CN216979297U - Optical sensor packaging structure with light source emission unit and photosensitive unit - Google Patents

Abstract

The utility model discloses an optical sensor packaging structure with a light source emission unit and a photosensitive unit, which relates to the technical field of semiconductors and comprises: the base plate is basically provided with a first surface and a second surface which correspond to each other, and a through hole is formed in the base plate; a light source emission unit disposed on a first surface of the substrate; and the photosensitive area of the photosensitive unit corresponds to the through hole. The problem that the optical sensor packaging structure is overlarge in size in the horizontal direction can be solved.

Description

Optical sensor packaging structure with light source emission unit and photosensitive unit

Technical Field

The utility model relates to the technical field of semiconductors, in particular to an optical sensor packaging structure with a light source emitting unit and a light sensing unit.

Background

The Optical Sensor having the light source emitting unit and the light sensing unit is various in types, and includes a Time of flight (TOF) Sensor, an Optical Tracking Sensor (OTS), and the like, the light source emitting unit emits emitting light with a specific wavelength, and the light is reflected by a target object, and the light sensing unit receives incident light reflected by the target object, so as to achieve distance measurement, Optical Tracking, and the like. For example, a D-TOF (Direct-Time of flight) sensor, wherein the context interpretation can be Direct Time of flight. The sensor has a very simple working principle, the transmitting equipment can firstly transmit light pulses, the light pulses can be reflected when meeting obstacles, the propagation speed of the known light is certain, the time for receiving the reflected light is different when the distances are different, the distance from the light pulse transmitting position to the position of an object can be calculated by recording the reflection time of the light pulses, and the 3D form of the object can be drawn by continuously repeating the process. In short, 3D imaging of an object can be obtained by detecting the flight (round trip) time of the light pulse to obtain the target object distance.

In an existing optical sensor, both the photosensitive unit and the light source emitting unit are disposed on the same surface of the substrate, so that the photosensitive unit can receive reflected light emitted by the light source emitting unit and reflected by an object. However, in this case, the photosensitive unit and the light source emitting unit must be provided on the same surface of the substrate in a staggered manner, and the substrate must have a sufficient size in the horizontal direction.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above-mentioned defects in the prior art, embodiments of the present invention provide an optical sensor package structure having a light source emitting unit and a light sensing unit, which can solve the problem of an oversized optical sensor package structure in a horizontal direction.

The embodiment of the utility model has the following specific technical scheme:

an optical sensor package structure provided with a light source emitting unit and a light sensing unit, comprising:

the substrate is provided with a first surface and a second surface which correspond to each other, and a through hole is formed in the substrate;

a light source emission unit disposed on the first surface of the substrate;

the photosensitive unit is arranged on the second surface of the substrate, and the position of a photosensitive area of the photosensitive unit corresponds to the through hole.

Preferably, the method further comprises the following steps:

the bracket is arranged on the first surface of the substrate, an accommodating space is formed between the bracket and the substrate, a partition part is arranged on the bracket and divides the accommodating space into a first accommodating space and a second accommodating space which are independent from each other, the first accommodating space corresponds to the through hole, and the light source emitting unit is positioned in the second accommodating space;

the bracket is provided with a first opening corresponding to the through hole;

and a second opening is formed in the position, corresponding to the light source emission unit, on the bracket.

Preferably, the upper surface of the photosensitive unit is electrically connected with the second surface of the substrate through a bump; solder balls are welded on the second surface of the substrate and the periphery of the photosensitive unit, and the solder balls are electrically connected with the corresponding bumps through the circuit of the substrate.

Preferably, the method further comprises the following steps: and the protective piece is formed on the second surface of the substrate in a mold injection molding mode, at least covers the side wall of the photosensitive unit, the lower surface of the photosensitive unit, which is deviated from the substrate, and a part of the solder balls, and at least exposes the photosensitive area on the upper surface of the photosensitive unit and one end, which is deviated from the substrate, of the solder balls.

