scattered in the process of manufacturing the printed circuit board P, (10) including a terminal protecting portion (20) capable of preventing contamination of the terminal (C). Further, it is possible to support the printed circuit board (P) and mount it on the assembly line of the printed circuit board (P) or the reflow soldering machine.

Therefore, the jig 100 for a printed circuit board according to some embodiments of the present invention includes the frame 10 capable of receiving the printed circuit board P, And a terminal protection unit (20) for protecting the terminal (C) of the circuit board (P), wherein the printed circuit board (P) The terminal C of the terminal C can be protected to prevent the terminal C from being contaminated.

In order to connect electronic components to the printed circuit board P, the printed circuit board P may be received in the jig 100 for the printed circuit board and mounted on the reflow soldering machine. At this time, the terminal protecting portion 20 protects the terminal C of the printed circuit board P when fluxing occurs due to the high temperature during the soldering process, thereby preventing the flux from adhering to the terminal C . As a result, the terminal C of the printed circuit board P can be prevented from being contaminated by the foreign substance, so that the occurrence of defects of the printed circuit board P due to the terminal C can be reduced.

FIG. 4 is an exploded perspective view schematically showing the lower frame 10-1 of the jig 100 for the printed circuit board according to some embodiments of the present invention, and FIGS. 5 and 6 are cross- Sectional view schematically showing the lower frame 10-1 of the circuit board jig 100. Fig.

7 is an exploded perspective view schematically showing the upper frame 10-2 of the jig 100 for a printed circuit board according to some embodiments of the present invention, Sectional view schematically showing the upper frame 10-2 of the jig 100. Fig.

More specifically, for example, as shown in FIGS. 4 to 8, the lower frame 10-1 of the jig 100 for a printed circuit board is arranged such that the printed circuit board P is aligned A printed circuit board alignment pin 1 inserted into a guide hole H of the printed circuit board P and guided to an alignment position of the printed circuit board P so that the lower frame 10-1 So that an operator or a pick-up device can push the upper frame 10-2 through the lower frame 10-1 to facilitate separation of the upper frame 10-2, The upper frame 10-2 has an upper frame separation hole portion 2 formed so as to penetrate through the upper frame 10-1 and a lower frame 10-2, An upper frame alignment pin 3 guiding the upper frame 10-1 to a coupling position so as to be coupled to the upper frame 10-1, (4) for fixing the upper frame (10-2) to the lower frame (10-1) so that the upper frame (10-2) is not separated after the lame (10-2) And a rail groove wing 5 formed on a side surface of the lower frame 10-1 so as to move along the rail groove of the process automation line.

For example, the printed circuit board alignment pin 1 may be easily inserted into the guide hole H of the printed circuit board P, The inclined surface may be formed such that the outer surface of the PCB 1 is inclined.

More specifically, for example, the printed circuit board alignment pin 1 may have a conical shape with an inclined surface formed on its outer surface. Therefore, the upper diameter of the printed circuit board alignment pin 1 is formed to be much smaller than the guide holes H of the printed circuit board P so that the printed circuit board alignment pins 1 are inserted into the guide holes H, As shown in FIG. The lower diameter of the printed circuit board alignment pin 1 is formed to be substantially equal to the diameter of the guide hole H of the printed circuit board P, H of the printed circuit board P is completely inserted into the printed circuit board alignment pin 1 so that a gap is hardly generated between the lower portion of the printed circuit board alignment pin 1 and the guide hole H of the printed circuit board P The shaking of the printed circuit board P can be prevented.

For example, the upper frame alignment pin 3 may be formed so that when the upper frame 10-2 is coupled to the lower frame 10-1, The alignment pins 3 can be arranged asymmetrically with respect to the center line of the frame 10. [

More specifically, for example, the lower frame 10-1 includes a plurality of upper frame alignment pins (not shown) so that the upper frame 10-2 can be coupled to the lower frame 10-1 at a predetermined position 3). At this time, the upper frame 10-2 may include a plurality of upper frame alignment holes corresponding to the upper frame alignment pins 3. The plurality of upper frame alignment pins 3 and the plurality of upper frame alignment holes may be arranged asymmetrically with respect to the center line of the frame 10.

When the upper frame 10-2 is connected to the lower frame 10-1 upside down, the upper frame alignment pin 3 and the upper frame alignment holes are not aligned with each other, Can be prevented from being coupled upside down to the lower frame 10-1.

For example, the fixing member 4 includes a first magnetic body 4a formed on the lower frame 10-1 and having magnetic properties and a second magnetic body 4b formed on the upper frame 10- And a second magnetic body 4b formed on the upper frame 10-2 and magnetically coupled to the first magnetic body 4a so that the first magnetic body 4a and the second magnetic body 4b can be coupled with each other.

