CN213398813U

CN213398813U - Chip test assembly line

Info

Publication number: CN213398813U
Application number: CN202021792538.8U
Authority: CN
Inventors: 王树锋; 陈阳
Original assignee: Qianhai Jingyun Shenzhen Storage Technology Co ltd
Current assignee: Qianhai Jingyun Shenzhen Storage Technology Co ltd
Priority date: 2020-08-24
Filing date: 2020-08-24
Publication date: 2021-06-08
Anticipated expiration: 2030-08-24

Abstract

The application discloses a chip testing assembly line, which sequentially comprises an automatic feeding machine, a material turnover device, an auxiliary feeding machine, a testing machine and an automatic discharging device, wherein all the parts are connected through a transmission line; grabbing the chip by an automatic feeding machine; the testing machine detects the chip; and the automatic blanking device sorts the chips. The whole-process automatic test of the chip test assembly line is of a combined structure and can be flexibly combined, so that the whole test line is always in the highest efficiency state; the chip aging test device has the capability of quickly switching high-low temperature wide temperature regions, and can replace the traditional aging equipment for the aging of a chip test link; the renewable advantage of the test module is fully utilized, the multi-task bringing is realized, and the flexible test device has the remarkable characteristic of flexible manufacturing; aiming at the characteristic of frequent updating of IC test, a scheme of modularizing a test structure body is adopted, and continuous availability of equipment is provided for rapid product replacement.

Description

Chip test assembly line

Technical Field

The application relates to the technical field of chip testing, in particular to a chip testing assembly line.

Background

With the change of the production process, more and more automatic devices are put into production line operation to replace manual work to carry out simple and repeated assembly line operation, so that the labor cost is reduced, and the productivity and the enterprise competitiveness are improved. At present, a chip automatic test assembly line is widely used, but in other links, such as loading, unloading, material transferring and the like of chips, further processing work needs to be done manually, so that the workload is increased, the production efficiency is reduced, the productivity is influenced, and meanwhile, the production cost is also increased.

Most of the current chip test pipelines are in rigid fit, and the response to different chip test requirements is weak, for example, on the problems of maintaining the production efficiency of the test line, and adapting the conversion and updating of test chips, the current pipelines cannot meet the requirements and cannot be quickly adjusted along with the change of the chip test condition.

SUMMERY OF THE UTILITY MODEL

The chip testing assembly line mainly solves the technical problems that the automation degree of the existing chip testing assembly line is low, the production efficiency of the testing assembly line cannot be guaranteed to be always high, and the chip testing assembly line cannot be well adapted to the testing requirement change caused by updating of a testing chip.

In order to solve the technical problem, the application adopts a technical scheme that: the chip testing assembly line sequentially comprises an automatic feeding machine, a material turnover device, an auxiliary feeding machine, a testing machine and an automatic discharging device, wherein the automatic feeding machine, the material turnover device, the auxiliary feeding machine and the automatic discharging device are connected through a transmission line, and the testing machine is arranged on the back of the auxiliary feeding machine; the automatic feeding machine is used for grabbing the chip to be detected and transmitting the chip to be detected to the transmission line; the material transfer device is used for providing a chip testing module for the automatic feeding machine; the auxiliary feeding machine is used for receiving the chips to be detected transmitted by the automatic feeding machine, transmitting the chips to be detected to the testing machine and transmitting the detected chips tested by the testing machine to the transmission line; the tester is used for detecting the chip to be detected; the automatic blanking device is used for receiving the detected chips and sorting and collecting the detected chips.

Compared with the prior art, the chip test assembly line of the application has the following beneficial effects: the whole process of chip testing is full-automatic from chip loading, testing to chip unloading, the problem of low automation degree of the existing chip testing assembly line is solved, the manual workload is reduced, the production efficiency and the productivity are improved, and the production cost is also reduced; the chip testing assembly line is of a combined structure, can be flexibly combined according to different chip testing methods, and increases or reduces the number of testing machines, so that the whole testing line is always in the highest efficiency state; the chip test assembly line has the capability of quickly switching high-low temperature wide temperature areas, and can replace traditional aging equipment for the problems of aging (BURN IN) and the like of a chip test link; the chip test assembly line fully utilizes the renewable and updating advantages of the test module, realizes multi-task bringing, and has the remarkable characteristic of flexible manufacturing; the chip test assembly line adopts a scheme of modularizing the test structure body aiming at the characteristic of frequent updating of IC test, and provides continuous availability of equipment for rapid product alternation.

Drawings

FIG. 1 is a schematic diagram of a chip test pipeline according to the present application;

FIG. 2 is a schematic diagram of a transmission line structure of a chip test pipeline according to the present application;

FIG. 3 is a schematic structural diagram of an automatic feeding machine of the chip testing pipeline of the present application;

FIG. 4 is a top view of a table of the automatic feeder;

FIG. 5 is a schematic structural view of a mounting frame of the automatic feeder;

fig. 6 is a bottom view of a mounting bracket of the automatic feeder;

FIG. 7 is another perspective view of the gripping mechanism of the automatic feeder;

FIG. 8 is a bottom view of the table of the automatic feeder;

FIG. 9 is a schematic structural diagram of a chip test module according to the present application;

FIG. 10 is a schematic view of the present application after the removal of the chip positioning mechanism shown in FIG. 9;

FIG. 11 is a schematic diagram of a chip positioning mechanism of the chip test module of the present application;

FIG. 12 is a schematic view of a chip pocket of the chip positioning mechanism of the present application;

FIG. 13 is a schematic view of the cover plate of the chip positioning mechanism of the present application;

FIG. 14 is a schematic structural diagram of a positioning block of the chip positioning mechanism of the present application;

FIG. 15 is a schematic structural diagram of a material transfer device of the chip test line of the present application;

FIG. 16 is a side perspective view of a material transfer device of the present application chip test line;

FIG. 17 is a schematic view of the present application showing the structure of the transfer cart of FIG. 15;

fig. 18 is a perspective view of the internal structure of the radio cassette player of fig. 15 of the present application;

fig. 19 is a schematic view of the lateral movement mechanism of the radio cassette player of the present application;

fig. 20 is a schematic view of the other side of the traverse mechanism of the radio and player of the present application;

fig. 21 is a schematic structural view of a first embodiment of an auxiliary feeder in the present application;

FIG. 22 is a side view of the auxiliary feeder of the present application;

FIG. 23 is a schematic view of the jaw assembly of the auxiliary feeder of the present application;

fig. 24 is a schematic structural view of a second embodiment of an auxiliary feeder in the present application;

FIG. 25 is a schematic diagram of a tester according to the present application;

FIG. 26 is a schematic structural diagram of a test module according to the present application;

FIG. 27 is a bottom view of the test module of the present application with the protective cover removed;

FIG. 28 is a schematic structural view of a test indenter of the present application;

FIG. 29 is a perspective view of a test indenter of the present application;

FIG. 30 is a schematic view of the structure of the automatic blanking device of the present application;

fig. 31 is a schematic structural view of a sorting and arranging machine of the automatic blanking device in the present application;

FIG. 32 is a bottom view of the alignment shipping mechanism of the present application;

FIG. 33 is an assembly view of the sorting telescopic cylinder and the sorting screw module in the aligning and transporting mechanism of the present application;

FIG. 34 is a schematic view of a transfer mechanism of the present application aligning a transport mechanism;

fig. 35 is a schematic structural view of a blanking machine of the automatic blanking device in the present application;

FIG. 36 is a bottom view of the first displacement mechanism of the automatic blanking apparatus of the present application;

FIG. 37 is an assembly view of the feed expansion cylinder and feed screw module of the first displacement mechanism of the present application;

FIG. 38 is a schematic view of the unlocking device of the chip test module according to the present invention;

FIG. 39 is a schematic view of the chip test module unlocking device and the assembly of the chip test module according to the present application;

FIG. 40 is a flow chart of the chip testing method of the present application.

Detailed Description

Referring to fig. 1, fig. 1 is a schematic view of a chip testing assembly line according to the present application, the chip testing assembly line sequentially includes an automatic feeding machine 1, a material transferring device 2, an auxiliary feeding machine 3, a testing machine 4 and an automatic discharging device 5, the automatic feeding machine 1, the material transferring device 2, the auxiliary feeding machine 3 and the automatic discharging device 5 are connected by a transmission line 6, and the testing machine 4 is disposed on the back of the auxiliary feeding machine 3;

automatic feeding machine 1 is used for snatching and waits to detect the chip, and will wait to detect the chip and transmit to transmission line 6 on. Specifically, the chip to be detected is placed in a containing device, such as a tray, before detection, the chip needs to be placed in the special chip testing module 7 when detection is performed, and the chip to be detected is transferred to the tray from the chip testing module 7 after detection is completed. The automatic feeding machine 1 is used for transferring the chip to be detected from the tray into the chip testing module 7 and flowing into the next process.

The material transfer device 2 is used for providing the chip testing module 7 for the automatic feeding machine 1 and transferring the chip testing module 7.

The auxiliary feeding machine 3 is used for receiving the chips to be detected transmitted by the automatic feeding machine 1, transmitting the chips to be detected to the testing machine 4, and transmitting the detected chips tested by the testing machine 4 to the transmission line 6. Specifically, the auxiliary feeder 3 is used for feeding and discharging the testing machine 4.

The testing machine 4 is used for detecting the chip to be detected.

The automatic blanking device 5 is used for receiving the detected chips and sorting and collecting the detected chips. Specifically, automatic unloader 5 is used for sorting the chip that has detected, rejects the chip that tests unusually, waits for further detection or manual processing, transfers the chip that tests normally to the tray in from chip test module 7.

The transmission lines 6 in this application include at least a module-under-test transmission line 61, a module-under-test transmission line 62, and an empty module transmission line 63. Referring to fig. 2, fig. 2 is a schematic diagram of transmission lines of the chip testing assembly line of the present application, in which a transmission line 61 of a module to be tested and a transmission line 62 of a module to be tested are arranged in parallel in a horizontal direction, and a transmission line 61 of a module to be tested and a transmission line 63 of an empty module are arranged in parallel in a vertical direction. The transmission line 6 is used for transmitting the chip test module 7, and it can be understood that the chip test module 7 for placing the chip to be tested is transmitted on the module transmission line 61 to be tested, the chip test module 7 for placing the chip detected by the tester 4 is transmitted on the module transmission line 62 to be tested, the chip test module 7 for not placing the chip is transmitted on the module transmission line 63, and different chip test modules 7 are transmitted through different transmission lines to avoid mixing.

The module transmission line 61 that awaits measuring in this application, module transmission line 62 and empty module transmission line 63 are belt drive, and chip test module 7 transmits on the belt.

