CN116437167A - Depth information camera module - Google Patents

Abstract

The utility model discloses a degree of depth information module of making a video recording, wherein, the degree of depth information module of making a video recording is through an optimized module support to solve the electromagnetic interference problem of sensitization chip, sensitization chip's heat dissipation problem comprehensively, and satisfy the miniaturized technical requirement of module.

Description

Depth information camera module

Technical Field

The application relates to the field of module preparation, and more particularly to a depth information camera module.

Background

In recent years, with rapid development and application of intelligent technology and virtual reality technology, a camera module with a depth information acquisition function has been greatly developed, such as a TOF camera module, a speckle structure light camera module, and the like.

The TOF depth information camera module performs depth measurement based on TOF (Time of Flight) technology, that is, the modulated detection light is actively projected by the projection module of the TOF depth information camera module, and then the detection light reflected by the object to be photographed is received by the receiving module of the TOF depth information camera module, so as to calculate the distance between the TOF depth information camera module and the object to be photographed based on the time difference or the phase difference between the projected detection light and the received detection light to generate depth information.

In the conventional TOF depth information imaging module, a laser unit (for example, a VCSEL unit) is often used as a light source for projecting detection light, and a driving circuit is required for driving the laser unit. With the higher performance requirement on the TOF depth information camera module, the whole working power of the laser unit is larger and larger, and the load of the driving circuit is larger and larger, so that a new technical problem is caused.

Specifically, in the TOF depth information camera module, the receiving module needs to be as close to the projection module as possible, and as the load of the driving circuit increases, the electromagnetic radiation generated by the receiving module can interfere with the light information receiving and imaging of the photosensitive chip of the receiving module, so as to affect the depth measurement of the TOF depth information camera module. It should be understood that when the overall operating power of the laser unit is small, the electromagnetic interference generated by the driving circuit is not so significant, but as the overall operating power of the laser unit is larger, the electromagnetic interference generated by the driving circuit becomes more significant. In addition, besides the technical problem of the TOF depth information camera module, the active depth information camera module such as the speckle structure light camera module also has the technical problem.

In order to avoid electromagnetic interference of the driving circuit, one current solution is to configure a shielding case for the projection module, for example, a layer of copper foil is wrapped on the outer surface of the projection module, or a metal shielding case is sleeved on the outer side of the driving circuit, which increases the cost on the one hand and increases the size of the projection module on the other hand. Another current approach is to provide the receiving module with a shield, which also increases material costs and increases the size of the receiving module.

For the receiving module, as the performance requirement on the TOF depth information camera module is higher, the size of the photosensitive chip of the receiving module is larger, so that the heat dissipation problem of the photosensitive chip is also a more obvious technical problem.

Meanwhile, in recent years, the trend of the terminal equipment toward light weight and thin has become mainstream, which requires the depth information camera module disposed at the terminal equipment to be developed toward miniaturization, which makes the problems of electromagnetic interference and heat dissipation of the photosensitive chip of the receiving module more remarkable.

Therefore, a novel depth information imaging module is desired.

Disclosure of Invention

An advantage of the present application is that it provides a depth information camera module, wherein, the depth information camera module is through an optimized module support to solve the electromagnetic interference problem of sensitization chip, sensitization chip's heat dissipation problem comprehensively, and satisfy the miniaturized technical requirement of module.

Another advantage of the present application is that it provides a depth information camera module, wherein the module support is formed with an electromagnetic shielding structure for protecting the photosensitive chip by embedding a metal reinforcement inside the module support. That is, in some embodiments of the present application, there is no need to provide a shield for the projection module to reduce cost and enable the size of the projection module to be reduced.

Another advantage of the present application is to provide a depth information camera module, wherein the module support has structural strength satisfying requirements by embedding metal reinforcements inside the module support so that the module support has relatively small dimensions, thereby satisfying the development trend of miniaturization of the module.

Still another advantage of the present application is that a depth information camera module is provided, wherein a metal stiffener embedded in the module support can also enhance the heat dissipation capability of the module support to optimize the heat dissipation of the photosensitive chip.

Still another advantage of the present application is to provide a depth information camera module, wherein the module support can be stably and closely attached to a surface of a circuit board of the receiving module.

To achieve at least one of the above or other advantages and objects, according to one aspect of the present application, there is provided a depth information camera module including:

the projection module comprises a first circuit board, a driving chip electrically connected with the first circuit board and a light source electrically connected with the driving chip; and

the receiving module is adjacently arranged on the projection module and comprises a photosensitive assembly and an optical lens which is held on a photosensitive path of the photosensitive assembly, wherein the photosensitive assembly comprises a second circuit board, a photosensitive chip which is electrically connected with the second circuit board and a module support which is arranged on the circuit board, the module support and the second circuit board are matched to form a containing cavity between the two, and the photosensitive chip is contained in the containing cavity;

the module support comprises a package body and a metal reinforcement part at least partially embedded in the package body, wherein at least a part of the metal reinforcement part is arranged around the photosensitive chip in a surrounding manner to form an electromagnetic shielding structure.

In the depth information camera module according to the application, the metal reinforcement comprises a metal frame and an annular supporting structure which is perpendicular to the frame body and extends along the periphery of the frame body, wherein the photosensitive chip is arranged in the annular supporting structure in a wrapping mode, and the electromagnetic shielding structure is formed through the annular supporting structure.

In the depth information camera module according to the application, the annular supporting structure is exposed to the packaging body and is attached to the second circuit board, and the wall thickness of the annular supporting structure is 0.05mm-0.15mm.

In the depth information camera module according to the application, the annular supporting structure is provided with at least three notches, the at least three notches are distributed in a non-collinear mode, the packaging body forms at least three combining parts distributed in a non-collinear mode at the at least three notches of the annular supporting structure, and the at least three combining parts form at least three mounting fulcrums of the module support mounted on the second circuit board.

In the depth information camera module according to the present application, the bottom surfaces of the at least three bonding portions are on the same plane, and the module bracket is stably attached to the second circuit board.

In the depth information camera module according to the present application, a bottom surface of the at least three joints is set to have a surface lower than a lower surface of the annular support structure.

In the depth information camera module according to the application, the at least three gaps comprise a first gap, a second gap, a third gap and a fourth gap which are positioned at four corners of the annular supporting structure, and the at least three combining parts comprise a first combining part, a second combining part, a third combining part and a fourth combining part which are respectively formed at the first gap, the second gap, the third gap and the fourth gap.

In the depth information camera module according to the present application, the annular supporting structure includes a first supporting arm extending upward from a first side of the frame, a second supporting arm extending upward from a second side of the frame adjacent to the first side, a third supporting arm extending upward from a third side of the frame opposite to the first side, and a fourth supporting arm extending upward from a fourth side of the frame opposite to the second side, wherein the first notch is formed between the first supporting arm and the second supporting arm, the second notch is formed between the second supporting arm and the third supporting arm, the third notch is formed between the third supporting arm and the fourth supporting arm, and the fourth notch is formed between the fourth supporting arm and the first supporting arm.

In the depth information camera module according to the present application, the first support arm includes a first support arm main body, a first bending portion extending inward from a side portion of the first support arm main body to the fourth notch, and a second bending portion extending inward from a side portion of the first support arm main body to the fourth notch, wherein the first bending portion is wrapped in the fourth bonding portion, and the second bending portion is wrapped in the first bonding portion.

In the depth information camera module according to the present application, the second support arm includes a second support arm body, a third bending portion extending inward from a side portion of the second support arm body to the first notch, and a fourth bending portion extending inward from a side portion of the second support arm body to the second notch, wherein the third bending portion is wrapped in the first bonding portion, and the fourth bending portion is wrapped in the second bonding portion.

In the depth information camera module according to the present application, the third support arm includes a third support arm body, a fifth bending portion extending inward from a side portion of the third support arm body to the second notch, and a sixth bending portion extending inward from a side portion of the third support arm body to the third notch, wherein the fifth bending portion is wrapped in the second bonding portion, and the sixth bending portion is wrapped in the third bonding portion.

