CN201868391U - Cleaning machine platform of semiconductor packaging product - Google Patents
Cleaning machine platform of semiconductor packaging product Download PDFInfo
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- CN201868391U CN201868391U CN2010206180698U CN201020618069U CN201868391U CN 201868391 U CN201868391 U CN 201868391U CN 2010206180698 U CN2010206180698 U CN 2010206180698U CN 201020618069 U CN201020618069 U CN 201020618069U CN 201868391 U CN201868391 U CN 201868391U
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Abstract
The utility model discloses a cleaning machine platform of a semiconductor packaging product, comprising a control panel, a cleaning operation area and a drying area, wherein the control panel is positioned at the upper part of the front surface of the machine platform and is used for realizing control of the cleaning process; the cleaning operation area is positioned in the middle of the front surface of the machine platform, is shaped like a hollow groove, and comprises more than one cleaning groove; the cleaning machine platform is provided with ultrasonic generating devices corresponding to all the cleaning grooves so as to clean the semiconductor packaging product in the cleaning groove by utilizing ultrasonic wave; the drying area is used for drying the cleaned product. The cleaning process comprises the steps of ultrasonic chemical cleaning, ultrasonic washing and drying. After cleaning, the adhesive residue on the semiconductor packaging product can be basically removed completely, so that the performance of the product is greatly improved, and simultaneously, the function test of a subsequent product is convenient.
Description
Technical field
The utility model relates to a kind of semiconductor packaging, refers in particular to a kind of cleaning machine of semiconductor package product.
Background technology
As everyone knows, the purpose of semiconductor packages is to finish the pin of bare chip internal circuit and the electric interconnection of outside matrix signal exit, protects bare chip simultaneously, avoids foreign object damage, makes it can carry certain external force, realizes good thermal diffusivity.Along with the growing and market of semiconductor technology demand, the compact focus of striving unexpectedly that changes into of product for the trend and the industry of technical development to miniaturization.QFN (Quad FlatNon-leaded Package, QFN) quad flat non-pin package, it is advanced packaging technology in the semiconductor packages in recent years, the product of its encapsulation is square, the pin apportion that also is square is arranged in around the matrix bottom, product size after the encapsulation is little, power path is short, electrical property is good, the reliability height, its main technique has: that wafer back part grinding → wafer cuts into single chips → chip is bonding with lead frame → lead-in wire bonding → plastic packaging →-lettering → cutting (chip is separated from one another with chip) → extracting (chip separates from lead frame) → test → packing shipment.At present QFN encapsulates attainable minimum package dimension and can reach 0.6mm*0.3mm*0.3mm, is equivalent to one of the percentage size of a big grain of rice, is the minimum dimension that reaches in the field both at home and abroad at present.
So little encapsulation volume is a great challenge for the existing technology of QFN.In the cutting technique; to be attached on the round iron ring with the film of glue-line earlier; film is made up of glue-line and plastics; the one side of glue-line is sticked leadframe strip arranged side by side; utilize cutting machine that the one side of posting leadframe strip is cut; be that the chip of avoiding cutting breaks away from from film during cutting; film is not cut; a but residue part; because blade is to a great extent just at the glue-line of cutting on the film; for 0.6mm*0.3mm*0.3mm level package dimension; because product is extremely small, the cull that produces in the cutting adheres on the product through regular meeting, even can cling product is whole; this can greatly influence the performance and the follow-up functional test of carrying out of product, glue must be removed clean.
Because the product of encapsulation is bigger at present, cull does not produce considerable influence to its performance and functional test usually, and therefore equipment or the technology that can remove cull fully also do not arranged.
The utility model content
The technical problems to be solved in the utility model is: at encapsulation microminiature product (as 0.6mm*0.3mm*0.3mm), propose a kind of cleaning machine of the semiconductor package product that cull can be removed fully.
