JP2008171992A - Mounting method of semiconductor component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of mounting a BGA-type semiconductor component capable of easily attaching/removing the BGA-type semiconductor component onto/from a circuit substrate. <P>SOLUTION: A plurality of solder bumps 12 are protrusively provided like a grid on the bottom surface of the BGA semiconductor component 1, and a circuit substrate 2 is equipped with a plurality of through holes 21 having an aperture diameter into which the solder bump 12 can be inserted, formed with the equal interval to that of the bumps 12 and passing through the thickness direction of the circuit substrate 2. A tool board 3 having a heat-resistant temperature higher than a melting point of the solder bump 12 is provided on the bottom surface of the circuit substrate 2. In addition, the solder bump 12 is inserted into the through hole 21 from the upper surface side of the circuit substrate 2 thereby placing the BGA-type semiconductor component 1 on the upper surface of the board 2. Then, the solder bump 12 is heated to have the BGA-type semiconductor component 1 fusion-bonded to the circuit substrate 2, and thereafter, the tool board 3 is removed from the circuit substrate 2. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for mounting a BGA type semiconductor component.

  Conventionally, a BGA (Ball Grid Array) type semiconductor component in which solder bumps are projected in a grid pattern on the bottom surface is known. This is used in a surface mounting technique in which a BGA type semiconductor component is welded to a circuit board by fitting a solder bump into a through hole of the circuit board and heating in a reflow furnace.

For example, Patent Document 1 discloses that a BGA type IC is formed on a substrate in which a material having a small heat capacity, conductivity and high heat resistance is formed in a plate shape, and a plurality of square holes to be soldered are formed in a matrix shape. A soldering jig having a positioning guide member is disclosed. According to this, the soldered portion can be heated uniformly with a relatively small amount of heat, and since it is conductive, soldering can be performed without being affected by static electricity even if the object to be soldered is an IC or the like. Quality can be improved.
In addition, for example, the mounting jig for electronic components such as the BGA package disclosed in Patent Document 2 regulates the movement in the surface direction perpendicular to the mounting direction and is movable in the mounting direction so that the outer periphery of the BGA package can be moved. And a pin that can be fitted into a positioning hole provided in the printed circuit board. As a result, it is possible to mount the BGA package with low cost, simply and accurately by manual work without modifying the BGA package itself.
Further, for example, in Patent Document 3, a structure in which two positioning pins standing on a pedestal are fitted into positioning holes or notches formed in advance in an interposer and a printed wiring board of a ball grid array package. A ball grid array package positioning jig is disclosed. According to this, the poor repairability of the BGA package can be improved, and the BGA package can be mounted by a simple method.
JP-A-11-333560 Japanese Patent Laid-Open No. 11-177204 Japanese Patent Laid-Open No. 10-247661

  However, the conventional method of mounting a semiconductor component is a form of mounting on a substrate and cannot directly access the solder, so that there is a problem that the semiconductor component cannot be easily attached or detached.

  The subject of this invention is providing the mounting method of the BGA type semiconductor component which can perform attachment and removal of the BGA type semiconductor component to a circuit board easily.

In order to solve the above problems, the invention according to claim 1 is a semiconductor component mounting method in which a semiconductor component having a plurality of solder bumps protruding in a lattice shape on the bottom surface is mounted on a circuit board.
The circuit board has an opening diameter into which the solder bumps can be inserted, is formed at the same interval as the solder bumps, and includes a plurality of through holes penetrating in the thickness direction of the circuit board.
A jig having a heat resistance higher than the melting point of the solder bump, having a diameter that can be inserted into the through-hole, and provided with a plurality of protruding portions protruding in a grid pattern at the same interval as the solder bump. The tool board is disposed on the bottom surface side of the circuit board by inserting the protruding portion into the through hole from the bottom surface side of the circuit board, and the semiconductor component is disposed on the upper surface of the circuit board. It is arranged on the upper surface side of the circuit board by inserting into the through hole from the side, and then the solder bump is heated by heating the jig board to weld the semiconductor component to the circuit board. Then, the jig board is removed from the circuit board.