In the depth information camera module according to the present application, the fourth support arm includes a fourth support arm body, a seventh bending portion extending inward from a side portion of the fourth support arm body to the third notch, and an eighth bending portion extending inward from a side portion of the fourth support arm body to the fourth notch, wherein the seventh bending portion is wrapped in the third bonding portion, and the eighth bending portion is wrapped in the fourth bonding portion.

In the depth information camera module according to the application, the first supporting arm is provided with at least one first through hole forming a transition part between the first supporting arm and the frame body; and/or the second supporting arm is provided with at least one second through hole forming the transition part between the second supporting arm and the frame body; and/or the third supporting arm is provided with at least one third through hole forming the transition part between the third supporting arm and the frame body; and/or the fourth supporting arm is provided with at least one fourth through hole forming the transition part of the fourth supporting arm and the frame body.

In the depth information camera module according to the present application, the module support has an opening formed at an upper portion thereof and in communication with the receiving cavity, and the photosensitive assembly further includes a filter element disposed at the upper portion of the module support, the filter element closing the opening.

In the depth information camera module according to the present application, the projection module further includes an optical modulation element held on a projection path of the light source.

In the depth information camera module according to the application, the light source is a VCSEL unit.

In the depth information camera module according to the application, the receiving module further comprises an electromagnetic driver for driving the optical lens to move relative to the photosensitive assembly.

Further objects and advantages of the present application will become fully apparent from the following description and the accompanying drawings.

These and other objects, features, and advantages of the present application will become more fully apparent from the following detailed description, the accompanying drawings, and the appended claims.

Drawings

These and/or other aspects and advantages of the present application will become more apparent and more readily appreciated from the following detailed description of the embodiments of the invention, taken in conjunction with the accompanying drawings, wherein:

fig. 1 illustrates a perspective view of a depth information camera module according to an embodiment of the present application.

Fig. 2 illustrates a schematic diagram of a projection module of the depth information camera module according to an embodiment of the present application.

Fig. 3 illustrates a schematic diagram of a receiving module of the depth information camera module according to an embodiment of the present application.

Fig. 4 illustrates a schematic diagram of a variant implementation of the receiving module according to an embodiment of the present application.

Fig. 5 illustrates a schematic perspective front view of a module holder of the receiving module according to an embodiment of the present application.

Fig. 6 illustrates a schematic perspective back view of the module support according to an embodiment of the present application.

Fig. 7 illustrates a perspective view of the stiffener according to an embodiment of the present application.

Fig. 8 illustrates a schematic diagram of a variant implementation of the module support according to an embodiment of the present application.

Fig. 9 illustrates a schematic diagram of another variant implementation of the module support according to an embodiment of the present application.

Detailed Description

The terms and words used in the following description and claims are not limited to literal meanings, but are used only by the inventors to enable a clear and consistent understanding of the application. It will be apparent to those skilled in the art, therefore, that the following description of the various embodiments of the present application is provided for the purpose of illustration only and not for the purpose of limiting the application as defined by the appended claims and their equivalents.

It will be understood that the terms "a" and "an" should be interpreted as referring to "at least one" or "one or more," i.e., in one embodiment, the number of elements may be one, while in another embodiment, the number of elements may be plural, and the term "a" should not be interpreted as limiting the number.

Although ordinal numbers such as "first," "second," etc., will be used to describe various components, those components are not limited herein. The term is used merely to distinguish one component from another. For example, a first component may be referred to as a second component, and likewise, a second component may be referred to as a first component, without departing from the teachings of the inventive concept. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

The terminology used herein is for the purpose of describing various embodiments only and is not intended to be limiting. As used herein, the singular is intended to include the plural as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, or groups thereof.

Schematic depth information camera module

As shown in fig. 1 to 3, a depth information camera module according to an embodiment of the present application is illustrated, wherein the depth information camera module is an active depth information camera module that performs depth information acquisition by actively projecting detection light and based on a time of flight or a phase difference between received detection light and projected detection light. In a specific example of the present application, the depth information camera module is implemented as a TOF depth information camera module, and of course, in other examples of the present application, the depth information camera module may also be implemented as other types of active depth information camera modules, for example, a speckle structure light depth information camera module, which is not limited in this application.

The following description will be given taking an example in which the depth information imaging module is implemented as a TOF depth information imaging module. As shown in fig. 1 to 3, the depth information camera module according to the embodiment of the present application includes a projection module 200 and a receiving module 100, wherein the projection module 200 is matched with the receiving module 100 and obtains depth information of a photographed object using a Time of Flight (TOF) principle, that is, distance information between the depth information camera module and the photographed object. Specifically, the projection module 200 is configured to project the modulated detection light to a subject, the receiving module 100 is disposed adjacent to the projection module 200 and is configured to receive the detection light reflected from the subject, and further, the depth information camera module obtains depth information of the subject based on a phase difference or a time difference between the projected detection light and the received detection light, for example, a depth image, a depth point cloud, an RGB-D fusion image, and the like may be generated. In some embodiments of the present application, the depth information camera module further includes a data processor for processing the optical signal collected by the receiving module 100 to calculate depth information, that is, the data processor is configured to calculate depth information of the photographed object based on a phase difference or a time difference between the projected detection light and the received detection light; of course, in other embodiments of the present application, the depth information camera module may also upload the optical signal collected by the receiving module 100 to the host computer, so as to process the optical signal collected by the receiving module 100 by the host computer to generate a depth measurement result, which is not limited in the present application.

As shown in fig. 2 and 3, in the embodiment of the present application, the projection module 200 includes a first circuit board 210, a driving chip 220 electrically connected to the first circuit board 210, and a light source 230 electrically connected to the driving chip 220, where the first circuit board 210 is adapted to provide the driving chip 220 with electric energy required for operation, and after the driving chip 220 is activated, the driving chip 220 can drive the light source 230 to generate the detection light.

Accordingly, the first circuit board 210 in the embodiment of the present application includes, but is not limited to, a hard circuit board, a flexible circuit board, a soft and hard combined board, and a ceramic and PCB board. The driving chip 220 is electrically connected to the first circuit board 210 to provide the driving chip 220 with power required for driving through the first circuit board 210.

In one specific example of the present application, the light source 230 is implemented as a VCSEL unit 231, i.e., a vertical cavity surface laser transmitter. It will be appreciated by those skilled in the art that a vertical cavity surface laser transmitter is a semiconductor laser that is capable of generating pulsed laser light under the control of the driver chip 220. That is, in the embodiment of the present application, a driving circuit is disposed in the driving chip 220, and is used to control and drive the VCSEL unit 231 after being turned on. Here, the VCSEL unit 231 does not represent only one VCSEL laser but the light source 230 is a light source 230 composed of a vertical cavity surface laser. Accordingly, in an implementation, the VCSEL light source 230 may be implemented as a line light source 230, a surface light source 230. Of course, in other examples of the present application, the light source 230 may be implemented as other types of light sources 230, such as light emitting diodes, edge emitting lasers, etc., which are not limited by the present application, and the light sources 230 may also be arranged in other patterns, which are not limited by the present application.

It should be noted that, because the laser is used as the detection light, the circuit design of the driving chip 220 must make the laser projected by the light source 230 meet the requirement of human eye laser safety and pass the international authentication standard. Further, the laser light generated by the light source 230 needs to be modulated in consideration of the fact that the laser light cannot be directly used for depth measurement. Accordingly, in the embodiment of the present application, the projection module 200 further includes an optical modulation component 240 that is held on the projection path of the light source 230, so that the phase and spatial intensity of the laser light can be changed by the optical modulation component 240. Accordingly, the modulated emission laser has higher anti-environmental interference performance so as to be beneficial to improving the depth measurement precision of the depth information camera module, and the modulated emission laser does not cause harm to human eyes. In the present embodiment, the optical modulation component 240 includes, but is not limited to, a diffractive optical element, a light homogenizing element, a convex lens, a concave lens, and the like.

In a specific example of the present application, the projection module 200 further includes a bracket 250 disposed on the first circuit board 210 (for example, the bracket 250 is attached to an upper surface of the first circuit board 210 by an adhesive), wherein the optical modulation component 240 is held on the projection path of the light source 230 in such a manner as to be mounted on the bracket 250. Of course, in the embodiment of the present application, the optical modulation component 240 can be held on the projection path of the light source 230 in other manners, which is not limited by the present application.

