CN217577167U - Blanking buffer storage table - Google Patents
Blanking buffer storage table Download PDFInfo
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- CN217577167U CN217577167U CN202220627217.5U CN202220627217U CN217577167U CN 217577167 U CN217577167 U CN 217577167U CN 202220627217 U CN202220627217 U CN 202220627217U CN 217577167 U CN217577167 U CN 217577167U
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- silicon wafer
- support frame
- receiving box
- wafer assembly
- hanging device
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/52—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices
- B65G47/68—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices adapted to receive articles arriving in one layer from one conveyor lane and to transfer them in individual layers to more than one conveyor lane or to one broader conveyor lane, or vice versa, e.g. combining the flows of articles conveyed by more than one conveyor
- B65G47/69—Devices for transferring articles or materials between conveyors i.e. discharging or feeding devices adapted to receive articles arriving in one layer from one conveyor lane and to transfer them in individual layers to more than one conveyor lane or to one broader conveyor lane, or vice versa, e.g. combining the flows of articles conveyed by more than one conveyor the articles being accumulated temporarily
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model provides a unloading buffer platform, a serial communication port, include: the supporting frame is used for supporting the silicon wafer assembly; the silicon chip assembly comprises a material seat, a connecting plate bonded on the material seat and a silicon chip bonded on the connecting plate; the hanging device is arranged on the supporting frame and used for fixing the silicon wafer assembly; the material receiving device comprises a material receiving box and a water receiving box arranged on the side edge of the material receiving box, wherein the material receiving box is arranged on the support frame and at the bottom of the material hanging device. The beneficial effects of the utility model are that hang the material device and can realize the inverse silicon chip subassembly, make and fail the firm silicon chip of bonding and can drop, the cooperation falls the condition that drops of silicon chip and connecting plate behind the crystal bar section that the piece sensor can short-term test, compares the manual inspection among the prior art, and the measuring method among the above-mentioned technical scheme can save a large amount of time, improves production efficiency.
Description
Technical Field
The utility model belongs to the technical field of photovoltaic automatic integration production manufacturing, especially, relate to an unloading buffer platform.
Background
With the rapid development of new energy industry, the photovoltaic industry is more and more fierce in competition, intelligent, safe and intelligent factories are the indispensable way for the industry development, cost control and labor saving are achieved, safe production is the way for enterprises to live, the influence of labor cost, loss and safety accidents is large in the existing state, so that less humanization, high efficiency and safety are the leading trends, a safe, simple and rapid tool is designed, the working efficiency of operators is improved, and the labor cost is reduced.
In present work production, the turnover of material relies on carrying out automatic transport according to mechanized equipment, the production line demand is unsatisfied to the work efficiency of present single unloading station, and the silicon chip subassembly still need to examine the piece condition after the line is cut, and if shift the silicon chip after cutting at once, a lot of coolant liquid can be remained on mill's ground, there is certain potential safety hazard, and when next process is not accomplished, the silicon chip subassembly can not in time get into next process, the manipulator can only be idle, the timeliness of manipulator has been reduced, and then whole production efficiency has been influenced.
SUMMERY OF THE UTILITY MODEL
The to-be-solved problem of the utility model is to provide an unloading buffer table, the unsatisfactory production line demand of work efficiency of single unloading station among the effectual solution prior art, and silicon chip module still need inspect the piece condition after the line is cut, and if shift the silicon chip after cutting at once, a lot of coolant liquid can be remained on mill's ground, there is the problem of certain potential safety hazard, still solved when next process is unfinished, silicon chip module can not in time get into next process, the manipulator can only idle, the timeliness of manipulator has been reduced, and then the problem of holistic production efficiency has been influenced.
In order to solve the technical problem, the utility model discloses a technical scheme is: the utility model provides a unloading buffering platform which characterized in that includes:
the supporting frame is used for supporting the silicon wafer assembly; the silicon chip assembly comprises a material seat, a connecting plate bonded on the material seat and a silicon chip bonded on the connecting plate;
the hanging device is arranged on the supporting frame and used for fixing the silicon wafer assembly;
the material receiving device comprises a material receiving box and a water receiving box arranged on the side edge of the material receiving box, the material receiving box is arranged on the support frame, and the silicon wafer assembly falling from the material hanging device can be collected at the bottom of the material hanging device; the water receiving box can store liquid flowing out of the silicon wafer assembly.
