CN117554784B - Chip three-temperature test equipment - Google Patents

Abstract

The invention discloses a chip three-temperature testing device which has high automation degree, can independently control the temperature of each chip, ensures the accuracy of the temperature required by the chip test and can simultaneously test the performance of the chip at low temperature, normal temperature and high temperature. The automatic feeding and discharging device comprises a workbench, wherein the front end of the workbench is symmetrically provided with feeding and discharging modules, the rear ends of the feeding and discharging modules are respectively provided with a triaxial material taking module, a carrier buffer table is arranged below the tail end of the triaxial material taking module, a turntable test module is arranged at the side end of the carrier buffer table, a rotary material taking module is arranged between the carrier buffer table and the turntable test module, and a sorting and discharging module is arranged between the carrier buffer table and the feeding and discharging modules. The invention is applied to the technical field of chip testing.

Description

Chip three-temperature test equipment

Technical Field

The invention relates to a three-temperature test device, in particular to a three-temperature test device for a chip.

Background

Because of the rapid development of automobile electronics at present, the automobile-standard chip also has forced high-low temperature experiment requirements.

The existing three-temperature test mode of the chip is that a tester firstly carries out normal temperature test on the chip, then carries out low temperature test and finally carries out high temperature test, the low temperature test is that the chip is required to be placed in a refrigeration box to carry out refrigeration according to set temperature and time, then the chip is taken out and placed in a carrier after reaching the set temperature, then the tested chip enters the high temperature test and is also placed in the high temperature box to be heated, the chip is taken out and placed in the carrier after reaching the set temperature, then the test is carried out, but the high temperature box cannot guarantee the temperature uniformity of each chip after the refrigeration box, thereby influencing the specific temperature of the chip in the carrier during test, heat loss can occur in the process of transferring the chip, further influencing the accuracy of the chip in the test at the set temperature.

Disclosure of Invention

The invention aims to solve the technical problem of overcoming the defects of the prior art, and provides a three-temperature chip testing device which has high automation degree, can independently control the temperature of each chip, ensures the accuracy of the temperature required by the chip test and can simultaneously test the performance of the chip at low temperature, normal temperature and high temperature.

The technical scheme adopted by the invention is as follows: the automatic feeding and discharging device comprises a workbench, wherein the front end of the workbench is symmetrically provided with an upper discharging module and a lower discharging module, the upper discharging module is used for feeding a chip tray filled with chips and discharging the empty chip tray, the rear ends of the upper discharging module and the lower discharging module are respectively provided with a three-axis material taking module, a carrier buffer table is arranged below the tail ends of the three-axis material taking modules, the three-axis material taking modules are used for taking the chips in the upper discharging module to the carrier buffer table or carrying out discharging transfer on the chips tested by the carrier buffer table, the side ends of the carrier buffer table are provided with rotary table test modules, a rotary material taking module is arranged between the carrier buffer table and the rotary table test modules, the rotary material taking module is used for transferring the chips of the carrier buffer table to the rotary table test modules and transferring the chips tested by the rotary table test modules back to the carrier buffer table, and a sorting and discharging module is arranged between the carrier buffer table and the upper discharging module and the lower charging module and is used for carrying out tray sorting and discharging on the chips tested by the carrier buffer table;

The turntable test module comprises a loading and unloading station, a low-temperature test station, a normal-temperature test station and a high-temperature test station which are sequentially arranged on the turntable, wherein each station is at least provided with a temperature control chip carrier module which is used for heating or refrigerating the placed chips, and test modules matched with the temperature control chip carrier modules are arranged above the low-temperature test station, the normal-temperature test station and the high-temperature test station;

The temperature control chip carrier module is characterized in that at least one temperature control chip carrier module is also arranged on the carrier cache table, the temperature control chip carrier module arranged on the turntable test module station and the temperature control chip carrier module arranged on the carrier cache table all comprise carrier bases, the tops of the carrier bases are provided with socket covers, the bottoms of the carrier bases are provided with water cooling bases, TEC temperature controllers are arranged on the water cooling bases, heat conducting blocks are arranged on the TEC temperature controllers, carrier grooves which are matched with chips and penetrate out of the socket covers are arranged in the heat conducting blocks, chip side clamp modules arranged at the side ends of the socket covers are used for limiting and fixing the heat conducting blocks to the upper ends of the TEC temperature controllers, and the chip side clamp modules are used for fixing chip side clamps in the carrier grooves.

Further, the heat conduction block is an annular ceramic heat conduction block, a temperature sensor is arranged in the annular ceramic heat conduction block, a K-type thermocouple is adopted by the temperature sensor, the K-type thermocouple is penetrated and fixed inside the ceramic heat conduction block, the TEC temperature controller is a three-stage TEC temperature controller, the three-stage TEC temperature controller is internally provided with an NTC sensor, a silicone grease connecting layer or a heat conduction adhesive connecting layer is arranged between the water cooling seat and the three-stage TEC temperature controller, a glass fiber isolation cover is arranged on the three-stage TEC temperature controller, screws are adopted to penetrate through the glass fiber isolation cover to fix the three-stage TEC temperature controller on the water cooling seat, and a water cooling channel is arranged inside the water cooling seat and is connected with an external liquid cooling radiator.

