CN213960402U - Component carrier and manufacturing system for manufacturing component carrier - Google Patents

Abstract

The present application provides a component carrier (1) comprising a laminated stack comprising at least one electrically insulating layer structure (2) and at least one electrically conductive layer structure (3). In a plan view of the component carrier (1), the electrically conductive layer structure (3) has a substantially rectilinear boundary (6); the electrically insulating layer structure (2) protrudes from a boundary (6) of the electrically conductive layer structure (3) such that a boundary (7) of the electrically insulating layer structure (2) extends beyond the boundary (6) of the electrically conductive layer structure (3); and the boundary (7) of the electrically insulating layer structure (2) has a regular shape. The present application further provides a manufacturing system (10) for manufacturing a component carrier (1).

Description

Component carrier and manufacturing system for manufacturing component carrier

Technical Field

The present application relates to a component carrier and a manufacturing system for manufacturing a component carrier.

Background

Fig. 5 shows an enlarged plan view of a part of a component carrier 100 according to the prior art. The prior art component carrier 100 comprises a laminated stack comprising an electrically insulating layer structure 200 and an electrically conductive layer structure 300. In an enlarged plan view of the component carrier 100, the electrically-conductive layer structure 300 has a boundary 600 that is substantially linear.

Electrically insulating layer structure 200 may be an ABF material. During lamination of the laminate, the ABF material seeps outside the boundary 600 of the electrically-conductive layer structure 300. The boundary 700 of the resulting electrically insulating layer structure 200 has a characteristic random and irregular shape as shown in fig. 5. This exuded material of the laminated electrically insulating layer structure 200 can subsequently contaminate the environment in a chemical process and affect other drying processes as well as the component carrier 100 itself (copper residues, undulations, etc.). It can lead to defects such as copper nodules, incompletely filled vias, undulations and other defects.

SUMMERY OF THE UTILITY MODEL

There is a need for a component carrier and a manufacturing system for manufacturing the component carrier that avoids the impact of such exuded material of a laminated electrically insulating barrier structure. This need is met by the teachings of the present application.

According to a first aspect of the application, the component carrier comprises a laminated stack comprising at least one electrically insulating layer structure and at least one electrically conductive layer structure. In a plan view of the component carrier, the at least one electrically-conductive layer structure has a substantially linear boundary; and the at least one electrically insulating layer structure protrudes from the boundary of the at least one electrically conductive layer structure such that the boundary of the at least one electrically insulating layer structure extends beyond the boundary of the at least one electrically conductive layer structure. The boundary of the at least one electrically insulating layer structure has a regular shape.

For example, a laser may be used to remove exuding material of the electrically insulating layer structure at the edge of the component carrier. Thereby, product yield loss can be reduced. The laser function for trimming the boundary of the at least one electrically insulating layer structure can easily be added to an existing manufacturing process.

According to an embodiment, the regular shape of the boundary of the at least one electrically insulating layer structure is substantially linear. Preferably, the boundary of the at least one electrically insulating layer structure extends parallel to the boundary of the at least one electrically conductive layer structure. Preferably, the straightness of the border of the at least one electrically insulating layer structure is less than 0.3mm, preferably the straightness of the border of the at least one electrically insulating layer structure is less than 0.1 mm.

According to an embodiment, the regular shape of the boundary of the at least one electrically insulating layer structure is wave-shaped.

According to an embodiment, a boundary of the at least one electrically insulating layer structure protrudes more than 0.5mm from a boundary of the at least one electrically conductive layer structure.

According to an embodiment, the raw material of the at least one electrically insulating layer structure is or comprises a laminable material, and the actual material of the at least one electrically insulating layer structure of the component carrier is in a laminated state. Preferably, the at least one electrically insulating layer structure comprises an epoxy-based build-up material, a prepreg, a solder resist, a photosensitive film or a flux.

According to an embodiment, the at least one electrically insulating layer structure is sandwiched between the at least one electrically conductive layer structure and the further electrically conductive layer structure.

