CN216597523U - Laminating device - Google Patents
Laminating device Download PDFInfo
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- CN216597523U CN216597523U CN202123396653.0U CN202123396653U CN216597523U CN 216597523 U CN216597523 U CN 216597523U CN 202123396653 U CN202123396653 U CN 202123396653U CN 216597523 U CN216597523 U CN 216597523U
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Abstract
The utility model discloses a laminating device relates to chip production facility technical field. The laminating device comprises a fixed support, an upper laminating mechanism, a lower laminating mechanism and a positioning mechanism, wherein the upper laminating mechanism is arranged on the fixed support and can adsorb a first workpiece; the lower attaching mechanism and the upper attaching mechanism are oppositely arranged, the lower attaching mechanism can bear a second workpiece and adjust the relative position of the second workpiece, the distance between the lower attaching mechanism and the upper attaching mechanism is adjustable, and when the distance between the upper attaching mechanism and the lower attaching mechanism is zero, a sealed cavity can be formed, so that the first workpiece and the second workpiece are attached in the sealed cavity to form a semi-finished product; the positioning mechanism comprises a plurality of positioning components arranged on the upper attaching mechanism at intervals, and the positioning components can acquire the position information of the first workpiece and the second workpiece in the sealed cavity in real time. This laminating device has guaranteed the laminating quality through carrying out the location calibration to first work piece and second work piece under vacuum environment.
Description
Technical Field
The utility model relates to a chip production facility technical field especially relates to a laminating device.
Background
In the production of chips, it is usually necessary to apply glass to the surfaces of the chips after dispensing and then perform UV curing. Because the specification of a single chip is small, in order to improve the production efficiency and the bonding precision of the chip, the existing method is to perform bonding and UV curing treatment by a wafer with uniformly distributed chips and glass matched with the size of the wafer. Wherein, it is inseparable to place wafer and glass under sealed environment through the laminating of evacuation realization between the two usually, because the space is limited, in order to guarantee to counterpoint the accuracy before the laminating between the two, usually need through CCD camera in order to acquire position between them and then adjust position between them. However, in the prior art, the CCD camera usually takes a picture of the wafer and the glass that are not in the sealing environment for positioning, so that when the sealing environment where the wafer and the glass are located is pumped, the wafer and the glass will slightly deform and shift in position due to the pumping force, and further the wafer and the glass are not completely aligned in the actual bonding process, and the bonding quality is not good.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a laminating device, through fix a position the calibration to first work piece and second work piece under vacuum environment, guaranteed the laminating quality.
For realizing the above technical effect, the technical scheme of the utility model as follows:
a laminating device, comprising:
fixing a bracket;
the upper laminating mechanism is arranged on the fixed support and can adsorb a first workpiece;
the lower attaching mechanism and the upper attaching mechanism are oppositely arranged, the lower attaching mechanism can bear a second workpiece and adjust the relative position of the second workpiece, the distance between the lower attaching mechanism and the upper attaching mechanism is adjustable, and when the distance between the upper attaching mechanism and the lower attaching mechanism is zero, a sealed cavity can be formed, so that the first workpiece and the second workpiece are attached in the sealed cavity to form a semi-finished product;
the positioning mechanism comprises a plurality of positioning components arranged on the upper attaching mechanism at intervals, and the positioning components can acquire the position information of the first workpiece and the second workpiece in the sealed cavity in real time.
As an alternative to the attaching device, the upper attaching mechanism includes:
the bottom surface of the first adsorption platform deck is provided with a first adsorption plate, the first adsorption plate can be adsorbed and attached to the upper surface of the first workpiece, and the height of the first adsorption plate is adjustable;
the material taking device comprises a first material taking assembly, wherein the first material taking assembly comprises a plurality of first guide modules arranged on a first adsorption platform, the first guide modules are arranged around the first adsorption plate, a first sucking disc is arranged at the lower end of each first guide module, the height of the first sucking disc is adjustable, and the first sucking disc can penetrate through the first adsorption plate and be attached to the upper surface of a first workpiece.
As an alternative of the attaching device, the upper attaching mechanism further comprises leveling components, and the leveling components are arranged on the first adsorption carrying platform in a surrounding mode so that the lower surface of the first workpiece and the upper surface of the second workpiece are always parallel in the attaching process.
