CN217369543U - Semiconductor chip ultrasonic cleaning device - Google Patents
Semiconductor chip ultrasonic cleaning device Download PDFInfo
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- CN217369543U CN217369543U CN202221251457.6U CN202221251457U CN217369543U CN 217369543 U CN217369543 U CN 217369543U CN 202221251457 U CN202221251457 U CN 202221251457U CN 217369543 U CN217369543 U CN 217369543U
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Abstract
The utility model relates to a semiconductor chip ultrasonic cleaning device, which comprises a box body and an equipment box, wherein the equipment box is arranged at one side of the back of the box body, three cleaning tanks are arranged in the box body, and the bottoms of the two cleaning tanks are provided with ultrasonic vibrators; two sides of the rest of the cleaning tanks are provided with drying devices, and the tops of the cleaning tanks are also provided with reciprocating blowing devices; and an ultrasonic generator is installed in the equipment box and is connected with the ultrasonic vibrator. Through the three cleaning tanks, the semiconductor chip workpiece can reach the required high-cleanliness requirement after being effectively cleaned, rinsed and dried by ultrasonic waves.
Description
Technical Field
The utility model relates to a part washs technical field, especially relates to a semiconductor chip ultrasonic cleaning device.
Background
For semiconductor chip cleaning, the prior art generally adopts the following two ways:
the traditional cleaning method is to rinse the chip with deionized water, in which the deionized water impacts the chip at a high flow rate to wash away impurities and contaminants on the chip, thereby achieving the cleaning effect. However, the impact force of the cleaning method on the chip is too large, which easily causes the damage of the element pattern, and the utilization rate of the deionized water of the cleaning method is low, which results in the waste of resources. The other cleaning method is to perform immersion cleaning with hydrochloric acid or hydrofluoric acid, however, the cleaning method has poor cleaning effect, and the residual solution on the surface can corrode the surface of the chip.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor chip ultrasonic cleaning device to solve the problem that meets among the above-mentioned background art.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
the ultrasonic cleaning device for the semiconductor chip comprises a box body and an equipment box, wherein the equipment box is installed on one side of the back of the box body, three cleaning tanks are arranged inside the box body, and ultrasonic vibrators are installed at the bottoms of the two cleaning tanks; two sides of the rest of the cleaning tanks are provided with drying devices, and the tops of the cleaning tanks are also provided with reciprocating blowing devices; an ultrasonic generator is installed in the equipment box and connected with an ultrasonic vibrator.
In the above scheme, reciprocal blast apparatus includes air knife nozzle and cylinder, the cylinder is installed at the back of box, the telescopic link of cylinder stretches into the inside and the air knife nozzle fixed connection of washing tank, the air source treater is installed at the top of equipment box, the air source treater passes through the solenoid valve and is connected with the air inlet of air knife nozzle.
In the above scheme, the drying devices are stainless steel heating pipes, and heat dissipation holes are formed in two sides of the cleaning tank between the two drying devices.
In the above scheme, the basket is installed respectively in every washing tank, and the apron is installed respectively at the top of every washing tank.
In the above scheme, the top of equipment box has the electric box through the support mounting, the operation screen is installed at the top of box, operation screen, reciprocal blast apparatus, supersonic generator, ultrasonic vibrator, drying device are connected with the components and parts electricity in the electric box respectively.
Compared with the prior art, the beneficial effects of the utility model are that: in the three cleaning tanks, two cleaning tanks generate high-frequency ultrasonic signals under the action of the ultrasonic vibrator, so that liquid flows and countless micro bubbles are generated in the cleaning tanks, the bubbles are closed to form instant high pressure and continuously bombard the surface of a chip workpiece, and dirt on the surface of the chip workpiece and in gaps is rapidly peeled off, so that the effect of rapid cleaning is achieved. And drying devices are arranged on two sides of the rest cleaning tank, a reciprocating blowing device is also arranged at the top of the rest cleaning tank, and the cleaning tank adopts reciprocating motion equipment and compressed air and combines circulating hot air to dry the semiconductor chip. Through the three cleaning tanks, the semiconductor chip workpiece can reach the required high-cleanliness requirement after being effectively cleaned, rinsed and dried by ultrasonic waves.
Drawings
The disclosure of the present invention is explained with reference to the drawings. It is to be understood that the drawings are designed solely for the purposes of illustration and not as a definition of the limits of the invention. In the drawings, like reference numerals are used to refer to like parts. Wherein:
FIG. 1 is a schematic view of the front three-dimensional structure of the present invention;
FIG. 2 is a schematic view of the front three-dimensional structure of the present invention;
FIG. 3 is a schematic top view of the present invention;
FIG. 4 is a schematic view of the cross-sectional structure A-A of FIG. 3;
fig. 5 is a schematic structural view of a section B-B in fig. 3.
