CN216648334U

CN216648334U - Inserting sheet cleaning and texturing integrated machine

Info

Publication number: CN216648334U
Application number: CN202122250620.9U
Authority: CN
Inventors: 连锦坤; 申朝锋; 胡滇建; 平飞林
Original assignee: Longji Leye Photovoltaic Technology Xixian New Area Co ltd
Current assignee: Longji Leye Photovoltaic Technology Xixian New Area Co ltd
Priority date: 2021-09-16
Filing date: 2021-09-16
Publication date: 2022-05-31
Anticipated expiration: 2031-09-16

Abstract

The application discloses inserted sheet washs making herbs into wool all-in-one, include: the inserting unit, the cleaning unit and the texturing unit are arranged in sequence; the silicon wafer inserting unit is used for inserting silicon wafers to be cleaned and subjected to texturing; the cleaning unit is used for cleaning the silicon wafer; the etching unit is used for etching the cleaned silicon wafer, and a separation part is arranged at the joint of the cleaning unit and the etching unit. Above-mentioned scheme can reduce equipment manufacturing cost and use cost, and can prevent that the volatile acid mist of making herbs into wool unit from causing the damage to the cleaning unit.

Description

Inserting sheet cleaning and texturing integrated machine

Technical Field

The utility model relates to the technical field of photovoltaics, in particular to an insert cleaning and texturing integrated machine.

Background

With the increasing shortage of fossil energy and the enhancement of environmental awareness, photovoltaic power generation technology is becoming more and more widely applied as an environment-friendly technology capable of directly converting sunlight into electric energy.

The current manufacturing process flow of the solar cell is generally the procedures of silicon material → crystal pulling → slicing → degumming → cleaning → sorting, packaging → wool making → electrode preparation and the like. In the cleaning and texturing processes, partial functions of the groove bodies are overlapped, and the cleaning and texturing are divided into two independent systems, so that the production cost and the use cost are increased.

SUMMERY OF THE UTILITY MODEL

In view of the above-mentioned drawbacks and deficiencies of the prior art, it is desirable to provide an insert cleaning and texturing machine for reducing the production cost and the use cost of the equipment.

The utility model provides an insert cleaning and texturing integrated machine, which comprises: the inserting unit, the cleaning unit and the texturing unit are arranged in sequence;

the silicon wafer inserting unit is used for inserting silicon wafers to be cleaned and subjected to texturing;

the cleaning unit comprises a plurality of first groove bodies which are arranged in sequence and is used for cleaning the silicon wafer;

the texturing unit comprises a plurality of second groove bodies which are sequentially arranged and is used for texturing the cleaned silicon wafer;

a separator is arranged at the joint of the cleaning unit and the texturing unit, and is used for separating the cleaning unit and the texturing unit at two sides of the separator;

the separator is provided with a channel, and a butt joint groove is arranged in the channel in a matching and penetrating way; the butt joint groove is provided with a first part and a second part which are communicated with each other, the first part and the cleaning unit are positioned on the same side of the partition, and the second part and the wool making unit are positioned on the other side of the partition; the first part and the second part are both provided with notches, and at least one notch is movably connected with a groove cover; and a butt joint conveying mechanism is arranged in the butt joint groove.

As an implementation manner, each notch is respectively arranged at the top of the first part and the second part, and the notch is movably connected with the slot cover.

As an achievable mode, the inserting piece unit further comprises a subfissure detection module, and the subfissure detection module is used for subfissure detection on the silicon wafer to be cleaned and before texturing.

As an implementation mode, a first mounting frame is fixedly connected to the machine base, and the first mounting frame is provided with a first mounting part located above the silicon wafer conveying module and a second mounting part located below the silicon wafer conveying module;

the subfissure detection module comprises an infrared light emitter and an infrared camera, wherein one of the infrared light emitter and the infrared camera is fixedly connected with the first installation part, and the other one of the infrared light emitter and the infrared camera is fixedly connected with the second installation part.

As an achievable mode, a second mounting frame is fixedly connected to the base, the second mounting frame is provided with a third mounting part located above the silicon wafer conveying module, the third mounting part is fixedly connected with an air knife, and an air outlet of the air knife faces the silicon wafer conveying module;

in the silicon wafer conveying direction, the air knife is positioned between the water tank and the subfissure detection module.

