CN215911426U - Optical sensor packaging structure with light source emission unit and photosensitive unit - Google Patents

Abstract

The utility model discloses a packaging structure of an optical sensor with a light source emission unit and a light sensing unit, which relates to the technical field of semiconductors and comprises the following components: a substrate; the photosensitive unit is arranged on the substrate and is electrically connected with the substrate; a light source emitting unit disposed on the substrate, the light source emitting unit being electrically connected to the substrate; the light source emitting unit, the photosensitive unit and the support are arranged on the same plane of the substrate, the support is provided with a first opening and a second opening, the position of the first opening corresponds to the photosensitive area of the photosensitive unit, and the position of the second opening corresponds to the light source emitting unit; and a filter member or a filter layer disposed on an upper surface of the photosensitive region of the photosensitive unit. The problem that the thickness of the packaging structure of the optical sensor with the light source emitting unit and the light sensing unit is large can be solved.

Description

Optical sensor packaging structure with light source emission unit and photosensitive unit

Technical Field

The present invention relates to the field of semiconductor technologies, and in particular, to a package structure of an optical sensor having a light source emitting unit and a light sensing unit.

Background

The Optical Sensor having the light source emitting unit and the light sensing unit is various in types, and includes a Time of flight (TOF) Sensor, an Optical Tracking Sensor (OTS), and the like, the light source emitting unit emits emitting light with a specific wavelength, and the light is reflected by a target object, and the light sensing unit receives incident light reflected by the target object, so as to achieve distance measurement, Optical Tracking, and the like. For example, Optical Tracking Sensors (OTS) have been widely used in sensing fields such as printing, digital knob Tracking, smart device control, and robot navigation to help improve output results by utilizing their powerful surface detection functions.

In the conventional package structure of the optical tracking sensor, in order to filter incident light, so that the photosensitive unit only receives the optical signal with the specified wavelength emitted by the light source emitting unit, a filter glass is connected and arranged on the support, and the lens is located at a position corresponding to the photosensitive unit, so that only the optical signal with the specified wavelength can pass through when the light incident to the photosensitive unit passes through the filter glass, and other parts are absorbed. Since in this configuration the filter glass connection is provided on the support, it results in a large thickness of the encapsulation structure of the entire optical tracking sensor. At present, optical tracking sensor is used in some intelligence wearing equipment in a large number, for example sets up on the crown of intelligent wrist-watch, and when wearing equipment is rotatory, thereby the light signal that the light source emission unit transmission hit the light signal that the rotation axis reflection is back is received by sensitization unit and is imaged, compares the roughness of rotation axis and the sensing of angle of pattern realization around the rotation, realizes functions such as the picture switching of wearing equipment. The optical tracking sensor in such application scenarios still needs to be reduced in size to meet the market demand for further miniaturization.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above-mentioned defects in the prior art, embodiments of the present invention provide a package structure of an optical sensor having a light source emitting unit and a light sensing unit, which can solve the problem of a large thickness of the package structure of the optical sensor having the light source emitting unit and the light sensing unit.

The specific technical scheme of the embodiment of the utility model is as follows:

a package structure of an optical sensor provided with a light source emitting unit and a light sensing unit, the package structure of the optical sensor comprising: a substrate; the photosensitive unit is arranged on the substrate and is electrically connected with the substrate; a light source emitting unit disposed on the substrate, the light source emitting unit being electrically connected to the substrate; the light source emitting unit, the photosensitive unit and the support are arranged on the same plane of the substrate, the support is provided with a first opening and a second opening, the position of the first opening corresponds to the photosensitive area of the photosensitive unit, and the position of the second opening corresponds to the light source emitting unit; and a filter member or a filter layer disposed on an upper surface of the photosensitive region of the photosensitive unit.

Preferably, the filter is fixed to the photosensitive region of the photosensitive unit by a transparent first adhesive material.

Preferably, the filter is made of glass, the filter being located in the first opening.

Preferably, an end surface of the filter facing away from the photosensitive unit is lower than or equal to an end surface of the support facing away from the substrate.

Preferably, at least one surface of the light filtering piece is provided with a coating film for filtering light.

Preferably, the filter or the filter layer makes transmittance of incident light in a preset wavelength range larger than a threshold, and the wavelength of light emitted by the light source emitting unit is within the preset wavelength range.