According to an embodiment, the at least one electrically insulating layer structure has, in a cross-section of the component carrier, substantially straight side edges. Such substantially straight sides are obtained by laser trimming the boundaries of the at least one electrically insulating layer structure.

According to an embodiment, the component is embedded in the stack or surface mounted on the stack.

According to a second aspect of the application, a manufacturing system for manufacturing a component carrier is provided. The manufacturing system includes: a laminating station configured to laminate the stack to obtain a laminated stack; and a laser station configured to laser trim the stack to obtain a boundary of the at least one electrically insulating layer structure having a regular shape.

According to an embodiment, the laser station is configured to drill holes in the stack. For example, a trimming process may be added after the laser drilling process, the laser drilling process and the trimming process preferably using the same laser station.

In order to trim the boundary of the at least one electrically insulating layer structure according to the present application, the specific laser aperture may be selected such that the laser beam size may trim the boundary. The laser power, laser pulse duty cycle, laser pulse width, and time parameters for trimming may be adjusted to achieve the optimal target power for trimming.

Thereby, a solution may be obtained that completely solves the problem of exuding material at the edges of the component carrier.

In the context of the present application, the term "regular shape" may particularly denote a non-random shape, for example a substantially linear, wavy, in particular periodic shape, or also any sequence of different regular shapes.

In the context of the present application, the term "manufacturing station" may particularly denote any unit or any single tool for performing any step of manufacturing a component carrier.

In the context of the present application, the term "component carrier" may particularly denote any support structure capable of accommodating one or more components thereon and/or therein to provide mechanical support and/or electrical connection. In other words, the component carrier may be configured as a mechanical and/or electronic carrier for the components. The component carrier may comprise a laminated stack. In particular, the component carrier may be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. The component carrier may also be a hybrid board combining different ones of the above-mentioned types of component carriers.

In the context of the present application, the term "stack" may particularly denote an arrangement of a plurality of planar layer structures, which are mounted parallel to each other on top of each other.

In the context of the present application, the term "layer structure" may particularly denote a continuous layer, a patterned layer or a plurality of non-continuous islands in a common plane.

In the context of the present application, the term "electronic component" may particularly denote a component that performs an electronic task. Such an electronic component may be, for example, a semiconductor chip comprising semiconductor material, in particular semiconductor material, as a main or base material. The semiconductor material may be, for example, a type IV semiconductor such as silicon or germanium, or the semiconductor material may be a type III-V semiconductor material such as gallium arsenide. In particular, the semiconductor component may be a semiconductor chip, for example a bare die or a molded die.

In an embodiment, the component carrier comprises a stack of at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier may be a stack of the mentioned electrically insulating layer structure(s) and electrically conductive layer structure(s), in particular formed by applying mechanical pressure and/or thermal energy. The mentioned stack may provide a plate-like component carrier which is able to provide a large mounting surface for further components and which is still very thin and compact.

In one embodiment, the component carrier is shaped as a plate. This contributes to a compact design, wherein the component carrier still provides a large base for mounting components on the component carrier. In addition, particularly a bare die, which is an example of an embedded electronic component, can be easily embedded in a thin board such as a printed circuit board thanks to its small thickness.

In one embodiment, the component carrier is configured as one of a printed circuit board, a substrate (in particular an IC substrate) and an interposer.

