TWM631352U - System for processing a component carrier - Google Patents

Abstract

A jig system for processing a component carrier (120), wherein the component carrier (120) comprises at least one cutout section (121) and a remaining section (122) surrounding the cutout section (121), wherein between the cutout section (121) and a remaining section (122) a cutting region (123) is provided. The jig system comprises a jig (100) comprising a remaining section support (101) for supporting the remaining section (122) and a cutout section support (102) for supporting the cutout section (121), wherein the jig (100) comprises a groove with an opening (103) between the remaining section support (101) and the cutout section support (102) below and along the cutting region (123) of the component carrier (120).

Description

Gripper system for handling component carriers

The invention relates to a clamp system for handling component carriers.

With the increase in product functionality of component carriers equipped with one or more components and the increasing miniaturization of such components and the increase in the number of components to be connected to component carriers such as printed circuit boards, the use of An increasingly powerful array-like component or package with several components having a plurality of contacts or connections with smaller and smaller spacing between the contacts. In particular, the component carrier should be mechanically robust and electrically reliable in order to be able to operate even under harsh conditions. More and more functions are integrated in component carriers.

During the manufacture of complex component carriers such as printed circuit boards (PCBs), component carriers may be damaged, eg by foreign substances (FM) scraped along the surface of the respective component carrier. FM particles may be generated when the component carrier is processed, for example, in the case of a cutting tool or drilling tool processing the component carrier.

Accordingly, it may be desirable to provide a handling system that prevents damage to component carriers from FM particles.

According to an exemplary embodiment of the present novel, a fixture system for handling (eg, a cutting or drilling process) a component carrier is presented. The component carrier includes at least one cut-out portion and a remainder surrounding the cut-out portion, wherein a cut-out area is provided between the cut-out portion and the remainder. The clamp system includes a clamp including a remainder support for supporting the remainder and a cutout support for supporting the cutout. The clamp includes a slot with an opening below and along the cutting area of the component carrier between the rest of the support and the cut-out support.

Arranging the component carrier on the above-described fixture system is described according to a method for processing (eg cutting or drilling) the component carrier. The remaining part is supported by the remaining part supports, and the cut-out part is supported by the cut-out part supports. The cutting area of the component carrier is arranged above and along the groove of the clamp.

In the context of this application, the term "component carrier" may in particular denote any support structure on and/or in which one or more components can be received to provide mechanical support and/or electrical connection. In other words, the component carrier can be configured as a mechanical and/or electronic carrier for components. In particular, the component carrier may be one of a printed circuit board, an organic interposer, a metal core substrate, an inorganic substrate, and an IC (integrated circuit) substrate. part The carrier can also be a hybrid plate combining different ones of the component carriers of the type described above.

In the context of this application, the term "component carrier material" may in particular denote the connection arrangement of one or more electrically insulating layer structures and/or one or more electrically conductive layer structures used in component carrier technology . More specifically, such component carrier materials may be materials used for printed circuit boards (PCBs) or IC substrates. In particular, the electrically conductive material of such a component carrier material may comprise copper. The electrically insulating material of the component carrier material may comprise resins, especially epoxy resins, optionally combined with reinforcing particles such as glass fibers or glass spheres.

The component carrier can be processed by cutting tools or by drilling tools. For example, certain rectangular or circular portions of the component carrier are cut out. Furthermore, through holes are drilled in the component carrier. The cutting tools and drilling tools may be mechanical cutting tools and drilling tools, or laser cutting tools and laser drilling tools, respectively.

Thus, for example, by cutting the component carrier along the cutting area without simultaneously separating the cut-out portion of the component carrier from the rest of the component carrier, the cut-out portion may be separated from the rest of the component carrier due to gravity Partially broken, this creates waste particles that can damage the component carrier. In addition, especially during mechanical cutting, waste particles are generated, which can damage the component carrier.

