CN116381447A - Automatic chip testing machine - Google Patents
Automatic chip testing machine Download PDFInfo
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- CN116381447A CN116381447A CN202211674329.7A CN202211674329A CN116381447A CN 116381447 A CN116381447 A CN 116381447A CN 202211674329 A CN202211674329 A CN 202211674329A CN 116381447 A CN116381447 A CN 116381447A
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- 238000012360 testing method Methods 0.000 title claims abstract description 283
- 238000007599 discharging Methods 0.000 claims abstract description 72
- 230000007246 mechanism Effects 0.000 claims abstract description 69
- 238000010438 heat treatment Methods 0.000 claims abstract description 41
- 238000012546 transfer Methods 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims description 50
- 238000000429 assembly Methods 0.000 claims description 32
- 230000000712 assembly Effects 0.000 claims description 32
- 230000033001 locomotion Effects 0.000 claims description 21
- 230000005540 biological transmission Effects 0.000 claims description 18
- 238000003825 pressing Methods 0.000 claims description 8
- 230000001360 synchronised effect Effects 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 5
- 239000000523 sample Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 2
- 210000000078 claw Anatomy 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000010408 sweeping Methods 0.000 description 5
- 230000005012 migration Effects 0.000 description 4
- 238000013508 migration Methods 0.000 description 4
- 230000001012 protector Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
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- 238000004519 manufacturing process Methods 0.000 description 2
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- 230000004048 modification Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000005570 vertical transmission Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000011990 functional testing Methods 0.000 description 1
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- 230000003014 reinforcing effect Effects 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/914—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems incorporating rotary and rectilinear movements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K7/10544—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation by scanning of the records by radiation in the optical part of the electromagnetic spectrum
- G06K7/10821—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation by scanning of the records by radiation in the optical part of the electromagnetic spectrum further details of bar or optical code scanning devices
- G06K7/10861—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation by scanning of the records by radiation in the optical part of the electromagnetic spectrum further details of bar or optical code scanning devices sensing of data fields affixed to objects or articles, e.g. coded labels
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- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
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- Theoretical Computer Science (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Mechanical Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The invention discloses an automatic chip testing machine, which comprises: the test machine is provided with a plurality of test mechanisms in an array manner, and the test mechanisms comprise a test tool, a test heating assembly and a test moving assembly; the feeding and discharging mechanism is arranged at the side edge of the test machine and used for placing a tray for testing chips; the code scanning rotating mechanism comprises a code scanning assembly and a rotating assembly; the chip transfer mechanism is arranged above each mechanism and used for taking and placing the test chips among the mechanisms. The invention improves the overall stability, not only has accurate positioning, but also can greatly improve the testing efficiency, and supports the advantages of feeding, discharging and testing of a plurality of groups of chips at the same time.
Description
Technical Field
The invention relates to the technical field of test equipment, in particular to an automatic chip tester.
Background
The functional test item refers to the process of simulating various factors involved in the actual use condition of the product to perform corresponding condition reinforcing experiments on the condition of the product generating performance.
In general, electronic devices, whether original, parts, components, complete machines, etc., need to be tested. The testing is completed by manufacturers or first-class electronic appliance detection technology companies, and problems of products are found through testing and are timely modified, so that the problems of the products reaching the hands of consumers are reduced as much as possible or the reliability of the products is improved.
The traditional chip test is mainly to put a single chip into test equipment for testing by manpower, observe the test chip by human eyes and correspondingly record test results, classify the test chip, swing a tray and the like by manpower after the test is finished, and the production efficiency is low, so that the requirement of large-scale efficient production cannot be met.
The test equipment in the prior art has the following defects: (1) The suction nozzle on the manipulator controls the suction nozzle to do lifting movement through the suction nozzle cylinder on the manipulator, so that the suction stability is poor; (2) The chips in the tray are required to be scanned manually one by one, the read information is used as a basis for distributing materials, the process consumes time, the testing efficiency is reduced, the chips are transferred to a code scanning station, the chips with different specifications have two-dimensional codes or bar codes with different sizes and positions, the direction of the chips on the tray is also possibly different from the testing direction and the code scanning direction, and a code scanning machine on the code scanning station is easy to cause reading failure; (3) The moving module of the manipulator is driven by a screw rod, a synchronous belt and a gear rack, and has complex structure and low positioning precision; (4) When the test module is used for carrying out a downward-pressing test on the chip, the synchronicity of lifting cylinders on the left side and the right side is poor, and the lower pressure head and the chip are in hard touch during the test, so that the chip is easy to shift or damage.