Preferably, the filter layer is processed on the photosensitive area of the photosensitive unit by sputtering or evaporation.

Preferably, the photosensitive unit and the substrate are electrically connected through a plurality of conductive connectors, and an opaque isolating material is coated on the region where the conductive connectors are located.

Preferably, the support member includes a support portion, a side wall portion, and a partition portion, the support portion, the side wall portion and the substrate forming an accommodation space, the partition portion partitioning the accommodation space into a first accommodation space and a second accommodation space, the photosensitive unit being located in the first accommodation space, the light source emission unit being located in the second accommodation space; a transparent second adhesive material is disposed in the second receiving space, and the second adhesive material coats the light source emission unit.

Preferably, the second adhesive material is disposed in the second accommodating space by means of glue spraying or glue pouring.

The technical scheme of the utility model has the following remarkable beneficial effects:

the packaging structure who possesses light source emission unit and the optical sensor of sensitization unit in this application directly is in with filter piece or filter layer setting on the sensitization region of sensitization unit, so can make the clearance between the sensitization region of filter piece or filter layer and sensitization unit reduce to the minimum, thereby can make support piece orientation clearance between the inner wall of basement and the basement further reduces, and then makes the packaging structure thickness of the optical sensor who possesses light source emission unit and sensitization unit reduce, and the volume is reduced to make optical sensor satisfy further miniaturized market demand.

Specific embodiments of the present invention are disclosed in detail with reference to the following description and drawings, indicating the manner in which the principles of the utility model may be employed. It should be understood that the embodiments of the utility model are not so limited in scope. Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments, in combination with or instead of the features of the other embodiments.

Drawings

The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way. In addition, the shapes, the proportional sizes, and the like of the respective members in the drawings are merely schematic for facilitating the understanding of the present invention, and do not specifically limit the shapes, the proportional sizes, and the like of the respective members of the present invention. Those skilled in the art, having the benefit of the teachings of this invention, may choose from the various possible shapes and proportional sizes to implement the utility model as a matter of case.

FIG. 1 is a top view of a package structure of an optical sensor having a light source emitting unit and a light sensing unit according to an embodiment of the present invention;

FIG. 2 is a cross-sectional view of a package structure of an optical sensor having a light source emitting unit and a light sensing unit according to an embodiment of the present invention;

fig. 3 is a top view of the optical sensor package with the light source emitting unit and the light sensing unit removed from the support according to the embodiment of the utility model.

Reference numerals of the above figures:

1. a substrate; 2. a light sensing unit; 21. a light-sensitive region; 3. a light source emitting unit; 4. a support member; 41. A support portion; 42. a sidewall portion; 43. a partition portion; 44. a first opening; 45. a second opening; 5. a light filtering member; 6. a first adhesive material; 7. an isolation material; 8. a second binder material; 9. a conductive connector; 91. a conductive wire; 92. a pad; 10. an accommodating space; 101. a first accommodating space; 102. a second accommodating space.

Detailed Description

The details of the present invention can be more clearly understood in conjunction with the accompanying drawings and the description of the embodiments of the present invention. However, the specific embodiments of the present invention described herein are for the purpose of illustration only and are not to be construed as limiting the utility model in any way. Any possible variations based on the present invention may be conceived by the skilled person in the light of the teachings of the present invention, and these should be considered to fall within the scope of the present invention. It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "mounted," "connected," and "connected" are to be construed broadly and may include, for example, mechanical or electrical connections, communications between two elements, direct connections, indirect connections through intermediaries, and the like. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In order to solve the problem of the large thickness of the package structure of the optical sensor having the light source emitting unit and the light receiving unit, especially the optical tracking sensor, the present application proposes a package structure of the optical sensor having the light source emitting unit and the light receiving unit, and it should be noted that the description is given by taking the optical tracking sensor as an example, but the package structure proposed herein can be applied to other optical sensors having the light source emitting unit and the light receiving unit as well, so as to reduce the thickness (Z direction) of the package structure. Fig. 1 is a top view of a package structure of an optical sensor having a light source emitting unit and a light sensing unit according to an embodiment of the present invention, and fig. 2 is a cross-sectional view of the package structure of the optical sensor having the light source emitting unit and the light sensing unit according to the embodiment of the present invention, and as shown in fig. 1 and fig. 2, the package structure of the optical sensor having the light source emitting unit and the light sensing unit may include: a substrate 1; a photosensitive unit 2 disposed on the substrate 1, the photosensitive unit 2 being electrically connected to the substrate 1; a light source emitting unit 3 disposed on the substrate 1, the light source emitting unit 3 being electrically connected to the substrate 1; a support 4 disposed on the substrate 1, the light source emission unit 3, the photosensitive unit 2 and the support 4 being located on the same plane of the substrate 1, the support 4 having a first opening 44 and a second opening 45, the first opening 44 corresponding to the photosensitive region 21 of the photosensitive unit 2, the second opening 45 corresponding to the light source emission unit 3; a filter 5 or a filter layer provided on the upper surface of the photosensitive region 21 of the photosensitive unit 2.

