CN111394000B - Heat dissipation type conductive double-sided adhesive tape and production process thereof - Google Patents
Heat dissipation type conductive double-sided adhesive tape and production process thereof Download PDFInfo
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- CN111394000B CN111394000B CN202010378112.6A CN202010378112A CN111394000B CN 111394000 B CN111394000 B CN 111394000B CN 202010378112 A CN202010378112 A CN 202010378112A CN 111394000 B CN111394000 B CN 111394000B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/21—Paper; Textile fabrics
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/26—Presence of textile or fabric
- C09J2400/263—Presence of textile or fabric in the substrate
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Abstract
The invention relates to the technical field of conductive double-sided adhesive tapes, in particular to a heat dissipation type conductive double-sided adhesive tape and a production process thereof, wherein the heat dissipation type conductive double-sided adhesive tape comprises a bearing layer, a colloid layer and a release layer which are sequentially arranged from bottom to top, the colloid layer comprises a conductive adhesive layer and a heat dissipation adhesive layer group, the heat dissipation adhesive layer group comprises an upper adhesive layer, a graphite sheet and a lower adhesive layer which are sequentially adhered from top to bottom, the thickness of the conductive adhesive layer is the same as the total thickness of the heat dissipation adhesive layer group, a heat conduction gap is formed between the conductive adhesive layer and the heat dissipation adhesive layer group at intervals, and the width of the heat conduction gap is 0.5-0.8 mm; the conductive adhesive layer is used for being matched with the copper exposing area of the flexible circuit board; the shape of going up glue film and glue film down and graphite flake looks adaptation, and go up the outline of glue film and glue film down side reason protrusion in the graphite flake, go up the glue film and glue film down and bond each other and be formed with the cladding glue of graphite flake cladding. The heat dissipation type conductive double-sided adhesive tape has high overall heat dissipation efficiency.
Description
Technical Field
The invention relates to the technical field of conductive double-sided adhesive tapes, in particular to a heat dissipation type conductive double-sided adhesive tape and a production process thereof.
Background
The flexible printed circuit is usually bonded to a predetermined position of the electronic product by using a conductive double-sided tape, so as to simultaneously realize the relative fixation between the flexible printed circuit and the electronic product and the circuit conduction.
After realizing that the circuit switches on between flexible circuit board and the electronic product, inevitably can produce the heat because of the existence of resistance, predetermine the condition that the position bonding department appears the local rise of temperature for reducing flexible circuit board and electronic product, still can cooperate heat dissipation double faced adhesive tape usually, when promoting between flexible circuit board and the electronic product stability of being connected, promote the radiating efficiency that flexible circuit board and electronic product predetermine the position bonding department.
In order to use the convenience, also formed the electrically conductive double faced adhesive tape of heat dissipation type including electrically conductive double faced adhesive tape and heat dissipation double faced adhesive tape simultaneously afterwards gradually, mainly included bearing layer, colloid layer and from the type layer, wherein, the colloid layer includes electrically conductive glue layer and heat dissipation adhesive tape unit group, and electrically conductive glue layer is used for with waiting to bond the exposed copper district looks adaptation of flexible circuit board. The heat dissipation glue film group includes glue film, graphite flake and rubber coating down, goes up the glue film and bonds with rubber coating down and be formed with the cladding glue of graphite flake cladding for reduce the graphite flake side reason and expose and the condition of the graphite miropowder that drops.
The heat dissipation type electrically conductive double faced adhesive tape among the prior art is usually simply to place electrically conductive double faced adhesive tape and heat dissipation double faced adhesive tape and use together, and in the in-service use, because of the good heat conductivility of graphite flake, the heat that flexible circuit board and electronic product pass through the bonding department of heat dissipation glue film can be better gives off, nevertheless the bonding department of electrically conductive double faced adhesive tape still has the condition that the radiating efficiency is low.
Disclosure of Invention
A first object of the present invention is to provide a heat dissipation type conductive double-sided tape having high overall heat dissipation efficiency.
