CN110544876B - Automatic power control light spot emitter - Google Patents
Automatic power control light spot emitter Download PDFInfo
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- CN110544876B CN110544876B CN201810521808.2A CN201810521808A CN110544876B CN 110544876 B CN110544876 B CN 110544876B CN 201810521808 A CN201810521808 A CN 201810521808A CN 110544876 B CN110544876 B CN 110544876B
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- power control
- automatic power
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/06804—Stabilisation of laser output parameters by monitoring an external parameter, e.g. temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
Abstract
An automatic power control optical spot emitter comprising: a shell, which is provided with an accommodating space and a platform above the accommodating space in sequence and covers the substrate, so that the automatic power control IC, the laser diode and the light reflecting element are positioned in the shell, and the accommodating space and the platform are positioned above the automatic power control IC, the laser diode and the light reflecting element; a collimating mirror; and a diffractive optical element adhered to the platform of the housing; the laser diode projects a laser on the light reflection element, so that the light reflection element vertically emits the laser to the diffraction optical element from the collimating mirror, the diffraction optical element can generate a plurality of light spots, the stray light is detected by the light detection diode of the automatic power control IC to form a readable light detection signal, the output of the laser diode is fed back and controlled by the light detection signal to adjust the power proportion emitted by the laser, and the emission of each light spot of the diffraction optical element is controlled by the power proportion emitted by the laser.
Description
Technical Field
The invention relates to an automatic power control light spot transmitter, wherein a light detection signal is fed back to control the output of a laser diode so as to adjust the power proportion emitted by laser and control the emission of each light spot of a diffraction optical element according to the power proportion emitted by the laser.
Background
The light emitting intensity of the laser diode is also affected by the amount of driving current and temperature, when the driving current is higher, the light intensity is higher, the component temperature is higher and the light attenuation value is larger, and after the laser diode is started, the change of the light micro-voltage causes the change of the current amount to be changed drastically, and the light emitting intensity of the laser diode also needs to be automatically power controlled, as shown in fig. 1, which is disclosed in US Patent No.7,177,333, and is a laser diode module 10, comprising: a heat sink (heat sink)11 having a groove 111, and a 1 st pin 12a, a 2 nd pin 12b and a 3 rd pin (not shown) disposed on the back surface thereof; a fixing base (mount)13, which is protruded on the surface of the heat sink 11 and connected to the 2 nd pin 12b of the Ground (GND); a primary fixing seat (sub) 131, which is arranged inside the fixing seat 13 and is used for bonding a laser diode (laser diode) 14; a photo diode (photo diode)15 disposed on the heat sink 11; a metal housing (cap)17 having a glass window 171 on its top surface and its bottom edge bonded above the heat sink 11; an APC circuit 16, which configures the automatic power control circuit into a circuit board or IC pattern, and is embedded and packaged in the metal shell 17, and utilizes routing to connect with the 1 st pin 12a, the 2 nd pin 12b and the 3 rd pin with the laser diode 14 and the light detection diode 15, so as to form the voltage driving component of the laser diode, although the reliability of the laser diode module 10 is high, the volume is large and difficult to integrate to the application end, and the rapid automatic production can not be achieved by using the semiconductor Surface Mount Technology (SMT).
Secondly, the current 3D sensing technology mainly uses structured light (structured light) technology, and the conventional sensing device generally employs a light spot emitter (dot projector), as shown in fig. 2, which is disclosed in US Patent No.8,829,406, and is a light spot emitter 20, comprising: a radiation source assembly 21 including a laser diode 211 and a photodiode 212, the laser diode 211 outputting a laser light (L)1) And the photodiode 212 detects a reflected light (N)1) The radiation source module 21 is mounted on a base 22, and the laser diode 211 is mounted on a sub mount 213, the sub mount 213 being fixed to a housing holder 214, the housing holder 214 being located in a package 215, the package 215 having a window 216 on an upper side thereof; a housing 23 for accommodating the radiation source module 21 and having an exit window 231; a collimating lens (co11 collimating lens)24 housed in the housing 23; a Diffractive Optical Elements (DOEs) 25 housed in the housing 23; a connector 26 coupled to the radiation source module 21. The main operation of the spot emitter 20 is the laser (L)1) After passing through the collimator lens 24 and the diffractive optical element 25, a plurality of light spots are formed and projected on an object to be identified, and then an image is captured by a camera (camera) to identify 3D depth information, but the volume is large and the assembly is complicated and difficult, and the radiation source assembly 21 cannot achieve rapid automatic production by using a semiconductor surface mount technology.
