CN215771140U - Optical sensor packaging structure with light source emission unit and photosensitive unit - Google Patents
Optical sensor packaging structure with light source emission unit and photosensitive unit Download PDFInfo
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- CN215771140U CN215771140U CN202122220478.3U CN202122220478U CN215771140U CN 215771140 U CN215771140 U CN 215771140U CN 202122220478 U CN202122220478 U CN 202122220478U CN 215771140 U CN215771140 U CN 215771140U
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Abstract
The utility model discloses an optical sensor packaging structure with a light source emission unit and a photosensitive unit, which relates to the technical field of semiconductors, and comprises the following components: a substrate; a bracket disposed on the substrate, an accommodating space being formed between the bracket and the substrate; the photosensitive unit is arranged on the substrate and is positioned in the accommodating space, and the bracket is provided with a first opening corresponding to the position of the photosensitive unit; a light source emission unit disposed on the substrate; the lens is arranged at the first opening and connected with the support, and at least one surface of the lens is provided with a coating film. The method and the device can simplify the process flow in the packaging process of the optical sensor with the light source emitting unit and the light sensing unit, and reduce the packaging cost.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to an optical sensor packaging structure with a light source emitting unit and a photosensitive unit.
Background
The Optical Sensor having the light source emitting unit and the light sensing unit is various in types, and includes a Time of flight (TOF) Sensor, an Optical Tracking Sensor (OTS), and the like, the light source emitting unit emits emitting light with a specific wavelength, and the light is reflected by a target object, and the light sensing unit receives incident light reflected by the target object, so as to achieve distance measurement, Optical Tracking, and the like. Such as a D-TOF (Direct-Time of flight) sensor, where the context interpretation may be Direct Time of flight. The sensor has a very simple working principle, the transmitting equipment can firstly transmit light pulses, the light pulses can be reflected when meeting obstacles, the propagation speed of the known light is certain, the time for receiving the reflected light is different when the distances are different, the distance from the light pulse transmitting position to the position of an object can be calculated by recording the reflection time of the light pulses, and the 3D form of the object can be drawn by continuously repeating the process. In short, 3D imaging of an object can be obtained by detecting the flight (round trip) time of the light pulse to obtain the target object distance.
In an existing optical sensor, a film is directly plated on a die or wafer of the optical sensor in a packaging process, so that light entering the die is filtered, and only a light signal with a specified wavelength is guaranteed to reach the die. However, the process flow of directly plating the film on the crystal grain is very complicated, resulting in high cost.
SUMMERY OF THE UTILITY MODEL
In order to overcome the above defects in the prior art, embodiments of the present invention provide an optical sensor package structure with a light source emitting unit and a light sensing unit, which can simplify the process flow in the optical sensor package process with the light source emitting unit and the light sensing unit and reduce the package cost.
The specific technical scheme of the embodiment of the utility model is as follows:
an optical sensor package having a light source emitting unit and a light sensing unit, the optical sensor package having the light source emitting unit and the light sensing unit includes:
a substrate;
a bracket disposed on the substrate, an accommodating space being formed between the bracket and the substrate;
the photosensitive unit is arranged on the substrate and is positioned in the accommodating space, and the bracket is provided with a first opening corresponding to the position of the photosensitive unit;
a light source emission unit disposed on the substrate;
the lens is arranged at the first opening and connected with the support, and at least one surface of the lens is provided with a coating film.
Preferably, one side of the lens, which is away from the photosensitive unit, is connected with one side of the bracket, which faces the photosensitive unit, in a sticking manner.
Preferably, one surface of the lens, which faces away from the photosensitive unit, is provided with a convex part, and the coating is located on one surface of the lens, which faces towards the photosensitive unit.
Preferably, one surface of the lens, which faces away from the photosensitive unit, is provided with a protruding portion, the protruding portion is located in the first opening, and the highest position of the protruding portion is lower than the upper end surface of the bracket.
Preferably, one surface of the lens facing the photosensitive unit is provided with a concave part, and the coating is positioned on one surface of the lens facing away from the photosensitive unit.
Preferably, the lens is injection molded by a transparent resin.
Preferably, the plating film is such that transmittance of incident light in a specific wavelength range within which the wavelength of light emitted by the light source emission unit is located is greater than a threshold value.
