CN212969789U

CN212969789U - Lens assembly, camera module and electronic equipment

Info

Publication number: CN212969789U
Application number: CN202020751125.9U
Authority: CN
Inventors: 吴华丽; 胡伟鹏
Original assignee: Jiangxi Jingrun Optics Co ltd
Current assignee: Guangzhou Delta Imaging Technology Co Ltd
Priority date: 2020-05-08
Filing date: 2020-05-08
Publication date: 2021-04-13
Anticipated expiration: 2030-05-08

Abstract

The utility model discloses a lens assembly, including a plurality of microlens and microscope base, the microscope base has first accommodation space, and a plurality of microlens is located the first plane of microscope base, and a plurality of microlens is array distribution, and the object side of a plurality of microlens is the convex surface. The utility model also discloses a camera module and including the electronic equipment of this camera module including this camera lens subassembly. The utility model discloses a plurality of microlens side by side can attenuate the thickness of camera lens subassembly.

Description

Lens assembly, camera module and electronic equipment

Technical Field

The utility model relates to a camera technical field especially relates to a camera lens subassembly, camera module and electronic equipment.

Background

The existing lens assembly includes a lens group, a lens barrel, a lens base, etc., the lens group is disposed in the lens barrel, and the lens barrel is disposed on the lens base. The stacked arrangement of the lenses in the lens group makes the size of the lens assembly in the optical axis direction too large to meet the current trend of thinning electronic products, especially the requirement of thinning on newly released 5G mobile phones. Therefore, there is a strong demand for a structure that can reduce the size of the lens assembly in the optical axis direction and is easy to assemble.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a lens subassembly, including the camera module of this lens subassembly and including the electronic equipment of this camera module can reduce lens subassembly, camera module and electronic equipment's thickness by a wide margin.

In a first aspect, a lens assembly is provided, which includes a plurality of microlenses and a lens holder, the lens holder has a first accommodation space, the plurality of microlenses are located in the first accommodation space, and the plurality of microlenses are located on a first plane of the lens holder, the plurality of microlenses are distributed in an array, and an object side surface of the plurality of microlenses is a convex surface.

A plurality of microlens parallel arrangement are on first plane, can avoid a plurality of mirror surface range upon range of the too big problem of lens subassembly thickness on the first plane direction of perpendicular to that leads to, and the light of equidirectional and position can be collected to a plurality of microlenses, the microlens array that a plurality of microlenses formed not only has the basic functions such as focus, formation of image of traditional lens, but also has the characteristics that the unit size is little, the integrated level is high, make it can accomplish the function that traditional optical element can't accomplish, and can constitute many neotype optical system.

In one embodiment, the plurality of microlenses are formed using an integral molding process. The integrally formed micro-lens array can also avoid the superposition error existing when the lenses are arranged in a laminated manner, and the assembly efficiency is improved.

In one embodiment, the lens holder is divided into a transparent area and a non-transparent area, the micro lens is disposed on the transparent area, the transparent area is used for allowing light from the micro lens to pass through, the non-transparent area is located around the transparent area, and the non-transparent area is used for avoiding interference with the light entering. The design can ensure that the light collected by the micro lens is not interfered by other light.

In one embodiment, the microlens and the lens holder are made by an integral molding process. The integral forming process can omit the step of assembling the micro lens and the lens base, simplify the process, improve the efficiency, avoid the joint tolerance of the micro lens and the lens base and improve the yield of the lens assembly.

In one embodiment, the integral molding process is a photolithography process or an injection molding process. The photoetching process can accurately control the shapes and sizes of the micro lens, the lens barrel and the lens base, and improve the precision of the lens assembly; the injection molding process can realize batch production after a set of mold is formed, the cost is relatively low, and the effects of decoration and molding can be simultaneously achieved through the one-time injection molding process.

In an embodiment, the lens assembly further includes a lens barrel disposed in the first accommodating space of the lens holder, and the micro lens is disposed in the lens barrel. The lens barrel may further protect the microlenses, and the provision of the lens barrel is not necessary.

In an embodiment, a convex lens is further disposed on one side of the optical surface of the microlens, and the convex lens is located in the first accommodating space of the lens holder. The convex lens is arranged on the micro lens, so that the light-gathering capacity of the lens assembly can be improved.