In order to avoid damage to the waste particles, according to the method, the clamp comprises a slot with an opening arranged below the cutting area of the component carrier. The cutting area defines a cutting line along which the cutting tool cuts the cutting portion Divide from the rest around the cut section. By having the clamp include a slot with an opening below the cutting area, waste particles resulting from cutting of the part carrier fall through the cavity, away from the part carrier, either by gravity or by applying negative pressure. Waste particles produced by the cutting tool can be collected in the groove. Thus, the risk of damage to waste particles is reduced.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

According to a further exemplary embodiment, the cut-out support is formed for supporting the cut-out of the component carrier in a support plane where the rest of the component carrier supports the rest of the component carrier with the rest of the support. The support plane is the same. Thus, if the cut-out is completely separated from the rest, the cut-out is still supported by the cut-out support at the same plane and height, respectively, as the rest of the component carrier is supported. Thus, during cutting along the cutting area, the risk of the cut-out portion of the component carrier breaking from the rest due to gravity is reduced, thereby reducing waste particles due to breaking with the rest.

According to another exemplary embodiment, the width (or diameter) of the opening of the slot is greater than the width (or diameter) of the cut area of the component carrier. The width is defined as the shortest distance between opposing walls of the component carrier or clamp. Thus, if the width of the slot opening is greater than the width of the cut-out area, the risk of waste particles staying on the surface of the clamp or failing to fall through the slot opening is reduced.

According to another exemplary embodiment, the groove is supported by the support of the cut-out part A support flange and a support flange of the remaining part of the support are formed, and both the support flange of the cut-out part and the support flange of the remaining part of the support extend along the cut area. The groove is also formed by a bottom portion extending between the support flange of the cut-out portion support and the support flange of the remaining portion support, wherein the bottom portion is spaced from the surface of the clamp on which the component carrier can be arranged open.

In other words, the rest of the support and the cut-out support comprise respective flanges or wall portions extending along the cutting area, wherein the respective flanges of the cut-out and rest supports are spaced apart from each other to form a clamp opening. Thus, along the edge of the remaining portion near the cutting area and the edge of the cut-out portion near the cutting area, the flange supports the component carrier such that the component carrier is supported along the cutting area in a firm manner. Furthermore, by connecting the flanges to the bottom part, a groove and thus a kind of reservoir for waste particles is formed.

According to another exemplary embodiment, the opening of the slot (or blind hole) in the clamp extends along the cutting area. Thus, waste particles generated by the cutting tool can be collected in the grooves along the cutting area.

According to another exemplary embodiment, the rest of the support includes a suction hole that can be coupled to a vacuum pump. The suction holes are arranged below the rest of the component carrier so that the component carrier can be secured to the clamp when negative pressure is applied by the vacuum pump.

According to another exemplary embodiment, the rest of the support includes a plurality of suction holes formed around the cut-out support. Therefore, in order to improve the fixation of the component carrier to the clamp, it is possible to provide a plurality of corresponding suction hole.

According to another exemplary embodiment, the cut-out support includes a suction hole that can be coupled to a vacuum pump. Thus, the cut-out of the component carrier can be fixed to the cut-out support in a firm manner, so that the cut-out can also be fixed to the clamp during and after processing of the component carrier.

According to another exemplary embodiment, the cut-out portion support includes a plurality of suction holes. Therefore, in order to improve the fixation of the cut-out portion to the clamp, a plurality of corresponding suction holes coupled to the vacuum pump may be provided.

According to another exemplary embodiment, the clamp system further includes a support table on which the clamps are arranged. The clamp can be detachably secured to the support table. Thus, it is possible to attach different clamps, including different designs for each different component carrier, to a common support table.

According to another exemplary embodiment, the support table includes through holes matching the suction holes of the remaining part of the support and the suction holes of the cut-out part of the support. Thus, by being under negative pressure, the component carrier can be pressed against the support table. In addition, according to the present example, the component carrier also presses the clamp arranged between the component carrier and the support table against the support table. Thus, a robust securing system for the securing of the component carrier and the clamp to the support table is provided.