Preferably, the bracket is provided with a partition part, the partition part divides the accommodating space into a first accommodating space and a second accommodating space which are independent, and the photosensitive region of the photosensitive unit is located in the first accommodating space;
the light source emission unit is positioned in the second accommodating space;
and a second opening is formed in the position, corresponding to the light source emission unit, on the bracket.
Preferably, the second accommodating space is filled with transparent glue.
Preferably, the bracket and the substrate are bonded together through black glue; the photosensitive unit and the substrate are bonded together through an adhesive; the light source emission unit is attached to the substrate through conductive silver paste.
The technical scheme of the utility model has the following remarkable beneficial effects:
thereby the setting realizes fixedly on the support through connecting the lens in sensitization unit top in this application to with sensitization unit phase separation, so, can carry out the coating film processing to lens alone when processing preparation optical sensor packaging structure, be connected to the support after processing is accomplished, or lens only carries out coating film processing with the support together, be connected to on the base plate after processing is accomplished. By the method, the process flow in the optical sensor packaging process can be effectively simplified, the lens and the photosensitive unit are prevented from being transported back and forth between a coating factory and a packaging factory in the processing process, and the packaging cost is reduced. Meanwhile, the lens is arranged on the support, so that stray light and impurities can be further prevented from entering the packaging, and the packaging reliability is enhanced.
Specific embodiments of the present invention are disclosed in detail with reference to the following description and drawings, indicating the manner in which the principles of the utility model may be employed. It should be understood that the embodiments of the utility model are not so limited in scope. Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments, in combination with or instead of the features of the other embodiments.
Drawings
The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way. In addition, the shapes, the proportional sizes, and the like of the respective members in the drawings are merely schematic for facilitating the understanding of the present invention, and do not specifically limit the shapes, the proportional sizes, and the like of the respective members of the present invention. Those skilled in the art, having the benefit of the teachings of this invention, may choose from the various possible shapes and proportional sizes to implement the utility model as a matter of case.
Fig. 1 is a schematic structural diagram of an optical sensor package structure provided with a light source emitting unit and a light sensing unit according to an embodiment of the present invention in a first implementation manner;
FIG. 2 is a top view of the sensing unit, the substrate and the light source emitting unit of FIG. 1;
fig. 3 is a schematic structural diagram of an optical sensor package structure provided with a light source emitting unit and a light sensing unit according to an embodiment of the present invention in a second implementation manner.
Reference numerals of the above figures:
1. a substrate; 2. a support; 21. a support portion; 22. a sidewall portion; 23. a partition portion; 24. a first opening; 25. a second opening; 3. an accommodating space; 31. a first accommodating space; 32. a second accommodating space; 4. a light sensing unit; 5. a lens; 51. a boss portion; 52. a recessed portion; 6. welding wires; 7. a connecting portion; 8. conductive silver paste; 9. a light source emitting unit; 10. transparent glue; 11. and (3) a binder.
Detailed Description
The details of the present invention can be more clearly understood in conjunction with the accompanying drawings and the description of the embodiments of the present invention. However, the specific embodiments of the present invention described herein are for the purpose of illustration only and are not to be construed as limiting the utility model in any way. Any possible variations based on the present invention may be conceived by the skilled person in the light of the teachings of the present invention, and these should be considered to fall within the scope of the present invention. It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, mechanical or electrical connections, communications between two elements, direct connections, indirect connections through intermediaries, and the like. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In order to simplify the process flow in the process of packaging an optical sensor having a light source emitting unit and a light sensing unit and reduce the packaging cost, the present application provides an optical sensor packaging structure having a light source emitting unit and a light sensing unit, fig. 1 is a schematic structural view of the optical sensor packaging structure having a light source emitting unit and a light sensing unit in the embodiment of the present invention in a first implementation manner, fig. 2 is a top view of the light sensing unit, a substrate and the light source emitting unit in fig. 1, fig. 3 is a schematic structural view of the optical sensor packaging structure having a light source emitting unit and a light sensing unit in the embodiment of the present invention in a second implementation manner, and as shown in fig. 1 to fig. 3, the optical sensor packaging structure having a light source emitting unit and a light sensing unit may include: a substrate 1; a holder 2 disposed on the substrate 1, an accommodating space 3 being formed between the holder 2 and the substrate 1; a photosensitive unit 4 disposed on the substrate 1, the photosensitive unit 4 being located in the accommodating space 3, the holder 2 having a first opening 24 corresponding to the position of the photosensitive unit 4; a light source emitting unit 9 disposed on the substrate 1; and the lens 5 is arranged at the first opening 24, the lens 5 is connected with the bracket 2, and at least one surface of the lens 5 is provided with a coating.
