TWM631352U - System for processing a component carrier - Google Patents
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Abstract
Description
本新型涉及一種用於處理部件承載件的夾具系統。 The invention relates to a clamp system for handling component carriers.
在配備有一個或更多個部件的部件承載件的產品功能增長和這種部件的日益微型化以及待連接至諸如印刷電路板之類的部件承載件上的部件的數量增加的情況下,採用具有若干部件的日益強大的陣列狀部件或封裝件,該陣列狀部件或封裝件具有多個接觸部或連接部,並且在這些接觸件之間的間隔越來越小。特別地,部件承載件應是機械穩固且電氣可靠的,以便在即使惡劣的條件下也能夠運行。越來越多的功能集成在部件承載件中。 With the increase in product functionality of component carriers equipped with one or more components and the increasing miniaturization of such components and the increase in the number of components to be connected to component carriers such as printed circuit boards, the use of An increasingly powerful array-like component or package with several components having a plurality of contacts or connections with smaller and smaller spacing between the contacts. In particular, the component carrier should be mechanically robust and electrically reliable in order to be able to operate even under harsh conditions. More and more functions are integrated in component carriers.
在製造諸如印刷電路板(PCB)之類的複雜的部件承載件期間,可能例如由沿著相應部件承載件的表面刮擦的外來物質(FM)對部件承載件造成損壞。FM顆粒可能會在處理部件承載件時產生,例如,在切割工具或鑽孔工具處理部件承載件的情況下產生FM顆粒。 During the manufacture of complex component carriers such as printed circuit boards (PCBs), component carriers may be damaged, eg by foreign substances (FM) scraped along the surface of the respective component carrier. FM particles may be generated when the component carrier is processed, for example, in the case of a cutting tool or drilling tool processing the component carrier.
因此,可能需要提供一種處理系統,該處理系統防止部件承載件被FM顆粒損壞。 Accordingly, it may be desirable to provide a handling system that prevents damage to component carriers from FM particles.
根據本新型的示例性實施方式,提出了一種用於處理(例如,切割或鑽孔過程)部件承載件的夾具系統。部件承載件包括至少一個切出部分和圍繞切出部分的其餘部分,其中在切出部分與其餘部分之間設置有切割區域。夾具系統包括夾具,該夾具包括用於對其餘部分進行支撐的其餘部分支撐件和用於對切出部分進行支撐的切出部分支撐件。夾具包括具有開口的槽,該槽在部件承載件的切割區域下方並且沿著部件承載件的切割區域而位於其餘部分支撐件與切出部分支撐件之間。 According to an exemplary embodiment of the present novel, a fixture system for handling (eg, a cutting or drilling process) a component carrier is presented. The component carrier includes at least one cut-out portion and a remainder surrounding the cut-out portion, wherein a cut-out area is provided between the cut-out portion and the remainder. The clamp system includes a clamp including a remainder support for supporting the remainder and a cutout support for supporting the cutout. The clamp includes a slot with an opening below and along the cutting area of the component carrier between the rest of the support and the cut-out support.
根據用於處理(例如切割或鑽孔)部件承載件的方法,描述了將部件承載件佈置在上述夾具系統上。其餘部分由其餘部分支撐件支撐,切出部分由切出部分支撐件支撐。部件承載件的切割區域佈置在夾具的槽上方並且沿著夾具的槽佈置。 Arranging the component carrier on the above-described fixture system is described according to a method for processing (eg cutting or drilling) the component carrier. The remaining part is supported by the remaining part supports, and the cut-out part is supported by the cut-out part supports. The cutting area of the component carrier is arranged above and along the groove of the clamp.
在本申請的上下文中,術語“部件承載件”可以特別地表示能夠在其上和/或其中容納一個或更多個部件以提供機械支撐和/或電連接的任意支撐結構。換而言之,部件承載件可以被構造成用於部件的機械和/或電子承載件。特別地,部件承載件可以是印刷電路板、有機中介層、金屬芯基板、無機基板和IC(集成電路)基板中的一者。部件 承載件也可以是將上述類型的部件承載件中的不同部件承載件組合的混合板。 In the context of this application, the term "component carrier" may in particular denote any support structure on and/or in which one or more components can be received to provide mechanical support and/or electrical connection. In other words, the component carrier can be configured as a mechanical and/or electronic carrier for components. In particular, the component carrier may be one of a printed circuit board, an organic interposer, a metal core substrate, an inorganic substrate, and an IC (integrated circuit) substrate. part The carrier can also be a hybrid plate combining different ones of the component carriers of the type described above.
在本申請的上下文中,術語“部件承載件材料”可以特別地表示在部件承載件技術中使用的一個或更多個電絕緣層結構和/或一個或更多個電傳導層結構的連接佈置。更具體地,這種部件承載件材料可以是用於印刷電路板(PCB)或IC基板的材料。特別地,這種部件承載件材料的電傳導材料可以包括銅。部件承載件材料的電絕緣材料可以包括可選地與諸如玻璃纖維或玻璃球之類的增強顆粒結合的樹脂、特別是環氧樹脂。 In the context of this application, the term "component carrier material" may in particular denote the connection arrangement of one or more electrically insulating layer structures and/or one or more electrically conductive layer structures used in component carrier technology . More specifically, such component carrier materials may be materials used for printed circuit boards (PCBs) or IC substrates. In particular, the electrically conductive material of such a component carrier material may comprise copper. The electrically insulating material of the component carrier material may comprise resins, especially epoxy resins, optionally combined with reinforcing particles such as glass fibers or glass spheres.