The above object of the present invention is achieved by the following technical solutions: a heat dissipation type electric conduction double-sided adhesive comprises a bearing layer, a colloid layer and a release layer which are sequentially arranged from bottom to top, wherein the colloid layer comprises an electric conduction adhesive layer and a heat dissipation adhesive layer group, the heat dissipation adhesive layer group comprises an upper adhesive layer, a graphite sheet and a lower adhesive layer which are sequentially adhered from top to bottom, the thickness of the electric conduction adhesive layer is the same as the total thickness of the heat dissipation adhesive layer group, a heat conduction gap is formed between the electric conduction adhesive layer and the heat dissipation adhesive layer group at intervals, and the width of the heat conduction gap is 0.5-0.8 mm; the conductive adhesive layer is used for being matched with a copper exposure area of the flexible circuit board; the shape of going up glue film and glue film down matches with the graphite flake, just go up the outline of glue film and glue film down in the side edge protrusion in the graphite flake, go up the glue film and glue film down and bond each other and be formed with the cladding glue of graphite flake cladding.
By adopting the technical scheme, due to the excellent heat-conducting property of the graphite sheet, the heat of the bonding part of the flexible circuit board and the electronic product through the heat-radiating adhesive layer can be better radiated; meanwhile, when the temperature of the bonding part of the conductive adhesive layer rises due to heat, the heat of one side, close to the heat dissipation adhesive layer group, of the conductive adhesive layer can be conducted away through the heat conduction gap by the heat dissipation adhesive layer group, so that the effect of reducing the temperature of the outer side of the conductive adhesive layer is achieved, the temperature difference between the inner part and the outer part of the conductive adhesive layer is increased, the effect of improving the heat dissipation efficiency of the conductive adhesive layer is achieved, and the integral heat dissipation efficiency of the heat dissipation type conductive double-sided adhesive is improved; the smaller the thickness of the heat conduction gap is, the better the heat conduction effect of the heat dissipation adhesive layer group on the electric conduction adhesive layer is, but when the heat conduction gap is too small, the situation that the electric conduction adhesive layer is mistakenly cut to cover the adhesive in the heat dissipation adhesive layer group due to the punching error in the die cutting process is easy to occur; the width of the heat conduction gap is set to be 0.5-0.8mm, so that the condition that coating glue in the heat dissipation glue layer set is mistakenly cut can be reduced while the good heat dissipation efficiency of the heat dissipation glue layer set on the electric conduction glue layer is realized, and the good coating effect of the coating glue on the graphite flake is kept.
Preferably, the thickness of the graphite sheet is 0.4 to 0.6 times of the total thickness of the heat dissipation glue layer set.
By adopting the technical scheme, the graphite flake is used as the radiating fin in the radiating gel layer group, the larger the thickness ratio of the graphite flake in the radiating gel layer group is, the better the radiating effect can be realized, but the thickness ratio of the upper gel layer to the lower gel layer is relatively reduced, and the bonding effect of the radiating gel layer group can be reduced; the thickness of the graphite flake is set to be 0.4-0.6 times of the total thickness of the heat dissipation adhesive layer group, so that the good heat dissipation effect of the heat dissipation adhesive layer group can be realized, and the good bonding stability of the heat dissipation adhesive layer group to the FPC and the electronic product can be kept.
Preferably, the distance between the outer edge of the coating glue and the side edge of the graphite sheet is 0.5-0.8 mm.
By adopting the technical scheme, the coating glue formed after the upper adhesive layer and the lower adhesive layer are bonded is used for coating the graphite flake, so that the situation that the graphite flake falls off due to the exposure of the side edge of the graphite flake is reduced, the good heat dissipation performance of the graphite flake is maintained, and the short circuit of a circuit caused by the falling of the graphite flake is avoided; meanwhile, the heat conduction performance and the heat dissipation efficiency of the graphite flake can be reduced by coating the side edge of the graphite flake by the coating adhesive, the smaller the distance between the outer side edge of the coating adhesive and the side edge of the graphite flake is, the better the heat conduction performance and the heat dissipation efficiency of the graphite flake and the coating adhesive are, but the more easily the coating of the side edge of the graphite flake by the coating adhesive after die cutting forming is caused by die cutting errors; the distance between the outer edge of the coating adhesive and the side edge of the graphite flake is set to be 0.5-0.8mm, so that the good heat-conducting property and the heat-radiating efficiency of the graphite flake can be realized, and the good coating of the coating adhesive on the graphite flake can be maintained.
