CN112444734A

CN112444734A - Chip testing machine and chip testing method

Info

Publication number: CN112444734A
Application number: CN202011356354.1A
Authority: CN
Inventors: 殷岚勇; 徐亮
Original assignee: Twinsolution Technology (suzhou) Ltd
Current assignee: Twinsolution Technology (suzhou) Ltd
Priority date: 2020-11-26
Filing date: 2020-11-26
Publication date: 2021-03-05

Abstract

The invention discloses a chip testing machine and a chip testing method, wherein the chip testing machine comprises a rack, and a transfer device, a testing device, an automatic feeding device, an automatic discharging device and a defective product placing table which are arranged on the rack, wherein the automatic feeding device comprises a first storage bin and an automatic feeding mechanism, and the automatic feeding mechanism moves up and down in the first storage bin; the automatic blanking mechanism comprises a second bin and an automatic blanking mechanism, the automatic blanking mechanism moves up and down in the second bin, the transfer device is located above the automatic feeding device, the automatic blanking device, the testing device and the defective product placing table, the transfer device moves the chips to be tested of the automatic feeding device to the testing device, and the chips which are tested are moved to the automatic blanking device or the defective product placing table. The chip tester has compact structure and small volume, occupies only one meter of area, and can meet the requirement of chip testing in small batch.

Description

Chip testing machine and chip testing method

Technical Field

The invention relates to the field of semiconductor test equipment, in particular to a chip tester and a chip test method.

Background

In a conventional chip test, a tester generally performs the test for a chip manufacturer. With the advent of more and more chip companies, the demand for chip testing is increasing. For a mature large-scale chip factory, due to the large chip yield, it will often take a certain advantage in the production plan of the tester. For a small lot of chips in a small-scale chip factory, the chips are often not optimally processed in a test plan of a test factory, which results in a longer chip test period.

The test equipment of the current chip test factory is mostly large-scale equipment, and can meet the requirement of large-batch chip test. If the large-scale test equipment is used for testing a small batch of chips, the resource waste is caused. And the existing large-scale test equipment is often tested by a plurality of test units in parallel so as to achieve the purpose of improving the test efficiency, thereby leading to larger volume, more occupied space and incapability of moving flexibly.

Disclosure of Invention

The invention aims to provide a chip testing machine and a chip testing method.

The technical scheme is as follows:

the invention discloses a chip tester in an embodiment.

The chip testing machine comprises a rack, and a transfer device, a testing device, an automatic feeding device, an automatic discharging device and a defective product placing table which are arranged on the rack, wherein the automatic feeding device comprises a first storage bin and an automatic feeding mechanism, and the automatic feeding mechanism moves up and down in the first storage bin; the automatic blanking mechanism comprises a second bin and an automatic blanking mechanism, the automatic blanking mechanism is arranged in the second bin and moves up and down, the transfer device is located above the automatic feeding device, the automatic blanking device, the testing device and the defective product placing table, the transfer device moves the chips to be tested of the automatic feeding device to the testing device, the chips which are tested are moved to the automatic blanking device or the defective product placing table, and the transfer device also moves the empty Tray disc of the automatic feeding device to the automatic blanking device.

Preferably, still be provided with heating device in the frame, heating device includes high temperature heating mechanism at least, high temperature heating mechanism is located testing arrangement's top, high temperature heating mechanism includes high temperature heating head, first moving mechanism and pushes down the mechanism, push down the mechanism with first moving mechanism links to each other, high temperature heating head with it links to each other to push down the mechanism.

Preferably, the heating device further comprises a preheating caching mechanism, the preheating caching mechanism is located between the automatic feeding device and the testing device, the preheating caching mechanism comprises a preheating workbench, and a plurality of preheating stations are arranged on the preheating workbench.

Preferably, the rack is further provided with a pre-positioning device, the pre-positioning device comprises a pre-positioning rotary cylinder, a pre-positioning base and a steering positioning base, the pre-positioning base is connected with the pre-positioning rotary cylinder, the pre-positioning base is located between the pre-positioning rotary cylinder and the steering positioning base, and the steering positioning base is provided with a concave pre-positioning groove.

Preferably, the pre-positioning device further comprises at least two photoelectric sensors, a pre-positioning cylinder base is fixed on the frame, the pre-positioning rotary cylinder is fixed on the pre-positioning cylinder base, four positioning frames which are arranged oppositely are arranged on the pre-positioning cylinder base, the pre-positioning base and the steering positioning base are located between the four positioning frames, and the two photoelectric sensors are respectively fixed on the two fixing frames.

Preferably, a transfer device is further fixed on the rack, the transfer device is located on one side of the automatic feeding device and the automatic discharging device, the transfer device comprises a cylinder cushion block, a transfer rotary cylinder and a Tray disc transfer table, the transfer rotary cylinder is fixed on the cylinder cushion block, and the Tray disc transfer table is connected with the transfer rotary cylinder.