Technical solution of the present utility model is: a kind of cleaning machine of semiconductor package product, and described cleaning machine comprises:
Control panel is positioned at the top in board front, is used to realize the control of cleaning process;
The washing and cleaning operation district, be positioned at the middle part in board front, be the hollow groove shape, described operation area comprises more than one rinse bath, and corresponding each rinse bath of described cleaning machine is provided with ultrasonic generator, to utilize ultrasonic wave the semiconductor package product in the described rinse bath is cleaned; And
Dry section is used for the product after cleaning is carried out drying.
The cleaning machine of aforesaid semiconductor package product, wherein, operation area, described washing and cleaning operation district has deck plate, described rinse bath comprises more than one chemical tank and more than one tank, described chemical tank and tank are to be recessed into relatively and to be formed by this deck plate, be loaded with surfactant solution in the described chemical tank, be loaded with deionized water in the described tank.
The cleaning machine of aforesaid semiconductor package product, wherein, on the cell body outer peripheral sidewall of described rinse bath heating plate is installed, the temperature sensor senses probe is installed on its madial wall, the ultrasonic oscillator of described ultrasonic generator is located at the cell body bottom of each rinse bath.
The cleaning machine of aforesaid semiconductor package product, wherein, described dry section comprises that the heating of being located at downstream, washing and cleaning operation district is spin-dried for groove, and described heating is spin-dried for groove and has the cell body that is formed by this deck plate planar projections, the cell body top is provided with lid, the cell body sidewall is provided with the perforate of input service gas, and has air vent hole on the lid.
The cleaning machine of aforesaid semiconductor package product, wherein, described perforate communicates with the working gas pipeline, described working gas pipeline links to each other with air supply system, and described working gas pipeline is provided with heating arrangement, and described heating is spin-dried for the temperature sensor senses probe is installed on the madial wall of groove.
The cleaning machine of aforesaid semiconductor package product, wherein, described washing and cleaning operation district is provided with backboard, and described backboard is provided with top portion ventilation district, bottom plenum area, cleans and switch groove and rack, and described cleaning is switched groove between top portion ventilation district and bottom plenum area.
The cleaning machine of aforesaid semiconductor package product, wherein, described cleaning is switched the groove top and is had at least one tap, in the described tap deionized water is arranged.
The cleaning machine of aforesaid semiconductor package product, wherein, described top portion ventilation district and bottom plenum area have the lattice-shaped gap.
The cleaning machine of aforesaid semiconductor package product, wherein, described washing and cleaning operation district also is provided with nitrogen gun and pure water rifle, is positioned at this front end both sides, washing and cleaning operation district.
Described control panel comprises that master controller, corresponding each rinse bath and/or heating are spin-dried for a plurality of sub-controllers that groove is provided with; Described master controller is provided with scram button; Described sub-controller is provided with control rinse bath and/or heating and is spin-dried for the time controller that the temperature controller of working temperature of groove and control rinse bath and/or heating are spin-dried for the operating time of groove; The sidepiece of described board is provided with the distribution district, and described control panel is connected in the distribution box of sidepiece by the conducting wire.
The cleaning machine of aforesaid semiconductor package product, wherein, the washing and cleaning operation district of board is the hollow cell body, and its upper end is provided with drawplate type retaining door; The top at the described board back side is provided with the air draft pipeline, and the bottom of board comprises that cell body holds district, pipeline district and article placing cabinet, and described article placing cabinet has sliding door.
Characteristics of the present utility model and advantage are: the utility model is provided with ultrasonic cleaning equipment at each rinse bath, and cleaning performance is good, the high and whole workpiece cleannes unanimities of cleannes; Cleaning speed is fast, can enhance productivity greatly, must not contact cleaning fluid by staff, and is safe and reliable; The utility model is provided with dry section, is spin-dried for groove and aeration-drying district as heating, therefore, can carry out drying to the semiconductor package product after cleaning quickly and easily, is convenient to enter as early as possible subsequent handling; After cleaning, the cull of product can be removed substantially fully, has greatly improved properties of product, is convenient to the subsequent product functional test simultaneously.