Preferably, the surface of the upper adhesive layer, which is far away from the graphite sheet, is used for being bonded with a preset position of an electronic product, and the surface of the lower adhesive layer, which is far away from the graphite sheet, is used for being bonded with a non-copper-exposed area of the flexible circuit board; the thickness of the lower adhesive layer is smaller than that of the upper adhesive layer.
Through adopting above-mentioned technical scheme, distribution density in the flexible circuit board is high, and it is also great relatively to receive the temperature rising to influence, and lower glue film is used for bonding mutually with the flexible circuit board, and makes the thickness of glue film down be less than the glue film, can make the graphite flake more be close to in the flexible circuit board, and then promotes the radiating efficiency of heat dissipation glue film group to the flexible circuit board.
Preferably, a heat conduction gap is formed between the conductive adhesive layer and the at least two heat dissipation adhesive layer groups.
Through adopting above-mentioned technical scheme, conductive adhesive layer forms the heat conduction clearance with two at least heat dissipation adhesive tape unit, utilizes a plurality of heat dissipation adhesive layer groups to carry out the heat conduction to the peripheral excessive heat that looses of conductive adhesive layer and gives off, increases the inside and outside temperature difference of conductive adhesive layer, reaches the effect that promotes conductive adhesive layer radiating efficiency, promotes the holistic radiating efficiency of heat dissipation type electrically conductive double faced adhesive tape.
Preferably, the conductive adhesive layer is a non-woven conductive adhesive layer.
By adopting the technical scheme, the woven fabric conductive adhesive layer is a conductive adhesive body with the non-woven fabric as the base material, has high conformability, can keep the adhesion tightness to the uneven surface, is adhered to the copper exposed area on the surface of the FPC by using the non-woven fabric conductive adhesive layer, is stable in adhesion and can keep excellent conductive performance.
The second purpose of the invention is to provide a production process of the heat dissipation type conductive double-sided adhesive tape, which has the advantage of high applicability.
The above object of the present invention is achieved by the following technical solutions: a production process of a heat dissipation type conductive double-sided adhesive tape is characterized by comprising the following steps:
s1, attaching the graphite flake to the protective film, removing the graphite flake with release paper, and attaching an isolation film on the graphite flake;
s2, punching the isolating film by using a first cutting die, half-cutting the isolating film to the protective film, and removing graphite sheet outer frame waste and isolating film waste to obtain graphite sheets which are loaded on the protective film and take a preset shape;
s3, attaching the first double-sided adhesive to the upper part of the graphite sheet, removing the release paper carried by the first double-sided adhesive, and attaching the release layer to the first double-sided adhesive;
s4, turning over the product obtained in the step S3 to enable the protective film to be located above, removing the protective film, attaching the second double-sided adhesive to the side, away from the first double-sided adhesive, of the graphite sheet, enabling the second double-sided adhesive to be bonded with the first double-sided adhesive and to wrap the graphite sheet, and replacing the self-carrying release paper of the second double-sided adhesive with white check paper;
s5, punching the white check paper by using a second cutting die, half-cutting the white check paper to the release layer, removing waste materials of an outer frame of the white check paper, and reserving the white check paper on the second double-sided adhesive area to obtain a heat dissipation adhesive layer group which is borne on the release layer and covered with the white check paper;
s6, adhering the conductive double-sided adhesive to the heat dissipation adhesive layer group, changing the release paper of the conductive double-sided adhesive into white check paper, punching the white check paper by using a third cutting die, half-cutting the white check paper to the release layer, removing waste materials in an adhesive-free area, removing the white check paper on the adhesive area of the conductive double-sided adhesive and the adhesive area of the second double-sided adhesive, and obtaining the heat dissipation adhesive layer group borne on the release layer and a conductive adhesive layer with a preset shape; the heat-conducting gap is formed between the conductive adhesive layer and the heat-radiating adhesive layer group at intervals, and the width of the heat-conducting gap is 0.5-0.8 mm;
s7, attaching the bearing layer to the conductive double-sided adhesive tape and the second double-sided adhesive tape;
s8, turning over the product obtained in the step S7 to enable the release layer to be located above, punching the release layer by using a fourth cutting die, half-cutting the release layer to the bearing layer, removing waste materials of the external materials to obtain a finished product of the conductive double-sided adhesive, and rolling the finished product of the conductive double-sided adhesive into a roll material.