However, it is found that the laser diode module 10 and the light spot emitter 20 can not be automatically and rapidly manufactured by using the semiconductor surface mount technology, and the laser diode module 10 needs to integrate the heat sink 11, the 1 st pin 12a, the 2 nd pin 12b and the 3 rd pin, the fixing base 13, the sub-fixing base 131, the laser diode 14, the photodiode 15, the APC circuit 16 and the metal housing 17, so as to have a larger volume, if the laser diode module 10 replaces the radiation source assembly 21 of the light spot emitter 20, and then integrates the base 22, the housing 23, the collimating mirror 24, the diffractive optical element 25 and the connector 26 of the light spot emitter 20, the assembly is more complicated and the volume is more bulky. In view of the above-mentioned problems, the present inventors have devised an automatic power control light spot emitter, which is the subject to be solved by the present invention.
Disclosure of Invention
The main technical problem to be solved by the present invention is to overcome the above-mentioned defects in the prior art, and to provide an automatic power control light spot emitter, which integrates an automatic power control IC having a light detection diode, a fixing base, a laser diode, a light reflection element, a housing, a collimating mirror and a diffraction optical element with a substrate, so as to solve the problems of more complicated assembly, larger volume and incapability of using a semiconductor surface adhesion technology to achieve rapid automatic production in the prior art, and further has the effects of simple assembly, light and thin volume and low production cost; the laser diode, the automatic power control IC with the light detection diode and the light reflection element can form laser which can be controlled in a feedback way, and further the power proportion emitted by the laser controls the emission effect of each light spot of the diffraction optical element; the automatic power control IC is provided with built-in optical feedback control and temperature compensation to stabilize the output of laser, and the automatic power control IC is provided with a built-in protection circuit to increase the reliability, thereby improving the efficacy of stable and reliable output of light spot output.
The technical scheme adopted by the invention for solving the technical problems is as follows:
an automatic power control optical spot emitter comprising: a substrate; an automatic power control IC having a photodiode and fixed on the substrate; a fixing seat fixed on the substrate; a laser diode fixed on the fixing base and coupled with the automatic power control IC; a light reflection element fixed in front of the laser diode; a housing, which is sequentially provided with an accommodating space and a platform above the accommodating space, and covers the substrate, so that the automatic power control IC, the laser diode and the light reflection element are positioned in the housing, and the accommodating space and the platform are positioned above the automatic power control IC, the laser diode and the light reflection element; a collimating lens fixed in the containing space of the shell to make the collimating lens above the automatic power control IC, the laser diode and the light reflecting element; and a diffractive optical element adhered to the platform of the housing, so that the diffractive optical element is positioned above the collimating mirror; therefore, the laser diode projects a laser on the light reflection element, the light reflection element enables the laser to vertically irradiate the laser on the collimating mirror to the diffraction optical element, the diffraction optical element can generate a plurality of light spots, the laser generates a stray light in the shell through reflection, the stray light is detected by the light detection diode of the automatic power control IC to form a readable light detection signal, the output of the laser diode is controlled by the light detection signal in a feedback mode to adjust the power proportion of the laser, and the light spot emission of the diffraction optical element is controlled by the power proportion of the laser.
According to the above-mentioned feature, the automatic power control IC is provided with a supply voltage contact, a ground contact, a current setting contact, a photodiode output contact and a laser diode output contact.
