KR20220001075U - Handling a component carrier structure during temperature treatment to suppress deformation of the component carrier structure - Google Patents

Abstract

A handling device (100) for handling a part carrier structure (102) comprising a plurality of preforms of a part carrier (104) during temperature treatment, the handling device (100) receiving the part carrier structure (102) therebetween first jig 108 and second jig 110 , an array of magnets 112 forming part of one of first jig 108 and second jig 110 , and first jig 108 ) and a plate 114 forming part of the other of the second jig 110 , wherein the magnet 112 works with the plate 114 to restrain deformation of the part carrier structure 102 therebetween. configured to generate an attractive force.

Description

Handling a component carrier structure during temperature treatment to suppress deformation of the component carrier structure

The present invention relates to a handling device and method, arrangement, and reflow oven for handling a part carrier structure during temperature processing.

With regard to increasing the miniaturization of these components as well as the increasing number of components to be connected to component carriers such as printed circuit boards and improving product functions of component carriers equipped with one or more electronic components, increasingly powerful arrays of components or multiple Packages with components are used, with a large number of contacts or connection points with much smaller spacing between these components. In particular, the component carrier must be mechanically robust and electrically reliable so that it can operate even in harsh conditions.

In particular, deformation, bending or warpage of the component carrier is a problem in terms of reliability and performance. This is especially important during reflow soldering, especially when done at the panel level.

There may be a need for a component carrier that can be manufactured with low warpage.

According to an exemplary embodiment of the present invention there is provided a handling device for handling a part carrier structure comprising a plurality (in particular still integrally connected) preforms of a part carrier during temperature processing (in particular in a reflow oven) wherein the handling device comprises a first jig and a second jig configured to receive a part carrier structure therebetween, an array of magnets forming part of one of the first jig and the second jig, and the first jig and the second jig including a plate (in particular a metal plate, for example a continuous or substantially continuous metal plate, or other highly mechanically stabilized (and preferably heat-redirecting) material or body) forming part of the other of the jig wherein the magnet is attached to the plate together with the plate (e.g., with the plate itself when the plate is made of a metallic material, or with the plate when the plate is made of a non-magnetic material) to inhibit deformation of the part carrier structure therebetween. together with a magnet) to create an attracting force.

According to another exemplary embodiment of the present invention, there is provided a handling device for handling a part carrier structure comprising a plurality of (in particular still integrally connected) preforms of a part carrier during temperature processing (particularly in a reflow oven), wherein the handling device comprises a first jig and a second jig configured to receive a part carrier structure therebetween, and a plurality of first jigs and a second jig which form part of at least one of the first jig and the second jig and are arranged between different preforms of the part carrier. a support structure including a bar and supporting the part carrier structure.

According to a further exemplary embodiment of the present invention, there is provided an arrangement comprising a handling device having the above-mentioned features and a plurality (in particular still integrally connected) a component carrier structure composed of a preform.

According to yet another exemplary embodiment of the present invention, there is provided a reflow oven for a part carrier structure comprising a plurality of preforms of a part carrier, wherein the reflow oven has the above-mentioned features for handling the part carrier structure. and a heating unit configured to heat the handling device with the preform of the part carrier mounted therein.

According to a further exemplary embodiment of the present invention, there is provided a method for handling a part carrier structure comprising a plurality of preforms of a part carrier during temperature processing (especially in a reflow oven), wherein the method comprises a handling device (especially above receiving a part carrier structure between a first jig and a second jig of a handling device having the mentioned features), the first jig and the second jig and an array of magnets forming part of one of the first and second jigs; generating an attracting force between the plates (preferably metal plates) forming part of the other of the jig, and heating the handling device together with the preform of the part carrier for temperature treatment (especially reflow soldering) including the steps of

According to a further exemplary embodiment of the present invention, there is provided a method for handling a part carrier structure comprising a plurality of preforms of a part carrier during temperature processing (especially in a reflow oven), wherein the method comprises a handling device (especially above receiving a part carrier structure between a first jig and a second jig of a handling device having the mentioned features), at least one of a first jig and a second jig comprising a plurality of bars arranged between different preforms of the part carrier supporting the part carrier structure by the support structure of

In the context of the present application, the term "component carrier" denotes any support structure capable of receiving one or more components thereon and/or within, in particular for providing mechanical support and/or electrical connection. . In other words, the part carrier may be configured as a mechanical and/or electrical carrier for the part. In particular, the component carrier may be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) board. The component carrier may also be a hybrid board combining different of the above-mentioned types of component carriers.

In the context of the present application, the term “component carrier structure” may refer in particular to thin sheets that are handled and processed during the manufacture of a part carrier, for example a panel, or an array of part carriers. In particular, the preforms of the part carrier can be integrally connected and thus form part of an integral part carrier structure and can, for example, still be present on panel level.

In the context of this application, the term “handling device for handling a part carrier structure” denotes an apparatus configured to hold a part carrier structure, such as a PCB panel, during processing, particularly at high temperatures that may occur in reflow ovens. can Such handling can be performed in a controlled manner, in particular for maintaining the part carrier structure in a predefined shape, position and orientation.

In the context of this application, the term “jig” is specifically designed to cooperate with another jig to define an accommodation volume therebetween, which is configured to hold a sheet-shaped component carrier structure such as a PCB panel. Represents a base or lid member. In other words, each jig may contribute to a receiving volume defined between the two cooperating jigs and shaped and dimensioned to receive the part carrier structure. Moreover, the cooperative jig may include a provision to hold the jig together in a stable predefined configuration.

In the context of the present application, the term “suppressing deformation” or “flattening” of a component carrier structure is used in particular to suppress warping, bending and wrinkling of a sheet-shaped component carrier structure such as for example a PCB panel. It can show the tendency of attracting magnetic force for To achieve this, the arrangement of the jig can apply a force to the part carrier structure to maintain the latter in a planar, flat shape.

In the context of the present application, the term "bar" refers in particular to elongate, configured for example as a strip or web and configured to support the part carrier structure while being received between jigs. ) can represent a physical body. For example, the width of each bar may be in the range of 0.1 mm to 1 mm, in particular in the range of 0.3 mm to 0.5 mm.

In the context of the present application, the term “temperature treatment” may refer in particular to a heat treatment or one or more processes which subject the part carrier structure to a (particularly significant) temperature change, for example in a reflow oven.