By adopting the technical scheme, the graphite flake is punched and formed by using the first cutting die, the first double-sided adhesive and the second double-sided adhesive are respectively attached to the two opposite surfaces of the graphite flake and are respectively used as the lower adhesive layer and the upper adhesive layer of the heat dissipation adhesive layer group, and then the lower adhesive layer and the lower adhesive layer are punched by using the second cutting die to form the heat dissipation adhesive layer group; then, punching and forming the conductive double-sided adhesive tape by using a third cutting die to form a conductive adhesive layer, and finally punching and forming a release layer covering the conductive adhesive layer and the heat dissipation adhesive layer by using a fourth cutting die to finish the production of the heat dissipation type conductive double-sided adhesive tape; simultaneously, through changing a plurality of cutting dies, can produce the electrically conductive double faced adhesive tape of heat dissipation type that adapts to different flexible circuit board surfaces, production technology is simple and convenient and the suitability is high.
Preferably, before the finished product of the conductive double-sided adhesive is rolled in the step S8, the residual adhesive on the finished product of the conductive double-sided adhesive is removed by using a plain film.
Through adopting above-mentioned technical scheme, use the plain film to clear up the cull on the electrically conductive double faced adhesive tape finished product, reduce the cull and remain in the off-the-shelf condition of electrically conductive double faced adhesive tape, promote the off-the-shelf quality of electrically conductive double faced adhesive tape.
In summary, the invention includes at least one of the following beneficial technical effects:
1. the heat dissipation adhesive layer group can conduct away heat on one side, close to the heat dissipation adhesive layer group, of the conductive adhesive layer through the heat conduction gap, so that the effect of reducing the temperature of the outer side of the conductive adhesive layer is achieved, the temperature difference between the inner part and the outer part of the conductive adhesive layer is increased, the effect of improving the heat dissipation efficiency of the conductive adhesive layer is achieved, and the integral heat dissipation efficiency of the heat dissipation type conductive double-sided adhesive is improved;
2. the thickness of the graphite flake is set to be 0.4-0.6 times of the total thickness of the heat dissipation adhesive layer group, so that the good heat dissipation effect of the heat dissipation adhesive layer group can be realized, and the good bonding stability of the heat dissipation adhesive layer group to the FPC and the electronic product can be kept;
3. the distance between the outer edge of the coating adhesive and the side edge of the graphite flake is set to be 0.5-0.8mm, so that the good heat-conducting property and the heat-radiating efficiency of the graphite flake can be realized, and the good coating of the coating adhesive on the graphite flake can be maintained;
4. the thickness of the lower adhesive layer is smaller than that of the upper adhesive layer, so that the graphite flake can be closer to the flexible circuit board, and the heat dissipation efficiency of the heat dissipation adhesive layer for the flexible circuit board is further improved;
5. utilize a plurality of heat dissipation glue film groups to carry out the heat conduction to the peripheral heat that overflows of conductive adhesive layer and give off, increase the inside and outside temperature difference of conductive adhesive layer, reach the effect that promotes conductive adhesive layer radiating efficiency.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation type conductive double-sided tape in an embodiment of the invention.
Fig. 2 is a schematic structural diagram of a colloid unit in an embodiment of the present invention.
Fig. 3 is a sectional view taken in the direction of a-a in fig. 2.
Fig. 4 is a schematic cross-sectional view of a heat dissipation adhesive layer set according to an embodiment of the invention.