Further, the feeding and discharging module comprises a linear transplanting module, a feeding station, a discharging station and a material taking station are sequentially arranged on the linear transplanting module, a jacking material supporting module is arranged below the feeding station and the discharging station, the feeding station and the discharging station comprise four corner-protecting vertical plates distributed around, the four corner-protecting vertical plates enclose a stacking groove frame matched with a chip tray, two disc separating modules are symmetrically arranged at two ends of the stacking groove frame, the disc separating modules are used for supporting the chip tray in the stacking groove frame, each disc separating module comprises a disc separating mounting seat and a jaw supporting block hinged in the disc separating mounting seat, a disc separating cylinder and a push rod connected with the disc separating cylinder are arranged at the outer end of each disc separating mounting seat, the push rod penetrates through the disc separating mounting seat to be connected with the bottom of the jaw supporting block, and springs connected with the jaw supporting blocks are arranged at the upper parts of the disc separating mounting seats; the jacking and supporting module comprises a jacking motor, a linkage module and two jacking plates, wherein the jacking motor is connected with the linkage module, the two jacking plates are symmetrically arranged at two ends of the linkage module, the linear transplanting module comprises a linear driving motor and transplanting plates connected with the linear driving motor, the transplanting plates are positioned between the two jacking plates, and the two jacking plates are respectively positioned between the left side of the transplanting plate and the jaw supporting blocks and below the right side of the transplanting plate and the jaw supporting blocks; the claw support block comprises an integrally formed rectangular block and a right trapezoid block positioned at the upper end of the rectangular block, the hypotenuse of the right trapezoid block faces the transplanting plate, the width of the bottom edge of the right trapezoid block is equal to that of the rectangular block, and the fixed edge length of the right trapezoid block is larger than that of the bottom edge of the right trapezoid block.

Further, the testing module comprises a testing frame, a cam lifting module and a testing mounting plate connected with the top of the cam lifting module are arranged in the testing frame, an integrating sphere tester positioned right above the temperature control chip carrier module is arranged on the testing mounting plate, and the cam lifting module is used for driving the integrating sphere tester to lift and contact with a chip in the temperature control chip carrier module for testing; the cam lifting module comprises a motor mounting vertical plate, a servo motor is arranged on the rear side surface of the motor mounting vertical plate, a rotating disc is arranged on the front side surface of the motor mounting vertical plate, a sensing disc is arranged at the rear end of the rotating disc, a sensing sheet is arranged on the outer edge of the sensing disc, a sensor matched with the sensing sheet is arranged at the front end of the motor mounting vertical plate, a cam connected with a driving shaft of the servo motor is arranged in the rotating disc, an annular guide rail arranged on the outer side of the cam is arranged in the rotating disc, a lifting guide rail and a lifting plate matched with the lifting guide rail are arranged at the upper end of the front side surface of the motor mounting vertical plate, a sliding guide wheel is arranged at the lower end of the lifting plate, the sliding guide wheel is arranged between the inner wall of the annular guide rail and the outer wall of the cam, the sliding guide wheel is in contact with the cam, lifting frames are arranged at the upper ends of the lifting plates, sliding guide rails are matched with the lifting frames, and the upper ends of the lifting frames are provided with test mounting plates.

Further, an adapter plate is arranged in the carrier seat, a needle protection block is arranged on the adapter plate, a first double-probe module which sequentially penetrates through the needle protection block and the TEC temperature controller and is arranged at the bottom of the carrier groove is arranged at the front end of the adapter plate, a test plate is arranged at the front end of the integrating sphere tester, a second double-probe module is arranged at the lower end of the test plate, and when the cam lifting module drives the integrating sphere tester to descend to the upper end of the carrier groove, the second double-probe module is contacted with the adapter plate, so that a chip is conducted, and the chip is tested through the integrating sphere tester; the needle protection block is provided with a guide hole and a probe avoiding hole, a guide column matched with the guide hole is arranged on the test board, and the probe avoiding hole is positioned right above the double-probe module II.

Further, the chip side clamp module comprises a side clamp mounting plate and a side clamp arm, the socket cover is provided with a positioning column matched with the side clamp mounting plate, two ends of the side clamp mounting plate are fixed on the socket cover through bolts, the side clamp arm comprises a vertical arm and a horizontal arm which are integrally formed, an inclined plane is arranged on the vertical arm, a compression spring is arranged between the back surface of the vertical arm and the side clamp mounting plate, the front end of the horizontal arm is provided with a clamping surface matched with two adjacent sides of a chip, the carrying groove is provided with a notch matched with the clamping surface, and the surface layer of the clamping surface is wrapped with an indium sheet layer; when the chip is clamped in the carrying groove by the side clamping arms, an annular groove positioned at the outer edge of the carrying groove is formed between the side clamping arms and the socket cover, an annular convex block matched with the annular groove is arranged at the lower side of the front end of the test mounting plate, a sealing ring is sleeved on the annular convex block, a guide groove with an opening gradually reduced is arranged at the front end of the test mounting plate, a through hole matched with the carrying groove is formed in the bottom surface of the guide groove, the upper part of the guide groove is communicated with a light source inlet of the integrating sphere tester, and the through hole is positioned at the upper end of the carrying groove when the cam drives the sliding guide wheel to move to the lowest point.

Further, the sorting and blanking module comprises a material arranging and transplanting module, and a chip blanking module is arranged between the two material arranging and transplanting modules; the material arranging and transplanting module comprises a transverse moving driving device and a transverse moving carrier plate connected with the transverse moving driving device, wherein at least one chip carrier is arranged on the transverse moving carrier plate; the chip unloading module includes unloading and transplants manipulator, a plurality of qualified unloading module and an unqualified unloading module, qualified unloading module with the structure of unqualified unloading module with go up the structure of unloading module unanimous, the unloading is transplanted the removal stroke of manipulator and is located two between the sideslip carrier plate, the unloading is transplanted the manipulator and is used for transferring the chip on the horizontal transfer board to qualified unloading module or in the unqualified unloading module.