In the context of the present application, the term "printed circuit board" (PCB) may particularly denote a plate-like component carrier formed by a number of electrically conductive layer structures and a number of electrically insulating layer structures, for example by applying pressure and/or by supplying thermal energy. As a preferred material for PCB technology, the electrically conductive layer structure is made of copper, while the electrically insulating layer structure may comprise resin and/or glass fibres, so-called prepreg or FR4 material. The various electrically conductive layer structures can be connected to each other in a desired manner by the following process: a through hole is formed through the laminate, for example by laser drilling or mechanical drilling, and a via or any other through hole connection is formed by filling the through hole with an electrically conductive material, in particular copper. The filled holes connect the entire stack (through-hole connections extending through multiple layers or the entire stack), or the filled holes connect at least two electrically conductive layers (called vias). Similarly, optical interconnects may be formed through the layers of the stack to receive an electro-optical circuit board (EOCB). In addition to one or more components that may be embedded in a printed circuit board, printed circuit boards are typically configured to receive one or more components on one or both opposing surfaces of a plate-like printed circuit board. They may be attached to the respective major surfaces by welding. The dielectric portion of the PCB may be composed of a resin with reinforcing fibers, such as glass fibers.

In the context of the present application, the term "substrate" may particularly denote a small component carrier. The substrate may be a relatively small component carrier with respect to the PCB, on which one or more components may be mounted, and may serve as a connection medium between the chip(s) and the further PCB. For example, the substrate may have substantially the same size as the components (in particular, electronic components) to be mounted on the substrate (for example, in the case of a Chip Size Package (CSP)). More specifically, a baseplate may be understood as a carrier for electrical connections or networks and a component carrier comparable to a Printed Circuit Board (PCB), but with a relatively high density of laterally and/or vertically arranged connections. The lateral connections are, for example, conductive paths, while the vertical connections may be, for example, boreholes. These lateral and/or vertical connections are provided within the substrate and may be used to provide electrical and/or mechanical connection of a housed or non-housed component (e.g. bare die), in particular of an IC chip, to a printed circuit board or an intermediate printed circuit board. Thus, the term "substrate" may also include "IC substrates". The dielectric portion of the substrate may be composed of a resin with reinforcing particles, such as reinforcing balls, in particular glass balls.

The substrate or interposer may comprise (or consist of): at least one layer of glass, silicon (Si) or a photoimageable or dry-etched organic material, such as an epoxy-based build-up material (such as an epoxy-based build-up film) or a polymer composite (which may or may not contain photosensitive and/or thermosensitive molecules), such as polyimide or polybenzoxazole.

In an embodiment, the at least one electrically insulating layer structure comprises at least one of: resins or polymers such as epoxy resins, cyanate ester resins, benzocyclobutene resins, bismaleimide triazine resins, polyphenylene derivatives (e.g. based on polyphenylene ether, PPE), Polyimides (PI), Polyamides (PA), Liquid Crystal Polymers (LCP), Polytetrafluoroethylene (PTFE) and/or combinations thereof. Reinforcing materials, for example made of glass (multiple layer glass), such as meshes, fibers, spheres or other kinds of filler particles may also be used to form the composite. A combination of a semi-cured resin and a reinforcing agent, such as a fiber impregnated with the above resin, is called a prepreg. These prepregs are generally named for their properties, for example FR4 or FR5, FR4 or FR5 describe the flame retardant properties of prepregs. While prepreg, and in particular FR4, is generally preferred for rigid PCBs, other materials, in particular epoxy based build-up materials (such as epoxy based build-up films) or photoimageable dielectric materials may be used. For high frequency applications, high frequency materials such as polytetrafluoroethylene, liquid crystal polymers and/or cyanate ester resins may be preferred. In addition to these polymers, low temperature co-fired ceramics (LTCC) or other low DK materials, lower DK materials, ultra low DK materials can be applied in the component carrier as an electrically insulating structure.

In an embodiment, the at least one electrically conductive layer structure may comprise at least one of copper, aluminum, nickel, silver, gold, palladium, tungsten, and magnesium. Although copper is generally preferred, other materials or coating forms thereof are possible, in particular coated with a superconducting material or a conductive polymer, such as graphene or poly (3, 4-ethylenedioxythiophene) (PEDOT), respectively.

