JP2010016305A - Substrate, mounting substrate, method for manufacturing mounting substrate, and method for positioning - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate capable of supplying solder to a suitable position of the substrate in a rework without needing a dedicated jig, a mounting substrate equipped with the substrate, a method for manufacturing the mounting substrate, and a method for positioning a solder mask. <P>SOLUTION: The substrate 1 on a surface of which an electronic component 2 is mounted by soldering includes, on its surface, an electronic component mounting region A for mounting the electronic component 2, and positioning portions 4 provided in a periphery of the electronic component mounting region A, wherein the positioning portions 4 are solder printed through opening portions 14 formed in a solder mask M used in soldering the electronic component mounting region A, and are formed projecting from the surface. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate on which an electronic component is mounted by soldering, a mounting substrate including the substrate on which the electronic component is mounted, a method for manufacturing the mounting substrate, and solder when the electronic component is remounted on the substrate. The present invention relates to a positioning method for positioning a mask.

  Some electronic components have a package configuration including terminals that are electrically connected to the substrate by incorporating a silicon chip on the surface of the substrate on which wiring is printed and soldering. Examples of the surface mount package include BGA (Ball grid array) and LGA (Land grid array). BGA is a package with a ball in which ball-shaped solder is arranged on a flat electrode formed on the back surface of a component and the solder is melted by heating. LGA is a package in which a planar electrode is formed on the back surface of a component, and there is no ball-like solder. Both BGA and LGA constitute a mounting substrate by soldering the package to the substrate by solder printing, component mounting, and reflow processes.

  By the way, when performing rework to remove an electronic component from the mounting substrate and attach a new electronic component to the substrate, the area (land) for attaching the electronic component on the substrate is maintained while maintaining the positional accuracy between the substrate and the electronic component. It is necessary to supply solder properly. Conventionally, it is common for an operator to visually align the position of the solder mask and the land of the substrate, and it is inevitable that the supplied solder is displaced. In order to prevent such misalignment of the solder, there is a means for recognizing the land of the board with a camera, but a device such as a camera is necessary and expensive equipment is required.

  Conventionally, a method using a dedicated positioning jig for preventing solder misalignment has also been proposed (see Patent Document 1 below).

FIG. 8 is a diagram illustrating a mechanism for positioning an electronic component on the substrate described in Patent Document 1. In FIG.
In this mechanism, a plurality of positioning holes 103 are provided in the substrate 101 around a region where the electronic component is attached, and the positioning pins 105 of the substrate fixing jig 104 are inserted into the plurality of positioning holes 103. Positioning is performed to specify an area for mounting the electronic component. When supplying solder onto the substrate, the solder printing means 107 is positioned using the substrate fixing jig 104. The solder printing means 107 includes a printing frame 108, a printing screen 109, and a squeegee 110, and positioning holes 111 are provided on the surface of the printing frame 108 on the substrate side so as to correspond to the positioning pins 105. The positioning pins 105 are inserted into the substrate 101 to be positioned on the substrate 101. After the solder 106 is printed by the squeegee 110 or the like, the solder printing means 107 is removed, and an electronic component mounting means (not shown) is positioned by the positioning pins 105 in the area where the solder 106 is printed on the substrate 101, thereby allowing the electronic component to be positioned. Is attached.

JP 2000-269272 A

However, the positioning method shown in FIG. 8 requires a dedicated positioning jig.
Further, in order to insert the positioning pin 105 of the substrate fixing jig 104, it is necessary to provide the positioning hole 103 in the substrate 101 in advance. However, in the high-density substrate, the positioning hole 103 is provided to correspond to the positioning pin 105. It is impossible.
Further, when the positioning hole 103 is penetrated through the substrate 101, the positioning hole 103 may be displaced with respect to the substrate 101.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a substrate that can supply solder to an appropriate position on the substrate at the time of rework without requiring a dedicated jig, and the substrate. It is an object of the present invention to provide a mounting substrate, a manufacturing method of the mounting substrate, and a solder mask positioning method.

