CN216671608U

CN216671608U - Insulating type power semiconductor module

Info

Publication number: CN216671608U
Application number: CN202123306739.XU
Authority: CN
Inventors: 周新华; 丁军雄; 金步青
Original assignee: Xiangyang Saipuer Electronics Co ltd
Current assignee: Xiangyang Saipuer Electronics Co ltd
Priority date: 2021-12-27
Filing date: 2021-12-27
Publication date: 2022-06-03
Anticipated expiration: 2031-12-27

Abstract

The utility model discloses an insulated power semiconductor module, which comprises a module bottom plate, wherein the top of the module bottom plate is fixedly connected with a power module, the surface of the power module is movably connected with a passive heat dissipation connecting assembly, the passive heat dissipation connecting assembly comprises a direct contact plate, the surface of the direct contact plate is fixedly connected with a limiting frame, one side of the inner surface of the limiting frame is fixedly connected with an elastic clamping head, the surface of the direct contact plate is movably connected with a hierarchical contact plate, and the surfaces of the hierarchical contact plate and the direct contact plate are provided with connecting clamping grooves. This insulating type power semiconductor module, through passive heat dissipation coupling assembling's setting, the module adopts the copper that coefficient of heat conductivity is higher and power module contact, can be faster in time derive the heat to outside heat radiation structure surface, can change the different copper of thickness according to the position difference of concrete power module simultaneously.

Description

Insulating type power semiconductor module

Technical Field

The utility model relates to the technical field of semiconductors, in particular to an insulated power semiconductor module.

Background

Power semiconductor modules are a step-development of discrete semiconductor devices, which are the main components of modern power electronics. Power electronic semiconductor devices are playing an important role in modern power electronic technology, and are developing towards high frequency, high power, intellectualization and modularization, wherein modularization is applied more deeply. The power semiconductor module product is widely applied to the fields of buildings, communication, electric power, electronics, chemical engineering, machinery and the like. Modular, initially defined as two or more power semiconductor chips joined in a circuit configuration, encapsulated in an insulating housing and insulated from a thermally conductive base plate by protective materials such as rtv, elastomeric silicone gel, epoxy, etc., power semiconductor modules have been developed and produced in a variety of internal circuit connections since the introduction of the modular concept into the field of power electronics.

Along with the high-speed development of economy, the demand of the insulated power semiconductor module is higher and higher, the heat productivity of the power device is larger when the insulated power semiconductor module works, an aluminum plate is required to be attached to the insulated power semiconductor module, the heat of the power device is required to be changed by the contact of the aluminum plate and the shell when the power device is produced on a large scale, the positions of the power devices of different products in the same series are required to be changed, if each product is subjected to independent die sinking production, a large number of aluminum plates with different sizes are required, and the cost is higher.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects of the prior art, the utility model provides an insulated power semiconductor module, which solves the problems that the positions of power devices of different products in the same series are required to be changed frequently in large-scale production, and a large number of aluminum plates with different sizes are required to be produced if each product is subjected to independent die sinking, so that the cost is high.

In order to realize the purpose, the utility model is realized by the following technical scheme: an insulation type power semiconductor module comprises a module bottom plate, wherein a power module is fixedly connected to the top of the module bottom plate, a passive heat dissipation connecting assembly is movably connected to the surface of the power module and comprises a direct contact plate, a limiting frame is fixedly connected to the surface of the direct contact plate, a copper plate is movably connected to the inner surface of the limiting frame, an elastic chuck is fixedly connected to one side of the inner surface of the limiting frame, a hierarchical contact plate is movably connected to the surface of the direct contact plate, connecting clamping grooves are formed in the surfaces of the hierarchical contact plate and the direct contact plate, elastic pieces are fixedly connected to the inner surfaces of the connecting clamping grooves, a connecting clamping plate is fixedly connected to the surface of the hierarchical contact plate, positioning clamping grooves are formed in the surfaces of the hierarchical contact plate and the direct contact plate, and a positioning assembly is movably connected to the surface of the passive heat dissipation connecting assembly, the positioning assembly comprises an adjusting extrusion box, a sliding plate is slidably connected between two sides of the inner wall of the adjusting extrusion box, an adjusting rod is fixedly connected to one side of the sliding plate, a reset spring is sleeved on the surface of the adjusting rod, an outer plate is fixedly connected to the surfaces of the adjusting extrusion box and the adjusting rod, and a buckle is fixedly connected to the surface of the outer plate.