Description of drawings
Fig. 1 is the stereogram of the cleaning machine of semiconductor package product of the present utility model.
Fig. 2 is the cell body of cleaning machine of semiconductor package product of the present utility model and the schematic diagram of pipeline.
Fig. 3 is the end view of the cleaning machine of semiconductor package product of the present utility model.
Fig. 4 is the stereogram of other direction of the cleaning machine of semiconductor package product of the present utility model.
The drawing reference numeral explanation:
10, first chemical tank 11, nitrogen gun 12, second chemical tank
13, clean switching groove 14, first tank 15, pure water rifle
16, second tank 18, heating are spin-dried for groove 19, distribution box
21, groove outlet pipe 31, supersonic generator are switched in exhausting interface 25, cleaning
32, bottom plenum area 34, rack 36, top portion ventilation district
38, article placing cabinet 39, the first chemical tank pipeline 41, the second chemical tank pipeline
43, the first tank pipeline 45, the second tank pipeline 46, main sewer
48, fluorescent lamp 50, control panel 52, deck plate
54, air draft passage A, master controller B, first controller
C, the second controller D, the 3rd controller E, the 4th controller
F, the 5th controller A1, temperature probe A2, heating plate
A3, ultrasonic oscillator A4, air admission hole
Embodiment
The utility model proposes a kind of chip cleaning machine that is used for semiconductor packaging process, wherein, this cleaning machine comprises control panel, washing and cleaning operation district and dry section, and this control panel is positioned at the top in board front, is used to realize the control of cleaning process; This washing and cleaning operation district is positioned at the middle part in board front, be the hollow groove shape, the operation area comprises more than one rinse bath, and corresponding each rinse bath of cleaning machine is provided with ultrasonic generator, cleans with the semiconductor chip after utilizing ultrasonic wave to the encapsulation in each rinse bath; And dry section, be used for the chip after cleaning is carried out drying.
Preferably, be provided with deck plate in this operation area, washing and cleaning operation district, said washing groove comprises more than one chemical tank and more than one tank, chemical tank and tank are to be recessed into relatively and to be formed by this deck plate, and be loaded with surfactant solution in the chemical tank, be loaded with deionized water in the described tank.Further, ultrasonic generator comprises the ultrasonic oscillator of cell body bottom installation and the supersonic generator that install at the board top, and each chemical tank and tank respectively are furnished with a supersonic generator, are used to control the vibration frequency of ultrasonic oscillator.
Preferably, on the cell body outer peripheral sidewall of each rinse bath heating plate is installed, accordingly, the temperature sensor senses probe is installed on its madial wall.
Preferably, dry section comprises that the heating of being located at downstream, washing and cleaning operation district is spin-dried for groove, and described heating is spin-dried for that groove has that plane by this deck plate protrudes out and the cell body that forms, and the cell body top is provided with lid, the cell body sidewall is provided with the perforate of input service gas, and has air vent hole on the lid.Preferably, perforate communicates with the working gas pipeline, and described working gas pipeline links to each other with air supply system, and described working gas pipeline is provided with heating arrangement, and described heating is spin-dried on the madial wall of groove the temperature sensor senses probe is installed.
Preferably, control panel comprises that master controller, corresponding each rinse bath and/or heating are spin-dried for a plurality of sub-controllers that groove is provided with; Described master controller is provided with safety guard, for example scram button; Described sub-controller is provided with temperature controller and time controller, is used to control working temperature and operating time that rinse bath and/or heating are spin-dried for groove; The sidepiece of described board is provided with the distribution district, and described control panel is connected in the distribution box of sidepiece by the conducting wire.
Be that example conjunction with figs. and specific embodiment are described in further detail embodiment of the present utility model below with the semiconductor packaging chip.