可以通過切割工具或通過鑽孔工具來處理部件承載件。例如,部件承載件的特定的矩形或圓形部分被切割出。此外,在部件承載件中鑽出通孔。切割工具和鑽孔工具可以分別是機械切割工具和鑽孔工具、或激光切割工具和激光鑽孔工具。 The component carrier can be processed by cutting tools or by drilling tools. For example, certain rectangular or circular portions of the component carrier are cut out. Furthermore, through holes are drilled in the component carrier. The cutting tools and drilling tools may be mechanical cutting tools and drilling tools, or laser cutting tools and laser drilling tools, respectively.
因此,例如通過沿著切割區域對部件承載件進行切割,而不同時將部件承載件的切出部分與部件承載件的其餘部分分離,使得由於重力作用,切出部分可能與部件承載件的其餘部分斷開,這會產生廢物顆粒,所述廢物顆粒可能會損壞部件承載件。此外,特別是在機械切割期間,會產生廢物顆粒,這些廢物顆粒可能會損壞部件承載件。 Thus, for example, by cutting the component carrier along the cutting area without simultaneously separating the cut-out portion of the component carrier from the rest of the component carrier, the cut-out portion may be separated from the rest of the component carrier due to gravity Partially broken, this creates waste particles that can damage the component carrier. In addition, especially during mechanical cutting, waste particles are generated, which can damage the component carrier.
為了避免廢物顆粒的損壞,根據本方法,夾具包括具有開口的槽,該開口佈置在部件承載件的切割區域下方。切割區域限定有切割線,切割工具沿著該切割線將切割部 分與圍繞切割部分的其餘部分分開。通過使夾具包括在切割區域下方的具有開口的槽,由部件承載件的切割產生的廢物顆粒由於重力或通過施加負壓力而穿過腔、遠離部件承載件而掉落。由切割工具產生的廢物顆粒可以被聚集在槽中。因此,減少了廢物顆粒損壞的風險。 In order to avoid damage to the waste particles, according to the method, the clamp comprises a slot with an opening arranged below the cutting area of the component carrier. The cutting area defines a cutting line along which the cutting tool cuts the cutting portion Divide from the rest around the cut section. By having the clamp include a slot with an opening below the cutting area, waste particles resulting from cutting of the part carrier fall through the cavity, away from the part carrier, either by gravity or by applying negative pressure. Waste particles produced by the cutting tool can be collected in the groove. Thus, the risk of damage to waste particles is reduced.
根據另一示例性實施方式,切出部分支撐件形成為用於在支撐平面中對部件承載件的切出部分進行支撐,該支撐平面與其餘部分支撐件對部件承載件的其餘部分進行支撐所在的支撐平面相同。因此,如果切出部分與其餘部分完全分開,則切出部分仍由切出部分支撐件分別在與部件承載件的其餘部分被支撐的平面和高度相同的平面和相同的高度上被支撐。因此,在沿著切割區域進行切割的過程中,減小了部件承載件的切出部分由於重力而與其餘部分斷開的風險,從而減少了由於與其餘部分斷開而引起的廢料顆粒。 According to a further exemplary embodiment, the cut-out support is formed for supporting the cut-out of the component carrier in a support plane where the rest of the component carrier supports the rest of the component carrier with the rest of the support. The support plane is the same. Thus, if the cut-out is completely separated from the rest, the cut-out is still supported by the cut-out support at the same plane and height, respectively, as the rest of the component carrier is supported. Thus, during cutting along the cutting area, the risk of the cut-out portion of the component carrier breaking from the rest due to gravity is reduced, thereby reducing waste particles due to breaking with the rest.
根據另一示例性實施方式,槽的開口的寬度(或直徑)大於部件承載件的切割區域的寬度(或直徑)。寬度被限定為部件承載件或夾具的相對的壁之間的最短距離。因此,如果槽的開口的寬度大於切出區域的寬度,則減小了廢物顆粒停留在夾具的表面上或不能通過槽的開口掉落的風險。 According to another exemplary embodiment, the width (or diameter) of the opening of the slot is greater than the width (or diameter) of the cut area of the component carrier. The width is defined as the shortest distance between opposing walls of the component carrier or clamp. Thus, if the width of the slot opening is greater than the width of the cut-out area, the risk of waste particles staying on the surface of the clamp or failing to fall through the slot opening is reduced.
根據另一示例性實施方式,槽由切出部分支撐件的支 撐凸緣和其餘部分支撐件的支撐凸緣形成,切出部分支撐件的支撐凸緣和其餘部分支撐件的支撐凸緣兩者均沿著切割區域延伸。槽還由底部部分形成,該底部部分在切出部分支撐件的支撐凸緣與其餘部分支撐件的支撐凸緣之間延伸,其中,該底部部分與夾具的可佈置有部件承載件的表面間隔開。 According to another exemplary embodiment, the groove is supported by the support of the cut-out part A support flange and a support flange of the remaining part of the support are formed, and both the support flange of the cut-out part and the support flange of the remaining part of the support extend along the cut area. The groove is also formed by a bottom portion extending between the support flange of the cut-out portion support and the support flange of the remaining portion support, wherein the bottom portion is spaced from the surface of the clamp on which the component carrier can be arranged open.
換句話說,其餘部分支撐件和切出部分支撐件包括沿切割區域延伸的相應的凸緣或壁部分,其中,切出部分支撐件和其餘部分支撐件的相應凸緣彼此間隔開以便形成夾具的開口。因此,沿著其餘部分的靠近切割區域的邊緣和切出部分的靠近切割區域的邊緣,凸緣對部件承載件進行支撐,使得部件承載件以牢固的方式沿著切割區域被支撐。此外,通過將凸緣連接的底部部分,形成了槽並且因此形成了用於廢物顆粒的一種儲存器。 In other words, the rest of the support and the cut-out support comprise respective flanges or wall portions extending along the cutting area, wherein the respective flanges of the cut-out and rest supports are spaced apart from each other to form a clamp opening. Thus, along the edge of the remaining portion near the cutting area and the edge of the cut-out portion near the cutting area, the flange supports the component carrier such that the component carrier is supported along the cutting area in a firm manner. Furthermore, by connecting the flanges to the bottom part, a groove and thus a kind of reservoir for waste particles is formed.