Preferably, the surface of the module bottom plate is movably connected with an outer cover, and the surface of the outer cover is polished smoothly.

Preferably, the surface of the outer cover is provided with heat dissipation fins, and the surface of the heat dissipation fins is coated with insulating paint.

Preferably, the surface of the outer cover is provided with a vent hole, and the inner wall of the vent hole is provided with a filter screen.

Preferably, the two sides of the surface of the module bottom plate are fixedly connected with anti-skid plates, and the surface of each anti-skid plate is fully paved with convex points.

Preferably, the surface of the antiskid plate is provided with antiskid grooves, and the surface of the antiskid grooves is provided with antiskid lines.

Advantageous effects

The utility model provides an insulated power semiconductor module. Compared with the prior art, the method has the following beneficial effects:

(1) the insulating power semiconductor module is connected with a passive heat dissipation connecting assembly through the surface activity of the power module, the passive heat dissipation connecting assembly comprises a direct contact plate, the surface of the direct contact plate is fixedly connected with a limiting frame, the inner surface activity of the limiting frame is connected with a copper plate, one side of the inner surface of the limiting frame is fixedly connected with an elastic chuck, the surface activity of the direct contact plate is connected with a level contact plate, the surfaces of the level contact plate and the direct contact plate are provided with connecting clamping grooves, the inner surface of the connecting clamping grooves is fixedly connected with elastic pieces, the surface of the level contact plate is fixedly connected with a connecting clamping plate, the surfaces of the level contact plate and the direct contact plate are provided with positioning clamping grooves, through the arrangement of the passive heat dissipation connecting assembly, the module adopts the copper plate with higher heat conductivity coefficient to contact with the power module, and can more quickly lead heat to the surface of an external heat dissipation structure in time, meanwhile, the copper plates with different thicknesses can be replaced according to different positions of a specific power module, the number of the heat dissipation aluminum plates can be changed in time according to different positions of the power module by adopting a mode of combining and connecting a plurality of heat dissipation aluminum plates, large-scale preparation is facilitated, production cost is low, the copper plates with high cost are locally adopted, heat dissipation capacity can be improved, and production cost cannot be increased on a large scale.

(2) This insulating type power semiconductor module, there is locating component through passive heat dissipation coupling assembling's surperficial swing joint, locating component is including adjusting the extrusion box, sliding connection has the sliding plate between the both sides of adjusting the extrusion box inner wall, one side fixedly connected with of sliding plate adjusts the pole, the surface cover of adjusting the pole is equipped with reset spring, adjust the extrusion box and the fixed surface of adjusting the pole and be connected with the planking, the fixed surface of planking is connected with the buckle, setting through locating component, can further compress tightly fixedly passive heat dissipation coupling assembling, avoid its during operation to rock at will, the comparatively simple easy staff fast operation of relevant structure simultaneously, and through the setting in heat radiation fins and ventilation hole, the module can in time disperse the outside heat of output, further improve the heat-sinking capability of module.

Drawings

FIG. 1 is a front view of the present invention;

FIG. 2 is a schematic view of a passive heat dissipation connecting assembly according to the present invention;

FIG. 3 is a schematic view of the positioning assembly of the present invention;

FIG. 4 is a top view of a heat sink fin structure according to the present invention;

fig. 5 is a sectional view of a vent structure of the present invention.