As shown in Figures 1 to 4, it is the structural representation of a specific embodiment of cleaning machine of the present utility model, and this board primary structure is as follows: skeleton is formed by stainless steel square tube Combination Welding, has strong structure; Shell is formed by the polypropylene Combination Welding; The below sliding door adopts transparent polyvinyl chloride, can well isolate acid gas, the protection operator.
This cleaning machine of present embodiment has rectangular structure, and the board mid portion is the washing and cleaning operation district, and the washing and cleaning operation district is the hollow cell body, and its upper end is provided with drawplate type retaining door, is used for closed operation district when board is non operating state, and board is protected.The operation area has deck plate 52, deck plate 52 is provided with four grooves (rinse bath), from left to right be followed successively by first chemical tank 10, second chemical tank 12, first tank 14, second tank 16, the groove that the plane that these four rinse baths are relative deck plate falls in, heating plate A2 is installed around its cell body, can make the cell body thermally equivalent, temperature sensor probe A1 is installed on the groove madial wall, be used to respond to temperature in the groove.In the present embodiment, ultrasonic generator comprises the ultrasonic oscillator A3 of cell body bottom installation and the supersonic generator that install at the board top, and each chemical tank and tank respectively are furnished with a supersonic generator, are used to control the vibration frequency of ultrasonic oscillator.Pre-set frequency when board uses, the supersonic generator switch is in open mode all the time, earlier cell body is heated to design temperature during operation, restart time controller, this moment, ultrasonic wave was also started working, and promptly the supersonic switch of each cell body is controlled by the time corresponding controller.When setting-up time then, time controller is zero clearing thereupon, ultrasonic wave also quits work.
Control panel 50 is positioned at the board top, be used to control the board operation, control mode can adopt manually, particularly, the control panel of present embodiment is provided with 6 group controllers, be followed successively by master controller A, the first controller B, the second controller C, the 3rd controller D, the 4th controller E, the 5th controller F, wherein: the first controller B to the, five controller F have temperature controlled function and time controlled function respectively, adopt the LED screen to show numerical value, the display screen below is provided with knob, control with manual mode, can set the heating-up temperature and the activity duration of cell body as required.Master controller A is provided with safety guard, and as scram button, this scram button is used in emergency circumstances realizing stopping immediately, presses this button, and board can quit work immediately.Wherein the first controller B is used to control first chemical tank 10, the second controller C is used to control second chemical tank 12, the 3rd controller D is used to control first tank, 14, the four controller E and is used to control second tank, 16, the five controller F and is used for control heating and is spin-dried for groove 18.Certainly; in order further to ensure the safe in utilization of cleaning machine; aforementioned master controller also can be provided with electric leakage safety guard and excess temperature overload protection arrangement; concrete structure as for electric leakage safety guard and excess temperature overload protection arrangement; those skilled in the art repeats no more understanding under the prerequisite of the technical program and can realizing in conjunction with the multiple structure of prior art herein.
In the present embodiment, the liquid feeding mode of four rinse baths is manual liquid feeding, and its discharge opeing mode is to utilize the drainage pipe 39,41,43,45 of gravity mode by separately to be disposed to main sewer 46, discharges through main sewer 46 again.
Heating is spin-dried for the next door that groove 18 is positioned at second tank 16, and it is the male-type cell body, and the top has lid, and lid adopts stainless steel material to make, and has some air vent holes on the lid.Heating is spin-dried for the mode that groove adopts gas heated, has a perforate A4 thereafter on the madial wall, is used to transmit hot gas, has the temperature sensor senses probe on the preceding madial wall.Perforate A4 is connected to pipeline, to link to each other with air supply system; Preferable a certain section installation heating plate at this pipeline, heating plate is preferable to have an electrical connector socket, when energized, electromagnetically operated valve is opened automatically, the beginning air feed, heating plate begins heating, during gas process heating plate, temperature raises, and electric energy is converted into heat energy, enter heating by perforate A4 and be spin-dried for groove 18, thereby the temperature that heating is spin-dried in the groove 18 raises.