According to another exemplary embodiment, the support table comprises a further through hole arranged below the groove of the clamp. If the grooves comprise through holes, waste particles generated during the cutting of the cut-out portion can be sucked away. For example, a particle filter can be arranged between the vacuum pump and the further through holes. If the groove, especially the bottom of the groove, does not have a through hole, the clamp can be moved along the The cutting area is further fixed to the support table so that the clamp can be securely fixed to the support table.

Therefore, by matching the suction hole of the jig with the through hole of the support table, the component carrier and the jig can be uniformly sucked to the support table, thereby improving the cutting accuracy.

In one embodiment, the component carrier is a laminated component carrier. In such embodiments, the component carrier is a composite of multilayer structures that are stacked and joined together by the application of pressure and/or heat.

In one embodiment, the at least one electrically insulating layer structure comprises at least one of the following: in a resin or polymer, such as epoxy resin, cyanate ester resin, benzocyclobutene resin, bismaleia Amine-triazine resins, polyphenylene derivatives (eg based on polyphenylene ether, PPE), polyimide (PI), polyamide (PA), liquid crystal polymers (LCP), polytetrafluoroethylene (PTFE) ), and/or combinations thereof. It is also possible to use reinforcing structures, eg made of glass (multilayer glass), eg meshes, fibers, spheres or other kinds of filler particles to form the composite. The combination of semi-cured resin and reinforcing agent, such as fiber impregnated with the above resin, is called prepreg. These prepregs are often named after their properties, such as FR4 or FR5, which describe the flame resistance properties of these prepregs. Although prepregs are generally preferred for rigid PCBs, especially FR4, other materials, especially epoxy-based build-up materials (eg, build-up films) or photoimageable dielectrics can also be used Material. For high frequency applications, high frequency materials such as polytetrafluoroethylene, liquid crystal polymers and/or cyanate ester resins may be preferred. In addition to these polymers, low temperature co-fired ceramics (LTCC) or other lower, very low or ultra low DK materials can also be used in component carriers as electrical insulating structures.

In one embodiment, the at least one electrically conductive layer structure may include at least one of copper, aluminum, nickel, silver, gold, palladium, tungsten, and magnesium. Although copper is generally preferred, other materials or coating forms thereof are also possible, in particular materials coated with a superconducting material or a conducting polymer, respectively, such as Graphene or poly(3,4-ethylenedioxythiophene) (PEDOT).

In one embodiment, the component carrier is shaped as a plate. This facilitates a compact design wherein the component carrier still provides a large base for mounting components on the component carrier. In addition, in particular, a bare wafer, which is an example of an embedded electronic component, can be easily embedded in a thin board such as a printed circuit board due to its small thickness.

In one embodiment, the component carrier is configured as one of a printed circuit board, a substrate (especially an IC substrate), and an interposer.

In the context of the present application, the term "printed circuit board" (PCB) may in particular denote a structure formed by laminating a plurality of electrically conductive layer structures with a plurality of electrically insulating layer structures, eg via the application of pressure and/or the supply of thermal energy Plate-shaped component carrier. As a preferred material for use in PCB technology, the electrically conductive layer structure is made of copper, while the electrically insulating layer structure may comprise resin and/or fiberglass, so-called prepregs or FR4 materials. By forming a via hole through the laminate, for example by laser drilling or mechanical drilling, and by filling the via hole with an electrically conductive material, especially copper, to form a via hole or any other via hole connection, it is possible to The various electrically conductive layer structures are connected to each other in the desired manner. Filled holes connect the entire stack (extends through multiple layers or the entire stack Through-hole connections of components), or filled holes connecting at least two electrically conductive layers, called vias. Similarly, optical interconnects may be formed through the various layers of the stack to receive an electro-optical circuit board (EOCB). In addition to one or more components that may be embedded in a printed circuit board, a printed circuit board is typically configured to receive one or more on one or both opposing surfaces of a plate-like printed circuit board part. One or more components may be connected to the respective major surfaces by welding. The dielectric portion of the PCB may be composed of resin with reinforcing fibers such as glass fibers.