As an alternative to the attaching device, the lower attaching mechanism includes:
the height of the second adsorption platform deck is adjustable, a second adsorption plate is arranged on the surface of the second adsorption platform deck, and the second adsorption plate can be attached to the lower surface of the second workpiece;
the second material taking assembly comprises a plurality of second guide modules arranged on the second adsorption platform deck, the second guide modules are arranged on the periphery of the second adsorption plate below, a second sucker is arranged at the upper end of each second guide module, and the second sucker is adjustable in height and can penetrate through the second adsorption plate to be attached to the lower surface of the second workpiece.
As an alternative of the bonding device, the lower bonding mechanism further includes an alignment mechanism disposed below the second adsorption plate, and the alignment mechanism is configured to receive a correction amount to drive the second adsorption plate to move or rotate in the X-axis direction and the Y-axis direction.
As an alternative to a conformable device, the positioning assembly includes:
a CCD camera;
the camera mounting seat is arranged on the upper attaching mechanism and is connected with the CCD camera;
the first moving module is connected with the camera mounting seat and used for enabling the CCD camera to move along the X-axis direction or the Y-axis direction;
and the second moving module is connected with the camera mounting seat and used for enabling the CCD camera to move along the Z-axis direction.
As an alternative of the attaching device, a first window and a second window are formed in the first adsorption carrying platform, and the positioning assembly can respectively acquire position information of the first workpiece and the second workpiece in the sealed cavity through the first window; the second window is convenient for manually observing the condition in the sealed cavity.
As an alternative to a laminating device, the laminating device further comprises a suction mechanism, the suction mechanism comprising:
the vacuum pump is used for generating a vacuum environment for the sealed cavity;
and the vacuum baffle valve is arranged on the upper laminating mechanism and is respectively connected with the sealed cavity and the vacuum pump.
As an alternative of the laminating device, the laminating device further comprises a pre-curing mechanism, wherein the pre-curing mechanism is arranged between the upper laminating mechanism and the lower laminating mechanism and used for pre-curing the semi-finished product.
As an alternative to the laminating device, the pre-curing mechanism includes:
the pre-curing lamp is positioned on one side of the sealed cavity;
the guide piece is installed on the upper attaching mechanism and can move along the Y-axis direction, and the pre-curing lamp is connected with the guide piece.
The utility model has the advantages that: the utility model provides a laminating device, during the use, it adsorbs first work piece to go up laminating mechanism, lower laminating mechanism bears the second work piece, make first work piece and second work piece set up along vertical direction relatively, laminating mechanism and interval between the lower laminating mechanism and then form seal chamber on the adjustment afterwards, first work piece and second work piece all are located seal chamber and have certain distance between the two this moment, form vacuum environment to seal chamber bleeding afterwards, and then acquire the position information of first work piece and second work piece respectively through positioning mechanism and adjust the position of second work piece as required again, thereby make first work piece and second work piece location accurate so that accomplish follow-up laminating between the two. In addition, compared with the situation that the position information of the first workpiece and the position information of the second workpiece are respectively obtained through the two positioning assemblies in the prior art, the system error of the positioning assemblies can be avoided by respectively obtaining the position information of the first workpiece and the position information of the second workpiece through one positioning assembly, the positioning accuracy between the first workpiece and the second workpiece is further ensured, and the attaching effect is improved. This laminating device has guaranteed the laminating quality through carrying out the location calibration to first work piece and second work piece under vacuum environment.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
Fig. 1 is a schematic structural view of a laminating apparatus according to an embodiment of the present invention;
fig. 2 is a first schematic structural view of an upper attaching mechanism according to an embodiment of the present invention;
fig. 3 is a schematic structural view of an upper attaching mechanism according to an embodiment of the present invention;
fig. 4 is a schematic structural view of a lower attaching mechanism according to an embodiment of the present invention.
Reference numerals:
1. fixing a bracket;
2. an upper attaching mechanism;
21. a first adsorption stage; 211. a second window;
221. a first guide module; 222. a first driving member;
23. a leveling assembly;
241. a second driving member;
25. a fastener;
3. a lower attaching mechanism;
31. a second adsorption stage; 311. a second adsorption plate;
323. a third driving member;
33. an alignment mechanism;
341. a slide rail; 342. a fourth drive;
35. a sealing strip;
41. a positioning assembly; 411. a CCD camera; 412. a camera mount; 413. a first moving module; 414. a second moving module;
51. a vacuum flapper valve; 52. a vacuum bellows;
61. a pre-curing lamp; 62. a guide member;
100. a second workpiece.