In the context of this application, the term “reflow oven” may refer to a device for processing component carrier structures, such as PCB panels, in particular during reflow soldering. In other words, the reflow oven may be configured to bring the part carrier structure handled by the handling device to a temperature at which the solder material of the part carrier structure can melt. In particular, the reflow oven may be configured to heat the part carrier structure to a temperature of at least 200°C, in particular at least 250°C, more particularly at least 270°C or even at least 290°C. The reflow oven may include multiple zones, which may be individually controlled for temperature. For example, a reflow oven may include several heating zones followed by one or more cooling zones, wherein the part carrier structure may move through the reflow oven on a conveyor belt or the like, thus providing a controlled time-temperature profile. can receive The one or more heating units of the reflow oven may be embodied as one or more infrared heaters (which can transfer heat to the part carrier structure by means of radiation of wavelengths in the infrared range). A heating unit of a reflow oven that uses one or more fans to force heated air towards the part carrier structure may be referred to as an infrared convection heating unit. Reflow soldering may refer to a process in which solder paste (eg, a tacky mixture of powder solder and flux) is used to temporarily attach one or more electronic components to their contact pads, after which the entire assembly is subjected to controlled heat. The solder paste reflows in the molten state, creating a permanent solder joint.

According to an exemplary embodiment of the present invention, there is provided a handling device for handling a part carrier structure, such as a panel comprising preforms of a plurality of component carriers (eg PCBs, printed circuit boards), for handling high temperature processes such as reflow Contributes to structural stabilization of the treated component carrier structure during soldering.

According to an exemplary embodiment of the first aspect of the present invention, this can be achieved by holding the part carrier structure between two opposing jigs of the handling device, the jig defining a receiving volume for the part carrier structure and the jig It includes a spatially distributed arrangement of magnets on one of them. The magnet is capable of generating an attractive force in conjunction with the (preferably metallic) plate of another jig. Such a jig configuration can be manufactured simply and allows safe protection of the handled part carrier structure against unwanted warping, wrinkling or bending. Thus, the component carrier structure can be of a well-defined and stable configuration that allows to perform the reflow soldering process with high accuracy.

According to an embodiment of the second aspect of the present invention, a handling device comprising two cooperating jigs for handling a part carrier structure during heat treatment (eg reflow soldering) is inter alia for defining a mechanically stable support structure with each other. The arrangement of bars may be mounted on at least one of the jigs which may extend in parallel and/or vertically. This can ensure that the part carrier structure is reliably maintained in a predefined configuration during handling so that unwanted warping, wrinkling or bending of the part carrier structure can be reliably avoided. The array of bars in at least one of the jigs also provides for the thermal processing of the handling device during high-temperature processing (eg about 100° C., especially above 200° C.), as adequate heat transfer to the received part carrier structure can be achieved with such a design. characteristics can have a positive effect.

According to an exemplary embodiment of the present invention, there is thus provided a handling device comprising two cooperating jigs for holding and carrying a board-type component carrier structure. The handling device may be composed of a lower jig and an upper jig. The lower jig may include a built-in magnet capable of attracting the upper jig to the lower jig by magnetic force. An advantage of such a magnetic connection is that the part carrier structure can be easily attached to and detached from the handling device. Moreover, unwanted deformations (eg warping) of the board-shaped component carrier structure can be reliably prevented. Besides this, unwanted disassembly of the handling device can be prevented by means of a magnetic bias force. Moreover, the effective heat capacity may be reduced by the frame-shaped design of at least one of the jigs, which may be provided by the provision of a bar. A component carrier (especially a board or printed circuit board) can be placed on a jig on panel level, and after heat treatment (especially a reflow process), the panel or individual component carrier can be removed from the jig.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

In the following, further exemplary embodiments of a handling device, method, arrangement and reflow oven will be described.

When the handling device consists of an arrangement of cooperating magnets and metal plates, the provision of a bar with a recess therebetween ensures reliable reflow soldering while flattening and supporting the part carrier structure during handling in a reflow oven. can work synergistically. The cooperating metal plate and magnet may generate a magnetic force while at least one bar of the jig may promote thermal properties. Both measures together ensure the production of a component carrier with high thermal, mechanical and electrical reliability.

In one embodiment, the array of magnets is formed as part of only one of the first jig or the second jig, while the magnets are not arranged in each other jig. This may be appropriate, for example, when the other jig comprises a metal plate.

In another embodiment, the array of magnets may be formed as part of each of the first jig and the second jig. For example, if a metal plate is not used for each jig, the magnet may be provided on both jigs (especially on both jig plates). Instead of metal, it may be possible to use a non-metallic material for the plate. The non-metallic material may cooperate with the magnet to provide a magnetic force for handling the substrate.

In one embodiment, the plate is made of a material that supports heat distribution and/or redirection of the part carrier structure. Preferably, the plate is a metal plate. However, it may also be possible for the plate to include a material such as a glass composite.

In one embodiment, the magnet is connected to the support structure. Connecting the magnet to the support structure is such that the attractive magnetic force and the supporting mechanical force can function together to maintain the part carrier structure flat and in a predefined configuration while the corresponding force is simultaneously and reliably heatable of the handling device. It can be guaranteed to be provided in the area. In particular, when the support structure is composed of an array of first and second bars, the first and second bars being oriented perpendicular to each other, the resulting grid-like arrangement is each A high mechanical holding force can be generated when cooperating with magnets arranged at the intersection of the horizontal bars of

In one embodiment, the magnet forms part of the bottom jig and the metal plate forms part of the top jig. For example, the bottom jig may include an entire array of magnets and may have no continuous metal plate, while the top jig may include a substantially continuous metallic plate and lack magnets. As a result, a high magnetic connection force can be generated, and the top jig can nevertheless be kept thin, which is advantageous in terms of stability. Moreover, such a configuration can ensure that the temperature gradient across the panel can be small.

In one embodiment, the magnet is made of a material having a Curie temperature of at least 200°C, in particular at least 250°C. As is known by those skilled in the art, the Curie temperature or Curie point is the temperature above which a material loses its permanent magnetic properties. To be suitable for use in a reflow oven, the magnet's Curie temperature must be higher than that of reflow soldering. When using a magnet with a Curie temperature greater than 250°C, the magnet and thus the handling device as a whole may be suitable for reflow soldering.

In one embodiment, the force exerted on the part carrier structure by the attractive force generated by the magnet and the metal plate is at least 10 N, in particular at least 20 N. By generating a force of at least 10 N and preferably at least 20 N, the handling device ensures that the sheet-like part carrier structure remains reliably in a flat or planar configuration and is not prone to bending or wrinkling during handling and especially during reflow soldering. can guarantee At the same time, such a force is adequate enough to prevent undesired mechanical impacts that deteriorate the structure of the component carrier structure.

In one embodiment, the magnet is made of a permanent magnetic material. When the magnet is made of a permanent magnetic material, such as a ferromagnetic or ferrimagnetic material, it may be sufficient to avoid the need for continuous remagnetization of the magnet. This results in a simple configuration of the handling device.