Preferably, the automatic feeding mechanism and the automatic discharging mechanism both comprise a servo motor, a planetary reducer, a ball screw, a first movable bottom plate, a second movable bottom plate 47 and two guide shafts positioned on two sides of the ball screw, the servo motor is connected with the planetary reducer, the planetary reducer is connected with the ball screw through a coupler, the ball screw and the two guide shafts are respectively connected with the first movable bottom plate, and the first movable bottom plate is connected with the second movable bottom plate 47.

Preferably, the transfer device comprises a Y-axis moving assembly, an X-axis moving assembly, a first Z-axis moving assembly, a second Z-axis moving assembly, a vacuum chuck and a vacuum nozzle, wherein the X-axis moving assembly is connected with the Y-axis moving assembly, the first Z-axis moving assembly and the second Z-axis moving assembly are respectively connected with the X-axis moving assembly, the vacuum chuck is connected with the first Z-axis moving assembly, and the vacuum nozzle is connected with the second Z-axis moving assembly.

Preferably, the testing device comprises a testing load plate, a testing seat jacket, a testing seat bottom plate, a testing seat middle plate and a testing seat cover plate, wherein the testing seat jacket is fixed on the upper surface of the testing load plate, the testing seat bottom plate is fixed on the testing seat jacket, the testing seat middle plate is positioned between the testing seat bottom plate and the testing seat cover plate, and the testing seat bottom plate and the testing seat cover plate are fixedly connected through a positioning pin.

The invention discloses a testing method of a chip testing machine in another embodiment.

The test method comprises the following steps:

placing a plurality of chips to be tested in a plurality of Tray discs, placing a plurality of chips to be tested in each Tray disc, placing the plurality of Tray discs in an automatic feeding device, and respectively placing an empty Tray disc on an automatic blanking device and a defective product placing table;

the transfer device takes out the chip to be tested from the Tray disc of the automatic feeding device and transfers the chip to the testing device for testing;

after the chip test is finished, the transfer device transfers the chips which are qualified in the test to an empty Tray of the automatic blanking device, and transfers the defective products to the empty Tray of the defective product placing table;

when all the chips to be tested in one Tray disc of the automatic feeding device are tested and the empty Tray disc of the automatic discharging device is filled with the chips qualified in the test, the transfer device transfers the empty Tray disc of the automatic feeding device to the automatic discharging device.

The following illustrates the advantages or principles of the invention:

1. when the chip testing machine is used for chip testing, a plurality of Tray discs are placed on the automatic feeding device, a plurality of chips to be tested are fully or placed on each Tray disc, and meanwhile, empty Tray discs are placed on the automatic discharging device and the defective product placing table respectively. After the testing machine is started, the transfer device sucks the chips to be tested from the Tray disc of the automatic feeding device and transfers the chips to the testing device for testing, after the chip testing is finished, the transfer device transfers the chips which are qualified in the testing to the empty Tray disc of the automatic discharging device, and transfers the defective products to the empty Tray disc of the defective product placing table for placing. When all the chips in one Tray disc of the automatic feeding device are tested and the empty Tray disc of the automatic discharging device is fully filled with the tested chips, the transfer device transfers the empty Tray disc of the automatic feeding device to the automatic discharging device. The chip tester has compact structure, small volume and small occupied area of about one meter, and can meet the requirement of chip testing in small batch.

2. The chip testing machine of the invention also comprises a heating device, and partial chips may need high-temperature heating or low-temperature cooling before testing. After the chip to be tested is transferred to the testing device, the high-temperature heating head can be driven by the first moving mechanism to move to the position above the testing device, then the pressing mechanism drives the high-temperature heating head to move downwards, and the chip is subjected to high-temperature heating or low-temperature cooling by the high-temperature heating head, so that the requirement of high-temperature heating or low-temperature cooling on the chip is met.

3. The heating device further comprises a preheating caching mechanism, when the chip needs to be subjected to high-temperature testing, in order to improve the heating efficiency, the plurality of chips to be tested can be moved to a plurality of preheating stations of the preheating workbench, the heating time of the high-temperature heating head can be reduced in the testing process, and the testing efficiency is improved.

4. The rack is also provided with a pre-positioning device, when the placing direction of the chip to be tested is inconsistent with the direction of the chip to be placed when the testing device tests, the chip to be tested can be moved to the pre-positioning device at first, the placing direction of the chip is adjusted through the pre-positioning device, and the smooth chip testing is guaranteed. After the chip is tested, the chip is moved to the pre-positioning device for direction adjustment, and the placing direction of the tested chip is consistent with the incoming material direction of the chip.