More specifically, for example, the first magnetic body 4a of the lower frame 10-1 may be a magnet member and the second magnetic body 4b of the upper frame 10-2 may be a metal member. Therefore, when the upper frame 10-2 is coupled to the lower frame 10-1, the metal member is attached to the magnet member by the magnetic force of the magnet member, (10-1). Conversely, the first magnetic body 4a of the lower frame 10-1 may be a metal member, and the second magnetic body 4b of the upper frame 10-2 may be a magnet member.

In addition, the lower frame 10-1 can prevent the lower frames 10-1 from sticking to each other due to the magnetic force of the first magnetic body 4a when a plurality of the lower frames 10-1 are stacked and stored And a spacer 6 formed on the opposite side of the first magnetic body 4a and spaced apart from the stacked lower frame 10-1 so that the magnetic force of the first magnetic body 4a is not exceeded. Also, the spacer 6 may be included in the upper frame 10-2 for the same reason as described above.

The jig 100 for a printed circuit board includes the printed circuit board alignment pin 1 for guiding an alignment position of the printed circuit board P and fixing the printed circuit board P so as not to be shaken , The printed circuit board P can be easily mounted on the lower frame 10-1 and the printed circuit board P can be prevented from shaking after being placed on the lower frame 10-1.

When the upper frame 10-2 is separated from the lower frame 10-1 with the upper frame separation hole portion 2, the upper frame 10- 2) can be easily separated by pushing them with a finger or a pin.

The upper frame 10-2 includes the upper frame alignment pin 3 so that the upper frame 10-2 can be coupled to the lower frame 10-1 at a predetermined position, The upper frame 10-2 is coupled to the lower frame 10-1 so as to prevent the lower frame 10-1 from being separated after being coupled to the frame 10-1. (10-2) can be prevented from being shaken or separated. The rail groove wing portion 5 is provided to move along the rail groove of the process automation line during the process of assembling the printed circuit board P so that the frame 10 fixes the printed circuit board P So that the automated assembly process can be carried out.

Therefore, in the jig 100 for a printed circuit board according to some embodiments of the present invention, the frame 10 is divided into the lower frame 10-1 and the upper frame 10-2, It is possible to easily mount the circuit board P to the frame 10. When the printed circuit board P is mounted on the frame 10, the printed circuit board P is mounted at a predetermined position via the printed circuit board alignment pin 1, P can be prevented from being shaken in the frame 10.

The lower frame 10-1 may include the upper frame alignment pin 3 so that the upper frame 10-2 can be coupled to a predetermined position, It is possible to prevent the upper frame 10-2 from being separated by the fixing member 4 after being coupled to the frame 10-1. This prevents the upper frame 10-2 from being improperly engaged or separated from the lower frame 10-1 during the process of assembling the printed circuit board P, It is possible to prevent the semiconductor wafer 10 from deviating from the process.

The printed circuit board P and the upper frame 10-2 are fixed to the lower frame 10-1 by the printed circuit board alignment pin 1 and the upper frame alignment pin 3 at an accurate position The position of the terminal C of the printed circuit board P and the terminal protecting portion 20 are changed so that the terminal C is prevented from being exposed to protect the terminal C more effectively can do.

9 is a cross-sectional view schematically showing the terminal protecting portion 20 of the jig 100 for a printed circuit board according to some embodiments of the present invention.

9, the terminal protection portion 20 is formed on the printed circuit board P so as to be separated from the terminal C of the printed circuit board P in a first direction A shielding portion 21 which is spaced apart from the terminal C by a distance L1 and a second distance L2 spaced from the terminal C of the printed circuit board P by a distance in the second direction, (22) protruding from a lower portion of the blocking portion (21) to a first protruding length (H1) so as to be formed lower than the upper surface of the printed circuit board (C) Is spaced apart from the terminal C by the second directional separation distance L2 and is formed so as to be lower than the upper surface of the terminal C by the second protruding length H2 from below the closure 21 And may include a second step 23 protruding therefrom.

The terminal protection portion 20 of the jig 100 for a printed circuit board is provided with a terminal C for protecting the terminal C of the printed circuit board P, A first protruding length 22 and a second protruding length H2 having a first protruding length H1 from below the closure 21, And the terminal C can be protected in such a manner as to surround the terminal C. [0031] As shown in FIG.

Therefore, the terminal (C) of the printed circuit board (P) can be protected without being in contact with the terminal protecting portion (20). As a result, the terminal protection portion 20 contacts the terminal C and the terminal C is damaged or short-circuiting occurs between the terminals C, thereby causing a failure of the printed circuit board P Can be prevented.

10 is a cross-sectional view schematically showing the terminal protecting portion 20 of the jig 100 for a printed circuit board according to another embodiment of the present invention.