Preferably, a blocking ring is arranged between the upper surface of the photosensitive unit and the second surface of the substrate, the blocking ring is located at the periphery of the photosensitive area of the photosensitive unit, and the projection is located at the outer side of the blocking ring.

Preferably, the protection element further comprises a circuit board arranged on the side of the protection element, which faces away from the substrate, and the circuit board is in contact with the solder balls to realize electrical connection.

Preferably, the method further comprises the following steps: at least one component disposed on the first surface of the substrate, the component being located in the first accommodation space.

Preferably, the method further comprises the following steps: a driving unit disposed on the first surface of the substrate and controlling the light source emitting unit, the driving unit being located in the second accommodating space.

Preferably, the method further comprises the following steps: a lens unit disposed in the first opening.

Preferably, the method further comprises the following steps: a collimating lens disposed in the second opening.

Preferably, the method further comprises the following steps: and the light beam emitted by the light source emission unit firstly passes through the collimating lens and then is emitted after being expanded by the diffractive optical element.

Preferably, the method further comprises the following steps: and the light filtering piece is arranged on the first surface of the substrate and is positioned in the first accommodating space corresponding to the through hole.

Preferably, the holder is made of an opaque material and is attached to the first face of the substrate by an opaque adhesive.

Preferably, the protective element is made of a light-impermeable material.

The technical scheme of the utility model has the following remarkable beneficial effects:

the light beam after the reflection of the object that lies in the light source emission unit transmission on the first face of base plate in the optical sensor packaging structure that this application possesses light source emission unit and sensitization unit can reach to the sensitization unit that lies in the second face of base plate behind the through hole to do not influence optical sensor's smooth operation. Meanwhile, the light source emitting unit and the photosensitive unit are respectively arranged on the two corresponding surfaces of the substrate, and projections of the light source emitting unit and the photosensitive unit in the direction perpendicular to the substrate can be partially overlapped or close to each other, so that the size of the optical sensor packaging structure with the light source emitting unit and the photosensitive unit in the horizontal direction can be further reduced, and the space required by the arrangement of the light source emitting unit and the photosensitive unit cannot be influenced.

Specific embodiments of the present invention are disclosed in detail with reference to the following description and drawings, indicating the manner in which the principles of the utility model may be employed. It should be understood that the embodiments of the utility model are not so limited in scope. Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments, in combination with or instead of the features of the other embodiments.

Drawings

The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way. In addition, the shapes, the proportional sizes, and the like of the respective members in the drawings are merely schematic for facilitating the understanding of the present invention, and do not specifically limit the shapes, the proportional sizes, and the like of the respective members of the present invention. Those skilled in the art, having the benefit of the teachings of this invention, may choose from the various possible shapes and proportional sizes to implement the utility model as a matter of case.

Fig. 1 is a schematic structural diagram of an optical sensor package structure provided with a light source emitting unit and a light sensing unit according to an embodiment of the present invention;

FIG. 2 is a top view of an upper surface of a photosensitive unit according to an embodiment of the utility model.

Reference numerals of the above figures:

1. a light source emitting unit; 2. a light sensing unit; 21. a light-sensitive region; 3. a substrate; 31. a first side; 32. a second face; 33. a through hole; 4. a support; 41. a partition portion; 42. a first opening; 43. a second opening; 44. a support portion; 45. a sidewall portion; 51. a first accommodating space; 52. a second accommodating space; 6. a bump; 7. tin balls; 8. a protective member; 9. a circuit board; 10. a component; 11. a drive unit; 12. a lens unit; 13. a collimating lens; 14. a diffractive optical element; 15. a light filtering member; 16. a metal plate; 17. a binder; 18. a stop ring.