5. A transfer device is further fixed on the rack, the Tray disc of the automatic feeding device is generally full disc feeding, and if defective products occur in the testing process, the Tray disc of the automatic discharging device can be not full. At the moment, the empty Tray disc of the automatic feeding device is transferred to the transfer device through the transfer device, then chips are sucked from the other Tray disc of the automatic feeding device for testing, and after the Tray disc of the automatic discharging device is filled with the chips, the empty Tray disc of the transfer device is moved to the position above the Tray disc filled with the chips by the automatic discharging device, so that the Tray disc of the automatic discharging device is also discharged in a full disc mode.

Drawings

FIG. 1 is a front view of a chip tester of the present embodiment;

fig. 2 is a perspective view of the chip tester of the present embodiment;

fig. 3 is a schematic structural view of the automatic feeding device or the automatic discharging device of the present embodiment;

fig. 4 is an internal structural view of the automatic feeding device or the automatic discharging device of the present embodiment;

fig. 5 is a schematic structural view of the relay device of the present embodiment;

FIG. 6 is a schematic structural diagram of a testing apparatus according to the present embodiment;

FIG. 7 is an exploded view of the test apparatus of the present embodiment;

FIG. 8 is a schematic structural view of the high-temperature heating mechanism of the present embodiment;

FIG. 9 is a schematic structural view of a preheating stage of the present embodiment;

fig. 10 is an exploded view of the preheating stage of the present embodiment;

FIG. 11 is a schematic structural diagram of a pre-positioning device of the present embodiment;

FIG. 12 is an exploded view of the pre-positioning device of the present embodiment;

fig. 13 is a schematic structural view of the transplanting device of this embodiment;

fig. 14 is another schematic structural view of the transfer device of the present embodiment;

description of reference numerals:

10. a frame; 20. a transfer device; 30. a testing device; 40. an automatic feeding device; 50. an automatic blanking device; 60. a defective product placing table; 11. a horizontally adjustable support-type caster; 12. a support plate; 41. a first storage bin; 42. an automatic feeding mechanism; 51. a second storage bin; 52. an automatic blanking mechanism; 411. a bin gate; 43. a servo motor; 44. a planetary reducer; 45. a ball screw; 46. a first moving floor; 47. a second moving floor; 48. a guide shaft; 49. a screw rod fixing plate; 451. a screw rod fixing seat; 60. a transfer device; 61. a cylinder cushion block; 62. a transfer rotating cylinder; 63. a Tray disc relay table; 31. testing the load board; 32. a test seat outer sleeve; 33. a test socket base plate; 34. a test socket intermediate plate; 35. a test socket cover plate; 36. positioning pins; 70. a high temperature heating mechanism; 71. a high temperature heating head; 72. a first moving mechanism; 73. a pressing mechanism; 721. a first movable fixed block; 722. a first movable fixed base plate; 723. a first moving guide rail; 724. a first moving cylinder; 731. pressing down the cylinder support; 732. pressing down the cylinder block; 733. pressing down the air cylinder; 734. a high temperature head support; 90. a preheating caching mechanism; 91. preheating a base plate; 92. a separator plate; 93. a heater; 94. a heat conducting plate; 95. a preheating workbench; 96. a preheating station; 100. a pre-positioning device; 101. pre-positioning a rotary cylinder; 102. pre-positioning the base; 103. a steering positioning base; 104. pre-positioning a groove; 105. a photosensor; 106. pre-positioning a cylinder base; 107. a positioning frame; 21. a Y-axis moving assembly; 22. an X-axis moving assembly; 23. a first Z-axis moving assembly; 24. a second Z-axis moving assembly; 25. a vacuum chuck; 26. a vacuum nozzle; 210. a Y-axis moving guide rail; 211. a Y-axis drag chain; 212. a Y-axis servo electric cylinder; 213. a Y-axis moving base plate; 220. an X-axis servo electric cylinder; 221. an X-axis drag chain; 230. a sliding table cylinder; 231. a double-rod cylinder; 232. a nozzle substrate; 233. a cylinder fixing seat; 240. a torque motor; 241. high torque timing belts; 242. a synchronous pulley; 243. a linear guide rail; 27. a vacuum generator; 110. a display; 120. three-color display lamp.

Detailed Description

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "middle", "inner", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.

The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the invention easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the invention.

As shown in fig. 1 and fig. 2, in an embodiment of the present invention, a chip testing machine is disclosed, which includes a frame 10, and a transfer device 20, a testing device 30, an automatic feeding device 40, an automatic discharging device 50, and a defective product placing table 60 disposed on the frame 10. Wherein, four opposite angles of the bottom of the frame 10 are respectively provided with a horizontal adjusting supporting caster 11. The rack 10 is provided with a support plate 12, the testing device 30 and the defective product placing table 60 are fixed on the support plate 12, the automatic feeding device 40 and the automatic discharging device 50 are arranged side by side in the transverse direction of the rack 10, and the automatic feeding device 40 is positioned between the automatic discharging device 50 and the defective product placing table 60. The defective product placing table 60 is located between the testing device 30 and the automatic feeding device 40. The transfer device 20 is located above the automatic feeding device 40, the automatic discharging device 50, the testing device 30 and the defective product placing table 60, the transfer device 20 moves the chips to be tested of the automatic feeding device 40 to the testing device 30, moves the tested chips to the automatic discharging device 50 or the defective product placing table 60, and the transfer device 20 also moves the empty Tray of the automatic feeding device 40 to the automatic discharging device 50.