根據另一示例性實施方式,夾具中的槽(或盲孔)的開口沿切割區域延伸。因此,由切割工具產生的廢物顆粒可以沿著切割區域而被聚集在槽中。 According to another exemplary embodiment, the opening of the slot (or blind hole) in the clamp extends along the cutting area. Thus, waste particles generated by the cutting tool can be collected in the grooves along the cutting area.
根據另一示例性實施方式,其餘部分支撐件包括可聯接至真空泵的抽吸孔。抽吸孔被佈置在部件承載件的其餘部分的下方,使得在通過真空泵施加負壓力時,部件承載件可以被固定至夾具。 According to another exemplary embodiment, the rest of the support includes a suction hole that can be coupled to a vacuum pump. The suction holes are arranged below the rest of the component carrier so that the component carrier can be secured to the clamp when negative pressure is applied by the vacuum pump.
根據另一示例性實施方式,其餘部分支撐件包括圍繞切出部分支撐件形成的多個抽吸孔。因此,為了改進部件承載件至夾具的固定,可以提供聯接到真空泵的多個相應 的抽吸孔。 According to another exemplary embodiment, the rest of the support includes a plurality of suction holes formed around the cut-out support. Therefore, in order to improve the fixation of the component carrier to the clamp, it is possible to provide a plurality of corresponding suction hole.
根據另一示例性實施方式,切出部分支撐件包括可聯接至真空泵的抽吸孔。因此,部件承載件的切出部分可以以牢固的方式固定到切出部分支撐件上,使得在對部件承載件進行處理期間以及在處理部件承載件之後,切出部分也可以固定至夾具。 According to another exemplary embodiment, the cut-out support includes a suction hole that can be coupled to a vacuum pump. Thus, the cut-out of the component carrier can be fixed to the cut-out support in a firm manner, so that the cut-out can also be fixed to the clamp during and after processing of the component carrier.
根據另一示例性實施方式,切出部分支撐件包括多個抽吸孔。因此,為了改進切出部分到夾具上的固定,可以設置聯接至真空泵的多個相應的抽吸孔。 According to another exemplary embodiment, the cut-out portion support includes a plurality of suction holes. Therefore, in order to improve the fixation of the cut-out portion to the clamp, a plurality of corresponding suction holes coupled to the vacuum pump may be provided.
根據另一示例性實施方式,夾具系統還包括佈置有夾具的支撐台。夾具可以以可拆卸的方式固定到支撐台。因此,可以將包括適於各個不同部件承載件的不同設計的不同夾具附接到一個共用的支撐台。 According to another exemplary embodiment, the clamp system further includes a support table on which the clamps are arranged. The clamp can be detachably secured to the support table. Thus, it is possible to attach different clamps, including different designs for each different component carrier, to a common support table.
根據另一示例性實施方式,支撐台包括與其餘部分支撐件的抽吸孔和切出部分支撐件的抽吸孔相匹配的通孔。因此,通過在負壓力下,可以將部件承載件壓向支撐台。另外,根據本示例,部件承載件還將佈置在部件承載件與支撐台之間的夾具壓向支撐台。因此,提供了一種用於部件承載件和夾具固定至支撐臺上的牢固的固定系統。 According to another exemplary embodiment, the support table includes through holes matching the suction holes of the remaining part of the support and the suction holes of the cut-out part of the support. Thus, by being under negative pressure, the component carrier can be pressed against the support table. In addition, according to the present example, the component carrier also presses the clamp arranged between the component carrier and the support table against the support table. Thus, a robust securing system for the securing of the component carrier and the clamp to the support table is provided.
根據另一示例性實施方式,支撐台包括佈置在夾具的槽下方的另外的通孔。如果槽包括通孔,則在對切出部分進行切割期間產生的廢物顆粒可以被吸走。例如,可以在真空泵與另外的通孔之間佈置顆粒過濾器。如果槽特別是槽的底部不具有通孔,則可以通過施加負壓來將夾具沿著 切割區域進一步固定至支撐台,從而可以使得夾具牢固地固定至支撐台。 According to another exemplary embodiment, the support table comprises a further through hole arranged below the groove of the clamp. If the grooves comprise through holes, waste particles generated during the cutting of the cut-out portion can be sucked away. For example, a particle filter can be arranged between the vacuum pump and the further through holes. If the groove, especially the bottom of the groove, does not have a through hole, the clamp can be moved along the The cutting area is further fixed to the support table so that the clamp can be securely fixed to the support table.
因此,通過使夾具的抽吸孔相對於支撐台的通孔相匹配,可以使得將部件承載件和夾具均勻地吸至支撐台,從而提高了切割精度。 Therefore, by matching the suction hole of the jig with the through hole of the support table, the component carrier and the jig can be uniformly sucked to the support table, thereby improving the cutting accuracy.
在一個實施方式中,部件承載件是層壓型部件承載件。在這樣的實施方式中,部件承載件是通過施加壓力和/或熱而疊置並連接在一起的多層結構的複合物。 In one embodiment, the component carrier is a laminated component carrier. In such embodiments, the component carrier is a composite of multilayer structures that are stacked and joined together by the application of pressure and/or heat.