Referring to fig. 3, fig. 3 is a schematic structural diagram of an automatic feeding machine 1 according to the present application, where the automatic feeding machine 1 includes a feeding control system, a rack 11, a carrier 12, a grabbing mechanism 13, and a detection device 14; the feeding control system is used for controlling the operation of the grabbing mechanism 13 and the detection device 14; the frame 11 is used for bearing a carrier 12, a grabbing mechanism 13 and a detection device 14; the carrier 12 is used for placing materials; the grabbing mechanism 13 is used for grabbing the materials in the carrier 12 and displacing the materials; the detection device 14 is used to detect the position and material of the carrier 12. Snatch mechanism 13 and detection device 14 through the setting, detection device 14 detects the position and the material of carrier 12, snatchs the mechanism through material loading control system control and snatchs the material in carrier 12, makes the material automatically carry out the displacement accurately, reaches automatic feeding's effect, and degree of automation is higher, improves material loading efficiency effectively. The above-described components will be specifically described below.

In this application, the material to be loaded is taken as an example to explain, the chip needs to be detected on a detection production line after being produced, before the material is loaded on the detection production line, the chip is placed in the carrier 12 for production, the chip needs to be grabbed from the original carrier 12 during loading, and the chip is converted into a test carrier, so that the automatic loading machine 1 in the application is provided with the grabbing mechanism 13 to automatically grab the chip, and then the position of the carrier 12 and the state of the chip in the displacement are detected through the detection device 14, so that the chip in the carrier 12 is automatically grabbed, the detection is realized through the detection device 14, the displacement process of the chip is monitored, and the loading of the chip meets the preset requirement.

Referring to fig. 3 and 4, fig. 3 is a schematic structural diagram of the automatic feeding machine of the present application, and fig. 4 is a top view of a workbench of the automatic feeding machine of the present application, specifically, the rack 11 in this embodiment includes a workbench 111 and a mounting bracket 112, and the mounting bracket 112 is fixed on the top of the workbench 111; a first region 1111 is arranged on one side of the top of the workbench 111, a second region 1112 is arranged on the other side opposite to the first region 1111, and a third region 1113 is arranged between the first region 1111 and the second region 1112; the carrier 12 is disposed in the first region 1111 and the second region 1112; the detection device 14 is disposed in the third region 1113; the gripping mechanism 13 is disposed on the mounting frame 112. As shown in the figure, the top of each of the workbench 111 and the mounting rack 112 is a working surface, the four corners of each of the workbench 111 and the mounting rack 112 are support columns, the workbench 111 is mounted or placed on the ground, and the support columns of the mounting rack 112 are fixed on the working surface of the workbench 111. In this embodiment, the working surface of the working platform 111 is rectangular, the first region 1111 is located on one side of the working surface, the second region 1112 is located on the other side opposite to the first region 1111, and the middle portion of the two, i.e., the middle portion of the two located at the center of the square, is the third region 1113. The chip carrier 12 has at least two kinds, which are respectively disposed at the first region 1111 and the second region 1112. Since the movement of the carriers 12 requires a certain space, different carriers 12 are disposed in different areas, thereby avoiding the formation of collisions in the space during loading. The loading process of the chip is to move from the first region 1111 to the second region 1112, and therefore the detection device 14 is disposed in the middle region of the first region 1111 and the second region 1112, i.e. the third region 1113, and is used for detecting the chip during the loading process. The grabbing mechanism 13 is disposed on the mounting frame 112, specifically, at the bottom of the working surface of the mounting frame 112, so that the grabbing mechanism 13 is located right above the working surface of the workbench 111, and the grabbing mechanism 13 is convenient to grab and move the lower chip.

Still referring to fig. 3, fig. 3 is a schematic structural diagram of the automatic feeding machine of the present application, in which the carrier 12 in the present embodiment includes a material carrier 121 and a chip testing module 7, the material carrier 121 has a material disposed therein, and the grabbing mechanism 13 is used for transferring the material to the chip testing module 7 through a third area 1113; the material carrier 121 is fixed in the first area 1111, and the chip testing module 7 is fixed in the second area 1112. The incoming material carrier 121 in the present application is an original carrier before loading chips, and more chips can be placed in one incoming material carrier 121. The incoming material carrier 121 may be a tray. The chip testing module 7 is a new carrier after the chip is moved, since the chip testing needs to be placed in the specific chip testing module 7 to be matched with a subsequent testing machine, and the number of chips which can be contained in the chip testing module 7 is different from that of the incoming material carrier 121, the chip needs to be transferred into the chip testing module 7 from the interior of the incoming material carrier 121 in the loading process. The incoming material carrier 121 and the chip testing module 7 are respectively disposed in the first region 1111 and the second region 1112, so as to distinguish the incoming material carrier 121 and the chip testing module from each other, thereby avoiding confusion and misuse of different carriers 12.

Referring to fig. 5 to 7, fig. 5 is a schematic structural view of a mounting frame of the automatic feeding machine of the present application, fig. 6 is a bottom view of the mounting frame of the automatic feeding machine of the present application, and fig. 7 is a schematic view of another view of a grabbing mechanism of the automatic feeding machine of the present application. The grasping mechanism 13 in the present application includes a first grasping mechanism 131 and a second grasping mechanism 132; the first grabbing mechanism 131 is used for grabbing the material in the incoming material carrier 121 and moving the material to the third area 1113; the second grasping mechanism 132 is configured to grasp the material located in the third area 1113 and move the material to the chip testing module 7 located in the second area 1112. The picking process in this embodiment includes the steps of first using the first picking mechanism 131 to transfer the chip in the material carrier 121 from the first area 1111 to the third area 1113, and using the second picking mechanism 132 to transfer the chip in the third area 1113 to the chip testing module 7 in the second area 1112 after the chip is detected by the detecting device 14. The first gripping mechanism 131 and the second gripping mechanism 132 have different functions and are used separately, so that the production efficiency can be improved.

Specifically, each of the first and second grabbing

mechanisms

131 and 132 includes a first guide rail 1311, a first motor 1312, a variable pitch sucker module 1313, a telescopic cylinder 1314 and a screw rod module 1315; the first guide rail 1311 is fixed on the mounting frame 112, and the variable-pitch sucker module 1313 can slide along the first guide rail 1311; the first motor 1312 is used for driving the telescopic cylinder 1314 to move, and the telescopic cylinder 1314 can drive the variable-pitch sucker module 1313 to move up and down along the screw rod module 1315.

In the present embodiment, the vertical direction is taken as the z-axis, the longitudinal direction of the first guide rail 321 is taken as the y-axis, and the direction perpendicular to the longitudinal direction of the first guide rail 321 is taken as the x-axis. The direction of the first guide rail 1311 is parallel to the line direction of the first region 1111 and the third region 1113, that is, both along the y-axis direction, because the first grabbing mechanism 131 is only used to drive the chip to move from the first region 1111 to the third region 1113, and the second grabbing mechanism 132 is only used to drive the chip to move from the third region 1113 to the second region 1112, the length of the first guide rail 1311 is slightly greater than half of the distance between the first region 1111 and the third region 1113, and meanwhile, to avoid interference, a height difference is formed between the first grabbing mechanism 131 and the second grabbing mechanism 132, so that the two first guide rails 1311 can be located on the same straight line.

In this embodiment, the first motor 1312 is used for driving the pitch varying sucker module 1313 to slide along the first guide rail 1311, i.e. to slide in the y-axis direction, and the telescopic cylinder 1314 is used for driving the pitch varying sucker module 1313 to move up and down, i.e. to move in the z-axis direction, so as to grab the chip from the carrier 12.

The pitch-variable sucker module 1313 comprises a pitch-variable mechanism and a sucker, wherein the pitch-variable mechanism is suitable for packaging and arranging materials, and is used for ensuring that the distance between each movable block is consistent, arranging the products in batches and then placing the products into a carrier 12 after pitch change, and placing the products into a chip testing module 7 in the embodiment. The sucking disc sets up in displacement mechanism bottom for absorb the chip. Chip test module 7 is interior to contain a plurality of chips and to place the position, and the chip is placed the position and is evenly arranged, and the chip is taken out the back by the absorption in the supplied materials carrier 121, through the distance between each chip of displacement mechanism adjustment, makes it and the chip place the interval matching of position to can put into chip test module 7 with a plurality of chips simultaneously.

The grabbing mechanism 13 in this embodiment further includes a second guide rail 133 and a second motor 134, and the second motor 134 drives the first grabbing mechanism 131 to slide along the second guide rail 133; the first guide rail 321 is perpendicular to the second guide rail 133. The second rail 133 is also fixed to the bottom surface of the mounting frame 112, is perpendicular to the first rail 1311, and is disposed along the x-axis direction. The first gripper mechanism 131 can slide entirely along the second rail 133, i.e., along the x-axis, and the variable pitch sucker module 1313 in the first gripper mechanism 131 can slide along the first rail 1311, i.e., along the y-axis, which allows the variable pitch sucker module 323 to move along both the x-axis and the y-axis. As described above, the chips are moved along the y-axis direction when being placed on the first grabbing mechanism 131, the multiple incoming material carriers 121 are simultaneously disposed when being loaded, and when the multiple incoming material carriers 121 are arranged in parallel along the x-axis, the first grabbing mechanism 131 can move on the x-axis to grab the chips in the different incoming material carriers 121, and then adjust the positions of the chips to transfer the chips along the y-axis direction.

The first grabbing mechanism 131 in this embodiment is used for grabbing the chips located in the incoming material carrier 121, and is also used for moving the chips which are detected by the detection device 14 and are not qualified to the NG area 1114, the NG area 1114 is located on one side of the third area 1113 and is used for storing the chips which are detected in the feeding process and are not qualified, the chips which are not qualified are moved to the NG area 1114 by the first grabbing mechanism 131 along the x-axis direction, and then the sucking disc module moves out of the feeding machine, so that the full-process automation effect is achieved.

Certainly, more clamps can be arranged on the first grabbing mechanism 131, after the chips in the incoming material carrier 121 are grabbed, the empty incoming material carrier 121 is moved out of the first area 1111 by the clamps, and the first grabbing mechanism 131 continuously grabs the chips in the incoming material carrier 121 located at the lower part, so that the whole feeding machine is more automated, and the production efficiency is improved.

The detection device 14 in this embodiment includes a first detection device 141 and a second detection device 142, the first detection device 141 is disposed in the third area 1113, and is configured to detect the material entering the third area 1113, specifically, detect whether the chip entering the third area 1113 meets a preset requirement, if so, meet a preset position and angle requirement, or detect whether the chip has a quality problem, screen the chip, and reject the chip that does not meet the requirement, so as to transfer the chip to the chip testing module 7 in the next step.

Referring to fig. 4, fig. 4 is a top view of a workbench of the automatic feeding machine of the present application. The top of the workbench 111 is provided with a first access 1115 and a second access 1116, the incoming material carrier 121 moves between the top surface and the bottom surface of the workbench 111 through the first access 1114, the chip testing module 7 moves between the top surface and the bottom surface of the workbench 111 through the second access 1116, the incoming material carrier 121 bears a chip and rises from the bottom of the workbench 111 to the top of the workbench 111, and the chip testing module 7 bears a detected chip and descends from the top of the workbench 111 to the bottom of the workbench 111, and flows out to a subsequent detector through a transmission line. The second detecting device 142 is disposed at one side of the second gateway 1116, and is configured to detect the position of the chip testing module 7, so that the second grabbing mechanism 132 can move the chip testing module 7 to the second gateway 1116, and then descend through the second gateway 1116.

