CN115598508A - Integrated circuit test connecting device - Google Patents
Integrated circuit test connecting device Download PDFInfo
- Publication number
- CN115598508A CN115598508A CN202211343083.5A CN202211343083A CN115598508A CN 115598508 A CN115598508 A CN 115598508A CN 202211343083 A CN202211343083 A CN 202211343083A CN 115598508 A CN115598508 A CN 115598508A
- Authority
- CN
- China
- Prior art keywords
- sliding
- fixedly connected
- integrated circuit
- threaded rod
- slider
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention belongs to the field of integrated circuit testing, in particular to an integrated circuit testing connection device, which aims at solving the problems that the service life of the device is reduced due to overhigh internal temperature when the existing integrated circuit testing connection device runs for a long time, the dustproof effect is poor, and the situation that the contact is not firm easily occurs when different integrated circuits are tested.
Description
Technical Field
The invention relates to the technical field of integrated circuit testing, in particular to an integrated circuit testing connection device.
Background
The integrated circuit is a miniature electronic device, and is made up by using a certain technological process to connect the elements of transistor, diode, resistor, capacitor and inductor, etc. required in a circuit and wiring together, and making them be made into one or several small semiconductor chips or medium substrates, then packaging them in a tube shell so as to obtain the miniature structure with the required circuit function. When the electronic product is subjected to the function test, generally, the integrated circuit of the electronic product is subjected to the function test, and when the integrated circuit is subjected to the function test, each functional pin of the integrated circuit needs to be connected to a test device through an integrated circuit adapter plate;
when current integrated circuit test connecting device moves for a long time, the service life of the too high reducing means of inside temperature, and dustproof effect is not good, when testing different integrated circuit in addition, the not firm condition of contact appears easily.
Disclosure of Invention
The invention aims to solve the defects that the internal temperature is too high to reduce the service life of the device when the integrated circuit test connection device runs for a long time, the dustproof effect is poor, and the situation that the contact is not firm easily occurs when different integrated circuits are tested in the prior art, and provides the integrated circuit test connection device.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides an integrated circuit test connecting device, the on-line screen storage device comprises a base, two curb plates of top fixedly connected with of base, the same roof of top fixedly connected with of two curb plates, one side fixed mounting of roof has the motor, first spout has been seted up on one of two curb plates, slidable mounting has first slider in the first spout, one side fixedly connected with connecting rod of first slider, the one end fixedly connected with test contact plate of connecting rod, one side fixedly connected with of base accomodates the casing, be provided with heat dissipation mechanism in accomodating the casing, the motor cooperatees with first slider and heat dissipation mechanism, the top of base sets up integrated circuit board fixture.
Preferably, a plurality of sliding trays have been seted up to the bottom of test contact plate, and equal slidable mounting has the slide bar in a plurality of sliding trays, and the bottom of a plurality of slide bars all is provided with the contact lever, all is provided with reset spring in a plurality of sliding trays, and a plurality of reset spring's one end is connected with the top of a plurality of contact levers respectively, and reset spring can drive the slide bar and reset.
Preferably, a first threaded rod is slidably mounted in the first sliding groove, a first threaded hole is formed in the first sliding block, the first threaded rod is threadedly mounted in the first threaded hole, and the first threaded rod can drive the first sliding block to move through the first threaded hole.
Preferably, a transmission cavity is formed in the top plate, a rotating shaft is rotatably installed in the transmission cavity, one end of the rotating shaft extends to the outer side of the top plate and is welded to an output shaft of the motor, a first bevel gear is fixedly sleeved on the outer side of the rotating shaft, the top end of the first threaded rod extends to the transmission cavity and is fixedly connected with a second bevel gear, the second bevel gear is meshed with the first bevel gear, and the first bevel gear can drive the second bevel gear to rotate.