Reference numerals: 1. a carrier layer; 2. a colloidal layer; 21. a colloid unit; 211. a non-woven conductive adhesive layer; 212. a heat dissipation rubber layer group; 212a, a lower adhesive layer; 212b, graphite sheets; 212c, a sizing layer; 22. a release layer; 22a, a release handle; 3. a thermally conductive gap.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1, the heat dissipation type conductive double-sided tape disclosed by the present invention includes a carrier layer 1, a colloid layer 2 and a release layer 22, which are sequentially arranged from bottom to top, wherein the carrier layer 1 is a transparent silica gel protective film, the colloid layer 2 is located above the carrier layer 1, the colloid layer 2 and the release layer 22 form a colloid unit 21, the colloid unit 21 is provided in a plurality, the colloid units 21 are arranged on the carrier layer 1 at intervals along the length direction of the carrier layer 1, and the carrier layer 1 can be finally rolled into a roll material which occupies a small space and is convenient to transport.
Referring to fig. 2 and 3, the colloid layer 2 includes a conductive adhesive layer and a heat dissipation adhesive layer group 212, the conductive adhesive layer is a non-woven fabric conductive adhesive layer 211 of a non-woven fabric substrate for matching with the copper exposed area of the flexible circuit board; the non-woven fabric conductive adhesive layer 211 has high conformability, can bond firmly to the unevenness surface, uses the non-woven fabric conductive adhesive layer 211 to bond the copper-exposed area on the FPC surface, bonds stably and can keep good electric conductivity. In this embodiment, the non-woven conductive adhesive layer 211 may be formed by removing the adhesive layer 2 with the release paper from a 3M9750 double-sided adhesive tape.
In addition, the thickness a of the non-woven fabric conductive adhesive layer 211 is the same as the total thickness b of the heat dissipation adhesive layer group 212, and in the embodiment, the thickness a = the thickness b =0.05 mm. In addition, the non-woven fabric conductive adhesive layer 211 and the at least two heat dissipation adhesive layer groups 212 are spaced to form a heat conduction gap 3; in this embodiment, the width c =0.6mm of heat conduction clearance 3 to make the heat conduction away that heat dissipation glue layer group 212 can in time just in a short time and in a short time put non-woven fabrics conducting resin layer 211 near heat dissipation glue layer group 212 through heat conduction clearance 3, reduce non-woven fabrics conducting resin layer 211 outside temperature, increase the inside and outside temperature difference of non-woven fabrics conducting resin layer 211, thereby promote non-woven fabrics conducting resin layer 211's radiating efficiency.
Referring to fig. 3 and 4, the heat dissipation adhesive layer group 212 includes a lower adhesive layer 212a, a graphite sheet 212b and an upper adhesive layer 212c, which are sequentially adhered from bottom to top, wherein the upper adhesive layer 212c and the lower adhesive layer 212a are both common double-sided adhesive, and the upper adhesive layer 212c and the lower adhesive layer 212a are matched with the graphite sheet 212b in shape; meanwhile, the side edges of glue-coated layer 212c and glue-coated layer 212a protrude from the outer contour of graphite sheet 212b, so that glue-coated layer 212c and glue-coated layer 212a are bonded to each other to form a coating glue coating graphite sheet 212 b.
Referring to fig. 4, the heat conduction performance and the heat dissipation efficiency of graphite sheet 212b are also reduced by coating the side edges of graphite sheet 212b with the coating adhesive, and the smaller the distance d between the outer side edge of the coating adhesive and the side edges of graphite sheet 212b is, the better the heat conduction performance and the heat dissipation efficiency of graphite sheet 212b and the outside of the coating adhesive are, but the more easily the coating adhesive does not completely coat the side edges of graphite sheet 212b after die cutting is performed due to die cutting errors. In this embodiment, setting the distance d between the outer edge of the coating adhesive and the side edge of graphite sheet 212b to 0.6mm can maintain good coating of graphite sheet 212b with the coating adhesive while achieving good heat conductivity and heat dissipation efficiency of graphite sheet 212 b.
Referring to fig. 4, in the thermal adhesive layer set 212, the larger the thickness ratio of the graphite sheet 212b in the thermal adhesive layer set 212 is, the better the thermal dissipation effect can be achieved, but the thickness ratio of the upper adhesive layer 212c to the lower adhesive layer 212a is relatively reduced, which in turn reduces the bonding effect of the thermal adhesive layer set 212; in this embodiment, the thickness b1 of the graphite edge is set to be 1/2 of b, that is, the thickness b1 of the graphite sheet 212b is 0.025mm, so that the good heat dissipation effect of the heat dissipation adhesive layer group 212 can be realized, and the good adhesion stability of the heat dissipation adhesive layer group 212 to the FPC and the electronic product can be maintained.