When a chip test is performed using the chip tester of the present embodiment, first, a plurality of Tray disks are placed on the automatic loading device 40, each Tray disk is filled or placed with a plurality of chips to be tested, and empty Tray disks are placed on the automatic unloading device 50 and the defective product placement table 60, respectively. After the test machine is started, the transfer device 20 sucks the chips to be tested from the Tray of the automatic loading device 40, transfers the chips to be tested to the test device 30, and tests the chips, and after the chip tests are completed, the transfer device 20 transfers the chips which are qualified in the tests to the empty Tray of the automatic unloading device 50, and transfers the defective products to the empty Tray of the defective product placing table 60 to place the defective products. When all the chips in one Tray of the automatic loading device 40 are tested and the empty Tray of the automatic unloading device 50 is filled with the tested chips, the transfer device 20 transfers the empty Tray of the automatic loading device 40 to the automatic unloading device 50. The chip testing machine of the embodiment of the invention has the advantages of compact structure, small volume and small occupied area of about one meter, and can meet the requirements of chip testing in small batches.

In order to realize the automatic loading of the chip to be tested, the automatic loading device 40 includes a first bin 41 and an automatic loading mechanism 42, and the automatic loading mechanism 42 moves up and down in the first bin 41. In order to realize the automatic blanking of the qualified chip, the automatic blanking mechanism 52 includes a second storage bin 51 and the automatic blanking mechanism 52, and the automatic blanking mechanism 52 moves up and down in the second storage bin 51.

As shown in fig. 3 and 4, the first bin 41 and the second bin 51 of the present embodiment have the same mechanism, openings are disposed above the first bin 41 and the second bin 51, and a bin door 411 is disposed on one side of the first bin 41 and one side of the second bin 51.

The automatic feeding mechanism 42 and the automatic discharging mechanism 52 have the same structure, and the automatic feeding mechanism 42 and the automatic discharging mechanism 52 each include a uniform servo motor 43, a planetary reducer 44, a ball screw 45, a first moving base plate 46, a second moving base plate 47, and two guide shafts 48 located on both sides of the ball screw 45. The servo motor 43 and the planetary reducer 44 are fixed at the bottom of the first bin 41 or the second bin 51, the ball screw 45, the first movable bottom plate 46, the second movable bottom plate 47 and the two guide shafts 48 are fixed inside the first bin 41 or the second bin 51, a driving main shaft of the servo motor 43 is connected with the planetary reducer 44, and the planetary reducer 44 is connected with the ball screw 45 through a coupler. A screw rod fixing plate 49 is arranged above the first bin 41 and the second bin 51, the bottom of the ball screw 45 is fixed on the bottom plate of the first bin 41 or the second bin 51 through a screw rod fixing seat 451, and the top of the ball screw 45 is fixed on the screw rod fixing plate 49 through the screw rod fixing seat 451. The bottoms of the two guide shafts 48 are also fixed on the bottom plate of the first bin 41 or the second bin 51, and the tops of the two guide shafts 48 are also fixed on the screw rod fixing plate 49. The ball screw 45 and the two guide shafts 48 are connected to a first moving base 46, and the first moving base 46 is connected to a second moving base 47.

When the automatic loading mechanism 42 is loading, a plurality of Tray trays filled with chips to be tested are stacked up and down on the second movable bottom plate 47 of the first magazine 41, and the Tray positioned on the uppermost layer is positioned at the opening portion of the first magazine 41. The transfer device 20 first sucks the chip on the Tray positioned on the uppermost layer to perform a test, and transfers the empty Tray to the automatic unloading mechanism 52 after the chip test on the Tray positioned on the uppermost layer is completed. Then the servo motor 43 drives the ball screw 45 to rotate, the ball screw 45 drives the second moving bottom plate 47 to move upwards through the first moving bottom plate 46, and drives the Tray disc positioned below to move upwards until all the chips in the Tray disc are tested completely.

When the automatic feeding mechanism 52 feeds the material, an empty Tray is first placed on the second moving bottom plate 47 of the second magazine 51, and the empty Tray is placed in the opening of the second magazine 51. Chips that are qualified for testing are placed in the empty Tray. When the Tray disc is filled with the detected chips, the servo motor 43 drives the ball screw 45 to rotate, the ball screw 45 drives the Tray disc to move downwards for a certain distance, then the transfer device 20 transfers the empty Tray disc of the automatic feeding device 40 to the automatic discharging device 50 for placement, and places the empty Tray disc above the Tray disc filled with the chips of the automatic discharging device 50 and stacks the empty Tray disc up and down.