Detailed Description

The details of the present invention can be more clearly understood in conjunction with the accompanying drawings and the description of the embodiments of the present invention. However, the specific embodiments of the present invention described herein are for the purpose of illustration only and are not to be construed as limiting the utility model in any way. Any possible variations based on the present invention may be conceived by the skilled person in the light of the teachings of the present invention, and these should be considered to fall within the scope of the present invention. It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, mechanical or electrical connections, communications between two elements, direct connections, indirect connections through intermediaries, and the like. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In order to solve the problem that the optical sensor package structure is too large in the horizontal direction, an optical sensor package structure having a light source emitting unit and a light sensing unit is provided in the present application, fig. 1 is a schematic structural diagram of the optical sensor package structure having the light source emitting unit and the light sensing unit in an embodiment of the present invention, and as shown in fig. 1, the schematic structural diagram of the optical sensor package structure having the light source emitting unit and the light sensing unit may include: the substrate 3, the substrate 3 has corresponding first surface 31 and second surface 32, offer the through hole 33 on the substrate 3; a light source emitting unit 1 disposed on a first face 31 of a substrate 3; and a light sensing unit 2 disposed on the second surface 32 of the substrate 3, wherein the light sensing region 21 of the light sensing unit 2 is positioned corresponding to the through hole 33.

The light beam emitted by the light source emitting unit 1 and reflected by an object on the first surface 31 of the substrate 3 in the optical sensor packaging structure with the light source emitting unit and the photosensitive unit can reach the photosensitive unit 2 on the second surface 32 of the substrate 3 through the through hole 33, so that smooth operation of the optical sensor is not affected. Meanwhile, because the light source emitting unit 1 and the photosensitive unit 2 are respectively arranged on two corresponding surfaces of the substrate 3, and projections of the light source emitting unit 1 and the photosensitive unit 2 in a direction perpendicular to the substrate 3 can be partially overlapped or closely approached, the size of the optical sensor packaging structure with the light source emitting unit and the photosensitive unit in the horizontal direction can be further reduced, and the space required for arranging the light source emitting unit 1 and the photosensitive unit 2 is not influenced.

In order to better understand the optical sensor package structure with the light source emitting unit and the light sensing unit in the present application, it will be further explained and explained below. As shown in fig. 1, the optical sensor package structure having a light source emitting unit and a light sensing unit may include: substrate 3, light source emission unit 1, photosensitive unit 2. The optical sensor packaging structure provided with the light source emitting unit and the light sensing unit in the application can be a TOF sensor, such as a D-TOF sensor and a 3D-TOF sensor, can also be an OTS sensor, and can also be any other optical sensor packaging structure with the light source emitting unit 1 and the light sensing unit 2.

Here, as shown in fig. 1, the substrate 3 may extend in a horizontal direction, which is used to dispose the light source emitting unit 1, the photosensitive unit 2, and the like. Basically, the first surface 31 and the second surface 32 are opposite to each other, and the first surface 31 is an upward surface and the second surface 32 is a downward surface. The substrate 3 is provided with a through hole 33, and the through hole 33 is used for allowing the light beam emitted by the light source emitting unit 1 above the substrate 3 and reflected by the object to pass through the substrate 3 and reach the light sensing area 21 of the light sensing unit 2 on the second surface 32 of the substrate 3, so that the light sensing area 21 of the light sensing unit 2 can receive the light beam. The substrate 3 may be a Printed Circuit Board (PCB) substrate, which serves as a support for electronic components, thereby implementing a carrier for electrical interconnection of the electronic components, or a substrate of other processes. The substrate 3 may also be a Ball Grid Array (Ball Grid Array) substrate, a lead frame (lead frame), a copper foil substrate, a resin substrate, or other kinds of substrates, as applicable. The specific type of substrate can be selected according to the specifications of the pins of the photosensitive unit 2, the light source emitting unit 1 and other components arranged on the substrate 3.

As shown in fig. 1, the light source emitting unit 1 is disposed on a first face 31 of the substrate 3. The light source emitting unit 1 and the substrate 3 can be electrically connected by a bonding wire. As a practical matter, the light source emitting unit 1 and the substrate 3 may be fixed by attaching conductive silver paste.