Further, the carrier buffer table the removal stroke both ends of going up unloading station and sideslip carrier plate all are provided with pusher dog mechanism, pusher dog mechanism including set up in pusher dog lift cylinder and with the pusher dog pole that pusher dog lift cylinder is connected, the front end of pusher dog pole is equipped with the thumb wheel, the thumb wheel with inclined plane looks adaptation on the perpendicular arm, the thumb wheel is used for promoting the inclined plane and moves backward and loosen the side arm lock, the middle part of pusher dog pole be equipped with the dodge groove of carrying groove looks adaptation.

Further, the three-axis material taking module comprises an X-axis moving device, a Y-axis moving device arranged on the X-axis moving device and a Z-axis moving device arranged on the Y-axis moving device, wherein at least one product absorber is arranged on the Z-axis moving device and is used for absorbing chips, and the size of a suction nozzle of the product absorber is smaller than that of the avoidance groove.

Further, still be provided with the aircraft bonnet on the workstation, the lower extreme of workstation is provided with the electric cabinet, go up the unloading module the triaxial get the material module, carousel test module rotatory get material module and select separately the unloading module all with electric cabinet electric connection.

The beneficial effects of the invention are as follows: 1. through reasonable and ingenious structural design, the chip tray filled with chips is automatically fed and discharged through the discharging module, the chips in the chip tray in the feeding and discharging module are taken to the carrier cache table through the triaxial material taking module, the chips in the carrier cache table are transferred to the turntable testing module through the rotary material taking module, the turntable testing module is provided with a feeding and discharging station, a low-temperature testing station, a normal-temperature testing station and a high-temperature testing station, and each station is provided with a temperature control chip carrier module, so that the chips can be independently controlled in temperature, and the chips in the low-temperature testing station, the normal-temperature testing station and the high-temperature testing station can be respectively tested in the low-temperature state, the normal-temperature state and the high-temperature state under the cooperation of the testing module; after the test result is out, the chip is sorted and discharged through the sorting and discharging module, so that a full-automatic chip three-temperature test process is realized, the test accuracy is improved, and the labor cost is reduced; 2. the TEC temperature controller is arranged in the carrier seat and is matched with the heat conducting block to conduct temperature transmission, so that chips in the carrier groove can be effectively heated or refrigerated; 3. the chip side clamp module arranged in the carrier seat can effectively clamp the chip in the carrier groove, and the chip side clamp can effectively avoid the occurrence of the condition that the chip is easy to be pressed and deformed at a high temperature.

Drawings

FIG. 1 is a schematic diagram of the structure of the present invention;

FIG. 2 is a top view of the present invention;

FIG. 3 is a schematic diagram of a loading and unloading module;

FIG. 4 is an enlarged schematic view of portion A of FIG. 3;

FIG. 5 is a schematic diagram of a split disk module;

FIG. 6 is a cross-sectional view of the split disc module;

FIG. 7 is a schematic diagram of a turret test module;

FIG. 8 is a schematic diagram of a test module;

FIG. 9 is a schematic diagram of a temperature-controlled chip carrier module;

FIG. 10 is an exploded view of a temperature controlled chip carrier module;

FIG. 11 is an exploded view of a chip side clamp module;

FIG. 12 is a partial cross-sectional view of a test module and a temperature controlled chip carrier module during testing;

FIG. 13 is a schematic diagram of the structure between the swing transplanting module and the blanking transplanting manipulator;

FIG. 14 is a schematic diagram of a three-axis take off module;

FIG. 15 is a schematic view of a rotary take-off module;

FIG. 16 is a schematic diagram of a structure between a finger mechanism and a temperature controlled chip carrier module.

Detailed Description

As shown in fig. 1 to 16, in this embodiment, the present invention includes a workbench 1, front ends of the workbench 1 are symmetrically provided with an upper and lower material modules 2, the upper and lower material modules 2 are used for loading and unloading a chip tray 3 loaded with chips 1a, rear ends of the upper and lower material modules 2 are respectively provided with a triaxial material taking module 4, a carrier buffer table 5 is arranged below the tail ends of the triaxial material taking modules 4, the triaxial material taking module 4 is used for taking the chips 1a in the upper and lower material modules 2 to the carrier buffer table 5 or carrying out unloading transfer on the chips 1a tested by the carrier buffer table 5, a turntable test module 6 is arranged at side ends of the carrier buffer table 5, a rotary module 7 is arranged between the carrier buffer table 5 and the turntable test module 6, the rotary module 7 is used for transferring the chips 1a of the carrier buffer table 5 to the turntable test module 6, transferring the chips 1a tested by the turntable test module 6 back to the carrier buffer table 5, or carrying out unloading transfer the chips 1a tested by the carrier buffer table 5 to the carrier buffer table 8 is arranged between the carrier buffer table 5 and the lower material testing module 8, and the carrier buffer table 8 is used for sorting the chips 1a tested by the carrier buffer table 8;

The turntable test module 6 comprises a loading and unloading station 61, a low-temperature test station 62, a normal-temperature test station 63 and a high-temperature test station 64 which are sequentially arranged on the turntable, each station is provided with two temperature-control chip carrier modules 65, each temperature-control chip carrier module 65 is used for heating or refrigerating the placed chip 1a, and a test module 66 matched with the temperature-control chip carrier module 65 is arranged above each of the low-temperature test station 62, the normal-temperature test station 63 and the high-temperature test station 64;

The temperature control chip carrier module 65 is also arranged on the carrier buffer table 5, the temperature control chip carrier module 65 arranged on the turntable test module station 6 and the temperature control chip carrier module 65 arranged on the carrier buffer table 5 both comprise a carrier seat 651, a socket cover 652 is arranged at the top of the carrier seat 651, a water cooling seat 653 is arranged at the bottom of the carrier seat 651, a TEC (thermal electric cooler) 654 is arranged on the water cooling seat 653, a heat conducting block 655 is arranged on the TEC temperature controller 654, a carrier groove 656 which is matched with a chip 1a and penetrates out of the socket cover 652 is arranged in the heat conducting block 655, a chip side clamping module 657 which is positioned at the side end of the carrier groove 656 is arranged at the side end of the socket cover 652, the socket cover 652 is used for limiting and fixing the heat conducting block 655 to the upper end of the TEC, the base seat plate arranged at the bottom of the temperature controller 655 is attached to the temperature controller 654, the base plate is matched with the base plate 655 and is buckled with the heat conducting block 654 through the heat conducting groove 655; the chip-side clip module 657 is used for fixing the chip 1a side clip in the carrier 656.