Preferably, the support frame comprises an outer support frame; the material hanging device is arranged at the top of the external support frame and is arranged on one side, facing the bottom, of the top of the external support frame, and the silicon wafer assembly is hung on the material hanging device; the material receiving device is arranged at the bottom of the external support frame, is arranged opposite to the material hanging device, and can collect falling silicon wafer assemblies.
Preferably, when the silicon wafer assembly is hung on the hanging device, the material seat is hung on the hanging device, one side of the material seat, which is far away from the crystal bar, contacts the hanging device, and the silicon wafer is positioned on one side close to the material receiving device.
Preferably, the supporting frame further comprises one or at least two (preferably 2-500, further preferably 2-100, further preferably 2-20) internal supporting frames, the material receiving device is placed at the top of the internal supporting frames, the material hanging device is installed at the bottom of the internal supporting frames, and one group or at least two groups (preferably 2-500, further preferably 2-100, further preferably 2-20) of the silicon wafer assemblies can be cached.
Preferably, the hanging device is a hanging feeding table, and one side of the hanging feeding table is arranged on the supporting frame and used for hanging and fixing the silicon wafer assembly.
Preferably, the bottom of the water receiving box is also provided with a drainage hole which can drain liquid inside the water receiving box.
Preferably, the silicon wafer assembly further comprises a blocking device for blocking the movement of the silicon wafer assembly, and the blocking device is arranged on one side of the supporting frame and is not arranged on the same side as the feeding side.
Preferably, the feeding side is the side where the silicon wafer assembly enters the blanking buffer table, and the blocking device is arranged on the opposite side of the feeding side and controls the moving distance of the silicon wafer assembly.
Preferably, the blocking means is configured to block the cylinder.
Preferably, the silicon wafer dropping device further comprises a wafer dropping sensor for detecting whether the silicon wafer drops, and the wafer dropping sensor is arranged on one side of the material receiving device; and if the silicon wafer falls, the falling wafer sensor gives an alarm to remind.
By adopting the technical scheme, the hanging device can realize the inverted hanging of the silicon wafer assembly, so that the silicon wafer which is not firmly bonded can fall off, the falling condition of the silicon wafer and the connecting plate after the crystal bar is sliced can be rapidly detected by matching with the falling sensor, the manual inspection in the prior art is compared, and the detection mode in the technical scheme can save a large amount of time and improve the production efficiency.
By adopting the technical scheme, residual cutting coolant liquid in the silicon wafer component can be collected to the water receiving box, ground pollution is prevented, potential safety hazards are brought to workers walking on the ground, liquid in the water receiving box does not need to be frequently replaced or poured out, and liquid stored in the water receiving box can be drained to other collecting boxes through the through hole in the bottom of the water receiving box only by regular cleaning.
Adopt above-mentioned technical scheme, set up inside braced frame among the braced frame, can increase a plurality of buffer memory positions, solve the problem that present buffer memory position can not satisfy the use amount, realize the efficiency of processing equipment and promote, can carry out the buffer memory and represent that last process just can continue processing, whole technology assembly line can not pause, can increase holistic production efficiency by a wide margin.