As shown in fig. 1, the photosensitive unit 2 is disposed on the second face 32 of the substrate 3. The photosensitive unit 2 is electrically connected to the substrate 3. The position of the light sensing area 21 of the light sensing unit 2 corresponds to the through hole 33, so that the light beam emitted by the light source emitting unit 1 on the first surface 31 and reflected by the object can pass through the through hole 33 and reach the light sensing area 21 of the light sensing unit 2 on the second surface 32 of the substrate 3.

As shown in fig. 1, it is feasible that the upper surface of the photosensitive unit 2 and the second surface 32 of the substrate 3 are electrically connected through the bump 6. The bump 6 is generally plural and arranged according to specific needs. The bumps 6 are formed on the photosensitive units 2 or the substrate 3 in advance, and when the photosensitive units 2 and the substrate 3 need to be electrically connected, the bumps 6 are only required to be closely attached to the corresponding photosensitive units 2 or the substrate 3.

As shown in fig. 1, the optical sensor package structure having the light source emitting unit and the light sensing unit may further include: the protector 8 is formed on the second surface 32 of the substrate 3 by means of mold injection molding. The protective member 8 is used to protect the photosensitive unit 2. The protection member 8 covers at least the sidewall of the light sensing unit 2 and the lower surface of the light sensing unit 2 away from the substrate 3. The protective element 8 can be made of a material that is opaque to light or a material that is transparent to light, without any limitation in this application. Preferably, it can be made of a non-light-transmissive material, so as to prevent a small amount of light from entering from the gap between the photosensitive unit 2 and the substrate 3 and reaching the photosensitive area 21 of the photosensitive unit 2, which may affect the image formation.

As shown in fig. 1, when the solder ball 7 is soldered on the second surface 32 of the substrate 3, the solder ball 7 may be located at the periphery of the light sensing unit 2, and the protection member 8 may at least cover the sidewall of the light sensing unit 2, the lower surface of the light sensing unit 2 facing away from the substrate 3, and a portion of the solder ball 7, and at least expose the light sensing area 21 on the upper surface of the light sensing unit 2 and one end of the solder ball 7 facing away from the substrate 3. By the above manner, the protection of the solder ball 7 can be realized. The end of the solder ball 7 departing from the substrate 3 is exposed, so that the optical fingerprint module can be electrically connected with other devices conveniently, and the end of the solder ball 7 departing from the substrate 3 is only required to be contacted with the connecting part of other devices. By the mode, the optical sensor packaging structure can be directly surface-mounted (SMT) on an external circuit board, so that a Flexible Printed Circuit (FPC) in the prior art is further cancelled to reduce cost, the circuit connection is short, the signal loss is less, and the noise is low.

Further, the optical sensor package structure having the light source emitting unit and the light sensing unit may include a circuit board 9 disposed on a side of the protective member 8 away from the substrate 3, and the circuit board 9 is in contact with the solder balls 7 to achieve electrical connection. In order to increase the strength of the printed circuit board 9, a metal plate 16, for example a steel plate, may be arranged in close contact with the side of the printed circuit board 9 facing away from the solder balls 7.

As shown in fig. 1, further, in the case of the protective member 8 formed on the second surface 32 of the substrate 3 by injection molding or pouring, in order to prevent the injection material forming the protective member 8 from flowing to the photosensitive area 21 of the photosensitive unit 2, a blocking ring 18 is provided between the upper surface of the photosensitive unit 2 and the second surface 32 of the substrate 3. FIG. 2 is a top view of the upper surface of the photosensitive unit according to the embodiment of the utility model, and as shown in FIG. 2, the blocking ring 18 is located at the periphery of the photosensitive area 21 of the photosensitive unit 2. For example, the blocking ring 18 may be located between the photosensitive region 21 and the plurality of bumps 6, that is, the bumps 6 are located outside the blocking ring 18, and the protection member 8 can cover the bumps 6, thereby protecting the bumps 6 and achieving the separation between the adjacent bumps 6.