Further, the light source 230 and the driving chip 220 generate heat during operation, and in order to keep the performance of the projection module 200 stable, in some embodiments of the present application, the projection module 200 further includes a heat dissipation component (not illustrated in the drawings) for enhancing heat dissipation of the light source 230 and/or the driving chip 220. For example, in some embodiments, a communication hole may be formed between the first circuit board 210 and the light source 230, and a heat conducting member may be embedded in the communication hole, so that the heat generated by the light source 230 is conducted to the first circuit board 210 through the heat conducting member and is conducted to the outside through the first circuit board 210. It should be understood that in the embodiments of the present application, the specific configuration and structure of the heat dissipation assembly is not limited by the present application.

In order to monitor the real-time performance of the light source 230, in some embodiments of the present application, the projection module 200 further includes a temperature sensor disposed adjacent to the light source 230, wherein the temperature sensor is adapted to sense the real-time temperature of the light source 230. Further, the driving chip 220 can adjust the control mode of the light source 230 based on the real-time temperature, for example, when the real-time temperature of the light source 230 is detected to exceed a preset threshold, the driving chip 220 stops working. It should be understood that, in the embodiment of the present application, the driver chip 220 may design more control modes based on the requirements of the application scenarios to adapt to the intelligent control requirements of different application scenarios.

Further, as shown in fig. 2 and 3, in the embodiment of the present application, the receiving module 100 includes a photosensitive assembly 20 and an optical lens 30 that is held on a photosensitive path of the photosensitive assembly 20, wherein the detection light reflected from the object to be photographed is collected by the optical lens 32 and perceived by the photosensitive assembly 20.

The optical lens 30 includes a lens barrel 31 and at least one optical lens 32 mounted in the lens barrel 31. It will be appreciated by those of ordinary skill in the art that the resolution of the optical lens 30 is proportional to the number of optical lenses 32 within a certain range, i.e., the higher the resolution, the greater the number of optical lenses 32 included in the optical lens 30. Therefore, in the embodiment of the present application, the optical lens 30 preferably includes a plurality of optical lenses 32, for example, 4, 5, or 6 optical lenses 32.

It should be noted that the type of the optical lens 30 is not limited in this application, and may be implemented as a single lens or as a split lens. Specifically, when the optical lens 30 is implemented as a unitary lens, the lens barrel 31 has a unitary structure, and a plurality of the optical lenses 32 are assembled within the lens barrel 31. When the optical lens 30 is implemented as a split lens, the lens barrel 31 includes at least two barrel units in which a plurality of optical lenses 32 are assembled to form a plurality of lens units, respectively, which are assembled together by active alignment to form the optical lens 30.

Accordingly, the photosensitive assembly 20 includes: the light sensing device comprises a second circuit board 21, a light sensing chip 22, a module support 10 and a light filtering element 23, wherein the second circuit board 21 is used as a mounting substrate of the light sensing assembly 20, the light sensing chip 22 is electrically connected to the second circuit board 21 (for example, the light sensing chip 22 is electrically connected to the second circuit board 21 through a lead wire), and the second circuit board 21 is used for providing a control circuit and electric energy required by the work of the light sensing chip 22.

It should be noted that, in some embodiments of the present application, the depth information camera module further includes a connection board 260 extending between the first circuit board 210 and the second circuit board 21, so that the receiving module 100 and the projecting module 200 may be in communication or electrically connected by the connection board 260, so that the depth information camera module can control the receiving module 100 and the projecting module 200 at the same time, for example, synchronously. For example, in the example illustrated in fig. 1, the depth information camera module further includes a mounting block 270 mounted on the second circuit board 21, wherein the projection module 200 is mounted on an upper surface of the mounting block 270 and the first circuit board 210 and the second circuit board 21 are electrically connected through the flexible board connection board 260, wherein the mounting block 270 is provided for the purpose of making a light emitting surface of the projection module 200 flush with a light incident surface of the receiving module 100.

Accordingly, the module bracket 10 is disposed on the second circuit board 21 for supporting other components. In the embodiment of the present application, the module support 10 has an optical window corresponding to at least a photosensitive area of the photosensitive chip 22. In some specific examples of the present application, the filter element 23 may be mounted on the module support 10, so that the filter element 23 is held on the photosensitive path of the photosensitive chip 22, so that, in the process of passing the detection light reflected from the object to be photographed through the filter element 23 to reach the photosensitive chip 22, the stray light in the detection light can be filtered by the filter element 23 to improve the imaging quality.

In other examples of the present application, the filter element 23 may also be mounted on the module support 10 in other manners, for example, the filter element support is first disposed on the module support 10, and then the filter element 23 is mounted on the filter element support, that is, in this example, the filter element 23 may be indirectly mounted on the module support 10 through other supports, which is not limited in this application.

In some embodiments of the present application, the optical lens 30 is held on the photosensitive path of the photosensitive assembly 20 in a manner of being mounted on the photosensitive assembly 20, more specifically, the optical lens 32 is held on the photosensitive path of the photosensitive chip 22 in a manner of being mounted on the module holder 10 of the photosensitive assembly 20. That is, in some embodiments of the present application, the receiving module 100 is implemented as a fixed focus module, wherein the relative positional relationship between the optical lens 30 and the photosensitive member 20 in the receiving module 100 is determined. It should be understood that, in other examples of the present application, the receiving module 100 may be implemented as other types of modules, such as a focus moving module, an anti-shake module, etc., that is, in other examples of the present application, the receiving module 100 is further configured to adjust a driving component of a relative positional relationship between the optical lens 32 and the photosensitive chip 22, so as to drive the optical lens 30 and/or the photosensitive component 20 (or directly drive the photosensitive chip 22) through the driving component to adjust an imaging performance of the receiving module 100.

It is worth mentioning that in other examples of the present application, the type of the driving assembly is not limited to the present application, and includes, but is not limited to, electromagnetic drivers, deformable memory alloy drivers, piezoelectric actuators, etc. Here, it should be noted that, in the conventional receiving module 100, when the driving assembly includes an electromagnetic driver, the relative positional relationship between the electromagnetic driver and the photosensitive chip 22 needs to be reasonably arranged to avoid the electromagnetic signal generated by the electromagnetic driver from affecting the operation of the photosensitive chip 22, however, in the embodiment of the present application, there is no need to worry about the electromagnetic interference of the electromagnetic driver on the photosensitive chip 22, which will be described in detail in the following description.

As mentioned above, as the performance requirement of the TOF depth information camera module increases, the working power of the light source 230 increases, and the load of the driving chip 220 increases, which causes new technical problems. Specifically, in the TOF depth information camera module, the receiving module 100 needs to be as close to the projection module 200 as possible, and as the load of the driving chip 220 increases, the electromagnetic radiation generated by the receiving module will interfere with the light information receiving and imaging of the photosensitive chip 22 of the receiving module 100, so as to affect the depth measurement of the TOF depth information camera module. It should be appreciated that when the operating power of the light source 230 is small, the electromagnetic interference generated by the driving chip 220 is not so significant, but as the operating power of the light source 230 is larger, the electromagnetic interference generated by the driving chip 220 becomes more significant. Also, as shown in fig. 1 to 3, in the embodiment of the present application, the driving chip 220 is exposed to the outside of the projection module 200, that is, if there is no attenuation, shielding or shielding scheme, the electromagnetic radiation generated by the driving chip 220 acts on the photosensitive chip 22 of the photosensitive assembly 20 in a large amount, so that the operation performance of the photosensitive chip 22 is affected.

In order to avoid electromagnetic interference of the driving chip 220, an existing solution is to configure an electromagnetic shielding means for the projection module 200, for example, a layer of copper foil is wrapped on the outer surface of the projection module 200, or a metal shielding cover is sleeved on the outer side of the driving chip 220, which increases the cost on the one hand and increases the size of the projection module 200 on the other hand. Another current approach is to provide the receiving module 100 with a shield, which also increases the material cost and increases the size of the receiving module 100.

