CN216982187U - Chip on film and display module - Google Patents
Chip on film and display module Download PDFInfo
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- CN216982187U CN216982187U CN202123272380.9U CN202123272380U CN216982187U CN 216982187 U CN216982187 U CN 216982187U CN 202123272380 U CN202123272380 U CN 202123272380U CN 216982187 U CN216982187 U CN 216982187U
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Abstract
The utility model provides a chip on film, which comprises a flexible circuit board, an integrated circuit arranged on the flexible circuit board and a heat dissipation part arranged on the flexible circuit board, wherein the heat dissipation part comprises: the heat dissipation layer is made of heat conduction materials; an air exhaust layer for exhausting an air layer between the flexible wiring board and the heat sink; the first pasting layer is arranged between the exhaust layer and the flexible circuit board; the second pasting layer is arranged between the exhaust layer and the heat dissipation layer; compared with the prior art, the heat dissipation element comprises an exhaust layer which comprises a continuous pore structure; the heat dissipation piece generates bubbles in the sticking process; through pressing, gas in the bubble is followed pore structure discharges to make the bubble eliminate, thereby solve the attached insecure problem of the heat dissipation subsides among the prior art from the root.
Description
Technical Field
The application relates to the field of display equipment, in particular to a chip on film and a display module.
Background
As display products are increasingly pursuing high resolution and high refresh rate; the heating problem of COF (chip on film) in display module is also getting worse.
In the prior art, a heat dissipation paste is mainly attached on an Integrated Circuit (IC) of a COF to help heat dissipation. In the initial stage, the heat dissipation paste is mainly pasted on the PI surface of the COF, the heat dissipation performance of the structure is general, but in the current time, the heat dissipation requirement of the product can be basically met in the age with low display resolution. With the rapid development of display technology, the resolution of the current display product is mostly 4K/8K, the refresh rate is mostly 120/144Hz or even higher, and the negative influence brought by the high resolution and the high refresh rate is the high heat productivity of COF; the conventional heat dissipation patch attachment scheme cannot meet the heat dissipation requirement. The existing solution considers that a heat dissipation paste is directly pasted on the surface of the COF integrated circuit so as to improve the heat dissipation effect and protect the integrated circuit from being damaged. Due to the thickness of the integrated circuit, the heat dissipation sticker is attached to the surface of the integrated circuit and is a non-flat plane, so that attachment bubbles and poor wrinkles are easily generated. After reliability verification and long-time use, the heat dissipation sticker is easy to have the problem of glue failure. Considering the limitation of the binding process, a certain safety distance needs to be reserved from the edge of the heat dissipation sticker to the edge of the PCB, so that the defects of high-temperature operation, scalding of the heat dissipation sticker, generation of bubbles and the like in the binding process are prevented. Meanwhile, the position of the integrated circuit and the COF length need to be matched with the whole machine and cannot be adjusted randomly, so that the distance of the heat dissipation paste beyond the integrated circuit is compressed; and the COF can be bent after the whole machine is installed, so that the problem that the heat dissipation paste is easy to be stripped is further caused.
SUMMERY OF THE UTILITY MODEL
The utility model provides a chip on film, wherein a heat dissipation piece is provided with an exhaust layer; bubbles generated during the attaching process can be discharged from the air discharge layer by pressing; therefore, the problem that the heat dissipation patch in the prior art is not firm in attachment is fundamentally solved.
The utility model provides a chip on film, which comprises a flexible circuit board, an integrated circuit arranged on the flexible circuit board and a heat dissipation part arranged on the flexible circuit board, wherein the heat dissipation part comprises:
the heat dissipation layer is made of heat conduction materials;
an air exhaust layer for exhausting an air layer between the flexible wiring board and the heat sink;
the first pasting layer is arranged between the exhaust layer and the flexible circuit board;
and the second pasting layer is arranged between the exhaust layer and the heat dissipation layer.
Optionally, the exhaust layer has an exhaust channel; the exhaust passage communicates the first adhesive layer with the external environment.
Optionally, the exhaust layer has a pore structure; the pore structures are communicated with each other to form the exhaust channel.
Optionally, the exhaust layer is made of heat conducting foam.
Optionally, the exhaust layer is made of heat-conducting silica gel; and a plurality of through channels are arranged in the heat-conducting silica gel to form the exhaust channel.
Optionally, the heat dissipation layer is made of a heat-conducting metal material and/or a heat-conducting non-metal material.