In this embodiment, the heat conducting block 655 is an annular ceramic heat conducting block, the annular ceramic heat conducting block can effectively conduct temperature transfer, a temperature sensor is arranged in the annular ceramic heat conducting block, the temperature sensor adopts a K-type thermocouple, the K-type thermocouple is penetratingly fixed in the ceramic heat conducting block, the K-type thermocouple can effectively detect real-time temperature of the heat conducting block 655, the TEC temperature controller 654 is a three-stage TEC temperature controller, an NTC sensor is arranged in the three-stage TEC temperature controller, a silicone grease connecting layer or a heat conducting glue connecting layer is arranged between the water cooling seat 653 and the three-stage TEC temperature controller, the design is convenient for subsequent maintenance, a glass fiber isolation cover 658 is arranged on the three-stage TEC temperature controller, the three-stage TEC temperature controller is fixed on the water cooling seat 653 by adopting screws to penetrate through the glass fiber isolation cover 658, a water cooling channel is arranged in the water cooling seat 653, and the water cooling channel is connected with an external liquid cooler; in conclusion, the structural design of the temperature control chip carrier module is convenient to assemble and disassemble, and the integrated design of parts is realized, so that the whole structure is compact and small, and the temperature can be effectively controlled.

In this embodiment, the feeding and discharging module 2 includes a linear transplanting module 21, a feeding station 22, a discharging station 23 and a material taking station 24 are sequentially disposed on the linear transplanting module 21, jacking and supporting modules 25 are disposed below the feeding station 22 and the discharging station 23, the feeding station 22 and the discharging station 23 include four corner-protecting vertical plates 26 distributed around, the four corner-protecting vertical plates 26 enclose a stacking frame adapted to the chip tray 3, two tray dividing modules 27 are symmetrically disposed at two ends of the stacking frame, the tray dividing modules 27 are used for lifting the chip tray 3 in the stacking frame, The tray dividing module 27 comprises a tray dividing mounting seat 271 and a claw supporting block 272 hinged in the tray dividing mounting seat 271, a tray dividing air cylinder 273 and a push rod 274 connected with the tray dividing air cylinder 273 are arranged at the outer end of the tray dividing mounting seat 271, the push rod 274 penetrates through the tray dividing mounting seat 271 to be connected with the bottom of the claw supporting block 272, and a spring 275 connected with the claw supporting block 272 is arranged at the upper part of the tray dividing mounting seat 271; The jacking and supporting module 25 comprises a jacking motor 251, a linkage module 252 and two jacking plates 253, the jacking motor 251 is connected with the linkage module 252, the linkage module 252 can adopt linkage plates, the two jacking plates 253 are symmetrically arranged at two ends of the linkage module 252, the linear transplanting module 21 comprises a linear driving motor 211 and a transplanting plate 212 connected with the linear driving motor 211, the transplanting plate 212 is positioned between the two jacking plates 253, and the two jacking plates 253 are respectively positioned between the left side of the transplanting plate 212 and the jaw support blocks 272 and below between the right side of the transplanting plate 212 and the jaw support blocks 272; the jaw supporting block 272 comprises an integrally formed rectangular block and a right trapezoid block positioned at the upper end of the rectangular block, the inclined edge of the right trapezoid block faces to the transplanting plate 212, the width of the bottom edge of the right trapezoid block is equal to that of the rectangular block, and the fixed edge length of the right trapezoid block is larger than that of the bottom edge of the right trapezoid block; The feeding and discharging process of the design is as follows: the chip trays filled with chips are stacked after a stacking groove frame of a loading station, the two jacking plates of the jacking and supporting module support the chip trays in the stacking groove frame, then a tray separating cylinder of the tray separating pneumatic module drives a claw supporting block to be unfolded, so that the jacking plates can drive the chip trays to move to a transplanting plate, when the chip tray at the bottommost layer descends to the horizontal position of the tray separating pneumatic module, the tray separating pneumatic module resets to continuously lift the chip trays except the chip tray at the bottommost layer in the stacking groove frame of the loading station, when the jacking plates descend to the lower end than the transplanting plate, the taken chip tray is smoothly transferred to the transplanting plate, Then the chip tray is driven to move to a material taking station through a linear driving device, then a triaxial material taking module picks up and loads chips in the chip tray, after the chips of the chip tray are taken, the transplanting plate drives the chip tray to move to a material discharging station, then two jacking plates of a jacking material supporting module below the material discharging station jack empty chip trays on the transplanting plate to a tray dividing pneumatic module, the tray dividing pneumatic module is opened, and meanwhile the jacking driving device continuously pushes the empty chip trays to ascend, so that the empty chip trays enter a stacking groove frame, the tray dividing pneumatic module is reset; and after the empty chip tray is supported by the lifting driving device at the discharging station, the transplanting plate can be moved to the feeding station, at the moment, the full chip tray is taken by the lifting plate in the feeding station, after the transplanting plate is moved in place, the chip tray is directly lowered by the lifting plate to be transferred to the transplanting plate, so that the loading and unloading process of the chip tray is finished, the loading and unloading efficiency of the chip tray is also improved, and the full chip tray can be fed to the stacking groove frame or the empty chip tray can be fed from the stacking groove frame at any time.