In the testing process, defective products can occur, and the defective products can be placed on the defective product placing table 60, so that after all tests of one Tray disc on the automatic feeding device 40 are completed, the Tray disc of the automatic discharging device 50 is not filled with chips. As shown in fig. 1, in order to ensure that the Tray of the automatic feeding device 40 is moved to the automatic discharging device 50 after the Tray of the automatic discharging device 50 is filled with chips, a transfer device 60 is further provided on the frame 10.

The transfer device 60 is located at one side of the automatic feeding device 40 and the automatic discharging device 50. As shown in fig. 5, the transferring device 60 includes a cylinder block 61, a transferring rotary cylinder 62 and a Tray transferring table 63, wherein the cylinder block 61 is fixed on the supporting plate 12, the transferring rotary cylinder 62 is fixed on the cylinder block 61, the Tray transferring table 63 is connected to the transferring rotary cylinder 62, and the transferring rotary cylinder 62 can drive the Tray transferring table 63 to rotate.

The function of the relay device 60 will be further described below with a specific example.

For example, 50 chips can be placed on one Tray, and 50 chips are loaded on each Tray of the automatic loading apparatus 40. The transfer device 20 sucks the chips in the Tray of the automatic loader 40 to the tester 30 for testing, and transfers the chips that have passed the test to the empty Tray of the automatic unloader 50. When a defective product occurs, the defective product is moved to the defective product placing table 60, and after all the chips in one Tray disc of the automatic feeding device 40 are tested, only 49 chips which are qualified in the test are loaded in the Tray disc of the automatic discharging device 50. At this time, the transfer device 20 transfers the empty Tray of the automatic loader 40 to the Tray transfer table 63, and then the transfer device 20 sucks and tests chips from another Tray below until the Tray of the automatic unloader 50 is filled with 50 chips, and then transfers the empty Tray on the Tray transfer table 63 to the automatic unloader 50.

As shown in fig. 6 and 7, the testing device 30 of the present embodiment includes a test load board 31, a test socket housing 32, a test socket bottom board 33, a test socket middle board 34, and a test socket cover board 35. The test socket outer sleeve 32 is fixed on the upper surface of the test load plate 31, the test socket bottom plate 33 is fixed on the test socket outer sleeve 32, the test socket middle plate 34 is positioned between the test socket bottom plate 33 and the test socket cover plate 35, and the test socket bottom plate 33 and the test socket cover plate 35 are fixedly connected through the positioning pin 36.

Before testing, some types of chips need to be heated at high temperature or cooled at low temperature, and in this embodiment, a heating device is further disposed on the rack 10. As shown in fig. 2, the heating device includes at least a high temperature heating mechanism 70, and the high temperature heating mechanism 70 is located above the testing device 30. As shown in fig. 8, the high-temperature heating mechanism 70 includes a high-temperature heating head 71, a first moving mechanism 72, and a pressing mechanism 73, the pressing mechanism 73 is connected to the first moving mechanism 72, and the high-temperature heating head 71 is connected to the pressing mechanism 73.

The first moving mechanism 72 is fixed on the upper top plate of the frame 10, and the first moving mechanism 72 includes two first moving fixed blocks 721, a first moving fixed bottom plate 722, two first moving guide rails 723 arranged oppositely, and a first moving cylinder 724. The two first moving fixed blocks 721 are oppositely disposed on the upper top plate of the rack 10, the two first moving guide rails 723 are respectively fixed on the two first moving fixed blocks 721, and the first moving fixed base plate 722 is respectively connected to the two first moving guide rails 723 through sliders. The first moving cylinder 724 is connected to the first moving fixed base 722, and the first moving cylinder 724 is connected to the upper top plate of the frame 10 through a cylinder fixing plate.

The pressing mechanism 73 comprises a pressing cylinder support 731, a pressing cylinder seat 732 and a pressing cylinder 733, the pressing cylinder support 731 is fixed on the first movable fixed bottom plate 722, the pressing cylinder seat 732 is fixed on the pressing cylinder support 731, the pressing cylinder 733 is fixed on the pressing cylinder seat 732, the pressing cylinder 733 is connected with a high-temperature head support 734, and the high-temperature heating head 71 is fixed on the high-temperature head support 734.

When the chip needs to be heated at a high temperature or cooled at a low temperature, the first moving cylinder 724 drives the first moving fixed base 722 to move, and the first moving fixed base 722 drives the pressing mechanism 73 and the high temperature heating head 71 to move above the testing apparatus 30. Then the high-temperature heating head 71 is driven by the pressing cylinder 733 to move downwards, and the high-temperature heating head 71 carries out high-temperature heating or low-temperature cooling on the chip, so that the requirement of high-temperature heating or low-temperature cooling on the chip is met.