In the figure: 1. a module base plate; 2. a power module; 3. a passive heat dissipation connection assembly; 31. a direct contact plate; 32. a limiting frame; 33. an elastic chuck; 34. a hierarchy contact plate; 35. a connecting clamping groove; 36. a spring plate; 37. connecting a clamping plate; 38. positioning the clamping groove; 39. a copper plate; 4. a positioning assembly; 41. adjusting the extrusion box; 42. a sliding plate; 43. adjusting a rod; 44. a return spring; 45. an outer plate; 46. buckling; 5. an outer cover; 6. heat dissipation fins; 7. a vent hole; 8. an anti-skid plate; 9. and (4) an anti-slip groove.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.

Referring to fig. 1-5, the present invention provides a technical solution: an insulation type power semiconductor module comprises a module bottom plate 1, a power module 2 is fixedly connected to the top of the module bottom plate 1, a passive heat dissipation connecting assembly 3 is movably connected to the surface of the power module 2, the passive heat dissipation connecting assembly 3 comprises a direct contact plate 31, a limiting frame 32 is fixedly connected to the surface of the direct contact plate 31, a copper plate 39 is movably connected to the inner surface of the limiting frame 32, an elastic chuck 33 is fixedly connected to one side of the inner surface of the limiting frame 32, a hierarchical contact plate 34 is movably connected to the surface of the direct contact plate 31, the direct contact plate 31 and the hierarchical contact plate 34 are both aluminum heat dissipation aluminum plates, connecting clamping grooves 35 are formed in the surfaces of the hierarchical contact plate 34 and the direct contact plate 31, elastic sheets 36 are fixedly connected to the inner surface of the connecting clamping grooves 35, a clamping plate 37 is fixedly connected to the surface of the hierarchical contact plate 34, and positioning clamping grooves 38 are formed in the surfaces of the hierarchical contact plate 34 and the direct contact plate 31, through the setting of passive heat dissipation coupling assembling 3, the module adopts the higher copper 39 of coefficient of heat conductivity and contacts with power module 2, can be faster in time derive the heat to outside heat radiation structure surface, can change the different copper 39 of thickness according to the position difference of concrete power module 2 simultaneously, the mode that adopts multi-disc heat dissipation aluminum plate built-up connection simultaneously can be according to power module 2's different positions, in time change heat dissipation aluminum plate's quantity, convenient large-scale preparation, manufacturing cost is lower, the local copper 39 that adopts with high costs can improve the heat-sinking capability, and can not increase manufacturing cost on a large scale.

The surface of the passive heat dissipation connecting assembly 3 is movably connected with a positioning assembly 4, the positioning assembly 4 comprises an adjusting extrusion box 41, a sliding plate 42 is slidably connected between two sides of the inner wall of the adjusting extrusion box 41, one side of the sliding plate 42 is fixedly connected with an adjusting rod 43, the surface of the adjusting rod 43 is sleeved with a return spring 44, the surfaces of the adjusting extrusion box 41 and the adjusting rod 43 are fixedly connected with an outer plate 45, the surface of the outer plate 45 is fixedly connected with a buckle 46, the passive heat dissipation connecting assembly 3 can be further pressed and fixed through the arrangement of the positioning assembly 4, the random shaking during the work of the passive heat dissipation connecting assembly is avoided, meanwhile, the related structure is simpler and is easy for a worker to operate quickly, and through the arrangement of the heat dissipation fins 6 and the vent holes 7, the module can timely dissipate the output heat to the outside, the heat dissipation capability of the module is further improved, the surface of the module bottom plate 1 is movably connected with an outer cover 5, the surface of enclosing cover 5 is polished smoothly, and the surface of enclosing cover 5 is provided with heat radiation fins 6, and insulating varnish is paintd on heat radiation fins 6's surface, and ventilation hole 7 has been seted up on the surface of enclosing cover 5, and ventilation hole 7 inner wall sets up the filter screen, and the equal fixedly connected with antiskid ribbed tile 8 in module bottom plate 1's surperficial both sides, the bump is paved on antiskid ribbed tile 8's surface, and antiskid groove 9 has been seted up on antiskid ribbed tile 8's surface, and antiskid ribbed tile 9's surface sets up anti-skidding line.