The invention according to claim 2 is a method for mounting a semiconductor component in which a semiconductor component having a plurality of solder bumps protruding in a lattice shape on the bottom surface is mounted on a circuit board.
The circuit board has an opening diameter into which the solder bumps can be inserted, is formed at the same interval as the solder bumps, and includes a plurality of through holes penetrating in the thickness direction of the circuit board.
A jig board having a heat resistant temperature higher than the melting point of the solder bump is disposed on the bottom surface side of the circuit board, and the semiconductor component is inserted into the through hole from the upper surface side of the circuit board. The semiconductor board is disposed on the upper surface side of the circuit board, and then the solder bump is heated to weld the semiconductor component to the circuit board, and then the jig board is removed from the circuit board. .

According to a third aspect of the present invention, in the semiconductor component mounting method according to the second aspect of the present invention, the jig board has a diameter that can be inserted into the through hole, and has a lattice shape at the same intervals as the solder bumps. Provided with a plurality of projecting portions projecting from
The jig board is arranged on the bottom surface side of the circuit board by inserting the protruding portion into the through hole from the bottom surface side of the circuit board.

  According to a fourth aspect of the present invention, in the semiconductor component mounting method according to the third aspect, by heating the jig board, the solder bumps are heated to weld the semiconductor component to the circuit board. It is characterized by.

According to the first aspect of the present invention, the semiconductor component has a plurality of solder bumps protruding in a lattice shape on the bottom surface, the circuit board has an opening diameter into which the solder bumps can be inserted, A plurality of through holes formed at the same interval and penetrating in the thickness direction of the circuit board are provided. The jig has a heat resistance higher than the melting point of the solder bump, has a diameter that can be inserted into the through hole, and includes a plurality of projecting portions projecting in a grid pattern at the same interval as the solder bump. The board is placed on the bottom surface side of the circuit board by inserting the protruding portion into the through hole from the bottom surface side of the circuit board, and the semiconductor component is placed on the through hole from the top surface side of the circuit board. By being inserted, it is arranged on the upper surface side of the circuit board, and then the jig board is heated, so that the solder bumps are heated and the semiconductor components are welded to the circuit board. Removed from.
Therefore, if the protruding portion of the jig board is inserted into the through hole, the jig board can be properly arranged, and the arrangement of the jig board becomes easy, and the solder bumps inserted from the upper surface side of the circuit board Can be positioned by abutting against the protruding portion in the through hole, so that the solder bump can be positioned more easily, and can be directly and easily applied to the solder from the back side of the circuit board. Since it can be accessed, the BGA type semiconductor component can be easily mounted on the circuit board.
In addition, in a state where the semiconductor component is welded to the circuit board, the solder can be directly and easily accessed from the back side of the circuit board, so that the semiconductor component can be removed more easily.
In addition, the jig board disposed on the bottom surface side of the circuit board prevents the solder melted by heating from dropping or dripping from the through hole, thereby preventing the occurrence of defects such as a short circuit.

According to the second aspect of the present invention, the semiconductor component has a plurality of solder bumps protruding in a lattice shape on the bottom surface, the circuit board has an opening diameter into which the solder bumps can be inserted, A plurality of through holes formed at the same interval and penetrating in the thickness direction of the circuit board are provided. A jig board having a heat resistant temperature higher than the melting point of the solder bump is arranged on the bottom surface side of the circuit board, and the semiconductor component is inserted into the through hole from the upper surface side of the circuit board. The solder bumps are then heated to weld the semiconductor component to the circuit board, and then the jig board is removed from the circuit board.
Therefore, the jig board disposed on the bottom side of the circuit board facilitates the positioning of the solder bumps inserted into the through holes, and the BGA type semiconductor component can be easily mounted on the circuit board.
In addition, in a state where the semiconductor component is welded to the circuit board, the solder can be directly and easily accessed from the back side of the circuit board, so that the semiconductor component can be removed more easily.
In addition, the jig board disposed on the bottom surface side of the circuit board prevents the solder melted by heating from dropping or dripping from the through hole, thereby preventing the occurrence of defects such as a short circuit.

According to the invention described in claim 3, it is a matter of course that the effect of the invention described in claim 2 can be obtained, and the jig board has a diameter that can be inserted into the through hole and is the same as the solder bump. A plurality of projecting portions projecting in a grid pattern at intervals are provided, and the projecting portions are inserted into the through holes from the bottom surface side of the circuit board, whereby the jig board is arranged on the bottom surface side of the circuit board. The
Accordingly, if the protruding portion of the jig board is inserted into the through hole, the jig board can be appropriately arranged, and the arrangement of the jig board is facilitated. In addition, the solder bumps inserted from the upper surface side of the circuit board can be brought into contact with the projecting portions in the through holes to perform positioning, and the solder bumps can be positioned more easily.