The present invention is as follows.
(1) A substrate on which electronic components are attached to the surface by soldering,
On the surface, an electronic component mounting area for mounting the electronic component;
A positioning portion that is provided around the electronic component mounting region, and performs positioning of a solder mask with respect to the substrate when the soldering is performed on the electronic component mounting region;
A substrate in which the positioning portion is solder printed using the solder mask.
(2) The substrate according to (1) above,
A substrate on which a plurality of the positioning portions are provided.
(3) The substrate according to (1) or (2) above,
A substrate in which the positioning portion is formed by a part of a sphere.
(4) The substrate according to any one of (1) to (3) above,
A mounting solder portion for mounting the electronic component is provided in the electronic component mounting region, and a height of the positioning portion from the surface is lower than a height of the mounting solder portion from the surface.
(5) A mounting board comprising the board according to any one of (1) to (4) above,
A mounting board in which the electronic component is attached to the electronic component attachment region by soldering.
(6) Solder is printed via a solder mask on an electronic component mounting region on the surface of the substrate for mounting the electronic component, and the solder is printed on the substrate via an opening formed in the solder mask. To form a positioning part,
In a state where the electronic component is disposed in the electronic component mounting region, heating is performed to attach the electronic component to the substrate, and the solder printed through the opening is also heated to perform the heating of the substrate. A method for manufacturing a mounting board, wherein a positioning portion protruding on a surface is formed.
(7) A method of manufacturing a mounting board according to (6) above,
A method for manufacturing a mounting board, wherein a plurality of the positioning portions are provided.
(8) The method for manufacturing a mounting board according to (6) or (7) above,
A method for manufacturing a mounting board, wherein the positioning portion is formed by a part of a sphere.
(9) A method for manufacturing a mounting board according to any one of (6) to (8) above,
A mounting board manufacturing method, wherein a mounting solder portion is provided in the electronic component mounting region, and a height of the positioning portion from the surface is lower than a height of the mounting solder portion from the surface.
(10) A positioning method for positioning a solder mask used for soldering on a substrate on which an electronic component is attached to a surface by soldering,
On the surface, an electronic component mounting area for mounting the electronic component;
A positioning portion located around the electronic component mounting region is provided,
The positioning portion is printed through an opening formed in the solder mask when supplying solder to the electronic component mounting region using the solder mask, and is configured to protrude from the surface of the substrate.
A positioning method for positioning the solder mask on the substrate by engaging the positioning portion with the opening.

  According to the present invention, a board capable of printing solder at an appropriate position on a board at the time of rework without requiring a dedicated jig, a mounting board provided with the board, a method for manufacturing the mounting board, and a solder mask The positioning method can be provided.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a cross-sectional view showing a part of a mounting board in which electronic components are attached to the board. FIG. 2 is a diagram illustrating a state in which a part of the mounting substrate is viewed in plan.
As shown in FIG. 1, the mounting substrate 10 has a configuration in which an electronic component 2 such as an IC is attached to the surface of the substrate 1 by soldering. The electronic component 2 according to the present embodiment has a configuration including a rectangular package having a BGA structure in plan view, but may be configured to include a package having an electrode structure on the back side of the component such as an LGA.

  As the substrate 1, a printed wiring board on which wiring is printed is used. For example, a paper phenol wiring board or a glass epoxy wiring board can be used as the printed wiring board, and the material of the board 1 is selected in consideration of the wiring density of the board, the thermal expansion coefficient of the electronic component, and the electrical characteristics. Is done.

  An electronic component mounting area A for mounting the electronic component 2 is provided on the surface of the substrate 1, and a plurality of ball-shaped mounting solder portions 3 are latticed in plan view by soldering to the electronic component mounting area A. Arranged in a shape. In the electronic component mounting area A, the electronic component 2 is mounted by the mounting solder portion 3. In the present embodiment, the electronic component mounting area A has a substantially rectangular shape having substantially the same dimensions as the shape of the electronic component 2 in plan view.

  Further, other components 8 and 9 such as resistors and capacitors may be attached on the substrate 1 of the mounting substrate 10.

  Around the electronic component mounting area A on the substrate 1, a plurality of (four in the present embodiment) positioning portions 4 are provided. The positioning portion 4 is used as a reference for positioning a solder mask such as a metal mask used for printing the mounting solder portion 3 on the substrate during soldering. Two or more positioning portions 4 are preferably provided, and positioning can be performed more reliably by using three or more.

  The positioning portion 4 is formed of the same material as the mounting solder portion 3 using the same solder mask when the mounting solder portion 3 is printed. Here, the positioning part 4 is provided in the vicinity of the mounting solder part 3 for positioning the solder mask for printing the mounting solder part 3. , It may be provided in another part. The periphery of the electronic component attachment area A includes a position where a part of the positioning portion 4 overlaps the electronic component 2 when the substrate 1 is viewed in a plan view with the electronic component 2 attached to the substrate 1.

  The positioning part 4 is formed so as to protrude from the surface of the substrate 1 to the electronic component 2 side. The positioning portion 4 is provided so as not to contact the electronic component 2 and the mounting solder portion 3 in a state of being attached to the electronic component 2 on the substrate 1.