Detailed Description
Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
It will be understood that the terms "central," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in an orientation or positional relationship indicated in the drawings for convenience in describing and simplifying the invention, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning. Wherein the terms "first position" and "second position" are two different positions.
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.
As shown in fig. 1 to 4, the present embodiment provides a bonding apparatus, including a fixed support 1, an upper bonding mechanism 2, a lower bonding mechanism 3, and a positioning mechanism, where the upper bonding mechanism 2 is installed on the fixed support 1, and the upper bonding mechanism 2 can adsorb a first workpiece; the lower attaching mechanism 3 and the upper attaching mechanism 2 are oppositely arranged, the lower attaching mechanism 3 can bear a second workpiece 100 and adjust the relative position of the second workpiece 100, the distance between the lower attaching mechanism 3 and the upper attaching mechanism 2 is adjustable, and a sealed cavity can be formed when the distance between the upper attaching mechanism 2 and the lower attaching mechanism 3 is zero, so that the first workpiece and the second workpiece 100 are attached in the sealed cavity to form a semi-finished product; the positioning mechanism comprises a plurality of positioning components 41 which are arranged on the upper attaching mechanism 2 at intervals, and the positioning components 41 can acquire the position information of the first workpiece and the second workpiece 100 in the sealed cavity in real time.
During the use, go up laminating mechanism 2 and adsorb first work piece, lower laminating mechanism 3 bears second work piece 100, make first work piece and second work piece 100 set up along vertical direction relatively, the interval between laminating mechanism 2 and the lower laminating mechanism 3 and then form seal chamber in the adjustment afterwards, first work piece and second work piece 100 all are located seal chamber and have certain distance between the two this moment, form vacuum environment to seal chamber bleeding afterwards, and then acquire the position information of first work piece and second work piece 100 respectively through positioning mechanism and adjust the position of second work piece 100 as required again, thereby make first work piece and second work piece 100 fix a position the accuracy so that accomplish follow-up laminating between the two. In addition, compared with the prior art in which the position information of the first workpiece and the second workpiece 100 is respectively obtained by two positioning assemblies 41, the system error of the positioning assemblies 41 can be avoided by respectively obtaining the position information of the first workpiece and the second workpiece 100 by one positioning assembly 41, so that the positioning accuracy between the first workpiece and the second workpiece 100 is further ensured, and the attaching effect is improved. The laminating device ensures the laminating quality by positioning and calibrating the first workpiece and the second workpiece 100 in a vacuum environment.
In this embodiment, the first workpiece is glass, the second workpiece 100 is a wafer, and a plurality of chips are uniformly distributed on the wafer.
As shown in fig. 2 and fig. 3, the upper attaching mechanism 2 includes a first adsorption carrier 21 and a first material taking assembly, a first adsorption plate is arranged on the bottom surface of the first adsorption carrier 21, the first adsorption plate can be attached to the upper surface of the first workpiece in an adsorption manner, and the height of the first adsorption plate is adjustable; the first material taking assembly comprises a plurality of first guide modules 221 arranged on the first adsorption carrying platform 21, the plurality of first guide modules 221 are arranged below the first adsorption plate in a surrounding mode, a first suction cup is arranged at the lower end of each first guide module 221, and the height of each first suction cup is adjustable and can penetrate through the first adsorption plate to be attached to the upper surface of the first workpiece.
