CN204022726U - A kind of high-heat-conductivity glue - Google Patents
A kind of high-heat-conductivity glue Download PDFInfo
- Publication number
- CN204022726U CN204022726U CN201420299790.3U CN201420299790U CN204022726U CN 204022726 U CN204022726 U CN 204022726U CN 201420299790 U CN201420299790 U CN 201420299790U CN 204022726 U CN204022726 U CN 204022726U
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- Prior art keywords
- heat
- sensitive adhesive
- copper foil
- adhesive layer
- pressure
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- Adhesive Tapes (AREA)
Abstract
The utility model discloses a kind of high-heat-conductivity glue, comprise stratum basale and be arranged on the pressure-sensitive adhesive layer of described stratum basale upper and lower surface, described stratum basale is copper foil layer, described pressure-sensitive adhesive layer and described copper foil layer cover adhering junction, on the two sides of Copper Foil, coat respectively heat conduction pressure sensitive adhesive, make its heat conductivility higher tens times than common high-heat-conductivity glue, and be applied in the thermally conductive material preparation of electronic applications, reasonable in design, has wide range of applications, and has splendid market-oriented prospect.
Description
Technical field
The utility model relates to thermally conductive material, relates in particular to a kind of high-heat-conductivity glue.
Background technology
Along with the develop rapidly of electron device microminiaturization, what especially highlight is that components and parts on electronic circuit board are day by day intensive, and electronic product surface temperature is also being raise, and the thermal management of electronic product becomes the important topic of product design.Present stage, what the electronics of all integrated component designs all needed consideration is exactly element surface temperature control problem, how effectively to control electronic element radiating and must play direct decisive role with the normal use of electronic product.
Summary of the invention
The purpose of this utility model is, for the deficiencies in the prior art, provides a kind of high-heat-conductivity glue, by being combined with of pressure-sensitive adhesive layer and copper foil layer, forms new thermally conductive material, effectively increased thermal conductivity.
For effectively addressing the above problem, the technical scheme that the utility model is taked is as follows:
A high-heat-conductivity glue, comprises stratum basale and is arranged on the pressure-sensitive adhesive layer of described stratum basale upper and lower surface, described stratum basale is copper foil layer, and described pressure-sensitive adhesive layer and described copper foil layer cover adhering junction.
Especially, between described pressure-sensitive adhesive layer and described copper foil layer, be provided with binder layer.
Especially, the described copper foil layer of the two-sided covering of described pressure-sensitive adhesive layer.
Especially, the direct and described pressure-sensitive adhesive layer of described copper foil layer covers and is connected.
The beneficial effects of the utility model: the high-heat-conductivity glue that the utility model provides, heat conduction pressure sensitive adhesive is coated respectively on two sides at Copper Foil, heat conduction pressure sensitive adhesive is by vinylformic acid glue, to be mixed with high conductive powder (aluminum oxide, zinc oxide, magnesium oxide, aluminium nitride, boron nitride etc.) to synthesize, and has the strongly adherent feature of high heat conduction.Make its heat conductivility higher tens times than common high-heat-conductivity glue, and be applied in the thermally conductive material preparation of electronic applications, reasonable in design, has wide range of applications, and has splendid market-oriented prospect.
Below in conjunction with accompanying drawing, the utility model is elaborated.
Accompanying drawing explanation
Fig. 1 is the disclosed high-heat-conductivity glue one-piece construction of the utility model schematic diagram.
Wherein:
001 copper foil layer, 002 pressure-sensitive adhesive layer, 003 binder layer.
Embodiment
Embodiment:
As shown in Figure 1, the high-heat-conductivity glue that the present embodiment provides, comprises stratum basale and is arranged on the pressure-sensitive adhesive layer 002 of described stratum basale upper and lower surface, described stratum basale is copper foil layer 001, and described pressure-sensitive adhesive layer 002 covers adhering junction with described copper foil layer 001.
Between described pressure-sensitive adhesive layer 002 and described copper foil layer 001, be provided with binder layer 003.The described copper foil layer 001 of the two-sided covering of described pressure-sensitive adhesive layer 002.Described copper foil layer 001 directly covers and is connected with described pressure-sensitive adhesive layer 002.
Applicant's statement, person of ordinary skill in the field is on the basis of above-described embodiment, by above-described embodiment step, combined with the technical scheme of utility model content part, thereby the new method or the structure that produce, also be one of record scope of the present utility model, the application, for making specification sheets simple and clear, is no longer enumerated other embodiment of these steps.
