CN216849845U

CN216849845U - Silicon wafer taking device and silicon wafer feeding equipment

Info

Publication number: CN216849845U
Application number: CN202123180134.0U
Authority: CN
Inventors: 徐飞; 李昶; 刘世挺
Original assignee: Wuxi Autowell Technology Co Ltd
Current assignee: Wuxi Autowell Technology Co Ltd
Priority date: 2021-12-17
Filing date: 2021-12-17
Publication date: 2022-06-28
Anticipated expiration: 2031-12-17

Abstract

The utility model discloses a piece device and silicon chip charging equipment are got to silicon chip, and the piece device is got to the silicon chip includes: a first conveyor belt and a second conveyor belt; the first conveying belt is wound on the first conveying frame, and a first sensor is arranged on the side edge of the first conveying frame; the conveying surface of the first conveying belt and the conveying surface of the second conveying belt are positioned on the same plane and form a bearing surface for bearing the silicon wafers together; the second conveying belt is wound on the second conveying frame, and a second sensor is arranged on the side edge of the second conveying frame; the first sensor and the second sensor are arranged diagonally, and the distance between the first sensor and the second sensor is smaller than the diagonal distance of the silicon wafer on the bearing surface. The silicon wafer feeding equipment comprises a transverse moving module and two silicon wafer taking devices, wherein the two silicon wafer taking devices are arranged on the transverse moving module in parallel. The utility model discloses a diagonal angle sets up first sensor and second sensor, can be when first conveyer belt and second conveyer belt get into the material basket, carry out comprehensive detection to the piece in the material basket.

Description

Silicon wafer taking device and silicon wafer feeding equipment

Technical Field

The utility model belongs to photovoltaic cell production field especially relates to an automatic get device of silicon chip and use device's charging equipment.

Background

When loading, the silicon wafers need to be taken out of the material basket. In the process of taking out the silicon wafers in the material basket piece by using the conveying belt, if some fragments exist in the material basket, the fragments at the corner of the material basket can not be detected usually, so that the conveying belt can not take out the fragments. When the material basket continues to descend along with the chip taking process, the chips at the corners can be smashed by the conveying belt again, the smashed slag can remain on the conveying belt, the normal chip taking of the later silicon chips is further influenced, the chip taking speed is seriously influenced, and the fault possibly occurs.

How to improve the accurate detection of some fragments after the conveyer belt stretches into the feeding basket is the technical problem that this field is urgently needed to solve.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a main aim at provides a piece device and silicon chip charging equipment are got to silicon chip that can accurately detect the piece when taking out the silicon chip in the material basket.

In order to realize the purpose of the utility model, the utility model adopts the following technical scheme:

if the utility model discloses an aspect provides a silicon chip gets piece device for pick up the silicon chip from the basket, the silicon chip gets piece device and includes: a first conveyor belt and a second conveyor belt;

the first conveying belt is wound on the first conveying frame, a first sensor is arranged on the side edge of the first conveying frame, and the first sensor is positioned at the wafer taking end of the silicon wafer taking device;

the second conveying belt is arranged in parallel to the first conveying belt, and the conveying surface of the first conveying belt and the conveying surface of the second conveying belt are positioned on the same plane and form a bearing surface for bearing the silicon wafers together; the second conveying belt is wound on the second conveying frame, a second sensor is arranged on the side edge of the second conveying frame, and the second sensor is positioned at the wafer taking end of the silicon wafer taking device;

the first sensor and the second sensor are arranged diagonally to detect the silicon wafer on the bearing surface, and the distance between the first sensor and the second sensor is smaller than the diagonal distance of the silicon wafer on the bearing surface.

The utility model discloses in, adopt the diagonal angle to set up first sensor and second sensor, can be when first conveyer belt and second conveyer belt get into the basket, first sensor and second sensor diagonal angle set up the piece to in the basket and detect comprehensively to in time discover the piece in the basket, improve and get piece efficiency, reduce and get piece trouble.

If the utility model discloses an embodiment, the piece device is got to silicon chip still is provided with the third sensor, third sensor and first sensor parallel arrangement, and the distance between third sensor and the first sensor is greater than the silicon chip on the loading end along direction of delivery's length of side.

The third sensor can detect whether the silicon wafer taking device takes the silicon wafer out of the material basket or not and count the taken silicon wafers.