As shown in fig. 1, as a practical matter, an optical sensor package structure having a light source emitting unit and a light sensing unit may include: a support 4 disposed on the first face 31 of the substrate 3. The holder 4 itself may be made of an opaque material, and the holder 4 is fixedly coupled to the contact portion of the substrate 3. Further, the contact portions between the holder 4 and the first face 31 of the substrate 3 are bonded together by the light-impermeable adhesive 17. The adhesive 17 may preferably be a black adhesive to prevent stray light from entering the package, although this is not limited in any way in this application. An accommodation space is formed between the holder 4 and the substrate 3. Further, the holder 4 may include a support portion 44 and a side wall portion 45, the side wall portion 45 being located at a periphery of the support portion 44, the side wall portion 45 being in contact with the substrate 3 toward a lower end of the substrate 3, and bonded thereto by the adhesive 17. The support portion 44 extends in the horizontal direction with a gap from the substrate 3, so that an accommodation space is formed between the support portion 44, the side wall portion 45, and the substrate 3.

As shown in fig. 1, the bracket 4 may have a partition portion 41 thereon, and the partition portion 41 may be connected to the support portion 44, and the partition portion 41 may extend toward the substrate 3. The partition 41 partitions the accommodating space into a first accommodating space 51 and a second accommodating space 52 which are independent of each other, at least a part of the first accommodating space 51 corresponds to the through-hole 33, and the light source emitting unit 1 is located in the second accommodating space 52. The partition 41 may extend to the substrate 3 and be bonded to the substrate 3 by the adhesive 17.

As shown in fig. 1, the bracket 4 has a first opening 42 corresponding to the position of the through hole 33. The first opening 42 is located on a support portion 44 of the bracket 4. The external light can reach the first accommodating space 51 through the first opening 42, pass through the through-hole 33, and reach the photosensitive unit 2 located on the second surface 32 of the substrate 3. The through hole 33 may be located right below the first opening 42, and the light sensing area 21 of the light sensing unit 2 may be located right below the through hole 33, so that reflected light in a larger range right in front of the optical sensor package structure can reach the light sensing area 21 of the light sensing unit 2 after passing through the first opening 42.

As a practical matter, the optical sensor package structure having the light source emitting unit and the light sensing unit may include: at least one component 10 arranged on the first side 31 of the substrate 3, the component 10 being located in the first accommodation space 51. The component 10 may be a peripheral component 10 having a certain function, and the component may be disposed in the first accommodation space 51, so that the size of the optical sensor package including the light source emitting unit and the light receiving unit in the horizontal direction can be reduced. The component 10 may be disposed as close to the I/O port as possible, and the component 10 may be a component 10 that performs a filtering or electrostatic protection function. Similarly, the optical sensor package structure having the light source emitting unit and the light sensing unit may include: a driving unit 11 provided on the first face 31 of the substrate 3 to control the light source emitting unit 1, the driving unit 11 being located in the second accommodating space 52.

As shown in fig. 1, the optical sensor package structure having a light source emitting unit and a light sensing unit may include: a lens unit 12 disposed in the first opening 42. The lens unit 12 may be composed of one optical lens or a plurality of optical lenses stacked. Preferably, the lens unit 12 can be made by using a wafer level lens (WLO), and by using a wafer level lens manufacturing technology and a wafer level lens manufacturing process, unlike a conventional optical element processing technology, the WLO process is used for duplicating and processing lenses in batches by using a semiconductor process on a whole glass wafer, and a plurality of lens wafers are pressed together and then cut into a single lens, which has the characteristics of small size, low height, good consistency and the like. In the present application, the number of lens wafers, the shape of the lens, and the like are related to the requirements of the optical imaging system, and can be determined according to specific requirements. The overall thickness of the lens unit 12 in the vertical direction can be further reduced by using the wafer-level lens, so that the thickness of the optical sensor packaging structure is further reduced, the problem that the size of the optical sensor packaging structure is larger is solved, and more space is provided for stacking other components in the electronic equipment in the vertical direction. In addition, each lens and optical filter in the lens unit 12 in the prior art need to be manufactured separately in a lens factory, and the WLO process can realize that a plurality of lens assemblies are integrally manufactured on a substrate wafer, thereby avoiding a process of assembling each lens and optical filter 15 into a lens assembly and reducing installation errors. In addition, in the embodiment shown in fig. 1 of the present application, the filter 15 is not integrated with the lens unit 12, which will be described in detail later. In other embodiments, the filter 15 may be integrated with the lens unit 12.