As the performance requirements of the TOF depth information camera module are higher and higher, the size of the photosensitive chip 22 of the receiver module 100 is also larger and larger, which makes the heat dissipation problem of the photosensitive chip 22 more prominent. Meanwhile, in recent years, the trend of the terminal equipment toward light weight and thin has become mainstream, which requires the depth information camera module disposed at the terminal equipment to be developed toward miniaturization, which makes the problems of electromagnetic interference and heat dissipation of the photosensitive chip 22 of the receiving module 100 more remarkable.

Accordingly, in the technical scheme of the application, the depth information camera module comprehensively solves the electromagnetic interference problem of the photosensitive chip 22 and the heat dissipation problem of the photosensitive chip 22 through the optimized module support 10, and meets the technical requirement of miniaturization of the module. In particular, the module support 10 according to the embodiment of the present application has the metal reinforcement 12 embedded therein so that the module support 10 itself forms the electromagnetic shielding structure 12A for protecting the photosensitive chip 22, compared to the conventional module support 10.

Specifically, as shown in fig. 3, in the embodiment of the present application, the module support 10 and the second circuit board 21 cooperate to form a receiving cavity 100A therebetween, the photosensitive chip 22 is received in the receiving cavity 100A, wherein the module support 10 includes a package 11 and a metal stiffener 12 at least partially embedded in the package 11, and at least a portion of the metal stiffener 12 is circumferentially disposed around the photosensitive chip 22 to form an electromagnetic shielding structure 12A.

It should be appreciated that the module support 10 is stacked on the upper surface of the second circuit board 21 by an adhesive to cooperate with the upper surface of the second circuit board 21 to form the accommodating cavity 100A, wherein the photosensitive chip 22 is hermetically accommodated in the accommodating cavity 100A so that dust or dirt of the outside will not pollute the photosensitive chip 22. It should be understood that, even if the photosensitive chip 22 is accommodated in the accommodating cavity 100A, the electromagnetic waves generated by the driving chip 220 cannot be prevented from affecting the operation of the photosensitive chip 22 for the conventional module holder 10, because the conventional module holder 10 is generally made of plastic material, and the electromagnetic waves have good penetrability to the plastic material.

Therefore, in the embodiment of the present application, the structure of the module support 10 is heterogeneous, that is, the metal stiffener 12 is embedded in the molded support, wherein the metal stiffener 12 has a special arrangement pattern within the module support 10 such that when the module support 10 is mounted on the upper surface of the second circuit board 21, at least a portion of the metal stiffener 12 is circumferentially arranged around the photosensitive chip 22 to form the electromagnetic shielding structure 12A. That is, in the embodiment of the present application, the metal stiffener 12 has a special position distribution pattern within the module holder 10 so that when the module holder 10 is stacked on the upper surface of the second wiring board 21, the photosensitive chip 22 is surrounded by the metal stiffener 12 to form an electromagnetic shielding structure 12A for protecting the photosensitive chip 22 by the module holder 10 embedded with the metal stiffener 12.

It should be noted that, in the embodiment of the present application, the metal stiffener 12 surrounds at least a portion of the photosensitive chip 22 so that the portion of the photosensitive chip 22 surrounded by the metal stiffener 12 can be protected by the metal stiffener 12. Preferably, in the embodiment of the present application, the metal reinforcement member 12 surrounds the entire periphery of the photosensitive chip 22 to completely prevent electromagnetic radiation generated by the driving chip 220 from affecting the normal operation of the photosensitive chip 22.

It should be appreciated that when the module support 10 forms the electromagnetic shielding structure 12A of the photosensitive chip 22, in some embodiments of the present application, no shielding case is required for the projection module 200 to reduce the cost and enable the size of the projection module 200 to be reduced. Of course, in order to ensure the electromagnetic shielding effect, in some embodiments of the present application, an electromagnetic shielding cover may be still configured for the projection module 200, which is not limited in this application.

In some embodiments of the present application, the metal stiffener 12 is electrically connected to the second circuit board 21 so that the metal shielding structure 12A formed by the metal stiffener 12 has better electromagnetic shielding performance. For example, the metal stiffener 12 may be electrically connected to the second wiring board 21 by soldering so that the electromagnetic shielding structure 12A formed of the metal stiffener 12 is grounded.

As shown in fig. 5 to 7, in the embodiment of the present application, the module support 10 is formed by an injection molding process, and includes a package 11 and the metal stiffener 12 at least partially embedded in the package 11 by the injection molding process.

In particular, in the embodiment of the present application, the structural strength of the metal reinforcement member 12 is greater than that of the package 11, so that the metal reinforcement member 12 embedded in the package 11 can reinforce the overall structural strength of the module support 10, that is, the module support 10 can have a certain structural strength on the premise of having a relatively smaller size by the metal reinforcement member 12. That is, when the receiving module 100 is configured with the module holder 10, the overall size of the receiving module 100 can be reduced to satisfy the trend of miniaturization of modules.

More specifically, as shown in fig. 5 to 7, in the embodiment of the present application, the metal reinforcement 12 implemented as a metal member includes a frame body 121 and an annular support structure 122 perpendicular to the frame body 121 and extending along a periphery of the frame body 121, wherein the photosensitive chip 22 is disposed around inside the annular support structure 122 to form the electromagnetic shielding structure 12A by the annular support structure 122.

In a specific example of the present application, the frame 121 has a closed polygonal structure, and is preferably implemented as a closed rectangular structure. It should be appreciated that the shape of the photosensitive chip 22 is generally rectangular, and therefore, in order to adapt to the photosensitive chip 22, the module support 10 is also preferably implemented as a square structure, and accordingly, when the frame 121 is implemented as a rectangle, it can be fitted into the package 11 more fittingly and completely. More specifically, as shown in fig. 5 to 7, the frame 121 having a closed rectangular structure includes a first side 1211, a second side 1212 perpendicular to the first side 1211, a third side 1213 opposite and parallel to the first side 1211, and a fourth side 1214 perpendicular to the first side 1211 and opposite to the second side 1212.

Further, in the present embodiment, the annular supporting structure 122 extends perpendicularly to the frame 121 and along the periphery of the frame 121, that is, in the present embodiment, the annular supporting structure 122 is perpendicular to the plane set by the frame 121, and the annular supporting structure 122 extends along the periphery of the frame 121. As shown in fig. 5 to 7, in the embodiment of the present application, after the metal stiffener 12 is involved in the package 11 through an injection molding process, the frame 121 of the metal stiffener 12 is encapsulated within the package 11 (for example, the frame 121 is encapsulated in the package 11 in such a manner that the outer surface thereof is exposed), and the annular support structure 122 of the metal stiffener 12 is exposed to the package 11 to form the support leg structure 120 of the module support 10.

Accordingly, as shown in fig. 3, in the embodiment of the present application, when the module support 10 is mounted on a circuit board, the annular support structure 122 is attached to the surface of the second circuit board 21 to form a support leg structure of the module support 10. It should be appreciated that the annular supporting structure 122 has a discontinuous annular structure, and thus, when the annular supporting structure 122 is mounted on the upper surface of the second wiring board 21, the photosensitive chip 22 is surrounded by the annular supporting structure 122, so that the annular supporting structure 122 can prevent electromagnetic interference from the driving chip 220 from four sides of the photosensitive chip 22. Meanwhile, the frame of the metal stiffener 12 is located at the upper side of the photo-sensing chip 22, and thus, the frame can prevent electromagnetic interference from the driving chip 220 to some extent from the upper side of the photo-sensing chip 22.

It should be noted that the metal stiffener 12 embedded in the module support 10 can also enhance the heat dissipation capability of the module support 10 to optimize the heat dissipation of the photosensitive chip 22.

Those skilled in the art will appreciate that the support leg structure of the conventional plastic support is made of plastic material as compared to the conventional plastic support (whether it is a plastic support in COB process, a molded support in MOB process, or a molded support in MOC process), and thus, in order to secure the support effect, the support leg structure of the conventional plastic support needs to have a relatively large wall thickness dimension (i.e., a wall thickness dimension of one side of the conventional plastic support is large), which will have an effect on miniaturization of the receiving module 100. Accordingly, in the present embodiment, the annular support structure 122 is made of a metallic material having a relatively high structural strength, and thus, the annular support structure 122 is still capable of providing a satisfactory supporting force for the module support 10 with a relatively small thickness dimension. Quantitatively, in the embodiment of the present application, the thickness dimension of the annular support structure 122 is 0.05mm to 0.15mm, while the wall thickness of one side of the conventional plastic support is about 0.25 mm.