Drawings
FIG. 1 is a schematic view of the embodiment of the present invention showing a structure of a blanking buffer stage
In the figure:
1. external support frame 2, internal support frame 3 and hanging material feeding table
4. Material receiving box 5, blocking cylinder 6 and water receiving box
7. Chip falling sensor
Detailed Description
The invention will be further described with reference to the following examples and drawings:
in the description of the embodiments of the present invention, it should be understood that the terms "top," "bottom," and the like refer to orientations or positional relationships based on those shown in the drawings, which are used for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention. In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
As shown in fig. 1, a schematic structural diagram of a blanking buffering table, a blanking buffering table includes:
the supporting frame is used for supporting the silicon wafer assembly;
the silicon chip assembly comprises a material seat, a connecting plate bonded on the material seat and a silicon chip bonded on the connecting plate; because the silicon chips are cut in the prior art in an inverted cutting mode, namely a material seat is arranged on the upper part, a crystal bar is arranged on the lower part, and a common material seat is made of metal, if the bar is directly adhered on a metal base, the adhesion is not firm on one hand, and the metal base is easy to damage during cutting, so that the production cost is increased; in the embodiment of the utility model, a layer of connecting plate is bonded on the metal base, in some feasible embodiments, the connecting plate is a resin plate, crystal bars are bonded on the resin plate, the bonding is firm, the metal base can be protected during cutting, the cost of the resin plate is low compared with that of the metal base, and the resin plate can be used as a disposable part, namely, a silicon wafer is used as the crystal bar after cutting;
the hanging device is arranged on the supporting frame and used for fixing the silicon wafer assembly;
the material receiving device comprises a material receiving box 4 and water receiving boxes 6 arranged on two sides of the material receiving box 4, the material receiving box 4 is arranged on the supporting frame, and the silicon wafer components falling from the material hanging device can be collected at the bottom of the material hanging device; the water receiving box 6 can store liquid flowing out of the silicon wafer assembly;
the material receiving box 4 and the water receiving box 6 jointly form the material receiving device, the water receiving box 6 is detachably mounted at the edge of the side edge of the material receiving box 4, in some feasible embodiments, the water receiving box 6 is arranged at two sides of the material receiving box 4 and is not arranged at the feeding side, and the length of the water receiving box 6 is smaller than or equal to the width of the material receiving box 4.
Specifically, the support frame comprises an outer support frame 1; the whole external support frame 1 is in a shape of Chinese character 'kou', has a certain thickness while having a length and a height, and the thickness is generally set to be equal to or slightly longer than the length of the material seat, so that the whole silicon wafer assembly can be contained in the external support frame 1 in the working process without falling risk; the height of the external support frame 1 is not less than the height of the material seat, the height of the connecting plate and the height of the silicon wafer, at least one group of silicon wafer assemblies can be accommodated in the external support frame 1, and naturally, the higher the height of the external support frame 1 is, the larger the space capable of bearing the internal part is, the more the silicon wafer assemblies can be born; the length of the external support frame 1 is not less than the width of the material seat, so that at least one group of silicon wafer components can be accommodated in the external support frame 1;
the hanging device is arranged at the top of the external support frame 1 and at one side of the top of the external support frame 1, which faces the bottom, and the silicon wafer assembly is hung on the hanging device; the number of the hanging devices is at least one, and the hanging devices are related to the length of the external support frame 1, and if the length of the external support frame 1 is longer, more hanging devices can be arranged; one material hanging device can hang a group of silicon chip assemblies, and the more the material hanging devices are, the more silicon chip assemblies can be cached;
in some possible embodiments, the hanging device is configured as a hanging feeding table 3, and one side of the hanging feeding table is mounted on the inner side of the top of the outer support frame 1, so that the hanging feeding table can be used for hanging and fixing the silicon wafer assembly during operation.
The material receiving device is an assembly of a material receiving box 4 and a water receiving box 6, is placed at the bottom of the external support frame 1 and is arranged opposite to the material hanging device, so that silicon wafer assemblies falling from the material hanging device can be collected in the working process; the number of the material receiving devices is at least one, and is related to the arrangement of the internal support frames 2, if the internal support frames 2 are not arranged, only one material receiving device is arranged, and if the internal support frames 2 are arranged, the number of the internal support frames 2 is the sum of the internal support frames 2 and 1; the size of the material receiving device is related to the size of the external support frame 1, and the material receiving device at least can receive a group of silicon wafer assemblies, and is preferably consistent with the size of the cross section of the external support frame 1 or slightly smaller than the size of the cross section of the external support frame 1;
when the silicon wafer assembly is hung on the hanging device, the material seat is hung on the hanging device, one side of the material seat, far away from the silicon wafer, contacts the hanging device, the silicon wafer is located on one side close to the material receiving device, namely, the silicon wafer is hung upside down on the top of the external support frame 1, so that the silicon wafer which is not firmly bonded can fall off, and the falling-off condition of the silicon wafer and the connecting plate after the crystal bar is sliced can be quickly detected by the aid of the falling-off sensor 7.