Reference numbers in the figures: 1-a box body; 11-a cleaning tank; 12-a storage plate; 13-a basket; 14-an ultrasonic vibrator; 15-a drying device; 2-equipment box; 21-an ultrasonic generator; 22-a gas source processor; 23-a solenoid valve; 3-reciprocating air blowing device; 31-an air knife nozzle; 32-cylinder; 4-an electric box; 41-operation screen.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention will now be described in further detail with reference to the accompanying drawings. These drawings are simplified schematic drawings and illustrate the basic structure of the invention only in a schematic way, and therefore they show only the relevant components of the invention.
According to the technical scheme of the utility model, under the essential spirit of the utility model, general technical personnel in this field can propose the multiple structural style and the realization that can replace each other. Therefore, the following detailed description and the accompanying drawings are merely illustrative of the technical solutions of the present invention, and should not be considered as limiting or restricting the technical solutions of the present invention in their entirety or in any other way.
The technical solution of the present invention will be further described in detail with reference to the accompanying drawings and embodiments.
As shown in fig. 1 to 5, an ultrasonic cleaning device for semiconductor chips comprises a box body 1 and an equipment box 2, wherein the equipment box 2 is installed on one side of the back of the box body 1, three cleaning tanks 11 are arranged inside the box body 1, and the semiconductor chips are sequentially cleaned in turn. Wherein, the ultrasonic vibrators 14 are arranged at the bottoms of the two cleaning tanks 11, and the ultrasonic vibrators 14 adopt ultrasonic cleaning vibrators of 28KHz 840W. The ultrasonic generator 21 is installed in the equipment box 2, the ultrasonic generator 21 adopts a 1500w ultrasonic generator, and the ultrasonic generator 21 is connected with the ultrasonic vibrator 14 and used for carrying out immersion ultrasonic cleaning on a semiconductor chip workpiece to be cleaned so as to achieve the purpose of cleaning the surface of the chip workpiece.
The two cleaning tanks 11 are divided into a 1 st tank, an ultrasonic cleaning tank, and a 2 nd tank, an ultrasonic rinsing tank, wherein the 1 st tank, the ultrasonic cleaning tank, in operation, uses an acidic pre-cleaning liquid to perform ultrasonic pre-cleaning on the semiconductor chip, and the 2 nd tank, the ultrasonic rinsing tank, uses an alkaline cleaning liquid to perform ultrasonic cleaning on the semiconductor chip. The bottom of the tank body of the two cleaning tanks 11 is provided with a drain valve, and dirt deposited on the bottom of the tank body can be drained out of the tank body from the drain valve.
The two cleaning tanks 11 generate high-frequency ultrasonic signals under the action of the ultrasonic vibrator 14, so that liquid flows and countless micro bubbles are generated in the cleaning tanks 11, the closing of the bubbles forms instant high pressure and continuously bombards the surface of a chip workpiece, and dirt on the surface of the chip workpiece and in gaps is rapidly peeled off, so that the effect of rapid cleaning is achieved.
The reciprocating air blowing device 3 comprises an air knife nozzle 31 and an air cylinder 32, wherein the air knife nozzle 31 adopts an LQD-275 aluminum alloy air knife with the size of 275mm in length, 28mm in width and 45mm in height, and the air cylinder 32 adopts a linear air cylinder with the model number of SE 32-250S-FA. The air cylinder 32 is mounted on the back of the box body 1 through an air cylinder seat, an expansion link of the air cylinder 32 extends into the cleaning tank 11 and is fixedly connected with the air knife nozzle 31, and when the expansion link of the air cylinder 32 expands and contracts, the expansion link drives the air knife nozzle 31 to expand and contract together, so that the air knife nozzle 31 reciprocates back and forth. Because the air knife nozzle 31 is of a strip-shaped structure, the whole top position of the cleaning tank 11 is covered in the reciprocating motion process, and the chip workpiece in the cleaning tank 11 is dried by blowing air.
The top of the equipment box 2 is provided with an air source processor 22, the air source processor 22 adopts an air source processor with the model of GAFC200-08, the air source processor 22 is connected with an air inlet of an air knife nozzle 31 through an electromagnetic valve 23, and the air knife nozzle 31 is connected with an external compressed air output port or an output pipe of a fan. The electromagnetic valve 23 is a DIN plug-in type electromagnetic valve with the model number of 4V110-06-B DC 24V. The workpiece is blown dry by compressed air in a reciprocating scanning mode after being pressed close to the workpiece, in addition, the temperature in the cleaning tank 11 is maintained at 50-60 ℃ by heating air for drying, the temperature can be adjusted and controlled according to different workpieces, and the workpiece is dried quickly. The air knife nozzle 31 is connected with a fan with the flow rate of 132m3/h and the power of 45W, and the air is supplied to the two sides of the cleaning tank 11.