In this embodiment, the test module 66 includes a test frame 661, a cam lifting module 662 and a test mounting board 663 connected to the top of the cam lifting module 662 are disposed in the test frame 661, an integrating sphere tester 664 located right above the temperature control chip carrier module 65 is disposed on the test mounting board 663, and the cam lifting module 662 is used for driving the integrating sphere tester 664 to lift and contact with the chip 1a in the temperature control chip carrier module 65 for testing; the cam lifting module 662 comprises a motor mounting vertical plate 6621, a servo motor 6622 is arranged on the rear side surface of the motor mounting vertical plate 6621, a rotating disc 6623 is arranged on the front side surface of the motor mounting vertical plate 6621, an induction disc is arranged at the rear end of the rotating disc 6623, an induction piece is arranged on the outer edge of the induction disc, a sensor matched with the induction piece is arranged at the front end of the motor mounting vertical plate 6621, a cam 6624 connected with a driving shaft of the servo motor 6622 is arranged in the rotating disc 6623, an annular guide rail positioned on the outer side of the cam 6624 is arranged in the rotating disc 6623, a lifting guide rail and a lifting plate 6625 matched with the lifting guide rail are arranged at the upper end of the front side surface of the motor mounting vertical plate 6621, a sliding guide 6626 is arranged at the lower end of the lifting plate 6625, the sliding guide rail is arranged between the inner wall of the annular guide rail and the outer wall of the cam 6624, a guide wheel 6626 is contacted with the inner wall 6624 of the cam 6624, and a lifting guide wheel 6624 is provided with a lifting guide rail 6625 arranged at the lifting guide rail of the lifting bracket and a lifting bracket of the test device is provided with a lifting guide rail 6628, and a lifting ball is arranged at the lifting bracket of the test device and the test device is provided with a lifting bracket 6628; the design adopts the cam lifting module to drive the integrating sphere tester to descend the test chip, can effectively control the test beat, can precisely control the precision of the descending distance, and avoids collision to influence the service life.

In this embodiment, an adapter plate 659 is disposed in the carrier seat 651, a needle protection block is disposed on the adapter plate 659, a first dual-probe module 6510 sequentially passing through the needle protection block and the TEC temperature controller 654 and disposed at the bottom in the carrier groove 656 is disposed at the front end of the adapter plate 659, a test plate 6641 is disposed at the front end of the integrating sphere tester 664, a second dual-probe module 6642 is disposed at the lower end of the test plate 6641, and when the cam lifting module 662 drives the integrating sphere tester 664 to descend to the upper end of the carrier groove 656, the second dual-probe module 6642 contacts the adapter plate 659, thereby conducting the chip 1a and testing the chip 1a by the integrating sphere tester 664; the needle protection block is provided with a guide hole and a probe avoiding hole, the test board 6641 is provided with a guide column matched with the guide hole, the probe avoiding hole is positioned right above the double-probe module II 6642, and the design can enable the double-probe module II to be contacted with the adapter board stably, so that the chip is conducted.

In this embodiment, the chip side clamping module 657 includes a side clamping mounting plate 6571 and a side clamping arm 6572, the socket cover 652 is provided with a positioning column adapted to the side clamping mounting plate 6571, two ends of the side clamping mounting plate 6571 are fixed on the socket cover 652 by bolts, the side clamping arm 6572 includes an integrally formed vertical arm and a horizontal arm, the vertical arm is provided with an inclined plane 6573, a compression spring 6574 is disposed between the back surface of the vertical arm and the side clamping mounting plate 6571, the front end of the horizontal arm is provided with a clamping surface 6575 adapted to two adjacent sides of the chip, the carrier groove 656 is provided with a notch adapted to the clamping surface 6575, and the surface layer of the clamping surface 6575 is wrapped with an indium sheet layer; when the side clamping arms 6572 clamp the chip in the carrier groove 656, an annular groove 6576 positioned at the outer edge of the carrier groove 656 is formed between the side clamping arms 6572 and the socket cover 652, an annular projection matched with the annular groove 6576 is arranged at the lower side of the front end of the test mounting plate 663, and a sealing ring is sleeved on the annular projection, so that when the cam lifting module drives the integrating sphere tester to descend for testing, the annular projection is contacted with the annular groove, and a better light-tight sealing space is provided for testing; the front end of the test mounting plate 663 is provided with a guide groove 6578 with a gradually reduced opening, the bottom surface of the guide groove 6578 is provided with a through hole 6579 matched with the carrying groove 656, the upper part of the guide groove 6578 is communicated with the light source inlet of the integrating sphere tester 664, and when the cam 6624 drives the sliding guide wheel 6626 to move to the lowest point, the through hole 6579 is positioned at the upper end of the carrying groove 656, so that the design is favorable for the integrating sphere tester to test a chip better.

In this embodiment, the sorting and blanking module 8 includes a material arranging and transplanting module 81, and a chip blanking module is disposed between the two material arranging and transplanting modules 81; the material arranging and transplanting module 81 comprises a transverse moving driving device 83 and a transverse moving carrier plate 84 connected with the transverse moving driving device 83, and at least one chip carrier 85 is arranged on the transverse moving carrier plate 84; the chip unloading module includes unloading and transplants manipulator 82, a plurality of qualified unloading module 83 and a unqualified unloading module 84, qualified unloading module 83 with the structure of unqualified unloading module 84 is unanimous with go up unloading module 2, the removal stroke that the manipulator 82 was transplanted in the unloading is located two between the sideslip carrier plate 84, the manipulator 82 is transplanted in the unloading is used for transferring the chip 1a on the sideslip carrier plate 84 to qualified unloading module 83 or in the unqualified unloading module 84.