In one embodiment, the support structure is made of a thermally conductive material. For example, the material of the support structure consists of a material having a thermal conductivity of at least 10 W/mK, in particular at least 50 W/mK, preferably at least 100 W/mK. In a preferred embodiment, the metal jig may be made of an aluminum alloy due to its high thermal conductivity, for example above 200 W/mK. In general, the higher the thermal conductivity, the better. For example, the support structure may be made of metal to provide such good thermal conductivity. Consequently - for example - the grid-like support structure can thus function to thermally equalize potential temperature differences along the handled part carrier structure. For example, heat can be removed by the support structure from the hot spots of the part carrier structure and supplied to the cold spots. This avoids any unwanted thermal gradients in the part carrier structure that may promote unwanted formation such as warpage.

In one embodiment, the bars extend parallel to each other. For example, all the bars may extend parallel to each other horizontally or vertically. This can ensure a simple construction of the handling device while simultaneously ensuring the proper exercise of the bearing force from the handling device to the part carrier structure.

In another embodiment, the bar includes a first bar extending parallel to each other along a first direction and a second bar extending parallel to each other along a second direction perpendicular to the first direction such that the bar is recessed to form a grid with In particular, each recess of the grid may correspond to one component carrier or a central part thereof. A surface portion of each part carrier corresponding to each recess may correspond to a part carrier region in which a part (eg, a semiconductor die) is to be surface mounted. Solder paste may be applied to the component carrier area. According to such a preferred configuration, a grid of two vertically extending bars can form a grid for reliably supporting the component carrier structure. When the dimension of each recess defined by the pair of first bars and the pair of second bars corresponds to the dimension of the part carrier or its preform currently being manufactured, the holding device does not touch the part carrier structure in its functional part. It can be guaranteed that no In contrast to this, it can then be ensured that the support structure only contacts the part carrier structure to be flattened and supported in the region between those functionally useful areas of the part carrier.

In one embodiment, each of the first jig and the second jig comprises a pin for applying a connecting force (in particular pressing on) to the part carrier structure from two opposing main surfaces. In particular, such a pin sandwiching the part carrier structure therebetween may be the only physical body in direct physical contact with the part carrier structure accommodated in the handling device. Advantageously, the pins provided on one or both of the jigs can define a position where the part carrier structure is in direct physical contact with the handling device during use, for example to be clamped between the pins. Preferably, the part carrier structure may not have any physical contact with the handling device at another location away from the pins. This can reliably prevent any damage to the component carrier structure during handling and reflow soldering away from the pins.

In one embodiment, the pin of one of the first jig and the second jig including the magnet is integrally formed with the magnet. In other words, magnetic pins may be provided. Merging the pins and magnets by joining them into a common structure can render the handling device compact and simple in structure. Moreover, it can reduce the space between the magnet and the metal plate, so that the provision of the magnetic pin can also improve the connection force between the jigs and improve the impact of force on the part carrier structure.

In one embodiment, at least a portion of the magnets have a grid at the intersection between a first bar extending parallel to each other along a first direction and a second bar extending parallel to each other along a second direction perpendicular to the first direction mounted on top The force transmission between the handling device and the part carrier structure is particularly advantageous when the magnets are mounted on the jig at the intersection of the grid of the jig.

In one embodiment, each of the first jig and the second jig comprises a support structure, each comprising a plurality of bars, in particular forming a grid. Preferably, a grid on the two jigs can be provided which can expose the preform of the component carrier during reflow soldering on its two opposing main surfaces.

In one embodiment, only one of the first jig and the second jig comprises an array of magnets. This allows to keep the other jig without magnets - preferably the top jig - simple and compact and to reduce the thickness of the other jig and the handling device as a whole.

In one embodiment, only one of the first jig and the second jig comprises a metal plate. Advantageously, the jig with magnets (preferably the bottom jig) may be free of a continuous metal plate, which further contributes to the compact nature of the handling device.

In one embodiment, the first jig and the second jig are configured to apply a vertical fixing force to the part carrier structure only at a plurality of point connections, wherein the point connections are located between adjacent adjacent preforms of the part carrier in particular. The point connection can be established by the pins of the two jigs, which are preferably aligned with each other. Providing multiple point connections rather than large-surface area connections can keep the clamping impact on the part carrier structure small.

In one embodiment, the heating unit is configured to heat the handling device together with the preform of the part carrier to at least 200°C, in particular to at least 250°C. When the heating unit of the reflow oven is configured to heat the part carrier structure to more than 200°C and preferably to more than 250°C, the reflow oven supports reflow soldering with a number of different solder materials that can be applied to the part carrier structure. can do.

In one embodiment, each surface of the preform of the component carrier is provided with solder paste prior to reflow soldering. For example, the solder paste may be applied to the component carrier structure by printing or dispensing or by stenciling. In particular, the method may include surface mounting the component onto the solder paste of the preform of the component carrier before the component carrier structure is moved to a reflow oven for reflow soldering. Such solder pastes may include solderable particles in a matrix such as a solvent. Such solder paste may be processed in a reflow oven to render the component carrier structure and in particular the component carrier solderable with surface-mount components, such as capacitor components or semiconductor chips.

In one embodiment, the component carrier comprises a stack of at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier may be a laminate of the mentioned electrically insulating layer structure(s) and electrically conductive layer structure(s), formed in particular by applying mechanical pressure and/or thermal energy. The stack mentioned can provide a large mounting surface for additional components and nevertheless provide a very thin and compact plate-shaped component carrier.

In one embodiment, the part carrier is shaped as a plate. This contributes to a compact design, where the part carrier nevertheless provides a large basis for mounting parts thereon. Moreover, a particularly naked die, as an example for an embedded electronic component, can be conveniently embedded, thanks to its small thickness, into a thin plate such as a printed circuit board.

In one embodiment, the component carrier is configured as one of the group consisting of a printed circuit board, a board (particularly an IC board), and an interposer.

In the context of the present application, the term "printed circuit board" (PCB) is in particular formed by laminating several electrically insulating layer structures and several electrically conductive layer structures, for example by application of pressure and/or by supply of thermal energy. plate-shaped component carrier. As a preferred material for PCB technology, the electrically conductive layer structure is made of copper, while the electrically insulating layer structure may comprise resin and/or glass fibers, so-called prepreg or FR4 material. The various electrically conductive layer structures can be interconnected in a desired manner by forming holes through the laminate and partially or completely filling them with an electrically conductive material (especially copper), for example by laser drilling or mechanical drilling, in which to form a via or any other through-hole connection. Filled holes connect the entire stack (through-hole connections that extend through several layers or the entire stack), or filled holes connect at least two electrically conductive layers, referred to as vias. Similarly, optical interconnects may be formed through individual layers of the stack to accommodate an electro-optic circuit board (EOCB). Except for one or more components that may be embedded in the printed circuit board, the printed circuit board is typically configured to receive one or more components on one or two opposing surfaces of a plate-shaped printed circuit board. They can be connected to each main surface by soldering. The dielectric portion of the PCB may be composed of a resin with reinforcing fibers (eg glass fibers).