Preferably, integrated circuit board fixture is including seting up two second spouts at the base top, equal slidable mounting has the second slider in two second spouts, and same two-way lead screw is installed to two second spout internal rotations, and the one end of two-way lead screw extends to the outside and the fixedly connected with hand wheel of base, has all seted up the second screw hole on two second sliders, and two-way lead screw thread mounting is in two second screw threads, the equal fixedly connected with grip block in top of two second sliders, and two-way lead screw can drive the displacement of second slider through the second screw hole.
Preferably, the heat dissipation mechanism comprises a third chute arranged on the inner wall of the bottom of the storage shell, a third sliding block is slidably mounted in the third chute, a heat dissipation fan is arranged at the top of the third sliding block, a second threaded rod is rotatably mounted in the third chute, a third threaded hole is formed in the third sliding block, the second threaded rod is threadedly mounted in the third threaded hole, and the second threaded rod can drive the third sliding block to move through the third threaded hole.
Preferably, the other end of rotation axis extends to the outside of roof and the first belt pulley of fixedly connected with, and the one end of second threaded rod extends to the outside of storage housing and the second belt pulley of fixedly connected with, and the outside cover of second belt pulley and first belt pulley is equipped with same belt, and first belt pulley can drive the second belt pulley through the belt and rotate.
Preferably, a first contact electrode is arranged on one side of the third sliding block, a second contact electrode is arranged on the inner wall of one side of the third sliding chute, and the first contact electrode is matched with the second contact electrode.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the scheme, the first threaded rod is matched with the first sliding block, and the reset spring is matched with the sliding rod, so that each contact rod can be effectively ensured to be effectively contacted with the integrated circuit;
2. the scheme can effectively fix the integrated circuit board by matching the bidirectional screw rod with the second sliding block, thereby facilitating the circuit test on the integrated circuit board;
3. according to the scheme, the second threaded rod is matched with the third sliding block, and the first belt pulley is matched with the second belt pulley through the belt, so that the heat dissipation fan in the accommodating shell can be moved out when the integrated circuit is tested, the integrated circuit is powered on to blow heat generated by circuit testing, and dust can be blown away;
the invention can effectively ensure that each contact rod can effectively contact with the integrated circuit, effectively cool and remove dust for the integrated circuit board in test, and prolong the service life.
Drawings
Fig. 1 is a schematic structural diagram of an integrated circuit test connection device according to the present invention;
fig. 2 is a schematic view of a storage case of the ic test connection device according to the present invention;
FIG. 3 is an enlarged schematic view of the integrated circuit test connection apparatus shown in FIG. 1;
FIG. 4 is an enlarged schematic view of the integrated circuit test connection device shown in FIG. 1 at B;
fig. 5 is a schematic perspective view of a second slider of the ic test connection device according to the present invention.
In the figure: 1. a base; 2. a side plate; 3. a top plate; 4. a motor; 5. a first slider; 6. a connecting rod; 7. testing a contact plate; 8. a housing case; 9. a contact lever; 10. a return spring; 11. a first threaded rod; 12. a rotating shaft; 13. a first bevel gear; 14. a second bevel gear; 15. a second slider; 16. a bidirectional screw; 17. a hand wheel; 18. a clamping plate; 19. a third slider; 20. a heat-dissipating fan; 21. a second threaded rod; 22. a first pulley; 23. a second pulley; 24. a belt; 25. a first contact electrode; 26. a second contact electrode; 27. a slide bar.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Example one
Referring to fig. 1-5, an integrated circuit test connection device comprises a base 1, two side plates 2 are fixedly connected to the top of the base 1, the tops of the two side plates 2 are fixedly connected with a same top plate 3 through welding, a motor 4 is fixedly installed on one side of the top plate through a bolt, a first sliding groove is formed in one side plate 2 of the two side plates 2, a first sliding block 5 is slidably installed in the first sliding groove, one side of the first sliding block 5 is fixedly connected with a connecting rod 6 through welding, one end of the connecting rod 6 is fixedly connected with a test contact plate 7 through welding, one side of the base 1 is fixedly connected with a containing shell 8, a heat dissipation mechanism is arranged in the containing shell 8, the motor 4 is matched with the first sliding block 5 and the heat dissipation mechanism, and an integrated circuit board clamping mechanism is arranged at the top of the base 1.