Disclosure of Invention
Aiming at the defects existing in the prior art, the invention aims to provide the automatic chip testing machine, which has the advantages of improving the overall stability, not only being accurate in positioning, but also being capable of greatly improving the testing efficiency and supporting the simultaneous feeding, discharging and testing of a plurality of groups of chips.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows: an automatic chip tester, comprising:
the test machine comprises a test machine table, wherein a plurality of test mechanisms are arranged on the test machine table in an array manner, each test mechanism comprises a test tool, a test heating assembly and a test moving assembly, the test tool is used for loading test chips, the test heating assembly is arranged above the test tool, and the test moving assembly drives the test heating assembly to press and heat the test chips on the test tool;
the feeding and discharging mechanism is arranged at the side edge of the test machine and used for placing a tray for testing chips;
the code scanning rotating mechanism comprises a code scanning component and a rotating component, wherein the code scanning component is used for scanning codes of the test chip, and the rotating component is used for adjusting the direction of the test chip;
the chip transfer mechanism is arranged above each mechanism and used for taking and placing the test chips among the mechanisms;
the chip transfer mechanism takes materials from the upper and lower feeding mechanisms and places the materials into the rotating assembly, the code scanning assembly scans the test chips, the code scanning is finished, the chip transfer mechanism takes out the test chips from the rotating assembly and places the test chips into the testing mechanism for testing, and the chip transfer mechanism takes out the test chips from the testing tool and places the test chips into the upper and lower feeding mechanisms for blanking and distributing.
As a preferred scheme, the test fixture comprises a test bottom plate and a test plate, wherein the test plate is arranged on the test bottom plate, a plurality of test grooves for placing test chips are formed in the test plate, and test probes are arranged in the bottoms of the test grooves.
As a preferred scheme, test heating element includes from top to bottom heating mounting panel, heat insulating board, the hot plate body that sets gradually, is provided with the heating rod in the hot plate body, the bottom of the hot plate body is connected with the floating briquetting through the floating spring, the floating briquetting is located the top position of test tank.
As a preferred scheme, test moving assembly includes test mounting bracket, test lift cylinder, test horizontal cylinder sets up on the test mounting bracket, the push rod of test horizontal cylinder is connected with the horizontal migration board, be provided with test horizontal slide rail on the test mounting bracket, the horizontal migration board passes through test horizontal slider and sets up on the test horizontal slide rail, test lift cylinder sets up on the horizontal migration board, the push rod of test lift cylinder is connected with the lift transmission arm, the lift track hole has been seted up on the lift transmission arm, the lift transmission arm is connected with the lift movable board, be provided with the lift guide post on the lift movable board, the lift guide post sets up in the lift track hole, be provided with the test lift slide rail on the horizontal migration board, the lift movable board passes through test lift slider and sets up on the test lift slide rail, the heating mounting panel sets up on the lift movable board.
As a preferred scheme, go up unloading mechanism and include at least one and go up unloading subassembly, go up unloading subassembly and include last unloading material frame, go up unloading lead screw, go up unloading nut, go up unloading motor and set up in the below position of last unloading material frame, go up unloading motor and go up unloading nut transmission through last unloading belt and be connected, go up in the unloading nut is located to the unloading lead screw cover, and go up the upper portion of unloading lead screw from the bottom of last unloading material frame run through and set up in last unloading material frame.
As a preferable scheme, the feeding and discharging assembly is provided with a material moving disc assembly, the material moving disc assembly comprises a synchronous belt linear module, a material moving lifting cylinder and a material moving clamping jaw, the synchronous belt linear module drives the material moving clamping jaw to move between at least two feeding and discharging assemblies, the material moving lifting cylinder drives the material moving clamping jaw to do lifting motion on the feeding and discharging assemblies, and the material moving clamping jaw is used for clamping the material taking disc at the feeding and discharging assemblies.
As a preferred scheme, sweep the code component and include sweep a yard horizontal slip table, sweep a yard mount pad, sweep a yard ware, sweep a yard mount pad and set up on sweeping a yard horizontal slip table, sweep a yard ware and set up on sweeping a yard mount pad through sweeping a yard regulating spindle.
As a preferable scheme, the rotating assembly comprises a rotating driving assembly and a rotating clamping jaw, the rotating driving assembly drives the rotating clamping jaw to do rotary motion, a rotating sensor is arranged at the position of the rotating clamping jaw, and the code scanner scans the test chip on the rotating clamping jaw.
As a preferable scheme, the chip transfer mechanism comprises at least two groups of feeding and discharging suction nozzle assemblies, a suction nozzle interval adjusting assembly and a feeding and discharging movement assembly, wherein the feeding and discharging suction nozzle assemblies are arranged on the suction nozzle interval adjusting assembly, the suction nozzle interval adjusting assembly is arranged on the feeding and discharging movement assembly, and the feeding and discharging movement assembly drives the feeding and discharging suction nozzle assemblies to move in the X direction, the Y direction and the Z direction; the feeding and discharging suction nozzle assembly comprises a suction nozzle mounting part, a suction nozzle lifting sliding table and a suction nozzle, wherein the suction nozzle mounting part is arranged on the suction nozzle interval adjusting assembly, the suction nozzle lifting sliding table is arranged on the suction nozzle mounting part and is provided with a suction nozzle sleeve, a suction nozzle loop bar is arranged in the suction nozzle sleeve through a limiting shaft, a buffer spring is sleeved outside the suction nozzle loop bar and is positioned between the suction nozzle loop bar and the suction nozzle sleeve, and the suction nozzle loop bar is connected with the suction nozzle along the outer extension of the suction nozzle sleeve.