When the chip is subjected to a high temperature test, in order to provide heating efficiency, the heating apparatus of the present embodiment further includes a preheating buffer mechanism 90, and the preheating buffer mechanism 90 is located between the automatic feeding apparatus 40 and the testing apparatus 30. As shown in fig. 9 and 10, the preheating buffer mechanism 90 includes a preheating backing plate 91, a partition plate 92, a heater 93, a heat conducting plate 94, and a preheating table 95. Preheating backing plate 91 is fixed in on the backup pad 12, and division board 92 is fixed in the upper surface of preheating backing plate 91, and heater 93 is fixed in on division board 92, and heater 93 is located between division board 92 and heat-conducting plate 94, and preheating worktable 95 is fixed in the upper surface of heat-conducting plate 94, is equipped with a plurality of preheating stations 96 on preheating worktable 95.

When the chip needs to carry out high-temperature heating, can will be with a plurality of chips that await measuring remove to preheating workstation 95 a plurality of stations 96 of preheating and preheat, in the test, can reduce high-temperature heating head 71's heat time, improve efficiency of software testing.

When the placing direction of the incoming material chip on the automatic feeding device 40 is not consistent with the direction of the chip to be placed when the testing device 30 tests, the chip to be tested needs to be pre-positioned first, so the pre-positioning device 100 is further arranged on the rack 10 in this embodiment. As shown in fig. 11 and 12, the pre-positioning device 100 includes a pre-positioning rotary cylinder 101, a pre-positioning base 102, and a steering positioning base 103, the pre-positioning base 102 is connected to the pre-positioning rotary cylinder 101, the pre-positioning base 102 is located between the pre-positioning rotary cylinder 101 and the steering positioning base 103, and a concave pre-positioning groove 104 is formed in the steering positioning base 103.

Preferably, the pre-positioning device 100 further includes at least two photoelectric sensors 105, a pre-positioning cylinder base 106 is fixed on the frame 10, the pre-positioning rotary cylinder 101 is fixed on the pre-positioning cylinder base 106, four positioning frames 107 are arranged on the pre-positioning cylinder base 106 in an opposite manner, the pre-positioning base 102 and the steering positioning base 103 are located between the four positioning frames 107, and the two photoelectric sensors 105 are respectively fixed on the two positioning frames 107.

When the chip needs to be pre-positioned, the chip is firstly transferred into the pre-positioning groove 104, and then the pre-positioning rotary cylinder 101 drives the steering positioning base 103 to rotate, so that the chip is driven to rotate forwards or reversely by 90 degrees. The placing direction of the chip is adjusted through the pre-positioning device 100, and smooth chip testing is guaranteed. After the chip is tested, the chip is moved to the pre-positioning device 100 for direction adjustment, and the placing direction of the tested chip is consistent with the material feeding direction of the chip.

As shown in fig. 13 and 14, the transfer device 20 of the present embodiment includes a Y-axis moving unit 21, an X-axis moving unit 22, a first Z-axis moving unit 23, a second Z-axis moving unit 24, a vacuum chuck 25, and a vacuum nozzle 26. The X-axis moving assembly 22 is connected with the Y-axis moving assembly 21, the first Z-axis moving assembly 23 and the second Z-axis moving assembly 24 are respectively connected with the X-axis moving assembly 22, the vacuum suction cup 25 is connected with the first Z-axis moving assembly 23, and the vacuum suction nozzle 26 is connected with the second Z-axis moving assembly 24.

The Y-axis moving assembly 21 is fixed on an upper top plate of the frame 10, the Y-axis moving assembly 21 comprises a Y-axis moving guide rail 210, a Y-axis drag chain 211, a Y-axis servo electric cylinder 212 and a Y-axis moving bottom plate 213, the Y-axis guide rail and the Y-axis drag chain 211 are arranged oppositely, and the Y-axis moving bottom plate 213 is connected with the Y-axis moving guide rail 210 and the Y-axis servo electric cylinder 212 through sliders respectively. The X-axis moving assembly 22 is connected to the Y-axis moving base 213, and the X-axis moving assembly 22 is further connected to the Y-axis drag chain 211. The Y-axis moving base plate 213 is driven by the Y-axis servo cylinder 212 to move in the Y-axis direction.

The X-axis moving assembly 22 comprises an X-axis servo electric cylinder 220 and an X-axis drag chain 221, the X-axis servo motor and the X-axis drag chain 221 are respectively fixed on the Y-axis moving base plate 213, and the first Z-axis moving assembly 23 and the second Z-axis moving assembly 24 are both connected with the X-axis servo motor and the X-axis drag chain 221.