在一實施方式中,至少一個電絕緣層結構包括以下各者中的至少一者:樹脂或聚合物中,例如環氧樹脂、氰酸酯樹脂、苯並環丁烯樹脂、雙馬來醯亞胺-三嗪樹脂、聚亞苯基衍生物(例如基於聚苯醚、PPE)、聚醯亞胺(PI)、聚醯胺(PA)、液晶聚合物(LCP)、聚四氟乙烯(PTFE)、和/或其組合。也可以使用例如由玻璃(多層玻璃)製成的增強結構,增強結構例如為網狀件、纖維、球或其他種類的填料顆粒來形成複合物。半固化樹脂與增強劑組合,例如浸漬有上述樹脂的纖維稱為預浸料。這些預浸料通常以它們的特性命名,例如FR4或FR5,FR4或FR5描述了這些預浸料的耐燃特性。儘管對於硬質PCB而言,通常預浸料是優選的,特別地FR4是優選的,但也可以使用其他材料、尤其是基於環氧樹脂的積層材料(例如積層膜)或可光成像的介電材料。對於高頻應用,諸如聚四氟乙烯、液晶聚合物和/或氰酸酯樹脂之類的高頻材料可能是優選的。除這些聚合物外,低溫共燒陶瓷(LTCC)或其他較低、極低或超低 DK材料也可以應用於部件承載件中來作為電絕緣結構。 In one embodiment, the at least one electrically insulating layer structure comprises at least one of the following: in a resin or polymer, such as epoxy resin, cyanate ester resin, benzocyclobutene resin, bismaleia Amine-triazine resins, polyphenylene derivatives (eg based on polyphenylene ether, PPE), polyimide (PI), polyamide (PA), liquid crystal polymers (LCP), polytetrafluoroethylene (PTFE) ), and/or combinations thereof. It is also possible to use reinforcing structures, eg made of glass (multilayer glass), eg meshes, fibers, spheres or other kinds of filler particles to form the composite. The combination of semi-cured resin and reinforcing agent, such as fiber impregnated with the above resin, is called prepreg. These prepregs are often named after their properties, such as FR4 or FR5, which describe the flame resistance properties of these prepregs. Although prepregs are generally preferred for rigid PCBs, especially FR4, other materials, especially epoxy-based build-up materials (eg, build-up films) or photoimageable dielectrics can also be used Material. For high frequency applications, high frequency materials such as polytetrafluoroethylene, liquid crystal polymers and/or cyanate ester resins may be preferred. In addition to these polymers, low temperature co-fired ceramics (LTCC) or other lower, very low or ultra low DK materials can also be used in component carriers as electrical insulating structures.
在一實施方式中,所述至少一個電傳導層結構可以包含銅、鋁、鎳、銀、金、鈀、鎢和鎂中的至少一者。雖然銅通常是優選的,但是其他材料或其塗層形式也是可能的,特別是分別塗覆有超導材料或傳導性聚合物的材料是可能的,該超導材料或傳導性聚合物例如為石墨烯或聚(3,4-乙烯二氧噻吩)(PEDOT)。 In one embodiment, the at least one electrically conductive layer structure may include at least one of copper, aluminum, nickel, silver, gold, palladium, tungsten, and magnesium. Although copper is generally preferred, other materials or coating forms thereof are also possible, in particular materials coated with a superconducting material or a conducting polymer, respectively, such as Graphene or poly(3,4-ethylenedioxythiophene) (PEDOT).
在一實施方式中,部件承載件成形為板。這有助於緊湊的設計,其中部件承載件仍然為在部件承載件上的安裝部件提供了大的基底。此外,特別地,作為嵌入的電子部件的示例的裸晶片由於其較小的厚度可以被方便地嵌入到諸如印刷電路板之類的薄板中。 In one embodiment, the component carrier is shaped as a plate. This facilitates a compact design wherein the component carrier still provides a large base for mounting components on the component carrier. In addition, in particular, a bare wafer, which is an example of an embedded electronic component, can be easily embedded in a thin board such as a printed circuit board due to its small thickness.
在一實施方式中,部件承載件被配置為印刷電路板、基板(特別是IC基板)和中介層中的一者。 In one embodiment, the component carrier is configured as one of a printed circuit board, a substrate (especially an IC substrate), and an interposer.
在本申請的上下文中,術語“印刷電路板”(PCB)可以特別地表示通過例如經由施加壓力和/或供給熱能而將多個電傳導層結構與多個電絕緣層結構層壓而形成的板狀部件承載件。作為用於PCB技術的優選材料,電傳導層結構由銅製成,而電絕緣層結構可以包括樹脂和/或玻璃纖維、所謂的預浸料或FR4材料。通過例如以激光鑽孔或機械鑽孔的方式形成穿過層壓件的通孔,並且通過用電傳導材料(特別是銅)填充該通孔從而形成過孔或任何其他通孔連接部,可以以期望的方式將各電傳導層結構連接至彼此。經填充的孔連接整個疊置件(延伸穿過多層或整個疊 置件的通孔連接部),或者經填充的孔連接至少兩個電傳導層,稱為過孔。類似地,可以通過疊置件的各個層形成光學互連部,以便接收電光電路板(EOCB)。除了可以被嵌入到印刷電路板中的一個或更多個部件之外,印刷電路板通常被構造成用於在板狀的印刷電路板的一個或兩個相反的表面上容納一個或更多個部件。一個或更多個部件可以通過焊接而被連接到相應的主表面。PCB的電介質部分可以由具有增強纖維(諸如玻璃纖維)的樹脂構成。 In the context of the present application, the term "printed circuit board" (PCB) may in particular denote a structure formed by laminating a plurality of electrically conductive layer structures with a plurality of electrically insulating layer structures, eg via the application of pressure and/or the supply of thermal energy Plate-shaped component carrier. As a preferred material for use in PCB technology, the electrically conductive layer structure is made of copper, while the electrically insulating layer structure may comprise resin and/or fiberglass, so-called prepregs or FR4 materials. By forming a via hole through the laminate, for example by laser drilling or mechanical drilling, and by filling the via hole with an electrically conductive material, especially copper, to form a via hole or any other via hole connection, it is possible to The various electrically conductive layer structures are connected to each other in the desired manner. Filled holes connect the entire stack (extends through multiple layers or the entire stack Through-hole connections of components), or filled holes connecting at least two electrically conductive layers, called vias. Similarly, optical interconnects may be formed through the various layers of the stack to receive an electro-optical circuit board (EOCB). In addition to one or more components that may be embedded in a printed circuit board, a printed circuit board is typically configured to receive one or more on one or both opposing surfaces of a plate-like printed circuit board part. One or more components may be connected to the respective major surfaces by welding. The dielectric portion of the PCB may be composed of resin with reinforcing fibers such as glass fibers.