In particular, in the present embodiment, the annular support structure 122 is a discontinuous annular structure, that is, the annular support structure 122 has at least one notch. It is noted that in the embodiment of the present application, the annular supporting structure 122 has at least three notches 1220 distributed in a non-completely collinear manner, and technical effects and technical purposes regarding this technical feature will be described in the following description.

It should be noted that in the present embodiment, the annular support structure 122 is not a continuous annular structure (i.e., the annular support structure 122 has a notch), but the annular support structure 122 is exposed on four sides of the module support 10, so that the electromagnetic shielding structure 12A formed by the annular support structure 122 can prevent electromagnetic infection from the outside from four sides of the photosensitive chip 22. That is, in the embodiment of the present application, the annular supporting structure 122 exposed to the package 11 is formed around the lower skirt portion of the module holder 10 to form the main body portion of the supporting leg structure 120 of the module holder 10, so that the annular supporting structure 122 can surround the outer circumference of the photosensitive chip 22 to form the electromagnetic shielding structure 12A when the module holder 10 is attached to the upper surface of the second wiring board 21 by an adhesive.

Of course, in other examples of the present application, the annular supporting structure 122 may be formed on only a few sides of the module support 10, for example, the annular supporting structure 122 may be located on only two opposite sides, two adjacent sides, or three sides between the modules of the module support 10, which is not limited in this application. That is, in other examples of the present application, the annular support structure 122 may also prevent electromagnetic interference from the drive chip 220 from several sides (e.g., two or three sides) of the photosensitive chip 22. Here, when the annular support structure 122 is located on two or three opposite sides of the module support 10, it is essentially that the gap of the annular support structure 122 is large, and from this point of view it may still be named annular support structure 122.

As previously mentioned, in the present embodiment, the annular support structure 122 has at least three indentations 1220 that are distributed in a non-entirely collinear manner. Accordingly, during the injection molding process, the injection molding material flows into the indentations and forms at least three bonds 1120 at the at least three indentations 1220 of the annular support structure 122 after molding, that is, in the embodiment of the present application, the package 11 forms at least three bonds 1120 distributed in a non-collinear manner at the at least three indentations 1220 of the annular support structure 122. As shown in fig. 5 to 7, in the embodiment of the present application, at least three notches 1220 of the annular support structure 122 are filled with the at least three joints 1120, such that the annular support structure 122 cooperates with the at least three joints 1120 to form the complete support leg structure 120 of the module support 10.

For ease of understanding and description, in the present embodiment, the portion of the package 11 for packaging the frame 121 is defined as a package main portion 111 and the portion of the package 11 for packaging the annular supporting structure 122 is positioned as a package bonding portion 112, that is, in the present embodiment, the package 11 includes a package main portion 111 and a package bonding portion 112 extending downward from the package main portion 111, wherein the package bonding portion 112 includes at least three bonding portions 1120 respectively formed at least three notches 1220 of the annular supporting structure 122. Accordingly, in the embodiment of the present application, the package main body 111 forms the accommodating cavity 100A therein in cooperation with the closed annular structure formed by the annular supporting structure 122 and the at least three bonding portions 1120, so that when the module support 10 is mounted on a circuit board, the photosensitive chip 22 mounted on the circuit board can be accommodated in the accommodating cavity 100A to protect the photosensitive chip 22 therein.

As shown in fig. 5 to 7, in the embodiment of the present application, the package body 111 has a mounting platform 1110 concavely formed on an upper surface thereof, wherein the mounting platform 1110 is adapted to mount a filter element thereon to filter the imaging light entering the photosensitive chip 22 through the filter element 23. It should be appreciated that when the filter element 23 is mounted to the mounting platform 1110, the receiving cavity 100A is sealed by the filter element 23 to protect the photosensitive chip 22 and other electronic devices located within the receiving cavity 100A. Of course, in other examples of the present application, the upper surface of the package main body 111 may be formed directly with a part of the upper surface of the package main body 111 as the mounting platform 1110 without disposing the recess portion forming the mounting platform 1110. That is, in other examples of the present application, the filter element 23 may be directly attached to the upper surface of the package main body 111.

It is also possible that in other examples of the present application, the mounting platform 1110 for mounting the filter element 23 is formed by the frame 121. For example, in some embodiments of the present application, at least a portion of the frame 121 protrudes from a side of the package body 111 to form the mounting platform 1110, and the filter element 23 is directly attached to the mounting platform 1110 formed by the frame 121. It should be noted that in these embodiments, the four sides of the frame 121 have a relatively large width dimension, and thus, they can better prevent electromagnetic interference from the driving chip 220 from the upper side of the photosensitive chip 22.

It is also worth mentioning that in some examples of the present application, the driving assembly includes an electromagnetic driver, for example, an electromagnetic driver for driving the optical lens 30 to move along the photosensitive path of the photosensitive assembly 20, where the electromagnetic driver may also generate electromagnetic interference to the photosensitive chip 22 during operation. Accordingly, in the embodiment of the present application, the metal stiffener 12 embedded in the module support 10 is beneficial to prevent the electromagnetic driver from generating electromagnetic interference to the photosensitive chip 22.

Further, in the present embodiment, the package 11 forms at least three bonds 1120 distributed in a non-collinear manner at least three indentations 1220 of the annular support structure 122. Here, the at least three coupling parts 1120 not only structurally connect the discontinuous ring-shaped supporting structure 122 to a complete closed ring-shaped structure, but also change the mounting manner of the module support 10 so that the module support 10 can be more smoothly and snugly mounted on the upper surface of the second circuit board 21.

In particular, as shown in fig. 5 to 7, in the embodiment of the present application, the bottom surfaces of the at least three coupling parts 1120 are on the same surface, and the bottom surfaces of the at least three coupling parts 1120 form at least three mounting fulcrums of the module bracket 10. It should be understood by those skilled in the art that when an object has three non-collinear mounting points, it can stand on a plane smoothly, and in the technical solution corresponding to the present application, the module support 10 can be mounted on the surface of the second circuit board 21 smoothly (here, the upper surface of the circuit board is set to be a flat surface) by at least three mounting points formed by the at least three joints 1120 and distributed in different lines

Most desirably, the bottom surfaces of the at least three joints 1120 are flush with the bottom surface of the annular support structure 122, that is, the bottom surfaces of the at least three joints 1120 and the bottom surface of the annular support structure 122 together form the bottom surface of the module support 10. It should be understood that the bottom surface of the module holder 10 is attached to the surface of the second circuit board 21 when the module holder 10 is attached to the circuit board, and thus, when the bottom surface of the module holder 10 is a flat surface, the mounting accuracy with the second circuit board 21 can be ensured.

Of course, in a specific implementation, the bottom surface of the at least three bonding portions 1120 may not be flush with the bottom surface of the annular support structure 112 due to processing and molding errors, for example, in another specific example of the present application, the bottom surface of the at least three bonding portions 1120 is lower than the bottom surface of the annular support structure 122, that is, in the embodiment of the present application, the lowest surface of the module support 10 in the height direction is formed by the bottom surfaces of the at least three bonding portions 1120. Accordingly, when the module holder 10 is attached to the second wiring board 21, the bottom surfaces of the at least three bonding portions 1120 overlap with the upper surface of the second wiring board 21. It should be understood that, in the embodiment of the present application, the bottom surfaces of the at least three bonding portions 1120 are on the same plane, so that when the module support 10 is stacked on the upper surface of the second circuit board 21 with the bottom surfaces of the at least three bonding portions 1120, the relative positional relationship between the module support 10 and the second circuit board 21 can be ensured, and in particular, the mounting parallelism of the module support 10 with respect to the circuit board can be ensured.