The packaging structure of the optical sensor who possesses light source emission unit and sensitization unit in this application directly sets up filter 5 or filter layer on sensitization regional 21 of sensitization unit 2, so can make the clearance between filter 5 or filter layer and sensitization regional 21 of sensitization unit 2 reduce to minimum, thereby can make support piece 4 further reduce towards the clearance between the inner wall of basement 1 and basement 1, and then make optical sensor's packaging structure thickness reduce, the volume is reduced, so that optical sensor satisfies further miniaturized market demand.

In order to better understand the package structure of the optical sensor having the light source emitting unit and the light sensing unit in the present application, the following further explains and explains the package structure. As shown in fig. 1 and 2, the optical sensor including the light source emitting unit and the light receiving unit may include: a substrate 1; a light sensing unit 2, a light source emitting unit 3, a support 4, a filter 5 or a filter layer disposed on a light sensing area 21 of the light sensing unit 2.

As shown in fig. 2, the substrate 1 may extend in a horizontal direction, which is used to fixedly dispose the support 4, the photosensitive unit 2, the light source emitting unit 3, and the like. The substrate 1 may be a Printed Circuit Board (PCB) substrate, which serves as a support for electronic components, thereby implementing a carrier for electrical interconnection of the electronic components. The substrate may be a Ball Grid Array (Ball Grid Array) substrate, a lead frame (lead frame), a copper foil substrate, a resin substrate, or other types of substrates. The specific type of substrate can be selected according to the specification of the pins of the light source emitting unit 3 and the light sensing unit 2 arranged on the substrate.

As shown in fig. 2, the light sensing unit 2 is disposed on the substrate 1, and the light source emitting unit 3 is electrically connected to the substrate 1. The light sensing unit 2 may be a sensor die, and the light sensing unit 2 is fixed to the upper surface of the substrate 1 by an adhesive material. The adhesive material may be any material configured to hold the photosensitive unit 2 in place during the assembly process. For example, the adhesive material may be a tape, a paste, a glue, or any other suitable material. In one or more embodiments, the adhesive material may be a die attach film.

The sensor die may be made of a semiconductor material, such as silicon. The sensor die includes an active surface that includes one or more electrical components (e.g., an integrated circuit). The integrated circuit may be an analog or digital circuit implemented as active devices, passive devices, conductive layers, and dielectric layers formed within the die and electrically interconnected according to the electrical design and function of the die. The sensor die includes circuitry for transmitting, receiving and analyzing electrical signals. In the embodiment shown, the active surface is located at an upper portion of the sensor die. The light sensing unit 2 is electrically connected to the substrate 1 by a plurality of conductive connectors 9, for example, the conductive connectors 9 may include conductive wires and pads coupling the light sensing unit 2 to pads on the upper surface of the substrate 1.

As shown in fig. 2, the light source emission unit 3 is disposed on the substrate 1, and the light source emission unit 3 is fixed on the upper surface of the substrate 1. The light source emitting unit 3 may be fixed to the upper surface of the substrate 1 by an adhesive material. The adhesive material may be a conductive Film or a conductive paste suitable for fixing the light source emitting unit 3 to the upper surface of the substrate 1, such as a conductive silver paste, a Die Attach Film (DAF), or any other suitable material.