The first detection device 141 and the second detection device 142 in the present embodiment are any one of a CCD sensor, a hall sensor, or a travel switch. Preferably, adopt the CCD sensor in this embodiment, shoot the chip bottom, detect whether the chip bottom surface matches with the image data of predetermineeing, avoid the chip can't correctly place in chip test module 7, influence subsequent detection.

Referring to fig. 8, fig. 8 is a schematic bottom structure view of the working table of the automatic feeding machine of the present application, in this embodiment, the automatic feeding machine 1 further includes a transmission mechanism 15, and the transmission mechanism 15 includes a jacking device 151; a feeding box 153 is arranged at the bottom of the workbench 111 opposite to the first outlet/inlet 1115, and the incoming material carrier 121 is placed in the feeding box 153 and driven by the jacking device 151 to move; the lifting device 151 includes a third motor and a cylinder assembly, the third motor drives the cylinder assembly to move, the cylinder assembly pushes the feeding box 153 to move upward, so that the incoming material carrier 121 rises into the first region 1111 through the first access 1115. The material loading box 153 is used for storing the incoming material carriers 121, the incoming material carriers 121 with chips are manually placed, a plurality of layers of incoming material carriers 121 can be placed at one time, and the jacking device 151 drives the incoming material carriers 121 to ascend to the working surface of the workbench 111.

The transport mechanism 15 in this embodiment further includes a chip test module handling module 152; the chip testing module carrying module 152 is disposed at the bottom of the working platform 111, opposite to the second gateway 1116; the chip testing module carrying module 152 includes a third motor (not shown), a third guide rail 1521, a sliding block 1522 and a carrying platform 1523, the third motor drives the sliding block 1522 to slide along the third guide rail 1521, the carrying platform 1523 and the sliding block 1522 are fixed together, and the carrying platform 1523 carries the chip testing module 7 to ascend or descend through the second entrance 1116. The chip testing module handling module 152 is used for transferring the chip testing module 7 with the chip from the working surface of the worktable 111 to the lower part of the worktable 111 and then flowing out through the transmission line. The direction of the third guide rail 1521 is along the z-axis direction, the carrying platform 1523 is arranged horizontally, and the chip testing module 7 is placed on the carrying platform 1523 and slides down along the third guide rail 1521 to flow to the next procedure for chip detection. When the carrying platform 1523 is raised, the empty chip testing module 7 can be transported on the carrying platform 1523 through the lower assembly line for carrying out chip containing of the next batch, and thus, loading of chips is repeated.

The automatic feeding machine 1 in this embodiment further includes a carrier positioning mechanism; the carrier positioning mechanism includes a driving member and a clamp, the driving member drives the clamp to move, and two ends of the clamp are respectively abutted against two adjacent sides of the carrier 12, so that the carrier 12 is fixed on the workbench 111. Specifically, the carrier positioning mechanism may be respectively disposed in the first region 1111 and the third region 1113, and when the chip is transferred, the incoming carrier 121 and the chip testing module 7 are both fixed on the worktable 111 by the carrier positioning mechanism, so as to facilitate the picking and positioning of the chip.

The automatic feeding machine 1 in this embodiment further includes a chip test module unlocking device 8 for unlocking the chip test module 7, so that the chip is placed in the chip test module 7, and the specific structure of the chip test module unlocking device 8 will be described below.

Referring to fig. 9 to 11, fig. 9 is a schematic structural diagram of a chip testing module in the present application, fig. 10 is a schematic structural diagram of the chip testing module in the present application after a chip positioning mechanism is removed from fig. 9, and fig. 11 is a schematic structural diagram of a chip positioning mechanism of the chip testing module in the present application. The chip testing module 7 in the present application includes a chip mounting plate 71 and a chip positioning mechanism 72, and the chip mounting plate 71 and the chip positioning mechanism 72 are detachably connected. The chip testing module 7 is used for fixing and bearing the chip, and enters the testing machine 4 together with the chip for testing.

A chip pin carrier plate 73 is fixed on the chip mounting plate 71 in this application, and the chip mounting plate 71 is a substrate of the chip testing module 7 and is used for bearing parts. The pin carrier 73 mainly functions to protect the chip and to interface the ic chip with the outside, and the chip is mounted on the pin carrier 73.

The chip positioning mechanism 72 in this application is used to fix the chip on the chip testing module 7, and in this embodiment, the chip positioning mechanism 72 includes a chip cavity 721, a positioning block 722 and a chip locking mechanism, where the chip cavity 721 is used to cooperate with the chip pin carrier 73 to form a groove, so that the chip is fixed in the groove. The positioning block 722 is used for fixing the chip, and the chip locking mechanism is used for locking the positioning block 722 to abut against the chip. For the convenience of mounting and dismounting, the chip positioning mechanism 72 in this embodiment is detachably connected to the chip mounting plate 71.

The chip locking mechanism of the present application only needs to apply a force to the positioning block 722 to make the positioning block 722 abut against the chip, so as to achieve the effect of limiting the chip, and in this embodiment, the chip locking mechanism at least includes an elastic member 723, and the elastic member 723 is disposed at the other end of the positioning block 722, and is used for applying an elastic force to the positioning block 722 to push the positioning block 722 to abut against the chip.

Referring to fig. 12, fig. 12 is a schematic structural diagram of a chip cavity of the chip positioning mechanism of the present application. In the present application, the chip cavity 721 is provided with a chip mounting groove 724, and the chip pin carrier plate 73 is sleeved in the chip mounting groove 724; one end of the positioning block 722 extends into the chip mounting groove 724 and is abutted with the chip; the elastic member 723 is disposed at the other end of the positioning block 722 for applying an elastic force to the positioning block 722.

Still be equipped with first magnetic part 74 on the chip mounting panel 71 in this application, the second magnetic part has been buried underground in chip die cavity 721, and chip die cavity 721 attracts mutually through first magnetic part 74 and second magnetic part magnetism with chip mounting panel 71 to make chip die cavity 721 and chip mounting panel 71 swing joint, be convenient for installation and dismantlement.

In this application, the chip mounting plate 71 is further provided with a guide member 75, the chip cavity 721 is provided with a guide hole 725, and the guide member 75 penetrates through the guide hole 725, so that the chip cavity 721 is mounted on the chip mounting plate 71. In order to facilitate the mounting of the chip cavity 721 to a predetermined position on the chip mounting plate 71, the guide member 75 and the guide hole 725 are provided in this embodiment, so that the chip cavity 721 is mounted at a correct position, and the chip cavity 721 is movably mounted on the chip mounting plate 71 by the first magnetic member 74 and the second magnetic member as described above.

In this application, the chip cavity 721 further includes a positioning member mounting platform 726, and the positioning block 722 is disposed on the positioning member mounting platform 726. A notch is formed at one side of the chip mounting groove 724 opposite to the positioning piece mounting platform 726, one end of the positioning piece 722 extends into the chip mounting groove 724 through the notch, and the other end of the positioning piece 722 is abutted to a chip positioned in the chip mounting groove 724, so that the chip is fixed in the chip testing module 7.

In this application, the notch is located on a connection line between the center of the chip mounting groove 724 and the center of the positioning member mounting platform 726, and the length center line of the positioning block 722 coincides with the connection line. The line connecting the center of the chip mounting groove 724 and the center of the positioning member mounting platform 726 forms an angle of 45 degrees with respect to the two ends of the length and width of the chip mounting plate 71, and the length direction of the positioning block 722 is parallel to the line, so that the force applied by the positioning block 722 to the chip is directed toward the center of the chip, and the stress of the chip is relatively balanced.

Referring to fig. 14, fig. 14 is a schematic structural diagram of a positioning block of the chip positioning mechanism in the present application. In the application, one end of the positioning block 722 close to the notch comprises a first side 7221 and a second side 7222 which are forked, and the first side 7221 and the second side 7222 respectively abut against two adjacent sides of the chip; a clearance groove 7223 is also arranged at the intersection of the first edge 7221 and the second edge 7222; the other end of the positioning block 722 is formed upward with a projection 7224. In this embodiment, the chip is square or rectangular, the four corners of the chip are right angles, so that an even force is formed on the chip when the chip is fixed, the positioning block 722 forms a first side 7221 and a second side 7222 which are bifurcated, an included angle between the first side 7221 and the second side 7222 is 90 degrees, the included angle is respectively abutted against two adjacent sides of the chip, the clearance groove 7223 is used for avoiding the four corners of the chip, and the opposite side of the chip, which is subjected to the thrust of the positioning block 722, is abutted against the inner wall of the chip cavity 721, so that the chip is fixed in the chip testing module 7.

Referring to fig. 13, fig. 13 is a schematic structural diagram of a cover plate of a chip positioning mechanism according to the present application. The chip locking mechanism of the present application further includes a cover plate 76, and the cover plate 76 is disposed on the positioning member mounting platform 725. The cover plate 76 is provided with a through groove 761, and the protrusion 7224 penetrates through the through groove 761, so that the positioning block 722 can perform reciprocating motion under the limit of the cover plate 76.

The chip test module 7 in the application further comprises a module shell 77, and a hollow-out hole 771 is formed in the module shell 77; the chip mounting board 71 and the chip positioning mechanism 72 are accommodated in the module case 77, and the chip positioning mechanism 72 is exposed from the hollowed-out hole 771.

In this application, one end of the elastic member 723 is fixed to the inner wall of the hollow 771, and the other end of the elastic member abuts against the positioning block 722, so as to apply an elastic force to the positioning block 722 and push the positioning block 722 to press the chip, thereby fixing the chip.

In this application, the module housing 77 is further provided with a patch panel 78 for introducing or leading out signals to facilitate connection of a test instrument or provision of a signal source, thereby performing debugging and maintenance.

Referring to fig. 15 and 16, fig. 15 is a schematic structural diagram of a material circulation device of a chip test line according to the present application, and fig. 16 is a side perspective view of the material circulation device of the chip test line according to the present application. The material transferring device 2 in this embodiment includes a transferring vehicle 21 and a radio and tape player 22, and the transferring vehicle 21 and the radio and tape player 22 are movably matched. The turnover vehicle 21 can be pushed to discharge or take out materials by a manual or a retraction machine 22. The radio and tape player 22 can take the materials from the transfer cart 21 and can transfer the materials stored in the radio and tape player to the transfer cart 21. The material may be a chip test module 7.

Referring to fig. 17, fig. 17 is a schematic structural diagram of the transfer cart in fig. 15 according to the present application. The turnover vehicle 21 is provided with a storage rack 211 for placing the chip testing module 7.