As an achievable mode, the plurality of first tank bodies arranged in sequence sequentially comprise a prewashing tank, a first alkali washing tank, a second alkali washing tank, a third alkali washing tank, a fourth alkali washing tank, a first rinsing tank, a second rinsing tank, a third rinsing tank, a fourth rinsing tank, a fifth rinsing tank and a sixth rinsing tank; and the sixth rinsing tank and the third rinsing tank are connected in a downward overflow mode in sequence.

The second bath bodies arranged in sequence are a first pickling tank, a seventh rinsing tank, a fifth alkaline washing tank, a sixth alkaline washing tank, a second acid washing tank, a first prefabricated wool groove, a second prefabricated wool groove, an eighth rinsing tank, a first wool making tank, a second wool making tank, a ninth rinsing tank, a third pickling tank, a fourth pickling tank, a tenth rinsing tank, an eleventh rinsing tank and a drying tank in sequence.

As an achievable mode, the cleaning unit further comprises a first manipulator, and the first manipulator is used for grabbing a flower basket for holding the silicon wafers to be cleaned and subjected to texturing, and sequentially passes through the pre-washing tank to the sixth rinsing tank so as to clean the silicon wafers to be cleaned and subjected to texturing; and/or the presence of a gas in the gas,

the texturing unit further comprises a second mechanical arm, the second mechanical arm is used for grabbing a basket of flowers containing the silicon wafers to be textured, and the baskets of flowers are sequentially arranged in the first pickling tank to the drying tank so as to be textured by the silicon wafers.

In an achievable form, the docking conveyor mechanism comprises a belt conveyor extending in its own conveying direction from the first section to the second section; and/or the presence of a gas in the gas,

this inserted sheet washs making herbs into wool all-in-one still includes back the basket track, back the basket track set up in the cleaning unit with one side of making herbs into wool unit, be provided with the AGV transfer car (buggy) on returning the basket track, the AGV transfer car (buggy) is used for following it certainly with the blank basket of making herbs into wool unit the unloading station transport extremely the material loading station of inserted sheet unit.

The above-mentioned scheme that this application provided, owing to link together cleaning unit and texturing unit order, the silicon chip is after cleaning unit washs, the silicon chip is clean, it directly sends to the texturing unit and carries out the texturing, can not wash once more before the texturing, consequently avoided arranging different factories or workshops because of cleaning unit and texturing unit branch, the silicon chip need sort the packing after cleaning unit washs, then transport to the texturing unit, and unpack, because in-process at transportation and bale breaking, the silicon chip probably is polluted, consequently need wash once more the silicon chip before carrying out the texturing, also promptly this application scheme can save the cell body and relevant parts that wash once more before the texturing, consequently, equipment manufacturing cost and use cost have been reduced. In addition, when the insert cleaning and texturing integrated machine is used, only one set of sewage disposal system is needed, and compared with the situation that the cleaning unit and the texturing unit are respectively arranged in different factories or workshops, two sets of sewage disposal systems need to be built, the factory construction cost and the sewage disposal (use) cost are reduced. In addition, the separator is arranged at the joint of the cleaning unit and the texturing unit, so that the problem that when a texturing process is carried out in the texturing unit, the used volatile acid such as hydrochloric acid is volatilized into the air and enters the cleaning unit to damage the cleaning unit can be prevented.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:

FIG. 1 is a top view of an insert cleaning and texturing machine provided by an embodiment of the present invention;

FIG. 2 is a schematic view of a tab unit according to an embodiment of the present invention;

FIG. 3 is a schematic view of a septum provided by an embodiment of the present invention;

FIG. 4 is a schematic view of an open state of one of the covers of the docking bay according to an embodiment of the present invention;

fig. 5 is a schematic view of an assembled compartment and docking bay according to an embodiment of the present invention.