As a preferred scheme, go up unloading motion subassembly and include X to linear electric motor module, first Y to linear electric motor module, second Y to linear electric motor module, Z to linear electric motor module, X sets up on first Y to linear electric motor module's one end, X sets up on second Y to linear electric motor module's the other end, Z sets up on X to linear electric motor module, suction nozzle interval adjustment assembly sets up on Z to linear electric motor module.
Compared with the prior art, the invention has the beneficial effects that:
(1) The automatic test replaces manual labor, so that the positioning is accurate, the test efficiency can be greatly improved, and the advantages of feeding, discharging and testing of multiple groups of chips at the same time are supported;
(2) The feeding and discharging suction nozzle assembly realizes the increase or reduction adjustment of the spacing in the horizontal direction, has strong adaptability, realizes the simultaneous feeding or discharging of a plurality of chips, greatly improves the feeding and discharging efficiency, is provided with an independent suction nozzle lifting sliding table, can independently feed or discharge the test chips, has good adsorption stability, and is provided with a buffer spring to reduce the damage to the test chips;
(3) The code scanning component is used for simultaneously scanning codes on a plurality of test chips, and the test direction and the code scanning direction of the test chips are adjusted through the rotating module, so that the time consumption is short, and the efficiency is high;
(4) The chip transfer mechanism forms a gantry structure in the X direction, the Y direction and the Z direction, the X direction, the Y direction and the Z direction all adopt linear motor driving modes, wherein the Y axis adopts a double driving mode, and the repeated positioning precision is high;
(5) When the test mechanism performs a downward-pressing test on the test chip, the synchronism is good, and the floating pressure head is in soft touch with the test chip under the action of the floating spring during the test, so that the test chip is prevented from being shifted or damaged.
Drawings
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a top view of the present invention;
FIG. 3 is a schematic diagram of the structure of the testing mechanism of the present invention;
FIG. 4 is a schematic diagram of the internal structure of the test mechanism according to the present invention;
FIG. 5 is a schematic view of the structure of the test heating assembly of the present invention;
FIG. 6 is a schematic diagram of the structure of the feeding and discharging assembly in the present invention;
FIG. 7 is a schematic diagram of a code scanning rotation mechanism according to the present invention;
FIG. 8 is a schematic diagram of a chip transfer mechanism according to the present invention;
FIG. 9 is an enlarged view of FIG. 8 at A in accordance with the present invention;
FIG. 10 is a schematic diagram of a first embodiment of the present invention of an upper and lower suction nozzle assembly and a suction nozzle spacing adjustment assembly;
FIG. 11 is a schematic diagram II of the structure of the feeding and discharging nozzle assembly and the nozzle spacing adjusting assembly;
FIG. 12 is a schematic view of the structure of the tray assembly of the present invention;
wherein the accompanying figures identify a list: test bench 1, test mechanism 2, test fixture 3, test heating assembly 4, test moving assembly 5, loading and unloading mechanism 6, tray 7, code sweeping rotary mechanism 8, code sweeping assembly 9, rotary assembly 10, chip transfer mechanism 11, test base plate 12, test plate 13, test slot 14, heating sensor 15, heating mounting plate 16, heat insulating plate 17, heating plate body 18, heating rod 19, floating spring 20, floating press block 21, temperature sensor 22, overload protector 23, test mounting frame 24, test lifting cylinder 25, test horizontal cylinder 26, horizontal moving plate 27, test horizontal slide rail 28, test horizontal slide block 29, lifting transmission arm 30, lifting track hole 31, lifting moving plate 32, lifting guide column, test lifting slide rail 34, test lifting slide block 35, vertical transmission piece 36, transmission arm 37, lifting arm 38, lifting horizontal slide rail 39, lifting horizontal slide block 40 lifting fixture 41, loading and unloading assembly 42, loading and unloading frame 43, loading and unloading screw rod 44, loading and unloading nut 45, loading and unloading motor 46, loading and unloading belt 47, loading and unloading assembly 48, unloading and loading and unloading assembly 49, split loading and unloading assembly 50, moving tray assembly 51, synchronous belt linear module 52, moving lifting cylinder 53, moving clamping claw 54, moving plate 55, moving cylinder 56, moving claw 57, scanning horizontal sliding table 58, scanning mounting seat 59, scanning device 60, scanning adjusting shaft 61, rotation driving assembly 62, rotation clamping jaw 63, rotation sensor 64, rotation driving motor 65, rotation driving main wheel 66, rotation driving guide wheel 67, rotation driving wheel 68, rotation driving belt 69, loading and unloading suction nozzle assembly 70, suction nozzle spacing adjusting assembly 71, loading and unloading moving assembly 72, suction nozzle mounting member 73, scanning horizontal sliding table 58, scanning device and method, the suction nozzle lifting sliding table 74, the suction nozzle 75, the suction nozzle sleeve 76, the limiting shaft 77, the suction nozzle loop bar 78, the adjusting fixing plate 79, the adjusting guide plate 80, the adjusting driving assembly 81, the transmission connecting piece 82, the horizontal linear guide rail 83, the vertical linear guide rail 84, the adjusting guide groove 85, the X-direction linear motor module 86, the first Y-direction linear motor module 87, the second Y-direction linear motor module 88 and the Z-direction linear motor module 89.