According to the above feature, the circuit architecture of the automatic power control IC further includes the supply voltage contact coupled in series with the photodiode, a resistor and a first ESD circuit, and the first ESD circuit coupled in parallel with a ground terminal; a logic circuit, which is respectively coupled in series with the resistor and the current setting contact; a current amplifying circuit coupled in series with the photodiode; an error amplifier coupled in parallel with the current amplifying circuit; a protection circuit coupled in parallel to the error amplifier and having a reference voltage unit, an over-temperature protection unit and a low voltage locking unit; a transistor, which is respectively coupled in series with the error amplifier, the laser diode output contact and the grounding terminal; a current monitoring circuit coupled in parallel to the ground terminal; a second ESD circuit coupled in parallel to the current setting node and the ground terminal, respectively; a third ESD circuit coupled in parallel to the current setting node and the ground terminal, respectively; a variable resistor coupled in series with the output contact of the photodiode and the ground terminal; the laser diode is respectively coupled in series with the supply voltage contact and the laser diode output contact.
According to the above-mentioned features, the circuit structure of the automatic power control IC further includes a slow start circuit for preventing an over-current during start-up.
According to the above feature, when the logic circuit determines that the current setting contact is set at a high level, the current value of the current monitoring circuit is set to 100mA, or when the logic circuit determines that the current setting contact is set at a low level, the current value of the current monitoring circuit is set to 300 mA.
According to the above feature, when the logic circuit determines that the current setting contact is set at a high level, the voltage value of the reference voltage unit is set to 0.55V, and when the logic circuit determines that the current setting contact is set at a low level, the voltage value of the reference voltage unit is set to 1.1V; the temperature value of the over-temperature protection unit is set to be larger than 165 ℃ and smaller than 135 ℃; the voltage value of the low voltage locking unit is set to be less than 2.3V and greater than 2.5V.
According to the above-mentioned feature, the resistance value of the variable resistor is set to 35Kohm to 1Kohm, the resistance value of the variable resistor is set to 6Kohm, and the current value corresponding to the photo detector is set to 90 uA.
According to the characteristics disclosed in the previous paragraph, the human body model values of the first ESD circuit, the second ESD circuit and the third ESD circuit are set to be greater than or equal to 2 KV; the mechanical model values of the first ESD circuit, the second ESD circuit and the third ESD circuit are set to be greater than or equal to 200V.
According to the above-mentioned features, the substrate has a first surface and a second surface opposite to the first surface, the first surface has a first conductive pad and the second surface has a second conductive pad, and the substrate is formed of a circuit board, so that an internal conductive trace is formed in the substrate, the first conductive pad and the second conductive pad are coupled to each other, and the first conductive pad is coupled to the automatic power control IC and the laser diode chip and the second conductive pad are coupled to an external circuit by a plurality of external conductive traces, respectively.
According to the disclosed features, the collimating lens is a single lens or a micro-lens array.
According to the aforementioned feature, the housing is made of one material selected from copper, stainless steel and aluminum.
According to the characteristics of the previous disclosure, a metal frame is disposed on the first surface of the substrate, the metal frame frames the automatic power control IC, the fixing base and the light reflection element, and an adhesive layer is disposed on the metal frame and adheres and fixes the bottom surface of the housing.
According to the above feature, the metal frame is made of nickel-gold or nickel-palladium-gold.
According to the aforementioned feature, the material of the adhesive layer is selected from a glue material or a metal.
According to the aforementioned feature, the adhesive material is selected from silicone or epoxy.
According to a feature of the invention, the metal is selected from gold tin, silver copper, tin silver copper or indium.
According to the characteristics of the previous disclosure, the accommodating space of the housing further comprises a press ring structure, the press ring structure is provided with a ring recess and a press ring positioned in the ring recess, the outer ring surface of the ring recess is riveted and fixed in the accommodating space of the housing, the collimating mirror and the ring recess are supported by the ring recess and provided with a light reflection hole, the position of the central convex surface of the collimating mirror, the position of the light reflection hole and the position of the light reflection element are vertically corresponding, and the central convex surface of the collimating mirror and the ring plane of the collimating mirror are tightly pressed by the inner ring surface of the press ring in a sleeved mode.
According to the feature of the previous disclosure, the platform is located in the housing, so that the platform forms a slot.