According to the invention described in claim 4, it is needless to say that the effect of the invention described in claim 3 can be obtained. When the jig board is heated, the solder bumps are heated and the semiconductor component is transferred to the circuit board. To be welded.
Therefore, when mounting the semiconductor component, the solder can be directly and easily accessed by the jig board, so that mounting can be performed more appropriately and easily.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  In the present embodiment, a method for mounting a semiconductor component on a circuit board and soldering the semiconductor component on the circuit board and removing the semiconductor component soldered to the circuit board will be described.

First, the mounting structure of the semiconductor component 1 on the circuit board 2 of this embodiment will be described.
FIG. 1 is a side cross-sectional view before the BGA type semiconductor component 1 according to this embodiment is mounted on a circuit board 2. FIG. 2 is a perspective view of the jig board 3. FIG. 3 is an explanatory diagram for explaining a mounting method of the BGA type semiconductor component 1 in the present embodiment. FIG. 4 is an explanatory diagram for explaining a method of removing the BGA type semiconductor component 1 mounted on the circuit board 2.

The semiconductor component 1 in the present embodiment employs a BGA (Ball Grid Array) type. For example, as shown in FIG. 1, a housing 11 including an electronic component or the like (not shown) and a bottom surface of the housing 11. And a plurality of solder bumps 12 protruding in a grid pattern.
The solder bumps 12 are formed in, for example, a cylindrical shape, inserted into through holes 21 formed in the circuit board 2, and welded to lands 22 provided in the through holes 21. Play a role.
The length of the solder bump 12 in the protruding direction from the BGA type semiconductor component 1 is shorter than the length of the circuit board 2 in the thickness direction. Therefore, the solder bump 12 does not protrude to the bottom surface side of the circuit board 2 in a state where it is inserted into the through hole 21.

The circuit board 2 is made of a material such as a glass epoxy material, for example, and is mounted with an electronic component such as the BGA type semiconductor component 1 described above. A plurality of through holes 21 penetrating in the thickness direction of the circuit board 2 are formed in the circuit board 2.
The through holes 21 have an opening diameter into which the solder bumps 12 of the BGA type semiconductor component 1 can be inserted, and are formed at the same intervals as the solder bumps 12. Each through hole 21 is formed with a land 22 that is insulated from each other. The land 22 is made of a conductive material, and for example, copper foil (Cu) is used.

The jig board 3 is made of, for example, a material (for example, glass epoxy material, ceramic, etc.) that has a heat resistance temperature higher than the melting point of the solder bump 12 and does not adhere to the solder at the solder mounting temperature. When mounting on the circuit board 2, it is arranged on the bottom side of the circuit board 2 and heated by a heating device (not shown). On the upper surface of the jig board 3, a protruding portion 31 having a diameter that can be inserted into the through hole 21 of the circuit board 2 is formed.
The protruding portions 31 have a diameter that can be inserted into the through holes 21 of the circuit board 2, and are formed at the same intervals as the solder bumps 12 and the through holes 21.

  For example, when the solder bumps 12 protruding from the bottom surface of the BGA type semiconductor component 1 are provided at intervals of 1.0 mm, the through holes 21 of the circuit board 2 formed at the same intervals as the solder bumps 12 and The protruding portions 31 of the jig board 3 are also provided at intervals of 1.0 mm. In this case, for example, the land 22 provided in the through hole 21 is formed with an opening diameter of about 0.6 mm, and the solder bump 12 and the protruding portion 31 inserted into the through hole 21 in which the land 22 is formed have 0 The diameter is about 5 mm.

  Next, a method of mounting the BGA type semiconductor component 1 on the circuit board 2 will be described with reference to FIG.