As shown in fig. 2, a support 4 is provided on the substrate 1, and the support 4 is fixedly coupled with a contact portion of the substrate 1. Further, the contact portions between the support 4 and the substrate 1 may be bonded together by a light-impermeable adhesive material, preventing ambient light from entering the package interior. The adhesive material may be black glue, but it is not limited to this. An accommodation space 10 is formed between the support 4 and the substrate 1. The light source emitting unit 3, the photosensitive unit 2, and the support 4 are located on the same plane of the substrate 1, and the light source emitting unit 3 and the photosensitive unit 2 are all disposed in the accommodating space 10. The support 4 may include a support portion 41 and a side wall portion 42, the side wall portion 42 being located at a periphery of the support portion 41, the side wall portion 42 being in contact with the substrate 1 toward a lower end of the substrate 1, and bonded thereto by an opaque adhesive material. The support portion 41 extends in a horizontal direction with a gap from the substrate 1, so that the receiving space 10 is formed between the support portion 41, the side wall portion 42, and the substrate 1.

The material of the supporting member 4 is not limited in this application, and can be made of any opaque material capable of blocking light, for example, a black opaque upper cover made of resin, nylon, plastic, metal, Liquid crystal polymer (Liquid crystal polymer), or other opaque material, preferably a high temperature resistant material, and is not limited in this application.

As shown in fig. 2, the support 4 has a first opening 44 and a second opening 45, the first opening 44 corresponding to the light sensing region 21 of the light sensing unit 2, and the second opening 45 corresponding to the light source emission unit 3. For example, the first opening 44 may be located directly above the photosensitive region 21 of the photosensitive unit 2. The specific shape of the first opening 44 may correspond to the shape of the light sensing region 21 of the light sensing unit 2.

Fig. 3 is a top view of the optical sensor package structure with the light source emitting unit and the light sensing unit of the embodiment of the utility model after removing the support, as shown in fig. 3, the light sensing area 21 is located on the upper surface of the light sensing unit 2. The light source emitting unit 3 can be used for emitting optical signals with specified wavelengths to the object, and the light sensing area 21 of the light sensing unit 2 can be used for sensing the optical signals returned by the object. The light source emitting unit 3 may be a vertical-cavity surface-emitting laser (VCSEL), a Light Emitting Diode (LED), or the like.

The optical signal with the specified wavelength can be an invisible optical signal, and the invisible optical signal is not easy to observe by eyes of a user, so that the user experience is improved. Of course, in some occasions where the requirements are not high, the visible light signal may also be used as the light source, which is not specifically limited in the embodiment of the present application.

As shown in fig. 2, the second opening 45 may be located right above the light source emitting unit 3, so as to ensure that most of the light signal with the specified wavelength emitted by the light source emitting unit 3 is emitted to the object through the second opening 45.

As shown in fig. 2, it is possible to provide the support 4 with a partition 43, and the partition 43 may be connected to the support 41, and the partition 43 extends toward the substrate 1. The partition portion 43 partitions the accommodating space 10 into a first accommodating space 101 and a second accommodating space 102 which are independent of each other. The photosensitive region 21 of the photosensitive unit 2 is located in the first accommodation space 101. The light source emitting unit 3 is located in the second accommodation space 102. Since the first accommodating space 101 and the second accommodating space 102 are isolated by the partition 43, the optical signal with the specified wavelength emitted from the light source emitting unit 3 cannot directly reach the photosensitive unit 2 from the inside of the bracket, thereby avoiding the influence of such optical signal on the photosensitive unit 2.

As shown in fig. 2, the filter 5 or the filter layer is disposed on the photosensitive region 21 of the photosensitive unit 2 so as to filter the light entering the sub-first opening 44, so that the transmittance of the incident light in a specific wavelength range is greater than a threshold (e.g., 95%), the wavelength of the emitted light of the light source emission unit 3 is within the specific wavelength range, that is, only the narrow-band (small-range) light near the optical signal of the specified wavelength emitted by the light source emission unit 3 is allowed to pass through, and the optical signals of other wavelengths are filtered and removed. For example, the wavelength of the optical signal of the specified wavelength emitted by the light source emitting unit 3 is about 850nm, the filter range of the filter 5 or the filter layer may be set such that the transmittance of 840nm to 860nm is greater than a threshold value (e.g., 95%). Through the mode, the gap between the light filtering piece 5 or the light filtering layer and the light sensing area 21 of the light sensing unit 2 can be reduced to the minimum, so that the gap between the inner wall of the support piece 4 facing the substrate 1 and the substrate 1 can be further reduced, the thickness of the packaging structure of the tracking sensor is further reduced, and the size of the packaging structure is reduced, so that the tracking sensor meets the market demand of further miniaturization.