In the present embodiment, be respectively equipped with on the rear wall in washing and cleaning operation district to clean and switch groove 13, bottom plenum area 32, top portion ventilation district 36 and rack 34, wherein bottom plenum area 32 and top portion ventilation district 36 are used for the gas that chemical tank solution discharges is in time discharged, its preferable lattice-shaped space at interval that is.Between bottom plenum area 32 and top portion ventilation district 36, be provided with rack 34, product when being used to place operation or article.Clean to switch groove 13 and be positioned at the top of bottom plenum area 32, the lower left of rack 34, the cleaning when being used for different cell bodies and switching, its top has outlet pipe 25.
In the present embodiment, the first half is provided with air draft pipeline 54 at the board back, and air draft pipeline 54 is used for bottom plenum area 32 and 36 air drafts of top portion ventilation district, and links to each other with the exhausting interface 21 on top.The board sidepiece has distribution box 19, as shown in Figure 4, and with placement and the switching that is used for the conducting wire.Board back Lower Half is the liquid line district, and Drainage pipe is installed.
In addition, present embodiment also is equipped with fluorescent lamp 48 at the top, operation area, is used for operating illumination.The left and right sides, operation area is separately installed with nitrogen gun 11 and pure water rifle 15, is used for drying up and cleaning of product in case of necessity.The board bottom is provided with article placing cabinet 38, and article placing cabinet 38 has sliding door, is used for material stored and article.The board bottom also has feet and pulley gear, has height and adjusts and lock function.
In addition, produce needs, guarantee to have sufficient hot water in the tank 14,16 at any time for adapting to, shorten heating time, a water heater (not shown) can be installed, water heater pipeline is linked to each other respectively with two tanks, when needing control valve is opened, hot water just flows to the tank in water heater.
Explanation by above-mentioned cleaning machine to this semiconductor package product, those skilled in the art should have certain understanding for the cleaning that this case relates to, and this cleaning comprises: A, chemical cleaning: packaged semiconductor chip is put into the rinse bath that is loaded with surfactant solution carry out ultrasonic waves for cleaning; B, washing: will through the chip after the chemical cleaning again water carry out ultrasonic waves for cleaning; C, drying: utilize the dry described chip of gas.Because each feature during the cleaning of this semiconductor package product can be selected to describe in conjunction with aforementioned cleaning machine, so locate no longer to be repeated in this description, only describe at its concrete processing step below in conjunction with the specific embodiment of this method.
For this cleaning, change the groove frequency in order to reduce solution, enhance productivity, be preferably and utilize a plurality of chemical tanks and a plurality of tank that chip is carried out repeatedly chemical cleaning and repeatedly washing.In the specific embodiment of the present utility model, be to utilize two chemical tanks that chip is carried out twice sonochemistry to clean, and utilize two tanks that chip is carried out twice washing.Wherein, the solution in the described chemical tank is surfactant solution, is deionized water in the described tank.
Preferably, comprising also between steps A and the step B and/or between described step B and the step C that one cleans switch step: the chip after will cleaning through previous step utilizes deionized water to switch cleaning, carries out next step then.
In the specific embodiment of this cleaning of the present utility model, be that packaged semiconductor chip is put into bogey respectively by different batch models, and put into successively with lower groove and clean and drying:
1. first chemical tank → temperature: 50 °～100 °, the time: 10 minutes～30 minutes, carry out first time sonochemistry and clean;
2. second chemical tank → temperature: 50 °～100 °, the time: 10 minutes～30 minutes, carry out second time sonochemistry and clean;
3. clean the groove → time of switching: 5 minutes～20 minutes, switch cleaning;
4. first tank → temperature: 50 °～100 °, the time: 10 minutes～30 minutes, carry out the ultrasonic wave washing first time;
5. second tank → temperature: 50 °～100 °, the time: 10 minutes～30 minutes, carry out the ultrasonic wave washing second time;
6. clean the groove → time of switching: 5 minutes～20 minutes, switch cleaning;
7. heating is spin-dried for groove → temperature: 100 °～120 °, and the time: 20 minutes～30 minutes, carry out the drying of chip;
8. product is placed under the ion fan and blows: 20 minutes-30 minutes time, to remove static.