According to an embodiment of the present invention, each of the first and second transportation frames includes a telescopic portion and a fixed portion, the telescopic portion is mounted on a connection plate, and the connection plate is movably disposed on the base;

the silicon wafer taking device further comprises a rodless cylinder and an equal-height block, the rodless cylinder is fixedly installed on the base, the driving end of the rodless cylinder is movably installed through a sliding block and is connected with the equal-height block, and the equal-height block is fixedly installed on the connecting plate.

The telescopic parts are installed through the equal-height blocks and the connecting plates, and the telescopic parts are driven through the rodless cylinders, so that the telescopic effect of each conveying frame is realized.

According to one embodiment of the utility model, the fixed part of the first conveying frame is arranged on the base through the first support, the fixed part of the second conveying frame is arranged on the base through the second support, the first support and the second support are provided with strip-shaped holes, the positions of the first support and the second support on the base are adjusted through the strip-shaped holes, and the length extending direction of the strip-shaped holes is vertical to the conveying direction of the first conveying belt and the second conveying belt; the telescopic parts of the first conveying frame and the second conveying frame are arranged on the connecting plate through the equal-height blocks, waist-shaped holes are formed in the end parts, connected with the equal-height blocks, of the telescopic parts of the first conveying frame and the second conveying frame, and the length extending direction of the waist-shaped holes is perpendicular to the conveying direction of the first conveying belt and the second conveying belt.

The mounting position of the fixed part of the first conveying frame and the second conveying frame can be transversely adjustable through the first support and the second support, meanwhile, the telescopic part of the first conveying frame and the telescopic part of the second conveying frame can also be transversely adjusted through the waist-shaped hole, and the telescopic part and the fixed part are transversely adjusted together, so that the distance between the first conveying frame and the second conveying frame is changed, and the requirements of various products with different sizes can be met.

If the utility model discloses an embodiment has all seted up the absorption hole on first conveyer belt and the second conveyer belt, adsorbs hole intercommunication adsorption equipment.

The arrangement of the adsorption holes can enhance the stability of the silicon wafer on each conveyer belt, and the silicon wafer is prevented from slipping and even falling.

If the utility model discloses an embodiment, silicon chip get piece device still include basket operating means and lift module, basket operating means with get piece end butt joint, basket operating means installs on lift module, and basket operating means for getting piece end liftable adjust.

Through the cooperation of material basket operating means and lifting module, realize getting the piece action of silicon chip, satisfy the silicon chip and get the requirement of blue altitude variation of material when piece.

According to an embodiment of the present invention, the basket operating device includes a vertical plate, a clamping structure and a claw structure, the clamping structure includes at least a pair of first clamping and second clamping, the first clamping and the second clamping are symmetrically disposed on two sides of the vertical plate, so as to clamp and release the basket; the jack catch structure includes jack catch and tray, and the jack catch setting is at the top of riser for joint material basket, and the tray setting is in the bottom of riser for the cooperation jack catch supports lifting to the material basket.

First clamping and second clamping from the left and right sides relative action, realize the tight and the release of clamp to the basket, the tray supports the basket in the lower part, and the jack catch is grabbed from upper portion and is leaned on the basket, guarantees the stable in position of basket on the riser.

According to an embodiment of the present invention, the first clip and the second clip can be synchronously adjusted in opposite directions relative to two sides of the vertical plate; and/or the presence of a gas in the gas,

the jack catch structure still includes first cylinder and connecting rod, and first cylinder is fixed to be set up on the riser, and the drive end of first cylinder rotates the one end of connecting the connecting rod, and the other end of connecting rod rotates and connects the jack catch, and the upset of drive jack catch is in order to realize joint and the release to the basket.

The setting of first cylinder can realize that automatic application of force grabs and leans on the basket, and the setting of connecting rod makes the straight line action of first cylinder, changes to the upset and snatchs the action.

If the utility model discloses an embodiment, the piece device is got to silicon chip still includes the third conveyer belt, and the third conveyer belt sets up between first conveyer belt and second conveyer belt, and carries the face to be located same horizontal plane with the transport face of first conveyer belt and second conveyer belt, and first conveyer belt, second conveyer belt and third conveyer belt are all through a step motor drive.

The third conveyer belt is additionally arranged, so that the contact area between the silicon wafer and the conveying surface is increased, friction can be increased, the bearing of the silicon wafer on the conveying surface is more stable and reliable, and the probability of the silicon wafer being separated from the conveying surface is lower.

If the utility model discloses an in another aspect, a silicon chip charging apparatus is provided, silicon chip charging apparatus includes that sideslip module and two as above arbitrary silicon chips get the piece device, and two silicon chips get the parallel setting of piece device on the sideslip module, and the synchronous sideslip of piece device is got to two silicon chips of sideslip module drive.

The silicon wafer taking devices are arranged in pairs and are used for alternately taking and feeding the silicon wafers, so that the silicon wafer taking and feeding efficiency can be effectively improved.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.

Fig. 1 is a schematic view of the three-dimensional structure of the silicon wafer loading device of the present invention.

Fig. 2 is a schematic view of a first perspective three-dimensional structure of the silicon wafer taking device of the present invention.

Fig. 3 is a schematic view of a second perspective three-dimensional structure of the silicon wafer taking device of the present invention.

Fig. 4 is a schematic view of the structure of the silicon wafer taking device of the present invention.

Fig. 5 is the utility model discloses a first visual angle spatial structure schematic diagram of basket operating means and lifting module in the piece device is got to silicon chip.

Fig. 6 is the second visual angle three-dimensional structure schematic diagram of basket operating means and lifting module in the silicon chip taking device.

Wherein the reference numerals are as follows:

1. a silicon wafer taking device; 10. a base; 11. a first conveyor belt; 110. a first sensor; 111. a telescoping portion of the first carriage; 112. a fixed portion of the first carriage; 113. an adsorption hole; 12. a second conveyor belt; 120. a second sensor; 121. a telescoping portion of the second carriage; 122. a fixed portion of the second carriage; 13. a third conveyor belt; 130. a third sensor; 131. a telescoping portion of the third carriage; 132. a fixed portion of the third carriage; 14. a stepping motor; 15. equal-height blocks; 151. a kidney-shaped hole; 152. a connecting plate; 153. a guide rail; 161. a first bracket; 162. a second bracket; 163. a first bracket strip-shaped aperture; 164. a second bracket strip-shaped hole; 17. a rodless cylinder; 171. a driving end; 172. a slider; 18. a basket operation device; 180. a vertical plate; 181. a first card holder; 182. a second card holder; 183. a support block; 184. a claw; 185. a first cylinder; 186. a connecting rod; 19. a lifting module; 2. a transverse moving module; A. taking the end of the chip.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed description will be omitted.

In the following description of various examples of the invention, reference is made to the accompanying drawings, which form a part hereof, and in which are shown by way of illustration various example structures, systems, and steps in which aspects of the invention may be practiced. It is to be understood that other specific arrangements of parts, structures, example devices, systems, and steps may be utilized, and structural and functional modifications may be made without departing from the scope of the present invention. Moreover, although the terms "top," "bottom," "front," "back," "side," and the like may be used in this specification to describe various example features and elements of the invention, these terms are used herein for convenience only, such as the orientation of the examples described in the figures. Nothing in this specification should be construed as requiring a specific three dimensional orientation of structures to fall within the scope of the invention.

As shown in fig. 1, the silicon wafer loading apparatus of the present embodiment includes a traverse module 2 and two silicon wafer taking devices 1. Wherein, two silicon chip take the piece device 1 and set up on sideslip module 2 in parallel, and sideslip module 2 drives two silicon chips and gets piece device 1 synchronous sideslip. The silicon wafer taking devices are arranged in pairs and are used for alternately taking and feeding the silicon wafers, so that the silicon wafer taking and feeding efficiency can be effectively improved.

The traversing module 2 of this embodiment drives the two silicon wafer taking devices 1 to realize traversing, and the two silicon wafer taking devices 1 take out the silicon wafers from the material basket operating device 18 and take out the silicon wafers from other devices to be sent to the next process. The silicon wafer taking devices 1 of the present embodiment are arranged in pairs, and in other embodiments, they may be arranged separately, or more silicon wafer taking devices 1 may be arranged at the same time.

Fig. 2 is a schematic view of a first perspective three-dimensional structure of the silicon wafer taking device of the present invention. Fig. 3 is a schematic view of a second perspective three-dimensional structure of the silicon wafer taking device of the present invention. Fig. 4 is a schematic view of the main view structure of the silicon wafer taking device of the present invention. Fig. 5 is the utility model discloses material basket operating means and lifting module's among the piece device is got to silicon chip first visual angle spatial structure schematic diagram. Fig. 6 is the second visual angle three-dimensional structure schematic diagram of basket operating means and lifting module in the silicon chip taking device.

In one embodiment, referring to fig. 2 to 6, the silicon wafer taking device 1 is used for picking up silicon wafers from a basket, and comprises a first conveyor belt 11 and a second conveyor belt 12. The first conveyor belt 11 is wound on a first conveyor frame, a first sensor 110 is arranged on a side edge of the first conveyor frame, and the first sensor 110 is located at a wafer taking end of the silicon wafer taking device 1. The second conveyer belt 12 is parallel to the first conveyer belt 11, and the conveying surface of the first conveyer belt 11 and the conveying surface of the second conveyer belt 12 are located on the same plane and form a bearing surface for bearing silicon wafers together. The second conveyor belt 12 is wound on a second conveyor frame, a second sensor 120 is arranged on a side edge of the second conveyor frame, and the second sensor 120 is also located at a wafer taking end of the silicon wafer taking device 1. In this embodiment, the first sensor 110 and the second sensor 120 are arranged diagonally to detect the silicon wafer on the supporting surface, and the distance between the first sensor 110 and the second sensor 120 is smaller than the diagonal distance of the silicon wafer on the supporting surface.

The first sensor 110 and the second sensor 120 are arranged diagonally, as shown in fig. 2, the first sensor 110 is arranged at the upper left corner of the film taking end a (viewed from the picture shown in fig. 2), and the second sensor 120 is arranged at the lower right corner of the film taking end a. The distance between the first sensor 110 and the second sensor 120 is less than the diagonal distance of the silicon wafer on the support surface. This distance's restriction can guarantee when getting the piece to the silicon chip, and first sensor 110 and second sensor 120 can detect the silicon chip respectively along direction of delivery's head end and tail end, and the diagonal angle setting adds the settlement of distance for first sensor 110 and second sensor 120 can combine the head end of treating the silicon chip of getting the piece and the detection of tail end, and the condition of opening, piece appears in time in discovery silicon chip bight, thereby improves and gets piece efficiency.

As a specific embodiment of the present invention, as shown in fig. 2 to 6, the first conveying frame includes a telescopic portion and a fixed portion, the telescopic portion 111 of the first conveying frame is mounted on the connecting plate 152, the connecting plate 152 is movably disposed on the base 10, and the telescopic portion 111 of the first conveying frame realizes the telescopic movement along with the movement of the connecting plate 152 relative to the base 10; the fixed portion 112 of the first carriage is fixedly provided on the base 10.

Similarly, the second carriage comprises a telescopic part and a fixed part, the telescopic part 121 of the second carriage is mounted on the connecting plate 152, the connecting plate 152 is movably arranged on the base 10, and the telescopic part 121 of the second carriage realizes telescopic movement along with the movement of the connecting plate 152 relative to the base 10; the fixing portion 122 of the second carriage is fixedly provided on the base 10.

In order to conveniently realize the extension and retraction of the extension and retraction part 111 of the first conveying frame and the extension and retraction part 121 of the second conveying frame, the silicon wafer taking device is further provided with a rodless cylinder 17 and an equal-height block 15, the rodless cylinder 17 is fixedly arranged on the base 10, a driving end 171 of the rodless cylinder is movably arranged through a sliding block 172 and is connected with the equal-height block 15, and the equal-height block 15 is fixedly arranged on the connecting plate 152.

Specifically, as shown in fig. 4, two equal-height blocks 15 may be provided, one end of each equal-height block 15 is connected to the telescopic portion 111 of the first conveying frame and the telescopic portion 121 of the second conveying frame, and the other end of each equal-height block 15 is fixedly connected to the connecting plate 152. When the rodless cylinder 17 operates, the driving end 171 of the rodless cylinder moves along the slider 172 and drives the equal-height block 15 to operate, and the equal-height block 15 drives the telescopic part 111 of the first conveying frame and the telescopic part 121 of the second conveying frame to perform telescopic operation through the connecting plate 152.

Further, in order to improve the stretching stability of the stretching portion 111 of the first conveying frame and the stretching portion 121 of the second conveying frame, the silicon wafer taking device is further provided with a guide rail 153.

In order to realize the compatibility of the silicon wafer taking device for the silicon wafers with different specifications during the taking process, the fixing part 112 of the first conveying frame and the fixing part 122 of the second conveying frame are designed into a mode that the relative positions can be adjusted adaptively; the

telescopic parts

111 and 121 of the first and second carriages are also designed in such a way that the relative positions can be adjusted adaptively.

The specific scheme is as follows:

as shown in fig. 2 and 3, the fixing portion 112 of the first conveying frame is mounted on the base 10 through a first bracket 161, the fixing portion 122 of the second conveying frame is mounted on the base 10 through a second bracket 162, the first bracket 161 and the second bracket 162 are provided with strip-shaped holes, the positions of the first bracket 161 and the second bracket 162 on the base 10 are adjusted through the strip-shaped holes, and the length extension direction of the strip-shaped holes is perpendicular to the conveying direction of the first conveying belt 11 and the second conveying belt 12; the first bracket 161 is provided with a first bracket strip-shaped hole 163, and the second bracket 162 is provided with a second bracket strip-shaped hole 164.

As shown in fig. 2 and 3, the first brackets 161 are provided in two at both ends of the fixed portion 112 of the first carriage, respectively, and the second brackets 162 are also provided in two at both ends of the fixed portion 122 of the second carriage, respectively. It should be noted that the number of the first brackets 161 and the second brackets 162 is not limited to two in the illustrated embodiment.

When the distance between the fixing part 112 of the first conveying frame and the fixing part 122 of the second conveying frame needs to be adjusted to be large to adapt to the taking of large-size silicon wafers, the first supports 161 at the two ends of the fixing part 112 of the first conveying frame can be moved along the upper right direction shown in fig. 3, and the fixing part 112 of the first conveying frame is fixed on the base 10 after being adjusted outwards; the second brackets 162 at both ends of the fixing portion 122 of the second carriage are moved along the lower left direction as shown in fig. 3, and the fixing portion 122 of the second carriage is adjusted outward and fixed on the base 10, so that the distance between the fixing portion 112 of the first carriage and the fixing portion 122 of the second carriage is increased. On the contrary, if the distance between the fixing portion 112 of the first carriage and the fixing portion 122 of the second carriage is to be reduced, the first carriage 161 is adjusted only in the opposite direction.

The telescopic parts of the first conveying frame and the second conveying frame are both arranged on the connecting plate 152 through the equal-height block 15, waist-shaped holes are arranged at the end parts of the telescopic parts of the first conveying frame and the second conveying frame, which are connected with the equal-height block 15, and the length extension direction of the waist-shaped holes is perpendicular to the conveying direction of the first conveying belt 11 and the second conveying belt 12.

With regard to the adjustment of the distance between the telescopic portion 111 of the first carriage and the telescopic portion 121 of the second carriage, reference is also made to fig. 3, in which fig. 3 the second conveyor belt 12 is hidden to better show the kidney-shaped holes 151 in the ends of the telescopic portion 121 of the second carriage where they are connected to the contour blocks 15. When the distance between the telescopic part 111 of the first conveying frame and the telescopic part 121 of the second conveying frame needs to be adjusted to be large to adapt to large-size silicon wafers, the telescopic part 121 of the second conveying frame can be translated outwards (outwards, namely in the direction away from the first conveying frame), the telescopic part 121 of the second conveying frame is fixed after being adjusted through the waist-shaped hole 151, and the telescopic part 121 of the second conveying frame is fixed on the equal-height block. Conversely, when the distance between the telescopic portion 111 of the first carriage and the telescopic portion 121 of the second carriage needs to be adjusted, only the telescopic portion 121 of the second carriage needs to be fixed in translation inward.

The adjustment principle for the telescopic portion 111 of the first carriage is the same as that for the telescopic portion 121 of the second carriage, and is not described herein again.

It should be noted that, when the distance between the first carriage and the second carriage is adjusted, only the telescopic portion 111 of the first carriage and the fixed portion 112 of the first carriage or only the telescopic portion 121 of the second carriage and the fixed portion 122 of the second carriage may be adjusted, and this adjustment is simple and convenient. The telescopic part 111 of the first conveying frame and the fixed part 112 of the first conveying frame, and the telescopic part 121 of the second conveying frame and the fixed part 122 of the second conveying frame can be adjusted at the same time, and the adjusting mode can ensure that the central line between the first conveying frame and the second conveying frame is always unchanged before and after adjustment, is convenient for the central line to be unchanged when the material basket is in butt joint every time, and is beneficial to butt joint.

In order to determine whether the silicon wafer taking device smoothly takes the silicon wafer out of the material basket each time, a third sensor 130 may be further disposed on the silicon wafer taking device, the third sensor 130 is disposed parallel to the first sensor 110, and a distance between the third sensor 130 and the first sensor 110 is greater than a side length of the silicon wafer on the carrying surface along the conveying direction.

Of course, the third sensor 130 is not limited to determining whether the silicon wafer taking device takes out the silicon wafers from the material basket smoothly, and may count the number of the silicon wafers taken out each time. Whether the silicon wafer is taken out smoothly is judged, and the judgment can be carried out according to the speed of taking the silicon wafer and the time difference of two times of induction of taking the silicon wafer; the number of silicon wafers taken out can be determined by the number of times of each induction.