Detailed Description
The invention is further described below in connection with specific embodiments. The following examples are only for more clearly illustrating the technical aspects of the present invention, and are not intended to limit the scope of the present invention.
Examples:
as shown in fig. 1 to 12, an automatic chip tester includes:
the test equipment comprises a test equipment 1, wherein a plurality of test mechanisms 2 are arranged on the test equipment 1 in an array manner, each test mechanism 2 comprises a test tool 3, a test heating assembly 4 and a test moving assembly 5, the test tools 3 are used for loading test chips, the test heating assemblies 4 are arranged above the test tools 3, and the test moving assemblies 5 drive the test heating assemblies 4 to press and heat the test chips on the test tools 3;
the feeding and discharging mechanism 6 is arranged at the side edge of the test machine table 1 and is used for placing a tray 7 for testing chips;
the code scanning rotating mechanism 8 comprises a code scanning assembly 9 and a rotating assembly 10, wherein the code scanning assembly 9 is used for scanning codes of the test chips, and the rotating assembly 10 is used for adjusting the directions of the test chips;
the chip transfer mechanism 11 is arranged above each mechanism and used for taking and placing the test chips among the mechanisms;
the chip transfer mechanism 11 takes materials from the feeding and discharging mechanism 6 and places the materials into the rotating assembly 10, the code scanning assembly 9 scans the test chips, the code scanning is finished, the chip transfer mechanism 11 takes the test chips out of the rotating assembly 10 and places the test chips into the testing mechanism 2 for testing, and the chip transfer mechanism 11 takes the test chips out of the testing tool 3 and places the test chips into the feeding and discharging mechanism 6 for discharging and distributing.
As shown in fig. 3 to 5, preferably, the test fixture 3 includes a test base plate 12 and a test board 13, the test board 13 is disposed on the test base plate 12, a plurality of test slots 14 for placing test chips are formed in the test board 13, and test probes (not shown because they are installed in the component) are disposed in the bottom of the test slots 14.
Specifically, the test fixture 3 is further provided with a heating sensor 15 for sensing the position of the test chip in the test slot 14.
More preferably, the test heating assembly 4 comprises a heating installation plate 16, a heat insulation plate 17 and a heating plate body 18 which are sequentially arranged from top to bottom, a heating rod 19 is arranged in the heating plate body 18, the bottom of the heating plate body 18 is connected with a floating pressing block 21 through a floating spring 20, and the floating pressing block 21 is positioned above the test groove 14.
Specifically, a temperature sensor 22 is further disposed in the heating plate body 18, an overload protector 23 is disposed outside the heating plate body 18, and the temperature sensor 22, the overload protector 23 and the heating rod 19 are electrically connected.
More specifically, in this embodiment, the heating rod 19 can be heated to 150 ℃ at the highest, and when the temperature reaches the temperature set by the temperature sensor 22, the overload protector 23 automatically stops the heating rod 19 from heating.
More preferably, the test moving assembly 5 comprises a test mounting frame 24, a test lifting cylinder 25 and a test horizontal cylinder 26, the test horizontal cylinder 26 is arranged on the test mounting frame 24, a push rod of the test horizontal cylinder 26 is connected with a horizontal moving plate 27, a test horizontal sliding rail 28 is arranged on the test mounting frame 24, the horizontal moving plate 27 is arranged on the test horizontal sliding rail 28 through a test horizontal sliding block 29, the test lifting cylinder 25 is arranged on the horizontal moving plate 27, a push rod of the test lifting cylinder 25 is connected with a lifting transmission arm 30, a lifting track hole 31 is formed in the lifting transmission arm 30, the lifting transmission arm 30 is connected with a lifting moving plate 32, a lifting guide column 33 is arranged on the lifting moving plate 32, the lifting guide column 33 is arranged in the lifting track hole 31, a test lifting sliding rail 34 is arranged on the horizontal moving plate 27, the lifting moving plate 32 is arranged on the test lifting sliding rail 34 through a test lifting sliding block 35, and the heating installation plate 16 is arranged on the lifting moving plate 32.