By means of the technical means disclosed above, the substrate is integrated with the automatic power control IC with the light detection diode, the fixing seat, the laser diode, the light reflection element, the shell cover, the collimating mirror and the diffractive optical element, and the laser diode, the automatic power control IC with the light detection diode and the light reflection element, so that the laser capable of being controlled in a feedback mode can be formed, and then the automatic power control IC is built with built-in optical feedback control and temperature compensation to achieve the purpose of stabilizing the output of the laser.
The invention has the advantages that the substrate is used for integrating the automatic power control IC with the light detection diode, the fixed seat, the laser diode, the light reflection element, the shell cover, the collimating mirror and the diffraction optical element, so as to solve the problems that the prior art is more complex in assembly, larger in volume and incapable of achieving rapid automatic production by using a semiconductor surface adhesion technology, and further has the effects of simple assembly, light and thin volume and low production cost; the laser diode, the automatic power control IC with the light detection diode and the light reflection element can form laser which can be controlled in a feedback way, and further the power proportion emitted by the laser controls the emission effect of each light spot of the diffraction optical element; the automatic power control IC is provided with built-in optical feedback control and temperature compensation to stabilize the output of laser, and the automatic power control IC is provided with a built-in protection circuit to increase the reliability, thereby improving the efficacy of stable and reliable output of light spot output.
Drawings
The invention is further illustrated with reference to the following figures and examples.
Fig. 1 is a schematic diagram of a conventional laser diode module.
Fig. 2 is a schematic diagram of a conventional point transmitter.
Fig. 3A is an exploded perspective view of the present invention.
Fig. 3B is an assembled perspective view of the present invention.
Fig. 3C is a cross-sectional view of 3C-3C of fig. 3B.
Fig. 4A is an exploded perspective view of another preferred embodiment of the present invention.
FIG. 4B is an assembled perspective view of another preferred embodiment of the present invention.
Fig. 4C is a cross-sectional view of 4C-4C of fig. 4B.
Fig. 5 is a top view of the automatic power control IC of the present invention.
Fig. 6 is a circuit diagram of the automatic power control IC of the present invention.
Fig. 7 is a circuit architecture diagram of the automatic power control IC of the present invention.
The reference numbers in the figures illustrate:
30A, 30B automatic power control light spot emitter
301 adhesive layer
31 base plate
311 first surface
3111 first conductive pad
3112 Metal frame
312 second surface
3121 second conductive pad
32 automatic power control IC
321 photodiode
33 fixed seat
34 laser diode
35 light reflecting element
36 casing
361 accommodation space
362 platform
363 bottom surface
37 collimating mirror
371 convex surface
372 ring plane
38 diffractive optical element
39 pressure ring structure
391 Ring recess
3911 outer ring surface
3912 light reflecting aperture
392 compression ring
3921 inner ring surface
3922 bottom ring surface
W external lead
O external circuit
L2Laser
N2Stray light
C light spot
S optical detection signal
T-transistor
R resistance
G ground terminal
U protection circuit
U1Reference voltage unit
U2Over-temperature protection unit
U3Low voltage lockout cell
P1Supply voltage contact
P2Grounding contact
P3Current setting contact
P4Output contact of photodiode
P5Laser diode output contact
E1A first ESD circuit
E2Second ESD circuit
E3Third ESD circuit
LE logic circuit
CA current amplifying circuit
EA error amplifier
CM current monitoring circuit
VR variable resistor
SS slow starting circuit
Detailed Description
First, referring to fig. 3A to 3C and fig. 5 to 7, a preferred embodiment of an automatic power control spot emitter 30A according to the present invention comprises: a substrate 31, in this embodiment, the substrate 31 has a first surface 311 and a second surface 312 opposite to the first surface 311, the first surface 311 is provided with a first conductive pad 3111, the second surface 312 is provided with a second conductive pad 3121, and the substrate 31 is formed by a circuit board, so that internal conductive lines are formed in the substrate 31, the first conductive pad 3111 and the second conductive pad 3121 are coupled to each other, and the second conductive pad 3121 is coupled to an external circuit O, but is not limited thereto.