Referring to fig. 18 to 20, fig. 18 is a perspective view of the internal structure of the radio cassette player of fig. 15 of the present application, fig. 19 is a schematic structural view of one side of the transverse moving mechanism of the radio cassette player of the present application, and fig. 20 is a schematic structural view of the other side of the transverse moving mechanism of the radio cassette player of the present application. The radio and cassette player 22 is provided with a frame 221, a lifting mechanism 222, and a lateral movement mechanism 223.

The lifting mechanism 222 is mounted on the frame 221, and is configured to drive the lateral moving mechanism 223 to lift along the frame 221, so that the height of the lateral moving mechanism 223 corresponds to the height of the storage rack 211, which is convenient for the lateral moving mechanism 223 to pick and place the chip testing module 7.

The transverse moving mechanism 223 extends and retracts along a horizontal direction perpendicular to the lifting direction, and is used for driving materials to horizontally move between the storage rack 211 and the picking and placing machine 22, namely, the chip testing module 7 can be driven by the transverse moving mechanism 223 to change positions between the storage rack 211 and the picking and placing machine 22.

Specifically, the above-mentioned materials are taken as the chip testing module 7 for example, and the material transfer device 2 is disposed behind the automatic feeding machine 1 and provides the empty chip testing module 7 to the automatic feeding machine 1. Empty chip test modules 7 are placed on the turnover vehicle 21 and transferred to the radio-cassette player 22, the empty chip test modules 7 flow back to the automatic feeding machine 1 through empty module transmission lines 63, and chips to be detected are placed on the automatic feeding machine 1 and then flow out through a module to be detected transmission line 61. The radio cassette player 22 can store the chip test modules 7 to prevent the chip test modules 7 from being stacked on the empty module transfer line 63. The turnover vehicle 21 can also transfer the chip test modules 7 stored on the radio and tape player 22 to the outside, provide different types of chip test modules 7 for the radio and tape player 22, convert the types of the chip test modules 7 on the transmission line 6, and adapt to the test requirements of different chips.

In this embodiment, the frame 221 includes a horizontal rod 2211 and a vertical rod 2212 connected as a whole, the vertical rods 2212 are vertically fixed, and the heads and the tails of the horizontal rods 2211 are respectively and fixedly connected to the adjacent vertical rods 2212 to form a rectangular frame for installing the lifting mechanism 222 and the horizontal movement mechanism 223.

The lifting mechanism 222 in this embodiment includes a guide rail 2221, a bearing plate 2222, and a timing belt 2223; the guide rails 2221 are provided in the length direction of the vertical rod 2212, that is, in the vertical direction. The two ends of the bearing plate 2222 are slidably connected to the guide rails 2221, and the synchronous belt 2223 is used to drive the bearing plate 2222 to move linearly along the guide rails 2221, so that the bearing plate 2222 can be raised and lowered.

In this embodiment, the lifting mechanism 222 further includes a movable transmission line 2224, one side of the movable transmission line 2224 is fixedly connected to the supporting plate 2222; the material is placed on the movable conveyor 2224. The movable transmission line 2224 is parallel to the transmission line 61 of the module to be tested and is a part of the transmission line 61 of the module to be tested, and the movable transmission line 2224 can be driven by the bearing plate 2222 to ascend or descend.

The lateral movement mechanism 223 in this embodiment includes a cylinder 2231, a push-pull plate 2232, and a guide shaft 2233. The cylinder 2231 is disposed on the carrier plate 2222 and is matched with the movable transmission line 2224 in height. The push-pull plate 2232 is disposed above the movable transmission line 2224 and is driven by the cylinder 231 to extend and retract, and the extending and retracting direction is a horizontal direction. One end of the guide shaft 2233 is fixedly connected to the push-pull plate 2232, and the other end passes through the bearing plate 2222, a guide mounting hole is formed in the bearing plate 2222, and the guide shaft 2233 passes through the guide mounting hole, so that the guide shaft 2233 can only move in the horizontal direction, and the movement direction of the push-pull plate 2232 is limited.

The push-pull plate 2232 in this application has various embodiments as long as the function of pushing and pulling the chip test module 7 can be realized. In one embodiment, the push-pull plate 2232 includes a flat plate, two opposite sides of the flat plate are bent to form a first bending plate and a second bending plate, the inner sides of the first bending plate and the second bending plate are provided with hooks or clamping mechanisms, and the side of the chip testing module 7 is also correspondingly provided with hook slots or clamping mechanisms, so that the push-pull plate 2232 and the chip testing module 7 can be fixed relatively, and the chip testing module 7 moves together with the push-pull plate 2232. In another embodiment, the push-pull plate 2232 includes a first surface, and a second surface and a third surface respectively disposed on two sides of the first surface, and both the second surface and the third surface are telescopically connected to the first surface. The distance between the second surface and the third surface is adjustable, a clamping mechanism is formed, when the chip testing module 7 is driven to move, the second surface and the third surface are respectively contacted with two opposite sides of the chip testing module 7, and the chip testing module 7 is clamped to move.

In this embodiment, the number of the storage racks 211 is plural, and the plurality of storage racks 211 are vertically and uniformly distributed on the turnover vehicle 21. The width of the storage rack 211 is at least twice of the width of the material, and a partition plate 212 is further disposed in the middle of the storage rack 211, so that at least two rows of chip testing modules 7 can be placed in one layer of the storage rack 211. After one side of the turnover vehicle 21 is fully placed, the turnover vehicle 21 is manually pushed out and then is rotated by 18 degrees to be pushed into the picking and placing machine 22, the chip testing modules 7 are continuously placed on the other side of the turnover vehicle 21, and after the two sides of the turnover vehicle 21 are fully placed, the turnover vehicle is manually pushed away, so that more chip testing modules 7 can be conveyed at one time, the labor consumption is reduced, and the working efficiency is higher. The bottom of the turnover vehicle 21 is also provided with universal wheels 213, which is convenient for pushing the turnover vehicle 21 to move.

In this embodiment, a baffle and a plug are further arranged on the side of the turnover vehicle 21, and the plug comprises a socket and a plug; one side of the baffle is hinged with the turnover vehicle, and the plug is arranged on the other opposite side of the baffle; the socket is fixed on the storage rack and corresponds to the plug in position. When baffle and bolt were used for promoting the motion of turnover vehicle 21, the protection was placed chip test module 7 on storing frame 211, avoided chip test module 7 to drop the damage, when turnover vehicle 21 carried out the material with the radio and tape player 22 and was transferred, the baffle was opened.

The radio and player 22 in this embodiment also includes a housing 224 for covering and protecting the other components of the radio and player 22. The housing 224 is provided with a movable door 225, the movable door 225 is hinged with the housing 224, and the movable door 225 can be opened when the transfer cart 21 and the radio and cassette 22 perform material transfer. The floor 226 of the transfer cart 21 is provided with a notch 227 for accommodating the transfer cart 21, and the width of the notch 227 is the same as the width of the transfer cart 21. When the transferring cart 21 is used with the radio cassette player 22, the movable door 225 is opened to push the transferring cart 21 to the notch 227, and since the width of the notch 227 is the same as that of the transferring cart 21, the transferring cart 21 is jammed, so that the transferring cart 21 and the radio cassette player 22 are kept relatively fixed when the chip testing module 7 is transferred between the transferring cart 21 and the radio cassette player 22.

Referring to fig. 21 and 22, fig. 21 is a schematic structural diagram of a first embodiment of an auxiliary feeder in the present application, and fig. 22 is a side view of the auxiliary feeder in the present application. The auxiliary feeding machine 3 in the present application includes an auxiliary feeding control system, a driving device 31, and a carrying mechanism 32; the auxiliary feeding control system is used for controlling the operation of the carrying mechanism 32; the driving device 31 drives the carrying mechanism 32 to move; the handling mechanism 32 comprises a transport rail and gripper assembly 321; the transmission rail comprises a z-axis rail 322, an x-axis rail 323 and a y-axis rail 324, wherein the z-axis rail 322 can slide along the x-axis 3212 rail, and the y-axis rail 324 is connected with the z-axis rail 322 in a sliding manner; the jaw assembly 321 is slidably connected to a y-axis rail 324.

The auxiliary feeding machine 3 is used for receiving the chip testing module 7 which is transmitted by the automatic feeding machine 1 and contains the chip to be detected, transmitting the chip to be detected to the testing machine 4, and transmitting the detected chip tested by the testing machine 4 to the transmission line 6 again. Through setting up the triaxial track, drive clamping jaw assembly 321 can move to the triaxial direction, and clamping jaw assembly 321 is used for pressing from both sides to get chip test module 7 and moves. Specifically, the x-axis rail 323 is along the length direction of the auxiliary feeder 3, the y-axis rail 324 is along the width direction of the auxiliary feeder 3, the z-axis rail 322 is along the height direction of the auxiliary feeder 3, the clamping jaw assembly 321 can slide along the y-axis rail 324, the y-axis rail 324 can slide up and down along the z-axis rail 322 together with the clamping jaw assembly 321, and the z-axis rail 322 can move along the x-axis rail 323 in a transverse action manner. The auxiliary feeder 3 and the testing machine 4 are arranged in parallel along the y-axis, and it can be understood that when the clamping jaw assembly 321 moves on the y-axis track 324, the chip testing module 7 is driven to switch positions between the auxiliary feeder 3 and the testing machine 4, specifically, the chip testing module 7 with an untested chip is transported from the auxiliary feeder 3 to the testing machine 4 for testing, and the chip testing module 7 with a tested chip in the testing machine 4 is transported back to the auxiliary feeder 3, so that the functions of feeding and discharging for the testing machine 4 are realized. When the clamping jaw assembly 321 moves on the x-axis rail 323 and the z-axis rail 322, the left-right position and the up-down position of the clamping jaw assembly 321 can be adjusted, so that the clamping jaw assembly 321 is consistent with the position of the chip testing module 7 to be clamped.

In this embodiment, the driving device 31 is disposed on the z-axis track 322 and can move along with the z-axis track 322, and the lines of the driving device 31 are disposed on the z-axis track 322 to avoid interference with the transmission line 6 or the chip testing module 7 during movement. The driving device 31 is any one of a stepping motor, a servo motor or a linear motor, and preferably, the driving device 31 is a stepping motor, and is used for synchronously controlling the three tracks and accurately controlling the moving position of the clamping jaw assembly 321.

The auxiliary feeder 3 in this embodiment further includes a support frame 33 and a base 34, and the support frame 33 is fixed on the base 34. The base 34 is used for carrying the support frame 33 and the carrying mechanism 32, and the transmission line 6 passes through the auxiliary feeder 3 and is fixed on the base 34. The clamping jaw assembly 321 clamps the chip test module 7 with the untested chip from the module transmission line 61 to be tested, and then takes out the chip test module from the testing machine 4 to be placed on the tested module transmission line 62 after the chip test module is placed in the testing machine 4 for testing.