Specifically, the horizontal test cylinder 26 is located at the center of the test mounting frame 24, the horizontal moving plate 27 is parallel to the test mounting frame 24, the push rod of the horizontal test cylinder 26 reciprocates in the horizontal direction, and the push rod of the horizontal test cylinder 26 is connected to the center of the horizontal moving plate 27 through the vertical transmission member 36.
More specifically, the test lifting cylinder 25 is located at the center of the horizontal moving plate 27, the push rod of the test lifting cylinder 25 reciprocates in the horizontal direction, and the push rod of the test lifting cylinder 25 is disposed at the center of the lifting transmission arm 30.
More preferably, the lifting driving arm 30 includes a driving arm 37 and two lifting arms 38, the two lifting arms 38 are respectively disposed at two ends of the driving arm 37, the push rod of the test lifting cylinder 25 is disposed at the center of the driving arm 37, and the lifting track hole 31 is formed on the lifting arm 38.
Further, the movement direction of the test horizontal sliding block 29 on the test horizontal sliding rail 28 is the same as the movement direction of the horizontal moving plate 27, and the movement direction of the test lifting sliding block 35 on the test lifting sliding rail 34 is the same as the movement direction of the lifting moving plate 32.
Further, a lifting horizontal sliding rail 39 is disposed at the top of the lifting arm 38, a lifting horizontal sliding block 40 is slidably disposed on the lifting horizontal sliding rail 39, a lifting fixing member 41 is connected to the lifting horizontal sliding block 40, and the lifting fixing member 41 is disposed on the horizontal moving plate 27.
In implementation, a test chip is placed in the test slot 14, when the heating sensor 15 senses that the test chip is in the test slot 14, the test moving assembly 5 drives the floating pressing block 21 to move to the upper position of the test chip, and the test moving assembly 5 drives the floating pressing block 21 to move downwards to press the test chip into close contact with the test probe, so that the test chip is tested.
As shown in fig. 6, preferably, the loading and unloading mechanism 6 includes at least one loading and unloading assembly 42, the loading and unloading assembly 42 includes a loading and unloading frame 43, a loading and unloading screw rod 44, a loading and unloading nut 45, and a loading and unloading motor 46, the loading and unloading motor 46 is disposed at a lower position of the loading and unloading frame 43, the loading and unloading motor 46 is in transmission connection with the loading and unloading nut 45 through a loading and unloading belt 47, the loading and unloading screw rod 44 is sleeved in the loading and unloading nut 45, and an upper portion of the loading and unloading screw rod 44 is disposed in the loading and unloading frame 43 in a penetrating manner from a bottom of the loading and unloading frame 43.
Specifically, the feeding and discharging motor 46 drives the feeding and discharging nut 45 through the feeding and discharging belt 47, and further drives the feeding and discharging screw 44 to rotate, so as to drive the tray 7 in the feeding and discharging frame 43 to do lifting motion.
More specifically, in this embodiment, the loading and unloading assembly 42 has several groups, including a loading and unloading assembly 48 to be loaded, an unloading assembly 49 to be unloaded, a loading and unloading assembly 50 to be loaded, a tray 7 of the loading and unloading assembly 50 to be loaded and unloaded, a tray 7 of the unloading assembly 48 to be loaded and unloaded to be used for sorting chips after testing, and an unloading assembly 49 to be loaded and unloaded to be used for recycling empty trays 7.
As shown in fig. 12, preferably, a material moving tray assembly 51 is disposed at the position of the loading and unloading assembly 42, the material moving tray assembly 51 includes a synchronous belt linear module 52, a material moving lifting cylinder 53, and a material moving clamping claw 54, the synchronous belt linear module 52 drives the material moving clamping claw 54 to move between at least two loading and unloading assemblies 42, the material moving lifting cylinder 53 drives the material moving clamping claw 54 to perform lifting movement on the loading and unloading assemblies 42, and the material moving clamping claw 54 is used for clamping the material taking tray 7 at the position of the loading and unloading assemblies 42.
Specifically, the material moving gripper 54 includes a material moving plate 55, a material moving cylinder 56, and a material moving gripper 57, where the material moving cylinder 56 is fixedly disposed on the material moving plate 55, and the material moving gripper 57 is disposed on a push rod of the material moving cylinder 56.
Further, there are four material moving cylinders 56, and each two material moving claws 57 of the material moving cylinders 56 form a group of claw structures.
As shown in fig. 7, preferably, the code scanning component 9 includes a code scanning horizontal sliding table 58, a code scanning mounting seat 59, and a code scanning device 60, where the code scanning mounting seat 59 is disposed on the code scanning horizontal sliding table 58, and the code scanning device 60 is disposed on the code scanning mounting seat 59 through a code scanning adjusting shaft 61.
Specifically, in this embodiment, the code scanning adjustment shaft 61 is a manual rotation shaft.