在本申請的上下文中,術語“基板”可以特別地表示小型的部件承載件。相對於PCB,基板可以是相對較小的部件承載件,一個或更多個部件可以安裝在該部件承載件上,並且基板可以充當一個或更多個芯片與另外的PCB之間的連接介質。例如,基板可以具有與待安裝在基板上的部件(特別是電子部件)基本相同的尺寸(例如,在芯片尺寸封裝(CSP)的情況下)。更具體地,基板可以被理解為用於電連接或電網絡的承載件以及與印刷電路板(PCB)相當的部件承載件,但是所述基板具有相對較高密度的側向和/或豎向設置的連接部。側向連接部是例如傳導路徑,而豎向連接部可以是例如鑽孔。這些側向和/或豎向連接部設置在基板內,並且可用於提供特別是IC芯片的所容置的部件或未容置的部件(例如裸晶片)與印刷電路板或中間印刷電路板的電連接、熱連接和/或機械連接。因此,術語“基板”還可以包括“IC基板”。基板的電介質部分可以由具有增強顆粒(諸如增強球,特別是玻璃球)的樹脂構成。 In the context of this application, the term "substrate" may in particular denote a small component carrier. Relative to a PCB, a substrate may be a relatively small component carrier on which one or more components may be mounted, and which may act as a connection medium between one or more chips and another PCB. For example, the substrate may have substantially the same dimensions (eg, in the case of a chip scale package (CSP)) as the components (especially electronic components) to be mounted on the substrate. More specifically, a substrate can be understood as a carrier for electrical connections or networks and a component carrier comparable to a printed circuit board (PCB), but with a relatively high density of lateral and/or vertical set connection. The lateral connections are, for example, conductive paths, while the vertical connections can be, for example, drilled holes. These lateral and/or vertical connections are provided within the substrate and can be used to provide in particular the connection of housed or non-housed components of an IC chip (eg a bare die) with a printed circuit board or an intermediate printed circuit board. Electrical, thermal and/or mechanical connections. Thus, the term "substrate" may also include "IC substrate". The dielectric portion of the substrate may be composed of a resin with reinforcing particles, such as reinforcing spheres, especially glass spheres.
基板或中介層可以包括以下各者或由以下各者組成:至少一層玻璃、矽(Si)或可光成像的有機材料或幹蝕刻的有機材料,如環氧基積層材料(諸如環氧基積層膜)、或聚合物複合物(聚合物複合物可以包含或不包含光敏分子和/或熱敏分子),如聚醯亞胺或聚苯並惡唑。 The substrate or interposer may include or consist of at least one layer of glass, silicon (Si), or a photoimageable organic material or a dry etched organic material, such as an epoxy-based build-up material such as an epoxy-based build-up film), or polymer complexes (polymer complexes may or may not contain photosensitive molecules and/or thermosensitive molecules), such as polyimide or polybenzoxazole.
至少一個部件可以被嵌入在部件承載件中和/或可以被表面安裝在部件承載件上。這樣的部件可以選自:非導電嵌體、導電嵌體(諸如金屬嵌體,優選地包括銅或鋁)、傳熱單元(例如熱管)、光導元件(例如光波導或光導體連接件)、電子部件、或者上述的組合。嵌體可以是例如帶有或不帶有絕緣材料塗層的金屬塊(IMS嵌體),所述嵌體可以被嵌入或表面安裝以便於散熱。根據材料的導熱率限定合適的材料,導熱率應至少為2W/mK。這種材料通常基於但不限於金屬、金屬氧化物和/或陶瓷,例如銅、氧化鋁(Al2O3)或氮化鋁(AlN)。為了增加熱交換能力,也經常使用具有增加的表面積的其他幾何形狀。此外,所述部件可以是有源電子部件(具有實現的至少一個p-n結)、無源電子部件如電阻器、電感或電容器、電子芯片、存儲裝置(例如DRAM或其他數據存儲器)、濾波器、集成電路(例如現場可編程門陣列(FPGA)、可編程陣列邏輯(PAL)、通用陣列邏輯(GAL)和複雜可編程邏輯器件(CPLD))、信號處理部件、功率管理部件(例如場效應晶體管(FET)、金屬氧化物半導體場效應晶體管(MOSFET)、互補金屬氧化物半導體(CMOS)、結型場效應晶體管(JFET)、或絕緣柵場效 應晶體管(IGFET),上述功率管理部件全部基於半導體材料,例如碳化矽(SiC)、砷化鎵(GaAs)、氮化鎵(GaN)、氧化鎵(Ga2O3)、砷化銦鎵(InGaAs)和/或任何其他合適的無機複合物)、光電接口元件、發光二極管、光電耦合器、電壓轉換器(例如DC/DC轉換器或AC/DC轉換器)、密碼部件、發射器和/或接收器、機電換能器、傳感器、致動器、微機電系統(MEMS)、微處理器、電容器、電阻器、電感、電池、開關、攝像機、天線、邏輯芯片和能量收集單元。但是,可以在部件承載件中嵌入其他部件。例如,磁性元件可以被用作部件。這種磁性元件可以是永磁元件(諸如鐵磁元件、反鐵磁元件、多鐵性元件或亞鐵磁元件,例如鐵氧體芯),或者這種磁性元件可以是順磁元件。然而,該部件也可以是例如呈板中板構型的IC基板、中介層或另外的部件承載件。部件可以被表面安裝在部件承載件上和/或可以被嵌入在部件承載件的內部。此外,也可以使用其他部件作為部件,特別是那些產生和發射電磁輻射和/或對從環境傳播的電磁輻射敏感的部件作為部件。 At least one component can be embedded in the component carrier and/or can be surface mounted on the component carrier. Such components may be selected from: non-conductive inlays, conductive inlays (such as metal inlays, preferably comprising copper or aluminium), heat transfer elements (eg heat pipes), light guide elements (eg light guides or light guide connectors), Electronic components, or a combination of the above. The inlay can be, for example, a metal block with or without a coating of insulating material (IMS inlay), which can be embedded or surface mounted to facilitate heat dissipation. Suitable materials are defined according to their thermal conductivity, which should be at least 2W/mK. Such materials are typically based on, but are not