In this embodiment, the x-axis rail 323 is fixed to the base 34 and is disposed along the length of the base 34. The top of the supporting frame 33 is provided with an upper slide rail 331, one end of the z-axis rail 322 is slidably connected with the x-axis rail 323, and the other end is slidably connected with the upper slide rail 331, so that the z-axis rail 322 can slide left and right along the x-axis direction.

Referring to fig. 23, fig. 23 is a schematic structural view of a jaw assembly of the auxiliary feeder of the present application. The jaw assembly 321 in the present application may have various forms as long as it can grasp and move the chip testing module 7. In one embodiment, the jaw assembly 321 includes a jaw 3211 and a slider 3212; the sliding member 3212 is slidably connected to the y-axis rail 324; the clamping jaw 3211 is fixedly connected with the sliding member 3212, and the arrangement direction of the clamping jaw 3211 is the same as the length direction of the y-axis rail 324. The clamping jaw 3211 includes two clamping plates and a top plate, the two clamping plates are telescopically connected with the top plate, the distance between the two clamping plates is adjustable, and force can be applied to two ends of the chip testing module 7 to drive the chip testing module 7 to move.

In this embodiment, the number of the clamping jaws 3211 is plural, and the plurality of clamping jaws 3211 form at least two layers. Preferably, the number of the clamping jaws 3211 is 4, and the clamping jaws are divided into two layers, two for each layer. When the device is used, the clamping jaws 3211 on each layer move synchronously, so that the clamping jaws 3211 on one layer can convey untested chip test modules 7 into the testing machine 4, and the clamping jaws 3211 on the other layer can convey tested chip test modules 7 out of the testing machine, and the production efficiency is higher.

In this embodiment, the clamping jaw 3211 is further provided with a position detecting sensor for detecting a moving position of the clamping jaw 3211, so that the displacement of the clamping jaw 3211 is more accurate.

Referring to fig. 24, fig. 24 is a schematic view of a second embodiment of the auxiliary loader 3 in the present application, in which the auxiliary loader 3 further includes a stacking mechanism 35 and a housing (not shown), the stacking mechanism 35 is disposed on one side of the x-axis rail 323, and is fixed on the base 34 for stacking the chip testing module 7. When the chip testing module 7 being tested in the testing machine 4 is full, the clamping jaw assembly 321 may store the chip testing module 7 conveyed by the module-to-be-tested transmission line 61 into the stacking mechanism 35, and after the testing by the testing machine 4 is completed, take out the tested chip testing module 7, clamp the untested chip testing module 7 from the stacking mechanism 35, and move the untested chip testing module 7 into the testing machine 4. The cover is provided outside the support frame 33 and the base 34, and protects the driving device 31 and the conveyance mechanism 32.

The length of the auxiliary feeding machine 3 in the embodiment is more than three times of the length of the testing machine 4, one auxiliary feeding machine 3 can correspond to three testing machines 4 to feed and discharge the three testing machines 4, and therefore one-driving-more machine can be achieved, efficiency is high, and cost is low.

Referring to fig. 25, fig. 25 is a schematic structural diagram of a testing machine according to the present application. The testing machine 4 in the present application includes a testing frame 41 and a testing module 42, the testing module 42 is installed on the testing frame 41, and the testing module 42 is used for detecting the chip.

Specifically, please refer to fig. 26 and 27, in which fig. 26 is a schematic structural diagram of the test module of the present application, and fig. 27 is a bottom view of the test module of the present application with the protective cover removed. The test module 42 comprises a test probe 421, a test pressure head 422, a mounting plate 423, a test plate 424 and a telescopic mechanism 425, wherein the test probe 421 and the test pressure head 422 are fixed on the mounting plate 423; the test probe 421 is used to receive a signal, provide the signal to a corresponding ICT or test system, and analyze the on-off and quality of the signal, and the test probe 421 is electrically connected to the interposer 78 of the chip test module 7. The mounting plate 423 is used to mount and secure the test probes 421 and the test indenter 422.

The test board 424 is opposite to the mounting board 423 for placing the chip test module 7. The test board 424 is provided with a positioning mechanism 426 for positioning the chip test module 7, so as to prevent the chip test module 7 from moving during the detection process. Preferably, the number of the positioning mechanisms 426 is at least two, the positioning mechanisms 426 are respectively distributed in different directions, and the positioning mechanisms 426 are L-shaped positioning blocks, which are positioned from the opposite side of the chip testing module 7, so that the chip testing module 7 cannot move.

The telescopic mechanism 425 is used for driving the mounting plate 423 to be close to or far away from the test plate 424, when the test machine 4 detects the chip, the telescopic mechanism 425 drives the mounting plate 423 to be close to the test plate 424, and at the moment, the test probe 421 and the test pressure head 422 are respectively contacted with the adapter plate 78 and the chip. When the chip detection is finished, the telescoping mechanism 425 drives the mounting plate 423 to be away from the testing board 424, and the testing probe 421 and the testing ram 422 are separated from the chip testing module 7.

Test pressure head 422 is used for compressing tightly the chip in this application, and subsidiary temperature conversion module provides high temperature or low temperature environment for the chip test simultaneously, environmental requirement when satisfying the chip test.

Specifically, please refer to fig. 28 to 29, in which fig. 28 is a schematic structural diagram of the test indenter of the present application, and fig. 29 is a perspective view of the test indenter of the present application. The test indenter 422 includes an upper housing 4221, a lower housing 4222, a sliding mechanism (not shown), an elastic mechanism 4223, an indenter 4224, and a temperature conversion module 4225. The top of the upper housing 4221 is fixedly assembled with the lower bottom surface of the mounting plate 423. The top of the lower shell 4222 is opposite to the bottom of the upper shell 4221, the pressure head 4224 is arranged at the bottom of the lower shell 4222, and the temperature conversion module 4225 is arranged in the lower shell 4222; the slide mechanism connects the upper housing 4221 and the lower housing 4222 so that the upper housing 4221 and the lower housing 4222 can slide relative to each other. The elastic mechanism 4223 is provided between the upper housing 4221 and the lower housing 4222. The testing indenter 422 is used for contacting with a chip in the chip testing process, and particularly, the lower shell 4222 of the testing indenter 422 is abutted against the chip. The test pressure head 422 is driven by the mounting plate 423 to move, after the pressure head 4224 on the lower shell 4222 is abutted to the chip, the upper shell 4221 can continue to move downwards for a certain distance due to the arrangement of the sliding mechanism and the elastic mechanism 4223, so that the pressure head 4224 at the bottom is tightly attached to the chip, and the chip is tightly pressed. The slide mechanism is used to move the upper housing 4221 in a direction parallel to the lower housing 4222, and the elastic mechanism 4223 is used to cushion when pressed downward. The temperature conversion module 4225 is used for providing heat or absorbing heat for the pressure head 4224, so that a high-temperature or low-temperature test environment is created, and the test pressure head 422 can meet the environmental conditions of different chips during detection.

Preferably, the temperature conversion module 4225 is a semiconductor refrigeration piece. The semiconductor refrigerating chip utilizes the Peltier effect of semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, the purposes of refrigerating and heating can be achieved, and high-temperature and low-temperature environments are provided for chip testing.

Certainly, under the condition that two testing environments of high temperature and low temperature are not needed, for example, when only high temperature testing is carried out, the semiconductor refrigerating sheet can be replaced by the thermocouple with low cost, and the product cost is reduced.

The sliding mechanism comprises a plurality of connecting columns 4226 and ball bushings 4227, two ends of each connecting column 4226 are fixedly connected with the upper shell 4221 and the lower shell 4222 respectively, and the ball bushings 4227 are arranged in the upper shell 4222, so that the upper shell 4221 can slide along the connecting columns 4226 along with the ball bushings 4227. The connecting column 4226 is used for connecting the upper shell 4221 with the lower shell 4222, the ball bush 4227 is sleeved outside the connecting column 4226, so that the upper shell 4221 and the lower shell 4222 can slide relatively, the distance between the upper shell 4221 and the lower shell 4222 is adjusted, the upper shell 4221 extrudes the elastic mechanism 4223, downward force is applied to the lower shell 4222, and the lower shell 4222 compresses a chip below the elastic mechanism.

The sliding mechanism further comprises a plurality of equal-height screws 4228, one end of each equal-height screw 4228 is fixed with the lower shell 4222, and the other end of each equal-height screw 4228 is movably connected with the upper shell 4221. The equal-height screw 4228 in the embodiment is used as a mandril screw, and the equal-height screw 4228 can ensure that the upper shell 4221 can move in parallel and cannot be broken due to uneven stress of the mandril caused by inclination.

In the application, the number of the connecting columns 4226 and the equal-height screws 4228 is two respectively, and the two connecting columns 4226 and the equal-height screws 4228 are distributed at four corners of the upper shell 4221 and the lower shell 4222, the two connecting columns 4226 are distributed on two opposite corners of the upper shell 4221 and the lower shell 4222, and the two equal-height screws 4228 are distributed on the other two opposite corners. The connecting column 4226 and the equal-height screws 4228 are arranged at intervals, so that the situation that the upper shell 4221 moves downwards and is stressed unevenly to incline when the two equal-height screws 4228 are arranged on the same side edge is avoided.

In the present application, the elastic mechanism 4223 is a plurality of springs, and the plurality of springs are symmetrically distributed on the center of the upper shell 4221 and the lower shell 4222. In the present application, the elastic mechanism 4223 is a buffer mechanism, the upper shell 4221 applies force to the lower shell 4222 through the elastic mechanism 4223, and the elastic mechanism 4223 may also be an elastic rubber body with a large elasticity as long as the pressure of the upper shell 4221 can be well transmitted.

The pressure head 4224 in the application is square, and the length and the width of the pressure head are both 15 mm. The chip that awaits measuring in this application is square or long direction, and maximum width all does not exceed 15mm, and the biggest compatible size is satisfied in the setting of above-mentioned pressure head 4224, is applicable to all chips, need not to change the pressure head when detecting different chips. Pressure head 4224's material is the copper in this application, is convenient for when chip test environment demand is high temperature environment, and the heat transfer who produces temperature conversion module 4225 is gone out rapidly.

The test indenter 422 further includes a cooling tube 4229 in the present application, and the cooling tube 4229 penetrates through the lower housing 4222 and is attached to the temperature conversion module 4225. The cooling tube 4229 is used for cooling the test indenter 422 by flowing cooling liquid.

Test pressure head 422 still includes temperature sensor in this application, and temperature sensor locates casing 4222 down for detect the temperature of temperature conversion module 4225, in time adjust when inside temperature exceedes preset temperature, avoid causing the chip to damage.

The telescoping mechanism 425 in this embodiment is a test ram cylinder. Mounting panel 423 and test pressure head cylinder's piston rod fixed connection to make test pressure head cylinder drive mounting panel 423 to stretch out and draw back. The test plate 424 passes through the piston rod and is disposed between the mounting plate 423 and the test ram cylinder.