Detailed Description

The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and are not limiting of the utility model. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

As shown in fig. 1 to 5, an insert cleaning and texturing machine provided by an embodiment of the present invention includes: the inserting piece unit 1, the cleaning unit 2 and the texturing unit 3 are arranged in sequence;

the silicon wafer inserting unit 1 is used for inserting a silicon wafer 6 to be cleaned and subjected to texturing, wherein the inserting is to insert the silicon wafer 6 into the flower basket 7; as will be understood by those skilled in the art, the inserting unit 1 has a water tank 107 and a scooping mechanism or a feeding mechanism 108, the silicon rod is sliced to form the silicon wafer 6, the silicon wafer 6 enters the water tank 107 of the inserting unit 1 to primarily remove dust attached to the surface of the silicon wafer 6 during slicing, and the scooping mechanism or the feeding mechanism 108 supplies the silicon wafer 6 from the water tank 107 to a silicon wafer conveying module 101 described below to be inserted into the flower basket 7 for subsequent processes, such as subfissure detection, cleaning, wool making, and the like. The inserting sheet unit 1 can be an existing device, and the structure of the inserting sheet unit is not limited uniquely.

The cleaning unit 2 comprises a plurality of first groove bodies which are arranged in sequence and is used for cleaning the silicon wafer 6; the silicon wafer 6 is inserted into the flower basket 7 and is conveyed to the cleaning unit 2, and the number of the first tank bodies and the types of cleaning liquid arranged in the first tank bodies can be adjusted according to the process requirements. The silicon wafers 6 can be manually or automatically placed into the first tank bodies along with the flower basket 7 in sequence to clean the silicon wafers 6.

And the texturing unit 3 comprises a plurality of second groove bodies which are sequentially arranged and is used for texturing the cleaned silicon wafer 6. After the cleaning, the silicon wafer 6 is conveyed to the texturing unit 3 to be textured. The second tank bodies are internally provided with a cleaning tank and a texturing tank, and the number of the cleaning tank and the texturing tank, the type of cleaning liquid arranged in the cleaning tank and the type of texturing liquid in the texturing tank can be adjusted according to the process requirements. Generally, the silicon wafer 6 is sequentially placed into each second tank of the texturing unit 3 along with the flower basket 7 in an automated manner to perform a texturing process on the silicon wafer 6.

Generally, the parts in the cleaning unit 2, such as various first tanks, are mostly steel parts, and the parts in the texturing unit 3, such as various second tanks, are mostly PP materials; when the texturing process is performed in the texturing unit 3, a volatile acid such as hydrochloric acid is used, the volatile acid is volatilized into the air and enters the cleaning unit 2, damage is caused to the cleaning unit 2, in order to prevent or reduce the damage, a partition 5 is arranged at the connection position of the cleaning unit 2 and the texturing unit 3, and the partition 5 is used for separating the cleaning unit 2 and the texturing unit 3 at two sides of the partition 5; the partition 5 is, for example, but not limited to, a partition wall that divides a plant in which the integrated insert cleaning and etching machine is installed into two separate work spaces and prevents acid gas from flowing in the different work spaces.

On the basis of preventing acid gas from flowing in different working spaces, and ensuring that the silicon wafers 6 can be conveyed from the cleaning unit 2 to the texturing unit 3 for the texturing process, the separator 5 is provided with a channel 51, a butt-joint groove 212 is arranged in the channel 51 in a matched and penetrated mode, the butt-joint groove 212 is arranged in the channel 51 in a matched and penetrated mode, so that acid mist can be prevented from diffusing through a gap between the butt-joint groove 212 and the channel 51, the butt-joint groove 212 is provided with a first part 2121 and a second part 2122 which are communicated with each other, the first part 2121 is positioned on the same side of the separator 5 as the cleaning unit 2, and the second part 2122 and the texturing unit 3 are positioned on the other side of the separator 5; the first part 2121 and the second part 2122 are provided with notches 2123, and at least one notch 2123 is movably connected with a groove cover 2124; a docking transmission mechanism is arranged in the docking slot 212. In operation, the cleaned silicon wafers are transferred from the first portion 2121 to the second portion 2122 by the docking transfer mechanism.