In this embodiment, the moving stroke both ends of the carrier buffer table 5, the loading and unloading station 61 and the lateral moving carrier plate 84 are provided with a pusher dog mechanism 9, the pusher dog mechanism 9 includes a pusher dog lifting cylinder 91 and a pusher dog lever 92 connected with the pusher dog lifting cylinder 91, the front end of the pusher dog lever 92 is provided with a pusher dog 93, the pusher dog 93 is matched with an inclined plane 6573 on the vertical arm, the pusher dog 93 is used for pushing the inclined plane 6573 to move backwards to loosen the side clamping arm 6572, the middle part of the pusher dog lever 92 is provided with an avoidance groove 94 matched with the loading groove 656, and the design is used for pushing the inclined plane to move backwards to loosen the side clamping arm under the driving of the pusher dog lifting cylinder, thereby facilitating the loading and unloading of chips.

In this embodiment, the three-axis material taking module 4 includes an X-axis moving device, a Y-axis moving device disposed on the X-axis moving device, and a Z-axis moving device disposed on the Y-axis moving device, at least one product suction device 41 is disposed on the Z-axis moving device, the product suction device 41 is configured to suck the chip 1a, and a size of a suction nozzle of the product suction device 41 is smaller than a size of the avoidance groove 94.

In this embodiment, the rotary material taking module 7 includes a rotary frame, a rotary motor 71 and a rotary mounting plate 72 connected to the rotary motor 71 are disposed on the rotary frame, and the product suction tool 41 is disposed around the rotary mounting plate 72.

In this embodiment, the workbench 1 is further provided with a hood, the hood is provided with a plurality of channel openings adapted to the qualified discharging module 83, the unqualified discharging module 84 and the feeding and discharging module 2, an electric cabinet is disposed at the lower end of the workbench 1, and the feeding and discharging module 2, the triaxial material taking module 4, the turntable test module 6, the rotary material taking module 7 and the sorting and discharging module 8 are electrically connected with the electric cabinet.

In this embodiment, the working process of the present invention is: 1. the feeding and discharging module moves the chip tray filled with chips to a material taking station; 2. the three-axis material taking module simultaneously absorbs two chips in the chip tray and moves and places the chips on the carrier buffer table, and meanwhile the carrier buffer table is at a refrigerating temperature of-45 to-50 ℃, so that the chips can be placed in the carrier buffer table to cool the chips, and the beat of the turntable test module is waited for blanking; 3. transferring the chip into a loading and unloading station through the rotary material taking module, and waiting for the next beat to enter a low-temperature testing station; 4. after the chip is subjected to low-temperature test at the low-temperature test station, the chip enters the normal-temperature test station, and at the moment, the temperature control chip carrier module is quickly heated to a normal-temperature state, so that the chip in the low-temperature state is recovered to the normal-temperature state through heat transfer, and then the normal-temperature test is performed; 5. after the normal temperature test is finished, the temperature control chip carrier module continues to be heated to 155 ℃ and continuously heats the chip for about 10 seconds, so that the chip reaches the required 150 ℃ for high temperature test; 6. after the high-temperature test is finished, the feeding and discharging stations are rotated back, the temperature of the temperature control chip carrier module is adjusted to be the refrigeration temperature, and the temperature control chip carrier module is further accelerated to be lowered from a high-temperature state through the water cooler; 7. the rotary material taking module transfers the tested chips back to the carrier buffer table and transfers the chips to the material arranging and transplanting module through the three-axis material taking module; 8. the material arranging and transplanting module drives the chip to move to the material discharging and transplanting manipulator, and the chip is sorted to the qualified material discharging module or the unqualified material discharging module through the test result.

The invention is applied to the technical field of chip testing.

While the embodiments of this invention have been described in terms of practical aspects, they are not to be construed as limiting the meaning of this invention, and modifications to the embodiments and combinations with other aspects thereof will be apparent to those skilled in the art from this description.

Claims (10)

1. The utility model provides a three temperature test equipment of chip which characterized in that: the device comprises a workbench (1), wherein the front end of the workbench (1) is symmetrically provided with an upper discharging module (2), the upper discharging module (2) is used for loading a chip tray (3) filled with chips (1 a) and unloading the empty chip tray (3), the rear ends of the upper discharging module (2) are respectively provided with a triaxial material taking module (4), a carrier buffer table (5) is arranged below the tail end of the triaxial material taking module (4), the triaxial material taking module (4) is used for taking chips (1 a) in the upper discharging module (2) to the carrier buffer table (5) or carrying out discharging transfer on the chips (1 a) tested by the carrier buffer table (5), a rotary table test module (6) is arranged at the side end of the carrier buffer table (5), a rotary module (7) is arranged between the carrier buffer table (5) and the rotary table test module (6), the rotary module (7) is used for transferring the chips (1 a) of the carrier buffer table (5) to the carrier buffer table (6) and carrying out discharging transfer on the carrier buffer table (5) to the carrier buffer table (5) and carrying out discharging transfer on the carrier buffer table (1 a) to the carrier buffer table (5), the sorting and blanking module (8) is used for carrying out tray separation and blanking on the chips (1 a) tested by the carrier buffer table (5);

the turntable test module (6) comprises a loading and unloading station (61), a low-temperature test station (62), a normal-temperature test station (63) and a high-temperature test station (64) which are sequentially arranged on the turntable, each station is at least provided with a temperature control chip carrier module (65), the temperature control chip carrier modules (65) are used for heating or refrigerating the placed chips (1 a), and test modules (66) which are matched with the temperature control chip carrier modules (65) are arranged above the low-temperature test station (62), the normal-temperature test station (63) and the high-temperature test station (64);