In the context of this application, the term "substrate" may in particular denote a small component carrier. Relative to a PCB, a substrate may be a relatively small component carrier on which one or more components may be mounted, and which may act as a connection medium between one or more chips and another PCB. For example, the substrate may have substantially the same dimensions (eg, in the case of a chip scale package (CSP)) as the components (especially electronic components) to be mounted on the substrate. More specifically, a substrate can be understood as a carrier for electrical connections or networks and a component carrier comparable to a printed circuit board (PCB), but with a relatively high density of lateral and/or vertical set connection. The lateral connections are, for example, conductive paths, while the vertical connections can be, for example, drilled holes. These lateral and/or vertical connections are provided within the substrate and can be used to provide in particular the connection of housed or non-housed components of an IC chip (eg a bare die) with a printed circuit board or an intermediate printed circuit board. Electrical, thermal and/or mechanical connections. Thus, the term "substrate" may also include "IC substrate". The dielectric portion of the substrate may be composed of a resin with reinforcing particles, such as reinforcing spheres, especially glass spheres.

The substrate or interposer may include or consist of at least one layer of glass, silicon (Si), or a photoimageable organic material or a dry etched organic material, such as an epoxy-based build-up material such as an epoxy-based build-up film), or polymer complexes (polymer complexes may or may not contain photosensitive molecules and/or thermosensitive molecules), such as polyimide or polybenzoxazole.

At least one component can be embedded in the component carrier and/or can be surface mounted on the component carrier. Such components may be selected from: non-conductive inlays, conductive inlays (such as metal inlays, preferably comprising copper or aluminium), heat transfer elements (eg heat pipes), light guide elements (eg light guides or light guide connectors), Electronic components, or a combination of the above. The inlay can be, for example, a metal block with or without a coating of insulating material (IMS inlay), which can be embedded or surface mounted to facilitate heat dissipation. Suitable materials are defined according to their thermal conductivity, which should be at least 2W/mK. Such materials are typically based on, but are not limited to, metals, metal oxides and/or ceramics, such as copper, aluminum oxide (Al ₂ O ₃ ) or aluminum nitride (AlN). To increase heat exchange capacity, other geometries with increased surface area are also often used. Furthermore, the components may be active electronic components (with at least one pn junction implemented), passive electronic components such as resistors, inductors or capacitors, electronic chips, memory devices (eg DRAM or other data storage), filters, Integrated circuits (eg Field Programmable Gate Arrays (FPGA), Programmable Array Logic (PAL), General Array Logic (GAL) and Complex Programmable Logic Devices (CPLD)), Signal Processing Components, Power Management Components (eg Field Effect Transistors) (FET), Metal Oxide Semiconductor Field Effect Transistor (MOSFET), Complementary Metal Oxide Semiconductor (CMOS), Junction Field Effect Transistor (JFET), or Insulated Gate Field Effect Transistor (IGFET), all of which are based on semiconductors Materials such as Silicon Carbide (SiC), Gallium Arsenide (GaAs), Gallium Nitride (GaN), Gallium Oxide ( _{Ga2O3 )} , Indium Gallium Arsenide (InGaAs) and/or any other suitable inorganic compound) , optoelectronic interface elements, light emitting diodes, optocouplers, voltage converters (eg DC/DC converters or AC/DC converters), cryptographic components, transmitters and/or receivers, electromechanical transducers, sensors, actuators devices, microelectromechanical systems (MEMS), microprocessors, capacitors, resistors, inductors, batteries, switches, cameras, antennas, logic chips and energy harvesting units. However, other components can be embedded in the component carrier. For example, magnetic elements can be used as components. Such magnetic elements may be permanent magnet elements (such as ferromagnetic elements, antiferromagnetic elements, multiferroic elements or ferrimagnetic elements, eg ferrite cores), or such magnetic elements may be paramagnetic elements. However, the component may also be an IC substrate, an interposer or another component carrier, eg in a board-in-board configuration. The components may be surface mounted on the component carrier and/or may be embedded within the component carrier. In addition, other components may also be used as components, particularly those that generate and emit electromagnetic radiation and/or are sensitive to electromagnetic radiation propagating from the environment.