Optionally, the heat dissipation layer is made of a metal heat conduction sheet, the metal heat conduction sheet includes a first surface and a second surface, and the second adhesive layer is coated on the first surface of the metal heat conduction sheet; the second surface of the metal heat conducting sheet is provided with a continuous dentate or wavy convex structure.
Optionally, the metal heat conducting sheet is a heat conducting copper sheet or a heat conducting aluminum sheet.
Optionally, the heat-conducting non-metallic material is a graphene heat-conducting film.
Optionally, the heat dissipation layer; comprises that
A first portion attached to the integrated circuit; and the number of the first and second groups,
a second portion; located around the first portion; the second part is attached to the flexible circuit board.
Optionally, the second adhesive layer is disposed between the first portion and the integrated circuit; the second paste layer, the exhaust layer and the first paste layer are arranged between the second part and the flexible circuit board in sequence.
Optionally, the second adhesive layer, the exhaust layer, and the first adhesive layer are sequentially disposed between the first portion and the integrated circuit; the second paste layer, the exhaust layer and the first paste layer are arranged between the second part and the flexible circuit board in sequence.
The utility model also provides a display module which comprises a display panel and a PCB (printed circuit board), wherein the display panel is connected with the PCB through the flip chip film.
Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages:
through set up the exhaust layer in the radiating piece, because the exhaust layer will the flexible line way board with air bed and outside intercommunication between the radiating piece, consequently work as the radiating piece is when pasting in-process production bubble, through pressing, gas in the bubble is followed the exhaust layer is discharged to make the bubble eliminate, thereby solve the attached insecure problem of the heat dissipation subsides among the prior art from the root.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the utility model and together with the description, serve to explain the principles of the utility model.
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 is a side view structural diagram of a chip on film provided in embodiment 1 of the present application.
Fig. 2 is a top view structural diagram of a heat dissipation device of a chip on film according to embodiment 1 provided in the present application.
Fig. 3 is a schematic view of a layered structure of a heat spreader of a chip on film according to embodiment 1 of the present disclosure.
Fig. 4 is a cross-sectional view of a heat dissipation layer of a chip on film according to embodiment 1 of the present disclosure.
Fig. 5 is a side view structural diagram of a chip on film provided in embodiment 2 of the present application.
Fig. 6 is a cross-sectional view of a heat dissipation layer of an embodiment of a chip on film according to embodiment 2 of the present disclosure.
Fig. 7 is a schematic view of a partial structure of a display module according to embodiment 3.
Description of the drawings: 1. a heat sink; 11. a first adhesive layer; 12. an exhaust layer; 121. an exhaust passage; 13. a second adhesive layer; 14. a heat dissipation layer; 141. a first portion; 142. a second portion; 2. a flexible circuit board; 3. an integrated circuit; 4. a display panel; 5. a PCB board; A. and (4) a safety distance.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Example 1:
referring to fig. 1 to 4, the flip chip film includes a flexible circuit board 2, an integrated circuit 3 mounted on the flexible circuit board 2, and a heat sink 1 mounted on the flexible circuit board 2, where the heat sink 1 includes:
a heat dissipation layer 14 made of a heat conductive material;
an exhaust layer 12 having an exhaust passage therein for exhausting an air layer between the flexible wiring board and the heat sink;
a first adhesive layer 11 provided between the exhaust layer 12 and the flexible wiring board 2;
and a second adhesive layer 13 provided between the exhaust layer 12 and the heat dissipation layer 14.
Further, referring to fig. 1 and 2, the heat dissipation layer 14; comprises that
A first portion 141 attached to the integrated circuit 3; and the number of the first and second groups,
a second portion 142; located around the first portion 141; the second portion 142 is attached to the flexible wiring board 2.
The integrated circuit 3 comprises a driving chip arranged on the flexible circuit board 2; the first portion 141 of the heat dissipation layer 14 is attached to the surface of the driving chip; the second part 142 is attached to the flexible circuit board 2; the first portion 141 mainly plays a role of heat dissipation, and the second portion 142 mainly plays a role of fixing.