Step 1 and step 2 in the above technology, step 3 is identical with step 4 technology, but adopts two chemical tanks and two tanks, and purpose is to reduce solution to change the groove frequency, enhances productivity.Solution in the chemical tank is surfactant solution, is deionized water in the tank, and through after the above technology, the glue that adheres on the product can be cleaned totally.
Though the utility model discloses with specific embodiment; but it is not in order to limit the utility model; any those skilled in the art; the displacement of the equivalent assemblies of under the prerequisite that does not break away from design of the present utility model and scope, having done; or, all should still belong to the category that this patent is contained according to equivalent variations and modification that the utility model scope of patent protection is done.
Claims (11)
1. the cleaning machine of a semiconductor package product is characterized in that, described cleaning machine comprises:
Control panel is positioned at the top in board front;
The washing and cleaning operation district is positioned at the middle part in board front, is the hollow groove shape, and described operation area comprises more than one rinse bath, and corresponding each rinse bath of described cleaning machine is provided with ultrasonic generator; And
Product after cleaning is carried out dry dry section.
2. the cleaning machine of semiconductor package product as claimed in claim 1, it is characterized in that, operation area, described washing and cleaning operation district has deck plate, described rinse bath comprises more than one chemical tank and more than one tank, described chemical tank and tank are to be recessed into relatively and to be formed by this deck plate, be loaded with surfactant solution in the described chemical tank, be loaded with deionized water in the described tank.
3. the cleaning machine of semiconductor package product as claimed in claim 1, it is characterized in that, on the cell body outer peripheral sidewall of described rinse bath heating plate is installed, the temperature sensor senses probe is installed on its madial wall, and the ultrasonic oscillator of described ultrasonic generator is located at the cell body bottom of each rinse bath.
4. the cleaning machine of semiconductor package product as claimed in claim 2, it is characterized in that, described dry section comprises that the heating of being located at downstream, washing and cleaning operation district is spin-dried for groove, and described heating is spin-dried for groove and has the cell body that is formed by this deck plate planar projections, the cell body top is provided with lid, the cell body sidewall is provided with the perforate of input service gas, and has air vent hole on the lid.
5. the cleaning machine of semiconductor package product as claimed in claim 4, it is characterized in that, described perforate communicates with the working gas pipeline, described working gas pipeline links to each other with air supply system, and described working gas pipeline is provided with heating arrangement, and described heating is spin-dried for the temperature sensor senses probe is installed on the madial wall of groove.
6. the cleaning machine of semiconductor package product as claimed in claim 1, it is characterized in that, described washing and cleaning operation district is provided with backboard, described backboard is provided with top portion ventilation district, bottom plenum area, cleans and switch groove and rack, and described cleaning is switched groove between top portion ventilation district and bottom plenum area.
7. the cleaning machine of semiconductor package product as claimed in claim 6 is characterized in that, described cleaning is switched the groove top and had at least one tap, in the described tap deionized water is arranged.
8. the cleaning machine of semiconductor package product as claimed in claim 7 is characterized in that, described top portion ventilation district and bottom plenum area have the lattice-shaped gap.
9. the cleaning machine of semiconductor package product as claimed in claim 7 is characterized in that, described washing and cleaning operation district also is provided with nitrogen gun and pure water rifle, is positioned at this front end both sides, washing and cleaning operation district.