10, the second protruding length H2 of the second step 23 is higher than the first protruding length H1 of the first step 22, for example, . Therefore, the second step 23 can be further extended toward the printed circuit board P to more effectively protect the terminal C of the printed circuit board P.

FIG. 11 is a cross-sectional view schematically showing the fixing member 4 of the jig 100 for a printed circuit board according to another embodiment of the present invention, and FIG. 12 is a cross- Sectional view schematically showing the fixing member 4 of the circuit board jig 100. Fig.

More specifically, for example, as shown in FIGS. 11 and 12, the fixing member 4 of the jig 100 for a printed circuit board is formed on a side surface of the lower frame 10-1, A coupling hook 4c having an elastic force including a hook shape hooked to the upper frame 10-2 or a clamp 4d for simultaneously hooking the lower frame 10-1 and the upper frame 10-2, ).

The fixing member 4 of the jig 100 for a printed circuit board is fixed to the lower frame 10-1 by the coupling hook 4c or the clamp 4d. To be separated from each other. Therefore, when the upper frame 10-2 is stably fixed to the lower frame 10-1, the frame 10 is separated from the printed circuit board P P can be prevented from being detached.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

1: Printed circuit board alignment pin
2: upper frame separation hole portion
3: upper frame alignment pin
4: Fixing member
5: rail groove flap
6: Spacer
10: frame
20: Terminal protection part
P: printed circuit board
C: terminal
H: Guide hole
100: Jig for printed circuit board

Claims (10)

A frame capable of receiving a printed circuit board having terminals formed on one side thereof; And
And a terminal protection portion formed at a position corresponding to the terminal of the frame and protecting the terminal so as to prevent contamination of the terminal due to scattered contaminants in the process,
The terminal protecting portion includes:
A shielding portion spaced from the terminal of the printed circuit board by a distance in the first direction that is above the terminal;
A first step protruding from the terminal of the printed circuit board by a first protruding length from a lower portion of the terminal so as to be spaced apart from the terminal by a second directional distance laterally of the terminal and being formed lower than an upper surface of the terminal; And
A second step protruding from a lower side of the covering portion to a second protruding length so as to be spaced apart from the terminal of the printed circuit board by the second directional distance which is the side of the terminal and lower than the upper surface of the terminal;
And a jig for a printed circuit board. delete The method according to claim 1,
And the second projecting length of the second step is higher than the first projecting length of the first step. The method according to claim 1,
The frame includes:
A lower frame having the printed circuit board receiving groove formed therein to receive a portion of the lower surface of the printed circuit board; And
And an upper frame having the printed circuit board receiving groove formed therein to receive a portion of the upper surface of the printed circuit board,
The terminal protecting portion includes:
A lower terminal protector formed at a position corresponding to the terminal of the lower frame so as to protect the terminal on the lower surface of the printed circuit board; And
An upper terminal protector formed at a position corresponding to the terminal of the upper frame to protect a terminal on the upper surface of the printed circuit board;
And a jig for a printed circuit board. 5. The method of claim 4,
Wherein the lower frame comprises:
A printed circuit board alignment pin inserted into a guide hole of the printed circuit board to guide the printed circuit board to an aligned position of the printed circuit board so that the printed circuit board can be aligned in position;
An upper frame separation hole portion formed through the lower frame so as to allow the operator or the pickup device to push the upper frame through the lower frame at the lower surface of the lower frame to facilitate separation of the upper frame;
An upper frame alignment pin for guiding the upper frame to a coupling position so that the upper frame can be coupled to a predetermined position when the upper frame is coupled to the lower frame;
A fixing member for fixing the upper frame to the lower frame so that the upper frame is not separated after the upper frame is coupled to the lower frame; And
A rail groove flap formed on a side surface of the lower frame so as to move along a rail groove of a process automation line when a process is performed;
And a jig for a printed circuit board. 6. The method of claim 5,
The printed circuit board alignment pin includes:
Wherein an upper surface of the printed circuit board alignment pin is formed to be smaller than a lower diameter so that an outer surface of the printed circuit board alignment pin is inclined so that the printed circuit board alignment pin can be easily inserted into the guide hole of the printed circuit board, Jig for circuit board. 6. The method of claim 5,
The upper frame alignment pin includes:
Wherein the upper frame alignment pin is disposed asymmetrically with respect to a center line of the frame so that the upper frame is not coupled in reverse when the upper frame is coupled to the lower frame. 6. The method of claim 5,
Wherein:
A first magnetic body formed on the lower frame and having magnetic properties; And
A second magnetic body formed on the upper frame and magnetically coupled to the first magnetic body so that the upper frame can be coupled by the magnetic force of the first magnetic body;
And a jig for a printed circuit board. 9. The method of claim 8,
Wherein the lower frame comprises:
The lower frame formed on the opposite side of the first magnetic body and stacked so that the magnetic force of the first magnetic body does not reach the lower frame so that the lower frames do not adhere to each other due to the magnetic force of the first magnetic body when the plurality of lower frames are stacked and stored. Spacers spaced apart;
And a jig for a printed circuit board. 6. The method of claim 5,
Wherein:
And a clamp which is formed on a side surface of the lower frame and includes a hook shape which is hooked on the upper frame and which has an elastic force, or a clamp which simultaneously hooks the lower frame and the upper frame.
KR1020150049166A 2015-04-07 2015-04-07 Jig for printed circuit board KR101646546B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150049166A KR101646546B1 (en) 2015-04-07 2015-04-07 Jig for printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150049166A KR101646546B1 (en) 2015-04-07 2015-04-07 Jig for printed circuit board