Preferably, the rotating assembly 10 comprises a rotating driving assembly 62 and a rotating clamping jaw 63, the rotating driving assembly 62 drives the rotating clamping jaw 63 to perform rotating motion, a rotating sensor 64 is arranged at the position of the rotating clamping jaw 63, and the code scanner 60 scans the test chip on the rotating clamping jaw 63.
Specifically, the rotary driving assembly 62 includes a rotary driving motor 65, a rotary driving main wheel 66, a rotary driving guiding wheel 67, and a rotary driving wheel 68, the rotary driving motor 65 is connected to the rotary driving main wheel 66, the rotary driving guiding wheel 67, and the rotary driving wheel 68 are connected through a rotary transmission belt 69, and the rotary clamping jaw 63 is disposed on the rotary driving wheel 68.
More specifically, when the rotating assembly 10 is provided, when the direction of the test chip on the tray 7 is inconsistent with the placement direction on the test tool 3, the direction adjustment can be performed through the rotating assembly 10, or when the barcode scanner 60 on the barcode scanning assembly 9 cannot scan the barcode or the two-dimensional code on the test chip, the direction adjustment can be performed through the rotating assembly 10.
As shown in fig. 8 to 11, the chip transferring mechanism 11 preferably includes at least two groups of loading and unloading nozzle assemblies 70, a nozzle pitch adjusting assembly 71, and loading and unloading moving assemblies 72, the loading and unloading nozzle assemblies 70 are disposed on the nozzle pitch adjusting assembly 71, the nozzle pitch adjusting assembly 71 is disposed on the loading and unloading moving assembly 72, and the loading and unloading nozzle assemblies 70 are driven to move in the X direction, the Y direction, and the Z direction by the loading and unloading moving assembly 72; the feeding and discharging suction nozzle assembly 70 comprises a suction nozzle mounting piece 73, a suction nozzle lifting sliding table 74 and a suction nozzle 75, wherein the suction nozzle mounting piece 73 is arranged on the suction nozzle interval adjusting assembly 71, the suction nozzle lifting sliding table 74 is arranged on the suction nozzle mounting piece 73, a suction nozzle sleeve 76 is arranged on the suction nozzle lifting sliding table 74, a suction nozzle sleeve rod 78 is arranged in the suction nozzle sleeve 76 through a limiting shaft 77, a buffer spring (not shown in the figure) is sleeved outside the suction nozzle sleeve rod 78, the buffer spring is positioned between the suction nozzle sleeve rod 78 and the suction nozzle sleeve rod 76, and the suction nozzle sleeve rod 78 extends outwards along the suction nozzle sleeve rod 76 to be connected with the suction nozzle 75.
Specifically, the feeding and discharging suction nozzle assemblies 70 are provided with a plurality of groups, and the feeding and discharging suction nozzle assemblies 70 of the groups can move at equal intervals in the horizontal direction, so that according to the interval adjustment between the test chips, as the suction nozzle lifting sliding table 74 is independently arranged on each group of feeding and discharging suction nozzle assemblies 70, the suction nozzles 75 on each group of feeding and discharging suction nozzle assemblies 70 are driven to independently lift, the invention adopts the suction nozzle lifting sliding table 74, the test chips are more stable to be adsorbed, and when the suction nozzles 75 touch the test chips to adsorb, the buffer springs play a role of buffering, so that the damage to the test chips is reduced.
More specifically, the nozzle spacing adjustment assembly 71 includes an adjustment fixing plate 79, an adjustment guide plate 80, an adjustment driving assembly 81, and a transmission connection member 82, wherein a horizontal through hole (not shown in the figure) is formed in the adjustment fixing plate 79 in a penetrating manner, a horizontal linear guide 83 is fixedly disposed on one side of the adjustment fixing plate 79, and a vertical linear guide 84 is disposed on the other side of the adjustment fixing plate 79; the suction nozzle mounting member 73 is slidably disposed on the horizontal linear guide 83; the adjusting guide plate 80 is slidably arranged on the vertical linear guide rail 84; the adjusting guide plate 80 is provided with a plurality of fan-shaped dispersed adjusting guide grooves 85, one end of the transmission connecting piece 82 is fixedly connected with the suction nozzle mounting piece 73, and the other end of the transmission connecting piece 82 extends through the horizontal through hole and is arranged in the adjusting guide grooves 85; the adjusting driving assembly 81 drives the adjusting guide plate 80 to move on the vertical linear guide rail 84, and then drives the feeding and discharging suction nozzle assembly 70 to move on the horizontal linear guide rail 83 through the transmission connecting piece 82.
Further, the adjusting driving component 81 is a servo motor screw rod structure, and will not be described in detail here.