As another specific example of the present application, the bottom surfaces of the at least three bonding portions 1120 are flush with a portion of the bottom surface of the annular supporting structure 122, and the portion of the bottom surface of the annular supporting structure 122 not flush with the bottom surfaces of the at least three bonding portions 1120 is higher than the bottom surfaces of the at least three bonding portions 1120, so that the module support 10 can be stably attached to the second circuit board 21 as well.

It should be noted that, in the embodiment of the present application, the gap between the annular supporting structure 122 of the module support 10 and the second circuit board 21 is greater than 0mm and less than 0.02mm. That is, although the module holder 10 determines the relative positional relationship between the bottom surfaces of at least three bonding portions 1120 thereof and the surface of the second circuit board 21 in the embodiment of the present application, it is also necessary to provide glue between the bottom surface of the annular supporting structure 122 and the surface of the second circuit board 21 to strengthen the bonding strength between the module holder 10 and the second circuit board 21. It should be noted that, in the embodiment of the present application, the thickness dimension of the at least three bonding portions 1120 is greater than the thickness dimension of the annular supporting structure 122, and thus, the dimension of the bottom surface of the at least three bonding portions 1120 is greater than the dimension of the bottom surface of the annular supporting structure 122, and thus, the area of the portion of the module support 10 contacting the circuit board 21 can be increased compared to the existing injection molding support, so that a relatively larger amount of adhesive can be applied between the module support 10 and the circuit board 21 to ensure the bonding strength therebetween.

It should be appreciated that the molding shape and molding accuracy of the at least three bonding portions 1120 can be ensured and consistent regardless of deviation of the mounting position of the metal reinforcement 12 in the injection mold during the injection molding process. That is, in the embodiment of the present application, the metal stiffener 12 of the module support 10 has a special structural design such that, after the package 11 is integrally formed with the metal stiffener 12, the package 11 forms at least three bonding portions arranged in a non-collinear manner, and the at least three bonding portions arranged in a non-collinear manner form a mounting positioning structure of the module support 10 and the second circuit board 21. That is, in the embodiment of the present application, by changing the bonding manner between the metal stiffener 12 and the package 11, the module bracket 10 forms the mounting structure of the module bracket 10 and the second wiring board 21 with the package 11 having more controllable and higher dimensional and shape accuracy, in such a manner that the mounting accuracy of the module bracket 10 and the second wiring board 21 is improved.

In a specific example of the present application, the at least three notches 1220 include four notches formed at four corners of the annular support structure 122, respectively, and are defined as a first notch 1221, a second notch 1222, a third notch 1223, and a fourth notch 1224 for convenience of explanation. Similarly, the package 11 includes a first coupling portion 1121, a second coupling portion 1122, a third coupling portion 1123, and a fourth coupling portion 1124 formed in the first notch 1221, the second notch 1222, the third notch 1223, and the fourth notch 1224, respectively. It should be appreciated that by such a positional arrangement, the module support 10 forms four mounting fulcra at its four corners, which is more advantageous in ensuring the mounting accuracy between the module support 10 and the second wiring board 21.

As shown in fig. 7, in the embodiment of the present application, the annular support structure 122 includes a first support arm 1225 extending upward from a first side 1211 of the frame 121, a second support arm 1226 extending upward from a second side 1212 of the frame 121 adjacent to the first side 1211, a third support arm 1227 extending upward from a third side 1213 of the frame 121 opposite to the first side 1211, and a fourth support arm 1228 extending upward from a fourth side 1214 of the frame 121 opposite to the second side 1212, wherein the first notch 1221 is formed between the first support arm 1225 and the second support arm 1226, the second notch 1222 is formed between the second support arm 1226 and the third support arm 1227, the third notch 1223 is formed between the third support arm 1227 and the fourth support arm 1228, and the fourth notch 1224 is formed between the first support arm 1225 and the fourth support arm 1228.

For example, in one specific example of the present application, the first, second, third and fourth support arms 1225, 1226, 1227, 1228 of the annular support structure 122 are made of a foldable material. It should be appreciated that when the annular support structure 122 is made of a metal material, the first, second, third and fourth support arms 1225, 1226, 1227, 1228 are foldable relative to the frame 121, such that when it is desired to participate in an injection molding process, the first, second, third and fourth support arms 1225, 1226, 1227, 1228 are respectively folded relative to the frame 121 to form the annular support structure 122 extending perpendicular to the frame 121 and along the periphery of the frame 121.

In particular, in this particular example, it is preferable that the first support arm 1225 has at least one first through hole 12251 formed at the transition thereof with the frame 121; and/or the second support arm 1226 has at least one second through hole 12261 formed at its transition with the frame 121; and/or the third support arm 1227 has at least one third through hole 12271 formed at its transition with the frame 121; and/or the fourth support arm 1228 has at least one fourth through hole 12281 formed at its transition with the frame 121. That is, it is preferable that the first, second, third and fourth support arms 1225, 1226, 1227 and 1228 be hollowed out at their transition with the frame 121 to weaken the degree of rebound of the first, second, third and fourth support arms 1225, 1226, 1227 and 1228 after being bent to improve the accuracy after bending. It should be appreciated that in some examples of the present application, the first through hole 12251 to the fourth through hole 12281 may also be implemented as grooves or dimples, which are not limited to the present application.

Of course, in other examples of the present application, the annular supporting structure 122 may be formed by other processes, for example, the annular supporting structure 122 may naturally have the first notch 1221, the second notch 1222, the third notch 1223 and the fourth notch 1224 after the metal reinforcement 12 is formed, or the annular supporting structure 122 may be a closed annular structure after the metal reinforcement 12 is formed, and the first notch 1221, the second notch 1222, the third notch 1223 and the fourth notch 1224 may be formed at four corners of the annular supporting structure 122, which is not limited in this application.

More specifically, in the embodiment of the present application, the first support arm 1225 includes a first support arm main body 12252 and a first bending portion 12253 extending inward from a side portion of the first support arm main body 12252 toward the fourth notch 1224, where the first bending portion 12253 is wrapped in the fourth bonding portion 1124. The first support arm 1225 further includes a second bending portion 12254 extending inward from a side portion of the first support arm main body 12252 toward the first notch 1221, and the second bending portion 12254 is wrapped in the first bonding portion 1121. Accordingly, in the embodiment of the present application, the second support arm 1226 includes a second support arm main body 11262 and a third bending portion 12263 extending inward from a side portion of the second support arm main body 11262 toward the first notch 1221, and the third bending portion 12263 is wrapped in the first bonding portion 1121.

In one example of the present application, the second bending portion 12254 of the first support arm 1225 and the third bending portion 12263 of the second support arm 1226 have different heights with respect to the frame 121. That is, the second bending part 12254 of the first support arm 1225 and the third bending part 12263 of the second support member structurally reinforce the first coupling part 1121 at different height positions of the first coupling part 1121. Of course, in other examples of the present application, the second bending portion 12254 of the first support arm 1225 and the third bending portion 12263 of the second support arm 1226 have the same height with respect to the frame 121, that is, the second bending portion 12254 of the first support arm 1225 and the third bending portion 12263 of the second support member structurally reinforce the first joint 1121 at the same height position of the first joint 1121. Of course, in other examples of the present application, a greater number of the second bending parts 12254 may be provided at the side of the first support arm 1225, and/or a greater number of the third bending parts 12263 may be provided at the side of the second support arm 1226, and a plurality of the second bending parts 12254 and a plurality of the third bending parts 12263 may be provided at a staggered manner to reinforce the first coupling part 1121, which is not limited to the present application.

Further, in the embodiment of the present application, the second support arm 1226 further includes a fourth bending portion 12264 extending inward from the side portion of the second support arm main body 11262 toward the second notch 1222, and the fourth bending portion 12264 is wrapped in the second bonding portion 1122. The third support arm 1227 includes a third support arm main body 11272 and a fifth bending portion 11273 extending inward from a side portion of the third support arm main body 11272 toward the second notch 1222, and the fifth bending portion 11273 is wrapped in the second coupling portion 1122.