In an embodiment, the lens assembly further includes a protective cover, the protective cover is located on an object side of the lens holder, and the protective cover closes the opening of the first accommodating space. The protective cover can protect the micro lens in the first accommodating space, and dust, water vapor and the like are prevented from entering the first accommodating space to influence the imaging precision of the micro lens.

In one embodiment, the lens assembly further includes a filter disposed on the microlens or the protective cover. The filter may be used to reduce or increase color temperature, change wavelength, block unwanted light, change color, etc.

In a second aspect, a camera module is provided, which includes a photosensitive component and the lens component, wherein the photosensitive component is disposed on the image side of the lens component. The photosensitive assembly is used for sensing and processing the light from the micro lens.

In a third aspect, an electronic device is provided, which includes a display module, a main circuit board and the camera module, the camera module and the display module are located on the same side of the electronic device, or located on different sides of the electronic device, and the main circuit board mainly plays a role in transmitting electrical signals. The camera module can be a front camera module or a rear camera module.

Drawings

To more clearly illustrate the structural features and effects of the present invention, the following detailed description is given with reference to the accompanying drawings and specific embodiments.

Fig. 1 is a schematic cross-sectional view of a lens assembly according to an embodiment of the present invention;

fig. 2 is a schematic cross-sectional view of another lens assembly in an embodiment of the present invention;

fig. 3 is a schematic cross-sectional view of another lens assembly in an embodiment of the present invention;

fig. 4 is a schematic cross-sectional view of another lens assembly in an embodiment of the present invention;

fig. 5 is a schematic cross-sectional structure diagram of a camera module according to an embodiment of the present invention;

fig. 6 is a schematic diagram of a connection relationship between a circuit board and an image sensor in the camera module according to the embodiment of the present invention;

fig. 7 is a schematic view of another connection relationship between the circuit board and the image sensor in the camera module according to the embodiment of the present invention;

fig. 8 is a schematic cross-sectional view of another camera module according to an embodiment of the present invention;

fig. 9 is a schematic plan view of an electronic device in an embodiment of the present invention;

fig. 10 is a schematic plan view of another electronic device in an embodiment of the present invention.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only some of the embodiments of the present invention, and not all of them. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall fall within the protection scope of the present invention.

The present embodiment provides a lens assembly, as shown in fig. 1, the lens assembly includes a plurality of microlenses 11 and a lens holder 12, an object-side surface of the lens holder 12 has a first accommodating space 12a, the plurality of microlenses 11 are located in the first accommodating space 12a, the lens holder 12 is divided into a transparent area 121 and a non-transparent area 122, the microlenses 11 are disposed on the transparent area 121, the transparent area 121 is used for allowing light from the microlenses 11 to pass through, the non-transparent area 122 is located around the transparent area 121, and the non-transparent area 122 is used for avoiding the interference of light entering. Specifically, the light-transmitting region 121 is made of a light-transmitting material such as resin, and the non-light-transmitting region 122 may be made of a non-light-transmitting material directly or may be shielded from light by a light-shielding film directly on the surface of the light-transmitting resin.

The microlenses 11 are located in the same plane, the plane where the microlenses 11 are located is a first plane, and the shapes of the microlenses 11 can be circular, square, rectangular, polygonal or free-form surfaces. In other possible embodiments, each microlens 11 has a height of 3um to 5um in a direction perpendicular to the first plane and a maximum width of 10um to 20um in the first plane. A plurality of microlenses 11 are arranged in parallel in the same plane to form a microlens array.

In one embodiment, the plurality of microlenses 11 are formed by an integral molding process. The integrally formed micro-lens array can also avoid the superposition error existing when the lenses are arranged in a laminated manner, and the assembly efficiency is improved.

In one embodiment, the microlens 11 and the lens holder 12 are of a unitary construction, formed by an integral molding process. The efficiency is improved, meanwhile, the joint tolerance of the micro lens 11 and the lens base 12 is reduced, and the product yield is improved. The integral molding process may specifically adopt a photolithography process, wherein a transparent material is first made into a whole piece, then the whole piece of transparent material is irradiated under a specific mold under a high temperature or ultraviolet light condition to form a lens assembly structure with the microlens 11 and the lens holder 12 integrally molded, and after the product is molded, the non-transparent region 122 in the lens holder 12 is shielded.