In the context of the present application, the term “substrate” may denote in particular a small component carrier. The substrate, in the context of a PCB, may be a relatively small component carrier on which one or more components may be mounted and which may serve as a connecting medium between one or more chip(s) and a further PCB. For example, the substrate may have substantially the same size as a component (especially an electronic component) to be mounted thereon (eg, in the case of a Chip Scale Package (CSP)). More specifically, a substrate can be understood as a component carrier comparable to a printed circuit board (PCB) as well as a carrier for electrical connections or electrical networks, but with a significantly higher density of lateral and/or vertically arranged connections. The lateral connection can be, for example, a conductive path, while the vertical connection can be, for example, a drill hole. These lateral and/or vertical connections are arranged within the substrate and provide electrical, thermal and/or mechanical connection of printed circuit boards or intermediate printed circuit boards with housed or unhousing components (eg bare dies), in particular IC chips. can be used for Accordingly, the term “substrate” also includes “IC substrate”. The insulating portion of the substrate may be composed of a resin having reinforcing particles (eg reinforcing spheres, particularly glass spheres).

The substrate or interposer may be at least a photoimageable or dry-etchable organic material such as glass, silicon (Si) and/or an epoxy-based build-up material (eg an epoxy-based build-up film) or a polyimide or polybenzo may comprise or consist of a layer of a polymeric compound (which may or may not contain photosensitive- and/or thermosensitive molecules) such as oxazole.

In one embodiment, the at least one electrically insulating layer structure is a resin or polymer, such as an epoxy resin, a cyanate ester resin, a benzocyclobutene resin, a bismaleimide-triazine resin, a polyphenylene derivative (eg polyphenylene). ether, based on PPE), polyimide (PI), polyamide (PA), liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE) and/or combinations thereof. Reinforcing structures such as webs, fibers, spheres or other types of filler particles, for example made of glass (multilayer glass), may also be used to form the composite. A semi-cured resin combined with a fiber impregnated with a reinforcing agent, for example the above-mentioned resin, is referred to as a prepreg. Such prepregs are often named eg FR4 or FR5 according to their properties, which describes their flame retardant properties. Prepregs especially FR4 are usually preferred for rigid PCBs, although other materials, particularly epoxy-based build-up materials (eg build-up films) or photoimageable dielectric materials may also be used. For high frequency applications, high frequency materials such as polytetrafluoroethylene, liquid crystal polymers and/or cyanate ester resins may be preferred. In addition to these polymers, low temperature cofired ceramic (LTCC) or other low, very low or ultra-low DK materials may be applied to the component carrier as electrically insulating structures.

In one embodiment, the at least one electrically conductive layer structure comprises at least one of the group consisting of copper, aluminum, nickel, silver, gold, palladium, tungsten and magnesium. Copper is usually preferred, but other materials or coated versions thereof are also possible, in particular coated with a super-conducting material or a conducting polymer such as graphene or poly(3,4-ethylenedioxythiophene) (PEDOT) respectively.

At least one component that can be surface mounted on and/or embedded within the component carrier is an electrically non-conductive inlay, an electrically conductive inlay (preferably comprising copper or aluminum, such as a metal inlay), heat transfer It may be selected from the group consisting of a unit (eg, a heat pipe), a light guiding element (eg, an optical waveguide or optical conductor connection), an electronic component, or a combination thereof. The inlay may be, for example, a metal block, with or without an insulating material coating (IMS-inlay), which may be embedded or surface mounted for the purpose of facilitating heat dissipation. A suitable material is defined according to its thermal conductivity, which should be at least 2 W/mK. Such materials are often based on, but not limited to, metals, metal-oxides and/or ceramics such as, for example, copper, aluminum oxide (Al ₂ O ₃ ) or aluminum nitride (AlN). To increase the heat exchange capacity, other geometries with increased surface area are also frequently used. Moreover, the component is an active electronic component (with at least one pn-junction implemented), a passive electronic component such as a resistor, inductance, or capacitor, an electronic chip, a storage device (eg DRAM or other data memory), a filter, an integrated Circuitry (such as field-programmable gate arrays (FPGA), programmable array logic (PAL), generic array logic (GAL), and complex programmable logic devices (CPLD)), signal processing components, power management components (all semiconductor materials such as eg field-effect transistors based on silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga ₂ O ₃ ), indium gallium arsenide (InGaAs) and/or any other suitable inorganic compound (FET), metal-oxide-semiconductor field-effect transistor (MOSFET), complementary metal-oxide-semiconductor (CMOS), junction field-effect transistor (JFET), or insulated-gate field-effect transistor (IGFET)); Optoelectronic interface elements, light emitting diodes, photocouplers, voltage converters (eg DC/DC converters or AC/DC converters), cryptographic components, transmitters and/or receivers, electromechanical transducers, sensors, actuators, microelectromechanical systems ( MEMS), microprocessors, capacitors, resistors, inductances, batteries, switches, cameras, antennas, logic chips, and energy harvesting units. However, other components may be incorporated into the component carrier. For example, a magnetic element may be used as a component. Such magnetic elements may be permanent magnetic elements (eg ferromagnetic elements, antiferromagnetic elements, multiferromagnetic elements or ferrimagnetic elements such as ferrite cores) or may be paramagnetic elements. However, the component may also be an IC substrate, an interposer or an additional component carrier, for example in a board-in-board configuration. The component may be surface mounted on and/or embedded within the component carrier. Furthermore, other components may also be used as components, in particular those that generate and emit electromagnetic radiation and/or are sensitive with respect to electromagnetic radiation propagating from the environment.

In one embodiment, the part carrier is a stacked part carrier. In such embodiments, the part carrier is a compound of multilayer structures that are laminated and joined together by applying a pressing force and/or heat.

After treating the inner layer structure of the component carrier, one or two opposing main surfaces of the treated layer structure are symmetrically or asymmetrically applied with one or more additional electrically insulating layer structures and/or electrically conductive layer structures (especially for lamination). by) it is possible to cover In other words, the build-up may continue until the desired number of layers is obtained.

After completing the formation of the stack of the electrically insulating layer structure and the electrically conductive layer structure, it is possible to proceed with surface treatment of the obtained layer structure or component carrier.