The temperature control chip carrier module (65) arranged on the turntable test module station (6) and the temperature control chip carrier module (65) arranged on the carrier cache station (5) comprise carrier seats (651), a socket cover (652) is arranged at the top of each carrier seat (651), a water cooling seat (653) is arranged at the bottom of each carrier seat (651), a TEC temperature controller (654) is arranged on each water cooling seat (653), a heat conducting block (655) is arranged on each TEC temperature controller (654), a carrier groove (656) which is matched with a chip (1 a) and penetrates out of each socket cover (652) is formed in each heat conducting block (655), a chip side clamp module (657) positioned at the side end of each carrier groove (656) is arranged at the side end of each socket cover (652), and each socket cover (652) is used for limiting and fixing the heat conducting block (655) at the upper end of each carrier groove (656) in each chip clamp module (657), and the heat conducting blocks (655) are used for fixing the heat conducting blocks (657) in the corresponding chip side clamp modules (656 a) on the chip side clamp modules (656;

the test module (66) comprises a test frame (661), a cam lifting module (662) and a test mounting plate (663) connected with the top of the cam lifting module (662) are arranged in the test frame (661), and an integrating sphere tester (664) positioned right above the temperature control chip carrier module (65) is arranged on the test mounting plate (663);

The chip side clamping module (657) comprises a side clamping mounting plate (6571) and a side clamping arm (6572), a positioning column matched with the side clamping mounting plate (6571) is arranged on the socket cover (652), two ends of the side clamping mounting plate (6571) are fixed on the socket cover (652) through bolts, the side clamping arm (6572) comprises a vertical arm and a horizontal arm which are integrally formed, an inclined surface (6573) is arranged on the vertical arm, a compression spring (6574) is arranged between the back surface of the vertical arm and the side clamping mounting plate (6571), a clamping surface (6575) matched with two adjacent sides of a chip is arranged at the front end of the horizontal arm, a notch matched with the clamping surface (6575) is arranged in the carrier groove (656), and an indium sheet layer is wrapped on the surface layer of the clamping surface (6575); when the chip is clamped in the carrier groove (656) by the side clamping arms (6572), an annular groove (6576) positioned at the outer edge of the carrier groove (656) is formed between the side clamping arms (6572) and the socket cover (652), an annular projection matched with the annular groove (6576) is arranged on the lower side of the front end of the test mounting plate (663), a sealing ring is sleeved on the annular projection, a guide groove (6578) with an opening gradually reduced is arranged on the front end of the test mounting plate (663), a through hole (6579) matched with the carrier groove (656) is formed in the bottom surface of the guide groove (6578), and the upper part of the guide groove (6578) is communicated with a light source inlet of the integrating sphere tester (664).

2. The chip tri-temperature test apparatus of claim 1, wherein: the utility model discloses a solar energy heat-conducting module, including heat conduction piece (655), ceramic heat conduction piece, temperature sensor, temperature controller (653) and outer liquid cooling radiator, heat conduction piece (655) is annular ceramic heat-conducting piece, be provided with temperature sensor in the annular ceramic heat-conducting piece, temperature sensor adopts K type thermocouple, and this K type thermocouple pierces through to be fixed inside the ceramic heat-conducting piece, TEC temperature controller (654) is tertiary TEC temperature controller, tertiary TEC temperature controller embeds has NTC sensor, water cooling seat (653) with be provided with silicone grease tie layer or heat conduction glue tie layer between the tertiary TEC temperature controller, just be provided with glass fiber isolation lid (658) on the tertiary TEC temperature controller to adopt the screw to pass glass fiber isolation lid (658) will tertiary TEC temperature controller is fixed in on water cooling seat (653), water cooling seat (653) inside is provided with the water cooling channel, the water cooling channel is connected with outside liquid cooling radiator.

3. The chip tri-temperature test apparatus of claim 2, wherein: the feeding and discharging module (2) comprises a linear transplanting module (21), a feeding station (22), a discharging station (23) and a material taking station (24) are sequentially arranged on the linear transplanting module (21), a jacking material supporting module (25) is arranged below the feeding station (22) and the discharging station (23), the feeding station (22) and the discharging station (23) comprise four corner-protecting vertical plates (26) distributed on the periphery, the four corner-protecting vertical plates (26) are surrounded to form a stacking groove frame matched with a chip tray (3), two tray dividing modules (27) are symmetrically arranged at two ends of the stacking groove frame, the tray dividing modules (27) are used for supporting the chip tray (3) in the stacking groove frame, each tray dividing module (27) comprises a tray dividing mounting seat (271) and a supporting block (272) hinged in the tray dividing mounting seat (271), the outer end of each tray dividing mounting seat (271) is provided with a tray dividing seat (273) and a jack catch (274) connected with a jack catch (274) of a push rod (271) through a cylinder, and the jack catch (274) is arranged on the tray dividing seat (273); the jacking and supporting module (25) comprises a jacking motor (251), a linkage module (252) and two jacking plates (253), wherein the jacking motor (251) is connected with the linkage module (252), the two jacking plates (253) are symmetrically arranged at two ends of the linkage module (252), the linear transplanting module (21) comprises a linear driving motor (211) and a transplanting plate (212) connected with the linear driving motor (211), the transplanting plate (212) is positioned between the two jacking plates (253), and the two jacking plates (253) are respectively positioned between the left side of the transplanting plate (212) and the jaw supporting block (272) and below between the right side of the transplanting plate (212) and the jaw supporting block (272); the claw support block (272) comprises an integrally formed rectangular block and a right trapezoid block positioned at the upper end of the rectangular block, the inclined edge of the right trapezoid block faces the transplanting plate (212), the width of the bottom edge of the right trapezoid block is equal to that of the rectangular block, and the edge fixing length of the right trapezoid block is larger than that of the bottom edge of the right trapezoid block.