The above-mentioned scheme that this application provided, owing to link together cleaning unit 2 and texturing unit 3 order, the silicon chip is after cleaning unit 2 washs, the silicon chip is clean, it directly sends to texturing unit 3 and carries out the texturing, can not wash once more before the texturing, consequently avoided arranging different factories or workshops because of cleaning unit 2 and texturing unit 3 branch, the silicon chip need sort the packing after cleaning unit 2 washs, then transport to texturing unit 3, and unpack, owing to in-process at transportation and bale breaking, the silicon chip probably is polluted, consequently need wash the silicon chip once more before carrying out the texturing, also promptly this application scheme can save the cell body and relevant parts that wash once more before the texturing, consequently, equipment manufacturing cost and use cost have been reduced. In addition, when the insert cleaning and texturing integrated machine is used, only one set of sewage disposal system is needed, compared with the case that the cleaning unit 2 and the texturing unit 3 are respectively arranged in different factories or workshops, and two sets of sewage disposal systems need to be built, the factory construction cost and the sewage disposal (use) cost are reduced. In addition, since the partition 5 is disposed at the connection between the cleaning unit and the texturing unit, it is possible to prevent a problem that the cleaning unit 2 is damaged due to the volatilization of volatile acids such as hydrochloric acid into the air and the entrance of the cleaning unit 2 when a texturing process is performed in the texturing unit.

As an implementation manner, the notches 2123 are respectively disposed at the tops of the first portion 2121 and the second portion 2122, the notches 2123 are disposed at the tops of the first portion 2121 and the second portion 2122 to facilitate taking and placing the flower basket 7, and the slot covers 2124 are movably connected to the notches 2123 to improve the acid gas isolation effect.

When it is desired to transfer the silicon wafer, the slot cover 2124 of the notch of the first part 2121 of the docking slot 212 is opened, and the basket 7 holding the silicon wafer is put into the docking transfer mechanism such as, but not limited to, a belt conveyor from the notch 2123 of the first part 2121 in the docking slot 212 and covered with the slot cover 2124; the basket 7 containing the silicon wafers 6 is transferred to the second part 2122 by the docking transfer mechanism, and after the basket 7 is transferred to the second part 2122, the cover 2124 of the second part 2122 of the docking slot 212 is opened, and the basket 7 containing the silicon wafers 6 is taken out of the second part 2122 of the docking slot 212 and covered with the cover 2124. With this structure, at least one slot cover 2124 is covered on the top slot opening 2123 of the docking slot 212 during the process of putting the flower basket 7 containing the silicon wafers 6 into the docking slot 212 or taking the flower basket 7 out of the docking slot 212, i.e. the flow of most of the acid gas between the cleaning unit 2 and the texturing unit 3 through the docking slot 212 can be prevented or at least blocked; in addition, during the transfer of the baskets 7 containing the silicon wafers 6 in the docking slot 212, both slot covers 2124 of the slot opening 2123 at the top of the docking slot 212 are covered, and thus, acid gas cannot flow (diffuse) between the cleaning unit 2 and the texturing unit 3 through the docking slot 212 at this time.

In an implementation manner, the blade insertion unit includes a base 106, the base 106 is, for example and without limitation, a welded frame structure, the base 106 is provided with a silicon wafer conveying module 101, and the silicon wafer conveying module 101 is, for example and without limitation, a belt conveyor. Along the silicon wafer conveying direction of the silicon wafer conveying module 101, one end of the silicon wafer conveying module 101 is provided with a water tank 107, the other end of the silicon wafer conveying module 101 is provided with a basket lifting mechanism 105, the water tank 107 is fixedly connected with the base 106, and the basket lifting mechanism 105 is arranged on the base 106 and is adjustable in height along the vertical direction.

When inserting the wafer, can be through setting up the confession piece mechanism 108 in basin 107, provide silicon chip 6 on the band conveyer as silicon chip transport module 101, just under the visual angle to fig. 2, carry module 101 through the silicon chip and carry silicon chip 6 from a left side to the right side, and insert in basket of flowers 7, every inserts a slice silicon chip 6 back in the basket of flowers 7, basket of flowers hoist mechanism 105 drive basket of flowers is in vertical direction, upwards or move certain distance downwards to insert next silicon chip 6 in the basket of flowers 7. The distance is determined according to the distance between two adjacent slots for placing the silicon wafers 6 in the flower basket 7. The basket lifting mechanism 105 is, for example, but not limited to, a mechanical jaw, as long as it can carry the basket 7 to move in the vertical direction. The height of the basket lifting mechanism 105 on the base 106 is adjustable along the vertical direction, and can be realized by a screw transmission mechanism, a pneumatic cylinder, a hydraulic cylinder or an electric push rod.

