CN216648278U

CN216648278U - Dry type encapsulating structure for high-voltage device

Info

Publication number: CN216648278U
Application number: CN202220226955.9U
Authority: CN
Inventors: 黄福庭; 严建春; 孙铁钢; 方淑辉; 胡明生; 孟勇
Original assignee: Qingdao Rui Yang Electronics Co ltd
Current assignee: Qingdao Rui Yang Electronics Co ltd
Priority date: 2022-01-27
Filing date: 2022-01-27
Publication date: 2022-05-31
Anticipated expiration: 2032-01-27

Abstract

The utility model discloses a dry type encapsulating structure of a high-voltage device, and particularly relates to the field of power electronic conversion. According to the utility model, the encapsulation cavity is encapsulated by adopting the silicon rubber body, and the first heat dissipation alumina ceramic plate, the second heat dissipation alumina ceramic plate and the third heat dissipation alumina ceramic plate are embedded on the heat dissipation surface at the same time, so that the high-voltage component is encapsulated, and the high-voltage component has reliable insulating capability and good heat dissipation capability.

Description

Dry type encapsulating structure for high-voltage device

Technical Field

The utility model relates to the field of power electronic conversion, in particular to a dry type encapsulating structure of a high-voltage device.

Background

The radar transmitter, the medical X-ray machine and other equipment need DC voltage of several KV to several hundred KV. To prevent arcing and breakdown in air, and to protect against personal safety, high voltage components such as high voltage transformers, rectifier stacks, filter capacitors, modulators, filament grid bias supplies, etc., need to be hermetically insulated. The current sealing and insulating method is mainly to put the components in a sealed oil tank and soak the components in insulating oil, which is called wet sealing. The insulating oil has the advantages that the insulating oil can provide the electric strength of dozens of KV per millimeter, and has reliable insulating capability; and the oil liquid is heated and flows, and the oil liquid has better heat dissipation capacity through convection. This method also has a number of disadvantages: the volume and the weight are large; after long-time use, the oil insulation is reduced; the oil leakage causes pollution; insulation sharply decreases at low temperature; the maintenance or oil supplement is carried out by heating, dehumidifying and filtering with special equipment. In order to solve the problems, in recent years, people try to perform dry sealing by using high polymer materials such as epoxy resin, silicon rubber and the like, but although the electric resistance of the high polymer materials can also reach ten to twenty-several KV per millimeter, the heat dissipation coefficient is only 0.3-0.8, the insulation problem is solved, and the problem of poor heat dissipation is solved. There is a method of adding silica powder or alumina powder to silica gel or epoxy resin to improve the thermal conductivity. An excessively large proportion of the fine silica powder or alumina powder causes brittleness and decreases in insulation. The existing dry encapsulation is adopted for a high-voltage component with larger power consumption, and the contradiction between insulation and heat dissipation can not be solved, so a dry encapsulation structure of a high-voltage device is needed.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above defects in the prior art, the present invention provides a dry encapsulation structure for high-voltage devices, which encapsulates a high-voltage component by using a silicon rubber body to encapsulate an encapsulation cavity, and simultaneously embeds a first heat-dissipating alumina ceramic plate, a second heat-dissipating alumina ceramic plate, and a third heat-dissipating alumina ceramic plate on a heat-dissipating surface, so that the high-voltage component has reliable insulating capability and good heat-dissipating capability, thereby solving the problems in the background art.

In order to achieve the purpose, the utility model provides the following technical scheme: high-pressure device dry-type embedment structure, including high-pressure device main part, high-pressure device main part includes protecting sheathing, the inside embedment chamber that is equipped with of protecting sheathing, embedment intracavity portion is filled has the silicon rubber body, embedment intracavity portion is equipped with first heat dissipation alumina ceramic plate, second heat dissipation alumina ceramic plate and third heat dissipation alumina ceramic plate, second heat dissipation alumina ceramic plate is located between first heat dissipation alumina ceramic plate and the third heat dissipation alumina ceramic plate, first heat dissipation alumina ceramic plate is located third heat dissipation alumina ceramic plate front side, first heat dissipation alumina ceramic plate, second heat dissipation alumina ceramic plate and third heat dissipation alumina ceramic plate are all fixed to be inlayed inside the silicon rubber body, first heat dissipation alumina ceramic plate front side is equipped with high voltage component.

In a preferred embodiment, the high voltage assembly comprises a plurality of diode main bodies, the diode main bodies are arranged at even intervals, the diode main bodies are all arranged in the encapsulating cavity, the diode main bodies are all fixedly embedded in the silicon rubber body, and the arrangement of the diodes is convenient for protecting current so that the situation of load can not occur.

In a preferred embodiment, the top end and the bottom end of the protective shell are both fixedly provided with installation pipes, and the high-voltage lead is convenient to fix and the stability of the high-voltage lead is improved through the installation pipes.

In a preferred embodiment, protective housing top and bottom all are equipped with the high-voltage lead wire, the high-voltage lead wire is located the installation intraductal, the one end that the high-voltage lead wire is close to protective housing runs through protective housing and extends to inside the protective housing, the one end that the high-voltage lead wire is close to protective housing is fixed to be inlayed inside the silicon rubber body, through the setting of high-voltage lead wire, is convenient for be connected with external equipment.

In a preferred embodiment, the rear side of the protective casing is provided with a heat dissipation plate, the rear end of the protective casing is sleeved outside the heat dissipation plate, the outer wall of the heat dissipation plate is fixedly connected with the inner wall of the protective casing, the heat dissipation plate is fixedly connected with the rear side of the silicon rubber body, the protective casing is conveniently sealed integrally through the arrangement of the heat dissipation plate, and meanwhile, the heat of the silicon rubber body can be absorbed and conducted to the outside for heat dissipation, so that the heat dissipation effect of the utility model is improved.

In a preferred embodiment, a plurality of radiating fins are fixedly arranged on the rear side of the radiating plate, the radiating fins are arranged at uniform intervals, and heat of the radiating plate is conveniently conducted and radiated through the arrangement of the radiating fins.

In a preferred embodiment, the same heat insulating board is arranged on the front sides of the diode main bodies, a plurality of high-voltage capacitors are arranged on the front sides of the heat insulating boards at equal intervals, the heat insulating boards and the high-voltage capacitors are embedded in the silicon rubber body, and heat is conveniently blocked by the heat insulating boards, so that heat insulation performance is improved.

The utility model has the technical effects and advantages that:

according to the utility model, the encapsulation cavity is encapsulated by adopting the silicon rubber body, and the high-voltage component is encapsulated by the structural design that the first heat dissipation alumina ceramic plate, the second heat dissipation alumina ceramic plate and the third heat dissipation alumina ceramic plate are embedded on the heat dissipation surface, so that the high-voltage component has reliable insulating capability and good heat dissipation capability, and meanwhile, the volume and the weight are reduced by multiple times; the packaging shape is not limited; the problem of pollution caused by oil leakage and oil leakage is solved, the high-voltage device can be packaged in a modularized manner, and the maintainability is improved; the whole structure can balance the contradiction between insulation and heat dissipation, and can meet the heat dissipation requirement of a high-voltage device.

Drawings

FIG. 1 is a front view of the overall structure of the present invention;

FIG. 2 is a side cross-sectional view of the protective housing of the present invention;

FIG. 3 is a top cross-sectional view of the protective housing of the present invention;

FIG. 4 is a side cross-sectional view of the high voltage capacitor of the present invention;

fig. 5 is a side cross-sectional view of the potting chamber of the present invention.

The reference signs are: 1. a high voltage device body; 2. a protective housing; 3. encapsulating the cavity; 4. a silicone rubber body; 5. a first heat dissipating alumina ceramic plate; 6. a second heat dissipating alumina ceramic plate; 7. a third heat-dissipating alumina ceramic plate; 8. a diode body; 9. installing a pipe; 10. a high voltage lead; 11. a heat dissipation plate; 12. a heat sink; 13. a heat insulation plate; 14. a high voltage capacitor.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to the attached drawings 1-5 in the specification, the dry-type encapsulation structure for the high-voltage device of the embodiment comprises a high-voltage device main body 1, wherein the high-voltage device main body 1 comprises a protective shell 2, an encapsulation cavity 3 is arranged inside the protective shell 2, a silicon rubber body 4 is filled inside the encapsulation cavity 3, a first heat dissipation alumina ceramic plate 5, a second heat dissipation alumina ceramic plate 6 and a third heat dissipation alumina ceramic plate 7 are arranged inside the encapsulation cavity 3, the second heat dissipation alumina ceramic plate 6 is positioned between the first heat dissipation alumina ceramic plate 5 and the third heat dissipation alumina ceramic plate 7, the first heat dissipation alumina ceramic plate 5 is positioned at the front side of the third heat dissipation alumina ceramic plate 7, and the first heat dissipation alumina ceramic plate 5, the second heat dissipation alumina ceramic plate 6 and the third heat dissipation alumina ceramic plate 7 are all fixedly embedded inside the silicon rubber body 4, the high-voltage assembly is arranged on the front side of the first radiating alumina ceramic plate 5 and comprises a plurality of diode main bodies 8, the diode main bodies 8 are arranged at equal intervals, the diode main bodies 8 are arranged in the encapsulating cavity 3, the diode main bodies 8 are fixedly embedded in the silicon rubber body 4, the protection current can be conveniently protected from load through the arrangement of the diodes, the top end and the bottom end of the protective shell 2 are fixedly provided with installation pipes 9, the high-voltage lead 10 can be conveniently fixed through the arrangement of the installation pipes 9, the stability of the high-voltage lead 10 is improved, the top end and the bottom end of the protective shell 2 are respectively provided with a high-voltage lead 10, the high-voltage lead 10 is positioned in the installation pipes 9, one end, close to the protective shell 2, of the high-voltage lead 10 penetrates through the protective shell 2 and extends into the protective shell 2, one end, close to the protective shell 2, of the high-voltage lead 10 is fixedly embedded in the silicon rubber body 4, through the setting of high-voltage lead wire 10, be convenient for be connected with external equipment, 8 front sides of a plurality of diode main parts are equipped with same heat insulating board 13, heat insulating board 13 front side is equipped with a plurality of high-voltage capacitor 14, and even interval sets up between a plurality of high-voltage capacitor 14, heat insulating board 13 and high-voltage capacitor 14 all inlay and locate inside silicon rubber body 4, through the setting of heat insulating board 13, are convenient for carry out the separation to the heat, improve the heat-proof quality.

The implementation scenario is specifically as follows: the encapsulation cavity 3 is encapsulated by adopting the silicon rubber body 4, and the first heat dissipation alumina ceramic plate 5, the second heat dissipation alumina ceramic plate 6 and the third heat dissipation alumina ceramic plate 7 are embedded on the heat dissipation surface to encapsulate the high-voltage component, so that the high-voltage component has reliable insulating capability and good heat dissipation capability; compared with the traditional oil tank sealing method: a heavy oil tank is abandoned, so that the volume and the weight are reduced by multiple times; the packaging shape is not limited, and the packaging shape is suitable for designing the shape according to a given space; the problem of pollution caused by oil leakage and oil leakage is solved; the high-voltage device can be divided into a plurality of modules to be packaged respectively, and the modules can be replaced and repaired in field or field operations, so that the maintainability is improved; the device can work in a wider temperature range and is suitable for the environmental temperature requirement of military equipment; compared with the method of pure silicon rubber body 4 packaging, the method can balance the contradiction between insulation and heat dissipation, overcomes the problem of poor heat dissipation, and can meet the heat dissipation requirement of high-voltage devices.

Referring to the attached drawings 1-4 of the specification, in the dry potting structure for the high-voltage device of the embodiment, the heat dissipation plate 11 is arranged on the rear side of the protective shell 2, the rear end of the protective shell 2 is sleeved outside the heat dissipation plate 11, the outer wall of the heat dissipation plate 11 is fixedly connected with the inner wall of the protective shell 2, the heat dissipation plate 11 is fixedly connected with the rear side of the silicon rubber body 4, the protective shell 2 is conveniently sealed integrally through the arrangement of the heat dissipation plate 11, meanwhile, heat of the silicon rubber body can be absorbed and conducted to the outside for heat dissipation, and therefore the heat dissipation effect of the dry potting structure is improved.

The implementation scenario is specifically as follows: the protective shell 2 is fixedly sealed through the heat dissipation plate 11, heat of the silicon rubber main body can be conducted and absorbed, and the absorbed heat is conducted to the outside through the heat dissipation plate 12, so that the purpose of dissipating heat of the utility model is achieved.

And finally: the above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents, improvements and the like that are within the spirit and principle of the present invention are intended to be included in the scope of the present invention.

Claims

1. High-voltage apparatus dry-type embedment structure, including high-voltage apparatus main part (1), its characterized in that: the high-voltage device main body (1) comprises a protective shell (2), an embedding cavity (3) is arranged inside the protective shell (2), the embedding cavity (3) is internally filled with a silicon rubber body (4), a first heat dissipation alumina ceramic plate (5), a second heat dissipation alumina ceramic plate (6) and a third heat dissipation alumina ceramic plate (7) are arranged inside the embedding cavity (3), the second heat dissipation alumina ceramic plate (6) is positioned between the first heat dissipation alumina ceramic plate (5) and the third heat dissipation alumina ceramic plate (7), the first heat dissipation alumina ceramic plate (5) is positioned on the front side of the third heat dissipation alumina ceramic plate (7), and the first heat dissipation alumina ceramic plate (5), the second heat dissipation alumina ceramic plate (6) and the third heat dissipation alumina ceramic plate (7) are all fixedly embedded inside the silicon rubber body (4), the front side of the first heat dissipation alumina ceramic plate (5) is provided with a high-voltage component.

2. The high-voltage device dry potting structure of claim 1, wherein: the high-voltage assembly comprises a plurality of diode main bodies (8), wherein the diode main bodies (8) are uniformly arranged at intervals, the diode main bodies (8) are arranged in the encapsulation cavity (3), and the diode main bodies (8) are fixedly embedded in the silicon rubber body (4).

3. The high-voltage device dry potting structure of claim 1, wherein: and the top end and the bottom end of the protective shell (2) are both fixedly provided with installation pipes (9).

4. The high-voltage device dry potting structure of claim 3, wherein: protective housing (2) top and bottom all are equipped with high-pressure lead (10), high-pressure lead (10) are located inside installation pipe (9), the one end that high-pressure lead (10) are close to protective housing (2) runs through protective housing (2) and extends to inside protective housing (2), fixed the inlaying of one end that is close to protective housing (2) of high-pressure lead (10) is located inside silicon rubber body (4).

5. The high-voltage device dry potting structure of claim 1, wherein: protective housing (2) rear side is equipped with heating panel (11), heating panel (11) outside is located to protective housing (2) rear end cover, heating panel (11) outer wall and protective housing (2) inner wall fixed connection, heating panel (11) and silicon rubber body (4) rear side fixed connection.

6. The high-voltage device dry potting structure of claim 5, wherein: the rear side of the heat dissipation plate (11) is fixedly provided with a plurality of heat dissipation fins (12), and the heat dissipation fins (12) are arranged at equal intervals.

7. The high-voltage device dry potting structure of claim 2, wherein: a plurality of diode main parts (8) front side is equipped with same heat insulating board (13), heat insulating board (13) front side is equipped with a plurality of high-voltage capacitor (14), and even interval sets up between a plurality of high-voltage capacitor (14), heat insulating board (13) and high-voltage capacitor (14) all inlay and locate inside silicon rubber body (4).