4. A chip tri-temperature testing apparatus according to claim 3, wherein: the cam lifting module (662) is used for driving the integrating sphere tester (664) to lift and contact with the chip (1 a) in the temperature control chip carrier module (65) for testing; the cam lifting module (662) comprises a motor mounting vertical plate (6621), a servo motor (6622) is arranged on the rear side surface of the motor mounting vertical plate (6621), a rotating disc (6623) is arranged on the front side surface of the motor mounting vertical plate (6621), an induction disc is arranged at the rear end of the rotating disc (6623), an induction piece is arranged on the outer edge of the induction disc, a sensor matched with the induction piece is arranged at the front end of the motor mounting vertical plate (6621), a cam (6624) connected with a driving shaft of the servo motor (6622) is arranged in the rotating disc (6623), an annular guide rail positioned on the outer side of the cam (6624) is arranged in the rotating disc (6623), a lifting guide rail and a lifting plate (6625) matched with the lifting guide rail are arranged at the upper end of the front side surface of the motor mounting vertical plate (6621), a sliding guide wheel (6626) is arranged at the lower end of the lifting plate (6625), the sliding guide wheel (6626) is arranged on the inner wall (6624) of the annular guide rail and is matched with the lifting guide rail (6624) on the lifting guide rail (6624) and the lifting guide rail (661) which is arranged on the two sides of the lifting guide rail (6624), the upper end of the lifting frame (6627) is provided with the test mounting plate (663).

5. The chip tri-temperature testing apparatus according to claim 4, wherein: an adapter plate (659) is arranged in the carrier seat (651), a needle protection block is arranged on the adapter plate (659), a first double-probe module (6510) which sequentially penetrates through the needle protection block and the TEC temperature controller (654) and is arranged at the inner bottom of the carrier groove (656) is arranged at the front end of the adapter plate (659), a test plate (6641) is arranged at the front end of the integrating sphere tester (664), a second double-probe module (6642) is arranged at the lower end of the test plate (6641), and when the cam lifting module (662) drives the integrating sphere tester (664) to descend to the upper end of the carrier groove (656), the second double-probe module (6642) is contacted with the adapter plate (659), so that a chip (1 a) is conducted, and the chip (1 a) is tested through the integrating sphere tester (664); the needle protection block is provided with a guide hole and a probe avoiding hole, a guide column matched with the guide hole is arranged on the test board (6641), and the probe avoiding hole is positioned right above the double-probe module II (6642).

6. The chip three-temperature test apparatus according to claim 5, wherein: when the cam (6624) drives the sliding guide wheel (6626) to move to the lowest point, the through hole (6579) is positioned at the upper end of the carrying groove (656).

7. The chip tri-temperature testing apparatus according to claim 6, wherein: the sorting and blanking module (8) comprises a material arranging and transplanting module (81), and a chip blanking module is arranged between the two material arranging and transplanting modules (81); the material arranging and transplanting module (81) comprises a transverse moving driving device (83) and a transverse moving carrier plate (84) connected with the transverse moving driving device (83), wherein at least one chip carrier (85) is arranged on the transverse moving carrier plate (84); the chip unloading module includes unloading and transplants manipulator (82), a plurality of qualified unloading module (83) and an unqualified unloading module (84), qualified unloading module (83) with the structure of unqualified unloading module (84) with go up the structure of unloading module (2) unanimous, the removal stroke that the manipulator (82) was transplanted in the unloading is located two between sideslip carrier plate (84), unloading is transplanted manipulator (82) and is used for shifting chip (1 a) on horizontal transfer board (84) to qualified unloading module (83) or in unqualified unloading module (84).

8. The chip tri-temperature testing apparatus according to claim 7, wherein: the utility model provides a carrier buffer table (5) unloading station (61) and sideslip carrier plate (84) remove stroke both ends all are provided with pusher dog mechanism (9), pusher dog mechanism (9) including set up in pusher dog lift cylinder (91) and with pusher dog pole (92) that pusher dog lift cylinder (91) are connected, the front end of pusher dog pole (92) is equipped with thumb wheel (93), thumb wheel (93) with inclined plane (6573) looks adaptation on the perpendicular arm, thumb wheel (93) are used for promoting inclined plane (6573) back to shift loosen side arm lock (6572), the middle part of pusher dog pole (92) be equipped with dodge groove (94) of carrier groove (656) looks adaptation.

9. The chip tri-temperature testing apparatus according to claim 8, wherein: the three-axis material taking module (4) comprises an X-axis moving device, a Y-axis moving device arranged on the X-axis moving device and a Z-axis moving device arranged on the Y-axis moving device, wherein at least one product absorber (41) is arranged on the Z-axis moving device, the product absorber (41) is used for absorbing a chip (1 a), and the size of a suction nozzle of the product absorber (41) is smaller than the size of the avoidance groove (94).

10. The chip tri-temperature test apparatus of claim 1, wherein: still be provided with the aircraft bonnet on workstation (1), the lower extreme of workstation (1) is provided with the electric cabinet, go up unloading module (2) triaxial get material module (4) carousel test module (6) rotatory get material module (7) and select separately unloading module (8) all with electric cabinet electric connection.