Preferably, the feeding and discharging motion assembly 72 includes an X-direction linear motor module 86, a first Y-direction linear motor module 87, a second Y-direction linear motor module 88, and a Z-direction linear motor module 89, one end of the X-direction linear motor module 86 is disposed on the first Y-direction linear motor module 87, the other end of the X-direction linear motor module 86 is disposed on the second Y-direction linear motor module 88, the Z-direction linear motor module 89 is disposed on the X-direction linear motor module 86, and the nozzle interval adjusting assembly 71 is disposed on the Z-direction linear motor module 89.
Specifically, the X-direction linear motor module 86, the first Y-direction linear motor module 87, the second Y-direction linear motor module 88, and the Z-direction linear motor module 89 form a gantry structure in the X-direction, the Y-direction, and the Z-direction, and the X-direction, the Y-direction, and the Z-direction all adopt linear motor driving modes, wherein the Y-axis adopts a double driving mode, and the repeated positioning accuracy is high.
In specific implementation, firstly, the chip transferring mechanism 11 performs material taking from the tray 7 of the feeding and discharging assembly 48 to be fed, the code scanning assembly 9 is arranged on the rotary assembly 10 to scan codes, the chip transferring mechanism 11 performs test from the rotary assembly 10 to take test chips and place the test mechanism 2, after the test is finished, the chip transferring mechanism 11 retrieves the test chips in the test mechanism 2 to place the feeding and discharging mechanism 6, the test chips after the test is finished are sorted and placed into the tray 7 of the feeding and discharging assembly 50 according to the test result of the test mechanism 2, the above actions are repeated, and when the test chips on the tray 7 of the feeding and discharging assembly 48 to be fed are taken, the empty tray 7 is clamped by the tray transferring assembly 51 to be retrieved to the empty feeding and discharging assembly 49.
The foregoing is merely a preferred embodiment of the present invention, and it should be noted that modifications and variations could be made by those skilled in the art without departing from the technical principles of the present invention, and such modifications and variations should also be regarded as being within the scope of the invention.
Claims (10)
1. An automatic chip tester, comprising:
the test machine comprises a test machine table, wherein a plurality of test mechanisms are arranged on the test machine table in an array manner, each test mechanism comprises a test tool, a test heating assembly and a test moving assembly, the test tool is used for loading test chips, the test heating assembly is arranged above the test tool, and the test moving assembly drives the test heating assembly to press and heat the test chips on the test tool;
the feeding and discharging mechanism is arranged at the side edge of the test machine and used for placing a tray for testing chips;
the code scanning rotating mechanism comprises a code scanning component and a rotating component, wherein the code scanning component is used for scanning codes of the test chip, and the rotating component is used for adjusting the direction of the test chip;
the chip transfer mechanism is arranged above each mechanism and used for taking and placing the test chips among the mechanisms;
the chip transfer mechanism takes materials from the upper and lower feeding mechanisms and places the materials into the rotating assembly, the code scanning assembly scans the test chips, the code scanning is finished, the chip transfer mechanism takes out the test chips from the rotating assembly and places the test chips into the testing mechanism for testing, and the chip transfer mechanism takes out the test chips from the testing tool and places the test chips into the upper and lower feeding mechanisms for blanking and distributing.
2. The automatic chip tester according to claim 1, wherein: the test fixture comprises a test bottom plate and a test plate, wherein the test plate is arranged on the test bottom plate, a plurality of test grooves for placing test chips are formed in the test plate, and test probes are arranged in the bottoms of the test grooves.
3. The automatic chip tester according to claim 2, wherein: the test heating assembly comprises a heating mounting plate, a heat insulation plate and a heating plate body which are sequentially arranged from top to bottom, a heating rod is arranged in the heating plate body, the bottom of the heating plate body is connected with a floating pressing block through a floating spring, and the floating pressing block is located at the upper position of the test groove.
4. A chip automatic tester according to claim 3, wherein: the test moving assembly comprises a test mounting frame, a test lifting cylinder and a test horizontal cylinder, wherein the test horizontal cylinder is arranged on the test mounting frame, a push rod of the test horizontal cylinder is connected with a horizontal moving plate, a test horizontal sliding rail is arranged on the test mounting frame, the horizontal moving plate is arranged on the test horizontal sliding rail through a test horizontal sliding block, the test lifting cylinder is arranged on the horizontal moving plate, a push rod of the test lifting cylinder is connected with a lifting driving arm, a lifting track hole is formed in the lifting driving arm, the lifting driving arm is connected with a lifting moving plate, a lifting guide column is arranged on the lifting moving plate, the lifting guide column is arranged in the lifting track hole, a test lifting sliding rail is arranged on the horizontal moving plate, and the lifting moving plate is arranged on the test lifting sliding rail through a test lifting sliding block.