Referring to fig. 1 and 2, since the integrated circuit 3 protrudes from the plane of the flexible circuit board 2, the first portion 141 is higher than the second portion 142; the transition portion between the first part 141 and the second part 142 has a large tension, and if the second part 142 is not firmly adhered or has poor adhesion, the tension may cause the adhesion of the second part 142 to be stripped, so that the second part cannot pass the reliability verification; in order to solve the above technical problem, the heat sink 1 provided by the present invention is provided with an exhaust layer 12, the exhaust layer 12 has a pore structure inside, and referring to fig. 4, the pore structure forms an irregular exhaust channel 121; the exhaust passage 121 communicates the first adhesive layer 11 with the external environment; since the chip portion of the ic 3 may be bumped, an air layer (air bubbles) is generated between the heat sink 1 and the flexible wiring board 2 after the heat sink is attached; due to the existence of the exhaust layer 12, the gas in the air layer can be exhausted from the exhaust channel 121 of the exhaust layer 12 by pressing, so that the air layer is eliminated, and the firm attachment is ensured.
In this embodiment, referring to fig. 1, the second adhesive layer 13 is disposed between the first part 141 and the integrated circuit 3; the second adhesive layer 13, the exhaust layer 12, and the first adhesive layer 11 are sequentially disposed between the second part 142 and the flexible printed circuit board 2.
The exhaust layer 12 may be made of a porous material having a pore structure, and in this embodiment, it is preferable that the exhaust layer 12 is made of a resin foam material having a pore structure; the pore structures in the exhaust layer 12 communicate with each other to form the exhaust passage 121; the resin foaming material has the advantages of low price, light weight and good bonding property with an adhesive; preferably, the resin foam may use low-density polyether, which not only has the advantages of the above resin foam, but also has low water absorption, so as to prevent the integrated circuit 3 from being affected with moisture due to high water absorption of the exhaust layer 12. The pore structure is an irregular pore structure, and the exhaust passages 121 formed by the interconnected pore structures are also irregular, as shown in fig. 4; since the exhaust stack 12 is in contact with only the second portion 142 of the heat dissipation layer 14, the heat dissipation performance of the exhaust stack 12 need not be considered.
It should be understood that the above-mentioned selection of the material of the exhaust stack 12 is a preferred embodiment, and a person skilled in the art may also select other types of materials with a channel/continuous pore structure for the exhaust stack 12 in order to achieve the corresponding technical effect.
Preferably, the heat dissipation layer 14 is used for conducting heat generated by the integrated circuit 3 to the surrounding environment, so the heat dissipation layer 14 needs to have high thermal conductivity; the heat dissipation layer 14 also needs good flexibility because the surface of the heat dissipation member is not flat when it is attached; the material of the heat dissipation layer 14 can be selected from a heat-conducting metal material, a heat-conducting non-metal material, or a composite material of the heat-conducting metal material and the heat-conducting non-metal material.
The heat-conducting metal material is preferably a metal heat-conducting sheet; the metal heat conducting sheet can deform, and the deformation of the metal heat conducting sheet can be kept; the heat-conducting metal material can be selected from metals with high heat conductivity, such as silver, copper, gold, aluminum or alloy materials of the metals; from the aspect of cost, the heat dissipation layer 14 is more preferably a thermally conductive copper sheet or a thermally conductive aluminum sheet.
Further, when the metal heat conductive sheet is used as the heat dissipation layer 14, the area of the heat dissipation layer 14 may be larger than the areas of the exhaust layer 12 and the first adhesive layer 11; in the above design, the heat dissipation layer 14 also has the function of supporting the shape of the whole heat dissipation member; since the heat dissipation layer 14 is a heat conductive metal material, the deformation thereof is irreversible; when the heat sink is attached to the IC, the tension of the transition portion between the first portion 141 and the second portion 142 on the heat sink is small; thereby preventing the influence of the tension on the second portion 142 and improving the firmness of the attachment of the heat sink.
Further, the metal heat conduction sheet includes a first surface and a second surface, and the first surface of the metal heat conduction sheet may be coated with an adhesive and bonded to the exhaust layer 12 through the adhesive; the second surface of the metal heat conducting sheet is not a flat plane and can be provided with a continuous dentate or wavy convex structure; the convex structure increases the specific surface area of the metal heat conducting sheet; the increase of the specific surface area of the metal heat conducting sheet also represents the increase of the heat exchange area of the metal heat conducting sheet; thereby further increasing the thermal conductivity of the heat sink layer 14.
The heat-conducting non-metallic material is preferably a graphene heat-conducting film; the graphene heat-conducting film provided by the utility model comprises a substrate and a graphene layer, wherein the substrate comprises one or a combination of more of PET (polyethylene terephthalate), copper foil, aluminum foil and the like; the graphene layer is graphene coated on the first surface of the substrate; compared with a heat-conducting metal material, the heat-conducting coefficient of the graphene heat-conducting film can reach more than 1000W/m.k, and the IC can be effectively radiated; the substrate comprises a second side opposite to the first side, and the second side can be coated with a glue layer; the heat dissipation layer 14 is adhered to the exhaust layer 12 through the adhesive layer.