  In this embodiment, the positioning part 4 is formed by a part of a sphere. Here, the part of the sphere includes, for example, a shape having a spherical surface in at least a part such as a hemisphere. In the present embodiment, the positioning portion 4 is formed in a hemispherical shape, but the shape and size thereof may be arbitrarily changed as long as the solder mask can be positioned and does not interfere with the mounting of the electronic component 2. There is no particular limitation. The configuration of the solder mask and the positioning method will be described later.

  Next, a method for manufacturing a mounting substrate will be described. FIG. 3 is a plan view showing an example of a solder mask used for printing solder. FIG. 4 is a schematic cross-sectional view illustrating a procedure for printing solder. In the following description, the configuration of the mounting substrate 10 shown in FIG.

  As shown in FIG. 3, in the solder mask M, a solder printing opening 13 for printing solder is provided on a plate made of a metal material such as stainless steel at a position corresponding to the area of the electronic component 2 on the substrate 1. It has been. A broken line in FIG. 3 indicates a position corresponding to the electronic component attachment region A when the solder mask M is attached to the substrate 1.

  The solder mask M is provided with a plurality of (four in FIG. 3) openings 14 around the solder printing openings 13. The opening 14 is for printing the positioning part 4 in the vicinity of the region where the electronic component 2 is formed on the substrate 1 when the solder printing opening 13 is printed. The opening 14 of the present embodiment is formed in a circular shape in plan view, but may be, for example, an oval or a rectangle, and the shape of the opening 14 is not particularly limited.

  The solder mask M is provided with solder printing openings 18 and 19 for printing solder for attaching other components 8 and 9 to the substrate 1.

  FIG. 4 is a cross-sectional view showing a process of printing solder on the substrate 1. As shown in FIG. 4A, a solder mask M is disposed on the surface side of the substrate 1 to which the electronic component 2 is attached, and as shown in FIG. 4B, the paste solder is placed on the substrate 1 side of the solder mask M. On the other hand, it is supplied to the opposite surface. Then, by moving the paste-like solder with a squeegee or the like, a part of the paste-like solder passes through the solder printing opening 13 and the opening 14 and is printed on the surface of the substrate 1 (see FIG. 4C).

  The paste solder printed by the solder printing opening 13 constitutes the mounting solder part 3, and the paste solder printed by the opening 14 constitutes the positioning part 4. Each of the mounting solder portion 3 and the positioning portion 4 is printed on the substrate 1 in a cylindrical shape.

  FIG. 5 is a diagram showing a reflow process. As shown in FIGS. 5A and 5B, the electronic component 2 is mounted on the electronic component mounting area A of the substrate 1 on which the solder is printed, and the mounting solder portion 3 is heated in the reflow furnace, so that the mounting is performed. The solder part 3 is melted. At this time, as shown in FIG.5 (c), the solder which comprises the positioning part 4 also melt | dissolves and it becomes hemispherical. Thereafter, the mounting solder part 3 and the positioning part 4 are cured by cooling to room temperature. In this way, the electronic component 2 is attached to the electronic component attachment region A of the substrate 1 by the attachment solder part 3.

  Although not shown, components other than the electronic component 2 are similarly printed on the substrate 1 by printing using the same solder mask as the printed solder portion 3 and then performing a reflow process. be able to.

  FIG. 6 is a cross-sectional view showing the solder and the positioning portion in a state where the electronic component is attached to the substrate. FIG. 6 shows a state in which the mounting solder part 3 and the positioning part 4 are completely cured after reflow. At this time, since the height H2 of the positioning portion 4 from the surface of the substrate 1 is lower than the height H1 from the surface of the mounting solder portion, the positioning portion 4 does not interfere with the electronic component 2.

  FIG. 7 is a schematic cross-sectional view for explaining the rework procedure. In the rework, a process of removing an electronic component attached to the mounting substrate and reattaching a new electronic component to the electronic component attachment region is performed.

FIG. 7A shows a state in which the electronic component is removed from the mounting substrate and only the positioning portion is left on the substrate.
First, when removing an electronic component, the electronic component mounting area is uniformly heated by a heating means such as hot air, and the mounting solder portion is melted to remove the electronic component from the substrate 1. Next, the solder remaining on the substrate 1 is carefully removed using, for example, a solder sucker, a soldering iron, a solder wick or the like.

FIG. 7B shows a state in which the solder mask M is positioned on the substrate 1 when printing a solder for attaching a new electronic component to the substrate. When positioning the solder mask M, the positioning portion 4 of the substrate 1 is fitted into the opening 14 of the solder mask M. In this way, since the positioning portion 4 is originally composed of the solder printed by the opening 14, the solder mask M can always be fixed at the same position on the substrate 1, and the position of the solder printing opening 13. It always matches the position of the mounting solder part from which is removed. After matching the solder mask M, the solder paste M is supplied to the solder mask M and printed to form the mounting solder portion 3 as shown in FIG.
If the positioning part 4 is formed in a hemispherical shape as in this embodiment, the opening 14 of the solder mask M can be easily fitted.