Preferably, the top of the inner side of the cleaning tank 11 is provided with an object placing plate 12 by a screw, and the cleaned workpiece can be placed after the 3 rd tank is finished. A basket 13 is respectively arranged in each cleaning tank 11, the basket 13 is used for intensively storing semiconductor chip workpieces, the workpieces are intensively put into the cleaning tanks 11 before cleaning or before drying, and the cleaning tanks 11 are intensively taken out after cleaning or after drying. The top of each cleaning tank 11 is provided with a cover plate which is made of stainless steel and can move, the cleaning tanks are opened and closed easily, and workpieces are sealed inside the cleaning tanks 11 of the cleaning device when cleaning is facilitated.
The top of the equipment box 2 is provided with an electrical box 4 through a support, and corresponding components and parts are installed in the electrical box 4 as required, and the electrical box is mainly used for starting and stopping equipment devices. An operation screen 41 is installed at the top of the box body 1, the operation screen 41, the reciprocating blowing device 3, the ultrasonic generator 21, the ultrasonic vibrator 14 and the drying device 15 are respectively electrically connected with components in the electric box 4, and the required parameters including the cleaning time of the first two cleaning tanks 11, the drying temperature of the other cleaning tank 11 and the like are conveniently started and stopped by one key through the operation screen 41.
No matter the structure is complex, the single workpiece or a lot of workpieces are large, the workpieces are only required to be placed in the cleaning tank 11, and the workpieces are ensured to be capable of contacting with the cleaning liquid, so that the ultrasonic cleaning device can carry out very efficient cleaning work. Different cleaning effects can be achieved by combining different solvents, and different matched production processes can be met. The whole cleaning process is completed in a manual control mode, and the cleaning product can meet the requirement of high cleanliness after being effectively cleaned, rinsed and dried by ultrasonic waves.
The above-mentioned embodiments further explain in detail the objects, technical solutions and advantages of the present invention, and it should be understood that the above-mentioned embodiments are only the embodiments of the present invention, and are not intended to limit the scope of the present invention, any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the scope of the present invention.
Claims (6)
1. The utility model provides a semiconductor chip ultrasonic cleaning device, includes box (1) and equipment box (2), equipment box (2) are installed in back one side of box (1), its characterized in that: three cleaning tanks (11) are arranged in the box body (1), wherein the bottoms of the two cleaning tanks (11) are provided with ultrasonic vibrators (14); two sides of the rest of the cleaning tanks (11) are provided with drying devices (15), and the tops of the cleaning tanks are also provided with reciprocating air blowing devices (3); an ultrasonic generator (21) is installed in the equipment box (2), and the ultrasonic generator (21) is connected with the ultrasonic vibrator (14).
2. The ultrasonic cleaning device for semiconductor chips according to claim 1, characterized in that: reciprocal blast apparatus (3) include air knife nozzle (31) and cylinder (32), the back at box (1) is installed in cylinder (32), the telescopic link of cylinder (32) stretches into to the inside and air knife nozzle (31) fixed connection of washing tank (11), air source treater (22) is installed at the top of equipment box (2), air source treater (22) are connected with the air inlet of air knife nozzle (31) through solenoid valve (23).
3. The ultrasonic cleaning device for semiconductor chips according to claim 1, characterized in that: the drying devices (15) are stainless steel heating pipes, and heat dissipation holes are formed in two sides of the cleaning tank (11) between the two drying devices (15).
4. The ultrasonic cleaning device for semiconductor chips as defined in claim 3, wherein: and an object placing plate (12) is arranged at the top of the inner side of the cleaning tank (11).
5. The ultrasonic cleaning device for semiconductor chips according to claim 1, characterized in that: a basket (13) is respectively arranged in each cleaning groove (11), and a cover plate is respectively arranged at the top of each cleaning groove (11).
6. The ultrasonic cleaning device for semiconductor chips according to claim 1, characterized in that: the top of equipment box (2) has electrical box (4) through the support mounting, operation screen (41) are installed at the top of box (1), operation screen (41), reciprocal blast apparatus (3), supersonic generator (21), ultrasonic vibrator (14), drying device (15) are connected with the components and parts electricity in electrical box (4) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221251457.6U CN217369543U (en) | 2022-05-24 | 2022-05-24 | Semiconductor chip ultrasonic cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221251457.6U CN217369543U (en) | 2022-05-24 | 2022-05-24 | Semiconductor chip ultrasonic cleaning device |
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| Publication Number | Publication Date |
|---|---|
| CN217369543U true CN217369543U (en) | 2022-09-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202221251457.6U Active CN217369543U (en) | 2022-05-24 | 2022-05-24 | Semiconductor chip ultrasonic cleaning device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117019745A (en) * | 2023-09-14 | 2023-11-10 | 福建大统新材料有限公司 | Corrosion foil intelligent cleaning device |
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2022
- 2022-05-24 CN CN202221251457.6U patent/CN217369543U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117019745A (en) * | 2023-09-14 | 2023-11-10 | 福建大统新材料有限公司 | Corrosion foil intelligent cleaning device |
| CN117019745B (en) * | 2023-09-14 | 2024-02-20 | 福建大统新材料有限公司 | Corrosion foil intelligent cleaning device |
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