In other embodiments, the integral molding process may also be an injection molding process, in which a completely melted resin material is stirred by a screw at a certain temperature, and the resin material is injected into a specific mold cavity at a high pressure, and then cooled and solidified to obtain a molded integral structure of the microlens 11 and the lens holder 12. The transparent area 121 and the non-transparent area 122 in the lens holder 12 need to be formed by two different materials, and a two-color injection molding method can be adopted, wherein the two-color injection molding is to inject two different materials into the same set of mold, so that a forming process that an injected part is formed by the two materials is realized.

In one embodiment, as shown in fig. 2, the lens assembly further includes a protective cover 13, the protective cover 13 is located on an object side of the lens base 12, and the protective cover 13 closes an opening of the first accommodating space 12 a. The protective cover 13 is used for protecting the microlens 11 in the first accommodating space 12a, so as to prevent dust, water vapor and the like from entering the first accommodating space 12a and being attached to the surface of the microlens 11, wherein the dust and the water vapor can increase the roughness of the surface of the microlens 11 and corrode the lens, and further influence is caused on the imaging precision of the microlens 11.

In other embodiments, as shown in fig. 3, the lens assembly may further include a lens barrel 14, the lens barrel 14 is disposed in the first accommodating space 12a of the lens base 12, the shape of the lens barrel 14 matches the first accommodating space 12a, and the shape of the lens barrel 14 may be, for example, a hollow cylinder or a rectangular parallelepiped. The lens cone 14 comprises a side wall and a bottom wall, wherein the bottom wall bears the micro lens array and is made of light-transmitting materials, and the bottom wall of the lens cone 14 and the light-transmitting area 121 of the lens base 12 are coaxially arranged. The lens barrel 14 has an opening near the object side for disposing the protective cover 13, and the protective cover 13 seals the first accommodating space 12a of the lens base 12 and the opening of the lens barrel 14 near the object side.

For the lens assembly provided with the lens barrel 14, the micro lens 11 and the lens base 12 are of an integral structure and are manufactured by adopting an integral forming process, in the prior art, the lens barrel 14 and the lens base 12 are usually fixed by glue, however, if the glue is poorly controlled during gluing, a problem that part of glue flows into the lens base 12 is easily caused, and elements such as the micro lens 11 are easily damaged, and the integral forming process can avoid the glue overflow problem when the lens barrel 14 and the lens base 12 are attached. And the integral forming process can reduce the fitting tolerance and improve the yield of products.

In one embodiment, the lens assembly further includes a filter, which may be an infrared cut filter or an ultraviolet cut filter, which may be used to reduce or increase color temperature, change wavelength, filter unwanted light, change color, and the like. The filter may be disposed on the microlens 11 or on the protective cover 13, for example, an ultraviolet cut filter may be disposed on the microlens 11, and an infrared cut filter may be disposed on the protective cover 13; or an infrared cut filter is provided on the microlens 11, and an ultraviolet cut filter is provided on the protective cover 13.

In another embodiment, as shown in fig. 4, a convex lens 15 is further disposed on the object side of the microlens 11, the convex lens 15 is located in the first accommodating space 12a of the lens holder 12 and is disposed between the microlens 11 and the protective cover 13, and a convex surface of the convex lens 15 faces the protective cover 13. Placing the convex lens 15 above the microlens 11 can increase the light gathering power of the lens assembly.

In one embodiment, as shown in fig. 5, a camera module 10 is provided, which includes a photosensitive component and a lens component. The mirror base 12 has a second accommodating space 12b on the image side, i.e. the mirror base 12 is "H" shaped. The second accommodating space 12b of the "H" shaped mirror base 12 can be used for accommodating the photosensitive assembly completely or partially. Compared with the direct stacking arrangement of the lens base 12 and the photosensitive assembly, the H-shaped lens base 12 improves the space utilization rate and reduces the overall thickness of the camera module 10. The photosensitive assembly comprises an image sensor 16 and a circuit board 17, wherein the circuit board 17 is positioned on the image side of the image sensor 16, or the image sensor 16 is positioned on the image side of the circuit board 17.