After processing the inner layer structure of the component carrier, the processed layer structure can be symmetrically or asymmetrically covered (in particular by lamination) with one or more further electrically insulating and/or electrically conductive layer structures one or two opposite major surfaces. In other words, accumulation can continue until the desired number of layers are obtained.

After completing the formation of the stack of the electrically insulating layer structure and the electrically conductive layer structure After that, the surface treatment of the layer structure or component carrier obtained can be continued.

In particular, with regard to surface treatments, an electrically insulating solder resist may be applied to one or both opposing major surfaces of the layer stack or component carrier. For example, a layer of solder resist, for example, can be formed over the entire major surface and then patterned to expose one or more electrically conductive surface portions that will be used to connect the component carrier to the electronic periphery pieces are electrically coupled. The surface portion of the component carrier which remains covered with the solder resist, in particular the copper-containing surface portion, can be effectively protected against oxidation or corrosion.

With regard to surface treatments, surface treatments can also be selectively applied to exposed electrically conductive surface portions of the component carrier. Such a surface finish may be an electrically conductive cover material on exposed electrically conductive layer structures on the surface of the component carrier, such as, in particular, copper-containing or copper-comprising pads, conductive traces, and the like. If such exposed electrically conductive layer structures are not protected, the exposed electrically conductive component carrier material, particularly copper, may oxidize, making the component carrier less reliable. The surface finish may then be formed, for example, as a joint between the surface mounted component and the component carrier. The surface finish has the function of protecting exposed electrically conductive layer structures (especially copper circuits) and fulfilling a bonding process with one or more components, eg by soldering. Examples of suitable materials for the surface finish are organic solderability preservatives (OSP), electroless nickel immersion gold (ENIG), electroless nickel immersion palladium immersion gold (ENIPIG), gold (especially hard gold), electroless tin, Nickel-gold, nickel-palladium, etc.

According to the example of the embodiment to be described below, the above limit of the present invention is Certain aspects and other aspects are apparent from and explained with reference to these examples of embodiments.

100: Fixtures

101: The rest of the support

102: Cut out part of the support

103: Opening

104: Support plane

105: Support flanges for the rest of the supports

106: Cut out the support flange of the partial support

107: Suction holes for the rest of the supports

108: Cut out suction holes for part of the support

109: Cutting Tools

110: Support table

120: Component carrier

121: Cut out the part

122: The rest

123: Cutting Area

124: Bottom part

201: Through hole for support table

202: Additional through holes for the support table

A: The width of the cutting area

B: The width of the opening

C: Depth of groove

[ FIG. 1 ] A schematic diagram showing a jig system according to an exemplary embodiment.

[ FIG. 2 ] A schematic diagram illustrating a jig system including a support table having a through hole according to an exemplary embodiment.

[ FIG. 3 ] A schematic top view showing a clamp of a clamp system according to an exemplary embodiment.

The illustrations in the drawings are schematic. In different figures, similar or identical elements are provided with the same reference numerals.

FIG. 1 shows a schematic diagram of a clamp system according to an exemplary embodiment. The clamp system is suitable for processing a component carrier 120 , wherein the component carrier 120 includes at least one cut-out portion 121 and a remaining portion 122 surrounding the cut-out portion 121 . A cutting area 123 is provided between the cut-out portion 121 and the remaining portion 122 . The clamp system includes a clamp 100 including a rest support 101 for supporting the rest 122 and a cutout support 102 for supporting the cutout 121 . The jig 100 includes a slot with an opening 103 below and along the cut area 123 of the component carrier 120 between the rest of the support 101 and the cut out support 102 between.