5. The automatic chip tester according to claim 1, wherein: the feeding and discharging mechanism comprises at least one feeding and discharging assembly, the feeding and discharging assembly comprises a feeding and discharging frame, a feeding and discharging screw rod, a feeding and discharging nut and a feeding and discharging motor, the feeding and discharging motor is arranged below the feeding and discharging frame, the feeding and discharging motor is in transmission connection with the feeding and discharging nut through a feeding and discharging belt, the feeding and discharging screw rod is sleeved in the feeding and discharging nut, and the upper part of the feeding and discharging screw rod is penetrated in the feeding and discharging frame from the bottom of the feeding and discharging frame.
6. The automatic chip tester according to claim 5, wherein: the feeding and discharging assembly is provided with a material moving disc assembly, the material moving disc assembly comprises a synchronous belt linear module, a material moving lifting cylinder and a material moving clamping jaw, the synchronous belt linear module drives the material moving clamping jaw to move between at least two feeding and discharging assemblies, the material moving lifting cylinder drives the material moving clamping jaw to do lifting motion on the feeding and discharging assemblies, and the material moving clamping jaw is used for clamping the material taking disc at the feeding and discharging assemblies.
7. The automatic chip tester according to claim 1, wherein: the code scanning component comprises a code scanning horizontal sliding table, a code scanning installation seat and a code scanning device, wherein the code scanning installation seat is arranged on the code scanning horizontal sliding table, and the code scanning device is arranged on the code scanning installation seat through a code scanning adjusting shaft.
8. The automatic chip tester according to claim 7, wherein: the rotary assembly comprises a rotary driving assembly and a rotary clamping jaw, the rotary driving assembly drives the rotary clamping jaw to do rotary motion, a rotary sensor is arranged at the rotary clamping jaw, and the code scanner scans a test chip on the rotary clamping jaw.
9. The automatic chip tester according to claim 1, wherein: the chip transfer mechanism comprises at least two groups of feeding and discharging suction nozzle assemblies, suction nozzle interval adjusting assemblies and feeding and discharging motion assemblies, wherein the feeding and discharging suction nozzle assemblies are arranged on the suction nozzle interval adjusting assemblies, the suction nozzle interval adjusting assemblies are arranged on the feeding and discharging motion assemblies, and the feeding and discharging motion assemblies drive the feeding and discharging suction nozzle assemblies to move in X directions, Y directions and Z directions; the feeding and discharging suction nozzle assembly comprises a suction nozzle mounting part, a suction nozzle lifting sliding table and a suction nozzle, wherein the suction nozzle mounting part is arranged on the suction nozzle interval adjusting assembly, the suction nozzle lifting sliding table is arranged on the suction nozzle mounting part and is provided with a suction nozzle sleeve, a suction nozzle loop bar is arranged in the suction nozzle sleeve through a limiting shaft, a buffer spring is sleeved outside the suction nozzle loop bar and is positioned between the suction nozzle loop bar and the suction nozzle sleeve, and the suction nozzle loop bar is connected with the suction nozzle along the outer extension of the suction nozzle sleeve.
10. The automatic chip tester according to claim 9, wherein: the feeding and discharging motion assembly comprises an X-direction linear motor module, a first Y-direction linear motor module, a second Y-direction linear motor module and a Z-direction linear motor module, one end of the X-direction linear motor module is arranged on the first Y-direction linear motor module, the other end of the X-direction linear motor module is arranged on the second Y-direction linear motor module, the Z-direction linear motor module is arranged on the X-direction linear motor module, and the suction nozzle interval adjusting assembly is arranged on the Z-direction linear motor module.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211674329.7A CN116381447B (en) | 2022-12-26 | 2022-12-26 | Automatic chip testing machine |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211674329.7A CN116381447B (en) | 2022-12-26 | 2022-12-26 | Automatic chip testing machine |
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| CN116381447A true CN116381447A (en) | 2023-07-04 |
| CN116381447B CN116381447B (en) | 2024-06-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211674329.7A Active CN116381447B (en) | 2022-12-26 | 2022-12-26 | Automatic chip testing machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117538735A (en) * | 2024-01-09 | 2024-02-09 | 无锡昌鼎电子有限公司 | Linear high-temperature high-pressure testing machine |
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| WO2019242345A1 (en) * | 2018-06-21 | 2019-12-26 | 东莞市冠佳电子设备有限公司 | Automatic feeding apparatus for power adapter testing |
| CN215263804U (en) * | 2021-07-09 | 2021-12-21 | 苏州乾鸣半导体设备有限公司 | Chip array test equipment |
| CN215248106U (en) * | 2021-07-09 | 2021-12-21 | 苏州乾鸣半导体设备有限公司 | Automatic chip testing equipment |
| CN215997609U (en) * | 2021-08-24 | 2022-03-11 | 苏州乾鸣半导体设备有限公司 | High-efficiency chip testing equipment |
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| CN117538735A (en) * | 2024-01-09 | 2024-02-09 | 无锡昌鼎电子有限公司 | Linear high-temperature high-pressure testing machine |
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| CN116381447B (en) | 2024-06-14 |
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