Thereby lens 5 in this application is through connecting on support 2 and realizing fixedly to with sensitization unit 4 phase separation, so, can carry out coating film processing to lens 5 alone when processing preparation optical sensor packaging structure, be connected to support 2 after the processing is accomplished on. By the method, the process flow in the optical sensor packaging process can be effectively simplified, the back-and-forth transportation of the light sensing unit 4 between a coating factory and a packaging factory in the processing process is avoided, and the packaging cost is reduced. Meanwhile, the lens is arranged on the support, so that stray light and impurities can be further prevented from entering the packaging, and the packaging reliability is enhanced.
In order to better understand the optical sensor package structure with the light source emitting unit and the light sensing unit in the present application, it will be further explained and explained below. As shown in fig. 1, the optical sensor package structure having a light source emitting unit and a light sensing unit may include: substrate 1, support 2, light sensing unit 4, light source emitting unit 9 and lens 5. Here, the substrate 1 may extend in a horizontal direction, and is used to dispose the fixing bracket 2, the photosensitive unit 4, and the like. The substrate 1 may be a Printed Circuit Board (PCB) substrate, which serves as a support for electronic components, thereby implementing a carrier for electrical interconnection of the electronic components, and may also be a substrate of other processes.
As shown in fig. 1, a holder 2 is provided on a substrate 1, and the holder 2 is fixedly coupled to a contact portion of the substrate 1. Further, the contact portions between the holder 2 and the substrate 1 are bonded together by the adhesive 11. The adhesive 11 may preferably be black glue to prevent stray light from entering the package, although this application is not limited thereto. An accommodation space 3 is formed between the holder 2 and the substrate 1. Further, the holder 2 may include a support portion 21 and a side wall portion 22, the side wall portion 22 being located at a periphery of the support portion 21, the side wall portion 22 being in contact with the substrate 1 toward a lower end of the substrate 1, and being bonded thereto by the adhesive 11. The support portion 21 extends in the horizontal direction with a gap from the substrate 1, so that the receiving space 3 is formed between the support portion 21, the side wall portion 22, and the substrate 1.
As shown in fig. 1, the photosensitive unit 4 is disposed on the substrate 1, and the photosensitive unit 4 is located in the accommodating space 3. The photosensitive unit 4 and the substrate 1 may also be adhered together by an adhesive 11, and the adhesive 11 may preferably be a Die Bonding (DB) adhesive, although this application does not limit this to any specific application, and may also be a Die Attach Film (DAF) adhesive or an Ultraviolet (UV) adhesive. As shown in fig. 2, the die (die or wafer) of the light sensing unit 4 is electrically connected to the connection portion 7 on the substrate 1 through the bonding wire 6, so as to supply power and transmit signal data to the die of the light sensing unit 4. Specifically, the connection between the connection portion 7 on the substrate 1 and the chip of the photosensitive unit 4 may be realized by, for example, a gold wire, a silver wire, a copper wire, or the like. Of course, the connection portion 7 and the bonding wire 6 may be replaced by other connection methods to achieve electrical connection between the die and the substrate 1, and no particular limitation is imposed on them in this application.
As shown in fig. 1, the holder 2 has a first opening 24 corresponding to the position of the photosensitive unit 4. The first opening 24 is located on the support portion 21 of the bracket 2. External light can reach the side of the photosensitive unit 4 located in the accommodating space 3 facing away from the substrate 1 through the first opening 24. The light sensing unit 4 may be located right below the first opening 24, so that reflected light in a larger range right in front can be ensured to reach the light sensing unit 4 after passing through the first opening 24 towards the optical sensor package.