In order to fix the filter 5 directly on the photosensitive region 21 of the photosensitive unit 2, the filter 5 is fixed to the photosensitive region 21 of the photosensitive unit 2 by the transparent first adhesive material 6. The purpose of the first adhesive material being a transparent adhesive material is to allow incident light reflected back by the object to reach the photosensitive area 21 of the photosensitive unit 2 through the first adhesive material 6.

As shown in fig. 2, the filter 5 may be made of glass, the filter 5 being located in the first opening 44. In the above manner, while the strength of the filter 5 is secured, by locating the filter 5 in the first opening 44 to prevent the support 4 from interfering with the filter 5 in the vertical direction, it is possible to further reduce the gap between the inner wall of the support 4 facing the substrate 1 and the substrate 1.

In order to avoid damage to the upper surface of the filter 5 by external forces during use, it is possible that, as shown in fig. 2, the end surface of the filter 5 facing away from the photosensitive unit 2 may be lower than or equal to the end surface of the support 4 facing away from the substrate 1.

The filter 5 may be provided with a coating film on at least one surface of the filter 5, so as to pass the optical signal with a narrow band around the specified wavelength emitted by the light source emitting unit 3. The coating film may be provided on either the upper surface or the lower surface of the filter 5.

In another possible embodiment, when the filter layer is disposed on the upper surface of the photosensitive region 21 of the photosensitive unit 2, the filter layer is sputtered or evaporated by using wafer level optical device wlo (wafer level optical) technology in the photosensitive region 21 of the photosensitive unit 2. This embodiment is implemented by processing a filter layer on the die or die (die) of the photo-sensing unit 2, which can be fabricated on the wafer (wafer) before the wafer is cut into dies (die) by the fab, and then cut, and the filter layer is directly on the die taken by the fab, thereby simplifying the assembly process of the fab, which requires a hard mask (hard mask) on the die (die) of the photo-sensing unit 2 to avoid the conductive connectors 9 and pads on the photo-sensing unit 2, which is relatively expensive.

As shown in fig. 3, the conductive connector 9 may include a conductive wire 91 and a pad 92 thereof, which enable the electrical connection between the photosensitive unit 2 and the substrate 1, and the embodiment shown in fig. 3 is coated with an opaque isolating material 7 in the area where the conductive connector 9 is located, and the opaque isolating material 7 may enable the isolation between the conductive connector 9 and the air, so as to protect the exposed conductive connector 9. The isolation material 7 may be any opaque material that can isolate air and is insulating, and is not limited in any way in this application. Furthermore, the isolating material 7 can be selected from black glue, and is convenient to obtain, and is often used for realizing adhesion between different parts in a packaging structure without additional purchase.

As shown in fig. 2 and 3, a transparent second adhesive material 8 may be disposed in the second receiving space 102, and the light source emission unit 3 may be coated with the second adhesive material 8. Preferably, the second adhesive material 8 may fill the second receiving space 102, and may also fill the second receiving space 102 and the second opening 45.

The light source emitting unit 3 in the second accommodating space 102 can be protected in the above manner, the light source emitting unit 3 is not damaged or dropped, and the optical signal with the specified wavelength emitted by the light source emitting unit 3 can be emitted from the second opening 45. In addition, since the second accommodating space 102 is filled with the transparent second adhesive material 8, dust, impurities, other substances, and the like cannot enter the second accommodating space 102 and are accumulated in the second accommodating space 102, so that interference or shielding of the optical signal with the specified wavelength emitted by the light source emitting unit 3 is effectively avoided. The second adhesive material 8 achieves the above object while reducing the package height of the optical sensor, compared to the prior art in which glass is attached to the light source emission unit 3.

If the light source emitting unit 3 is electrically connected to the substrate 1 through a conductive connector (not shown), the transparent second adhesive material 8 can also isolate the conductive connector from air, so as to protect the exposed conductive connector 9.

As a possibility, the second adhesive material 8 may be disposed in the second receiving space 102 by spraying or pouring, and then cured, and the curing achieves protection of the light source emitting unit 3. The glue filling mode is cured by baking, pits are formed on the surface after curing, light paths can be diffused, and the degree of depression of the surface of the glue is controlled according to the performance of a chip and an optical principle in the manufacturing process. The second adhesive material 8 is not limited in this application and may be, for example, an epoxy, a transparent glue, or the like.