In this embodiment, a plurality of sliding chutes have been seted up to the bottom of test contact board 7, and equal slidable mounting has slide bar 27 in a plurality of sliding chutes, and a plurality of contact bars 9 all are provided with to the bottom of a plurality of slide bars 27, all are provided with reset spring 10 in a plurality of sliding chutes, and the one end of a plurality of reset spring 10 is connected with the top of a plurality of contact bars 9 respectively, and reset spring 10 can drive slide bar 27 and reset.
In this embodiment, slidable mounting has first threaded rod 11 in the first spout, has seted up first screw hole on the first slider 5, and 11 screw threads of first threaded rod are installed in first screw hole, and first threaded rod 11 can drive first slider 5 displacement through first screw hole.
In this embodiment, a transmission cavity is formed in the top plate 3, a rotating shaft 12 is rotatably installed in the transmission cavity, one end of the rotating shaft 12 extends to the outer side of the top plate 3 and is welded to an output shaft of the motor 4, a first bevel gear 13 is fixedly arranged on the outer side of the rotating shaft 12 through welding, the top end of the first threaded rod 11 extends to the transmission cavity and is fixedly connected with a second bevel gear 14 through welding, the second bevel gear 14 is meshed with the first bevel gear 13, and the first bevel gear 13 can drive the second bevel gear 14 to rotate.
In this embodiment, integrated circuit board fixture is including offering two second spouts at base 1 top, equal slidable mounting has second slider 15 in two second spouts, and same two-way lead screw 16 is installed to two second spout internal rotations, the one end of two-way lead screw 16 extends to base 1's the outside and is connected with hand wheel 17 through welded fastening, the second screw hole has all been seted up on two second sliders 15, 16 threaded mounting of two-way lead screw are in two second screw threads, welded fastening is connected with grip block 18 all at the top of two second sliders 15, two-way lead screw 16 can drive 15 displacements of second slider through the second screw hole.
In this embodiment, the heat dissipation mechanism includes the third spout of seting up on the inner wall of storage housing 8 bottom, and slidable mounting has third slider 19 in the third spout, and the top of third slider 19 is provided with radiator fan 20, and the second threaded rod 21 is installed to the third spout internal rotation, has seted up the third screw hole on the third slider 19, and second threaded rod 21 threaded mounting is in the third threaded hole, and second threaded rod 21 can drive the displacement of third slider 19 through the third screw hole.
In this embodiment, the other end of rotation axis 12 extends to the outside of roof 3 and is connected with first belt pulley 22 through welded fastening, and the one end of second threaded rod 21 extends to the outside of accomodating casing 8 and is connected with second belt pulley 23 through welded fastening, and second belt pulley 23 is equipped with same belt 24 with the outside cover of first belt pulley 22, and first belt pulley 22 can drive second belt pulley 23 through belt 24 and rotate.
In this embodiment, a first contact electrode 25 is disposed on one side of the third slider 19, a second contact electrode 26 is disposed on an inner wall of one side of the third sliding chute, and the first contact electrode 25 is matched with the second contact electrode 26.
In this embodiment, when the testing device is used, firstly, the integrated circuit board is placed between the two clamping plates 18, then the hand wheel 17 is rotated, the hand wheel 17 drives the bidirectional screw 16 to rotate, the bidirectional screw 16 drives the second slider 15 to move, so that the clamping plates 18 can effectively clamp and fix the integrated circuit board, then the motor 4 is started, the output shaft of the motor 4 drives the rotating shaft 12 to rotate, the rotating shaft 12 drives the first bevel gear 13 to rotate, the first bevel gear 13 drives the second bevel gear 14 to rotate, the second bevel gear 14 drives the first threaded rod 11 to rotate, the first threaded rod 11 drives the first slider 5 to move downwards, the first slider 5 drives the testing contact plate 7 to move downwards until the contact rod 9 abuts against the integrated circuit board below, the reset spring 10 is matched with the sliding rod 27, so that each contact rod 9 can effectively and firmly abut against the integrated circuit board, so as to complete the testing, meanwhile, the rotating shaft 12 drives the first belt pulley 22 to rotate, the first pulley 22 drives the second pulley 23 to rotate through the belt 24, the second pulley 23 drives the second threaded rod 21 to rotate, the second threaded rod 21 drives the third slider 19, the third slider 19 drives the fan 19 to move, and the third slider 19 drives the heat dissipation electrode 20 to discharge heat, and at the heat generated by blowing, and at the heat generated by the heat dissipation electrode 20.