As shown in fig. 1, in order to realize the convergence of the reflected light of the object, the lens 5 is disposed at the first opening 24, and the reflected light of the object is converged to reach the light sensing unit 4 while passing through the first opening 24. The lens 5 is connected with the bracket 2, thereby realizing the fixation of the lens 5. At least one surface of the lens 5 has a coating film, and the coating film may be located on a surface of the lens 5 facing the photosensitive unit 4 or on a surface of the lens 5 facing away from the photosensitive unit 4. The coating film is used for filtering incident light passing through the lens 5 so as to allow only optical signals with specified wavelengths to pass through, and filtering and removing optical signals with other wavelengths. In one embodiment, the coating is applied such that the transmittance of the incident light in a specific wavelength range is greater than a threshold (e.g. 95%), and the wavelength of the light emitted by the light source emitting unit 9 is in the specific wavelength range, as will be described in detail later.
Through the mode, the lens 5 and the photosensitive unit 4 are arranged in a separated mode and are not directly connected together, when the optical sensor packaging structure is processed and manufactured, the lens 5 can be manufactured through transparent resin injection molding, then the lens 5 is independently subjected to film coating processing, and the processed lens is connected to the support 2. Therefore, the process flow in the optical sensor packaging process can be effectively simplified, the back-and-forth transportation of the light sensing unit 4 between a coating factory and a packaging factory in the processing process is avoided, and the packaging cost is reduced. That is, if the photosensitive unit 4 is directly coated, the die with the photosensitive unit 4 must be transported together from the packaging factory to the coating factory during coating, then a complicated process is performed to coat the surface of the die with the photosensitive unit 4, and after coating is completed, the coating factory is transported back to the packaging factory to realize the next packaging process, which requires transportation to and fro in a dust-free environment and a complicated process of coating the die with the photosensitive unit 4 (coating the surface of the die requires an additional hard mask (hard mask) to avoid the connection portion 7 and the bonding wire 6 shown in fig. 2) and greatly increases the cost.
As shown in fig. 1 and 3, the side of the lens 5 facing away from the photosensitive unit 4 and the side of the bracket 2 facing the photosensitive unit 4 are adhered by the adhesive 11, so that the fixed connection between the two can be realized conveniently and quickly. In addition, the lens 5 can be protected by the above method, and the lens 5 can be prevented from falling off under the influence of external force. Compared with the lens 5 directly arranged on the photosensitive unit 4, the lens 5 is arranged on the bracket 2 and hermetically connected, so that stray light and impurities can be prevented from entering the interior of the package, and the reliability of the package can be enhanced.
In one possible embodiment, as shown in fig. 1, the side of the lens 5 facing away from the light-sensing unit 4 has a projection 51 to achieve the convergence of the reflected light. The circumferential edge of the lens 5 is adhesively joined to the holder 2 so that the projection 51 is located in the first opening 24. Thus, the distance between the lower end surface of the lens 5 and the photosensitive unit 4 can be effectively reduced, so that the thickness of the whole optical sensor packaging structure in the vertical direction is thinner, and the volume of the optical sensor packaging structure is smaller.
In the above embodiment, the coating film may be located on the surface of the lens 5 facing the photosensitive unit 4, which is planar, so that a stable and uniform coating film can be formed on the lens 5.
Further, as shown in fig. 1, the highest position of the projection 51 is lower than the upper end surface of the holder 2. That is, the uppermost end of the projection 51 needs to be lower than the upper end surface of the holder 2, so that it is possible to prevent the portion of the uppermost end of the projection 51 exceeding the upper end surface of the holder 2 from being damaged or the lens 5 from falling off the holder 2 due to external influences such as collision or friction.
In another possible embodiment, as shown in fig. 3, the face of the lens 5 facing the light-sensing unit 4 has a recess 52. In a similar way, the distance between the lower end face of the lens 5 and the photosensitive unit 4 can be effectively reduced in this way, so that the thickness of the whole optical sensor packaging structure in the vertical direction is thinner, and the volume of the optical sensor packaging structure is smaller.
In this embodiment, the coating is located on the side of the lens 5 away from the photosensitive unit 4, which is planar, so that a stable and uniform coating can be formed on the lens 5.