An automatic power control IC32 having a photodiode 321, the first conductive pad 3111 coupled to the automatic power control IC32 and fixed on the substrate 31, wherein the automatic power control IC32 has a supply voltage pad (P) in the embodiment1) A grounding contact (P)2) A current setting contact (P)3) A photodiode output contact (P)4) And a laser diode output contact (P)5) But is not limited thereto.
A fixing seat 33 fixed on the substrate 31.
A laser diode 34 fixed on the fixing base 33 and coupled to the automatic power control IC32, in the embodiment, the first conductive pad 3111 is coupled to the automatic power control IC32 and the laser diode chip 34 by a plurality of external wires W, respectively, but not limited thereto.
A light reflecting element 35 is fixed in front of the laser diode 34.
A housing 36, which has a receiving space 361 and a platform 362 above the receiving space 361 in sequence, and covers the substrate 31, such that the automatic power control IC32, the laser diode 34 and the light reflection element 35 are located in the housing 36, and the receiving space 361 and the platform 362 are located above the automatic power control IC32, the laser diode 34 and the light reflection element 35, in this embodiment, the material of the housing 36 is selected from one of copper, stainless steel or aluminum, but is not limited thereto.
In this embodiment, the adhesive layer 301 is selected from a glue material or a metal, the glue material is selected from one of silicon gel (silicone) and epoxy resin (epoxy), and the metal is selected from one of gold tin (AuSn), silver copper (AgCu), tin silver copper (SnAgCu, SAC) and Indium (Indium), but not limited thereto.
A collimating mirror 37 fixed in the accommodating space 361 of the housing 36, such that the collimating mirror 37 is located above the automatic power control IC32, the laser diode 34 and the light reflecting element 35, in the embodiment, the collimating mirror 37 is formed by one of a single lens or a micro lens array, but is not limited thereto.
A diffractive optical element 38 attached to the platform 362 of the housing 36 such that the diffractive optical element 38 is located above the collimator lens 37.
In another preferred embodiment, shown in fig. 4A-4C and 5-7, an automatic power control spot emitter 30B comprises: the substrate 31, the automatic power control IC32, the holder 33, the laser diode 34, the light reflection element 35, the housing 36, the collimator 37, the diffractive optical element 38, and the accommodation space 361 of the housing 36 further include a pressure ring structure 39, the pressure ring structure 39 has a ring recess 391 and a pressure ring 392 located in the ring recess 391, an outer ring surface 3911 of the ring recess 391 is riveted and fixed in the accommodation space 361 of the housing 36, the collimator 37 and the ring recess 391 are provided with a light reflection hole 3912, and the position of the central convex surface 371 of the collimator 37, the position of the light reflection hole 3912, and the position of the light reflection element 35 are vertically corresponding to each other, and an inner ring surface 3921 of the pressure ring 392 fixes the central convex surface 371 of the collimator 37 and a bottom ring surface 22 of the pressure ring 392 tightly presses the ring surface 372 of the collimator 37 and the platform 362 in the housing 36, the platform 362 forms a slot, but is not limited thereto.
Based on the above structure, the two embodiments differ only in the height of the platform 362 and the presence or absence of the chuck structure 39, and both can achieve the effect that the laser diode 34 projects a laser beam (L)2) The light reflection element 35 is configured to reflect the laser beam (L) to the light reflection element 352) Perpendicular to the collimating mirror 37 to the diffractive optical element 38, so that the diffractive optical element 38 can generate a plurality of light spots (C), and the laser light (L)2) A stray light (N) is generated by reflection in the housing 362) And detecting the stray light (N) by the photodiode 321 of the automatic power control IC322) Forming a readable optical signalSignal (S) for feedback-controlling the output of the laser diode 34 to adjust the laser light (L)2) The ratio of the emitted power and the laser light (L)2) The ratio of the emitted powers controls the emission of each of the spots (C) of the diffractive optical element 38.
