CN217043542U - LED wafer picks up brilliant sorting unit - Google Patents
LED wafer picks up brilliant sorting unit Download PDFInfo
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- CN217043542U CN217043542U CN202220596546.8U CN202220596546U CN217043542U CN 217043542 U CN217043542 U CN 217043542U CN 202220596546 U CN202220596546 U CN 202220596546U CN 217043542 U CN217043542 U CN 217043542U
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Abstract
The utility model discloses a LED wafer crystal picking and sorting device, which comprises a first base and a second base which are oppositely arranged at a certain distance, and is characterized in that a wafer supply part is arranged on the upper side of the first base, a material taking thimble mechanism is arranged at the top end of the first base, and a thimble connected with the material taking thimble mechanism in a driving way can run to the wafer supply part after being driven; a wafer placing part is arranged on the upper side of the second base, a material placing ejector pin mechanism is arranged at the top end of the second base, and an ejector which is in driving connection with the material placing ejector pin mechanism can run to the wafer placing part after being driven; and a swing arm rotating mechanism, a first CCD camera and a second CCD camera are arranged in the empty partition between the first base and the second base. The utility model discloses a brilliant sorting unit is picked up to LED wafer has solved present LED wafer and has picked up brilliant and select separately the problem that accuracy and speed are not high, has reduced the LED wafer simultaneously and has leaked the rate of examining.
Description
Technical Field
The utility model relates to a LED selects separately technical field, specific saying so relates to a brilliant sorting unit is picked up to LED wafer.
Background
In the production process of the LED wafer, particularly in the wafer detection and sorting stage, precise positioning needs to be carried out for many times. The vision positioning has the characteristics of safety, reliability and high accuracy, so a CCD camera, computer software and a PLC are generally used for realizing the accurate positioning of the wafer by utilizing a machine vision technology.
The LED wafers are small in size and large in data volume, and the size of the diced wafers varies from wafer to wafer for different performance parameters and different powers, and the LED wafers range from about 6 mils by 7 mils to 160 mils by 160 mils. Typically, a silicon wafer contains multiple levels of LED chips, up to thousands to tens of thousands of LED chips. The essence of sorting wafers by the LED sorter is to sort the same grade wafers in a Wafer supply area (referred to as Wafer area) into a Wafer placement area (referred to as Bin area) in a certain order. The LED sorting system is complex optical, mechanical and electronic integrated equipment, depends on import at home at present, researches an accurate, efficient and reliable LED wafer sorting system, and has important significance for researching and manufacturing the equipment.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art, the to-be-solved technical problem of the utility model lies in providing a LED wafer picks up brilliant sorting unit. The sorting device is designed for the purpose of: the problem of present LED wafer pick-up and select separately accuracy and speed not high is solved, LED wafer omission factor has been reduced simultaneously.
In order to solve the technical problem, the utility model discloses a following scheme realizes: the utility model discloses a LED wafer picks up brilliant sorting unit, include two first bases and second bases that set up relatively at a distance apart, characterized in that, the upside of said first base is equipped with the wafer supply portion, its top end is fitted with and got the thimble mechanism, can move to the said wafer supply portion after getting the thimble that the thimble mechanism drive connects is driven;
a wafer placing part is arranged on the upper side of the second base, a material placing ejector pin mechanism is arranged at the top end of the second base, and an ejector which is in driving connection with the material placing ejector pin mechanism can run to the wafer placing part after being driven;
and a swing arm rotating mechanism, a first CCD camera and a second CCD camera are arranged in the empty space between the first base and the second base.
Further, the first base and the second base are marble bases.
Furthermore, the wafer supply part is provided with a first YZ axis driving mechanism and a wafer disc assembly in driving connection with the first YZ axis driving mechanism, the first YZ axis driving mechanism drives the wafer disc assembly to move in a YZ axial direction, and the wafer disc assembly is provided with a first bearing platform for placing a wafer disc.