As shown in fig. 1 and 3, the bracket 2 may have a partition 23 thereon, and the partition 23 may be connected to the support portion 21, and the partition 23 may extend toward the substrate 1. The partition 23 partitions the accommodating space 3 into a first accommodating space 31 and a second accommodating space 32 which are independent of each other, and the photosensitive region of the photosensitive unit 4 is located in the first accommodating space 31. The partition 23 may extend to the photosensitive unit 4 and be bonded to the photosensitive unit 4 with the adhesive 11.
As shown in fig. 1 and 3, the light source emitting unit 9 of the optical sensor package structure is disposed on the substrate 1. The light source emitting unit 9 and the substrate 1 can be electrically connected through the bonding wires 6. As a practical matter, the light source emitting unit 9 and the substrate 1 are fixed by attaching the conductive silver paste 8.
The light source emitting unit 9 is located in the second accommodation space 32. The bracket 2 is provided with a second opening 25 at a position corresponding to the light source emitting unit 9. The second opening 25 may be located right above the light source emitting unit 9, so as to ensure that most of the light signal with the specified wavelength emitted from the light source emitting unit 9 is emitted to the object through the second opening 25. Since the first accommodating space 31 and the second accommodating space 32 are isolated by the partition 23, the optical signal with the specified wavelength emitted from the light source emitting unit 9 cannot directly reach the photosensitive unit 4 from the inside of the bracket 2, thereby avoiding the influence of such optical signal on the photosensitive unit 4.
The light source emitting unit 9 can be used for emitting optical signals with specified wavelengths to the target object, and the light sensing area of the light sensing unit 4 can be used for sensing the optical signals returned by the object. The light source may be a vertical-cavity surface-emitting laser (VCSEL) or a light-emitting diode (LED). The light sensing unit 4 can be a Single Photon Avalanche Diode (SPAD) to convert the reflected optical signal into an electrical signal.
The optical signal with the specified wavelength can be an invisible optical signal, and the invisible optical signal is not easy to observe by eyes of a user, so that the user experience is improved. Of course, in some occasions where the requirements are not high, the visible light signal may also be used as the light source, which is not specifically limited in the embodiment of the present application.
Preferably, the optical signal of the specified wavelength may be an infrared optical signal. When the optical signal of the specified wavelength emitted by the light source emitting unit 9 is an infrared optical signal, the filtering range of the coating film on the lens 5 corresponds to the infrared optical signal, so as to ensure that only the infrared optical signal returned by the object can reach the photosensitive area of the photosensitive unit 4 through the lens 5. In one embodiment, the filtering range of the coating is such that the coating causes the transmittance of incident light in a specific wavelength range to be greater than a threshold (e.g., 95%). The wavelength of light emitted by the light source emitting unit 9 is within the specific wavelength range.
Alternatively, if silicon (Si) is used as the photosensitive responsive material on the photosensitive unit 4 and the wavelength of the optical signal of the specified wavelength emitted by the light source emitting unit 9 is less than 1000nm, for example, about 940nm, the filtering range of the coating film on the lens 5 may be set to 930nm to 950nm transmittance greater than the threshold value. If germanium (Ge) is used as a response material for sensitization on the light sensing unit 4 and the wavelength of the optical signal of the specified wavelength emitted by the light source emitting unit 9 is about 1310nm, the filtering range of the plated film on the lens 5 can be set such that the transmittance of 1300nm to 1320nm is greater than a threshold value. If indium gallium arsenide phosphide (InGaAs) is used as a response material for sensitization on the light sensing unit 4 and the wavelength of the optical signal of the specified wavelength emitted by the light source emitting unit 9 is about 1550nm, the filtering range of the plating film on the lens 5 can be set such that the transmittance from 1540nm to 1560nm is greater than the threshold value.
As shown in fig. 1 and 3, in order to protect the light source emitting unit 9 in the second accommodating space 32 and ensure that the optical signal with the specified wavelength emitted by the light source emitting unit 9 can be emitted from the second opening 25, the second accommodating space 32 is filled with a transparent glue 10. The second receiving space 32 can be filled with the transparent glue 10, so that the light source emitting unit 9 is wrapped therein, and thus the light source emitting unit 9 can be protected, and the light source emitting unit 9 cannot be damaged or fall down. In addition, as the second accommodating space 32 is filled with the transparent glue 10, dust, impurities or other substances and the like cannot enter the second accommodating space 32 and are accumulated in the second accommodating space 32, so that the interference or shielding of the optical signal with the specified wavelength emitted by the light source emitting unit 9 is effectively avoided.