In addition, the circuit structure of the APC IC32 further includes the supply voltage node (P)1) A resistor (R) and a first ESD circuit (E) coupled in series with the photodiode 321 and in parallel with each other1) And the first ESD circuit (E)1) A ground terminal (G) connected in parallel, in the present embodiment, the supply voltage contact (P)1) The supplied voltage is 2.8V, but is not limited thereto.
A logic circuit (LE) coupled in series to the resistor (R) and the current setting contact (P)3)。
A current amplifying Circuit (CA) coupled in series with the photodiode 321.
An Error Amplifier (EA) coupled in parallel to the current amplifying Circuit (CA).
A protection circuit (U) coupled in parallel to the Error Amplifier (EA) and having a reference voltage unit (U)1) An over-temperature protection unit (U)2) And a low voltage locking unit (U)3) In this embodiment, when the logic circuit (LE) determines the current setting contact (P)3) Set at high level, the reference voltage unit (U)1) Is set to 0.55V, and when the logic circuit (LE) determines that the current setting contact (P) is set3) Set at low level, the reference voltage unit (U)1) The voltage value of (1.1) is set; the over-temperature protection unit (U)2) The temperature value of (a) is set to be more than 165 degrees and less than 135 degrees; the low voltage locking unit (U)3) The voltage value of (2) is set to be less than 2.3V and greater than 2.5V, but is not limited thereto.
A transistor (T) coupled in series to the Error Amplifier (EA) and the output contact (P) of the laser diode5) And the ground terminal (G).
A current monitoring Circuit (CM) coupled in parallel to the ground (G), in this embodiment, when the logic circuit (LE) determines the current setting node (P)3) When the current is set to high level, the current value of the current monitoring Circuit (CM) is set to 100mA, or when the logic circuit (LE) judges that the current setting contact (P) is set3) When the current is set to a low level, the current value of the current monitor Circuit (CM) is set to 300mA, but the current is not limited thereto.
A second ESD circuit (E)2) Respectively coupled in parallel to the current setting contacts (P)3) And the ground terminal (G).
A third ESD circuit (E)3) Respectively coupled in parallel to the current setting contacts (P)3) And the ground terminal (G), in this embodiment, the first ESD circuit (E)1) The second ESD circuit (E)2) And the third ESD circuit (E)3) The Human Body Model (HBM) value of (1) is set to be greater than or equal to 2 KV; the first ESD circuit (E)1) The second ESD circuit (E)2) And the third ESD circuit (E)3) The Mechanical Model (MM) value of (1) is set to 200V or more, but is not limited thereto.
A Variable Resistor (VR) respectively coupled in series with the photodiode output contact (P)4) And the ground terminal (G).
The laser diodes 34 are respectively coupled in series with the supply voltage contacts (P)1) And the laser diode output contact (P)5) In this embodiment, the resistance value range of the Variable Resistor (VR) is set to 35Kohm to 1Kohm, the resistance value of the Variable Resistor (VR) is set to 6Kohm, and the current value corresponding to the photo detector 321 is set to 90uA, but the invention is not limited thereto.
A slow start circuit (SS) for preventing over-current during start-up.
Based on the above structure, the substrate 31 is used to integrate the automatic power control IC32 with the photodiode 321, the fixing base 33, the laser diode 34, the light reflection element 35, the housing 36, the collimating mirror 37 and the diffractive optical element 38, and the laser diode 34, the automatic power control IC32 with the photodiode 321 and the light reflection element 35, so as to form the laser (L) capable of being controlled in a feedback manner2) The automatic power control IC32 is built with optical feedback control and temperature compensation to achieveStabilize the laser light (L)2) The protection circuit (U) is built in the automatic power control IC32, and the protection circuit (U) also has over-current protection, over-temperature protection or transient protection, and further has the advantages of easy assembly, thin and light volume, low production cost, and the laser (L) being light and thin2) The ratio of the emitted power controls the emission of each light spot (C) of the diffractive optical element 38, the stability of the output of the light spot (C) and the reliability of the output.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and all simple modifications, equivalent variations and modifications made to the above embodiment according to the technical spirit of the present invention still fall within the scope of the technical solution of the present invention.