In one example of the present application, the fourth bending portion 12264 of the second support arm 1226 and the fifth bending portion 11273 of the third support arm 1227 have different heights with respect to the frame 121. That is, the fourth bending portion 12264 of the second support arm 1226 and the fifth bending portion 11273 of the third support member structurally reinforce the second coupling portion 1122 at different height positions of the second coupling portion 1122. Of course, in other examples of the present application, the fourth bending portion 12264 of the second support arm 1226 and the fifth bending portion 11273 of the third support arm 1227 have the same height with respect to the frame 121, that is, the fourth bending portion 12264 of the second support arm 1226 and the fifth bending portion 11273 of the third support arm 1227 structurally reinforce the second coupling portion 1122 at the same height position of the second coupling portion 1122. Of course, in other examples of the present application, a greater number of the fourth bending parts 12264 may be provided on the side of the second support arm 1226, and/or a greater number of the fifth bending parts 11273 may be provided on the side of the third support arm 1227, and a plurality of the fourth bending parts 12264 and a plurality of the fifth bending parts 11273 may be provided in a staggered manner to reinforce the second coupling part 1122, which is not limited to the present application.

Further, in the embodiment of the present application, the third support arm 1227 further includes a sixth bending portion 11274 extending inward from the side portion of the third support arm main body 11272 toward the third notch 1223, and the sixth bending portion 11274 is wrapped in the third combining portion 1123. The fourth support arm 1228 includes a fourth support arm main body 11282 and a seventh bent portion 11283 extending inward from a side portion of the fourth support arm main body 11282 toward the third notch 1223, and the seventh bent portion 11283 is enclosed in the third coupling portion 1123.

In a specific example of the present application, the sixth bending portion 11274 of the third supporting arm 1227 and the seventh bending portion 11283 of the fourth supporting arm 1228 have different heights with respect to the frame 121. That is, the sixth bending portion 11274 of the third support arm 1227 and the seventh bending portion 11283 of the fourth support arm 1228 structurally reinforce the third coupling portion 1123 at different height positions of the third coupling portion 1123. Of course, in other examples of the present application, the sixth bending portion 11274 of the third supporting arm 1227 and the seventh bending portion 11283 of the fourth supporting arm 1228 have the same height with respect to the frame 121, that is, the sixth bending portion 11274 of the third supporting arm 1227 and the seventh bending portion 11283 of the fourth supporting arm 1228 structurally reinforce the third connecting portion 1123 at the same height position of the third connecting portion 1123. Of course, in other examples of the present application, a greater number of the sixth bending portions 11274 may be provided at the side portion of the third support arm 1227 and/or a greater number of the seventh bending portions 11283 may be provided at the side portion of the fourth support arm 1228, and a plurality of the sixth bending portions 11274 and a plurality of the seventh bending portions 11283 may be provided so as to stagger the third coupling portion 1123 for reinforcement, which is not limited to the present application.

Further, in the embodiment of the present application, the fourth support arm main body 11282 further includes an eighth bending portion 11284 extending inward from a side portion of the fourth support arm main body 11282 toward the fourth notch 1224, and the eighth bending portion 11284 is wrapped in the fourth combining portion 1124. As previously described, the first support arm 1225 further includes a first bending portion 12253 extending inward from the side of the first support arm body 12252 toward the fourth notch 1224, and the second bending portion 12253 is wrapped in the fourth bonding portion 1124.

In a specific example of the present application, the eighth bending portion 11284 of the fourth support arm 1228 and the first bending portion 12253 of the first support arm 1225 have different heights with respect to the frame 121. That is, the eighth bending portion 11284 of the fourth support arm 1228 and the first bending portion 12253 of the first support arm 1225 structurally reinforce the fourth coupling portion 1124 at different height positions of the fourth coupling portion 1124. Of course, in other examples of the present application, the eighth bending portion 11284 of the fourth supporting arm 1228 and the first bending portion 12253 of the first supporting arm 1225 have the same height with respect to the frame 121, that is, the eighth bending portion 11284 of the fourth supporting arm 1228 and the first bending portion 12253 of the first supporting arm 1225 structurally reinforce the fourth connecting portion 1124 at the same height position of the fourth connecting portion 1124. Of course, in other examples of the present application, a greater number of the eighth bending portions 11284 may be provided on the side portion of the fourth support arm 1228, and/or a greater number of the first bending portions 12253 may be provided on the side portion of the first support arm 1225, and a plurality of the eighth bending portions 11284 and a plurality of the first bending portions 12253 may be provided so as to stagger and reinforce the fourth coupling portion 1124, which is not limited to the present application.

It should be understood that, for the support leg structure 120 of the module support 10, since the annular support structure 122 is made of a metal material and four joints formed at the notches of the annular support structure 122 are made of a plastic material, the weakest link of the module support 10 in the support leg structure 120 part thereof is the four joints. Accordingly, by providing the bent portions (i.e., the first to eighth bent portions) at the side portions of the first, second, third and fourth support arms 1225, 1226, 1227 and 1228, the structural strength of the support leg structure 120 at the four corners can be reinforced so that the structural strength of the module support 10 at the support leg structure 120 portion thereof can meet the preset requirement.

Moreover, when the first to eighth bending portions are embedded in the four corners of the supporting leg structure 120, the electromagnetic shielding structure 12A formed by the annular supporting structure 122 can cover the periphery of the photosensitive chip 22 more widely and more comprehensively, so as to perform electromagnetic shielding on the photosensitive chip 22 more widely and more comprehensively.

As shown in fig. 5 to 7, in the embodiment of the present application, at least a portion of at least one of the at least three bonding portions 1120 is recessed inward. Here, the inward depression of at least a portion of the coupling portion means that at least a portion of the coupling portion is depressed toward the receiving cavity so that the thickness dimension of the corresponding coupling portion is reduced, and in this way, the corresponding coupling portion can also be reinforced. In the embodiment of the present application, at least a portion of the first, second, third and fourth coupling parts 1121, 1122, 1123 and 1124 are recessed inward such that the first, second, third and fourth coupling parts 1121, 1122, 1123 and 1124 are structurally reinforced.

It should be noted that, in the process of manufacturing the module support 10, since the reinforcement member 12 needs to be cut after injection molding, if no recess is provided at the at least three bonding portions 1120, the remaining connecting band portion may protrude outside the entire module support after the reinforcement member 12 is cut, resulting in an increase in size and irregular overall appearance of the module support 10. Accordingly, when the recess is provided in the at least three coupling portions 1120, the cut connection tape may be received in the recess so that the remaining connection tape does not protrude from the module holder 10, in such a manner as to satisfy the size and appearance requirements of the module holder 10.

Fig. 8 illustrates a schematic diagram of a variant implementation of the metal stiffener 12 according to an embodiment of the present application. In this variant embodiment, the number and position of the indentations of the annular support structure 122 are adjusted, as shown in fig. 8. More specifically, as shown in fig. 8, in this variant embodiment, the at least three indentations include a first indentation 1221 located at a first edge 1211 of the annular support structure 122, a second indentation 1222 located at a second edge 1212 of the annular support structure 122 adjacent to the first edge 1211, and a third indentation 1223 located at a third edge 1213 of the annular support structure 122 opposite to the first edge 1211. That is, in this variant embodiment, the annular support structure 122 has three notches formed on three sides, respectively. Preferably, in this variant embodiment, the first notch 1221 is located at the center of the first edge 1211, the second notch 1222 is located at the center of the second edge 1212, and the third notch 1223 is located at the center of the third edge 1213. It should be appreciated that as the number of notches of the annular support structure 122 is reduced, the annular support structure 122 covers a larger area around the photosensitive chip 22, thereby providing more overall electromagnetic interference resistance.

Fig. 9 illustrates a schematic diagram of a variant implementation of the metal stiffener 12 according to an embodiment of the present application. In this variant embodiment, the number and position of the indentations of the annular support structure 122 are adjusted, as shown in fig. 9. More specifically, in this embodiment, the at least three indentations include a first indentation 1221 and a second indentation 1222 located at a first side 1211 of the annular support structure 122, and a third indentation 1223 located at a third side 1213 of the annular support structure 122 opposite the first side 1211. Preferably, in this variant embodiment, the third notch 1223 is located on a midpoint of a line between the first notch 1221 and the second notch 1222, and the third notch 1223 is located at a midpoint of the third edge 1213, the first notch 1221 and the second notch 1222 being located on two quarters of the first edge 1211. It should be appreciated that as the number of notches of the annular support structure 122 is reduced, the annular support structure 122 covers a larger area around the photosensitive chip 22, thereby providing more overall electromagnetic interference resistance.