The test module 42 in this embodiment further comprises a sealing means comprising a shield 427 and a movement mechanism. The shield 427 has an opening at one end, the opening is directed toward the testing board 424, the mounting plate 423 is located between the shield 427 and the testing board 424, the shield 427 is used for being attached to the testing board 424 to form a closed space, the chip testing module 7 is sealed in the closed space, and then a low-temperature or high-temperature environment is formed in the closed space. The moving mechanism is used for driving the protection cover 427 to move.

The movement mechanism in this embodiment includes a shield cylinder 428, a shaft 429 and a bearing 4210; shield cylinder 428 is fixedly attached to shield 427 through test plate 424; one end of the shaft 429 is fixed to the test board 424, and the longitudinal direction of the shaft 429 is perpendicular to the mounting plate 423 and the test board 424. The bearing 4210 is sleeved on the shaft 429 and fixedly connected with the side part of the protective cover 427. Shield cylinder 428 moves shield 427 up and down along axis 429 so that shield 427 is brought into proximity or away from test plate 424.

In this embodiment, a vacuum tube 4211, a sealed wire passing hole 4212 and a cooling liquid inlet 4213 are arranged on the bottom surface of the shield 427 opposite to the opening; the vacuumizing pipe orifice 4211 is connected with vacuumizing equipment and used for vacuumizing the interior of the protective cover 427 so as to prevent condensate water from being generated during low-temperature test; the sealed wire passing hole 4212 is used for the electric connection wires of the test probe 421 and the test pressure head 422 to pass through; a coolant inlet 4213 is used to inject coolant into the test head 422, and one end of the coolant tube 4229 is disposed at the coolant inlet 4213 and receives the coolant from the outside.

In this embodiment, a sealing ring 4214 is disposed on a surface of the testing board 424 facing the shield 427, and the sealing ring 4214 has the same shape as the shield 427 and is used for sealing when the shield 427 is attached to the testing board 424 to form a sealed space. Test plate 424 also has a plurality of cylinder bores for test ram and shroud cylinders 428 to pass through test plate 424, with telescoping mechanism 425 and shroud cylinder 428 and shrouds 427 and mounting plate 423 located on opposite sides of test plate 424. Be equipped with cylinder sealing ring 4215 in the cylinder bore, cylinder sealing ring 4215 and sealing ring 4214 cooperation are used for sealing the piston rod of cylinder, form sealed space when making protection casing 427 and survey test panel 424 both laminate.

The test jig 41 in this embodiment includes a plurality of layers, and each layer of test jig 41 all is equipped with a plurality of test module installation positions, and each layer of test jig 41 in this embodiment includes four test module installation positions. Each layer of test frame 41 is detachably connected, so that the test frame is convenient to carry and mount. The top of the test frame 41 is further provided with at least one air outlet 43 for dissipating heat from the test frame 41.

In the embodiment, the testing machine 4 is provided with a plurality of testing positions, and each testing position is integrated with a chip testing module unlocking device 8 for unlocking the chip testing module 7; each test position is a station for fixing the chip test module 7 and testing the chip, and the specific structure of the chip test module unlocking device 8 is described in the following section.

In this embodiment, each test site is further integrated with a power interface and a communication interface; the power interface is used to supply power to the chip test module 7 for testing. The communication interface is electrically connected with the chip testing module 7 and is used for communicating with the chip testing module 7, so that the outside can obtain the testing process and the testing result of the chip testing module 7. Communication interfaces include, but are not limited to: network interface, USB interface, 232 serial port, etc.

In this embodiment, a processor is integrated on the testing machine 4, a database is arranged in the processor, the processor is used for collecting the testing information of the chip testing module 7 and uploading the testing information to the information center, the database is used for collecting the testing information, and the processor collects, arranges and uploads the testing data of the chip testing module 7 to the data information center, so that technicians can visually analyze the testing result. The working flow of the testing machine of the application is as follows:

the chip testing module 7 transmitted by the auxiliary feeder 3 is received and fixed, the chip testing module 7 is fixed on the testing board 424 by the positioning mechanism 426, and the testing probe 421 and the testing pressure head 422 are driven to descend by the telescopic mechanism 425 until the chip testing module 7 is electrically connected. When the chip is subjected to high temperature test, the chip is heated by the temperature conversion module on the test indenter 422. When carrying out low temperature test to the chip, through the temperature conversion module cooling on the test pressure head 422, descend the protection casing 427, form airtight space with survey test panel 424, outside evacuation equipment is through the evacuation mouth of pipe 4211 evacuation in to airtight space, builds low temperature environment, makes the chip test under low temperature environment. After the test is finished, the tested chip test module 7 is transmitted to the tested module transmission line 62 by the auxiliary feeder 3.

Referring to fig. 30, fig. 30 is a schematic structural view of an automatic blanking device according to the present application. The automatic blanking device 5 in the application comprises a blanking control system, a sorting and arranging machine 51, a blanking machine 52 and a transfer mechanism 53; the discharging control system is used for controlling the sorting and arranging machine 51, the discharging machine 52 and the transfer mechanism 53 to operate; the sorting and arranging machine 51 comprises a sorting mechanism 511 and an arranging and transporting mechanism 512, wherein the sorting mechanism 511 is used for sorting materials, and the arranging and transporting mechanism is used for transporting the materials to the transfer mechanism 53; the transfer mechanism 53 spans the sorting and arranging machine 51 and the blanking machine 52 and is used for receiving the materials of the sorting and arranging machine and transferring the materials to the blanking machine 52; the blanking machine 52 comprises a blanking bearing frame 521, a first displacement mechanism 522 and a blanking carrier 523; the first displacement mechanism 522 is disposed on the blanking carrier 521, and is configured to grab the material from the transfer mechanism 53 and move the material into the blanking carrier 523. The automatic blanking device 5 is used for receiving the chip testing module 7 with the detected chip from the tested module transmission line 62, grabbing the chip from the chip testing module 7, moving the chip into the blanking carrier 523, and manually carrying out the blanking carrier 523 containing the chip for storage. The automatic blanking device 5 is provided with a blanking control system, a sorting and arranging machine 51 and a blanking machine 52, wherein the blanking control system receives a result tested by the testing machine 4 and distinguishes chips with abnormal tests and chips with normal tests. The sorting and arranging machine 51 automatically sorts the detected chips, rejects the chips with abnormal tests, and transfers the chips with normal tests to the blanking machine 52. The transfer mechanism 53 is provided between the sorting and arranging machine 51 and the blanking machine 52, and is used for transferring the chips. The blanking machine 52 places the received different chips in different blanking carriers 523 according to the categories, and stores the chips in a classified manner. Therefore, full-automatic blanking is realized, the labor is reduced, and the production efficiency is improved. The automatic blanking apparatus 5 will be described in detail below.

Referring to fig. 31, fig. 31 is a schematic structural view of a sorting and arranging machine of the automatic blanking device in the present application. The sorting and arranging machine 51 comprises a sorting mechanism 511 and an arranging and conveying mechanism 512, wherein the sorting mechanism 511 is controlled by a discharging control system to sort the detected chips. The chip sorting mechanism 511 includes a scanning gun 5111 and a reject placement box 5112, and the scanning gun 5111 is disposed on one side of a chip testing module unlocking device 8 described below, and is configured to scan the chip testing module 7. The rejecting placement box 5112 is disposed at the lower portion of the sorting and arranging frame 5122, and when the chip testing module 7 contains abnormal chips, the chip testing module 7 is automatically rejected, and the abnormal chips can be retested according to the detection conditions.

Referring to fig. 32 to 33, fig. 32 is a bottom view of the aligning and transporting mechanism of the present application, and fig. 33 is an assembly view of the sorting telescopic cylinder and the sorting screw module of the aligning and transporting mechanism of the present application. The arrangement and transportation mechanism 512 in the application comprises a second displacement mechanism, a sorting arrangement frame 5121, a chip test module unlocking device 8 and a chip test module lifting mechanism 5122; the second displacement mechanism is disposed on the sorting rack 5121 for moving the material to the transfer mechanism 53. The chip testing module unlocking device 8 corresponds to the chip testing module lifting mechanism 5122 in position and is used for unlocking the chip testing module 7 in the chip testing module lifting mechanism 5122 so as to take out the chip in the chip testing module 7. The chip testing module lifting mechanism 5122 is disposed at the lower portion of the sorting and arranging frame 5121 and used for lifting the chip testing module 7, specifically, the chip testing module lifting mechanism 5122 may be a combination of a guide rail and a slider, or may be an air cylinder, as long as the chip testing module 7 can be driven to move up and down.

Specifically, the second displacement mechanism comprises a sorting guide rail 5123, a sorting motor 5124, a sorting variable-pitch sucker module 5125, a sorting telescopic cylinder 5126 and a sorting screw rod module 5127; the sorting guide rail 5123 is fixed on the sorting arrangement frame 5121, and the sorting variable-pitch sucker module 5125 can slide along the sorting guide rail 5123; the sorting motor 5124 is used for driving the sorting telescopic cylinder 5126 to move, and the sorting telescopic cylinder 5126 can drive the sorting variable-pitch sucker module 5125 to move up and down along the sorting screw rod module 5127. Sorting displacement sucking disc module 5125 can slide along letter sorting guide rail 5123, and letter sorting guide rail 5123 length direction is perpendicular with transfer mechanism 53 length direction, and letter sorting telescopic cylinder 5126 can drive letter sorting displacement sucking disc module 5125 and carry out the up-and-down motion along letter sorting lead screw module 5127. The process that the chip is grabbed to letter sorting displacement sucking disc module 5125 does: snatch the chip from being located chip test module 7 of letter sorting range frame 5121 one side, snatch the in-process and drive the up-and-down motion through letter sorting telescopic cylinder 5126, snatch the vertical removal of back letter sorting displacement sucking disc module 5125 and be located the transfer mechanism 53 department at middle part, descend once more and shift the chip to on the transfer mechanism 53.

Referring to fig. 34, fig. 34 is a schematic view of a transfer mechanism of the present application for arranging transport mechanisms. The transfer mechanism 53 comprises a material placing box 531 and a material transfer guide rail 532, and the material transfer guide rail 532 spans the sorting and arranging machine 51 and the blanking machine 52; the material placement box 531 is slidably connected to the material transfer rail 532. During the chip conveying process between the sorting and arranging machine 51 and the blanking machine 52, the chips are positioned in the material placing box 531 and move transversely through the material transfer guide rails 532. The chips are placed in the material placing box 531 according to the types of the chips, for example, the chips of the same type are vertically placed in a preset column of the material placing box 531, so that the subsequent blanking machine 52 can conveniently process the chips of the same type in a centralized manner. The material placing box 531 comprises two material placing boxes in the embodiment, wherein one material placing box conveys the chips to the blanking machine 52, and the other material placing box loads the chips on the sorting and arranging machine 51, so that the production efficiency is improved. The heights of the two material placing boxes 531 are different, so that collision and position conflict can be avoided.

