CN210325850U

CN210325850U - Diode packaging structure

Info

Publication number: CN210325850U
Application number: CN201921583463.XU
Authority: CN
Inventors: 陈红梅; 陈荣荣
Original assignee: Suzhou Kuansheng Electronic Co Ltd
Current assignee: Suzhou Kuansheng Electronic Co Ltd
Priority date: 2020-03-04
Filing date: 2020-03-04
Publication date: 2020-04-14
Anticipated expiration: 2030-03-04

Abstract

The utility model discloses a diode packaging structure, including diode epoxy encapsulation shell, pin, LED chip, heat abstractor and silica gel pad, the inside of diode epoxy encapsulation shell is equipped with the LED chip, the bottom electric connection of LED chip distributes and has the pin, the inboard bottom of diode epoxy encapsulation shell bonds there is the silica gel pad, the both sides of diode epoxy encapsulation shell are equipped with heat abstractor, the inside medial extremity distribution of heat abstractor has pt100 temperature sensor, the outside electric connection of pt100 temperature sensor has controlling means, the outside distribution of heat abstractor has shutter fin structure, the medial extremity of diode epoxy encapsulation shell is equipped with the ceramic plate, the outside of ceramic plate is equipped with the aluminium foil layer, the outside of aluminium foil layer is equipped with the metal shielding layer for sealed buffering shock attenuation, waterproof dustproof, give off the heat, increase of service life, high temperature resistant is prevented scalding, static, stability is high are prevented in the shielding.

Description

Diode packaging structure

Technical Field

The utility model relates to a diode technical field specifically is a diode packaging structure.

Background

Diode packaging refers to the use of wire bonding of circuit pins on a silicon die to external connections for connection to other devices. In electronics, it not only plays a role in mounting, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also is connected to the pins of the package housing by wires through the contacts on the chip, and these pins are connected to other devices by wires on the printed circuit board, thereby realizing the connection of the internal chip with the external circuit. Because the chip must be isolated from the outside to prevent the electrical performance degradation caused by the corrosion of the chip circuit by impurities in the air.

The existing diode packaging structure cannot efficiently realize sealing shock absorption, water can enter dust, the service life and the use effect are shortened, the generated heat cannot efficiently monitor and achieve the purpose of intelligent heat dissipation, the diode packaging structure is easy to damage due to overhigh temperature and cannot resist high temperature, the electrostatic radiation intensity is high, the stability is poor, and the requirement of the existing diode packaging structure cannot be met.

SUMMERY OF THE UTILITY MODEL

Technical problem to be solved

An object of the utility model is to provide a diode packaging structure has solved the problem that proposes among the background art.

(II) technical scheme

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes: a diode packaging structure comprises a diode epoxy resin packaging shell, pins, an LED chip, a heat dissipation device and a silica gel pad, the LED chip is arranged in the diode epoxy resin packaging shell, pins are electrically connected and distributed at the bottom of the LED chip, the bottom of the inner side of the diode epoxy resin packaging shell is bonded with a silica gel pad, two sides of the diode epoxy resin packaging shell are provided with heat dissipation devices, a pt100 temperature sensor is distributed at the inner side end of the heat sink, a control device is electrically connected outside the pt100 temperature sensor, the outer part of the heat dissipation device is distributed with a shutter heat dissipation sheet structure, the inner side end of the diode epoxy resin packaging shell is provided with a ceramic plate, the outside of ceramic plate is equipped with the aluminium foil layer, the outside on aluminium foil layer is equipped with the metal shielding layer, the outside on metal shielding layer is equipped with the silica gel layer.

Preferably, the outer inner side end of the pin is sleeved with a sleeve block, and the sleeve block is bonded to the bottom of the diode epoxy resin packaging shell.

Preferably, the inner end of the top of the diode epoxy resin encapsulation shell is of a hollow structure, and the heat dissipation device is of a rectangular structure.

Preferably, the diode epoxy resin encapsulation shell is of a rectangular structure and is made of transparent plastic materials.

Preferably, the inner side ends of the louver radiating fin structures are electrically connected and distributed with rotating shafts, and sealing gaskets are bonded to the inner side ends of the louver radiating fin structures.

(III) advantageous effects

The utility model provides a diode packaging structure. The method has the following beneficial effects:

this diode packaging structure, through the silica gel pad that bonds in the inboard bottom of diode epoxy encapsulates the shell, make sealed buffering shock attenuation, it is waterproof dustproof, the stability factor is high, through the heat abstractor that sets up in diode epoxy encapsulates the shell both sides, can the efficient give off the heat, increase of service life, through the rotation of its inside pt100 temperature sensor that sets up and the control device intelligent control shutter fin structure open and dispel the heat, the problem of prior art can not intelligent high-efficient radiating is solved, through the ceramic plate that sets up at diode epoxy encapsulates the shell inside, the aluminium foil layer, metal shielding layer and silica gel layer, it prevents scalding to have high temperature resistant, the shielding prevents static, the high advantage of stability, reasonable in design.

Drawings

Fig. 1 is a schematic view of an overall structure of a diode package structure according to the present invention;

fig. 2 is a schematic diagram of an outer frame structure of a diode package structure according to the present invention;

fig. 3 is a schematic structural view of a heat dissipation device of a diode package structure according to the present invention.

In the figure: the LED packaging structure comprises a diode epoxy resin packaging shell 1, pins 2, an LED chip 3, a heat dissipation device 4, a silica gel pad 5, a sleeve block 6, a ceramic plate 7, an aluminum foil layer 8, a metal shielding layer 9, a silica gel layer 10, a pt100 temperature sensor 11, a louver heat dissipation structure 12 and a control device 13.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, an embodiment of the present invention provides a technical solution: a diode packaging structure comprises a diode epoxy resin packaging shell 1, pins 2, LED chips 3, a heat dissipation device 4 and a silica gel pad 5, wherein the LED chips 3 are arranged inside the diode epoxy resin packaging shell 1, the pins 2 are electrically connected and distributed at the bottoms of the LED chips 3, the silica gel pad 5 is bonded at the bottom of the inner side of the diode epoxy resin packaging shell 1, the heat dissipation device 4 is arranged on two sides of the diode epoxy resin packaging shell 1, a pt100 temperature sensor 11 is distributed at the inner side end of the heat dissipation device 4, a control device 13 is electrically connected outside the pt100 temperature sensor 11, a shutter heat dissipation structure 12 is distributed outside the heat dissipation device 4, a ceramic plate 7 is arranged at the inner side end of the diode epoxy resin packaging shell 1, an aluminum foil layer 8 is arranged outside the ceramic plate 7, and a metal shielding layer 9 is arranged outside the aluminum foil layer 8, and a silica gel layer 10 is arranged outside the metal shielding layer 9.

The sleeve block 6 is sleeved at the inner side end of the outer portion of the pin 2, the sleeve block 6 is bonded to the bottom of the diode epoxy resin packaging shell 1, the probability that an anode pin and a cathode pin of the diode are broken from the root is effectively reduced, and the structural strength is enhanced.

The diode epoxy resin encapsulation shell 1 is characterized in that the inner end of the top of the diode epoxy resin encapsulation shell is of a hollow structure, the heat dissipation device 4 is of a rectangular structure, the inside of the diode epoxy resin encapsulation shell can be observed conveniently and directly, the intensity is high, and the heat dissipation effect is good.

Diode epoxy encapsulates shell 1 and is the rectangle structure, diode epoxy encapsulates shell 1 and is transparent plastics material, and the design novel structure, it is with low costs.

The inner side ends of the louver radiating fin structures 12 are all electrically connected and distributed with rotating shafts, and sealing gaskets are bonded on the inner side ends of the louver radiating fin structures 12, so that sealing and fastening are facilitated when the louver radiating fin structures are closed.

The working principle is as follows: silica gel pad 5 that the inboard bottom of diode epoxy encapsulates 1 inboard bottom bonding makes sealed buffering shock attenuation, it is waterproof dustproof, the stability factor is high, heat abstractor 4 of diode epoxy encapsulates 1 both sides gives off the heat through the shutter fin structure 12 of outer end, increase of service life, through the inside pt100 temperature sensor 11 real-time supervision temperature of heat abstractor 4, pt100 temperature sensor 11 thermal resistance sensor, convert temperature variable into the standardized output signal that can convey, start controlling means 13 intelligent control shutter fin structure 12 and rotate and open and dispel the heat when the temperature reaches the setting value, the inside ceramic plate 7 of diode epoxy encapsulates 1, aluminium foil layer 8, metal shielding layer 9 and silica gel layer 10 are high temperature resistant to prevent scalding, static is prevented in the shielding, stability is high.

The utility model discloses a diode epoxy resin encapsulation shell 1, pin 2, LED chip 3, heat abstractor 4, silica gel pad 5, cover block 6, ceramic plate 7, aluminium foil layer 8, metal shielding layer 9, silica gel layer 10, pt100 temperature sensor 11, shutter fin structure 12, controlling means 13, the part is general standard component or the part that technical staff in this field knows, its structure and principle all can be known through the technical manual or through conventional experimental method, the problem that the utility model solves is that the current diode encapsulation structure can not high-efficient sealed shock attenuation, can cause the entering water to get into the dust, shortens service life and result of use, the heat that produces can not high-efficiently monitor and reaches the purpose of intelligent heat dissipation, easy high temperature damage, can not endure high temperature, the static radiation intensity is high, poor stability, the problem such as being difficult to satisfy the demand of the current diode encapsulation structure, the utility model discloses a combination of each other of above-mentioned part, this diode packaging structure, silica gel pad through bonding in the inboard bottom of diode epoxy encapsulation shell, make sealed buffering shock attenuation, it is waterproof dustproof, the stability factor is high, through the heat abstractor who sets up in diode epoxy encapsulation shell both sides, can the efficient give off the heat, increase of service life, pt100 temperature sensor and the control device intelligence through its inside setting control shutter fin structure rotate to open and dispel the heat, the problem of prior art can not intelligent high-efficient radiating is solved, through the ceramic plate at the inside setting of diode epoxy encapsulation shell, the aluminium foil layer, metal shielding layer and silica gel layer, have high temperature resistant, prevent scalding, the shielding is prevented static, the high advantage of stability, reasonable in design.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. A diode packaging structure is characterized in that: the LED packaging structure comprises a diode epoxy resin packaging shell (1), pins (2), LED chips (3), heat dissipation devices (4) and a silica gel pad (5), wherein the LED chips (3) are arranged inside the diode epoxy resin packaging shell (1), the pins (2) are electrically connected and distributed at the bottoms of the LED chips (3), the silica gel pad (5) is bonded at the bottom of the inner side of the diode epoxy resin packaging shell (1), the heat dissipation devices (4) are arranged on two sides of the diode epoxy resin packaging shell (1), pt100 temperature sensors (11) are distributed at the inner side ends of the heat dissipation devices (4), a control device (13) is electrically connected to the outer parts of the pt100 temperature sensors (11), louver heat dissipation structures (12) are distributed on the outer parts of the heat dissipation devices (4), and a ceramic plate (7) is arranged at the inner side ends of the diode epoxy resin packaging shell (1), the outside of ceramic plate (7) is equipped with aluminium foil layer (8), the outside of aluminium foil layer (8) is equipped with metallic shield layer (9), the outside of metallic shield layer (9) is equipped with silica gel layer (10).

2. The diode package structure of claim 1, wherein: the outer inner side end of the pin (2) is sleeved with a sleeve block (6), and the sleeve block (6) is bonded to the bottom of the diode epoxy resin packaging shell (1).

3. The diode package structure of claim 1, wherein: the inner end of the top of the diode epoxy resin packaging shell (1) is of a hollow structure, and the heat dissipation device (4) is of a rectangular structure.

4. The diode package structure of claim 1, wherein: the diode epoxy resin packaging shell (1) is of a rectangular structure, and the diode epoxy resin packaging shell (1) is made of transparent plastic materials.

5. The diode package structure of claim 1, wherein: the inner side ends of the louver radiating fin structures (12) are electrically connected and distributed with rotating shafts, and sealing gaskets are bonded to the inner side ends of the louver radiating fin structures (12).