As an implementation manner, in order to improve the yield of the product and reduce the breakage rate in the manufacturing process, in the early stage of the manufacturing process, that is, in the insert process before the silicon wafer is cleaned, the subfissure detection module is further disposed in the insert unit 1, and the subfissure detection module is used for performing subfissure detection on the silicon wafer 6 before the silicon wafer is to be cleaned and subjected to texturing.

As an implementation manner, a first mounting rack 109 is fixedly connected to the base 106, and the first mounting rack 109 has a first mounting portion located above the silicon wafer conveying module 101 and a second mounting portion located below the silicon wafer conveying module 101;

the subfissure detection module comprises an infrared light emitter 104 and an infrared camera 103, wherein one of the infrared light emitter 104 and the infrared camera 103 is fixedly connected to the first installation part, and the other one is fixedly connected to the second installation part. In this example, the infrared camera 103 is fixedly attached to the first mounting portion, and the infrared light emitter 104 is fixedly attached to the second mounting portion.

The infrared light emitter 104 emits infrared light to irradiate the silicon wafer 6 to be subjected to the subfissure detection, the infrared camera 103 shoots the silicon wafer 6 to be subjected to the subfissure detection, and whether the silicon wafer 6 has the defects of subfissure and the like is judged according to the shot picture.

As an achievable way, in order to improve the accuracy of subfissure detection, it is necessary to ensure that the silicon wafer 6 is relatively dry during detection, and at the very least, a large amount of water cannot remain on the silicon wafer 6; then, a second mounting frame 110 is fixedly connected to the base 106, the second mounting frame 110 has a third mounting portion located above the silicon wafer conveying module 101, the third mounting portion is fixedly connected to an air knife 102, and an air outlet of the air knife 102 faces the silicon wafer conveying module 101;

in the silicon wafer conveying direction, the air knife 102 is positioned between the water tank 107 and the subfissure detection module; that is to say, the silicon wafer 6 passes through the air knife and is dried by the air knife 6 before being sent to the position of the subfissure detection module for subfissure detection. The air knife 102 is used for drying the silicon wafer 6. In order to improve the drying efficiency, the air knife 102 may blow hot air toward the silicon wafer 6.

As a realizable mode, the plurality of sequentially arranged first tank bodies are a prewash tank 201, a first alkaline washing tank 202, a second alkaline washing tank 203, a third alkaline washing tank 204, a fourth alkaline washing tank 205, a first rinse tank 206, a second rinse tank 207, a third rinse tank 208, a fourth rinse tank 209, a fifth rinse tank 210 and a sixth rinse tank 211 in sequence; and is connected in sequence from the sixth rinse tank 211 to the third rinse tank 208 in an overflow manner. The term "overflow-down connection" as used herein means that the liquid in the sixth rinse tank 211 may overflow to the fifth rinse tank 210, the liquid in the fifth rinse tank 210 may overflow to the fourth rinse tank 209, and the liquid in the fourth rinse tank 209 may overflow to the third rinse tank 208.

Generally, the working medium of the prewash tank 201 may be pure water; working media of the first alkaline washing tank 202, the second alkaline washing tank 203, the third alkaline washing tank 204 and the fourth alkaline washing tank 205 can be sodium hydroxide solutions, wherein the first alkaline washing tank 202 can comprise two tank bodies 2021 which are connected in parallel according to the requirement of capacity; working media of the first rinsing tank 206 and the second rinsing tank 207 can be pure water and hydrogen peroxide; the working medium in each of the third rinse tank 208, the fourth rinse tank 209, the fifth rinse tank 210, and the sixth rinse tank 211 may be pure water.

In order to improve the cleaning effect, ultrasonic generators are arranged in at least the prewash tank 201, the first alkaline washing tank 202, the second alkaline washing tank 203, the third alkaline washing tank 204, the fourth alkaline washing tank 205, the third rinsing tank 208, the fourth rinsing tank 209, the fifth rinsing tank 210 and the sixth rinsing tank 211 to perform ultrasonic cleaning.

In a practical manner, the plurality of second tank bodies arranged in sequence are a first pickling tank 301, a seventh rinsing tank 302, a fifth alkaline washing tank 303, a sixth alkaline washing tank 304, a second acid washing tank 305, a first pre-texturing tank 306, a second pre-texturing tank 307, an eighth rinsing tank 308, a first texturing tank 309, a second texturing tank 310, a ninth rinsing tank 311, a third pickling tank 312, a fourth pickling tank 313, a tenth rinsing tank 314, an eleventh rinsing tank 315 and a drying tank 316.