The sorting arranging machine 51 can distinguish abnormal and normal chips after being tested by the testing machine 4, can distinguish different types of chips, places the chips of the same type in a concentrated mode, and is convenient to grab quickly and convenient to judge by the aid of the subsequent blanking machine 52, so that production efficiency is improved.

Referring to fig. 35, fig. 35 is a schematic structural diagram of a blanking machine of the automatic blanking device in the present application. The blanking machine 52 in the present application includes a blanking carrier 521, a first displacement mechanism and a blanking carrier 522, the blanking carrier 521 includes a bottom frame 5211 and a top frame 5212, and the top frame 5212 is fixed on the top of the bottom frame 5211; the blanking carrier 522 is arranged at the upper end of the bottom frame 5211; the first displacement mechanism is disposed on the top frame 5212. The blanking bearing frame 521 is used for bearing the first displacement mechanism and a blanking carrier 522, the blanking carrier 522 is used for containing and collecting chips which are tested normally, and preferably, the blanking carrier 522 is a tray.

Referring to fig. 36 to 37, fig. 36 is a bottom view of the first displacement mechanism of the automatic feeding device of the present application, and fig. 37 is an assembly view of the feeding telescopic cylinder and the feeding screw rod module of the first displacement mechanism of the present application. The first displacement mechanism comprises a first blanking guide rail 523, a first blanking motor 524, a blanking variable-pitch sucker module 525, a blanking telescopic cylinder 526 and a blanking screw rod module 527; the first blanking guide rail 523 is fixed on the top frame 5212, and the blanking variable-pitch sucker module 525 can slide along the first blanking guide rail 523; the first blanking motor 524 is used for driving the blanking telescopic cylinder 526 to move, and the blanking telescopic cylinder 526 can drive the blanking variable-pitch sucker module 525 to move up and down along the blanking screw rod module 527. The structure and the effect of first displacement mechanism are similar with the structure and the effect of foretell second displacement mechanism, drive unloading displacement sucking disc module 525 through first unloading motor 524 and slide on first unloading guide rail 523, move on the horizontal plane promptly, drive through unloading telescopic cylinder 526 and move in vertical direction along unloading lead screw module 527 to snatch the chip, place the box 531 with the chip from the material and transmit to in the unloading carrier 522, moving the unloading carrier 522 who fills with the chip to storage area through the manual work.

First displacement mechanism still includes second unloading guide rail 528 and second unloading motor 529 in this application, and second unloading guide rail 529 is mutually perpendicular with first unloading guide rail 523, and second unloading motor 529 is used for driving first displacement mechanism and follows the motion of second unloading guide rail 528. Taking the length direction of the first blanking guide rail 523 as being along the x-axis as an example, the length direction of the second blanking guide rail 528 is along the y-axis, the blanking variable-pitch sucker module 525 in the first displacement mechanism can slide along the first blanking guide rail 523, that is, along the x-axis, and the whole first displacement mechanism can slide along the second blanking guide rail 528, that is, along the y-axis, and the arrangement can make the blanking variable-pitch sucker module 525 move along both the x-axis and the y-axis. The material transfer guide rails 532 in this application are arranged along the x-axis direction, and the blanking carriers 522 are distributed at the upper and lower ends of the blanking machine 52 and arranged in two rows. When blanking, the first displacement mechanism can move on the x axis to grab the chips transferred by the material placing box 531, and then the position is adjusted to transfer the chips to the blanking carrier 522 along the y axis direction.

The number of the blanking carriers 522 in this embodiment is plural, and when the blanking device is used, the first displacement mechanism places different types of chips in different blanking carriers 522, so as to distinguish the chip types.

In the application, the lower part of the blanking machine 52 is also provided with a blanking box 5210 and a blanking box jacking device; the bottom of the blanking box 5210 abuts against the blanking box jacking device, and the blanking carrier 522 is placed in the blanking box 5210; the blanking box jacking device comprises a lifting motor and a blanking air cylinder assembly, the lifting motor is used for driving the blanking air cylinder assembly to move, and the blanking air cylinder assembly pushes the blanking box 5210 to ascend or descend. The blanking box 5210 is used for carrying the blanking carriers 522, and the blanking carriers 522 can be placed in the blanking box 5210 in multiple layers. The discharging box jacking device drives the plurality of layers of discharging carriers 522 to be used to the upper part of the discharging carrier 521, so that the first displacement mechanism drives the chips to the inside of the discharging carriers 522.

The quantity of unloading carrier 522 and unloading box 5210 is a plurality ofly in this application, and arranges in proper order on blanking machine 52, and the chip is placed in unloading carrier 522, and unloading carrier 522 is stacked in unloading box 5210 again. A plurality of blanking carriers 522 are arranged in two rows and a plurality of columns, and each blanking carrier 522 is used for containing chips of different types respectively. The blanking machine 52 is further provided with a manipulator 5213, and the manipulator 5213 is used for grabbing the blanking carrier 522 and placing the blanking carrier into the blanking box 5210. At least one of the plurality of unloading carriers 522 is used for placing an empty unloading carrier 522, when the unloading carrier 522 is filled with chips, the manipulator 5213 picks one empty unloading carrier 522 therefrom and stacks the empty unloading carrier 522 on the unloading carrier 522 filled with chips, and the unloading box 5210 moves downwards by the height of one unloading carrier 522 so that the empty unloading carrier 522 is consistent with the plane of the unloader 52. After the plurality of layers of blanking carriers 522 are placed in the blanking boxes 5210, the plurality of layers of blanking carriers 522 are manually moved to the outside for storage.

Automatic unloader 5 in this application still includes chip test module unlocking means 8, and chip test module unlocking means 8 is located and sorts on the range machine for carry out the unblock to chip test module 7, and chip test module unlocking means 8's specific structure will be described in detail below.

Automatic unloader 5 in this application still includes unusual module climbing mechanism, and unusual module climbing mechanism will be placed in the region that awaits measuring through the unusual material that scanning rifle 5111 scanned to distinguish chip test module 7 that will include the unusual chip of test from the normal chip test module 7 of test result, will contain the chip test module 7 jacking of the unusual chip of test to the region that awaits measuring, follow-up carry out corresponding processing to the chip test module 7 that is located the region that awaits measuring by the manual work.

Referring to fig. 38 and 39, fig. 38 is a schematic structural diagram of the unlocking device for the chip testing module of the present application, and fig. 39 is a schematic assembly diagram of the unlocking device for the chip testing module and the chip testing module of the present application. The chip testing assembly line comprises a chip testing module unlocking device 8, wherein the chip testing module unlocking device 8 comprises a driving device 81, a transmission piece 82 and a pull rod 83; one end of the pull rod 83 is fixed on the transmission member 82, and the other end of the pull rod is abutted against the positioning block 722 of the chip testing module 7; the driving device 81 is used for driving the transmission piece 82 to move; the direction of movement of the transmission element 82 is the direction in which the pull rod 83 is away from the chip testing module 7. As described above, when the chip is loaded on the chip testing module 7, the chip is limited by the chip positioning mechanism 72 and cannot move, before the chip is put into or taken out from the chip testing module 7, the chip positioning mechanism 72 needs to be opened to allow the chip to move freely, and the testing module unlocking device 8 is used to open the chip positioning mechanism 72.

All be equipped with chip test module unlocking means 8 on automatic feeding machine 1, test machine 4 and the automatic unloader 5 in this application chip test assembly line for carry out the unblock to chip test module 7. The automatic feeding machine 1 is provided with a chip testing module unlocking device 8 for placing a chip after the chip positioning mechanism 72 is opened, the testing machine 4 is provided with a chip testing module unlocking device 8 for testing the chip, and the automatic blanking device 5 is provided with a chip testing module unlocking device 8 for taking out the chip after the chip positioning mechanism 72 is opened.

Specifically, the driving device 81 is configured to drive the pull rod 83 to move through the transmission component 82, and the insertion portion 831 at one end of the pull rod 83 is inserted into the through groove 761 of the cover plate 76 in the chip positioning mechanism 72 when the lock is unlocked, so that the side portion of the insertion portion 831 abuts against the protrusion 7224 of the positioning block 821, and the pull rod 83 pushes the positioning block 821 to move when the lock is moved, and the moving direction is a direction away from the chip, so that the positioning block 722 is separated from the chip, and the chip can be captured.

Transmission member 82 includes locating plate 821 in this application, is equipped with first mounting hole 822 on the locating plate 821, and drive arrangement 81 is located in first mounting hole 822. In this embodiment, the first mounting hole 822 is disposed at the center of the positioning plate 821, and the driving device 81 is also mounted at the center of the positioning plate 821 to facilitate the force-bearing movement of the transmission member 82.

Preferably, the driving device 81 is a cylinder, and an included angle between the expansion direction of the cylinder and the length direction of the positioning plate 821 is 45 degrees. As described above, the length direction of the positioning block 722 forms an angle of 45 degrees with the length and width directions of the chip, so that one end of the positioning block 722 can limit two side surfaces of the chip, and the applied force is relatively balanced. The positioning plate 821 is parallel to the chip, and in order to drive the positioning block 722 to move, the extending and retracting direction of the cylinder is also set to be 45 degrees, which is the same as the length direction of the positioning block 722, when the cylinder extends and retracts, the positioning plate 821 and the pull rod 83 are also driven to linearly move along the direction of 45 degrees, the positioning block 722 is pushed to be far away from the chip, and the chip positioning mechanism 72 is unlocked.

Chip test module unlocking means 8 still includes the guide rail 84 of unblanking in this application, and the guide rail 84 of unblanking locates the locating plate 821 lower part, and the locating plate 821 can be followed and unblanked guide rail 84 and slide, and the length direction of unblanking guide rail 84 and locating plate 821 length direction's contained angle is 45 degrees. The positioning plate 821 is pushed by the driving device 81 to slide along the unlocking guide rail 84, and the sliding direction is 45 degrees and is consistent with the moving direction of the positioning block 722.

The unlocking device 8 of the chip testing module in the application further comprises an elastic device 85, and the elastic device 85 is abutted with the transmission piece 82; the longitudinal direction of the elastic means 85 is the same as the longitudinal direction of the unlocking rail 84. The elastic device 85 is arranged in the embodiment, so that the transmission piece 82 can rebound and reset automatically. When the driving member 82 pushes the positioning block 722 to unlock, the elastic device 85 is compressed, and when unlocking is finished, the elastic device 85 releases elastic force to push the driving member 82 to reset, so that the other chip positioning mechanism 72 can be unlocked continuously.

Be equipped with second mounting hole 823 on the locating plate 821 in this application, in elastic device 85 located second mounting hole 823, the elastic device 85 of being convenient for directly applyed elasticity to locating plate 821. The included angle between the length direction of the elastic device 85 and the length direction of the positioning plate 821 is 45 degrees, so that the elastic direction of the elastic device 85 is consistent with the moving direction of the positioning plate 821.