Example two
The difference from the first embodiment is that: the clamping plate 18 is provided with a rubber cushion layer, so that the clamped integrated circuit board can be effectively protected.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (8)
1. The utility model provides an integrated circuit test connecting device, including base (1), a serial communication port, two curb plates of top fixedly connected with (2) of base (1), the same roof (3) of top fixedly connected with of two curb plates (2), one side fixed mounting of roof has motor (4), first spout has been seted up on one curb plate (2) in two curb plates (2), slidable mounting has first slider (5) in the first spout, one side fixedly connected with connecting rod (6) of first slider (5), the one end fixedly connected with test contact plate (7) of connecting rod (6), one side fixedly connected with storage housing (8) of base (1), be provided with heat dissipation mechanism in storage housing (8), motor (4) cooperate with first slider (5) and heat dissipation mechanism, the top of base (1) sets up integrated circuit board fixture.
2. The ic test connection device according to claim 1, wherein a plurality of sliding grooves are formed in the bottom of the test contact plate (7), sliding rods (27) are slidably mounted in the sliding grooves, the contact rods (9) are disposed at the bottom ends of the sliding rods (27), the return springs (10) are disposed in the sliding grooves, and one ends of the return springs (10) are respectively connected with the top ends of the contact rods (9).
3. The device according to claim 2, wherein the first sliding groove is slidably mounted with a first threaded rod (11), the first sliding block (5) is provided with a first threaded hole, and the first threaded rod (11) is threadedly mounted in the first threaded hole.
4. The integrated circuit testing connection device according to claim 3, wherein a transmission cavity is formed in the top plate (3), a rotating shaft (12) is rotatably mounted in the transmission cavity, one end of the rotating shaft (12) extends to the outer side of the top plate (3) and is welded to the output shaft of the motor (4), a first bevel gear (13) is fixedly sleeved on the outer side of the rotating shaft (12), the top end of the first threaded rod (11) extends into the transmission cavity and is fixedly connected with a second bevel gear (14), and the second bevel gear (14) is meshed with the first bevel gear (13).
5. The IC testing connection device according to claim 4, wherein the IC clamping mechanism comprises two second sliding grooves formed in the top of the base (1), second sliding blocks (15) are arranged in the two second sliding grooves in a sliding mode, the same two-way lead screw (16) is arranged in the two second sliding grooves in a rotating mode, one end of the two-way lead screw (16) extends to the outer side of the base (1) and is fixedly connected with a hand wheel (17), second threaded holes are formed in the two second sliding blocks (15), the two-way lead screw (16) is arranged in the two second threads in a threaded mode, and clamping plates (18) are fixedly connected to the tops of the two second sliding blocks (15).
6. The IC testing connection device according to claim 5, wherein the heat dissipation mechanism comprises a third sliding groove formed in the inner wall of the bottom of the housing (8), a third sliding block (19) is slidably mounted in the third sliding groove, a heat dissipation fan (20) is disposed on the top of the third sliding block (19), a second threaded rod (21) is rotatably mounted in the third sliding groove, a third threaded hole is formed in the third sliding block (19), and the second threaded rod (21) is threadedly mounted in the third threaded hole.
7. The IC test connection device according to claim 6, wherein the other end of the rotary shaft (12) extends to the outside of the top plate (3) and is fixedly connected with a first belt pulley (22), one end of the second threaded rod (21) extends to the outside of the housing (8) and is fixedly connected with a second belt pulley (23), and the second belt pulley (23) and the first belt pulley (22) are sleeved with the same belt (24).