The at least one component may be embedded in the component carrier and/or may be surface mounted on the component carrier. Such components may be selected from: a non-conductive inlay, a conductive inlay (such as a metal inlay, preferably comprising copper or aluminum), a heat transfer unit (e.g., a heat pipe), a light guide element (e.g., a light guide or light conductor connector), an electronic component, or a combination thereof. The inlay may be, for example, a metal block with or without a coating of insulating material (IMS inlay), which may be embedded or surface mounted to aid in heat dissipation. Suitable materials are defined in terms of the thermal conductivity of the material, which should be at least 2W/mK. Such materials are generally based on, but not limited to, metals, metal oxides and/or ceramics, such as copper, alumina (Al)₂O₃) Or aluminum nitride (AlN). Other geometries with increased surface area are also often used in order to increase the heat exchange capacity. Furthermore, the component may be an active electronic component (having implemented at least one p-n junction), a passive electronic component (e.g., a resistor, an inductor, or a capacitor), an electronic chip, a storage device (e.g., a DRAM or other data storage), a filter, an integrated circuit (e.g., a Field Programmable Gate Array (FPGA), a Programmable Array Logic (PAL), a Generic Array Logic (GAL), and a Complex Programmable Logic Device (CPLD)), a signal processing component, a power management component (e.g., all based on semiconductor materials such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga)₂O₃) Field Effect Transistors (FETs), Metal Oxide Semiconductor Field Effect Transistors (MOSFETs), Complementary Metal Oxide Semiconductors (CMOS), Junction Field Effect Transistors (JFETs) or Insulated Gate Field Effect Transistors (IGFETs)), optoelectronic interface elements, light emitting diodes, opto-couplers, voltage converters (e.g. DC/DC converters or AC/D converters) of indium gallium arsenide (InGaAs) and/or any other suitable inorganic compoundC-converters), cryptographic components, transmitters and/or receivers, electromechanical converters, sensors, actuators, micro-electromechanical systems (MEMS), microprocessors, capacitors, resistors, inductors, accumulators, switches, cameras, antennas, logic chips and energy harvesting units. However, other components may be embedded in the component carrier. For example, a magnetic element may be used as the component. Such a magnetic element may be a permanent magnetic element (such as a ferromagnetic element, an antiferromagnetic element, a multiferroic element, or a ferrimagnetic element, e.g. a ferrite core), or such a magnetic element may be a paramagnetic element. However, the component may also be a substrate, an interposer or another component carrier, for example in a board-in-board configuration. The component may be surface mounted on the component carrier and/or may be embedded inside the component carrier. Furthermore, other components, in particular those which generate and emit electromagnetic radiation and/or which are sensitive to electromagnetic radiation propagating from the environment, can also be used as the component.

In an embodiment, the component carrier is a laminate type component carrier. In such embodiments, the component carrier is an assembly of multiple layers of structures that are stacked and joined together by the application of pressure and/or heat.

After processing the inner layer structure of the component carrier, one or both opposing main surfaces of the processed layer structure may be covered (in particular by lamination) symmetrically or asymmetrically with one or more further electrically insulating layer structures and/or electrically conductive layer structures. In other words, lamination may continue until the desired number of layers is obtained.

After completion of the formation of the stack of the electrically insulating layer structure and the electrically conductive layer structure, the obtained layer structure or component carrier may be subjected to a surface treatment.

In particular, in the case of surface treatment, an electrically insulating solder resist may be applied to one or both of the opposite main surfaces of the layer stack or the component carrier. For example, a layer of, for example, solder resist may be formed over the entire main surface and subsequently patterned to expose one or more electrically conductive surface portions that will be used to electrically couple the component carrier with the electronic periphery. The surface portion of the component carrier, in particular the surface portion containing copper, which remains covered with the solder resist, can be effectively protected from oxidation or corrosion.