Generally, the working medium of the first pickling tank 301 may be hydrochloric acid; the working medium of the seventh rinse tank 302 may be deionized water; working media of the fifth alkali washing tank 303 and the sixth alkali washing tank 304 can be sodium hydroxide solution and hydrogen peroxide or SDR; the working medium of the second acid washing tank 305 can be hydrochloric acid and ozone; the working media of the first preformed pile groove 306 and the second preformed pile groove 307 can be KOH + APD (absolute ethyl alcohol or isopropanol); the working medium of the eighth rinsing tank 308 can be deionized water; the working medium of the first texturing groove 309 and the second texturing groove 310 can be KOH + APD (absolute ethyl alcohol or isopropanol); the working medium of the ninth rinsing tank 311 can be deionized water; the working medium of the third pickling tank 312 can be hydrochloric acid and ozone; the working medium of the fourth pickling tank 313 can be hydrochloric acid and hydrofluoric acid; the working medium of the tenth rinse tank 314 may be deionized water; the working medium of the eleventh rinsing tank 315 may be hot water; the drying slots 316 can be provided in a plurality according to actual needs, in this example, five drying slots 316 are provided, and the working medium in each drying slot 316 can be hot air or hot nitrogen.

In a practical way, the cleaning unit 2 further comprises a first manipulator, the number of the first manipulators can be determined according to actual needs, the first manipulator can be arranged at a fixed position, and can be provided with a walking mechanism to move among different troughs; the first mechanical arm is used for grabbing the flower basket 7 containing the silicon wafers 6 to be cleaned and subjected to texturing, and sequentially passes through the pre-washing tank 201 to the sixth rinsing tank 211 so as to clean the silicon wafers to be cleaned and subjected to texturing.

The texturing unit 3 further comprises second mechanical arms, the number of the second mechanical arms can be determined according to actual needs, the second mechanical arms can be arranged at fixed positions and can be provided with traveling mechanisms to move among different grooves; the second manipulator is used for grabbing the basket of flowers 7 containing the silicon wafer 6 to be subjected to texturing, and sequentially passes through the first pickling tank 301 to the drying tank 316 so as to be subjected to texturing on the silicon wafer.

As an implementable manner, the butt-joint conveying mechanism comprises a belt conveyor, which is known to those skilled in the art to generally comprise a drive roller, a driven roller and a belt connected to the drive roller and the driven roller. The belt conveyor extends in its own conveying direction from the first part 2121 to the second part 2122. When it is desired to transfer the silicon wafer 6, the slot cover 2124 of the notch 2123 of the first part 2121 of the docking slot 212 is opened, the basket 7 containing the silicon wafer 6 is put into the belt conveyor in the docking slot 212 from the notch 2123 of the first part 2121 and covered with the slot cover 2124, the basket 7 containing the silicon wafer 6 is transferred to the second part 2122 by the belt conveyor, and after the basket is transferred to the docking slot, the slot cover 2124 of the second part 2122 of the docking slot 212 is opened, the basket 7 containing the silicon wafer 6 is taken out of the second part 2122 of the docking slot 212 and covered with the slot cover 2124.

As an implementation manner, in order to realize the automation of returning the empty flower basket 7 to the basket, the insert piece cleaning and texturing all-in-one machine further comprises a basket returning track 4, the basket returning track 4 is arranged on one side of the cleaning unit and the texturing unit, an AGV transfer trolley is arranged on the basket returning track 4, and the AGV transfer trolley is used for conveying the empty flower basket from the blanking station of the texturing unit 3 to the feeding station of the insert piece unit 1 along the basket returning track 4. The blanking station of the texturing unit 3 can be, but is not limited to, the position where the silicon wafer 6 is taken out from the flower basket 7 after texturing is finished; the loading station of the tab unit 1 can be understood, without limitation, as a location for placing an empty flower basket 7.