In summary, the present invention completely meets the needs of industrial development in terms of structural design, practical use and cost effectiveness, and the disclosed structure has an unprecedented innovative structure, novelty, creativity and practicability, and meets the requirements of the patent requirements of the invention, so that the patent application is filed in law.
Claims (16)
1. An automatic power control optical spot emitter, comprising:
a substrate;
an automatic power control IC having a light detecting diode and fixed on the substrate, the automatic power control IC having a supply voltage contact, a ground contact, a current setting contact, a light detecting diode output contact and a laser diode output contact, the circuit architecture of the automatic power control IC further including the supply voltage contact coupled in series with the light detecting diode and coupled in parallel with a resistor and a first ESD circuit, and the first ESD circuit coupled in parallel with a ground terminal; a logic circuit, which is respectively coupled in series with the resistor and the current setting contact; a current amplifying circuit coupled in series with the photodiode; an error amplifier coupled in parallel with the current amplifying circuit; a protection circuit coupled in parallel to the error amplifier and having a reference voltage unit, an over-temperature protection unit and a low voltage locking unit; a transistor, which is respectively coupled in series with the error amplifier, the laser diode output contact and the grounding terminal; a current monitoring circuit coupled in parallel to the ground terminal; a second ESD circuit coupled in parallel to the current setting node and the ground terminal, respectively; a third ESD circuit coupled in parallel to the current setting node and the ground terminal, respectively; a variable resistor coupled in series with the output contact of the photodiode and the ground terminal; the laser diode is respectively coupled in series with the supply voltage contact and the laser diode output contact;
a fixing seat fixed on the substrate;
a laser diode fixed on the fixing base and coupled with the automatic power control IC;
a light reflection element fixed in front of the laser diode;
a housing, which is sequentially provided with an accommodating space and a platform above the accommodating space, and covers the substrate, so that the automatic power control IC, the laser diode and the light reflection element are positioned in the housing, and the accommodating space and the platform are positioned above the automatic power control IC, the laser diode and the light reflection element;
a collimating lens fixed in the containing space of the shell to make the collimating lens above the automatic power control IC, the laser diode and the light reflecting element; and
a diffractive optical element adhered to the platform of the housing, so that the diffractive optical element is positioned above the collimating mirror;
therefore, the laser diode projects a laser on the light reflection element, the light reflection element enables the laser to vertically irradiate the laser on the collimating mirror to the diffraction optical element, the diffraction optical element can generate a plurality of light spots, the laser generates a stray light in the shell through reflection, the stray light is detected by the light detection diode of the automatic power control IC to form a readable light detection signal, the output of the laser diode is controlled by the light detection signal in a feedback mode to adjust the power proportion of the laser, and the light spot emission of the diffraction optical element is controlled by the power proportion of the laser.
2. The automatic power control optical spot emitter of claim 1 wherein the circuit structure of the automatic power control IC further comprises a soft start circuit for preventing over-current during start-up.
3. The automatic power control light spot emitter according to claim 1, wherein the current value of the current monitor circuit is set to 100mA when the logic circuit judges that the current setting contact is set at a high level, or set to 300mA when the logic circuit judges that the current setting contact is set at a low level.
4. The automatic power control spot emitter according to claim 1, wherein the voltage value of the reference voltage unit is set to 0.55V when the logic circuit judges that the current setting contact is set at a high level, and the voltage value of the reference voltage unit is set to 1.1V when the logic circuit judges that the current setting contact is set at a low level; the temperature value of the over-temperature protection unit is set to be larger than 165 ℃ and smaller than 135 ℃; the voltage value of the low voltage locking unit is set to be less than 2.3V and greater than 2.5V.
5. The automatic power control light spot emitter according to claim 1, wherein the resistance value of the variable resistor is set in a range of 35Kohm to 1Kohm, the resistance value of the variable resistor is set at 6Kohm, and the current value corresponding to the photodiode is set at 90 uA.
6. The automatic power control spot emitter according to claim 1, wherein the first ESD circuit, the second ESD circuit and the third ESD circuit are set to have a human model value greater than or equal to 2 KV; the mechanical model values of the first ESD circuit, the second ESD circuit and the third ESD circuit are set to be greater than or equal to 200V.