The supporting frame further comprises one or more internal supporting frames 2, a material receiving device is placed at the top of each internal supporting frame 2, a material hanging device is installed at the bottom of each internal supporting frame 2, and a plurality of groups of silicon wafer assemblies can be cached at the same time; the inner support frame 2 is arranged inside the outer support frame 1, the inner support frame 2 can be rectangular, circular and other shapes, preferably the shape consistent with the cross section of the outer support frame 1, and is placed inside the outer support frame 1 to ensure that the distance between the top and the bottom of the inner support frame 2 and the top and the bottom of the outer support frame 1 is greater than or equal to the height of the silicon wafer assembly, so that the silicon wafer assembly can be accommodated in the blanking buffer table; the number of the inner support frames 2 is not limited, and is related to the height of the outer support frame 1, and the higher the height of the outer support frame 1 is, the more the number of the inner support frames 2 can be placed, and the more the silicon wafer components can be cached.
In some feasible embodiments, the inner support frame 1 is detachably placed inside the outer support frame 1, when a large number of cache silicon wafer assemblies are needed, the inner support frame 1 is installed, a cache space is manufactured for the silicon wafer assemblies, when a single crystal does not need to be cached, the inner support frame 1 can be detached, and the inner support frame is cleaned or installed on another blanking cache table, so that the flexible utilization rate of the inner support frame 1 is increased.
The silicon wafer assembly movement prevention device is arranged on one side of the external support frame 1 and is not arranged on the same side as the feeding side; the blocking device is preferably arranged on one side of the hanging device, is not the same as the feeding side, and can be seen from figure 1 to be arranged on the rear side of the hanging device, and the length of the blocking device at least can block the silicon wafer assembly on each layer; the number of the blocking devices is consistent with the number of the layers of the silicon wafer assemblies, so that the silicon wafer assemblies on each layer can not fall off;
wherein, the feed side is one side that silicon chip subassembly got into unloading buffer platform, and stop device sets up at the offside of feed side, and the moving distance of control silicon chip subassembly prevents that silicon chip subassembly from dropping from the offside of feed side, leads to the condition of damage silicon chip to appear.
In some possible embodiments, the blocking device is configured as a blocking cylinder 5, the blocking cylinder 5 can block when blocking is needed, and can retract when blocking is not needed, so that damage to the silicon wafer caused by collision with the silicon wafer assembly is prevented, and the production cost in the whole process is reduced.
In some possible embodiments, the silicon wafer dropping device further comprises a wafer dropping sensor 7 for detecting whether the silicon wafer drops, and the wafer dropping sensor is arranged on one side, preferably the feeding side, of the material receiving box 4; if the silicon wafer falls, the wafer falling sensor 7 gives an alarm to remind a worker to process the silicon wafer; the number of the falling sensors 7 is consistent with that of the hanging devices, namely, the silicon wafer assembly on each hanging device is provided with one falling sensor 7, so that the falling silicon wafers can be processed in time.
The above detailed description of the embodiments of the present invention is only for the purpose of describing the preferred embodiments of the present invention, and should not be construed as limiting the scope of the present invention. All the equivalent changes and improvements made according to the application scope of the present invention should still fall within the patent coverage of the present invention.
Claims (10)
1. The utility model provides a unloading buffering platform which characterized in that includes:
the supporting frame is used for supporting the silicon wafer assembly;
the hanging device is arranged on the supporting frame and used for fixing the silicon wafer assembly;
the material receiving device comprises a material receiving box and a water receiving box arranged on the side of the material receiving box, the material receiving box is arranged on the supporting frame, and the silicon wafer assembly falling from the material hanging device can be collected at the bottom of the material hanging device; the water receiving box can store liquid flowing out of the silicon wafer assembly.
2. The blanking buffer table according to claim 1, wherein: the support frame comprises an outer support frame; the material hanging device is arranged at the top of the external support frame and is arranged on one side, facing the bottom, of the top of the external support frame, and the silicon wafer assembly is hung on the material hanging device; the material receiving device is arranged at the bottom of the external support frame, is arranged opposite to the material hanging device, and can collect falling silicon wafer assemblies.
3. The blanking buffer table according to claim 2, wherein: the silicon chip assembly comprises a material seat, a connecting plate bonded on the material seat and a silicon chip bonded on the connecting plate; when the silicon wafer assembly is hung on the hanging device, the material seat is hung on the hanging device, one side of the material seat, which is far away from the crystal bar, contacts the hanging device, and the silicon wafer is located at one side close to the material receiving device.