The package structure of the optical tracking sensor in the present application may be comprised in different electronic devices and may for example be coupled to a microprocessor, a power supply, a memory or other such electronic components. Electronic devices include the packaging structures of the optical tracking sensors described herein, and may also include, for example, cellular phones, smart phones, tablet computers, cameras, and/or wearable computing devices that may be located in clothing, shoes, watches, glasses, or any other wearable structure. In certain embodiments, such electronics or the packaging structure of the optical tracking sensor described herein may be located in vehicles such as boats and cars, robots, or any other movable structure or machine.

All articles and references disclosed, including patent applications and publications, are hereby incorporated by reference for all purposes. The term "consisting essentially of …" describing a combination shall include the identified element, ingredient, component or step as well as other elements, ingredients, components or steps that do not materially affect the basic novel characteristics of the combination. The use of the terms "comprising" or "including" to describe combinations of elements, components, or steps herein also contemplates embodiments that consist essentially of such elements, components, or steps. By using the term "may" herein, it is intended to indicate that any of the described attributes that "may" include are optional. A plurality of elements, components, parts or steps can be provided by a single integrated element, component, part or step. Alternatively, a single integrated element, component, part or step may be divided into separate plural elements, components, parts or steps. The disclosure of "a" or "an" to describe an element, ingredient, component or step is not intended to foreclose other elements, ingredients, components or steps.

The above embodiments are only a few embodiments of the present invention, and the embodiments of the present invention are described above, but the present invention is only used for the understanding of the present invention, and is not limited to the embodiments. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the utility model as defined by the appended claims.

Claims (10)

1. A package structure of an optical sensor having a light source emitting unit and a light receiving unit, the package structure of the optical sensor comprising:

a substrate;

the photosensitive unit is arranged on the substrate and is electrically connected with the substrate;

a light source emitting unit disposed on the substrate, the light source emitting unit being electrically connected to the substrate;

the light source emitting unit, the photosensitive unit and the support are arranged on the same plane of the substrate, the support is provided with a first opening and a second opening, the position of the first opening corresponds to the photosensitive area of the photosensitive unit, and the position of the second opening corresponds to the light source emitting unit; and

and the filter piece or the filter layer is arranged on the upper surface of the light sensing area of the light sensing unit.

2. The package structure of claim 1, wherein the filter is fixed to the photosensitive region of the photosensitive unit by a transparent first adhesive material.

3. The package structure of an optical sensor having a light source emitting unit and a light sensing unit according to claim 1, wherein the filter is made of glass, and the filter is located in the first opening.

4. The package structure of an optical sensor having a light source emitting unit and a light sensing unit according to claim 3, wherein an end surface of the filter facing away from the light sensing unit is lower than or equal to an end surface of the support facing away from the substrate.

5. The package structure of claim 3, wherein at least one of the surfaces of the filter has a coating for filtering light.

6. The package structure of claim 1, wherein the filter or the filter layer is configured to allow a transmittance of incident light in a predetermined wavelength range to be greater than a threshold, and the light emitting unit emits light in the predetermined wavelength range.

7. The package structure of an optical sensor having a light source emitting unit and a light receiving unit as claimed in claim 1, wherein the filter layer is formed on the light receiving area of the light receiving unit by sputtering or evaporation.

8. The package structure of claim 1, wherein the light sensing unit is electrically connected to the substrate via a plurality of conductive connectors, and the area of the conductive connectors is coated with an opaque isolating material.

9. The package structure of an optical sensor having a light source emitting unit and a light sensing unit according to claim 1, wherein the support includes a support portion, a side wall portion, and a partition portion, the support portion, the side wall portion and the substrate form an accommodating space, the partition portion partitions the accommodating space into a first accommodating space and a second accommodating space, the light sensing unit is located in the first accommodating space, and the light source emitting unit is located in the second accommodating space; a transparent second adhesive material is disposed in the second receiving space, and the second adhesive material coats the light source emission unit.

10. The package structure of an optical sensor having a light source emitting unit and a light sensing unit according to claim 9, wherein the second adhesive material is disposed in the second receiving space by spraying or pouring.

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