7. The automatic power control spot emitter of claim 1, wherein the substrate has a first surface and a second surface opposite to the first surface, the first surface has a first conductive pad and the second surface has a second conductive pad, and the substrate is formed of a circuit board, such that the substrate has internal conductive traces formed therein, the first conductive pad and the second conductive pad are coupled to each other, the first conductive pad is coupled to the automatic power control IC and the laser diode chip and the second conductive pad are coupled to an external circuit by external conductive traces, respectively.
8. The automatic power control spot emitter according to claim 1, wherein said collimating mirror is a single lens or a micro lens array.
9. The automatic power control spot emitter according to claim 1, wherein the housing is made of one material selected from copper, stainless steel and aluminum.
10. The automatic power control light spot emitter of claim 1, wherein a metal frame is disposed on the first surface of the substrate, the metal frame encloses the automatic power control IC, the fixing base and the light reflection element, and an adhesive layer is disposed on the metal frame and adhesively fixes the bottom surface of the housing.
11. The automatic power control spot emitter as claimed in claim 10, wherein the metal casing is made of a material selected from ni-au or ni-pd-au.
12. The automatic power control spot emitter according to claim 10, wherein the material of said adhesive layer is selected from a glue material or a metal.
13. The automatic power control light spot emitter according to claim 12, wherein said glue is selected from a group consisting of silicone or epoxy.
14. The automatic power control light spot emitter according to claim 12 wherein the metal is selected from gold tin, silver copper, tin silver copper or indium.
15. The automatic power control light spot emitter according to claim 1, further comprising a pressing ring structure in the receiving space of the housing, wherein the pressing ring structure has a ring recess and a pressing ring located in the ring recess, an outer annular surface of the ring recess is riveted and fixed in the receiving space of the housing, the ring recess receives the collimating mirror and the ring recess has a light reflecting hole, and the position of the central convex surface of the collimating mirror, the position of the light reflecting hole and the position of the light reflecting element vertically correspond to each other, and the inner annular surface of the pressing ring is sleeved and fixed with the central convex surface of the collimating mirror and a bottom annular surface of the pressing ring to press the annular surface of the collimating mirror.
16. The automatic power control spot emitter of claim 1 wherein the platform is positioned within the housing such that the platform forms a nest.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810521808.2A CN110544876B (en) | 2018-05-28 | 2018-05-28 | Automatic power control light spot emitter |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810521808.2A CN110544876B (en) | 2018-05-28 | 2018-05-28 | Automatic power control light spot emitter |
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| CN110544876B true CN110544876B (en) | 2021-01-12 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1327626A (en) * | 1999-10-05 | 2001-12-19 | 松下电器产业株式会社 | Optical integrated device |
| CN1419722A (en) * | 2000-02-04 | 2003-05-21 | 斯特拉托斯光波公司 | Automatic power control and laser sloep efficiency normalizing circuit |
| CN102377107A (en) * | 2010-07-28 | 2012-03-14 | 小约翰·P·唐宁 | High-stability light source system and method of manufacturing |
| CN204271437U (en) * | 2014-10-31 | 2015-04-15 | 高准精密工业股份有限公司 | Surface fixed diffraction optics laser module |
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2018
- 2018-05-28 CN CN201810521808.2A patent/CN110544876B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1327626A (en) * | 1999-10-05 | 2001-12-19 | 松下电器产业株式会社 | Optical integrated device |
| CN1419722A (en) * | 2000-02-04 | 2003-05-21 | 斯特拉托斯光波公司 | Automatic power control and laser sloep efficiency normalizing circuit |
| CN102377107A (en) * | 2010-07-28 | 2012-03-14 | 小约翰·P·唐宁 | High-stability light source system and method of manufacturing |
| CN204271437U (en) * | 2014-10-31 | 2015-04-15 | 高准精密工业股份有限公司 | Surface fixed diffraction optics laser module |
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| CN110544876A (en) | 2019-12-06 |
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