As shown in fig. 1, the lens unit 12 may be disposed in the first opening 42 of the support 4, and the lens unit 12 is not disposed on the upper surface or the lower surface of the support portion 44 of the support 4, which may also reduce the thickness of the optical sensor package.

The light source emitting unit 1 is located in the second accommodation space 52. The bracket 4 is provided with a second opening 43 at a position corresponding to the light source emitting unit 1. The second opening 43 may be located right above the light source emitting unit 1, so as to ensure that most of the light signal with the specified wavelength emitted from the light source emitting unit 1 is emitted to the object through the second opening 43. Since the first accommodating space 51 and the second accommodating space 52 are isolated by the light-tight partition 41, the optical signal with the specified wavelength emitted from the light source emitting unit 1 cannot directly reach the photosensitive unit 2 from the inside of the bracket 4, so that the influence of such optical signal on the photosensitive unit 2 is avoided, and the optical crosstalk (crosstalk) between the light source emitting unit 1 and the photosensitive unit 2 is effectively prevented.

As a practical matter, the optical sensor package structure having the light source emitting unit and the light sensing unit may include: and a collimator lens 13. The collimator lens 13 is used to adjust the light beam emitted by the light source emitting unit 1 into a uniform collimated light beam. Further, the collimator lens 13 may be disposed in the first opening 42. The collimator lens 13 is not disposed on the upper surface or the lower surface of the support portion 44 of the holder 4, which also reduces the thickness of the optical sensor package.

As a practical matter, the optical sensor package structure having the light source emitting unit and the light sensing unit may include: a diffractive optical element 14. Further, the diffractive optical element 14 may also be disposed in the first opening 42, which may also reduce the thickness of the optical sensor package structure. The diffractive optical element 14 may be adjacent to the upper surface of the support 44 of the support 4 and the collimator lens 13 may be adjacent to the lower surface of the support 44 of the support 4. The light beam emitted by the light source emitting unit 1 passes through the collimating lens 13, is expanded by the diffractive optical element 14, and then is emitted. For example, the diffractive optical element 14 expands one light spot emitted by the light source emitting unit 1 into a plurality of light spots by using the principle of optical diffraction, so as to realize laser lattice emission and ensure a certain detection distance.

The lens unit 12, the collimator lens 13, the diffractive optical element 14, and the like may be attached to the holder 4, and then the holder 4 is bonded to the substrate 3.

The light source emitting unit 1 can be used for emitting optical signals with specified wavelengths to a target object, and the light sensing area 21 of the light sensing unit 2 can be used for sensing optical signals returned by the object. The light source emitting unit 1 may be a VERTICAL-CAVITY SURFACE emitting laser (VERTICAL-CAVITY SURFACE emitting laser-EMITTING LASER, VCSEL) or a light emitting DIODE (LIGHT EMITTING DIODE, LED), or a common-cathode multi-hole VERTICAL laser emitter. The light sensing unit 2 may include a SINGLE PHOTON AVALANCHE DIODE (SPAD) to convert the reflected optical signal into an electrical signal. The optical signal with the specified wavelength can be an invisible optical signal, and the invisible optical signal is not easy to observe by eyes of a user, so that the user experience is improved. Of course, in some occasions where the requirement is not high, a visible light signal may also be used as the light source, which is not specifically limited in the embodiment of the present application.