8. An IC test connection arrangement according to claim 7, characterized in that the third slider (19) is provided with a first contact electrode (25) on one side and a second contact electrode (26) on an inner wall of the third runner on one side, the first contact electrode (25) cooperating with the second contact electrode (26).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211343083.5A CN115598508A (en) | 2022-10-31 | 2022-10-31 | Integrated circuit test connecting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211343083.5A CN115598508A (en) | 2022-10-31 | 2022-10-31 | Integrated circuit test connecting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115598508A true CN115598508A (en) | 2023-01-13 |
Family
ID=84850253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211343083.5A Withdrawn CN115598508A (en) | 2022-10-31 | 2022-10-31 | Integrated circuit test connecting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115598508A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116243031A (en) * | 2023-04-19 | 2023-06-09 | 江苏友润微电子有限公司 | Integrated circuit test fixture |
| CN116643153A (en) * | 2023-07-27 | 2023-08-25 | 陕西汇天广科信息科技有限公司 | High-low temperature testing device for integrated circuit |
| CN117491840A (en) * | 2023-10-20 | 2024-02-02 | 北京齐诚科技有限公司 | Testing device for integrated circuit |
-
2022
- 2022-10-31 CN CN202211343083.5A patent/CN115598508A/en not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116243031A (en) * | 2023-04-19 | 2023-06-09 | 江苏友润微电子有限公司 | Integrated circuit test fixture |
| CN116243031B (en) * | 2023-04-19 | 2024-05-28 | 江苏友润微电子有限公司 | Integrated circuit test fixture |
| CN116643153A (en) * | 2023-07-27 | 2023-08-25 | 陕西汇天广科信息科技有限公司 | High-low temperature testing device for integrated circuit |
| CN117491840A (en) * | 2023-10-20 | 2024-02-02 | 北京齐诚科技有限公司 | Testing device for integrated circuit |
| CN117491840B (en) * | 2023-10-20 | 2024-04-30 | 北京齐诚科技有限公司 | Testing device for integrated circuit |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN115598508A (en) | Integrated circuit test connecting device | |
| CN109894876A (en) | A kind of cutting of aluminum substrate, pressing, deburring integrated production line | |
| CN113125929A (en) | Probe test board for semiconductor processing | |
| CN213957551U (en) | Power-on test device for integrated circuit board | |
| CN114258210A (en) | SIP integrated circuit packaging structure fusing SMT | |
| CN208795768U (en) | A kind of substrate package test fixture | |
| CN209961615U (en) | Full-automatic torsion testing arrangement | |
| CN217213017U (en) | Integrated circuit testing arrangement convenient to adjust | |
| CN113608108B (en) | VPX integrated circuit board intelligent test frock | |
| CN209821096U (en) | BGA crack detection analyzer based on three-dimensional X-ray | |
| CN216117894U (en) | Integrated circuit testing device | |
| CN219162298U (en) | Applicability device for integrated circuit detection | |
| CN220189630U (en) | Battery cell packaging mechanism | |
| CN213042905U (en) | Integrated circuit packaging structure | |
| CN219768035U (en) | Limiting device for manufacturing power electronic components | |
| CN221039146U (en) | Flip type chip test seat | |
| CN219592734U (en) | Integrated circuit dismounting structure | |
| CN215768871U (en) | Integrated circuit chip aging testing device | |
| CN220961625U (en) | Positioning device for circuit test | |
| CN215453432U (en) | Supporting device for fixing electronic circuit board in production | |
| CN213875764U (en) | PCB (printed circuit board) detection jig | |
| CN219084978U (en) | Integrated circuit tester | |
| CN215735045U (en) | A processingequipment for production of gas table PCB circuit board | |
| CN219357040U (en) | Test fixture of integrated circuit test sorting machine | |
| CN218918799U (en) | Tin-plating device for semiconductor production |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20230113 |
|
| WW01 | Invention patent application withdrawn after publication |