In addition, the surface of lower adhesive layer 212a away from graphite sheet 212b is used for bonding with the non-copper-exposed area of the flexible circuit board, and the surface of upper adhesive layer 212c away from graphite sheet 212b is used for bonding with the preset position of the electronic product; because of the high wiring density in the flexible circuit board, relatively influenced by temperature rise is also great, makes thickness b2 of lower glue film 212a be less than thickness b3 of last glue film 212c, can make graphite piece 212b more be close to the flexible circuit board, and then promotes the radiating efficiency of heat dissipation glue film group 212 to the flexible circuit board. In this embodiment, in order to select the glue corresponding to the lower glue layer 212a and the upper glue layer 212c, the thickness b2 of the lower glue layer 212a and the thickness b3 of the upper glue layer 212c are both set to be the common thickness of the double-sided glue in the market; specifically, the thickness b2=0.01mm of the lower adhesive layer 212a, and the thickness b3=0.015mm of the upper adhesive layer 212 c.
Referring to fig. 2 and 3, the release layer 22 is a blue film, and the lower surface of the release layer 22 is a release surface and is adhered to the upper surface of the glue layer 212 c. In order to facilitate the worker to tear the release layer 22 from the upper side of the colloid layer 2, a release handle 22a for the worker to pinch is extended from one edge of the release layer 22; the release handle 22a is shaped like a rectangle, and the release handle 22a and the release layer 22 are integrally formed.
The implementation principle of the embodiment is as follows: due to the excellent heat-conducting property of graphite sheet 212b, the heat at the bonding position of the flexible circuit board and the electronic product through the heat-radiating adhesive layer can be better radiated; simultaneously, when the temperature rises because of the heat when the bonding department of non-woven fabrics conductive adhesive layer 211, a plurality of heat dissipation glue film group 212 can in time lead away the heat that non-woven fabrics conductive adhesive layer 211 is close to heat dissipation glue film group 212 one side through heat conduction clearance 3, play the effect that reduces non-woven fabrics conductive adhesive layer 211 outside temperature, increase the inside and outside temperature difference of non-woven fabrics conductive adhesive layer 211, thereby promote the radiating efficiency of non-woven fabrics conductive adhesive layer 211, and then promote the holistic radiating efficiency of the electrically conductive double faced adhesive tape of heat dissipation type.
The thickness b1 of the graphite sheet 212b is set to be 1/2 of the total thickness b of the heat dissipation adhesive layer group 212, so that the good heat dissipation effect of the heat dissipation adhesive layer group 212 can be realized, and the good bonding stability of the heat dissipation adhesive layer group 212 to the FPC and the electronic product can be kept; meanwhile, the distance d between the outer edge of the coating adhesive and the side edge of the graphite sheet 212b is set to be 0.6mm, so that the coating adhesive can keep good coating on the graphite sheet 212b while good heat-conducting performance and heat-radiating efficiency of the graphite sheet 212b are realized.
The invention discloses a production process of a heat dissipation type conductive double-sided adhesive tape, which comprises the following steps:
s1, attaching the graphite sheet 212b to the protective film, removing the graphite sheet 212b from the release paper, and attaching the isolation film to the graphite sheet 212 b.
Wherein, graphite sheet 212 b's thickness is 0.025mm, and the protection film can select the silica gel protection film, and the barrier film can select the net grain membrane.
And S2, punching the isolating film by using a first cutting die, half-cutting the isolating film to the protective film, and removing the waste materials of the outer frame of the graphite sheet 212b and the isolating film to obtain the graphite sheet 212b which is born on the protective film and is in a preset shape.
Specifically, graphite flake 212b all uses automatic waste discharging device to carry out the rolling and wastes discharge with the extra quality waste material of barrier film, and remaining barrier film waste material then uses OPP waste discharge sticky tape to glue on the graphite flake 212b and removes.
S3, attaching the first double-sided adhesive to the upper side of the graphite sheet 212b, removing the release paper of the first double-sided adhesive, and attaching the release layer 22 to the first double-sided adhesive.