When the optical sensor packaging structure with the light source emitting unit and the light sensing unit is a 3D-TOF sensor, the light source emitting unit 1 is a porous vertical laser emitter, emitted light of the porous vertical laser emitter is emitted according to an array, the anode of the porous vertical laser emitter needs a plurality of gold threads to be connected to the gold fingers on the substrate 3, and only one gold thread needs to be punched relative to the anode of the single-point TOF sensor; the cathode of the porous vertical laser emitter is also connected to the substrate 3 by gold wires, and the connection with the light sensing unit 2 is realized by the internal circuit of the substrate 3. Since the driving unit 11 is relatively complicated when the optical sensor package structure including the light source emitting unit and the light sensing unit is a 3D-TOF sensor, the driving unit 11 may be formed as a device independent from the light sensing unit 2, and of course, the driving unit 11 may be integrated inside the light sensing unit 2, while the driving unit 11 is usually integrated inside the light sensing unit 2 in the case of a single-point D-TOF sensor.

As a practical matter, the optical sensor package structure having the light source emitting unit and the light sensing unit may include: a filter 15 disposed on the first face 31 of the substrate 3. The filter 15 may be adhered to the first face 31 of the substrate 3. The position of the filter 15 corresponds to the through hole 33, further, the filter 15 is located in a portion of the first receiving space 51 corresponding to the through hole 33, and the filter 15 is located above the photosensitive area 21(active area) of the photosensitive unit 2, so as to filter the light rays to be incident into the photosensitive unit 2 after passing through the lens unit 12, so that the transmittance of the incident light in a specific wavelength range is greater than a threshold (for example, 95% or other values), the wavelength of the emitted light of the light source emission unit 1 is within the specific wavelength range, and after being reflected by the object, passes through the lens unit 12 and the filter 15 and reaches the photosensitive area 21 of the photosensitive unit 2, that is, only narrow-band (small-range) light rays near the optical signal of a specified wavelength reflected by the object, which is emitted from the light source emission unit 1, are allowed to pass through, and optical signals of other wavelengths are filtered and removed. For example, the transmittance of incident light in a wavelength band around 940nm/1350nm/1550nm is allowed to be larger than a threshold value.

As a possibility, the filter 15 may be a filter, for example made of glass. Further, in order to reduce the reflectivity of the filter and increase the transmittance of light passing through the filter, an Anti-Reflection coating (Anti-Reflection) may be coated on the side of the glass filter facing the lens unit 12. The other side of the filter member 15 made of glass may be coated with a filter layer for filtering light incident to the light sensing unit 2.

For among the prior art filter 15 do together with lens unit 12, accomplish the laminating of filter at the camera lens factory or encapsulation factory, this application is through setting up the filter on the first face 31 of base plate 3, do the encapsulation between sensitization unit 2 and the base plate 3 at the encapsulation factory and just can directly paste the filter, can prevent like this that chip level encapsulation from transporting the module factory from the encapsulation factory among the prior art to the module factory, carry out follow-up installation light source emission unit 1, the in-process debris such as support 4 get into the single photon avalanche diode of sensitization unit 2 and cause the influence to it.

The term "consisting essentially of …" describing a combination shall include the identified element, ingredient, component or step as well as other elements, ingredients, components or steps that do not materially affect the basic novel characteristics of the combination. The use of the terms "comprising" or "including" to describe combinations of elements, components, or steps herein also contemplates embodiments that consist essentially of such elements, components, or steps. By using the term "may" herein, it is intended to indicate that any of the described attributes that "may" include are optional. A plurality of elements, components, parts or steps can be provided by a single integrated element, component, part or step. Alternatively, a single integrated element, component, part or step may be divided into separate plural elements, components, parts or steps. The disclosure of "a" or "an" to describe an element, ingredient, component or step is not intended to foreclose other elements, ingredients, components or steps.