limited to, metals, metal oxides and/or ceramics, such as copper, aluminum oxide (Al 2 O 3 ) or aluminum nitride (AlN). To increase heat exchange capacity, other geometries with increased surface area are also often used. Furthermore, the components may be active electronic components (with at least one pn junction implemented), passive electronic components such as resistors, inductors or capacitors, electronic chips, memory devices (eg DRAM or other data storage), filters, Integrated circuits (eg Field Programmable Gate Arrays (FPGA), Programmable Array Logic (PAL), General Array Logic (GAL) and Complex Programmable Logic Devices (CPLD)), Signal Processing Components, Power Management Components (eg Field Effect Transistors) (FET), Metal Oxide Semiconductor Field Effect Transistor (MOSFET), Complementary Metal Oxide Semiconductor (CMOS), Junction Field Effect Transistor (JFET), or Insulated Gate Field Effect Transistor (IGFET), all of which are based on semiconductors Materials such as Silicon Carbide (SiC), Gallium Arsenide (GaAs), Gallium Nitride (GaN), Gallium Oxide ( Ga2O3 ) , Indium Gallium Arsenide (InGaAs) and/or any other suitable inorganic compound) , optoelectronic interface elements, light emitting diodes, optocouplers, voltage converters (eg DC/DC converters or AC/DC converters), cryptographic components, transmitters and/or receivers, electromechanical transducers, sensors, actuators devices, microelectromechanical systems (MEMS), microprocessors, capacitors, resistors, inductors, batteries, switches, cameras, antennas, logic chips and energy harvesting units. However, other components can be embedded in the component carrier. For example, magnetic elements can be used as components. Such magnetic elements may be permanent magnet elements (such as ferromagnetic elements, antiferromagnetic elements, multiferroic elements or ferrimagnetic elements, eg ferrite cores), or such magnetic elements may be paramagnetic elements. However, the component may also be an IC substrate, an interposer or another component carrier, eg in a board-in-board configuration. The components may be surface mounted on the component carrier and/or may be embedded within the component carrier. In addition, other components may also be used as components, particularly those that generate and emit electromagnetic radiation and/or are sensitive to electromagnetic radiation propagating from the environment.
在處理部件承載件的內部層結構之後,可以用一個或更多個另外的電絕緣層結構和/或電傳導層結構對稱地或不對稱地覆蓋(特別是通過層壓)經處理的層結構的一個或兩個相反的主表面。換而言之,可以繼續積累直到獲得所需數量的層。 After processing the inner layer structure of the component carrier, the processed layer structure can be symmetrically or asymmetrically covered (in particular by lamination) with one or more further electrically insulating and/or electrically conductive layer structures one or two opposite major surfaces. In other words, accumulation can continue until the desired number of layers are obtained.
在完成電絕緣層結構和電傳導層結構的疊置件的形成 之後,可以繼續對所獲得的層結構或部件承載件進行表面處理。 After completing the formation of the stack of the electrically insulating layer structure and the electrically conductive layer structure After that, the surface treatment of the layer structure or component carrier obtained can be continued.
特別地,就表面處理而言,可以將電絕緣阻焊劑施加至層疊置件或部件承載件的一個或兩個相反的主表面。例如,可以在整個主表面上形成例如阻焊劑並隨後對阻焊劑的層進行圖案化,以暴露一個或更多個電傳導表面部分,該電傳導表面部分將用於將部件承載件與電子外圍件進行電耦接。部件承載件的保持被阻焊劑覆蓋的表面部分、特別是含銅的表面部分可以有效地被保護以免受氧化或腐蝕。 In particular, with regard to surface treatments, an electrically insulating solder resist may be applied to one or both opposing major surfaces of the layer stack or component carrier. For example, a layer of solder resist, for example, can be formed over the entire major surface and then patterned to expose one or more electrically conductive surface portions that will be used to connect the component carrier to the electronic periphery pieces are electrically coupled. The surface portion of the component carrier which remains covered with the solder resist, in particular the copper-containing surface portion, can be effectively protected against oxidation or corrosion.