10. the cleaning machine of semiconductor package product as claimed in claim 4 is characterized in that, described control panel comprises that master controller, corresponding each rinse bath and/or heating are spin-dried for a plurality of sub-controllers that groove is provided with; Described master controller is provided with scram button; Described sub-controller is provided with control rinse bath and/or heating and is spin-dried for the time controller that the temperature controller of working temperature of groove and control rinse bath and/or heating are spin-dried for the operating time of groove; The sidepiece of described board is provided with the distribution district, and described control panel is connected in the distribution box of sidepiece by the conducting wire.
11. the cleaning machine of semiconductor package product as claimed in claim 1 is characterized in that, the washing and cleaning operation district of board is the hollow cell body, and its upper end is provided with drawplate type retaining door; The top at the described board back side is provided with the air draft pipeline, and the bottom of board comprises that cell body holds district, pipeline district and article placing cabinet, and described article placing cabinet has sliding door.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206180698U CN201868391U (en) | 2010-11-19 | 2010-11-19 | Cleaning machine platform of semiconductor packaging product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010206180698U CN201868391U (en) | 2010-11-19 | 2010-11-19 | Cleaning machine platform of semiconductor packaging product |
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| Publication Number | Publication Date |
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| CN201868391U true CN201868391U (en) | 2011-06-15 |
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| CN2010206180698U Expired - Fee Related CN201868391U (en) | 2010-11-19 | 2010-11-19 | Cleaning machine platform of semiconductor packaging product |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103157618A (en) * | 2013-04-01 | 2013-06-19 | 北京兴科迪科技有限公司 | Steel mesh cleaning machine |
| CN107179098A (en) * | 2017-06-16 | 2017-09-19 | 南方电网科学研究院有限责任公司 | Position sequence detection apparatus for electric energy metrical safety chip |
| CN107818935A (en) * | 2017-12-06 | 2018-03-20 | 常州市科沛达超声工程设备有限公司 | Wafer resist remover |
| CN110000148A (en) * | 2019-05-22 | 2019-07-12 | 苏州施密科微电子设备有限公司 | A kind of optical enclosure cleaning machine |
| TWI694527B (en) * | 2017-09-29 | 2020-05-21 | 台灣積體電路製造股份有限公司 | Processing tool for processing singulated semiconductor die and method processing a plurality of ic die |
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2010
- 2010-11-19 CN CN2010206180698U patent/CN201868391U/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103157618A (en) * | 2013-04-01 | 2013-06-19 | 北京兴科迪科技有限公司 | Steel mesh cleaning machine |
| CN103157618B (en) * | 2013-04-01 | 2015-07-29 | 北京兴科迪科技有限公司 | steel mesh cleaning machine |
| CN107179098A (en) * | 2017-06-16 | 2017-09-19 | 南方电网科学研究院有限责任公司 | Position sequence detection apparatus for electric energy metrical safety chip |
| CN107179098B (en) * | 2017-06-16 | 2023-05-16 | 南方电网科学研究院有限责任公司 | Bit sequence detection device for electric energy metering safety chip |
| TWI694527B (en) * | 2017-09-29 | 2020-05-21 | 台灣積體電路製造股份有限公司 | Processing tool for processing singulated semiconductor die and method processing a plurality of ic die |
| US10665507B2 (en) | 2017-09-29 | 2020-05-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Automated transfer and drying tool for process chamber |
| US10991625B2 (en) | 2017-09-29 | 2021-04-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Automated transfer and drying tool for process chamber |
| US11699619B2 (en) | 2017-09-29 | 2023-07-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Automated transfer and drying tool for process chamber |
| CN107818935A (en) * | 2017-12-06 | 2018-03-20 | 常州市科沛达超声工程设备有限公司 | Wafer resist remover |
| CN110000148A (en) * | 2019-05-22 | 2019-07-12 | 苏州施密科微电子设备有限公司 | A kind of optical enclosure cleaning machine |
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