It can be understood that, since the fingers of the carrying mechanism contact the non-attaching surfaces (i.e. the upper surface of the first workpiece and the lower surface of the second workpiece 100) of the first workpiece and the second workpiece 100 when the first workpiece and the second workpiece 100 are transferred to the attaching mechanism by the carrying mechanism, respectively, in order to ensure the cleanliness of the attaching surfaces (i.e. the lower surface of the first workpiece and the upper surface of the second workpiece 100), when the first workpiece needs to be attached to the first attaching plate, the height of the first suction cup is adjusted by the first guiding module 221 so as to extend out of the first attaching plate in the direction close to the lower attaching mechanism 3, i.e. the upper surface of the first workpiece is first attached to the first suction cup so that the fingers of the carrying mechanism can withdraw, then the first suction cup is adjusted by the first guiding module 221 so as to retract until the upper surface of the first workpiece is attached to the first attaching plate, and then the adsorption function of the first adsorption plate is opened and the adsorption function of the first sucker is closed. In this embodiment, the first guiding module 221 is composed of a guide post and a guide sleeve, and the guide post and the guide sleeve are common knowledge in the field of machinery, so the embodiment is not specifically described.
Further, in order to ensure the stability of the first workpiece adsorption, the number of the first guide modules 221 is plural, and the plural first guide modules 221 are circumferentially disposed on the first adsorption plate.
In this embodiment, the first material taking assembly further includes a first driving member 222, and a driving end of the first driving member 222 is connected to the first guiding module 221, and is configured to drive the guide pillar to drive the first suction disc to move along the Z-axis direction.
Illustratively, the first drive 222 is a lead screw motor.
Alternatively, in consideration of the need to evacuate the sealed cavity, the suction cup can be inserted into the first adsorption plate, and a sealing ring is disposed at the connection position of the first guide module 221 and the first adsorption stage 21.
Specifically, in order to ensure that the first adsorption plate can drive the first workpiece to be close to the second workpiece 100 by adjusting the height of the first adsorption plate after the sealed cavity is formed, the upper attaching mechanism 2 further comprises a first attaching lifting assembly connected with the first adsorption plate, the first attaching lifting assembly comprises a second driving piece 241, and the driving end of the second driving piece 241 is connected with the first adsorption plate and used for driving the first adsorption plate to move along the Z-axis direction.
Illustratively, the first drive 222 is a lead screw motor.
In this embodiment, considering that the upper bonding mechanism 2 is suspended on the fixed support through the fastening member 25, the bonding mechanism further includes a leveling component 23, and the leveling components 23 are circumferentially arranged on the first suction stage 21, so that the lower surface of the first workpiece and the upper surface of the second workpiece 100 are always parallel in the bonding process. Since the leveling assembly 23 is a mature product in the field and can be obtained by outsourcing, detailed description of the specific structure and working process thereof is omitted.
Illustratively, the fastener 25 is a threaded rod.
As shown in fig. 4, the lower attaching mechanism 3 includes a second adsorption stage 31 and a second material taking assembly, the height of the second adsorption stage 31 is adjustable, a second adsorption plate 311 is arranged on the surface of the second adsorption stage 31, and the second adsorption plate 311 can be attached to the lower surface of the second workpiece 100; the second material taking assembly comprises a plurality of second guide modules arranged on the second adsorption carrying platform 31, the plurality of second guide modules are arranged below the second adsorption plate 311 in a surrounding mode, a second suction cup is arranged at the upper end of each second guide module, and the second suction cup is adjustable in height and can penetrate through the second adsorption plate 311 to be attached to the lower surface of the second workpiece 100.
Similarly, when the second workpiece 100 needs to be adsorbed on the second adsorption plate 311, the fingers of the carrying mechanism are located below the second workpiece 100, i.e., the fingers are attached to the lower surface of the second workpiece 100, the height of the second suction cup is adjusted by the second guide module to enable the second suction cup to extend out of the second adsorption plate 311 in the direction close to the upper attaching mechanism 2, i.e., the lower surface of the second workpiece 100 is firstly adsorbed on the second suction cup so that the fingers of the carrying mechanism can exit, then the second suction cup is adjusted by the second guide module to enable the second suction cup to retract until the lower surface of the second workpiece 100 is attached to the second adsorption plate 311, and then the adsorption function of the second adsorption plate 311 is started and the adsorption function of the second suction cup is closed. In this embodiment, the second guiding module is composed of a guide post and a guide sleeve, and the guide post and the guide sleeve are common knowledge in the field of machinery, so the embodiment is not specifically described.
Optionally, the first adsorption stage 21 and the second adsorption stage 31 are both made of an aluminum alloy material, which has the advantages of high rigidity and light weight.