The first Z-axis moving assembly 23 includes a sliding table cylinder 230, a double-rod cylinder 231, a suction nozzle substrate 232, and a cylinder fixing seat 233, wherein the suction nozzle substrate 232 is movably connected with the X-axis, the sliding table cylinder 230 is fixed on the suction nozzle substrate 232, the cylinder fixing seat 233 is connected with the sliding table cylinder 230, and the double-rod cylinder 231 is fixed on the cylinder fixing seat 233. The vacuum chuck 25 is connected to a double rod cylinder 231. When the sliding table cylinder 230 moves, the cylinder fixing plate is driven to be connected, the cylinder fixing seat 233 drives the double-rod cylinder 231 to move, and the double-rod cylinder 231 can drive the vacuum chuck 25 to move, so that the vacuum chuck 25 is driven to move upwards or downwards.

The second Z-axis moving assembly 24 includes a torque motor 240, a high torque timing belt 241, two timing pulleys 242, and a linear guide 243. The torque motor 240 is fixed on the nozzle base plate 232, the two synchronous pulleys 242 are respectively and oppositely arranged on the upper side and the lower side of the nozzle base plate 232, the two synchronous pulleys 242 are connected through a high-torque timing belt 241, and the torque motor 240 is connected with one of the synchronous pulleys 242. The linear guide 243 is fixed on the nozzle base plate 232, the vacuum nozzle 26 is fixed on the linear guide 243 through a slide block, and the slide block is connected with a timing belt of a high-torque machine. The torque motor 240 drives the synchronous belt wheel 242 to rotate, the synchronous belt wheel 242 drives the high-torque timing belt 241 to rotate, and the high-torque timing belt 241 drives the vacuum suction nozzle 26 to move up and down on the linear guide 243 through the sliding block.

A plurality of vacuum generators 27 are fixed to the nozzle base plate 232, and the vacuum generators 27 are connected to the vacuum suction pads 25 and the vacuum nozzles 26. This embodiment may suck the chip by means of the vacuum chuck 25 and/or the vacuum nozzle 26.

The frame 10 of this embodiment is further fixed with a display 110, the display 110 displays the operation of the testing machine, and the frame 10 is further fixed with a three-color display lamp 120, which displays different working states of the testing machine. The industrial control box, the tester host, the electric control box and the like of the tester are all fixed on the frame 10.

The test method comprises the following steps:

s1: a plurality of chips to be tested are placed in a plurality of Tray disks, a plurality of chips to be tested are placed in each Tray disk, the plurality of Tray disks are placed in the automatic feeding device 40, and an empty Tray disk is placed on the automatic discharging device 50 and the defective product placing table 60 respectively.

For example, 50 chips can be placed in each Tray of the automatic loading apparatus 40 at the maximum, and then 10 Tray trays filled with chips can be placed on the automatic loading apparatus 40 with the 10 Tray trays being stacked one on top of another.

S2: the transfer device 20 takes out the chips to be tested from the Tray of the automatic loading device 40 and transfers the chips to the testing device 30 for testing.

When the chip testing machine is started, the transfer device 20 moves to a position above the automatic feeding device 40, and then the transfer device 20 moves downward to suck the chips in the Tray positioned at the top of the automatic feeding device 40, and transfers the chips to the testing device 30 to test the chips.

S3: after the chip test is completed, the transfer device 20 transfers chips that have passed the test to the empty Tray of the automatic unloading device 50, and transfers defective products to the empty Tray of the defective product placement table 60.

After the chip test is completed, the chip may be a qualified product or a defective product. If the chip is qualified, the qualified chip is transferred to a Tray of an automatic blanking machine by a transfer device 20 and placed; if the chip is defective, the defective is transferred to a Tray of the defective placement table 60 and placed.

S4: when all the chips to be tested in one Tray of the automatic feeding device 40 are tested and the empty Tray of the automatic discharging device 50 is filled with the chips qualified in the test, the transferring device 20 transfers the empty Tray of the automatic feeding device 40 to the automatic discharging device 50.

When all 50 chips in the Tray disk of the automatic feeding device 40 located at the top are tested, and all 50 chips are qualified products, the Tray disk of the automatic discharging device 50 is filled with 50 chips qualified by the test. The Tray of the holes of the automatic loader 40 is transferred to the automatic unloader 50 by the transfer device 20, and the Tray is placed above the Tray of the automatic unloader 50 on which 50 chips are placed.

When 1 or 2 defective products appear in 50 chips after all 50 chips in the Tray disk positioned at the top of the automatic feeding device 40 are tested, the Tray disk of the automatic discharging device 50 is not filled with 50 chips at this time. Then the test method also includes the following steps:

the empty Tray of the automatic feeding device 40 is transferred to the transfer device 60, chips are then sucked from the next Tray of the automatic feeding device 40 for testing, the chips qualified for testing are placed in the automatic blanking device 50 until the Tray of the automatic blanking device 50 is filled with the chips qualified for testing, and then the empty Tray of the transfer device 60 is transferred to the automatic blanking device 50.