In the present embodiment, the image sensor 16 may be a Charge Coupled Device (CCD) or a Complementary Metal-Oxide Semiconductor (CMOS). The CCD is made of a semiconductor material having high sensitivity, and converts light into electric charges, which are converted into digital signals by an analog-to-digital converter chip. A CCD consists of many photosites, usually in mega pixels. When the surface of the CCD is irradiated by light, each photosensitive unit reflects charges on the component, and signals generated by all the photosensitive units are added together to form a complete picture; the CMOS is mainly a semiconductor made of two elements, i.e., silicon and germanium, so that N (band-electric) and P (band + electric) semiconductors coexist on the CMOS, and the current generated by the two complementary effects can be recorded and interpreted as an image by a processing chip. The circuit board 17 is connected with an image processing chip for transmitting data obtained from the image sensor 16 to the central processing unit in time and quickly. The circuit board 17 plays a role of electric signal transmission in this process. In one embodiment, the circuit board 17 is connected to the mirror base 12 by gluing or soldering, or both.

In the prior art, the image sensor and the circuit board are usually stacked, and in order to prevent the circuit board from blocking light, the circuit board is usually disposed on the side closer to the image side than the image sensor. The circuit board and the image sensor are connected through a wire or a conductive ball. However, the thickness of the stacked image sensor and the circuit board is large, and the stacked image sensor and the circuit board cannot be adapted to the pursuit of the current user for the ultrathin camera module.

In the present embodiment, as shown in fig. 6, the influence sensor 16 is located on the image side of the circuit board 17, the image sensor 16 and the circuit board 17 are disposed by a flip-chip process, and the circuit board 17 is provided with a stepped through-hole. The circuit board 17 is provided with a large through hole having an opening area larger than or equal to an opening area of the small through hole and a small through hole provided on a side closer to the image side than the small through hole in the optical axis direction of the microlens 11. The image sensor 16 is arranged in the large through hole, and the large through hole, the small through hole and the image sensor 16 are coaxially arranged. The object side of the image sensor 16 is provided with a light-sensing surface for sensing the light collected by the micro lens 11.

The peripheral position of the surface of the light sensing surface is provided with a first bonding pad 161, the surface of the circuit board 17 facing the light sensing surface is provided with a second bonding pad 171, the first bonding pad 161 and the second bonding pad 171 are opposite at intervals in the optical axis direction, the first bonding pad 161 and the second bonding pad 171 are connected through a conductive ball 18a, and specifically, the conductive ball 18a may be a conductive metal ball, for example, a gold ball. The conductive balls 18a have a larger connection area than the conductive wires 18b, and can better ensure stable electrical connection between the circuit board 17 and the image sensor 16. The conductive balls 18a function here to be conductive, and shapes include, but are not limited to, spherical. Thereby, the electrical connection of the image sensor 16-the first pad 161-the conductive metal ball-the second pad 171-the circuit board 17 "is achieved. The number of the first pads 161 and the number of the second pads 171 may be several, so as to ensure the stability of the electrical connection between the image sensor 16 and the circuit board 17. The flip structure of the image sensor 16 and the circuit board 17 reduces the overall thickness of the camera module 10.

In another embodiment, as shown in fig. 7, the circuit board 17 is located on the image side of the image sensor 16, the circuit board 17 has a blind via structure, and a groove is formed on the object side surface of the circuit board 17. The image sensor 16 is disposed in the recess. The light-sensing surface is disposed on the object-side surface of the image sensor 16, the first pad 161 is disposed at the peripheral position of the light-sensing surface of the image sensor 16, and the second pad 171 is disposed on the object-side surface of the circuit board 17. Specifically, the second pad 171 is disposed around the groove of the circuit board 17. The first pad 161 and the second pad 171 are connected by a wire 18b, and the wire 18b may be a conductive metal wire, for example, a gold wire.