In the case of a surface treatment, a surface modification can also be selectively applied to the exposed electrically conductive surface portions of the component carrier. Such surface modification may be an electrically conductive covering material on exposed electrically conductive layer structures (such as, in particular, pads comprising or consisting of copper, electrically conductive tracks, etc.) on the surface of the component carrier. If such an exposed electrically conductive layer structure is not protected, the exposed electrically conductive component carrier material (particularly copper) may oxidize, making the component carrier less reliable. A surface modification may then be formed, for example as an interface between the surface mounted component and the component carrier. The surface modification has the function of protecting the exposed electrically conductive layer structure (in particular the copper circuit) and of carrying out the bonding process with one or more components, for example by soldering. Examples of suitable materials for surface modification are organic solderability preservative material (OSP), electroless nickel gold (ENIG), electroless nickel-gold-immersion gold (ENIPIG), gold (especially hard gold), chemical tin, nickel-gold, nickel-palladium, and the like.

The aspects defined above and further aspects of the present application are apparent from the examples of embodiment to be described hereinafter and are explained with reference to these examples of embodiment.

Drawings

Fig. 1 shows a cross section of a component carrier according to an embodiment.

Fig. 2 shows an enlarged plan view of the component carrier in relation to fig. 1.

Fig. 3 shows an enlarged detail Z from fig. 1.

Fig. 4 shows an enlarged plan view on a part of a component carrier according to a further embodiment.

Fig. 5 shows an enlarged plan view of a part of a component carrier according to the prior art.

Fig. 6 shows a schematic view of a manufacturing system for manufacturing a component carrier according to an embodiment.

Fig. 7 shows a schematic view of a manufacturing system for manufacturing a component carrier according to another embodiment.

Detailed Description

The illustration in the drawings is schematically. In different drawings, similar or identical elements are provided with the same reference signs.

Fig. 1 shows a cross section of a component carrier 1 according to an embodiment. The component carrier 1 comprises a laminated stack comprising an electrically insulating layer structure 2 and an electrically conductive layer structure 3. The electrically insulating layer structure 2 is sandwiched between the electrically conductive layer structure 3 and the further electrically conductive layer structure 8. The component 5 is embedded in the stack. The component carrier 1 may be a printed circuit board. Reference numeral 4 may denote a solder resist.

The electrically conductive layer structure 3 is a patterned or structured layer, which electrically conductive layer structure 3 is realized, for example, by means of a photolithography process and an etching process. Holes 9 are drilled in the electrically insulating layer structure 2, for example by means of a laser. The holes 9 are plated or filled with an electrically conductive material, thereby forming vias in the holes 9. Which in turn is connected to the pads of the component 5 and to the patterned electrically conductive layer structure 3.

Fig. 2 shows an enlarged plan view of the component carrier 1 from fig. 1. In an enlarged plan view of the component carrier 1, the electrically conductive layer structure 3 has a substantially rectilinear boundary 6. In other words, the border 6 forms an edge of the electrically conductive layer structure 3.

The electrically insulating layer structure 2 protrudes from the border 6 of the electrically conductive layer structure 3 such that the border 7 of the electrically insulating layer structure 2 extends beyond the border 6 of the electrically conductive layer structure 3.

The border 7 of the electrically insulating layer structure 2 has a regular shape. In the embodiment of fig. 2, the regular shape of the border 7 of the electrically insulating layer structure 2 is substantially linear, and the border 7 of the electrically insulating layer structure 2 extends parallel to the border 6 of the electrically conductive layer structure 3. For example, the straightness of the border 7 of the electrically insulating layer structure 2 may be less than 0.3mm, preferably less than 0.1 mm.

The raw material of the electrically insulating layer structure 2 is a laminable material, or the raw material of the electrically insulating layer structure 2 comprises a laminable material, and the actual material of the electrically insulating layer structure 2 of the component carrier 1 is in a laminated state. The electrically insulating layer structure 2 includes, for example, a resin material such as an epoxy-based build-up material, or a prepreg or the like. During lamination of the stack and before obtaining the finally manufactured component carrier 1, the raw material of the electrically insulating layer structure 2 is heated and softened, so that the raw material of the electrically insulating layer structure 2 seeps out of the borders 6 of the electrically conductive layer structure 3. The borders 7 of the electrically insulating layer structure 2 thus temporarily have a random and irregular shape as shown in fig. 5. In the present application, the borders 7 of the electrically insulating layer structure 2 are subsequently laser trimmed to obtain a regular shape as shown in fig. 2.