Further, a first surface of the graphene layer is bonded to a first surface of the substrate; the second surface of the graphene layer is not a flat plane and can be provided with a continuous dentate or wavy convex structure; the convex structure increases the specific surface area of the graphene layer; the increase of the specific surface area of the graphene layer also represents the increase of the heat exchange area of the graphene layer; thereby further increasing the thermal conductivity of the heat dissipation layer 14.
The first adhesive layer 11 and the second adhesive layer 13 are single-layer adhesive layers; the single-layer adhesive layer can be acrylic adhesive, and can also be other types of adhesives; it should be understood that the first adhesive layer 11 and the second adhesive layer 13 can also be other types of glue layers; for example, the first adhesive layer 11 and the second adhesive layer 13 may be double-sided tapes, and the base materials of the double-sided tapes may be provided with vent holes.
Example 2
In this embodiment, the chip on film includes a flexible circuit board 2, an integrated circuit 3 mounted on the flexible circuit board 2, and a heat sink 1 mounted on the flexible circuit board 2, where the heat sink 1 includes:
a heat dissipation layer 14 made of a heat conductive material;
an exhaust layer 12 having an exhaust passage therein for exhausting an air layer between the flexible wiring board and the heat sink;
a first adhesive layer 11 provided between the exhaust layer 12 and the flexible wiring board 2;
and a second adhesive layer 13 provided between the exhaust layer 12 and the heat dissipation layer 14.
Further, referring to fig. 5, the heat dissipation layer 14; comprises that
A first portion 141 attached to the integrated circuit 3; and the number of the first and second groups,
a second portion 142; located around the first portion 141; the second portion 142 is attached to the flexible wiring board 2.
The integrated circuit 3 comprises a driving chip arranged on the flexible circuit board 2; the first portion 141 of the heat dissipation layer 14 is attached to the surface of the driving chip; the second part 142 is attached to the flexible circuit board 2; the first portion 141 mainly plays a role of heat dissipation, and the second portion 142 mainly plays a role of fixing.
Further, referring to fig. 5, the second adhesive layer 13, the exhaust layer 12 and the first adhesive layer 11 are sequentially disposed between the first portion 141 and the integrated circuit 3; the second adhesive layer 13, the exhaust layer 12, and the first adhesive layer 11 are sequentially disposed between the second part 142 and the flexible printed circuit board 2.
This embodiment differs from the above embodiment 1 in that the first part 141 also includes the first adhesive layer 11, the exhaust layer 12; since the first portion 141 also has the air release layer 12, the adhesion of the first portion 141 to the integrated circuit 3 is more secure than in embodiment 1; more importantly, the exhaust layer 12 of the first portion 141 has an impact absorbing function, and can effectively protect the integrated circuit 3.
In the present embodiment, since the exhaust layer 12 is provided between the first portion 141 and the integrated circuit 3; the exhaust layer 12 also takes heat conduction into consideration.
Optionally, the exhaust layer 12 may be made of a heat-conducting foaming resin material, where the heat-conducting foaming resin material is formed by adding a heat-conducting material in a formula of a foaming resin, and the heat-conducting material may be one or a combination of more of alumina powder, graphite, magnesium oxide, calcium silicate, and copper powder.
Alternatively, the exhaust layer 12 may be made of a flexible porous heat-conducting material, such as heat-conducting foam. The heat-conducting foam is made of composite materials and comprises a porous flexible substrate and a heat-conducting part embedded in the substrate.
Optionally, the exhaust layer 12 may be made of a flexible heat conducting material, such as a heat conducting silica gel, where the silica gel is doped with a heat conducting material, and the heat conducting material may be one or more of alumina powder, graphite, magnesium oxide, calcium silicate, and copper powder; in the present preferred embodiment, a plurality of through channels may be processed and formed in the exhaust layer 12 to form the exhaust channel 121, referring to fig. 6, the exhaust channel 121 communicates the first adhesive layer 11 with the external environment, and the heat sink generally generates bubbles during the adhering process; through pressing, the gas in the bubble is passed through exhaust passage 121 discharges to the external environment to make the bubble eliminate, thereby solve the attached insecure problem of the heat dissipation subsides among the prior art from the root.
Example 3:
referring to fig. 7, the present embodiment provides a display module, which includes a display panel 4 and a PCB (printed circuit board) 5, wherein the display panel 4 and the PCB (printed circuit board) 5 are connected by the flip chip, and a specific connection manner is shown in fig. 7.