All articles and references disclosed, including patent applications and publications, are hereby incorporated by reference for all purposes. The term "consisting essentially of …" describing a combination shall include the identified element, ingredient, component or step as well as other elements, ingredients, components or steps that do not materially affect the basic novel characteristics of the combination. The use of the terms "comprising" or "including" to describe combinations of elements, components, or steps herein also contemplates embodiments that consist essentially of such elements, components, or steps. By using the term "may" herein, it is intended to indicate that any of the described attributes that "may" include are optional. A plurality of elements, components, parts or steps can be provided by a single integrated element, component, part or step. Alternatively, a single integrated element, component, part or step may be divided into separate plural elements, components, parts or steps. The disclosure of "a" or "an" to describe an element, ingredient, component or step is not intended to foreclose other elements, ingredients, components or steps.
The above embodiments are only a few embodiments of the present invention, and the embodiments of the present invention are described above, but the present invention is only used for the understanding of the present invention, and is not limited to the embodiments. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the utility model as defined by the appended claims.
Claims (10)
1. An optical sensor package having a light source emitting unit and a light sensing unit, the optical sensor package having the light source emitting unit and the light sensing unit includes:
a substrate;
a bracket disposed on the substrate, an accommodating space being formed between the bracket and the substrate;
the photosensitive unit is arranged on the substrate and is positioned in the accommodating space, and the bracket is provided with a first opening corresponding to the position of the photosensitive unit;
a light source emission unit disposed on the substrate;
the lens is arranged at the first opening and connected with the support, and at least one surface of the lens is provided with a coating film.
2. The optical sensor package structure with a light source emitting unit and a light sensing unit as claimed in claim 1, wherein a side of the lens facing away from the light sensing unit is adhesively connected to a side of the bracket facing the light sensing unit.
3. The optical sensor package structure with a light source emitting unit and a light sensing unit as claimed in claim 1, wherein a surface of the lens facing away from the light sensing unit has a protrusion, and the coating is disposed on a surface of the lens facing the light sensing unit.
4. The optical sensor package structure with a light source emitting unit and a light sensing unit according to claim 1, wherein a surface of the lens facing away from the light sensing unit has a protrusion, the protrusion is located in the first opening, and a highest position of the protrusion is lower than an upper end surface of the bracket.
5. The optical sensor package with a light source emitting unit and a light sensing unit as claimed in claim 1, wherein a surface of the lens facing the light sensing unit has a recess, and the coating is disposed on a surface of the lens facing away from the light sensing unit.
6. The optical sensor package structure with a light source emitting unit and a light sensing unit according to claim 1, wherein the lens is injection-molded by a transparent resin.
7. The optical sensor package structure with a light source emitting unit and a light sensing unit according to claim 1, wherein the coating film is formed such that a transmittance of incident light in a specific wavelength range within which the light source emitting unit emits light is greater than a threshold value.
8. The optical sensor package structure with a light source emitting unit and a light sensing unit according to claim 1, wherein the bracket has a partition portion thereon, the partition portion partitions the accommodating space into a first accommodating space and a second accommodating space which are independent of each other, and a light sensing region of the light sensing unit is located in the first accommodating space;
the light source emission unit is positioned in the second accommodating space;
and a second opening is formed in the position, corresponding to the light source emission unit, on the bracket.
9. The optical sensor package structure with a light source emitting unit and a light sensing unit as claimed in claim 8, wherein the second receiving space is filled with a transparent glue.
10. The optical sensor package structure with a light source emitting unit and a light sensing unit according to claim 8, wherein the bracket and the substrate are bonded together by a black glue; the photosensitive unit and the substrate are bonded together through an adhesive; the light source emission unit is attached to the substrate through conductive silver paste.
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| CN202122220478.3U CN215771140U (en) | 2021-09-14 | 2021-09-14 | Optical sensor packaging structure with light source emission unit and photosensitive unit |
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| CN202122220478.3U CN215771140U (en) | 2021-09-14 | 2021-09-14 | Optical sensor packaging structure with light source emission unit and photosensitive unit |
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| CN215771140U true CN215771140U (en) | 2022-02-08 |
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