  Thereafter, as shown in FIGS. 5B and 5C, the electronic component 2 is mounted on the electronic component mounting region A and heated to mount the electronic component 2.

  The substrate 1 of the present embodiment includes, on the surface, an electronic component mounting area A for mounting the electronic component 2 and positioning portions 4 provided around the electronic component mounting area A. The positioning portion 4 is an electronic component. Solder printed through the opening 14 formed in the solder mask M used when soldering to the attachment region A, is formed so as to protrude from the surface. For this reason, when reworking, the mounting solder portion 3 for mounting the new electronic component 2 is printed with high accuracy in the electronic component mounting area A by positioning the same solder mask M based on the positioning portion 4. can do.

  Moreover, the positioning part 4 can also be utilized as an alignment mark of the electronic component 2 by normal visual observation.

According to the structure of the said embodiment, it is advantageous at the following points compared with the positioning mechanism as shown in FIG.
(1) The solder mask M can be easily positioned on the substrate 1, and other members and devices such as a dedicated positioning jig are not required. Further, there is no need for a step of positioning with another device such as a jig.
(2) Since it is not necessary to provide the positioning hole 103 for penetrating the positioning pin 105 in the substrate 1, the positioning hole 103 is not displaced with respect to the substrate 101, and the positioning hole 103 is produced when the substrate 1 is manufactured. There is no need to perform the process of providing the.

It is sectional drawing which shows a part of mounting board by which the electronic component was attached to the board | substrate. It is a figure which shows the state which planarly viewed a part of mounting board | substrate. It is a top view which shows an example of the solder mask used in order to print solder. It is typical sectional drawing explaining the procedure which prints solder. It is typical sectional drawing explaining the procedure which attaches an electronic component to the board | substrate with which the solder was printed. It is sectional drawing which shows the solder and positioning part in the state by which the electronic component was attached to the board | substrate. It is sectional drawing explaining the procedure of rework. It is a figure which shows the mechanism which positions the electronic component on the conventional board | substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Electronic component 3 Mounting solder part 4 Positioning part 10 Mounting board 13 Solder printing opening 14 Opening part M Solder mask

Claims (10)

A substrate on which electronic components are attached to the surface by soldering,
On the surface, an electronic component mounting area for mounting the electronic component;
A positioning portion that is provided around the electronic component mounting region, and performs positioning of a solder mask with respect to the substrate when the soldering is performed on the electronic component mounting region;
A substrate in which the positioning portion is solder printed using the solder mask. The substrate of claim 1,
A substrate on which a plurality of the positioning portions are provided. The substrate according to claim 1 or 2, wherein
A substrate in which the positioning portion is formed by a part of a sphere. A substrate according to any one of claims 1 to 3,
A mounting solder portion for mounting the electronic component is provided in the electronic component mounting region, and a height of the positioning portion from the surface is lower than a height of the mounting solder portion from the surface. A mounting board comprising the board according to claim 1,
A mounting board in which the electronic component is attached to the electronic component attachment region by soldering. By printing solder on the surface of the substrate through the solder mask on the electronic component mounting area for mounting the electronic component, and printing the solder on the substrate through the opening formed in the solder mask. Forming the positioning part,
In a state where the electronic component is disposed in the electronic component mounting region, heating is performed to attach the electronic component to the substrate, and the solder printed through the opening is also heated to perform the surface of the substrate. A method for manufacturing a mounting board, in which a positioning portion that protrudes from the substrate is formed. It is a manufacturing method of the mounting board according to claim 6,
A method for manufacturing a mounting board, wherein a plurality of the positioning portions are provided. It is a manufacturing method of the mounting board according to claim 6 or 7,
A method for manufacturing a mounting board, wherein the positioning portion is formed by a part of a sphere. It is a manufacturing method of the mounting substrate according to any one of claims 6 to 8,
A mounting board manufacturing method, wherein a mounting solder portion is provided in the electronic component mounting region, and a height of the positioning portion from the surface is lower than a height of the mounting solder portion from the surface. A positioning method for positioning a solder mask used for soldering on a substrate on which electronic components are attached to a surface by soldering,
On the surface, an electronic component mounting area for mounting the electronic component;
A positioning portion located around the electronic component mounting region is provided,
The positioning portion is printed through an opening formed in the solder mask when supplying solder to the electronic component mounting region using the solder mask, and is configured to protrude from the surface of the substrate.
A positioning method for positioning the solder mask on the substrate by engaging the positioning portion with the opening.

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