And those not described in detail in this specification are well within the skill of those in the art.

During operation, insert copper 39 according to specific needs and place spacing frame 32 inner wall one side, copper 39 is compressed tightly fixedly by elasticity dop 33, insert the connection cardboard 37 on hierarchy contact board 34 surface in connecting the draw-in groove 35, shell fragment 36 extrusion is connected cardboard 37 and is fixed to it, direct contact board 31 is hugged closely with hierarchy contact board 34 surface, then pulling regulation pole 43, adjust the inside reset spring 44 deformation of extrusion box 41, aim at buckle 46 at positioning card groove 38, loosen regulation pole 43, reset spring 44 contracts and drives buckle 46 and will passively press from both sides tight coupling assembling 3 is whole, be connected enclosing cover 5 through the bolt and module bottom plate 1, open module work, after work end with the whole recovery of module.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An insulated power semiconductor module comprising a module base plate (1), characterized in that: the module comprises a module bottom plate (1), wherein a power module (2) is fixedly connected to the top of the module bottom plate (1), a passive heat dissipation connecting assembly (3) is movably connected to the surface of the power module (2), the passive heat dissipation connecting assembly (3) comprises a direct contact plate (31), a limiting frame (32) is fixedly connected to the surface of the direct contact plate (31), a copper plate (39) is movably connected to the inner surface of the limiting frame (32), an elastic clamping head (33) is fixedly connected to one side of the inner surface of the limiting frame (32), a hierarchical contact plate (34) is movably connected to the surface of the direct contact plate (31), a connecting clamping groove (35) is formed in the surfaces of the hierarchical contact plate (34) and the direct contact plate (31), an elastic sheet (36) is fixedly connected to the inner surface of the connecting clamping groove (35), and a connecting clamping sheet (37) is fixedly connected to the surface of the hierarchical contact plate (34), positioning card groove (38) have been seted up on the surface of level contact board (34) and direct contact board (31), the surperficial swing joint of passive heat dissipation coupling assembling (3) has positioning assembly (4), positioning assembly (4) are including adjusting extrusion box (41), sliding connection has sliding plate (42) between the both sides of adjusting extrusion box (41) inner wall, one side fixedly connected with of sliding plate (42) adjusts pole (43), the surperficial cover of adjusting pole (43) is equipped with reset spring (44), adjust extrusion box (41) and adjust surperficial fixedly connected with planking (45) of pole (43), the fixed surface of planking (45) is connected with buckle (46).

2. An insulated power semiconductor module according to claim 1, characterized in that: the surface of the module bottom plate (1) is movably connected with an outer cover (5), and the surface of the outer cover (5) is polished smoothly.

3. An insulated power semiconductor module according to claim 2, characterized in that: the surface of the outer cover (5) is provided with heat dissipation fins (6), and insulating paint is smeared on the surfaces of the heat dissipation fins (6).

4. An insulated power semiconductor module according to claim 2, characterized in that: the surface of the outer cover (5) is provided with a vent hole (7), and the inner wall of the vent hole (7) is provided with a filter screen.

5. An insulated power semiconductor module according to claim 1, characterized in that: the anti-skidding module is characterized in that anti-skidding plates (8) are fixedly connected to two sides of the surface of the module bottom plate (1), and salient points are fully paved on the surface of each anti-skidding plate (8).

6. An insulated power semiconductor module according to claim 5, characterized in that: the surface of the antiskid plate (8) is provided with antiskid grooves (9), and the surface of each antiskid groove (9) is provided with antiskid lines.