The major technique application of this embodiment:
The high-heat-conductivity glue that the utility model provides is coated respectively heat conduction pressure sensitive adhesive on the two sides of Copper Foil, heat conduction pressure sensitive adhesive is by vinylformic acid glue, to be mixed with high conductive powder (aluminum oxide, zinc oxide, magnesium oxide, aluminium nitride, boron nitride etc.) to synthesize, and has the strongly adherent feature of high heat conduction.Make its heat conductivility higher tens times than common high-heat-conductivity glue, and be applied in the thermally conductive material preparation of electronic applications, reasonable in design, has wide range of applications, and has splendid market-oriented prospect.The utility model illustrates implementation method of the present utility model and apparatus structure by above-described embodiment, but the utility model is not limited to above-mentioned embodiment, does not mean that the utility model must rely on aforesaid method and structure could be implemented.Person of ordinary skill in the field should understand; to any improvement of the present utility model; to the selected implementation method of the utility model equivalence replace and and the interpolation of step, the selection of concrete mode etc., within all dropping on protection domain of the present utility model and open scope.
The utility model is not limited to above-mentioned embodiment, and all employings and the utility model analog structure and method thereof realize all modes of the utility model object, all within protection domain of the present utility model.
Claims (4)
1. a high-heat-conductivity glue, is characterized in that, comprises stratum basale and is arranged on the pressure-sensitive adhesive layer of described stratum basale upper and lower surface, and described stratum basale is copper foil layer, and described pressure-sensitive adhesive layer and described copper foil layer cover adhering junction.
2. high-heat-conductivity glue according to claim 1, is characterized in that, between described pressure-sensitive adhesive layer and described copper foil layer, is provided with binder layer.
3. high-heat-conductivity glue according to claim 1, is characterized in that, the described copper foil layer of the two-sided covering of described pressure-sensitive adhesive layer.
4. high-heat-conductivity glue according to claim 1, is characterized in that, described copper foil layer directly covers and is connected with described pressure-sensitive adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420299790.3U CN204022726U (en) | 2014-06-06 | 2014-06-06 | A kind of high-heat-conductivity glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420299790.3U CN204022726U (en) | 2014-06-06 | 2014-06-06 | A kind of high-heat-conductivity glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204022726U true CN204022726U (en) | 2014-12-17 |
Family
ID=52062618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420299790.3U Expired - Fee Related CN204022726U (en) | 2014-06-06 | 2014-06-06 | A kind of high-heat-conductivity glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204022726U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111394000A (en) * | 2020-05-07 | 2020-07-10 | 东莞市星勤胶粘制品有限公司 | Heat dissipation type conductive double-sided adhesive tape and production process thereof |
-
2014
- 2014-06-06 CN CN201420299790.3U patent/CN204022726U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111394000A (en) * | 2020-05-07 | 2020-07-10 | 东莞市星勤胶粘制品有限公司 | Heat dissipation type conductive double-sided adhesive tape and production process thereof |
| CN111394000B (en) * | 2020-05-07 | 2021-10-08 | 东莞市星勤胶粘制品有限公司 | Heat dissipation type conductive double-sided adhesive tape and production process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170524 Address after: 518000, Shenzhen, Guangdong, Baoan District, Songgang street, Hongxing community, Daejeon Industrial Zone, No. 15 East Songgang Road, 2 building, third floor, C3 Patentee after: Shenzhen focus Electronic Materials Co., Ltd. Address before: Yizhou City, the Guangxi Zhuang Autonomous Region Hechi city 546399 Qing Yuan Zhen pan Tang Cun Chong Tun Liangshan No. 96 Patentee before: Wu Fudong |
|
| TR01 | Transfer of patent right | ||
| CP03 | Change of name, title or address |
Address after: 518000 Jinsha community, Jinsha community, Pingshan District, Shenzhen, Guangdong, 5 Patentee after: Shenzhen laibad Polytron Technologies Inc Address before: 518000 Guangdong Shenzhen Baoan District Songgang Street Hongxing community daitai industrial zone 15 Songgang Road 2 2 floor C3 Patentee before: Shenzhen focus Electronic Materials Co., Ltd. |
|
| CP03 | Change of name, title or address | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141217 Termination date: 20210606 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |