CN216698409U

CN216698409U - LED drive chip packaging structure

Info

Publication number: CN216698409U
Application number: CN202123313547.1U
Authority: CN
Inventors: 杨星波
Original assignee: Ningbo Guangji Lighting Technology Co ltd
Current assignee: Ningbo Guangji Lighting Technology Co ltd
Priority date: 2021-12-27
Filing date: 2021-12-27
Publication date: 2022-06-07
Anticipated expiration: 2031-12-27

Abstract

The utility model discloses an LED driving chip packaging structure which comprises a packaging substrate, wherein a supporting block is arranged at the top of the packaging substrate, an LED chip main body is arranged at the upper end of the supporting block, a through hole is formed in the packaging substrate, a welding flux layer is arranged at the upper end of the through hole, a sealing sticking ring is arranged in the through hole, the upper end of the welding flux layer is connected with the LED chip main body, a sealing plug rod is inserted in the packaging substrate, a current-limiting groove is formed in the surface of the sealing plug rod, and the outer wall of the sealing plug rod is sleeved with the sealing sticking ring. According to the LED driving chip packaging structure, the supporting block is arranged at the top of the packaging substrate, the LED chip main body is placed at the top of the supporting block, and then the LED chip main body is welded with the packaging substrate through the through hole in the bottom of the packaging substrate, so that the packaging substrate and the LED chip main body are welded and fixed conveniently, meanwhile, the later-stage welding work for loosening between the packaging substrate and the LED chip main body is facilitated, and the connection firmness of the packaging substrate and the LED chip main body is improved.

Description

LED drive chip packaging structure

Technical Field

The utility model relates to the technical field of LED packaging equipment, in particular to an LED driving chip packaging structure.

Background

LED (semiconductor light emitting diode) packages refer to packages of light emitting chips, which are significantly different compared to integrated circuit packages; the packaging of the LED is required to not only protect the lamp wick, but also transmit light; therefore, the encapsulation of the LED has special requirements on the encapsulation material; the LED packaging technology is developed and evolved on the basis of the discrete device packaging technology, but has great particularity; typically, the die of the discrete device is encapsulated within a package, the role of which is primarily to protect the die and to complete the electrical interconnections; and the LED package finishes outputting an electric signal to protect the tube core to normally work and outputs: the function of visible light, both electrical and optical parameters, is a design and technical requirement, and the packaging of discrete devices cannot be simply applied to LEDs; the high-power LED packaging structure and the process are complex, and the service performance and the service life of the LED are directly influenced, and particularly the high-power white light LED packaging is a hotspot in research; the functions of the LED package mainly include: 1. mechanical protection to improve reliability; 2. the heat dissipation is enhanced to reduce the junction temperature of the chip and improve the performance of the LED; 3. optical control is performed, the light emitting efficiency is improved, and the light beam distribution is optimized; 4. power management, including ac/dc conversion, and power control, etc.

The LED chip is usually welded on a packaging substrate by using a welding flux in the current LED chip packaging, the welding flux is easy to loose after being used for a long time, and the current LED chip is packaged by using glue after being welded and fixed by using the welding flux, so that the maintenance and the replacement are inconvenient, and the improvement is needed.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide an LED driving chip packaging structure, which solves the problem that an LED chip is inconvenient to repair and replace at the later stage after being welded and fixed by using a solder in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme that the LED driving chip packaging structure comprises a packaging substrate, wherein a supporting block is arranged at the top of the packaging substrate, an LED chip main body is arranged at the upper end of the supporting block, a through hole is formed in the packaging substrate, a solder layer is arranged at the upper end of the through hole, a sealing paste ring is arranged in the through hole, the upper end of the solder layer is connected with the LED chip main body, a sealing plug rod is inserted into the packaging substrate, a current-limiting groove is formed in the surface of the sealing plug rod, the outer wall of the sealing plug rod is sleeved with the sealing paste ring, and a limiting baffle is arranged at the bottom of the sealing plug rod.

Preferably, the bottom of the packaging substrate is provided with a first protective layer, and the first protective layer is made of an anti-corrosion coating.

Preferably, a second protective layer is arranged at the bottom of the first protective layer, and the second protective layer is made of waterproof paint.

Preferably, the left side and the right side of the solder layer are respectively provided with a positive electrode pin and a negative electrode pin, and the positive electrode pin and the negative electrode pin are provided with light-transmitting protective covers.

Preferably, the light-transmitting protective cover is sleeved on the outer wall of the LED chip main body, a packaging light-transmitting layer is arranged on the light-transmitting protective cover, the anode pin and the cathode pin, and the packaging light-transmitting layer is made of epoxy resin.

Preferably, the support supporting blocks are distributed in a bilateral symmetry mode about a bisector of the LED chip main body, and the lower ends of the support supporting blocks are welded and fixed with the packaging substrate.

Compared with the prior art, the utility model has the beneficial effects that: according to the LED driving chip packaging structure, the supporting block is arranged at the top of the packaging substrate, the LED chip main body is placed at the top of the supporting block, and then the LED chip main body is welded with the packaging substrate through the through hole in the bottom of the packaging substrate, so that the packaging substrate and the LED chip main body are welded and fixed conveniently, meanwhile, the later-stage welding work for loosening between the packaging substrate and the LED chip main body is facilitated, and the connection firmness of the packaging substrate and the LED chip main body is improved.

Drawings

Fig. 1 is a schematic structural diagram of an LED driver chip package structure according to the present invention;

FIG. 2 is an enlarged schematic view of a portion A of a packaging structure diagram of an LED driving chip in FIG. 1 according to the present invention;

fig. 3 is a front view of a sealing adhesive ring of an LED driving chip package structure according to the present invention.

In the figure: 1. the LED packaging structure comprises a packaging substrate, 2, a first protective layer, 3, a second protective layer, 4, an anode pin, 5, a packaging light transmission layer, 6, a solder layer, 7, a light transmission protective cover, 8, an LED chip main body, 9, a supporting block, 10, a cathode pin, 11, a limiting baffle, 12, a current limiting groove, 13, a sealing adhesive ring, 14 and a sealing plug rod.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: an LED driving chip packaging structure comprises a packaging substrate 1, wherein a supporting block 9 is arranged at the top of the packaging substrate 1, the packaging substrate 1 and the supporting block 9 are fixedly welded, an LED chip main body 8 is arranged at the upper end of the supporting block 9, the supporting block 9 and the LED chip main body 8 are not fixedly contacted, a first protective layer 2 is arranged at the bottom of the packaging substrate 1, the first protective layer 2 is coated at the bottom of the packaging substrate 1, and the first protective layer 2 is made of an anticorrosive coating; the bottom of the first protective layer 2 is provided with a second protective layer 3, the bottom of the first protective layer 2 is coated with the second protective layer 3, and the second protective layer 3 is made of waterproof paint, so that the second protective layer 3 and the first protective layer 2 can play a role in corrosion prevention and water prevention on the packaging substrate 1; the supporting support blocks 9 are distributed in a bilateral symmetry mode about a bisector of the LED chip main body 8, and the lower ends of the supporting support blocks 9 are welded and fixed with the packaging substrate 1; a through hole is formed in the package substrate 1, a solder layer 6 is arranged at the upper end of the through hole, the solder layer 6 is arranged between the package substrate 1 and the LED chip main body 8, the package substrate 1 and the LED chip main body 8 are fixedly welded, a sealing paste ring 13 is arranged in the through hole, the sealing paste ring 13 is made of silica gel, the lower end of the sealing paste ring 13 is fixed with the package substrate 1 through glue, the sealing paste ring 13 is in a trapezoid structure, the upper end of the solder layer 6 is connected with the LED chip main body 8, the left side and the right side of the solder layer 6 are respectively provided with an anode pin 4 and a cathode pin 10, the solder layer 6 on the left side of the bottom of the LED chip main body 8 is welded with the anode pin 4, the solder layer 6 on the right side of the bottom of the LED chip main body 8 is welded with the cathode pin 10, and the anode pin 4 and the cathode pin 10 are provided with light-transmitting shields 7; the light-transmitting protective cover 7 is sleeved on the outer wall of the LED chip main body 8, the light-transmitting protective cover 7, the anode pin 4 and the cathode pin 10 are provided with the packaging light-transmitting layer 5, the packaging light-transmitting layer 5 is made of epoxy resin, the epoxy resin can play a role in sealing, and meanwhile, the light-transmitting property of the LED chip main body 8 can also be ensured; a sealing plug rod 14 is inserted into the packaging substrate 1, the sealing plug rod 14 can seal a through hole on the packaging substrate 1, so that a waterproof effect is achieved, meanwhile, later-stage welding work can be facilitated, a current-limiting groove 12 is formed in the surface of the sealing plug rod 14, the sealing plug rod 14 and the current-limiting groove 12 are integrally connected, a sealing paste ring 13 is sleeved on the outer wall of the sealing plug rod 14, the sealing paste ring 13 can prevent water from entering the welding flux layer 6 through the sealing plug rod 14, a limiting baffle 11 is arranged at the bottom of the sealing plug rod 14, and the sealing plug rod 14 and the limiting baffle 11 are fixed through glue; this LED driver chip packaging structure is through setting up support tray 9 at packaging substrate 1 top, through placing LED chip main part 8 at support tray 9 top, realize the welding of LED chip main part 8 and packaging substrate 1 through the through-hole of packaging substrate 1 bottom afterwards, not only be convenient for packaging substrate 1 and LED chip main part 8 welded fastening simultaneously also be convenient for later stage packaging substrate 1 and LED chip main part 8 between not hard up with the welding work from this, improve the fastness that packaging substrate 1 and LED chip main part 8 are connected.

The working principle is as follows: when the LED driving chip packaging structure is used, firstly, the device is simply known, after the understanding, important parts of the device are checked, the device is formally used after no problem is detected, when the LED driving chip packaging structure is used, an LED chip main body 8 is placed on a supporting support block 9 at the top of a packaging substrate 1, then the LED chip main body 8 is welded with the packaging substrate 1 by using a welding material layer 6, an anode pin 4 and a cathode pin 10 are respectively welded on the welding material layers 6 at the left side and the right side of the LED chip main body 8 in the process of welding the LED chip main body 8 and the packaging substrate 1, after the anode pin 4 and the cathode pin 10 are welded, a light-transmitting protective cover 7 is covered on the outer wall of the LED chip main body 8, finally, the light-transmitting protective cover 7, the welding material layer 6, the anode pin 4 and the cathode pin 10 are packaged together by using a packaging light-transmitting layer 5, if the welding material layer 6 is aged, the phenomenon of breaking with LED chip main part 8 appears, then can take out sealed cock stem 14 from packaging substrate 1 is inside, adds the welding work through the through-hole on packaging substrate 1 on original solder layer 6 afterwards, use sealed cock stem 14 to fill in packaging substrate 1 inside after the completion adds the welding work, make sealed sticking ring 13 cover establish sealed cock stem 14 outside, play waterproof effect, this is exactly this LED driver chip packaging structure's theory of operation.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that various changes in the embodiments and/or modifications of the utility model can be made, and equivalents and modifications of some features of the utility model can be made without departing from the spirit and scope of the utility model.

Claims

1. The utility model provides a LED driver chip packaging structure, includes packaging substrate (1), its characterized in that: packaging substrate (1) top is provided with supports tray (9), and supports tray (9) upper end and be provided with LED chip main part (8), the through-hole has been seted up on packaging substrate (1), and the through-hole upper end is provided with solder layer (6), and the through-hole is inside to be provided with sealed ring (13) of pasting, and solder layer (6) upper end is connected with LED chip main part (8), inside the inserting of packaging substrate (1) is equipped with sealed gag lever post (14), and sealed gag lever post (14) surface has seted up current-limiting groove (12), sealed gag lever post (14) outer wall cover is equipped with sealed ring (13) of pasting, and sealed gag lever post (14) bottom is provided with limit baffle (11).

2. The LED driving chip packaging structure of claim 1, wherein: the packaging substrate is characterized in that a first protective layer (2) is arranged at the bottom of the packaging substrate (1), and the first protective layer (2) is made of anticorrosive paint.

3. The LED driving chip packaging structure of claim 2, wherein: the bottom of the first protective layer (2) is provided with a second protective layer (3), and the second protective layer (3) is made of waterproof paint.

4. The LED driving chip packaging structure of claim 1, wherein: the left side and the right side of the solder layer (6) are respectively provided with a positive electrode pin (4) and a negative electrode pin (10), and the positive electrode pin (4) and the negative electrode pin (10) are provided with light-transmitting protective covers (7).

5. The LED driving chip packaging structure of claim 4, wherein: the LED chip is characterized in that the light-transmitting protective cover (7) is sleeved on the outer wall of the LED chip main body (8), a packaging light-transmitting layer (5) is arranged on the light-transmitting protective cover (7) and the anode pin (4) and the cathode pin (10), and the packaging light-transmitting layer (5) is made of epoxy resin.

6. The LED driving chip packaging structure of claim 1, wherein: the support supporting blocks (9) are distributed in a bilateral symmetry mode about the bisector of the LED chip main body (8), and the lower ends of the support supporting blocks (9) are welded and fixed with the packaging substrate (1).