In particular, an electrically insulating solder resist may be applied to one or two opposing main surfaces of the layer stack or component carrier in terms of surface treatment. For example, forming such a solder resist on the entire main surface and thereafter patterning a layer of solder resist to expose one or more electrically conductive surface portions used to electrically couple a component carrier to an electronic perimeter may be useful. It is possible. The surface portion of the component carrier which remains covered with the solder resist, in particular the surface portion comprising copper, can be effectively protected against oxidation or corrosion.

It is also possible in terms of surface treatment to selectively apply a surface finish to the exposed electrically conductive surface portion of the component carrier. Such a surface finish may be an electrically conductive cover material on an electrically conductive layer structure (especially comprising or consisting of copper, such as a pad, conductive track, etc.) exposed on the surface of the part carrier. If such an exposed electrically conductive layer structure is left unprotected, then the exposed electrically conductive part carrier material (especially copper) may be oxidized, making the part carrier less reliable. Here, the surface finish can be formed, for example, as an interface between the surface-mounted component and the component carrier. The surface finish has the function of protecting the exposed electrically conductive layer structures (especially copper circuits) and enabling a bonding process with one or more components, for example by soldering. Examples of suitable materials for the surface finish include Organic Solderability Preservative (OSP), Electroless Nickel Immersion Gold (ENIG), Electroless Nickel Immersion Palladium Immersion Gold; ENIPIG), gold (especially hard gold), chemical tin, nickel-gold, nickel-palladium, and the like.

Aspects defined above and further aspects of the present invention are apparent from, and described with reference to, examples of embodiments to be described below.

1 illustrates a cross-sectional view of a portion of a handling device according to an exemplary embodiment of the present invention;
2 illustrates a side view of a part carrier structure before and after heat treatment of a handling device according to an exemplary embodiment of the present invention;
3 illustrates a side view of a part carrier structure before and after heat treatment of a conventional handling device;
4 illustrates a plan view of the first jig at the lower side of the handling device according to an exemplary embodiment of the present invention.
FIG. 5 illustrates a top view of a second jig on the upper side for cooperation with the first jig according to FIG. 4 .
6 illustrates a first jig at the lower side of the handling device according to an exemplary embodiment of the present invention.
7 illustrates a top-side second jig of a handling device comprising the first jig according to FIG. 6 .
8 illustrates different manufacturing stages, including a reflow solder stage, to be performed during a method of manufacturing a component carrier according to an exemplary embodiment of the present invention.
9 is a detailed view of a bar of a second jig of a handling device according to an exemplary embodiment of the present invention.

Examples of the drawings are schematic. In different drawings, like or identical elements are provided with the same reference numerals.

Earlier, with reference to the drawings, exemplary embodiments will be described in more detail, and some basic considerations will be summarized based on which exemplary embodiments of the present invention have been developed.

According to an exemplary embodiment of an aspect of the present invention, a handling device having two cooperating jigs may be provided for facilitating flattening of a sheet-shaped part carrier structure during reflow soldering, wherein such handling device is one of the jigs. It may include a magnet on one side and a metal plate on the other. The attractive magnetic force between the magnet and the metal plate can then reliably prevent warping, wrinkling and bending of the part carrier structure. During reflow soldering, the solder paste, solder bumps or any other solder material on the component carrier structure is deposited on the component carrier (e.g. a printed circuit board or integrated circuit) of the component carrier structure (particularly a panel comprising still integrally connected preforms of the component carrier). can be melted for surface mount components on the substrate).

According to an exemplary embodiment of a second aspect of the present invention, there is provided a handling device for handling a part carrier structure during reflow soldering, which consists of a pair of opposing jigs, one arranged on the part carrier structure to be handled and the other is arranged below. At least one (and preferably both) of the bottom jig and the top jig may include, for example, a grid-shaped support structure for applying a bearing force to the part carrier structure. At the same time, the recess in the support structure may keep at least a portion of the preform of the part carrier exposed, which may promote heat transfer during reflow soldering, which may result in excessive contact of the preform of the part carrier with the handling device. can reduce the risk of damage.

Preferably, a grid of first bars extending in a first direction and a second bar extending in different (preferably vertical) directions may be provided on one or both of the jigs. The arrangement of such bars can be configured according to the panel size so that each opening of this grid can correspond to, for example, one printed circuit board or card or unit of a panel-type component carrier structure. As a result, not only the individual component carriers can be adequately supported by the grid, but also the entire panel. In particular when combining such a grid with an array of magnets on only one of the cooperating jigs in such a way as to attract a metal plate on another jig, a simple and compact handling device can be provided, wherein in particular a metal plate and a jig (preferably The thickness of the upper jig) may be made very small. By avoiding magnets on the top jig, preferably very thin, it may be possible to achieve adequate stability. Moreover, the described configuration can ensure that no appreciable temperature gradient is created across the panel. Preferably, the metal plate of the top jig may be made of iron or aluminum alloy, ie a material capable of being magnetically attracted by the magnet of another jig. The magnet may be made of a permanent magnetic material. During reflow soldering of the component carrier structure being handled by the handling device, a temperature in the range of 200° C. to 290° C. for example may be applied. Preferably, the permanent magnetic material of the magnet is configured such that the attractive magnetic force of the magnet is maintained even at such highly elevated temperatures. Consequently, a magnetic material having a sufficiently high Curie temperature must be used. Due to the above-described configuration of the handling device, the temperature profile of the part carrier structure during reflow soldering can be improved and in particular can be equilibrated.

Advantageously, each of the jigs can be equipped with one or preferably more restraining pins which can clamp the part carrier structure therebetween during use. Such pins may be positioned between the surface areas of the component carrier structure to which the component, eg, a semiconductor die, will be mounted by soldering. Correspondingly, also areas such as solder bumps can be located away from areas where the pins of the jig cooperate. This can ensure adequate stability and protection of the component carrier structure against damage. Preferably, the bars and also pins of the support structure can be arranged in a singulation line of the part carrier structure, ie in an area where the part carrier structure will later be singulated into an individual part carrier. For example, the width of the bars may thus range from 0.3 mm to 0.5 mm, ie the width of the grid lines may be very small.

When constructing the support structure as a grid comprising bars extending in a first direction and additional bars extending perpendicular thereto, the handling device is capable of contributing to a uniform heat supply, heat removal, heat balance and heat diffusion, so that the handling device can contribute to a uniform heat supply, heat removal, heat balancing and heat diffusion. , especially suitable for high temperature applications. In other words, a thermally suitable conductive grid having a matrix-like array of recesses between the bars making up the grid can contribute to temperature equilibrium across the entire part carrier structure.

For high performance component carrier applications (especially concerning printed circuit boards and integrated circuit boards), compliance with the required specifications is desirable in terms of land coplanarity (ie the level of distortion obtained). Meeting such requirements traditionally entails the risk of a significant reduction in yield.