就表面處理而言,還可以選擇性地將表面修整部應用於部件承載件的暴露的電傳導表面部分。這種表面修整部可以是在部件承載件的表面上的暴露的電傳導層結構(諸如,特別是包含銅或包括銅的墊、傳導跡線等)上的電傳導覆蓋材料。如果這種暴露的電傳導層結構不被保護,則暴露的電傳導部件承載件材料(特別是銅)可能氧化,從而使部件承載件不太可靠。然後表面修整部可以形成為例如作為表面安裝的部件與部件承載件之間的接合部。表面修整部具有保護暴露的電傳導層結構(特別是銅電路)並且例如通過焊接來實現與一個或更多個部件的結合過程的功能。用於表面修整部的適當材料的示例是有機可焊性防護劑(OSP)、化學鎳浸金(ENIG)、化學鎳浸鈀浸金(ENIPIG)、金(特別是硬金)、化學錫、鎳-金、鎳-鈀等。 With regard to surface treatments, surface treatments can also be selectively applied to exposed electrically conductive surface portions of the component carrier. Such a surface finish may be an electrically conductive cover material on exposed electrically conductive layer structures on the surface of the component carrier, such as, in particular, copper-containing or copper-comprising pads, conductive traces, and the like. If such exposed electrically conductive layer structures are not protected, the exposed electrically conductive component carrier material, particularly copper, may oxidize, making the component carrier less reliable. The surface finish may then be formed, for example, as a joint between the surface mounted component and the component carrier. The surface finish has the function of protecting exposed electrically conductive layer structures (especially copper circuits) and fulfilling a bonding process with one or more components, eg by soldering. Examples of suitable materials for the surface finish are organic solderability preservatives (OSP), electroless nickel immersion gold (ENIG), electroless nickel immersion palladium immersion gold (ENIPIG), gold (especially hard gold), electroless tin, Nickel-gold, nickel-palladium, etc.
根據下面將描述的實施方式的示例,本新型的以上限 定的方面和其他方面變得明顯,並且參考實施方式的這些示例對本新型的上述限定的方面和其他方面進行解釋。 According to the example of the embodiment to be described below, the above limit of the present invention is Certain aspects and other aspects are apparent from and explained with reference to these examples of embodiments.
100:夾具 100: Fixtures
101:其餘部分支撐件 101: The rest of the support
102:切出部分支撐件 102: Cut out part of the support
103:開口 103: Opening
104:支撐平面 104: Support plane
105:其餘部分支撐件的支撐凸緣 105: Support flanges for the rest of the supports
106:切出部分支撐件的支撐凸緣 106: Cut out the support flange of the partial support
107:其餘部分支撐件的抽吸孔 107: Suction holes for the rest of the supports
108:切出部分支撐件的抽吸孔 108: Cut out suction holes for part of the support
109:切割工具 109: Cutting Tools
110:支撐台 110: Support table
120:部件承載件 120: Component carrier
121:切出部分 121: Cut out the part
122:其餘部分 122: The rest
123:切割區域 123: Cutting Area
124:底部部分 124: Bottom part
201:支撐台的通孔 201: Through hole for support table
202:支撐台的另外的通孔 202: Additional through holes for the support table
A:切割區域的寬度 A: The width of the cutting area
B:開口的寬度 B: The width of the opening
C:槽的深度 C: Depth of groove
[圖1]示出了根據示例性實施方式的夾具系統的示意圖。 [ FIG. 1 ] A schematic diagram showing a jig system according to an exemplary embodiment.
[圖2]示出了根據示例性實施方式的包括具有通孔的支撐台的夾具系統的示意圖。 [ FIG. 2 ] A schematic diagram illustrating a jig system including a support table having a through hole according to an exemplary embodiment.
[圖3]示出了根據示例性實施方式的夾具系統的夾具的示意性俯視圖。 [ FIG. 3 ] A schematic top view showing a clamp of a clamp system according to an exemplary embodiment.
附圖中的圖示是示意性的。在不同的附圖中,相似或相同的元件設置有相同的附圖標記。 The illustrations in the drawings are schematic. In different figures, similar or identical elements are provided with the same reference numerals.
圖1示出了根據示例性實施方式的夾具系統的示意圖。所述夾具系統適用於對部件承載件120進行處理,其中,部件承載件120包括至少一個切出部分121和圍繞所述切出部分121的其餘部分122。在切出部分121與其餘部分122之間設置有切割區域123。夾具系統包括夾具100,夾具100包括用於對其餘部分122進行支撐的其餘部分支撐件101和用於對切出部分121進行支撐的切出部分支撐件102。夾具100包括具有開口103的槽,所述槽在部件承載件120的切割區域123下方並且沿著部件承載件120的切割區域123位於其餘部分支撐件101與切出部分支撐件102之
間。
FIG. 1 shows a schematic diagram of a clamp system according to an exemplary embodiment. The clamp system is suitable for processing a
可以通過切割工具109來處理部件承載件120。例如,切割出部件承載件120的特定的矩形或圓形部分。通過沿著切割區域123對部件承載件120進行切割,並沒有同時將部件承載件的切出部分121與部件承載件120的其餘部分122分離,使得由於重力,切出部分121可能與部件承載件120的其餘部分122斷開,這會導致廢物顆粒,所述廢物顆粒可能會損壞部件承載件。
槽的開口103佈置在部件承載件120的切割區域123的下方。切割區域123限定切割線,切割工具109沿著所述切割線將切出部分121與圍繞所述切出部分121的其餘部分122分開。通過在切割區域123的下方提供具有開口103的槽,由部件承載件120的切割產生的廢物顆粒由於重力穿過開口103遠離部件承載件120而掉落。由切割工具產生的廢物顆粒被聚集在槽中。切出部分支撐件102形成為用於在支撐平面104中對部件承載件120的切出部分121進行支撐,該支撐平面與其餘部分支撐件101對部件承載件120的其餘部分122進行支撐所在的支撐平面相同。