FIG. 3A is a side sectional view of the circuit board 2 before the BGA type semiconductor component 1 is mounted.
First, in FIG. 3B, the jig board 3 is arranged on the bottom surface side of the circuit board 2. At this time, the projecting portions 31 projecting from the upper surface of the jig board 3 are arranged so as to be inserted into the through holes 21 of the circuit board 2 from the bottom surface side.
Next, in FIG. 3C, the BGA type semiconductor component 1 is arranged on the upper surface side of the circuit board 2. At this time, the solder bumps 12 protruding from the bottom surface of the housing 11 of the BGA type semiconductor component 1 are arranged so as to be inserted into the through holes 21 provided in the circuit board 2 from the upper surface side. At this time, the solder bumps 12 are brought into contact with the protruding portions 31 inserted in advance from the bottom side in the through holes 21.

Further, in the state of FIG. 3C, heat is applied to the jig board 3 disposed on the bottom surface side of the circuit board 2 at a temperature capable of melting the solder, and the heat is inserted from the upper surface side in the through hole 21. While directly accessing the solder bumps 12, the solder bumps 12 are heated and melted, and the BGA type semiconductor component 1 is welded to the circuit board 2. This mounting is realized by, for example, preheating at 170 ° C. for 60 to 120 seconds and heating at a maximum temperature of 260 ° C. for 5 to 10 seconds.
Thereafter, in FIG. 3D, the jig board 3 arranged on the bottom surface side of the circuit board 2 is removed from the circuit board 2.
Through the above steps, the BGA type semiconductor component 1 is welded to the circuit board 2 and electrically connected to the circuit board 2, and the mounting operation is completed.

  Next, a method for removing the BGA type semiconductor component 1 mounted on the circuit board 2 will be described with reference to FIG.

FIG. 4A is a side sectional view of the circuit board 2 in a state where the BGA type semiconductor component 1 is mounted.
First, in FIG. 4B, the jig board 3 is arranged on the bottom surface side of the circuit board 2. At this time, the projecting portions 31 projecting from the upper surface of the jig board 3 are arranged so as to be inserted into the through holes 21 of the circuit board 2 from the bottom surface side.
Next, in the state of FIG. 4B, heat is applied to the jig board 3 disposed on the bottom surface side of the circuit board 2 at a temperature capable of melting the solder, and the solder inserted from the upper surface side in the through hole 21. The solder bump 12 is heated and melted while directly accessing the bump 12.
Further, in FIG. 4C, the solder of the solder bump 12 that has been melted to form a liquid is sucked and removed by the suction tool 4 or the like.
Through the above steps, the removal operation of the BGA type semiconductor component 1 mounted on the circuit board 2 is completed.

According to the mounting method of the BGA type semiconductor component 1 in the present embodiment described above, the BGA type semiconductor component 1 has a plurality of solder bumps 12 protruding in a grid pattern on the bottom surface, and the circuit board 2 has a solder bump. A plurality of through holes 21 having an opening diameter into which the circuit board 2 can be inserted and formed at the same interval as the solder bumps 12 and penetrating in the thickness direction of the circuit board 2 are provided. And it has a heat-resistant temperature higher than the melting point of the solder bump 12, has a diameter that can be inserted into the through hole 21, and includes a plurality of projecting portions 31 that project in a grid pattern at the same interval as the solder bump 12. The jig board 3 is placed on the bottom surface side of the circuit board 2 by inserting the protruding portion 31 into the through hole 21 from the bottom surface side of the circuit board 2, and the BGA type semiconductor component 1 is By inserting the solder bumps 12 into the through holes 21 from the upper surface side of the circuit board 2, the solder bumps 12 are heated by being placed on the upper surface side of the circuit board 2 and then the jig board 3 is heated. Then, the BGA type semiconductor component 1 is welded to the circuit board 2. In addition, in a state where the BGA type semiconductor component 1 is welded to the circuit board 2, the BGA type semiconductor component 1 is removed from the circuit board 2 by removing the solder after heating the jig board 3.
Therefore, if the protruding portion 31 of the jig board 3 is inserted into the through hole 21, the jig board 3 can be appropriately arranged, and the jig board 3 can be easily arranged and the upper surface side of the circuit board 2 can be arranged. It is possible to position the solder bump 12 inserted from the solder bump 12 in contact with the projecting portion 31 in the through hole 21, so that the solder bump 12 can be positioned more easily. Since the solder can be directly and easily accessed from the back side of the BGA type semiconductor component 1, the BGA type semiconductor component 1 can be easily mounted on the circuit board 2.
Further, in a state where the BGA type semiconductor component 1 is welded to the circuit board 2, the solder can be directly and easily accessed from the back side of the circuit board 2, so that the removal of the BGA type semiconductor component 1 is easier. Can be done.
In addition, the jig board 3 disposed on the bottom surface side of the circuit board 2 prevents the solder melted by heating from dropping or dripping from the through-hole 21 and preventing the occurrence of problems such as a short circuit. it can.