To overcome such drawbacks, exemplary embodiments provide a handling device for handling a part carrier structure, such as a panel, based on two cooperating jigs to provide full mechanical support for the processed part carrier structure. In particular, such a handling device may be able to press or clamp all the substrate units of the part carrier structure in place during high temperature processing to obtain excellent results in terms of land coplanarity. At the same time, the yield obtained when producing the part carrier can be significantly improved. In particular, the exemplary embodiment of the present invention can improve the efficiency and keep the manufacturing time small. Land coplanarity can be achieved with low effort. Accordingly, an exemplary embodiment of the present invention provides a magnetic jig pair for improved land coplanarity of a manufactured part carrier.

For example, one of the jigs may mount a plurality of magnets, for example, 80 pieces of magnets having a thickness of 2 mm. The magnet may be embedded into a bottom jig, for example 5 mm thick, to hold a component carrier structure comprising a plurality of substrate units together with a top jig.

Moreover, to ensure that the preform of the part carrier of the part carrier structure is produced without shape curvature during high temperature processing, it may be possible to configure one or both of the jigs with a frame and pocket design. In particular, providing the magnet embedded into the lower jig can support a uniform force pressure applied on the substrate unit from the upper jig. With the pocket design, it may be possible that all substrate units can be supported by the bottom jig. For example, a magnetic jig with a pocket design can apply a force of approximately 20 N on a substrate-type component carrier structure.

During high temperature processing (especially during reflow soldering), the handling device according to an exemplary embodiment of the present invention will ensure that all substrate units of the component carrier structure can be held to shape without risk of curving or warping. can Very advantageously, the land coplanarity (ie the deviation of the land or pad on the main surface of the stack from the horizontal direction) can be improved significantly.

1 illustrates a cross-sectional view of a portion of a handling device 100 according to an exemplary embodiment of the present invention.

The handling device 100 , shown only partially in FIG. 1 , is used during a manufacturing process for a plurality of parts carrier 104 (eg, a printed circuit board (PCB) or an integrated circuit (IC) substrate) at a high temperature of, for example, at least 200° C. It serves to handle the part carrier structure 102 (eg, a panel having dimensions of 12 x 18 square inches or greater) that is comprised of a preform. Preferably, the handling device 100 with the received part carrier structure 102 can be processed in a reflow oven (see reference numeral 106 in FIG. 8 ).

In the illustrated embodiment, the handling device 100 comprises a first jig 108 and a second jig 110 that can be assembled together. The jigs 108 , 110 are configured to receive the part carrier structure 102 therebetween. The first jig 108 may be a bottom-side jig that supports the component carrier structure 102 from below. In contrast to this, the second jig 110 may be a top-side jig to be arranged over the part carrier structure 102 .

Advantageously, an array of magnets 112 forming part of the first jig 108 may be provided to apply an attractive magnetic force to the second jig 110 . To make this possible, the second jig 110 includes a metal plate 114 (eg made of iron) that can be attracted by the magnet 112 of the first jig 108 . The second jig 110 does not have an embedded magnet in the illustrated embodiment. Accordingly, the magnet 112 may be configured to create an attractive force with the metal plate 114 to hold the jigs 108 , 110 with the part carrier structure 102 clamped therebetween. This configuration allows to keep the part carrier structure 102 flat during reflow soldering by suppressing any tendency of deformation. In particular, any unwanted tendency of warping can be effectively suppressed, and excellent properties in terms of land coplanarity can be achieved with the easily manufactured component carrier 104 .

1 shows a side view of a handling device 100 and in particular illustrates the position of the lower side first jig 108 and the upper side second jig 110 . The thickness, D, of the part carrier structure 102 handled by the handling device 100 may be, for example, about 0.6 mm. The part carrier structure 102 is held between the restraining pins 124 formed on both the lower side first jig 108 and the upper side second jig 110 at corresponding positions, whereby the part carrier structure 102 is Each portion is fastened (eg, clamped) between two opposing restraining pins 124 of the first jig 108 and the second jig 110 , respectively.

Advantageously, the array of pins 124 of the first jig 108 and the array of pins 124 of the second jig 110 are spatially aligned with each other. This keeps the surface portion of the part carrier structure 102 in contact with the jigs 108 , 110 small and ensures force transmission from the handling device 100 to the part carrier structure 102 , which does not cause deformation of the latter.

Accordingly, the alignment of the aligned restraining pins 124 of the jigs 108 , 110 can ensure proper handling of the part carrier structure 102 in properly defined positions while physical contacting the part carrier structure 102 . ) is avoided in other locations. This protects the part of the part carrier structure 102 that forms the part carrier 104 from damage later (ie, after completing the manufacturing process and after separation). In addition to the direct physical pin contact applied by the cooperative restraining pins 124 and holding the part carrier structure 102 in place, the attractive magnetic force between the lower side magnet 112 and the upper side metal plate 114 is applied to the jig 108 . , 110) may create a connection force between them. The fact that the pins 124 of the first jig 108 are integrally formed with the magnet 112 further reduces the vertical distance between the magnet 112 and the metal plate 114 and thereby also contributes to a high connection force. .

As can be derived from FIG. 1 , the first jig 108 and the second jig 110 are configured to apply a vertical clamping force to the part carrier structure 102 only at a plurality of point connections. Advantageously, a point connection can be located between adjacent preforms of the part carrier 104 (eg in the region of the separation line where the panels are to be separated into individual part carriers 104 ). By taking these measures, it can be ensured that the part carrier 104 is not damaged by the clamping force exerted on the part carrier structure 102 between the jigs 108 , 110 . Preferably, the point connection is established by alignment pins 124 on two opposite sides of the part carrier structure 102 . More advantageously, the pins 124 of the first jig 108 are configured as magnetic pins, ie pins formed by the magnets 112 .

The support grid 120 (not shown in Fig. 1, but shown in Figs. 4-7) formed by the array of bars 118 can further increase stability and reduce heat spread and heat distribution during reflow soldering. can contribute Such a grid structure can also be provided for the handling device 100 according to FIG. 1 .

2 illustrates a side view of a portion of a part carrier structure 102 before and after heat treatment in a handling device 100 according to an exemplary embodiment of the present invention. 3 illustrates a side view of a part carrier structure 202 before and after heat treatment in a conventional handling device.

Referring first to the conventional approach according to FIG. 3 , a treated part carrier structure 202 can deform in a significant way during a thermal process. In particular, the center of the part carrier structure 202 may be prone to excessive bending, as schematically indicated by arrow 204 . This may be caused by the design of the jig of the handling device which does not have any support in the panel center. Therefore, the shape of the substrate cannot be properly controlled according to FIG. 3, which may cause significant defects. Thermal loads acting on the part carrier structure 202 particularly during reflow soldering can typically cause significant distortion of the part carrier structure 202 .