The above embodiments are only a few embodiments of the present invention, and the embodiments of the present invention are described above, but the present invention is only used for the understanding of the present invention, and is not limited to the embodiments. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the utility model as defined by the appended claims.

Claims (14)

1. An optical sensor package structure having a light source emitting unit and a light sensing unit, comprising:

the substrate is provided with a first surface and a second surface which correspond to each other, and a through hole is formed in the substrate;

a light source emission unit disposed on the first surface of the substrate;

and the photosensitive unit is arranged on the second surface of the substrate, and the position of a photosensitive area of the photosensitive unit corresponds to the through hole.

2. The optical sensor package structure provided with a light source emitting unit and a light sensing unit according to claim 1, further comprising:

the bracket is arranged on the first surface of the substrate, an accommodating space is formed between the bracket and the substrate, a partition part is arranged on the bracket and divides the accommodating space into a first accommodating space and a second accommodating space which are independent from each other, the first accommodating space corresponds to the through hole, and the light source emitting unit is positioned in the second accommodating space;

the bracket is provided with a first opening corresponding to the through hole;

and a second opening is formed in the position, corresponding to the light source emission unit, on the bracket.

3. The package structure of optical sensor with a light source emitting unit and a light sensing unit as claimed in claim 1, wherein the light sensing unit is electrically connected to the second surface of the substrate by a bump; solder balls are welded on the second surface of the substrate and the periphery of the photosensitive unit, and the solder balls are electrically connected with the corresponding bumps through the circuit of the substrate.

4. The optical sensor package structure with a light source emitting unit and a light sensing unit according to claim 3, further comprising: and the protective piece is formed on the second surface of the substrate in a mold injection molding mode, at least covers the side wall of the photosensitive unit, the lower surface of the photosensitive unit, which is deviated from the substrate, and a part of the solder balls, and at least exposes the photosensitive area on the upper surface of the photosensitive unit and one end, which is deviated from the substrate, of the solder balls.

5. The package structure of optical sensor with a light source emitting unit and a light sensing unit as claimed in claim 4, wherein a blocking ring is disposed between the upper surface of the light sensing unit and the second surface of the substrate, the blocking ring is located at the periphery of the light sensing area of the light sensing unit, and the protrusion is located outside the blocking ring.

6. The optical sensor package with a light source emitting unit and a light sensing unit as claimed in claim 4, further comprising a circuit board disposed on a side of the protection member facing away from the substrate, the circuit board contacting the solder balls for electrical connection.

7. The optical sensor package structure provided with a light source emitting unit and a light sensing unit according to claim 2, further comprising: at least one component disposed on the first surface of the substrate, the component being located in the first accommodation space.

8. The optical sensor package structure provided with a light source emitting unit and a light sensing unit according to claim 2, further comprising: a driving unit disposed on the first surface of the substrate and controlling the light source emitting unit, the driving unit being located in the second accommodating space.

9. The optical sensor package structure provided with a light source emitting unit and a light sensing unit according to claim 2, further comprising: a lens unit disposed in the first opening.

10. The optical sensor package structure with a light source emitting unit and a light sensing unit according to claim 2, further comprising: a collimating lens disposed in the second opening.

11. The optical sensor package structure provided with a light source emitting unit and a light sensing unit according to claim 10, further comprising: and the light beam emitted by the light source emission unit firstly passes through the collimating lens and then is emitted after being expanded by the diffractive optical element.

12. The optical sensor package structure provided with a light source emitting unit and a light sensing unit according to claim 2, further comprising: and the filter is arranged on the first surface of the substrate and positioned in the first accommodating space corresponding to the through hole.

13. The optical sensor package with a light source emitting unit and a light sensing unit as claimed in claim 2, wherein the bracket is made of an opaque material and is connected to the first surface of the substrate by an opaque adhesive.

14. The optical sensor package with a light source emitting unit and a light sensing unit as claimed in claim 4, wherein the protection member is made of an opaque material.

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