Component carrier 120 may be processed by cutting tool 109 . For example, a specific rectangular or circular portion of the component carrier 120 is cut out. By cutting the component carrier 120 along the cutting area 123 without simultaneously separating the cut-out portion 121 of the component carrier from the rest 122 of the component carrier 120, the cut-out portion 121 may be separated from the component carrier due to gravity The remainder 122 of 120 is broken, which results in waste particles that may damage the component carrier.

The slot opening 103 is arranged below the cutting area 123 of the component carrier 120 . The cutting area 123 defines a cutting line along which the cutting tool 109 separates the cut-out portion 121 from the remainder 122 surrounding the cut-out portion 121 . By providing a slot with an opening 103 below the cutting area 123, waste particles resulting from the cutting of the component carrier 120 fall away from the component carrier 120 through the opening 103 due to gravity. The waste particles produced by the cutting tools are collected in the grooves. The cut-out portion support 102 is formed for supporting the cut-out portion 121 of the component carrier 120 in the support plane 104 , which is the same as where the remaining portion support 101 supports the remaining portion 122 of the component carrier 120 . The support plane is the same.

The width (or diameter) B of the slot opening 103 is greater than the width (or diameter) A of the cut area 123 of the component carrier 120 . The width B of the opening 103 may be between 0.7 mm (millimeters) and 1.1 mm, in particular between 0.8 mm and 1.0 mm. The beam size of the laser cutting tool can be, for example, 18 μm to 22 μm. The thickness of the clamp 100 may be 3.0 mm to 4.0 mm, particularly 3.5 mm.

The opening 103 is formed between the support flange 106 of the cut out part support 102 and the support flange 105 of the remaining part support 101 , both extending along the cut area 123 . The slot is also formed by a bottom portion 124 extending between the support flange 106 of the cut-out portion support 102 and the support flange 105 of the remaining portion support 101, wherein the bottom portion 124 and the clamp 100 may be arranged with The surfaces of the component carriers 120 are spaced apart. Accordingly, the rest of the support 101 and the cut-out support 102 comprise respective flanges or wall portions 105 , 106 extending along the cutting area 123 , wherein the respective protrusions of the cut-out support 102 and the rest of the support 101 The edges 105 , 106 are spaced apart from each other to form the opening 103 of the clamp 100 . Furthermore, through the bottom portion 124 connecting the flange 105 and the flange 107, waste particles generated by the cutting tool 109 can be collected in the groove. The depth C of the grooves may be 1 mm to 2 mm.

The rest of the support 101 includes suction holes 107 that can be coupled to a vacuum pump. The suction holes 107 are arranged below the rest 122 of the component carrier 120 so that the component carrier 120 can be secured to the clamp 100 when negative pressure is applied by the vacuum pump.

Additionally, the cut-out support 102 includes a suction hole 108 that can be coupled to a vacuum pump. Therefore, the cut-out 121 of the component carrier 120 can be fixed to the cut-out support 102 in a firm manner, so that the cut-out 121 can be processed during and after the component carrier 120 is processed is fixed to the jig 100 .

The clamp system also includes a support table 110 on which the clamp 100 is arranged. The clamp 100 can be detachably fixed to the support table 110.

FIG. 2 shows a schematic diagram of a clamp system including a support table 110 having through holes 201 , 202 according to an exemplary embodiment. The jig 100 is formed similar to the jig 100 in FIG. 1 . However, the support table 110 includes through holes 201 matching the suction holes 107 of the remaining part of the support 101 and the suction holes 108 of the cut-out part of the support 102 . Therefore, under negative pressure, the component carrier 120 is pressed against the support table 110 . In addition, the component carrier 120 also presses the jig 100 disposed between the component carrier 120 and the support table 110 against the support table 110 .

In addition, the support table 110 further includes a through hole 202 arranged below the groove. The grooves form a closed cavity so that the clamp 100 can be further fixed to the support table 110 along the cutting area 123 by applying negative pressure from one side of the support table 110 . By matching the suction holes 107, 108 of the jig 100 with respect to the through hole 201 of the support table, uniform attraction of the component carrier 120 and the jig 100 toward the support table 110 can be provided, thereby improving cutting accuracy.