It should be noted that, the distance between the third sensor 130 and the first sensor 110 is greater than the length of the side of the silicon wafer on the carrying surface along the conveying direction, and the optimal distance is slightly greater than the length of the side of the silicon wafer on the carrying surface along the conveying direction, because it is required to ensure that the silicon wafer is separated from the material basket when the third sensor 130 senses the silicon wafer, and to eliminate the situation that the silicon wafer is conveyed for an excessively long distance after being taken out from the material basket and then conveyed, and a deviation occurs during the conveying process.

In addition, the third sensor 130 and the second sensor 120 are arranged in parallel to achieve the above-described object.

In the present application, the first sensor 110, the second sensor 120, and the third sensor 130 are mounted at positions that are exposed to the outside of the first conveyor belt 11, the second conveyor belt 12, and the third conveyor belt 13 and are not blocked by the first conveyor belt 11, the second conveyor belt 12, and the third conveyor belt 13.

When the silicon wafer in the material basket is taken by the taking device, if the silicon wafer is required to be taken at a high speed, the problem that the friction force between the silicon wafer and the conveying belt is too small and the silicon wafer is easy to slip can occur, so that the production is influenced. In order to solve the problem, can also all seted up adsorption hole 113 on first conveyer belt 11 and second conveyer belt 12, adsorption hole 113 intercommunication adsorption equipment, adsorption equipment gets piece speed according to the difference and provides the not negative pressure of equidimension to adsorption hole 113, when getting the piece, get the piece after the homoenergetic to the silicon chip on the conveyer belt have suitable absorption, when guaranteeing to get the piece and get the piece after the frictional force between silicon chip and the conveyer belt at a suitable within range, thereby improve and get piece efficiency.

In order to increase the contact area between the silicon wafer and the conveying surface and increase the friction area, so that the silicon wafer can be more stably and reliably supported on the conveying surface, and the probability that the silicon wafer slips or breaks away from the conveying surface is reduced, in some embodiments, the silicon wafer taking device may further include a third conveying belt 13, the third conveying belt 13 is arranged between the first conveying belt 11 and the second conveying belt 12 in parallel, and the conveying surface and the conveying surfaces of the first conveying belt 11 and the second conveying belt 12 are located on the same horizontal plane.

For the mounting of the third conveyor belt reference is made to the first conveyor belt 11 and the second conveyor belt 12, i.e. the third conveyor belt 13 is wound on a third conveyor frame, which also comprises a telescopic part 131 of the third conveyor frame and a fixed part 132 of the third conveyor frame, as the first conveyor frame and the second conveyor frame. In contrast, the fixing portion 132 of the third carriage may not be adjustably provided, and may be directly fixedly mounted on the base 10.

As for the driving manner of the first conveyor belt 11, the second conveyor belt 12 and the third conveyor belt 13, the driving manner can be driven by a stepping motor 14, as shown in fig. 2, the stepping motor 14 is fixedly installed on the base 10 and is in transmission connection with the first conveyor belt 11, the second conveyor belt 12 and the third conveyor belt 13, so as to drive the first conveyor belt 11, the second conveyor belt 12 and the third conveyor belt 13 to synchronously operate.

In order to better cooperate with the material basket to take the wafer, as shown in fig. 1, the silicon wafer taking device may further include a material basket operating device 18, the material basket operating device 18 is butted with the wafer taking end a, the material basket operating device 18 is installed on the lifting module 19, and the material basket operating device 18 is adjusted in a lifting manner relative to the wafer taking end.

Through the cooperation of the material basket operating device 18 and the lifting module 19, the silicon wafer taking action is realized, and the requirement on the height change of the material basket during the silicon wafer taking is met.

Optionally, the lifting module 19 is installed on the traverse module 2, so as to realize the lifting and the traverse of the basket operating device 18. The lifting module 19 and the transverse moving module 2 can adopt a motor and a screw nut structure to realize the lifting and transverse moving functions.

Install lift module 19 on sideslip module 2, because the silicon chip gets piece device 1 and also installs on sideslip module 2, consequently can realize the sideslip motion that basket operating device 18 and silicon chip got piece device 1 in step, through the sideslip of sideslip module 2, can be with the silicon chip sideslip after getting the piece to the station that needs the butt joint.

Specifically, as shown in fig. 5 and 6 with respect to the basket operation means 18, the basket operation means 18 includes a riser 180, a clip structure, and a claw structure. The clamping structure comprises two pairs of first clamping 181 and second clamping 182, the first clamping 181 and the second clamping 182 are symmetrically arranged on two sides of the vertical plate 180, the position of the second clamping is manually adjusted, and the position of the first clamping is adjusted by driving of an air cylinder or an electric cylinder. Of course, the first clip 181 and the second clip 182 may be driven by an air cylinder or an electric cylinder. In addition, the clamping structure can be a pair, or three or more pairs, and can be selected according to actual production requirements.

The first clamping clips 181 and the second clamping clips 182 can be synchronously adjusted reversely relative to two sides of the vertical plate to clamp and release the material basket, namely, the first clamping clips 181 and the second clamping clips 182 can be adjusted to move away from and close to each other relative to a central line, and the moving directions are reversed when the first clamping clips 181 and the second clamping clips 182 move away from or close to each other.

The first clamping 181 and the second clamping 182 can synchronously carry out reverse adjustment relative to two sides of the vertical plate, the first clamping 181 and the second clamping 182 can be synchronously adjusted relative to a central line, not only can the first clamping 181 and the second clamping 182 be compatible with baskets with different sizes, but also the central line between the first conveying belt 11 and the second conveying belt 12 corresponding to the silicon wafer taking device can be better kept corresponding relative to a central line adjusting mode, and the silicon wafer taking device is more convenient to adjust when silicon wafers with different sizes are compatible.

In the conventional silicon wafer taking production, after the first clip 181 and the second clip 182 clip the material basket, the material basket operating device 18 will clip the material basket to perform an operation of turning over 90 degrees, and the material basket operating device 18 shown in fig. 5 is rotated 90 degrees after clipping the material basket (fig. 5 does not show a structural schematic diagram of the material basket). In the process of 90-degree rotation after the first clamp 181 and the second clamp 182 clamp the basket, the basket may tip over, which may damage the silicon wafers in the basket.

As shown in FIG. 5, in order to avoid the possibility of the basket tipping when the basket operation device 18 is turned over, the basket operation device 18 further comprises a claw structure, the claw structure comprises a claw 184 and a support block 183, and the claw 184 is arranged on the top of the vertical plate 180 and used for clamping the basket. The supporting block 183 is arranged at the bottom of the vertical plate 180 and used for being matched with the clamping jaw to lift and support the material basket. Through addding the jack catch structure, can be at the in-process of material basket operating means 18 upset, through jack catch 184 and the cooperation of dragging block 183, with the vertical direction of clamping structure clamping power, exert a card power of grabbing again to the material basket, prevent that the material basket from taking place to overturn at the in-process of upset, damaging the silicon chip.

For the embodiment of the jaw structure, the following may be used:

the jaw structure further comprises a first air cylinder 185 and a connecting rod 186, the first air cylinder 185 is fixedly arranged on the vertical plate 180, the driving end of the first air cylinder 185 is rotatably connected with one end of the connecting rod 186, the other end of the connecting rod 186 is rotatably connected with the jaw 184, and the jaw 184 is driven to turn over to clamp and release the material basket.

The working principle of the silicon wafer taking device is as follows:

referring to fig. 1 and 2, a basket is fully loaded on the basket operating device 18, and after the basket operating device 18 is rotated by 90 degrees, the placing position of the basket meets the slice taking requirement;

the telescopic part 111 of the first conveying frame and the telescopic part 121 of the second conveying frame of the silicon wafer taking device 1 extend into the material basket operating device 18 under the driving of the rodless cylinder 17, so that the wafer taking end A of the silicon wafer taking device 1 is positioned below the material basket clamped by the material basket operating device 18.

The lifting module 19 controls the material basket operating device 18 to descend for a preset distance, so that a first silicon wafer at the lowest position in the material basket (the first silicon wafer is the lowest silicon wafer in the material basket, and a second silicon wafer and a third silicon wafer … … are sequentially arranged upwards) is lapped on the wafer taking end A and is taken out outwards along with the conveying belt 11 and the conveying belt 12;

the lifting module 19 controls the material basket operating device 18 to descend for a preset distance again, and a second silicon wafer at the lowest position in the material basket is lapped on the wafer taking end A and taken out along with the conveying belt 11 and the conveying belt 12;

the lifting module 19 controls the material basket operating device 18 to descend for a preset distance again, and a third silicon wafer at the lowest position in the material basket is lapped on the wafer taking end A and taken out along with the conveying belt 11 and the conveying belt 12;

……

until all the silicon chips in the material basket are taken out. The size of the predetermined distance for the basket manipulator 18 is related to the thickness of the slots for holding silicon wafers in different baskets.