Furthermore, the first YZ-axis driving mechanism comprises a first Y-axis movement module and a first Z-axis movement module;
the power source of the first Y-axis movement module is a first Y-axis servo motor, the first Y-axis servo motor is in driving connection with a first Y-axis screw rod, and the first Y-axis screw rod is in threaded connection with the first Z-axis movement module;
the power source of the first Z-axis movement module is a first Z-axis servo motor, the first Z-axis servo motor is in driving connection with a first Z-axis screw rod, and the first Z-axis screw rod is in threaded connection with the wafer disc assembly.
Furthermore, the wafer placing part is provided with a second YZ axis driving mechanism and a sorting disc assembly in driving connection with the second YZ axis driving mechanism, the second YZ axis driving mechanism drives the sorting disc assembly to move in a YZ axial direction, and the sorting disc assembly is provided with a second bearing table for placing a material disc.
Furthermore, the second YZ-axis driving mechanism comprises a second Y-axis movement module and a second Z-axis movement module;
the power source of the second Y-axis motion module is a second Y-axis servo motor, the second Y-axis servo motor is in driving connection with a second Y-axis screw rod, and the second Y-axis screw rod is in threaded connection with the second Z-axis motion module;
the power source of the second Z-axis movement module is a second Z-axis servo motor, the second Z-axis servo motor is in driving connection with a second Z-axis screw rod, and the second Z-axis screw rod is in threaded connection with the classification disc assembly.
Furthermore, the swing arm rotating mechanism comprises a theta axis mechanism and a rotating support which is arranged on the theta axis mechanism and is driven by the theta axis mechanism to rotate, and two sets of swing arm assemblies which are arranged oppositely are symmetrically arranged on the rotating support.
Furthermore, the power source of the theta axis mechanism is a theta axis servo motor which drives the rotating bracket to rotate;
the two groups of swing arm assemblies are respectively and vertically arranged on two sides of the rotating bracket through elastic plates;
and a limiting structure and an elastic force adjusting structure are respectively arranged between the rotating bracket and the two groups of swing arm assemblies.
Further, the opposite sides of the top ends of the two sets of swing arm assemblies are provided with suction ports.
Furthermore, the LED wafer picking and sorting device further comprises an industrial personal computer, an image acquisition card and a PLC, one path of the industrial personal computer is electrically connected with the image acquisition card, the other path of the industrial personal computer is connected with the PLC, and the image acquisition card is respectively connected with the first CCD camera and the second CCD camera to form an image acquisition system.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) the utility model discloses a cost is reduced when the device has improved the accuracy.
(2) The utility model discloses a two suction nozzles all can pick up and put the LED wafer, and every rotatory 180 just can change the function of two suction nozzles, have improved efficiency.
(3) In the process of picking up the LED wafer, the suction nozzle is fixed, the thimble cap tightly sucks the wafer, the thimble extends out to pierce the wafer, and simultaneously the suction nozzle is opened in vacuum, so that the wafer is separated from the blue film; simple structure and good stability.
Drawings
Fig. 1 is a whole machine diagram of the LED wafer picking and sorting device of the present invention.
Fig. 2 is a top view of the LED wafer picking and sorting device of the present invention.
Fig. 3 is a structural view of a wafer supply unit according to the present invention.
Fig. 4 is a structural view of the wafer placing part of the present invention.
Fig. 5 is a structural diagram of the swing arm rotating mechanism of the present invention.
Fig. 6 is the structure diagram of the material taking thimble mechanism of the present invention.
Fig. 7 is a structural diagram of the discharging thimble mechanism of the present invention.
Fig. 8 is a schematic view of the installation structure of the first CCD camera and the second CCD camera of the present invention.