In general, the boundary 7 of the electrically insulating layer structure 2 may be trimmed using any suitable laser machine, for example the same laser machine that has been used for drilling the hole 9. Optionally, the laser power, laser pulse duty cycle, laser pulse width and time parameters may be adjusted or varied to achieve a target power for trimming the boundary 7 of the electrically insulating layer structure 2.

Advantageously, the laser function is used to remove the exuded resin material at the edges of the component carrier 1, thereby reducing yield loss of the product. The laser function for trimming the boundary 7 of the electrically insulating layer structure 2 can easily be added to an existing manufacturing process.

Fig. 3 shows an enlarged detail Z from fig. 1. In the cross section of the component carrier 1, the laser-trimmed boundary 7 of the electrically insulating layer structure 2 can be further recognized, since the electrically insulating layer structure 2 has substantially straight side edges 21. Due to laser trimming, the substantially straight side edges 21 are sometimes not perfectly vertical, but have a relatively small inclination angle α with respect to the vertical axis (the inclination angle α is greatly exaggerated in fig. 3 for better understanding). The tilt angle alpha can also be observed in so-called laser vias.

Furthermore, the border 7 of the electrically insulating layer structure 2 protrudes a distance a from the border 6 of the electrically conductive layer structure 3. If the laser beam is directed close to the boundary 6 of the electrically conductive layer structure 3, the laser beam does not affect the electrically conductive layer structure 3 and the resulting boundary 7 of the electrically insulating layer structure 2 is very close to the boundary 6 of the electrically conductive layer structure 3. In other words, the distance a can also be very small.

Fig. 4 shows an enlarged plan view of a part of a component carrier 1 according to a further embodiment. The regular shape of the boundary 7 of the electrically insulating layer structure 2 is a wave. In this embodiment, the undulation is sinusoidal in shape. In other embodiments, the undulations may have a saw-tooth shape, or the undulations may be a sequence of straight portions that are angled with respect to each other.

In all embodiments, the border 7 of the electrically insulating layer structure 2 may protrude more than 0.5mm from the border 6 of the electrically conductive layer structure 3. The region between the boundary 7 of the electrically insulating layer structure 2 and the boundary 6 of the electrically conductive layer structure 3 may also be referred to as a exclusion zone (KOZ). However, it is conceivable that the boundary 7 of the electrically insulating layer structure 2 protrudes a much smaller amount from the boundary 6 of the electrically conductive layer structure 3. It has to be taken into account that the laser beam normally cannot pass through the electrically conductive layer structure 3, which may be a copper layer. If the laser beam is directed close to the boundary 6 of the electrically conductive layer structure 3, the laser beam does not affect the electrically conductive layer structure 3 and the resulting boundary 7 of the electrically insulating layer structure 2 is very close to the boundary 6 of the electrically conductive layer structure 3.

Fig. 6 shows a schematic view of a manufacturing system 10 for manufacturing a component carrier 1 according to an embodiment. The manufacturing system 10 includes, among other things: a lamination station 11, the lamination station 11 being configured to laminate the stack to obtain a laminated stack; and a laser station 12, the laser station 12 being configured to laser trim the stack to obtain a boundary 7 of the electrically insulating layer structure 2 having a regular shape. Preferably, the laser station 12 is also configured to drill holes 9 in the stack so that the present application can be easily implemented in existing manufacturing systems 10.

Fig. 7 shows a schematic view of a manufacturing system 10 for manufacturing a component carrier 1 according to another embodiment. In this embodiment the manufacturing system 10 comprises a first laser station 12.1 for drilling the hole 9 and a second laser station 12.2 for trimming the boundary 7 of the electrically insulating layer structure 2.