S4, turning over the product obtained in the step S3 to enable the protective film to be located above, removing the protective film, attaching the second double-sided adhesive to the side, away from the first double-sided adhesive, of the graphite sheet 212b, enabling the second double-sided adhesive to be bonded with the first double-sided adhesive and to wrap the graphite sheet 212b, and changing the second double-sided adhesive from the release paper with the release paper into white check paper.
In the step S3, the first double-sided tape and the second double-sided tape are both common double-sided tapes, and in this embodiment, the first double-sided tape has a glue thickness of 0.01mm, and the second double-sided tape has a glue thickness of 0.015 mm.
And S5, punching the white check paper by using a second cutting die, half-cutting the white check paper onto the release layer 22, removing the waste of the outer frame of the white check paper, and reserving the white check paper on the second double-sided adhesive area to obtain the heat dissipation adhesive layer group 212 which is borne on the release layer 22 and covered with the white check paper.
And S6, adhering the conductive double-sided adhesive to the heat dissipation adhesive layer group 212, changing the release paper of the conductive double-sided adhesive into white check paper, punching the white check paper by using a third cutting die, half cutting the white check paper to the release layer 22, removing waste materials in the non-adhesive area, removing the white check paper in the adhesive area of the conductive double-sided adhesive and the adhesive area of the second double-sided adhesive, and obtaining the heat dissipation adhesive layer group 212 borne on the release layer 22 and the conductive adhesive layer with the preset shape. Wherein, the conductive adhesive layer and the heat dissipation adhesive layer group 212 are separated to form a heat conduction gap 3, and the width of the heat conduction gap 3 is 0.5-0.8 mm;
the conductive double-sided tape is a non-woven fabric conductive double-sided tape of a non-woven fabric substrate, and in this embodiment, the non-woven fabric conductive double-sided tape is a 3M9750 double-sided tape with a glue thickness of 0.05 mm.
And S7, attaching the bearing layer 1 to the conductive double-sided adhesive tape and the second double-sided adhesive tape.
Wherein, the bearing layer 1 can be selected as a transparent silica gel protective film.
S8, turning over the product obtained in the step S7 to enable the release layer 22 to be located above, punching the release layer 22 by using a fourth cutter die, half-cutting the release layer to the bearing layer 1, removing the waste materials of the external materials to obtain a finished product of the conductive double-sided adhesive tape, removing the residual adhesive on the finished product of the conductive double-sided adhesive tape by using the plain film, and finally winding the finished product of the conductive double-sided adhesive tape into a coil material.
The embodiments of the present invention are preferred embodiments of the present invention, and the scope of the present invention is not limited by these embodiments, so: all equivalent changes made according to the structure, shape and principle of the invention are covered by the protection scope of the invention.
Claims (8)
1. The utility model provides a heat dissipation type electrically conductive double faced adhesive tape, includes bearer layer (1), colloid layer (2) and from type layer (22) that arrange in proper order from bottom to top, colloid layer (2) include conductive adhesive layer and heat dissipation adhesive layer group (212), heat dissipation adhesive layer group (212) include top-down adhesive last glue film (212c), graphite flake (212b) and lower glue film (212a) in proper order, its characterized in that: the thickness of the conductive adhesive layer is the same as the total thickness of the heat dissipation adhesive layer group (212), heat conduction gaps (3) are formed between the conductive adhesive layer and the heat dissipation adhesive layer group (212) at intervals, and the width of each heat conduction gap (3) is 0.5-0.8 mm; the conductive adhesive layer is used for being matched with a copper exposure area of the flexible circuit board; the shape of the upper glue layer (212c) and the lower glue layer (212a) is matched with that of the graphite sheet (212b), the side edges of the upper glue layer (212c) and the lower glue layer (212a) protrude out of the outer contour of the graphite sheet (212b), and the upper glue layer (212c) and the lower glue layer (212a) are bonded with each other to form wrapping glue wrapping the graphite sheet (212 b).
2. The heat dissipation type conductive double-sided tape according to claim 1, wherein: the thickness of the graphite sheet (212b) is 0.4-0.6 times of the total thickness of the heat dissipation gel layer group (212).