Optionally, in order to ensure the sealing performance of the sealed cavity when the first adsorption stage 21 and the second adsorption stage 31 are attached together, a sealing strip 35 is provided on the second adsorption stage 31.
Further, in order to ensure the stability of the adsorption of the second workpiece 100, the number of the second guide modules is multiple, and the multiple second guide modules are circumferentially arranged on the second adsorption plate 311.
In this embodiment, the second material taking assembly further includes a third driving member 323, and a driving end of the third driving member 323 is connected to the second guiding module, and is configured to drive the guide pillar to drive the second suction disc to move along the Z-axis direction.
Illustratively, the third drive 323 is a lead screw motor.
Specifically, in order to ensure that the lower attaching mechanism 3 can move in the Z-axis direction to be close to the upper attaching mechanism 2 to form a sealed cavity, so that the second suction stage 31 can drive the second workpiece 100 on the second suction plate 311 to be close to the first workpiece by adjusting the height of the second suction stage 31, the lower attaching mechanism 3 further includes a second attaching and lifting assembly connected to the second suction stage 31, the second attaching and lifting assembly includes a slide rail 341 and a fourth driving member 342 extending in the Z-axis direction, the slide rail 341 is disposed on the fixed support 1, and a driving end of the fourth driving member 342 is connected to the second suction stage 31 and is configured to drive the second suction stage 31 to move in the Z-axis direction.
Illustratively, the fourth driving member 342 is a lifting cylinder.
Further, considering that the tape positioning assembly 41 needs to be finely adjusted after acquiring the position information of the first workpiece and the second workpiece 100 to ensure accurate alignment of the first workpiece and the second workpiece 100, the lower bonding mechanism 3 further includes an alignment mechanism 33 disposed below the second suction plate 311, and the alignment mechanism 33 is configured to receive the correction amount to drive the second suction plate 311 to move or rotate in the X-axis direction and the Y-axis direction, so as to achieve alignment of the second workpiece 100 in the XXY direction. Since the alignment in the XXY direction by the alignment mechanism 33 is a common technique for those skilled in the art, the embodiment will not be described in detail.
In this embodiment, the fifth driving unit for driving the alignment mechanism 33 is disposed outside the second suction stage 31, thereby reducing the space required for the second suction stage 31 as much as possible.
The positioning assembly 41 includes a CCD camera 411, a camera mounting base 412, a first moving module 413 and a second moving module 414, wherein the camera mounting base 412 is disposed on the upper attaching mechanism 2 and connected to the CCD camera 411; the first moving module 413 is connected to the camera mounting base 412, and is configured to enable the CCD camera 411 to move along the X-axis direction or the Y-axis direction; the second moving module 414 is connected to the camera mount 412, and is configured to move the CCD camera 411 in the Z-axis direction. First, the first workpiece is photographed and positioned by the CCD camera 411, and then the second moving module 414 moves the CCD camera 411 downward to photograph and position the second workpiece 100.
In this embodiment, the number of the positioning assemblies 41 is three, that is, the first moving module 413 of two of the positioning assemblies 41 can move the CCD camera 411 along the X-axis direction, and the first moving module 413 of the other positioning assembly 41 can move the CCD camera 411 along the Y-axis direction, so that the positioning device can adapt to the first and second workpieces 100 with different sizes, and can ensure the accurate positioning of the first and second workpieces 100. It will be appreciated that if the first and second workpieces 100 have their locating points, the number of locating elements 41 need only be two.
Further, a first window is formed in the first adsorption carrying table 21, so that the positioning assembly 41 can respectively obtain the position information of the first workpiece and the second workpiece 100 located in the sealed cavity through the first window;
optionally, a second window 211 is further formed in the first adsorption carrying stage 21, and the second window 211 facilitates manual observation of the condition in the sealed cavity, so that a worker can timely respond.
In this embodiment, in order to form a vacuum environment in the sealed cavity, the attaching device further includes an air extracting mechanism, which includes a vacuum pump and a vacuum flapper valve 51, and is used for generating a vacuum environment in the sealed cavity; a vacuum flapper valve 51 is provided on the upper attaching mechanism 2 and is connected to the sealed chamber and the vacuum pump through a vacuum bellows 52, respectively, so as to control the opening and closing of the vacuum pump.