Publications (1)

Publication Number Publication Date
KR101646546B1 true KR101646546B1 (en) 2016-08-08

Family

ID=56712080

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150049166A KR101646546B1 (en) 2015-04-07 2015-04-07 Jig for printed circuit board

Country Status (1)

Country Link
KR (1) KR101646546B1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112289754A (en) * 2019-07-23 2021-01-29 珠海格力电器股份有限公司 Power module and packaging method
KR20220001075U (en) * 2020-11-06 2022-05-13 에이티 앤드 에스 (총칭) 컴퍼니 리미티드 Handling a component carrier structure during temperature treatment to suppress deformation of the component carrier structure
KR20220166050A (en) 2021-06-09 2022-12-16 주식회사 엘지에너지솔루션 Printed circuit board assembly and printed circuit board processing apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006005106A (en) * 2004-06-16 2006-01-05 Sumitomo Metal Micro Devices Inc Fixing tool and fixing method for substrate
KR20110111920A (en) * 2010-04-06 2011-10-12 (주)엠이씨 The jig for fixing the pcb

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006005106A (en) * 2004-06-16 2006-01-05 Sumitomo Metal Micro Devices Inc Fixing tool and fixing method for substrate
KR20110111920A (en) * 2010-04-06 2011-10-12 (주)엠이씨 The jig for fixing the pcb

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112289754A (en) * 2019-07-23 2021-01-29 珠海格力电器股份有限公司 Power module and packaging method
CN112289754B (en) * 2019-07-23 2023-09-12 珠海格力电器股份有限公司 Power module and packaging method
KR20220001075U (en) * 2020-11-06 2022-05-13 에이티 앤드 에스 (총칭) 컴퍼니 리미티드 Handling a component carrier structure during temperature treatment to suppress deformation of the component carrier structure
KR200497050Y1 (en) * 2020-11-06 2023-07-10 에이티 앤드 에스 (총칭) 컴퍼니 리미티드 Handling a component carrier structure during temperature treatment to suppress deformation of the component carrier structure
KR20220166050A (en) 2021-06-09 2022-12-16 주식회사 엘지에너지솔루션 Printed circuit board assembly and printed circuit board processing apparatus

Similar Documents

Publication Publication Date Title
US20110188226A1 (en) Shield apparatus for emi shielding
US10638597B2 (en) Stand-off block
US8359734B2 (en) Alignment jig for electronic component
JP5911899B2 (en) Board inspection apparatus and component mounting apparatus
US20060169488A1 (en) Circuit board mounted with surface mount type circuit component and method for producing the same
KR101646546B1 (en) Jig for printed circuit board
US6498307B2 (en) Electronic component package, printing circuit board, and method of inspecting the printed circuit board
JP4162058B2 (en) Semiconductor device support device, semiconductor device fixing method, and semiconductor device removal method from support device
KR101091884B1 (en) Shield Apparatus for EMI shielding
US9750139B2 (en) Miniature SMT housing for electronics package
JP2010165812A (en) Printed circuit board
JP2008171992A (en) Mounting method of semiconductor component
KR100345251B1 (en) Printed Circuit Board Pallet
US7972178B2 (en) High density connector for interconnecting fine pitch circuit packaging structures
KR101170774B1 (en) Mounting Method for Shield Apparatus for EMI shielding
JP4060329B2 (en) Test carrier and method for attaching semiconductor device to test carrier
KR101577026B1 (en) Assembly and transfer apparatus of substrate zig for solder reflow
KR100345252B1 (en) Printed Circuit Board Pallet
US7411295B2 (en) Circuit board, device mounting structure, device mounting method, and electronic apparatus
WO2009031903A1 (en) Device and method for mounting an electronic component
JP2010010212A (en) Printed circuit board, electronic instrument and semiconductor package
KR20170066875A (en) Camera module
JP6333877B2 (en) Substrate inspection method and printed circuit board manufacturing method
KR101019101B1 (en) The method for solving soldering defect of bga type component
JP2008306015A (en) Electronic component for insertion and mounting, and method for mounting the same

Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20190610

Year of fee payment: 4