In order to overcome such drawbacks, a handling device 100 schematically illustrated in FIG. 2 is provided according to an exemplary embodiment of the present invention. The illustrated pocket design allows the part carrier structure 102 to remain substantially planar. Due to the correct holding of the part carrier structure 102 during reflow soldering, the handling device 100 ensures a substantially flat configuration of the properly supported part carrier structure 102 , thereby Any tendency of warping, wrinkling, or bending of the can be strongly suppressed.

4 illustrates a plan view of the lower-side first jig 108 of the handling device 100 according to an exemplary embodiment of the present invention. FIG. 5 illustrates a top view of the top side second jig 110 of the handling device 100 with the first jig 108 according to FIG. 4 .

As mentioned above, the handling device 100 serves to handle the part carrier structure 102 consisting of a plurality of preforms of the part carrier 104 in the reflow oven 106 during manufacturing the part carrier 104 . do The handling device 100 includes a first jig 108 and a second jig 110 configured to receive a part carrier structure 102 therebetween.

Moreover, the support structure 116 is provided on both the first jig 108 and the second jig 110 . Each support structure 116 is arranged between different preforms of the part carrier 104 (when the assigned part carrier structure 102 is assembled to the handling device 100 ) and includes a plurality of supporting parts carrier structures 102 . bar 118 of Preferably, the support structure 116 may be made of a thermally conductive material to improve thermal management during reflow soldering. For example, the material of the support structure 116 of each of the jigs 108 , 110 may have a thermal conductivity of at least 10 W/mK, preferably at least 50 W/mK.

As already described above, the first jig 108 mounts a plurality of magnets 112 to generate a magnetic force that attracts the metal plate 114 of the second jig 110 . The magnet 112 creates an attractive force with the metal plate 114 to flatten the part carrier structure 102 therebetween. In the illustrated embodiment, the magnet 112 is connected to the support structure 116 of the first jig 108 . Preferably, the magnet 112 is made of a permanent magnetic material. Advantageously, the magnet 112 is made of a material having a Curie temperature of at least 250° C. so that the magnet 112 continues to generate an attractive magnetic force even at high temperatures, ie at the operating temperature of the reflow solder oven 106 . The magnet 112 and the metal plate 114 may be configured such that the magnetic force applied to the part carrier structure 102 by the attractive force generated by the magnet 112 and the metal plate 114 is, for example, about 20 N. .

4 and 5 , the bars 118 include first bars 118a extending parallel to each other along a first direction and extending parallel to each other along a second direction perpendicular to the first direction. The bars 118a , 118b form a grid with recesses 122 by including a second bar 118b that is Each recess 122 of the grid 120 may correspond to one part carrier 104 of the part carrier structure 102 .

Very advantageously and as best seen in FIG. 1 , each of the first jig 108 of FIG. 4 and the second jig 110 of FIG. 5 exerts a connecting force to the part carrier structure 102 from two opposing main surfaces. It includes a pin 124 for applying. The pin 124 may be the only physical body of the handling device 100 in direct physical contact with the part carrier structure 102 received in the handling device 100 . This prevents the preform of the part carrier 104 from damage during handling.

As illustrated by reference numeral 150 in FIG. 4 , additional holes may be opened in the first jig 108 to further improve the reflow profile and handling. As illustrated by reference numeral 112 ′, edge magnets may be provided at corresponding locations of the first jig 108 very close to the part carrier structure 102 . As indicated by reference numeral 154 , the illustrated configuration of the lower side first jig 108 increases the manual handling hole size (eg by forming one or more oblong holes). It may be possible to do

Referring now to FIG. 5 , the top cover or second jig 110 may allow expanding the hole (see reference numeral 156 ) to further improve the handling and temperature profile of the part carrier structure 102 . there is. As shown by reference numeral 158 , it may be possible to open additional (eg 5×5 mm) holes to optimize the temperature profile of the part carrier structure 102 during reflow soldering.

6 illustrates a lower-side first jig 108 of the handling device 100 according to an exemplary embodiment of the present invention. 7 illustrates a top-side second jig 110 of a handling device 100 comprising a first jig 108 according to FIG. 6 .

As shown in FIG. 6 , each recess 122 of the illustrated first jig 108 has one part carrier 104 ( for example a printed circuit board or an integrated circuit board). During assembly reflow, the illustrated frame-shaped first jig 108 may apply a coupling force to the component carrier structure 102 or substrate of, for example, 20 N. This is a value large enough to ensure flattening and a value small enough to avoid excessive mechanical impact to the part carrier structure 102 and reliably prevent damage.

8 illustrates different manufacturing stages, including a reflow solder stage, during a line process for manufacturing the component carrier 104 according to an exemplary embodiment of the present invention.

As shown by reference numeral 170 , the panel-type component carrier structure may be first made to undergo solder paste printing while the solder paste may be printed onto a desired surface portion of the component carrier structure.

As can be further taken from FIG. 8 , the part carrier structure may then be moved along line conveyor direction 172 . The component carrier structure may then be processed by a chip capacitor attachment unit that attaches the chip capacitor onto the solder paste of each component carrier of the component carrier structure. This is indicated by reference numeral 174 .

As can also be taken from FIG. 9 , the component carrier structure with the solder paste applied and the component attached (chip capacitor in the illustrated embodiment) may then be transported to a reflow oven 106 through which the present invention The part carrier structure held by the handling device according to the exemplary embodiment of the can then be transported. The reflow oven 106 serves for processing the part carrier structure and includes a heating unit 126 configured to heat the handling device and the handling device with the part carrier structure held therein. By means of the heating unit 126 , it is possible to heat the handling device 100 together with the component carrier structure 102 preferably to at least 250° C., thus making it possible to perform efficient reflow soldering.

On the inlet side of the reflow oven 106 , the part carrier structure can be assembled to a handling device, reference numeral 176 .

As shown by reference numeral 178 , the component carrier structure of the handling device may be unloaded from the handling device after reflow soldering, ie at the outlet side of the reflow oven 106 .

The magnetic attraction mechanism between the jigs 108 and 110 in combination with the grid-like support structure 116 described above can advantageously be implemented during the high temperature reflow oven process. Due to such an implementation, the land coplanarity of the obtained part carrier can be significantly improved and the yield can be significantly increased.

9 is a detailed view of the bar 118 of the second jig 110 of the handling device 100 according to an exemplary embodiment of the present invention.

As shown, the bars 118 include first bars 118a extending parallel to each other along a first direction and second bars 118b extending parallel to each other in a second direction perpendicular to the first direction. By including the bars 118a , 118b form a grid 120 having recesses 122 .