3. The heat dissipation type conductive double-sided tape according to claim 1, wherein: the space between the outer edge of the coating glue and the side edge of the graphite sheet (212b) is 0.5-0.8 mm.
4. The heat dissipation type conductive double-sided tape according to claim 1, wherein: the surface of the upper adhesive layer (212c) far away from the graphite sheet (212b) is used for being adhered with a preset position of an electronic product, and the surface of the lower adhesive layer (212a) far away from the graphite sheet (212b) is used for being adhered with a non-exposed copper area of the flexible circuit board; the thickness of the lower adhesive layer (212a) is smaller than that of the upper adhesive layer (212 c).
5. The heat dissipation type conductive double-sided tape according to claim 1, wherein: and a heat conduction gap (3) is formed between the conductive adhesive layer and the at least two heat dissipation adhesive layer groups (212).
6. The heat dissipation type conductive double-sided tape according to claim 1, wherein: the conductive adhesive layer is a non-woven fabric conductive adhesive layer (211).
7. A production process of a heat dissipation type conductive double-sided adhesive tape is characterized by comprising the following steps:
s1, attaching the graphite sheet (212b) to the protective film, removing the graphite sheet (212b) from release paper, and attaching the isolation film to the graphite sheet (212 b);
s2, punching the isolating film by using a first cutting die, half-cutting the isolating film to the protective film, and removing the graphite sheet (212b) outer frame waste and the isolating film waste to obtain a graphite sheet (212b) which is borne on the protective film and takes a preset shape;
s3, attaching the first double-sided adhesive to the upper part of the graphite sheet (212b), removing release paper carried by the first double-sided adhesive, and attaching the release layer (22) to the first double-sided adhesive;
s4, turning over the product obtained in the step S3 to enable the protective film to be located above, removing the protective film, attaching the second double-sided adhesive to the side, away from the first double-sided adhesive, of the graphite sheet (212b), enabling the second double-sided adhesive to be bonded with the first double-sided adhesive and wrapping the graphite sheet (212b), and changing the self-carrying release paper of the second double-sided adhesive into white check paper;
s5, punching the white check paper by using a second cutting die, half-cutting the white check paper onto the release layer (22), removing the waste of the outer frame of the white check paper, and reserving the white check paper on the second double-sided adhesive area to obtain a heat dissipation adhesive layer group (212) which is borne on the release layer (22) and covered with the white check paper;
s6, adhering the conductive double-sided adhesive to the heat dissipation adhesive layer group (212), changing the release paper of the conductive double-sided adhesive into white check paper, punching the white check paper by using a third cutting die, half-cutting the white check paper onto the release layer (22), removing waste materials in an adhesive-free area, removing the white check paper on the adhesive-containing area of the conductive double-sided adhesive and the adhesive-containing area of the second double-sided adhesive, and obtaining the heat dissipation adhesive layer group (212) borne on the release layer (22) and a conductive adhesive layer with a preset shape; the conductive adhesive layer and the heat dissipation adhesive layer group (212) are separated to form a heat conduction gap (3), and the width of the heat conduction gap (3) is 0.5-0.8 mm;
s7, attaching the bearing layer (1) to the conductive double-sided adhesive tape and the second double-sided adhesive tape;
s8, turning over the product obtained in the step S7 to enable the release layer (22) to be located above, punching the release layer (22) by using a fourth cutting die, half-cutting the release layer to the bearing layer (1), removing the waste materials of the external materials to obtain a finished product of the conductive double-sided adhesive, and rolling the finished product of the conductive double-sided adhesive into a roll material.
8. The production process of the heat dissipation type conductive double-sided tape according to claim 7, wherein: and before the conductive double-sided adhesive tape finished product is rolled in the step S8, the residual adhesive on the conductive double-sided adhesive tape finished product is removed by using a plain film.
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| CN112895667A (en) * | 2021-01-19 | 2021-06-04 | 合肥美凯电子有限公司 | Double-sided back local adhesive punching process |
| CN116042187B (en) * | 2022-12-30 | 2024-06-14 | 常州富烯科技股份有限公司 | Flexible graphite composite heat conducting film and preparation method thereof |
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