The
槽的開口103的寬度(或直徑)B大於部件承載件120的切割區域123的寬度(或直徑)A。開口103的寬度B可以介於0.7mm(毫米)至1.1毫米之間、特別是介於0.8mm至1.0mm之間。激光切割工具的光束尺寸可以是例如18μm至22μm。夾具100的厚度可以是3.0mm至4.0mm、特別地是3.5mm。
The width (or diameter) B of the
開口103形成在切出部分支撐件102的支撐凸緣106與其餘部分支撐件101的支撐凸緣105之間,支撐凸緣106和支撐凸緣105均沿著切割區域123延伸。槽還由底部部分124形成,底部部分124在切出部分支撐件102的支撐凸緣106與其餘部分支撐件101的支撐凸緣105之間延伸,其中,底部部分124與夾具100的可佈置有部件承載件120的表面間隔開。因此,其餘部分支撐件101和切出部分支撐件102包括沿著切割區域123延伸的相應的凸緣或壁部分105、106,其中切出部分支撐件102和其餘部分支撐件101的相應的凸緣105、106彼此間隔開以形成夾具100的開口103。此外,通過將凸緣105和凸緣107連接的底部部分124,由切割工具109產生的廢物顆粒可以被聚集在槽中。槽的深度C可以是1mm至2mm。
The
其餘部分支撐件101包括可聯接至真空泵的抽吸孔107。抽吸孔107佈置在部件承載件120的其餘部分122的下方,使得在由真空泵施加負壓力時,部件承載件120可以被固定至夾具100。
The rest of the
此外,切出部分支撐件102包括可聯接至真空泵的抽吸孔108。因此,部件承載件120的切出部分121可以以牢固的方式固定至切出部分支撐件102,使得在對部件承載件120進行處理期間以及在對部件承載件120處理之後,切出部分121可以被固定至夾具100。
Additionally, the cut-out
夾具系統還包括支撐台110,在該支撐台110上佈置有夾具100。夾具100可以以可拆卸的方式固定到支撐台
110。
The clamp system also includes a support table 110 on which the
圖2示出了根據示例性實施方式的夾具系統的示意圖,該夾具系統包括具有通孔201、202的支撐台110。夾具100形成為與圖1中的夾具100相類似。然而,支撐台110包括與其餘部分支撐件101的抽吸孔107和切出部分支撐件102的抽吸孔108相匹配的通孔201。因此,在負壓力下,部件承載件120被壓向支撐台110。另外,部件承載件120還將佈置在部件承載件120與支撐台110之間的夾具100壓向支撐台110。
FIG. 2 shows a schematic diagram of a clamp system including a support table 110 having through
此外,支撐台110還包括佈置在槽下方的通孔202。槽形成封閉的腔,從而通過從支撐台110的一側施加負壓,可以將夾具100沿著切割區域123進一步固定到支撐台110。通過使夾具100的抽吸孔107、108相對於支撐台的通孔201相匹配,可以提供將部件承載件120和夾具100朝向支撐台110的均勻的吸引,從而提高了切割精度。
In addition, the support table 110 further includes a through
圖3示出了根據示例性實施方式的夾具系統的夾具100的示意性俯視圖。夾具100包括多個切出部分支撐件102,多個切出部分支撐件102被其餘部分支撐件101圍繞。切出部分支撐件102由槽的開口103分開。切出部分支撐件102形成支撐平臺,部件承載件120的切出部分121可以被支撐在該支撐平臺上。在支撐平臺上形成有相應的抽吸孔108。在圖3所示的示例性實施方式中,切出部分支撐件102可以包括僅一個抽吸孔108或兩個(或多個)抽吸孔108。此外,其餘支撐部分101可以包括多個通孔107。
FIG. 3 shows a schematic top view of a
應當注意,術語“包括”不排除其他元件或步驟,並且“一”或“一種”不排除多個。此外,可以對與不同實施方式相關聯描述的元件進行組合。 It should be noted that the term "comprising" does not exclude other elements or steps, and "a" or "an" does not exclude a plurality. Furthermore, elements described in association with different embodiments may be combined.
還應當注意,權利要求中的附圖標記不應被解釋為限制申請專利範圍。 It should also be noted that reference signs in the claims shall not be construed as limiting the scope of the patent application.
本新型的實現不限於附圖所示的和上述的優選實施方式。相反,即使在根本不同的實施方式的情況下,也可以使用根據本新型示出的解決方案和原理的多種變型。 The realization of the novel is not limited to the preferred embodiments shown in the drawings and described above. Rather, many variants of the solutions and principles shown in accordance with the present invention may be used, even in the case of radically different embodiments.
100:夾具 100: Fixtures
101:其餘部分支撐件 101: The rest of the support
102:切出部分支撐件 102: Cut out part of the support
103:開口 103: Opening
104:支撐平面 104: Support plane
105:其餘部分支撐件的支撐凸緣 105: Support flanges for the rest of the supports
106:切出部分支撐件的支撐凸緣 106: Cut out the support flange of the partial support
107:其餘部分支撐件的抽吸孔 107: Suction holes for the rest of the supports
108:切出部分支撐件的抽吸孔 108: Cut out suction holes for part of the support
109:切割工具 109: Cutting Tools
110:支撐台 110: Support table
120:部件承載件 120: Component carrier
121:切出部分 121: Cut out the part
122:其餘部分 122: The rest
123:切割區域 123: Cutting Area
124:底部部分 124: Bottom part
Claims (12)
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CN202120132409.4 | 2021-01-18 | ||
CN202120132409.4U CN214507503U (en) | 2021-01-18 | 2021-01-18 | Clamping system for handling component carriers |
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TWM631352U true TWM631352U (en) | 2022-09-01 |
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ID=78215571
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TW111200499U TWM631352U (en) | 2021-01-18 | 2022-01-13 | System for processing a component carrier |
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CN (1) | CN214507503U (en) |
TW (1) | TWM631352U (en) |
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2021
- 2021-01-18 CN CN202120132409.4U patent/CN214507503U/en active Active
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