For vertical bars 118b , each may include a central bar portion 160 arranged between two peripheral bar portions 162 . Advantageously, the central bar portion 160 may have a greater thickness than each of the two peripheral bar portions 162 . For example, the central bar portion 160 may have a thickness of 5 mm and a width of 0.5 mm, L. Each of the peripheral bar portions 162 may have a thickness of 3 mm and a width, B, of 0.25 mm. Other dimensions are possible.

Referring to horizontal bars 118a , each of which may correspondingly include a central bar portion 164 arranged between two peripheral bar portions 166 . Advantageously, the central bar portion 164 may have a greater thickness than the two peripheral bar portions 166 . For example, the central bar portion 164 may have a thickness of 5 mm and a width of 0.5 mm. Each of the peripheral bar portions 166 may have a thickness of 3 mm and a width of 0.25 mm. Other dimensions are possible.

Advantageously, the configuration of FIG. 9 can create a high rigidity of the second jig 110 .

It should be noted that the term "comprising" does not exclude other elements or steps and "a" or "an" does not exclude a plurality. Also, elements described in connection with different embodiments may be combined.

It should also be noted that any reference signs in the claims should not be construed as limiting the scope of the claims.

The implementation of the present invention is not limited to the preferred embodiments shown in the drawings and described above. Instead, many modifications are possible and employ the illustrated solutions and principles according to the present invention even for radically different embodiments.

Claims (37)

A handling device for handling a part carrier structure comprising a plurality of preformed part carriers during temperature treatment, the handling device comprising:
a first jig and a second jig configured to receive the part carrier structure therebetween;
an array of magnets forming a portion of one of the first jig and the second jig; and
a plate forming a part of the other one of the first jig and the second jig;
and the magnet is configured to create an attractive force with the plate to inhibit deformation of the part carrier structure therebetween. According to claim 1,
and a support structure forming a part of at least one of the first jig and the second jig, the support structure comprising a plurality of bars to be arranged between different preforms of the part carrier and supporting the part carrier structure. A handling device for handling a part carrier structure comprising a plurality of preformed part carriers during temperature treatment, the handling device comprising:
a first jig and a second jig configured to receive the part carrier structure therebetween;
and a support structure forming a part of at least one of the first jig and the second jig, the support structure comprising a plurality of bars to be arranged between different preforms of the part carrier and supporting the part carrier structure. 4. The method of claim 3,
an array of magnets forming a portion of one of the first jig and the second jig, and a plate forming a portion of the other of the first jig and the second jig, wherein the magnets are disposed therebetween. and generate an attractive force with the plate to restrain deformation of the part carrier structure in the . According to claim 1,
wherein the plate is made of a material that promotes heat distribution and/or heat redirection of the part carrier structure. According to claim 1,
wherein the plate is a metal plate. According to claim 1,
and the magnet is connected to the support structure. According to claim 1,
and the magnet forms a part of the configured first jig as a lower-side jig, and the plate forms a part of the configured second jig as an upper-side jig. The method of claim 1,
wherein the magnet is made of a material having a Curie temperature of at least 200°C. 10. The method of claim 9,
wherein the magnet is made of a material having a Curie temperature of at least 250°C. According to claim 1,
and the attractive force generated by the magnet and the plate and applied to the part carrier structure is at least 10 N. 12. The method of claim 11,
and the attractive force generated by the magnet and the plate and applied to the part carrier structure is at least 20 N. According to claim 1,
wherein the magnet comprises a permanent magnetic material. 3. The method of claim 2,
The support structure is made of a thermally conductive material. 15. The method of claim 14,
The support structure is made of a thermally conductive material having a thermal conductivity of at least 10 W/mK. 15. The method of claim 14,
The support structure is made of a thermally conductive material having a thermal conductivity of at least 50 W/mK. 15. The method of claim 14,
The support structure is made of a thermally conductive material having a thermal conductivity of at least 100 W/mK. 3. The method of claim 2,
wherein the bars extend parallel to each other. 3. The method of claim 2,
wherein the bars include first bars extending parallel to each other along a first direction and second bars extending parallel to each other along a second direction perpendicular to the first direction so that the bars form a grid with recesses which is a handling device. 20. The method of claim 19,
at least one of the first bar and the second bar has a central bar portion arranged between two peripheral bar portions, the central bar portion having a greater thickness than each of the two peripheral bar portions. 20. The method of claim 19,
each recess of the grid corresponds to one part carrier. According to claim 1,
and each of the first jig and the second jig includes a pin for pressing the part carrier structure from two opposing main surfaces. 23. The method of claim 22,
wherein each of the first jig and the second jig comprises a pin that presses the part carrier structure from two opposing main surfaces that are the only physical bodies in direct physical contact with the part carrier structure when received in the handling device. handling device. 24. The method of claim 23,
and the pin of one of the first jig and the second jig including the magnet is formed integrally with the magnet. According to claim 1,
and each of the first jig and the second jig includes a support structure including a plurality of bars. 26. The method of claim 25,
A handling device, wherein each of the first jig and the second jig includes a support structure including a plurality of bars forming a grid. According to claim 1,
wherein only one of the first jig and the second jig comprises an array of magnets. According to claim 1,
A handling device, wherein only one of the first jig and the second jig includes a plate. According to claim 1,
at least a portion of the magnets are mounted on a grid at an intersection between a first bar extending parallel to each other along a first direction and a second bar extending parallel to each other along a second direction perpendicular to the first direction device. According to claim 1,
and the first jig and the second jig are configured to apply a vertical fixing force to the part carrier structure only at a plurality of point connecting portions. 31. The method of claim 30,
and the first jig and the second jig are configured to apply a vertical clamping force to the part carrier structure only at a plurality of point connections, the point connections being located between adjacent preforms of the part carrier. According to claim 1,
and the array of magnets is formed as a part of only one of the first jig or the second jig, or is formed as a part of each of the first jig and the second jig. As an array,
A handling device according to claim 1 ; and
and a part carrier structure comprised of a plurality of preform part carriers received between the first jig and the second jig. 34. The method of claim 33,
wherein the part carrier structure comprises an integral plate structure comprising connected preforms of a part carrier. A reflow oven for a part carrier structure comprising a plurality of preform part carriers, the reflow oven comprising:
a handling device according to claim 1 for handling the component carrier structure during reflow soldering; and
and a heating unit configured to heat the part carrier structure in the handling device for reflow soldering. 36. The method of claim 35,
and the heating unit is configured to heat the part carrier structure in the handling device to at least 200°C. 37. The method of claim 36,
and the heating unit is configured to heat the part carrier structure in the handling device to at least 250° C.

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