FIG. 3 shows a schematic top view of a clamp 100 of a clamp system according to an exemplary embodiment. The jig 100 includes a plurality of cut-out supports 102 surrounded by the remaining supports 101 . The cut-out supports 102 are separated by the openings 103 of the slots. The cut-out support 102 forms a support platform on which the cut-out 121 of the component carrier 120 can be supported. Corresponding suction holes 108 are formed on the support platform. In the exemplary embodiment shown in FIG. 3 , the cut-out support 102 may include only one suction hole 108 or two (or more) suction holes 108 . In addition, the remaining support portion 101 may include a plurality of through holes 107 .

It should be noted that the term "comprising" does not exclude other elements or steps, and "a" or "an" does not exclude a plurality. Furthermore, elements described in association with different embodiments may be combined.

It should also be noted that reference signs in the claims shall not be construed as limiting the scope of the patent application.

The realization of the novel is not limited to the preferred embodiments shown in the drawings and described above. Rather, many variants of the solutions and principles shown in accordance with the present invention may be used, even in the case of radically different embodiments.

100: Fixtures

101: The rest of the support

102: Cut out part of the support

103: Opening

104: Support plane

105: Support flanges for the rest of the supports

106: Cut out the support flange of the partial support

107: Suction holes for the rest of the supports

108: Cut out suction holes for part of the support

109: Cutting Tools

110: Support table

120: Component carrier

121: Cut out the part

122: The rest

123: Cutting Area

124: Bottom part

Claims (12)

A fixture system for handling component carriers, wherein, The component carrier (120) comprises at least one cut-out portion (121) and a remaining portion (122) surrounding the cut-out portion (121), wherein the cut-out portion (121) and the remaining portion are A cutting area (123) is provided between (122), The fixture system is characterized in that the fixture system includes: A clamp (100) comprising a rest support (101) for supporting the rest (122) and a cutout for supporting the cutout (121) support (102), wherein the clamp (100) comprises a slot with an opening (103) below the cutting area (123) of the component carrier (120) and along the direction of the component carrier (120) The cutting area (123) is located between the remaining support (101) and the cut-out support (102). The fixture system of claim 1, wherein, The cut-out portion support (102) is formed for supporting the cut-out portion (121) of the component carrier (120) in a support plane (104) which is connected to the support plane (104). The supporting plane on which the remaining part (122) of the component carrier (120) is supported by the remaining part of the support (101) is the same. The fixture system of claim 1, wherein, The width of the opening (103) of the slot is greater than the width of the cut area (123) of the component carrier (120). The fixture system of claim 1, wherein, The grooves are formed by the support flanges of the cut-out support (102) and the rest of the support (101), the support flanges of the cut-out support (102) and all the support flanges of the rest of the supports (101) all extend along the cutting area (123); and wherein the groove is also formed by a bottom part (124) between the support flange of the cut-out part support (102) and the support flange of the rest support (101) extending therebetween, wherein the bottom portion (124) is spaced from a surface of the clamp on which the component carrier (120) can be provided. The fixture system of claim 1, wherein, The opening (103) of the slot extends along the cutting area (123). The fixture system of claim 1, wherein, The rest of the support (101) includes a suction hole that can be coupled to a vacuum pump. The fixture system according to claim 6, wherein, The remainder support (101) includes a plurality of suction holes formed around the cut out support (102). The clamp system of claim 1, wherein the cut-out support (102) includes a suction hole that can be coupled to a vacuum pump. The clamp system of claim 8, wherein, The cut-out portion support (102) includes a plurality of suction holes. The fixture system according to claim 1, wherein the fixture system comprises: A support table (110), the clamp (100) is arranged on the support table (110). The clamp system of claim 10, wherein the support table (110) comprises suction holes corresponding to the suction holes of the rest support (101) and the cutout support (102) Matching vias (201). The clamp system of claim 10, wherein the support table (110) further comprises a further through hole (202) arranged below the slot of the clamp (100).

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