Fig. 9 is a schematic view of the reciprocating motion of the swing arm rotating mechanism of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making more clear and definite definitions of the protection scope of the present invention. It is obvious that the described embodiments of the invention are only some of the embodiments of the invention, and not all of them. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be connected through the inside of the two elements, or may be connected wirelessly or through a wire. The specific meaning of the above terms in the present invention can be understood as a specific case by those skilled in the art.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
Example 1:
referring to fig. 1-9, the LED chip pickup sorting apparatus of the present invention includes two first bases 31 and two second bases 51 oppositely disposed at a distance, a chip supply part 1 is installed on the upper side of the first base 31, a material pickup thimble mechanism 5 is installed on the top end of the first base 31, and a thimble 7 driven and connected by the material pickup thimble mechanism 5 can be driven to move to the chip supply part 1;
the upper side of the second base 51 is provided with a wafer placing part 2, the top end of the second base is provided with a discharging ejector pin mechanism 8, and an ejector 9 which is in driving connection with the discharging ejector pin mechanism 8 can run to the wafer placing part 2 after being driven;
the swing arm rotating mechanism 3, the first CCD camera 10 and the second CCD camera 11 are arranged in the empty space between the first pedestal 31 and the second pedestal 51.
A preferred technical solution of this embodiment: the first base 31 and the second base 51 are both marble bases.
A preferred technical solution of this embodiment: the wafer supply part 1 is provided with a first YZ shaft driving mechanism and a wafer disc assembly in driving connection with the first YZ shaft driving mechanism, the first YZ shaft driving mechanism drives the wafer disc assembly to move in a YZ axial direction, and the wafer disc assembly is provided with a first bearing platform for placing a wafer disc.
A preferred technical solution of this embodiment: the first YZ-axis driving mechanism comprises a first Y-axis movement module and a first Z-axis movement module;
the power source of the first Y-axis movement module is a first Y-axis servo motor, the first Y-axis servo motor is in driving connection with a first Y-axis screw rod, and the first Y-axis screw rod is in threaded connection with the first Z-axis movement module;
the power source of the first Z-axis movement module is a first Z-axis servo motor, the first Z-axis servo motor is in driving connection with a first Z-axis screw rod, and the first Z-axis screw rod is in threaded connection with the wafer disc assembly.
A preferred technical solution of this embodiment: the wafer placing part 2 is provided with a second YZ shaft driving mechanism and a sorting tray assembly in driving connection with the second YZ shaft driving mechanism, the second YZ shaft driving mechanism drives the sorting tray assembly to move in a YZ axial direction, and the sorting tray assembly is provided with a second bearing table for placing a material tray.
A preferred technical solution of this embodiment: the second YZ-axis driving mechanism comprises a second Y-axis movement module and a second Z-axis movement module;
the power source of the second Y-axis motion module is a second Y-axis servo motor, the second Y-axis servo motor is in driving connection with a second Y-axis screw rod, and the second Y-axis screw rod is in threaded connection with the second Z-axis motion module;
the power source of the second Z-axis movement module is a second Z-axis servo motor, the second Z-axis servo motor is connected with a second Z-axis screw rod in a driving mode, and the second Z-axis screw rod is in threaded connection with the classification disc assembly.
A preferred technical solution of this embodiment: the swing arm rotating mechanism 3 comprises a theta shaft mechanism and a rotating support which is arranged on the theta shaft mechanism and driven by the theta shaft mechanism to rotate, and two sets of swing arm assemblies 4 which are arranged oppositely are symmetrically arranged on the rotating support.
A preferred technical solution of this embodiment: the power source of the theta axis mechanism is a theta axis servo motor which drives the rotating bracket to rotate;
the two groups of swing arm assemblies 4 are respectively and vertically arranged on two sides of the rotating bracket through elastic plates;
and a limiting structure and an elastic force adjusting structure are respectively arranged between the rotating bracket and the two groups of swing arm assemblies 4.
A preferred technical solution of this embodiment: the opposite sides of the top ends of the two sets of swing arm assemblies 4 are mounted with a suction nozzle portion 12.
A preferred technical solution of this embodiment: the LED wafer picking and sorting device further comprises an industrial personal computer, an image acquisition card and a PLC, wherein one path of the industrial personal computer is electrically connected with the image acquisition card, the other path of the industrial personal computer is connected with the PLC, and the image acquisition card is respectively connected with the first CCD camera 10 and the second CCD camera 11 to form an image acquisition system.