In the present invention, various improvements and design changes may be made without departing from the spirit of the invention.
For example, the shape of the solder bump 12 is not limited to a cylindrical shape, and a spherical shape, a conical shape, or the like can be appropriately employed.
Moreover, the structure which uses the sheet-like jig | tool board 3 in which the protrusion part 31 is not provided may be sufficient.
Further, for example, the description has been given using the example in which the solder bumps 12 are provided in a lattice shape on the semiconductor component 1, but the configuration may be such that the solder bumps 12 are provided only in the peripheral portion on the bottom surface of the semiconductor component 1. good.
In mass production, a copper foil or the like may be embedded to eliminate the through hole 21 of the circuit board 2, and the circuit board 2 can also be used as a normal circuit board without changing the pattern.
In the above embodiment, the case where the solder bumps 12 are melted by heating the jig board 3 disposed on the bottom surface side of the circuit board 2 when the semiconductor component 1 is attached to and removed from the circuit board 2 has been described. The heating method is not limited to this, and for example, a method of heating the whole with a reflow furnace may be adopted. Even in this case, the jig board 3 makes it easy to position the semiconductor component 1 and to prevent the solder melted by heating from dripping from the through hole 21. .

It is side surface sectional drawing before the BGA type semiconductor component in this embodiment is mounted in a circuit board. It is a perspective view of a jig board. It is explanatory drawing for demonstrating the mounting method of the BGA type semiconductor component in this embodiment. It is explanatory drawing for demonstrating the removal method of the BGA type semiconductor component mounted in the circuit board.

Explanation of symbols

1 BGA type semiconductor parts (semiconductor parts)
12 Solder bump 2 Circuit board 21 Through hole 3 Jig board 31 Projection

Claims (4)

In a semiconductor component mounting method for mounting a semiconductor component having a plurality of solder bumps protruding in a lattice shape on a bottom surface on a circuit board,
The circuit board has an opening diameter into which the solder bumps can be inserted, is formed at the same interval as the solder bumps, and includes a plurality of through holes penetrating in the thickness direction of the circuit board.
A jig having a heat resistance higher than the melting point of the solder bump, having a diameter that can be inserted into the through-hole, and provided with a plurality of protruding portions protruding in a grid pattern at the same interval as the solder bump. The tool board is disposed on the bottom surface side of the circuit board by inserting the protruding portion into the through hole from the bottom surface side of the circuit board, and the semiconductor component is disposed on the upper surface of the circuit board. It is arranged on the upper surface side of the circuit board by inserting into the through hole from the side, and then the solder bump is heated by heating the jig board to weld the semiconductor component to the circuit board. Thereafter, the jig board is removed from the circuit board. In a semiconductor component mounting method for mounting a semiconductor component having a plurality of solder bumps protruding in a lattice shape on a bottom surface on a circuit board,
The circuit board has an opening diameter into which the solder bumps can be inserted, is formed at the same interval as the solder bumps, and includes a plurality of through holes penetrating in the thickness direction of the circuit board.
A jig board having a heat resistant temperature higher than the melting point of the solder bump is disposed on the bottom surface side of the circuit board, and the semiconductor component is inserted into the through hole from the upper surface side of the circuit board. The semiconductor board is disposed on the upper surface side of the circuit board, and then the solder bump is heated to weld the semiconductor component to the circuit board, and then the jig board is removed from the circuit board. Semiconductor component mounting method. The jig board has a diameter that can be inserted into the through hole, and includes a plurality of projecting portions that project in a grid pattern at the same interval as the solder bumps.
3. The semiconductor component according to claim 2, wherein the jig board is disposed on the bottom surface side of the circuit board by inserting the protruding portion into the through hole from the bottom surface side of the circuit board. Implementation method.   The method of mounting a semiconductor component according to claim 3, wherein the solder bump is heated to weld the semiconductor component to the circuit board by heating the jig board.

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