Preferably, the elastic device 85 is a spring in this application, and of course, the elastic device 85 may also be an elastic colloid, and may also apply a resilient force to the positioning plate 821 to drive the positioning plate 821 to move.

The number of the pull rods 83 is multiple in the present application, and the distance between the pull rods 83 is equal to the distance between the positioning blocks 722. The chip test module unlocking device 8 is provided with the pull rods 83, the distance between the pull rods 83 is the same as the distance between the positioning blocks 722 on the chip test module 7, and therefore the pull rods 83 can unlock the chip test modules 7 at the same time. Preferably, in this embodiment, the chip testing module 7 is provided with four chip positioning mechanisms 72, and the positioning plate 821 is provided with eight pull rods 83, so that all chips on two chip testing modules 7 can be unlocked simultaneously.

The chip test module unlocking device 8 of the application has the working flow that:

the chip testing module 7 is fixed, the lower end of the pull rod 83 is inserted into the through groove 761 of the chip testing module 7, the driving device 81 drives the pull rod 83 to move through the transmission part 82, the pull rod 83 pushes the positioning block 722 to slide in the direction away from the chip, and the chip can be placed into the chip testing module 7 or be grabbed to the outside from the chip testing module 7. The resilient means 85 is compressed during the above process. Then the pull rod 83 is separated from the chip testing module 7, and the elastic device 85 applies elastic force to the transmission member 82 to drive the transmission member 82 and the pull rod 83 to reset.

The chip testing module unlocking device comprises a driving device, a transmission part and a pull rod, wherein the driving device is arranged on the chip testing module, the transmission part is arranged on the pull rod, the pull rod is connected with the chip testing module through the transmission part, and the transmission part is arranged on the pull rod.

To solve the technical problem, the present application further provides a chip testing method, please refer to fig. 40, where fig. 40 is a flowchart of the chip testing method, and the testing method includes the following steps:

and S100, loading, wherein the chip is transferred into an empty chip testing module through an automatic loading machine, specifically, the chip is grabbed from a loading carrier and then moved into the empty chip testing module.

And S200, testing, namely transferring a chip testing module carrying a chip to be tested to a testing machine through a transmission line, testing the chip to be tested by the testing machine, specifically, transmitting the chip to the testing machine in the chip testing module, and providing a testing environment matched with testing parameters by the testing machine to test the chip.

And S300, blanking, wherein the chip testing module carrying the tested chip is transferred to a transmission line from the testing machine and flows to an automatic blanking device through the transmission line, and the automatic blanking device transfers the tested chip to the outside from the chip testing module. Specifically, after the chip is tested on the testing machine, the chip flows to the automatic discharging device, the chip is transferred into the discharging carrier from the chip testing module, and the chip testing is finished.

Before the chip shifts to in the chip test module through automatic feeding machine in this application, include:

empty chip test module shifts to the transmission line through material turnover device, flows to automatic feeding machine through the transmission line. Chip test module in this application also is automatic feeding, transmits to automatic feeding machine from the outside through material turnover device, bears the examination chip that awaits measuring.

Carry the chip test module of the chip that awaits measuring in this application and shift to the test machine through the transmission line, include:

transferring a chip testing module carrying a chip to be tested to a testing machine through an auxiliary feeding machine;

transferring a chip test module carrying a tested chip from a tester to a transmission line, comprising:

the chip test module carrying the tested chip is transferred from the tester to the transmission line by the auxiliary feeder. Set up supplementary material loading machine in this application for go up unloading to the test machine, shift chip test module to the test machine and test, shift to the transmission line again after the test finishes on, shift to automatic blanking machine department.

The quantity of test machine is the integer multiple of supplementary material loading machine quantity in this application, and the test parameter of every test machine is the same or different. One auxiliary feeding machine can serve a plurality of testing machines, and the testing parameters of the testing machines can be the same or different, so that the testing machines can test different chips at the same time or test the chips in different parameter environments. The testing machines are of combined structures, can be flexibly combined according to different testing methods of the chips, and increase or reduce the number of the testing machines, so that the whole testing line is always in the highest efficiency state.

Automatic unloader will test the chip and transfer to the outside from chip test module in this application, include: the automatic blanking device sorts the tested chips with normal test results and abnormal test results, and the tested chips with normal test results are transferred to the outside from the chip test module. The automatic blanking device not only undertakes the blanking process, but also has the sorting function, chips with abnormal test results are removed, the manual work is waited for carrying out subsequent processing, and only the chips with normal test results are blanked and collected.

By using the chip testing assembly line, the whole process of chip testing is full-automatic from chip loading, testing to chip unloading, the problem of low automation degree of the existing chip testing assembly line is solved, the manual workload is reduced, the production efficiency and the productivity are improved, and the production cost is also reduced; the chip testing assembly line is of a combined structure, can be flexibly combined according to different chip testing methods, and increases or reduces the number of testing machines, so that the whole testing line is always in the highest efficiency state; the chip test assembly line has the capability of quickly switching high-low temperature wide temperature areas, and can replace traditional aging equipment for the problems of aging (BURN IN) and the like of a chip test link; the chip test assembly line fully utilizes the renewable and updating advantages of the test module, realizes multi-task bringing, and has the remarkable characteristic of flexible manufacturing; the chip test assembly line adopts a scheme of modularizing the test structure body aiming at the characteristic of frequent updating of IC test, and provides continuous availability of equipment for rapid product alternation.

The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims

1. A chip testing assembly line is characterized by comprising an automatic feeding machine, a material turnover device, an auxiliary feeding machine, a testing machine and an automatic discharging device in sequence, wherein the automatic feeding machine, the material turnover device, the auxiliary feeding machine and the automatic discharging device are connected through transmission lines, and the testing machine is arranged on the back of the auxiliary feeding machine;

the automatic feeding machine is used for grabbing the chip to be detected and transmitting the chip to be detected to the transmission line;

the material transfer device is used for providing a chip testing module for the automatic feeding machine;

the auxiliary feeding machine is used for receiving the chip to be detected transmitted by the automatic feeding machine, transmitting the chip to be detected to the testing machine and transmitting the detected chip tested by the testing machine to the transmission line;

the tester is used for detecting the chip to be detected;

the automatic blanking device is used for receiving the detected chips and sorting and collecting the detected chips.

2. The chip testing line of claim 1, wherein the automatic feeder comprises a control system, a rack, a gripping mechanism, and a detection device;

the control system is used for controlling the operation of the grabbing mechanism and the detection device;

the frame is used for bearing the grabbing mechanism and the detection device;

the grabbing mechanism is used for grabbing materials and displacing the materials;

the detection device is used for detecting the material in the displacement process of the material.

3. The chip testing line of claim 1, wherein the material transfer device comprises a transfer cart and a pick and place machine, the transfer cart and the pick and place machine being movably engaged;

the turnover vehicle is provided with a storage rack;

the radio and tape player is provided with a frame, a lifting mechanism and a transverse movement mechanism;

the lifting mechanism is arranged on the frame and used for driving the transverse movement mechanism to lift along the frame;

the transverse movement mechanism stretches along the horizontal direction vertical to the lifting direction and is used for driving materials to horizontally move between the storage rack and the retraction jack.

4. The chip testing line of claim 2, wherein the auxiliary loader comprises an auxiliary loading control system, a drive device, and a handling mechanism;

the auxiliary feeding control system is used for controlling the operation of the carrying mechanism;

the driving device drives the carrying mechanism to move;

the carrying mechanism comprises a transmission rail and a clamping jaw assembly; the transmission rail comprises a z-axis rail, an x-axis rail and a y-axis rail, the z-axis rail can slide along the x-axis rail, and the y-axis rail is connected with the z-axis rail in a sliding manner;

the clamping jaw assembly is connected with the y-axis rail in a sliding mode.

5. The chip testing line of claim 1, wherein the tester includes a test rack and a test module, the test module being mounted on the test rack;

the test module comprises a test probe, a test pressure head, a mounting plate, a test plate and a telescopic mechanism;

the test probe and the test pressure head are fixed on the mounting plate;

the test board is opposite to the mounting plate and used for placing a test module;

the telescopic mechanism is used for driving the mounting plate to be close to or far away from the test plate;

the test pressure head is provided with a temperature conversion module.

6. The chip testing line of claim 5, wherein the testing ram comprises an upper housing, a lower housing, a sliding mechanism, an elastic mechanism, a ram, and a temperature conversion module;

the top of the upper shell is used for fixing and assembling;

the top of the lower shell is opposite to the bottom of the upper shell, the pressure head is arranged at the bottom of the lower shell, and the temperature conversion module is arranged in the lower shell;

the sliding mechanism is connected with the upper shell and the lower shell, so that the upper shell and the lower shell can slide relatively;

the elastic mechanism is arranged between the upper shell and the lower shell.

7. The chip testing line of claim 1, wherein the automatic blanking device comprises a blanking control system, a sorting and arranging machine, a blanking machine, and a transfer mechanism;

the discharging control system is used for controlling the sorting and arranging machine, the discharging machine and the transfer mechanism to operate;

the sorting and arranging machine comprises a sorting mechanism and an arranging and transporting mechanism, the sorting mechanism is used for sorting materials, and the arranging and transporting mechanism is used for transporting the materials to the transfer mechanism;

the transfer mechanism spans the sorting and arranging machine and the blanking machine and is used for receiving the materials of the sorting and arranging machine and transferring the materials to the blanking machine;

the blanking machine comprises a blanking bearing frame, a first displacement mechanism and a blanking carrier;

the first displacement mechanism is arranged on the blanking bearing frame and used for grabbing the materials from the transfer mechanism and moving the materials into the blanking carrier.

8. The chip test pipeline of claim 1, wherein the transmission lines include at least a module-under-test transmission line, and an empty module transmission line;

the module transmission line to be tested and the tested module transmission line are arranged in parallel in the horizontal direction, and the module transmission line to be tested and the empty module transmission line are arranged in parallel in the vertical direction.

9. The chip test pipeline of claim 1,

the chip testing module comprises a chip mounting plate and a chip positioning mechanism, and the chip mounting plate is detachably connected with the chip positioning mechanism;

a chip pin carrier plate is fixed on the chip mounting plate;

the chip positioning mechanism comprises a chip cavity, a positioning block and an elastic piece;

the chip cavity is provided with a chip mounting groove, and the chip needle support plate is sleeved in the chip mounting groove; one end of the positioning block extends into the chip mounting groove and is abutted with the chip; the elastic piece is arranged at the other end of the positioning block and used for applying elasticity to the positioning block.

10. The chip testing assembly line of claim 9, wherein the automatic feeder, the tester, and the unloader are each provided with a test module unlocking device for unlocking a chip test module;

the test module unlocking device comprises a driving device, a transmission part and a pull rod;

one end of the pull rod is fixed on the transmission part, and the other end of the pull rod is abutted with the positioning block of the chip testing module;

the driving device is used for driving the transmission piece to move;

the movement direction of the transmission piece is the direction in which the pull rod is far away from the chip testing module.