Further, in consideration of the requirement of carrying the first workpiece and the second workpiece 100 to a curing device for curing after the first workpiece and the second workpiece are bonded together, the bonding device further comprises a pre-curing mechanism, which is arranged between the upper bonding mechanism 2 and the lower bonding mechanism 3 and is used for pre-curing the semi-finished product so as to avoid relative movement between the first workpiece and the second workpiece 100 during carrying after bonding.
Specifically, the pre-curing mechanism comprises a pre-curing lamp 61 and a guide piece 62, wherein the pre-curing lamp 61 is positioned on one side of the sealed cavity; the guide 62 is mounted on the upper attaching mechanism 2 and the guide 62 can move in the Y-axis direction, and the precuring lamp 61 is connected to the guide 62. That is, after the first workpiece and the second workpiece 100 are bonded, the adsorption function of the first adsorption plate is turned off, the fourth driving part 342 is driven to make the second adsorption stage 31 far away from the first adsorption stage 21, the pre-curing lamp 61 is turned on, and the guide part 62 is moved along the Y-axis direction to drive the pre-curing lamp 61 to uniformly sweep over the bonded first workpiece and second workpiece 100, so as to complete the pre-curing treatment.
The working flow of the whole laminating device is as follows:
first, the carrying mechanism moves the first workpiece to the lower side of the first adsorption plate, the first driving part 222 of the first material taking assembly drives the first guiding module 221 to drive the first suction cup to extend out of the first adsorption plate, the adsorption function of the first suction cup is started to adsorb the first workpiece on the first suction cup, and then the finger of the carrying mechanism is convenient to withdraw. Then, the first driving member 222 of the first material taking assembly reversely drives the first guiding module 221 to drive the first suction cup to retract into the first suction plate so that the upper surface of the first workpiece can be attached to the first suction plate, and then the adsorption function of the first suction plate is started and the adsorption function of the first suction cup is closed to realize that the first suction plate adsorbs the first workpiece.
On the other side, the carrying mechanism moves the second workpiece 100 to the position above the second adsorption plate 311, the third driving part 323 of the second material taking assembly drives the second guiding module to drive the second suction cup to extend out of the second adsorption plate 311, the adsorption function of the second suction cup is started to adsorb the second workpiece 100 on the first suction cup, and then the finger of the carrying mechanism is convenient to withdraw. Then, the third driving member 323 of the second material taking assembly reversely drives the second guiding module to drive the second suction cup to retract into the second suction plate 311, so that the lower surface of the second workpiece 100 can be attached to the second suction plate 311, and then the suction function of the second suction plate 311 is turned on and the suction function of the second suction cup is turned off, so that the second suction plate 311 sucks the second workpiece 100.
After the first workpiece and the second workpiece 100 are adsorbed, the fourth driving part 342 in the second adhering and lifting mechanism of the lower adhering mechanism 3 drives the second adsorbing carrier 31 to approach the first adsorbing carrier 21 until the two adhere together to form a sealed cavity. The vacuum flapper valve 51 is then opened to create a vacuum environment within the sealed cavity. Then, the second driving member 241 of the first bonding lifting assembly of the upper bonding mechanism 2 drives the first adsorption plate to approach the second adsorption plate 311 until reaching a preset distance, at this time, the CCD camera 411 first photographs the first workpiece to obtain the position information of the first workpiece, and then the CCD camera 411 descends along the Z-axis direction when passing through the second moving module 414 to photograph the second workpiece 100 to obtain the position information of the second workpiece 100, the aligning mechanism 33 is controlled according to the position information of the first workpiece and the second workpiece 100 to drive the second workpiece 100 on the second adsorption plate 311 to complete the correction so as to ensure the accurate alignment of the first workpiece and the second workpiece 100, and the second driving piece 241 of the first attaching lifting assembly of the upper attaching mechanism 2 drives the first adsorption plate to be close to the second adsorption plate 311 again so that the first workpiece and the second workpiece 100 are attached with zero gap and continue for a period of time to complete the attachment of the first workpiece and the second workpiece 100. The adsorption function of the vacuum baffle valve 51 and the first adsorption plate is closed, the second driving part 241 drives the first adsorption plate to be far away from the second adsorption plate 311, the fourth driving part 342 drives the second adsorption carrying platform 31 to be far away from the first adsorption carrying platform 21 to return to the initial position, the pre-curing lamp 61 is further turned on, the guide part 62 is made to move along the Y-axis direction to drive the pre-curing lamp 61 to uniformly sweep over the attached first workpiece and the attached second workpiece 100, and the pre-curing treatment is completed to form a semi-finished product.