It will be understood that any orientation or positional relationship indicated above with respect to the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," etc., is based on the orientation or positional relationship shown in the drawings and is for convenience in describing and simplifying the utility model, and does not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and is therefore not to be considered limiting of the utility model. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by those skilled in the art that the scope of the utility model herein disclosed is not limited to the particular combination of features described above, but also encompasses other arrangements formed by any combination of features described above or equivalents thereof without departing from the inventive concept. For example, the above features may be replaced with (but not limited to) features having similar functions disclosed in the present application.

Claims

1. The utility model provides an inserted sheet washs making herbs into wool all-in-one which characterized in that includes: the inserting sheet unit, the cleaning unit and the texturing unit are arranged in sequence;

the separator is provided with a channel, and a butt joint groove is arranged in the channel in a matching and penetrating way; the docking slot has a first portion and a second portion communicating with each other, the first portion being located on the same side of the partition as the cleaning unit, the second portion being located on the other side of the partition as the texturing unit; the first part and the second part are both provided with notches, and at least one notch is movably connected with a notch cover; and a butt joint conveying mechanism is arranged in the butt joint groove.

2. An insert cleaning and texturing machine according to claim 1, wherein each notch is respectively arranged at the top of the first portion and the second portion, and the notch is movably connected with the slot cover.

3. The integrated insert cleaning and etching machine according to claim 1,

the silicon wafer conveying module is arranged on the machine base, a water tank is arranged at one end of the silicon wafer conveying module, a flower basket lifting mechanism is arranged at the other end of the silicon wafer conveying module, the water tank is fixedly connected with the machine base, and the height of the flower basket lifting mechanism in the vertical direction on the machine base is adjustable.

4. The insert cleaning and texturing machine according to claim 3, wherein the insert unit further comprises a subfissure detection module, and the subfissure detection module is used for subfissure detection of the silicon wafer to be cleaned and before texturing.

5. The integrated insert cleaning and texturing machine according to claim 4, wherein a first mounting frame is fixedly connected to the machine base, and the first mounting frame is provided with a first mounting portion located above the silicon wafer conveying module and a second mounting portion located below the silicon wafer conveying module;

6. The integrated insert cleaning and texturing machine according to claim 5, wherein a second mounting frame is fixedly connected to the machine base, the second mounting frame is provided with a third mounting portion located above the silicon wafer conveying module, an air knife is fixedly connected to the third mounting portion, and an air outlet of the air knife faces the silicon wafer conveying module;

7. The integrated insert cleaning and etching machine according to claim 6, wherein the first groove bodies arranged in sequence are a prewashing groove, a first alkaline washing groove, a second alkaline washing groove, a third alkaline washing groove, a fourth alkaline washing groove, a first rinsing groove, a second rinsing groove, a third rinsing groove, a fourth rinsing groove, a fifth rinsing groove and a sixth rinsing groove in sequence; and the sixth rinsing tank and the third rinsing tank are connected in a downward overflow mode in sequence.

8. The integrated insert piece cleaning and flocking machine according to claim 7, wherein the plurality of second tank bodies arranged in sequence are sequentially a first pickling tank, a seventh rinsing tank, a fifth alkaline washing tank, a sixth alkaline washing tank, a second acid washing tank, a first pre-flocking tank, a second pre-flocking tank, an eighth rinsing tank, a first flocking tank, a second flocking tank, a ninth rinsing tank, a third pickling tank, a fourth pickling tank, a tenth rinsing tank, an eleventh rinsing tank and a drying tank.

9. The insert cleaning and texturing machine integrated according to claim 8, wherein the cleaning unit further comprises a first manipulator, the first manipulator is used for grabbing a flower basket containing the silicon wafers to be cleaned and textured, and the flower basket sequentially passes through the pre-washing tank to the sixth rinsing tank so as to clean the silicon wafers to be cleaned and textured; and/or the presence of a gas in the gas,

10. An all-in-one tab cleaning and flocking machine according to any one of claims 1 to 9 wherein the docking conveyor comprises a belt conveyor extending from the first portion to the second portion in its own conveying direction; and/or the presence of a gas in the gas,

still including returning the basket track, return the basket track set up in the cleaning unit with one side of making herbs into wool unit, it is provided with the AGV transfer car (buggy) on the basket track to return, the AGV transfer car (buggy) is used for following return the basket track with the sky flower basket certainly the unloading station of making herbs into wool unit transports to the material loading station of inserted sheet unit.