Before testing, part of the test chips need to be heated at high temperature or cooled at low temperature, and before testing, the chips need to be heated at high temperature or cooled at low temperature through a heating device. When the feeding direction of the automatic feeding machine is not consistent with the placing direction of the chip in the testing device 30, before testing, the chip needs to be moved to the pre-positioning device 100 to pre-position the chip.

The embodiments of the present invention are not limited thereto, and according to the above-mentioned contents of the present invention, the present invention can be modified, substituted or combined in other various forms without departing from the basic technical idea of the present invention.

Claims

1. The chip testing machine is characterized by comprising a rack, a transfer device, a testing device, an automatic feeding device, an automatic discharging device and a defective product placing table, wherein the transfer device, the testing device, the automatic feeding device, the automatic discharging device and the defective product placing table are arranged on the rack; the automatic blanking mechanism comprises a second bin and an automatic blanking mechanism, the automatic blanking mechanism is arranged in the second bin and moves up and down, the transfer device is located above the automatic feeding device, the automatic blanking device, the testing device and the defective product placing table, the transfer device moves the chips to be tested of the automatic feeding device to the testing device, the chips which are tested are moved to the automatic blanking device or the defective product placing table, and the transfer device also moves the empty Tray disc of the automatic feeding device to the automatic blanking device.

2. The chip testing machine as claimed in claim 1, wherein the frame further comprises a heating device, the heating device comprises at least a high temperature heating mechanism, the high temperature heating mechanism is located above the testing device, the high temperature heating mechanism comprises a high temperature heating head, a first moving mechanism and a pressing mechanism, the pressing mechanism is connected to the first moving mechanism, and the high temperature heating head is connected to the pressing mechanism.

3. The chip testing machine as claimed in claim 2, wherein the heating device further comprises a pre-heating buffer mechanism, the pre-heating buffer mechanism is located between the automatic loading device and the testing device, the pre-heating buffer mechanism comprises a pre-heating table, and a plurality of pre-heating stations are arranged on the pre-heating table.

4. The chip testing machine according to any one of claims 1 to 3, wherein the frame is further provided with a pre-positioning device, the pre-positioning device includes a pre-positioning rotary cylinder, a pre-positioning base, and a steering positioning base, the pre-positioning base is connected to the pre-positioning rotary cylinder, the pre-positioning base is located between the pre-positioning rotary cylinder and the steering positioning base, and the steering positioning base is provided with a recessed pre-positioning groove.

5. The chip testing machine according to claim 4, wherein the pre-positioning device further includes at least two photoelectric sensors, a pre-positioning cylinder base is fixed on the frame, the pre-positioning rotary cylinder is fixed on the pre-positioning cylinder base, four positioning frames are oppositely disposed on the pre-positioning cylinder base, the pre-positioning base and the turning positioning base are located between the four positioning frame supports, and the two photoelectric sensors are respectively fixed on the two fixing frames.

6. The chip testing machine according to any one of claims 1 to 3, wherein a transfer device is further fixed to the frame, the transfer device is located on one side of the automatic feeding device and the automatic discharging device, the transfer device includes a cylinder block, a transfer rotating cylinder and a Tray disk transfer table, the transfer rotating cylinder is fixed to the cylinder block, and the Tray disk transfer table is connected to the transfer rotating cylinder.

7. The chip testing machine according to claim 1, wherein the automatic feeding mechanism and the automatic discharging mechanism each comprise a servo motor, a planetary reducer, a ball screw, a first movable base plate, a second movable base plate, and two guide shafts located on both sides of the ball screw, the servo motor is connected to the planetary reducer, the planetary reducer is connected to the ball screw through a coupling, the ball screw and the two guide shafts are respectively connected to the first movable base plate, and the first movable base plate is connected to the second movable base plate.

8. The chip testing machine as claimed in claim 1, wherein the transfer device comprises a Y-axis moving assembly, an X-axis moving assembly, a first Z-axis moving assembly, a second Z-axis moving assembly, a vacuum chuck and a vacuum nozzle, the X-axis moving assembly is connected to the Y-axis moving assembly, the first Z-axis moving assembly and the second Z-axis moving assembly are respectively connected to the X-axis moving assembly, the vacuum chuck is connected to the first Z-axis moving assembly, and the vacuum nozzle is connected to the second Z-axis moving assembly.

9. The chip testing machine as claimed in claim 1, wherein the testing device comprises a testing load board, a testing seat outer sleeve, a testing seat bottom board, a testing seat middle board and a testing seat cover board, the testing seat outer sleeve is fixed on the testing load board, the testing seat bottom board is fixed on the testing seat outer sleeve, the testing seat middle board is located between the testing seat bottom board and the testing seat cover board, and the testing seat bottom board and the testing seat cover board are fixedly connected through a positioning pin.

10. The test method of the chip tester is characterized by comprising the following steps: