CN215342583U

CN215342583U - COB (chip on board) packaging LED (light emitting diode) module with high light extraction rate

Info

Publication number: CN215342583U
Application number: CN202121223412.3U
Authority: CN
Inventors: 毛吉军; 何信; 向文华
Original assignee: Hangzhou Xinzade Electronic Co ltd
Current assignee: Hangzhou Xinzade Electronic Co ltd
Priority date: 2021-06-02
Filing date: 2021-06-02
Publication date: 2021-12-28
Anticipated expiration: 2031-06-02

Abstract

The utility model discloses a COB (chip on Board) packaged LED (light emitting diode) module with high light extraction rate, which comprises an insulating substrate, a ceramic heat dissipation seat, an electric connection assembly, an LED lamp panel and a protective cover, wherein the electric connection assembly comprises an outer copper ring and an inner copper ring, the lower surface of the insulating substrate is fixedly connected with an aluminum plate, the lower surface of the aluminum plate is connected with a heat dissipation disc through heat conduction glue, and the circumference of the lower surface of the heat dissipation disc is uniformly and fixedly connected with heat dissipation fins.

Description

COB (chip on board) packaging LED (light emitting diode) module with high light extraction rate

Technical Field

The utility model relates to the technical field of LED lighting, in particular to a COB (chip on board) packaged LED module with high light extraction rate.

Background

The LED, i.e. the light emitting diode, generates heat during operation, and if the heat cannot be dissipated in time, the temperature of the operating environment of the LED increases, and when the temperature of the operating environment of the LED is high, the following conditions may occur.

Firstly, the concentration of electrons and holes will increase, the forbidden bandwidth will decrease, and the electron mobility will decrease;

secondly, the temperature is increased, the radiation recombination probability of electrons and holes in the potential well is reduced, and non-radiation recombination (heat generation) is caused, so that the internal quantum efficiency of the LED is reduced;

thirdly, the blue light wave crest of the chip shifts to the long wave direction due to the temperature rise, so that the emission wavelength of the chip is not matched with the excitation wavelength of the fluorescent powder, and the external light extraction efficiency of the white light LED is also reduced.

All of the above conditions lead to deterioration of the luminous efficacy of the LED,

The COD encapsulation is a technology for solving the problem of heat dissipation of LEDs, but the COD encapsulation in the prior art still has the following problems:

firstly, each module is generally provided with a plurality of LED lamp panels, each lamp panel needs to be connected with an internal welding plate and an external welding plate for a circuit when being installed, the arrangement of a plurality of welding plates not only increases the assembly difficulty, but also leads to heat accumulation, thereby causing overhigh local temperature and further causing the denaturation of packaging glue;

secondly, in the existing packaging technology, most of the packaging glue is exposed in the air, so that the packaging glue is easy to damage;

thirdly, besides the heat conduction of the packaging adhesive, other auxiliary heat dissipation parts are absent, so that the heat dissipation effect is poor, and further the light extraction rate is not high.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problems, the present invention provides a COB packaged LED module with a high light extraction rate, which is implemented by the following technical scheme.

A COB (chip on Board) packaged LED (light emitting diode) module with high light extraction rate comprises an insulating substrate, a ceramic heat dissipation seat, an electric connection assembly, an LED lamp panel and a protection cover; the utility model discloses an LED lamp plate, including insulating substrate, ceramic radiating seat, outer copper ring and interior copper ring, insulating substrate is the disc, ceramic radiating seat rigid coupling is at the upper surface of base plate, and the outer fringe of ceramic radiating seat and insulating substrate's outer fringe parallel and level, and ceramic radiating seat's inner chamber is bowl-shaped, connect the electric subassembly to include outer copper ring and interior copper ring, the embedded rigid coupling of outer copper ring and interior copper ring is at insulating substrate's upper surface, and insulating substrate's left and right sides symmetry rigid coupling has the welded plate, and the welded plate of the left and right sides passes through the electric wire respectively with outer copper ring and interior copper ring electric connection, all is equipped with the breach on outer copper ring and the interior copper ring, LED lamp plate rigid coupling is evenly equipped with a plurality ofly on the insulating substrate between outer copper ring and the interior copper ring and the circumference, and the both ends of each LED lamp plate are connected with outer copper ring and interior copper ring respectively through the gold wire, the safety cover is connected with ceramic radiating seat, and the safety cover intussuseption is filled with the packaging adhesive.

Further, the LED lamp panel is glued on the insulating substrate through silver glue.

Further, the lower surface rigid coupling of insulating substrate has aluminum plate, aluminum plate's lower surface is connected with the heat dissipation dish through heat-conducting glue, the even rigid coupling of lower surface circumference of heat dissipation dish has radiating fin.

Further, the safety cover is made for optical glass, and the safety cover is the arc that makes progress hunch-up, and the bottom rigid coupling of safety cover has the shirt rim that pastes with ceramic radiating seat inner wall, and the rigid coupling has the connecting seat in addition on the safety cover, the circumference evenly is equipped with the through-hole on the connecting seat, the upper surface of ceramic radiating seat is equipped with the fixed screw who corresponds with the through-hole, still includes set screw, set screw passes the through-hole and twists in the fixed screw that corresponds.

Further, the encapsulation glue is solidified for liquid silica gel and forms, the top of safety cover is equipped with the material pipe, the head threaded connection of material pipe has the lid.

The LED lamp panel protection device has the advantages that the LED lamp panel is connected through the circuit of the electric connection assembly, so that the connection is convenient, the defect that heat is gathered or difficult to assemble due to the fact that too many welding plates are arranged is overcome, the protection of packaging glue is carried out through the protection cover, the ceramic heat dissipation seat, the aluminum plate and the heat dissipation disc are arranged, and the packaging glue is matched to achieve a heat dissipation function, so that the LED lamp panel protection device has a good heat dissipation effect, and the light extraction rate is indirectly improved.

Drawings

In order to more clearly illustrate the technical solution of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without inventive labor.

FIG. 1: the utility model discloses a structural schematic diagram of a COB (chip on board) packaged LED module with high light extraction rate;

FIG. 2: the utility model discloses a schematic diagram of the internal structure of a ceramic heat dissipation seat;

FIG. 3: the protective cover is structurally schematic;

FIG. 4: the structure of the heat dissipation plate is schematically shown.

The reference numbers are as follows:

1-insulating substrate, 11-aluminum plate, 12-heat conducting glue, 13-radiating seat, 14-radiating fin, 2-ceramic radiating seat, 31-outer copper tube, 32-inner copper ring, 33-welding plate, 34-electric wire, 35-notch, 4-LED lamp panel, 41-gold wire, 42-silver glue, 5-protective cover, 51-packaging glue, 52-skirt edge, 53-connecting seat, 54-through hole, 55-fixing screw hole, 56-fixing screw, 57-material tube and 58-cover body.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in fig. 1-4, a COB packaged LED module with high light extraction rate includes an insulating substrate 1, a ceramic heat sink 2, an electrical connection assembly, an LED lamp panel 4, and a protective cover 5; insulating substrate 1 is the disc, ceramic radiating seat 2 rigid coupling is at the upper surface of base plate, the outer fringe of ceramic radiating seat 2 and the outer fringe parallel and level of insulating substrate 1, the inner chamber of ceramic radiating seat 2 is the bowl shape, connect the electric subassembly to include outer copper ring 31 and interior copper ring 32, the embedded rigid coupling of outer copper ring 31 and interior copper ring 32 is at the upper surface of insulating substrate 1, insulating substrate 1's left and right sides symmetry rigid coupling has welded plate 33, the welded plate 33 of the left and right sides passes through electric wire 34 respectively with outer copper ring 31 and interior copper ring 32 electric connection, all be equipped with breach 35 on outer copper ring 31 and the interior copper ring 32, LED lamp plate 4 rigid coupling is on insulating substrate 1 between outer copper ring 31 and interior copper ring 32 and the circumference evenly is equipped with a plurality ofly, the both ends of each LED lamp plate 4 are connected with outer copper ring 31 and interior copper ring 32 respectively through gold wire 41, safety cover 5 is connected with ceramic radiating seat 2, safety cover 5 intussuseption is filled with encapsulation and is glued 51.

Preferably, the LED lamp panel 4 is glued on the insulating substrate 1 by silver glue 42.

Preferably, the lower surface of the insulating substrate 1 is fixedly connected with an aluminum plate 11, the lower surface of the aluminum plate 11 is connected with a heat dissipation disc 13 through a heat conducting glue 12, and the circumference of the lower surface of the heat dissipation disc 13 is uniformly and fixedly connected with heat dissipation fins 14.

Preferably, the protective cover 5 is made of optical glass, the protective cover 5 is in an upward arched arc shape, a skirt edge 52 attached to the inner wall of the ceramic heat dissipation seat 2 is fixedly connected to the bottom of the protective cover 5, the protective cover 5 is further fixedly connected with a connecting seat 53, through holes 54 are uniformly formed in the circumference of the connecting seat 53, fixing screw holes 55 corresponding to the through holes 54 are formed in the upper surface of the ceramic heat dissipation seat 2, and the protective cover further comprises fixing screws 56, and the fixing screws 56 penetrate through the through holes 54 and are screwed into the corresponding fixing screw holes 55.

Preferably, the packaging adhesive 51 is formed by solidifying liquid silica gel, a material pipe 57 is arranged at the top of the protection cover 5, and a cover body 58 is connected to the head of the material pipe 57 in a threaded manner.

One embodiment of the present invention is:

firstly, the LED lamp panels 4 are glued on the insulating substrate 1 through the silver adhesive 42, and then the LED lamp panels 4 are connected with the outer copper ring 31 and the inner copper ring 32 in a soldering mode, so that circuit connection of the LED lamp panels 4 can be realized.

Then, the protective cover 5 is mounted, the protective cover 5 is more stably mounted by the skirt 52, and the mounting of the protective cover 5 is realized by inserting the fixing screws 56 through the through holes 54 and screwing the fixing screws into the corresponding fixing screw holes 55.

The cover body 58 is unscrewed, the liquid silica gel is conveyed into the protective cover 5 through the material pipe 57, the cover body 58 is screwed after the silica gel is solidified, the solidified liquid silica gel forms the packaging adhesive 51, the mold can be prevented from being manufactured, the liquid silica gel is directly input into the protective cover 5 to be solidified, and the liquid silica gel can be completely filled in gaps among circuit elements, so that the insulating property is improved.

When the LED lamp panel is used, the welding plates 33 on the left side and the right side are used for soldering the power supply lead, so that the LED lamp panels 4 are connected in parallel.

In the working process, the packaging adhesive 51, the ceramic heat dissipation seat 2, the aluminum plate 11, the heat conducting adhesive 12 and the heat dissipation disc 13 are matched to jointly improve the heat dissipation effect, so that the light extraction rate of the LED lamp panel 4 is improved.

The preferred embodiments of the utility model disclosed above are intended to be illustrative only. The preferred embodiments are not exhaustive and do not limit the utility model to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, to thereby enable others skilled in the art to best utilize the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. The utility model provides a COB encapsulation LED module of high light-emitting rate which characterized in that: the LED lamp comprises an insulating substrate (1), a ceramic heat dissipation seat (2), an electric connection assembly, an LED lamp panel (4) and a protective cover (5); insulating substrate (1) is the disc, ceramic radiating seat (2) rigid coupling is at the upper surface of base plate, the outer fringe of ceramic radiating seat (2) and the outer fringe parallel and level of insulating substrate (1), and the inner chamber of ceramic radiating seat (2) is the calathiform, connect the electric subassembly including outer copper ring (31) and interior copper ring (32), the embedded rigid coupling of outer copper ring (31) and interior copper ring (32) is at the upper surface of insulating substrate (1), and the left and right sides symmetry rigid coupling of insulating substrate (1) has welding plate (33), and welding plate (33) of the left and right sides pass through electric wire (34) respectively with outer copper ring (31) and interior copper ring (32) electric connection, all is equipped with breach (35) on outer copper ring (31) and interior copper ring (32), LED lamp plate (4) rigid coupling is on insulating substrate (1) between outer copper ring (31) and interior copper ring (32) and the circumference evenly is equipped with a plurality ofly, the both ends of each LED lamp plate (4) are connected with outer copper ring (31) and interior copper ring (32) respectively through gold wire (41), safety cover (5) are connected with ceramic radiating seat (2), and safety cover (5) intussuseption is filled with encapsulation and glues (51).

2. The COB-packaged LED module with high light extraction rate according to claim 1, wherein: the LED lamp panel (4) is glued on the insulating substrate (1) through silver glue (42).

3. The COB-packaged LED module with high light extraction rate according to claim 1, wherein: the lower surface rigid coupling of insulating substrate (1) has aluminum plate (11), aluminum plate (11)'s lower surface is connected with heat dissipation dish (13) through heat-conducting glue (12), the even rigid coupling of lower surface circumference of heat dissipation dish (13) has radiating fin (14).

4. The COB-packaged LED module with high light extraction rate according to claim 1, wherein: protective cover (5) are made for optical glass, and protective cover (5) are the arc of upwards arching, and the bottom rigid coupling of protective cover (5) has skirt border (52) of pasting with ceramic radiating seat (2) inner wall, and it has connecting seat (53) to go up still the rigid coupling on protective cover (5), the circumference evenly is equipped with through-hole (54) on connecting seat (53), the upper surface of ceramic radiating seat (2) is equipped with fixed screw (55) that correspond with through-hole (54), still includes set screw (56), set screw (56) pass through-hole (54) and twist in fixed screw (55) that correspond.

5. The COB-packaged LED module with high light extraction rate as claimed in claim 4, wherein: encapsulation glue (51) solidify for liquid silica gel and form, the top of safety cover (5) is equipped with material pipe (57), the head threaded connection of material pipe (57) has lid (58).