The manufacturing system 10 may also comprise further manufacturing stations for manufacturing the component carrier 1, such as a surface preparation station 13(SP station 13), a second surface preparation station 14(SSP station 14), a resin curing station 15(RC station 15) and a further processing station 16 which may be formed by a blower.

In the embodiment of fig. 7, the lamination station 11 is a laminate film lamination station 11(BFL station 11).

It should also be noted that reference signs in the claims shall not be construed as limiting the scope of the claims.

The implementation of the present application is not limited to the preferred embodiments shown in the drawings and described above. On the contrary, the illustrated solution and many variants according to the principles of the present application can be used even in the case of fundamentally different embodiments.

Claims (14)

1. A component carrier (1) comprising:

a laminated stack comprising at least one electrically insulating layer structure (2) and at least one electrically conductive layer structure (3);

the component carrier (1) is characterized in that, in a plan view of the component carrier (1),

the at least one electrically conductive layer structure (3) has a rectilinear boundary;

the at least one electrically insulating layer structure (2) protrudes from the boundary of the at least one electrically conductive layer structure (3) such that the boundary of the at least one electrically insulating layer structure (2) extends beyond the boundary of the at least one electrically conductive layer structure (3); and

the boundary of the at least one electrically insulating layer structure (2) has a regular shape.

2. The component carrier (1) according to claim 1,

the regular shape of the boundary of the at least one electrically insulating layer structure (2) is a straight line.

3. The component carrier (1) according to claim 2,

the boundary of the at least one electrically insulating layer structure (2) extends parallel to the boundary of the at least one electrically conductive layer structure (3).

4. The component carrier (1) according to claim 2 or 3,

-the straightness of said border of said at least one electrically insulating layer structure (2) is less than 0.3 mm.

5. The component carrier (1) according to claim 2 or 3,

the straightness of the boundary of the at least one electrically insulating layer structure (2) is less than 0.1 mm.

6. The component carrier (1) according to claim 1,

the regular shape of the boundary of the at least one electrically insulating layer structure (2) is wave-shaped.

7. The component carrier (1) according to claim 1 or 2,

the boundary of the at least one electrically insulating layer structure (2) protrudes more than 0.5mm from the boundary of the at least one electrically conductive layer structure (3).

8. The component carrier (1) according to claim 1 or 2,

the raw material of the at least one electrically insulating layer structure (2) is a laminable material, or the raw material of the at least one electrically insulating layer structure (2) comprises a laminable material, and the actual material of the at least one electrically insulating layer structure (2) of the component carrier (1) is in a laminated state.

9. The component carrier (1) according to claim 8,

the at least one electrically insulating layer structure (2) comprises an epoxy-based build-up material, a prepreg, a solder resist, a photosensitive film or a flux.

10. The component carrier (1) according to claim 1 or 2,

the at least one electrically insulating layer structure (2) is sandwiched between the at least one electrically conductive layer structure (3) and a further electrically conductive layer structure (8).

11. The component carrier (1) according to claim 1 or 2,

in a cross-section of the component carrier (1), the at least one electrically insulating layer structure (2) has straight side edges (21).

12. The component carrier (1) according to claim 1 or 2,

a component (5) is embedded in the stack or a component (5) is surface mounted on the stack.

13. A manufacturing system (10) for manufacturing a component carrier (1) according to claim 1 or 2, the manufacturing system (10) being characterized in that the manufacturing system (10) comprises:

a laminating station (11), the laminating station (11) being configured to laminate a stack to obtain a laminated stack; and

a laser station (12), the laser station (12) being configured to laser trim the stack to obtain a boundary of the at least one electrically insulating layer structure (2) having a regular shape.

14. The manufacturing system (10) of claim 13,

the laser station (12) is configured to drill holes (9) in the stack.

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