In another embodiment, as shown in fig. 8, the camera module 10 further includes a filter 19, and the filter 19 is disposed in the second accommodating space 12b and located on the object side of the photosensitive element. Thus, the second accommodating space 12b sequentially includes, from the object side to the image side along the optical axis: a filter 19, a circuit board 17 and an image sensor 16, or a filter 19, an image sensor 16 and a circuit board 17. In one embodiment, the filter 19 is an infrared cut filter, and the infrared cut filter is an optical filter that is formed by alternately coating optical films with high refractive index on an optical substrate by using a precision optical coating technique to realize high transmission in the visible light region (400-. By adding the infrared cut-off filter in the imaging system, the infrared light which interferes with the imaging quality is blocked, so that the formed image can better accord with the best feeling of human eyes. The method is mainly applied to the digital imaging fields of mobile phone cameras, built-in computer cameras, automobile cameras and the like which can be shot, and is used for eliminating the influence of infrared light on imaging of the image sensor 16. It is understood that when the infrared cut filter 19 is disposed in the camera module 10, the microlens 11 and the protective cover 13 may not need to be provided with an infrared cut filter.

The principle of the imaging of the camera module 10 with the micro lens 11 is as follows: the microlens array is a two-dimensional array composed of a plurality of microlens 11 units. The light passing through each microlens 11 cell is projected onto the image sensor 16 to form a small sub-image of the microlens 11. Each microlens 11 sub-image comprises a number of pixels, and the intensity of the light recorded by each pixel comes from the beamlets confined between one microlens 11 and one sub-aperture region of the lens, i.e. the discrete sampled form of the light field, and the position and direction of each beamlet can be determined by the coordinates (s, t) of the elements of the microlens 11 and the coordinates (u, v) of the lens sub-aperture, obtaining the distribution of the light field L (u, v, s, t). After the light field distribution in the camera is obtained, a virtual image plane can be reselected, the positions of more distant or closer image planes can be selected, and the intersection point positions and the energy distribution of all light rays on the plane are calculated, so that an image on a new image plane is obtained.

In one embodiment, as shown in fig. 9 and 10, an electronic device 100 is provided, and the electronic device 100 may be a mobile phone, a tablet computer, a notebook computer, etc. with a camera function. The electronic device 100 includes a camera module 10, a display module 20, and a main circuit board electrically connected to the circuit board 17 of the camera module 10. The circuit board 17 is connected with an image processing chip, the image processing chip transmits processed image data to the central processing unit through the circuit board 17 and the main circuit board, and the circuit board 17 and the main circuit board play a role in electric signal transmission in the process. The camera module 10 and the display module 20 may be located on the same side of the electronic device 100, or located on the opposite side of the electronic device 100 from the display module 20, that is, the camera module 10 of this embodiment may be a front camera module or a rear camera module.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope of the present invention, and these modifications or replacements should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. The utility model provides a lens assembly, its characterized in that includes a plurality of microlens and microscope base, the microscope base has first accommodation space, a plurality of microlens is located in the first accommodation space, just a plurality of microlens is located on the first plane of microscope base, a plurality of microlens is array distribution, the object side of a plurality of microlens is the convex surface.

2. The lens assembly of claim 1, wherein the plurality of microlenses are formed using an integral molding process.

3. The lens assembly of claim 1, wherein the lens mount is divided into a transmissive region and a non-transmissive region, the micro-lens being disposed on the transmissive region, the transmissive region being configured to pass light from the micro-lens, the non-transmissive region being disposed around the transmissive region, the non-transmissive region being configured to avoid entry of interfering light.

4. The lens assembly of claim 1, wherein the microlenses and the lens mount are made by an integral molding process.

5. The lens assembly of claim 1, further comprising a lens barrel disposed in the first receiving space of the lens holder, wherein the micro lens is disposed in the lens barrel.

6. The lens assembly of claim 1, wherein the object side of the micro lens is further provided with a convex lens, and the convex lens is located in the first accommodating space of the lens holder.

7. The lens assembly of claim 1, further comprising a protective cover disposed on an object side of the lens holder, wherein the protective cover closes the opening of the first accommodating space.

8. The lens assembly of claim 7, further comprising a filter disposed on the microlenses or on the protective cover.

9. A camera module comprising a photosensitive component and the lens component of any one of claims 1-8, wherein the photosensitive component is disposed on an image side of the lens component.

10. An electronic device, comprising a display module, a main circuit board and the camera module of claim 9, wherein the camera module and the display module are located on the same side of the electronic device, or located on the opposite side of the electronic device from the display module, and the main circuit board is electrically connected to the circuit board of the camera module.