Example 2:
the following is the utility model discloses LED wafer picks up brilliant sorting unit's theory of operation:
the wafer supply area 1 and the wafer placing area 2 are respectively positioned at wafer picking and placing positions, the swing arm assembly 4 rotates to the wafer picking and placing positions, the two sucker parts 12 are matched with the thimbles to pick up the wafers, one sucker part 12 places the wafers, and the two sucker parts 12 are respectively a first sucker and a second sucker.
The utility model discloses LED wafer picks up brilliant sorting unit and specifically steps include:
a1: the swing arm assembly 4 rotates the first suction nozzle to the wafer supply area 1, the second suction nozzle rotates to the wafer placing area 2, the thimble cap 6 is pushed out from left to right, the thimble 7 is jacked up, and the first suction nozzle picks up the wafers; meanwhile, the ejector 9 is pushed out from the right to the left, and the second suction nozzle is placed;
a2: the thimble cap 6 and the thimble 7 are withdrawn, and the first suction nozzle finishes picking up the wafer; the ejector 9 is withdrawn, the second suction nozzle is placed in an empty position, and the workbench moves;
a3: the swing arm assembly 4 rotates, the first suction nozzle rotates to the wafer placing area 2, the second suction nozzle rotates to the wafer supply area 1, the thimble cap 6 is pushed out from left to right, the thimble 7 is jacked up, and the second suction nozzle picks up the wafers; meanwhile, the ejector 9 is pushed out from the right to the left, and the first suction nozzle is placed;
a4: the thimble cap 6 and the thimble 7 are withdrawn, and the second suction nozzle finishes picking up the wafer; the ejector 9 is withdrawn, the first suction nozzle is arranged in an empty position after being arranged, the workbench moves, and the swing arm assembly 4 rotates;
repeating the steps A1-A4 until the wafer sorting is completed.
The following is that the process of sorting the first suction nozzle or the second suction nozzle specifically comprises the following steps (the following suction nozzle refers to the first suction nozzle or the second suction nozzle):
1. the suction nozzle, the thimble and the thimble cap reach respective initial positions;
2. the thimble cap and the thimble move to the preparation position, the thimble cap is opened in vacuum, and the blue film is adsorbed on the thimble cap;
3. the thimble moves to the blue film piercing position, and the thimble pierces the blue film at the bottom of the LED chip;
4. the suction nozzle is opened in vacuum, the wafer is adsorbed, the thimble is withdrawn, and the two reach respective initial positions.
The initial positions of the thimble cap and the thimble are about 1mm on the left side of the LED wafer, the preparation positions of the thimble cap and the thimble are tightly attached to the lower surface of the blue film at the bottom of the LED wafer and are about 0.1mm away from the suction nozzle, and the puncture position of the thimble is a position for separating the LED wafer from the blue film.
The initial position of the suction nozzle is that the distance between the end face of the suction nozzle and the wafer is 1mm, and the position of the suction nozzle for picking up the wafer is the picking and sorting position.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the same way in the protection scope of the present invention.
Claims (10)
1. An LED wafer picking and sorting device comprises a first base (31) and a second base (51) which are oppositely arranged at a certain distance, and is characterized in that a wafer supply part (1) is arranged on the upper side of the first base (31), a material taking thimble mechanism (5) is arranged at the top end of the first base, and a thimble (7) which is connected with the material taking thimble mechanism (5) in a driving mode can run to the wafer supply part (1) after being driven;
a wafer placing part (2) is arranged on the upper side of the second base (51), a discharging ejector pin mechanism (8) is arranged at the top end of the second base, and an ejector (9) which is in driving connection with the discharging ejector pin mechanism (8) is driven to run to the wafer placing part (2);
and a swing arm rotating mechanism (3), a first CCD camera (10) and a second CCD camera (11) are arranged in a space between the first base (31) and the second base (51).