It is to be understood by one of ordinary skill in the art that the specific structures and processes shown in the detailed description are exemplary only and not limiting. Moreover, the various technical features shown in the above description can be combined in various possible ways to form new technical solutions, or other modifications can be made by those skilled in the art, and all fall within the scope of the present invention.

Claims

1. A silicon wafer taking device is used for picking up a silicon wafer from a material basket, and is characterized by comprising: a first conveyor belt and a second conveyor belt;

the first conveying belt is wound on a first conveying frame, a first sensor is arranged on the side edge of the first conveying frame, and the first sensor is positioned at the wafer taking end of the silicon wafer taking device;

the second conveying belt is arranged in parallel to the first conveying belt, and the conveying surface of the first conveying belt and the conveying surface of the second conveying belt are positioned on the same plane and form a bearing surface for bearing the silicon wafers together; the second conveying belt is wound on a second conveying frame, a second sensor is arranged on the side edge of the second conveying frame, and the second sensor is positioned at the wafer taking end of the silicon wafer taking device;

2. The silicon wafer taking apparatus as defined in claim 1,

the silicon wafer taking device is further provided with a third sensor, the third sensor is parallel to the first sensor, and the distance between the third sensor and the first sensor is larger than the side length of the silicon wafer on the bearing surface along the conveying direction.

3. The silicon wafer taking device according to claim 1, wherein the first carriage and the second carriage each comprise a telescopic portion and a fixed portion, the telescopic portion being mounted on a connection plate, the connection plate being movably disposed on a base;

4. The silicon wafer taking device according to claim 3, wherein the fixed part of the first carriage is mounted on the base through a first bracket, the fixed part of the second carriage is mounted on the base through a second bracket, the first bracket and the second bracket are provided with strip-shaped holes, the positions of the first bracket and the second bracket on the base are adjusted through the strip-shaped holes, and the length extension direction of the strip-shaped holes is perpendicular to the conveying direction of the first conveying belt and the second conveying belt;

the telescopic parts of the first conveying frame and the second conveying frame are both arranged on the connecting plate through equal-height blocks, waist-shaped holes are formed in the end parts, connected with the equal-height blocks, of the telescopic parts of the first conveying frame and the second conveying frame, and the length extension direction of the waist-shaped holes is perpendicular to the conveying direction of the first conveying belt and the second conveying belt.

5. The silicon wafer taking device according to claim 1, wherein the first conveyor belt and the second conveyor belt are both provided with adsorption holes, and the adsorption holes are communicated with an adsorption device.

6. The silicon wafer taking device according to claim 1, further comprising a basket operating device and a lifting module, wherein the basket operating device is in butt joint with the wafer taking end, the basket operating device is mounted on the lifting module, and the basket operating device is adjustable in a lifting manner relative to the wafer taking end.

7. The silicon wafer taking device as claimed in claim 6, wherein the basket operating device comprises a vertical plate, a clamping structure and a clamping claw structure, the clamping structure comprises at least one pair of a first clamping and a second clamping, and the first clamping and the second clamping are symmetrically arranged on two sides of the vertical plate to clamp and release the basket; the clamping jaw structure comprises a clamping jaw and a supporting block, the clamping jaw is arranged at the top of the vertical plate and used for clamping the material basket, and the supporting block is arranged at the bottom of the vertical plate and used for being matched with the clamping jaw to lift and support the material basket.

8. The silicon wafer taking device according to claim 7, wherein the first clamp and the second clamp are synchronously and reversely adjustable relative to two sides of the vertical plate; and/or the presence of a gas in the gas,

the clamping jaw structure further comprises a first air cylinder and a connecting rod, the first air cylinder is fixedly arranged on the vertical plate, the driving end of the first air cylinder is connected with one end of the connecting rod in a rotating mode, the other end of the connecting rod is connected with the clamping jaw in a rotating mode, and the clamping jaw is driven to overturn so as to achieve clamping and releasing of the material basket.

9. The silicon wafer taking device according to claim 1, further comprising a third conveyor belt disposed between the first conveyor belt and the second conveyor belt, wherein a conveying surface is located on the same horizontal plane as the conveying surfaces of the first conveyor belt and the second conveyor belt, and the first conveyor belt, the second conveyor belt, and the third conveyor belt are driven by a stepping motor.

10. A silicon wafer loading apparatus, comprising a traverse module and two silicon wafer taking devices according to any one of claims 1 to 9, wherein the two silicon wafer taking devices are arranged in parallel on the traverse module, and the traverse module drives the two silicon wafer taking devices to synchronously traverse.