Further, one end of the chip on film is mounted on the display panel 4, and the other end of the chip on film is mounted on the PCB 5; the heat dissipation member 1 on the chip on film comprises a first end and a second end which are opposite, wherein the first end is close to the PCB 5, and the second end is close to the display panel 4; the PCB 5 can generate high heat during operation, and in order to prevent the sticking firmness of the heat radiating piece 1 on the flexible circuit board 2, a safe interval A is required between the first end of the heat radiating piece 1 and the PCB 5.
Because the position of the integrated circuit 3 and the total length of the chip on film need to be matched with the whole machine and cannot be adjusted at will, the adhesion area of the part of the heat dissipation member 1 close to one side of the PCB 5 is smaller due to the existence of the safety distance A; in this embodiment, since the heat sink 1 is provided with the air discharge layer 12, the air discharge layer 12 can discharge the air layer between the heat sink 1 and the flexible printed circuit board 2, and therefore, even when the heat sink 1 has a small attachment area, the heat sink 1 and the flexible printed circuit board 2 have high attachment firmness.
It should be understood that the above-described embodiments 1, 2 and 3 are three embodiments of the present invention; the technical features of the solutions in the three embodiments described above can be combined with each other to form a new embodiment.
It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The foregoing is merely a detailed description of the utility model that enables one skilled in the art to understand or practice the utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The utility model provides a chip on film, includes flexible line way board (2), install in integrated circuit (3) on flexible line way board (2) and install in heat dissipation piece (1) of flexible line way board (2), its characterized in that, heat dissipation piece (1) includes:
the heat dissipation layer (14) is made of heat conduction materials;
an air discharge layer (12) for discharging an air layer between the flexible wiring board (2) and the heat sink (1);
the first pasting layer (11) is arranged between the exhaust layer (12) and the flexible circuit board (2);
and a second adhesive layer (13) provided between the exhaust layer (12) and the heat dissipation layer (14).
2. The chip on film according to claim 1, wherein the air vent layer (12) has air vent channels (121); the air discharge channel (121) communicates the first adhesive layer (11) with the external environment.
3. The chip on film according to claim 2, wherein the venting layer (12) has a pore structure; the pore structures are communicated with each other to form the exhaust channel (121).
4. The COF of claim 3, wherein the air venting layer (12) is made of a thermally conductive foam.
5. The COF of claim 2, wherein the venting layer (12) is made of a thermally conductive silicone; and a plurality of through channels are arranged in the heat-conducting silica gel to form the exhaust channel (121).
6. The chip on film according to claim 1, wherein the heat dissipation layer (14) is a metal heat conductive sheet, the metal heat conductive sheet comprises a first surface and a second surface, and the first surface of the metal heat conductive sheet is coated with the second adhesive layer (13); the second surface of the metal heat conducting sheet is provided with a continuous dentate or wavy convex structure.
7. The chip on film according to claim 1, wherein the heat spreading layer (14); comprises that
A first portion (141) attached to the integrated circuit (3); and the number of the first and second groups,
a second portion (142); located around the first portion (141); the second portion (142) is attached to the flexible wiring board (2).
8. COF-F according to claim 7, characterized in that said second adhesive layer (13) is provided between said first part (141) and said integrated circuit (3); the second pasting layer (13), the exhaust layer (12) and the first pasting layer (11) are sequentially arranged between the second part (142) and the flexible circuit board (2).
9. COF according to claim 7, characterized in that between the first part (141) and the integrated circuit (3) in turn is provided the second glue layer (13), the venting layer (12) and the first glue layer (11); the second pasting layer (13), the exhaust layer (12) and the first pasting layer (11) are sequentially arranged between the second part (142) and the flexible circuit board (2).
10. A display module comprising a display panel (4) and a PCB board (5), wherein the display panel (4) and the PCB board (5) are connected by a flip-chip film according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123272380.9U CN216982187U (en) | 2021-12-23 | 2021-12-23 | Chip on film and display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123272380.9U CN216982187U (en) | 2021-12-23 | 2021-12-23 | Chip on film and display module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216982187U true CN216982187U (en) | 2022-07-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123272380.9U Active CN216982187U (en) | 2021-12-23 | 2021-12-23 | Chip on film and display module |
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| Country | Link |
|---|---|
| CN (1) | CN216982187U (en) |
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- 2021-12-23 CN CN202123272380.9U patent/CN216982187U/en active Active
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