In summary, the depth information camera module according to the embodiments of the present application is illustrated, which solves the electromagnetic interference problem of the photosensitive chip 22 and the heat dissipation problem of the photosensitive chip 22 through an optimized module bracket 10, and meets the technical requirements of miniaturization of the module. Specifically, the module holder 10 has the metal reinforcement 12 embedded therein so that the module holder 10 itself forms the electromagnetic shielding structure 12A for protecting the photosensitive chip 22. That is, in some embodiments of the present application, it is not necessary to provide the projection module 200 with a shielding case to reduce the cost and enable the size of the projection module 200 to be reduced. Second, the module support 10 satisfies the trend of miniaturization of the module by embedding the metal reinforcement 12 inside thereof so that the module support 10 has structural strength satisfying the requirement in a relatively small size. In addition, the metal stiffener 12 embedded in the module support 10 can also enhance the heat dissipation capability of the module support 10 to optimize the heat dissipation of the photosensitive chip 22.

Fig. 4 illustrates a schematic diagram of a variant embodiment of the receiving module 100 according to an embodiment of the present application. In this variant embodiment, the module holder 10 of the receiving module 100 is embodied as an integrated holder, as compared to the receiving module 100 as illustrated in fig. 3. More specifically, in the example illustrated in fig. 3, the lens barrel 31 of the optical lens 30 and the module holder 10 of the photosensitive assembly 20 are two independent components, that is, in the example illustrated in fig. 3, the module holder 10 is a split-type holder. In the modified embodiment as illustrated in fig. 4, the module holder 10 and the lens barrel 31 of the optical lens 30 have an integral structure, that is, the module holder 10 simultaneously forms the lens barrel 31 of the optical lens 30, and the optics of the optical lens 30 are directly mounted in the module holder 10.

Accordingly, in the present embodiment, the metal reinforcement 12 may also be embedded in the module support 10. Also, the arrangement pattern of the metal stiffener 12 within the module holder 10 may be adjusted in response to the adjustment of the shape and size of the module holder 10, for example, the metal stiffener 12 may be extended to a portion of the module holder 10 for supporting the optical lens 32 in such a manner that the metal stiffener 12 covers a greater range of the photosensitive chip 22 to strengthen the electromagnetic interference effect of the metal stiffener 12.

The basic principles of the present application have been described above in connection with specific embodiments, however, it should be noted that the advantages, benefits, effects, etc. mentioned in the present application are merely examples and not limiting, and these advantages, benefits, effects, etc. are not to be considered as necessarily possessed by the various embodiments of the present application. Furthermore, the specific details disclosed herein are for purposes of illustration and understanding only, and are not intended to be limiting, as the application is not intended to be limited to the details disclosed herein as such.

Claims (18)

1. The utility model provides a degree of depth information module of making a video recording which characterized in that includes:

the projection module comprises a first circuit board, a driving chip electrically connected with the first circuit board and a light source electrically connected with the driving chip; and

the receiving module is adjacently arranged on the projection module and comprises a photosensitive assembly and an optical lens which is held on a photosensitive path of the photosensitive assembly, wherein the photosensitive assembly comprises a second circuit board, a photosensitive chip which is electrically connected with the second circuit board and a module support which is arranged on the circuit board, the module support and the second circuit board are matched to form a containing cavity between the two, and the photosensitive chip is contained in the containing cavity;

The module support comprises a package body and a metal reinforcement part at least partially embedded in the package body, wherein at least a part of the metal reinforcement part is arranged around the photosensitive chip in a surrounding manner to form an electromagnetic shielding structure.

2. The depth information camera module of claim 1, wherein the metal stiffener comprises a metal frame and an annular support structure perpendicular to the frame and extending along a periphery of the frame, wherein the photosensitive chip is disposed around within the annular support structure to form the electromagnetic shielding structure through the annular support structure.

3. The depth information camera module of claim 2, wherein the annular support structure is exposed to the package and mounted to the second circuit board, the annular support structure having a wall thickness of 0.05mm-0.15mm.

4. A depth information camera module according to claim 3, wherein the annular support structure has at least three indentations distributed in a non-collinear manner, the package body forming at least three joints distributed in a non-collinear manner at the at least three indentations of the annular support structure, wherein the at least three joints form at least three mounting fulcrums for the module bracket to be mounted to the second circuit board.

5. The depth information camera module of claim 4, wherein bottom surfaces of the at least three joints are in a same plane, the module bracket being smoothly attached to the second circuit board.

6. The depth information camera module of claim 5, wherein a bottom surface of the at least three joints is set to a surface that is lower than or flush with a lower surface of the annular support structure.

7. The depth information camera module of claim 3, wherein the at least three notches include a first notch, a second notch, a third notch, and a fourth notch at four corners of the annular support structure, and the at least three joints include a first joint, a second joint, a third joint, and a fourth joint formed at the first notch, the second notch, the third notch, and the fourth notch, respectively.

8. A depth information camera module according to claim 3, wherein the annular support structure includes a first support arm extending upwardly from a first side of the frame, a second support arm extending upwardly from a second side of the frame adjacent to the first side, a third support arm extending upwardly from a third side of the frame opposite the first side, and a fourth support arm extending upwardly from a fourth side of the frame opposite the second side, wherein the first notch is formed between the first support arm and the second support arm, the second notch is formed between the second support arm and the third support arm, the third notch is formed between the third support arm and the fourth support arm, and the fourth notch is formed between the fourth support arm and the first support arm.

9. The depth information camera module of claim 1, wherein the first support arm includes a first support arm body, a first bend extending inwardly from a side of the first support arm body toward the fourth notch, and a second bend extending inwardly from a side of the first support arm body toward the fourth notch, wherein the first bend is wrapped in the fourth bond, and the second bend is wrapped in the first bond.

10. The depth information camera module of claim 9, wherein the second support arm includes a second support arm body, a third bend extending inwardly from a side of the second support arm body toward the first notch, and a fourth bend extending inwardly from a side of the second support arm body toward the second notch, wherein the third bend is wrapped in the first bond, and the fourth bend is wrapped in the second bond.

11. The depth information camera module of claim 10, wherein the third support arm includes a third support arm body, a fifth bend extending inwardly from a side of the third support arm body toward the second gap, and a sixth bend extending inwardly from a side of the third support arm body toward the third gap, wherein the fifth bend is wrapped in the second bond, and the sixth bend is wrapped in the third bond.

12. The depth information camera module of claim 11, wherein the fourth support arm includes a fourth support arm body, a seventh bend extending inwardly from a side of the fourth support arm body toward the third gap, and an eighth bend extending inwardly from a side of the fourth support arm body toward the fourth gap, wherein the seventh bend is encased within the third bond, and the eighth bend is encased within the fourth bond.

13. The depth information camera module of claim 8, wherein the first support arm has at least one first through hole forming a transition with the frame; and/or the second supporting arm is provided with at least one second through hole forming the transition part between the second supporting arm and the frame body; and/or the third supporting arm is provided with at least one third through hole forming the transition part between the third supporting arm and the frame body; and/or the fourth supporting arm is provided with at least one fourth through hole forming the transition part of the fourth supporting arm and the frame body.

14. The depth information camera module of claim 1, wherein the module holder has an opening formed at an upper portion thereof and in communication with the receiving cavity, the photosensitive assembly further comprising a filter element disposed at the upper portion of the module holder, the filter element closing the opening.

15. The depth information camera module of claim 1, wherein the projection module further comprises an optical modulation assembly held in a projection path of the light source.

16. The depth information camera module of claim 15, wherein the light source is a VCSEL unit.

17. The depth information camera module of claim 16, wherein the receiving module further comprises an electromagnetic driver for driving the optical lens to move relative to the photosensitive assembly.

18. The depth information camera module of claim 1, wherein the metal stiffener is electrically connected to the second circuit board.

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