4. A blanking buffer station according to claim 2 or 3, wherein: the support frame further comprises one or at least two internal support frames, the material receiving device is placed at the top of each internal support frame, the material hanging device is installed at the bottom of each internal support frame, and one or at least two groups of silicon wafer assemblies can be cached.
5. A blanking buffer station according to any of claims 1 to 3, wherein: the material hanging device is a material hanging feeding table, and one side of the material hanging feeding table is arranged on the supporting frame and used for hanging and fixing the silicon wafer assembly.
6. -a blanking buffer station, according to claim 1, 2 or 3, characterized in that: the bottom of the water receiving box is also provided with a drainage hole which can drain the liquid in the water receiving box.
7. A blanking buffer station according to claim 1, 2 or 3, wherein: the silicon wafer assembly moving device further comprises a blocking device for blocking the silicon wafer assembly to move, and the blocking device is arranged on one side of the supporting frame and is not arranged on the same side as the feeding side.
8. The blanking buffer table of claim 7, wherein: the feeding side is the side where the silicon wafer assembly enters the blanking buffer table, and the blocking device is arranged on the opposite side of the feeding side and used for controlling the moving distance of the silicon wafer assembly.
9. The blanking buffer table of claim 7, wherein: the blocking device is configured to block the cylinder.
10. The blanking buffer station of claim 1 or 2 or 3 or 8, wherein: the silicon wafer dropping sensor is used for detecting whether the silicon wafer drops and is arranged on one side of the material receiving device; and if the silicon wafer falls, the falling sensor gives an alarm for reminding.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220627217.5U CN217577167U (en) | 2022-03-22 | 2022-03-22 | Blanking buffer storage table |
| PCT/CN2023/083135 WO2023179685A1 (en) | 2022-03-22 | 2023-03-22 | Blanking temporary storage table |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220627217.5U CN217577167U (en) | 2022-03-22 | 2022-03-22 | Blanking buffer storage table |
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| Publication Number | Publication Date |
|---|---|
| CN217577167U true CN217577167U (en) | 2022-10-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220627217.5U Active CN217577167U (en) | 2022-03-22 | 2022-03-22 | Blanking buffer storage table |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN217577167U (en) |
| WO (1) | WO2023179685A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023179685A1 (en) * | 2022-03-22 | 2023-09-28 | Tcl中环新能源科技股份有限公司 | Blanking temporary storage table |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10132503A1 (en) * | 2001-07-05 | 2002-02-14 | Wacker Siltronic Halbleitermat | Wire saw to separate discs from work piece, e.g. to cut semiconductor wafers has work piece holder to fix work piece plate and adjusting unit to align work piece plate flush with work piece holder |
| JP5996382B2 (en) * | 2012-11-06 | 2016-09-21 | 株式会社ディスコ | Chuck table of cutting equipment |
| TWM535142U (en) * | 2016-09-13 | 2017-01-11 | Micron Diamond Wire & Equipment Co Ltd | Cutting device |
| CN206931580U (en) * | 2017-07-07 | 2018-01-26 | 常州亿晶光电科技有限公司 | The automatic loading and unloading device of dropping-prevention piece PECVD device |
| JP7139043B2 (en) * | 2018-06-07 | 2022-09-20 | 株式会社ディスコ | cutting equipment |
| CN110625836A (en) * | 2019-10-18 | 2019-12-31 | 上海新昇半导体科技有限公司 | Crystal bar workpiece plate, crystal bar cutting device and crystal bar cutting method |
| CN214687349U (en) * | 2020-12-16 | 2021-11-12 | 无锡中环应用材料有限公司 | Crystal bar bonding fixing and shaping device and production line with same |
| CN217577167U (en) * | 2022-03-22 | 2022-10-14 | 天津市环智新能源技术有限公司 | Blanking buffer storage table |
-
2022
- 2022-03-22 CN CN202220627217.5U patent/CN217577167U/en active Active
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2023
- 2023-03-22 WO PCT/CN2023/083135 patent/WO2023179685A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023179685A1 (en) * | 2022-03-22 | 2023-09-28 | Tcl中环新能源科技股份有限公司 | Blanking temporary storage table |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023179685A1 (en) | 2023-09-28 |
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