2. The LED wafer picking and sorting device according to claim 1, wherein the first base (31) and the second base (51) are both marble bases.
3. The LED wafer picking and sorting device according to claim 1, wherein the wafer supply part (1) has a first YZ-axis driving mechanism and a wafer tray assembly in driving connection with the first YZ-axis driving mechanism, the first YZ-axis driving mechanism drives the wafer tray assembly to make YZ axial movement, and the wafer tray assembly is provided with a first carrying table for placing the wafer tray.
4. The LED wafer picking and sorting device according to claim 3, wherein the first YZ-axis driving mechanism comprises a first Y-axis motion module and a first Z-axis motion module;
the power source of the first Y-axis movement module is a first Y-axis servo motor, the first Y-axis servo motor is in driving connection with a first Y-axis screw rod, and the first Y-axis screw rod is in threaded connection with the first Z-axis movement module;
the power source of the first Z-axis movement module is a first Z-axis servo motor, the first Z-axis servo motor is in driving connection with a first Z-axis screw rod, and the first Z-axis screw rod is in threaded connection with the wafer disc assembly.
5. The LED wafer picking and sorting device according to claim 1, wherein the wafer placing part (2) has a second YZ-axis driving mechanism and a sorting tray assembly in driving connection with the second YZ-axis driving mechanism, the second YZ-axis driving mechanism drives the sorting tray assembly to perform YZ axial movement, and the sorting tray assembly is provided with a second carrying platform for placing a material tray.
6. The LED wafer picking and sorting device according to claim 5, wherein the second YZ-axis driving mechanism comprises a second Y-axis motion module and a second Z-axis motion module;
the power source of the second Y-axis motion module is a second Y-axis servo motor, the second Y-axis servo motor is connected with a second Y-axis screw rod in a driving mode, and the second Y-axis screw rod is in threaded connection with the second Z-axis motion module;
the power source of the second Z-axis movement module is a second Z-axis servo motor, the second Z-axis servo motor is in driving connection with a second Z-axis screw rod, and the second Z-axis screw rod is in threaded connection with the classification disc assembly.
7. The LED wafer picking and sorting device according to claim 1, wherein the swing arm rotating mechanism (3) comprises a theta axis mechanism and a rotating support which is mounted on the theta axis mechanism and driven by the theta axis mechanism to rotate, and two sets of swing arm assemblies (4) which are arranged oppositely are symmetrically mounted on the rotating support.
8. The LED wafer picking and sorting device according to claim 7, wherein the power source of the theta axis mechanism is a theta axis servo motor, and the theta axis servo motor drives the rotating support to rotate;
two groups of swing arm assemblies (4) are respectively and vertically arranged on two sides of the rotating bracket through elastic plates;
and a limiting structure and an elastic force adjusting structure are respectively arranged between the rotating bracket and the two groups of swing arm assemblies (4).
9. The LED wafer picking and sorting device according to claim 8, characterized in that the suction nozzle parts (12) are installed on the opposite sides of the top ends of the two groups of swing arm assemblies (4).
10. The LED wafer crystal picking and sorting device according to claim 1, further comprising an industrial personal computer, an image acquisition card and a PLC, wherein one path of the industrial personal computer is electrically connected with the image acquisition card, the other path of the industrial personal computer is connected with the PLC, and the image acquisition card is respectively connected with the first CCD camera (10) and the second CCD camera (11) to form an image acquisition system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220596546.8U CN217043542U (en) | 2022-03-18 | 2022-03-18 | LED wafer picks up brilliant sorting unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220596546.8U CN217043542U (en) | 2022-03-18 | 2022-03-18 | LED wafer picks up brilliant sorting unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217043542U true CN217043542U (en) | 2022-07-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220596546.8U Active CN217043542U (en) | 2022-03-18 | 2022-03-18 | LED wafer picks up brilliant sorting unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217043542U (en) |
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2022
- 2022-03-18 CN CN202220596546.8U patent/CN217043542U/en active Active
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