And finally, opening the adsorption function of the second sucker to enable the semi-finished product to be adsorbed on the second sucker, closing the adsorption function of the second adsorption plate 311, driving the second guide module by the third driving piece 323 to drive the second sucker to stretch out from the second adsorption plate 311 to enable the lower surface of the semi-finished product to be far away from the second adsorption plate 311, enabling the fingers of the carrying mechanism to stretch into and adsorb the lower surface of the semi-finished product, closing the adsorption function of the second sucker to enable the carrying mechanism to transfer the semi-finished product, and driving the second guide module by the third driving piece 323 to drive the second sucker to retract into the second adsorption plate 311.
In the description herein, references to the description of "some embodiments," "other embodiments," or the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only for the preferred embodiment of the present invention, and for those skilled in the art, there are variations on the detailed description and the application scope according to the idea of the present invention, and the content of the description should not be construed as a limitation to the present invention.
Claims (10)
1. A laminating device, comprising:
a fixed bracket (1);
the upper attaching mechanism (2) is installed on the fixed support (1), and the upper attaching mechanism (2) can adsorb a first workpiece;
the lower attaching mechanism (3) and the upper attaching mechanism (2) are oppositely arranged, the lower attaching mechanism (3) can bear a second workpiece (100) and adjust the relative position of the second workpiece (100), the distance between the lower attaching mechanism (3) and the upper attaching mechanism (2) is adjustable, and when the distance between the upper attaching mechanism (2) and the lower attaching mechanism (3) is zero, a sealed cavity can be formed, so that the first workpiece and the second workpiece (100) are attached in the sealed cavity to form a semi-finished product;
the positioning mechanism comprises a plurality of positioning components (41) which are arranged on the upper attaching mechanism (2) at intervals, and the positioning components (41) can acquire the position information of the first workpiece and the second workpiece (100) in the sealed cavity in real time.
2. The laminating device according to claim 1, characterized in that the upper laminating mechanism (2) comprises:
the first adsorption platform deck (21), the bottom surface of the first adsorption platform deck (21) is provided with a first adsorption plate, the first adsorption plate can be adsorbed and attached to the upper surface of the first workpiece, and the height of the first adsorption plate is adjustable;
the material taking device comprises a first material taking assembly, wherein the first material taking assembly comprises a plurality of first guide modules (221) arranged on a first adsorption carrying platform (21), the first guide modules (221) are arranged around the lower portion of a first adsorption plate, a first suction cup is arranged at the lower end of each first guide module (221), and the first suction cup is adjustable in height and can penetrate through the first adsorption plate to be attached to the upper surface of a first workpiece.
3. The bonding apparatus according to claim 2, wherein the upper bonding mechanism (2) further comprises a leveling component (23), and a plurality of leveling components (23) are circumferentially arranged on the first suction stage (21) so that the lower surface of the first workpiece and the upper surface of the second workpiece (100) are always parallel in the bonding process.
4. The laminating device according to claim 1, characterized in that the lower laminating mechanism (3) comprises:
the height of the second adsorption stage (31) is adjustable, a second adsorption plate (311) is arranged on the surface of the second adsorption stage (31), and the second adsorption plate (311) can be attached to the lower surface of the second workpiece (100);
the second material taking assembly comprises a plurality of second guide modules arranged on the second adsorption carrying platform (31), the second guide modules are arranged on the lower portion of the second adsorption plate (311) in a surrounding mode, a second sucking disc is arranged at the upper end of each second guide module, the height of the second sucking disc is adjustable, and the second sucking disc can penetrate through the second adsorption plate (311) to be attached to the lower surface of the second workpiece (100).
5. The bonding apparatus according to claim 4, wherein the lower bonding mechanism (3) further comprises an alignment mechanism (33) disposed below the second suction plate (311), and the alignment mechanism (33) is configured to receive a correction amount to drive the second suction plate (311) to move or rotate in the X-axis direction and the Y-axis direction.
6. The laminating device according to claim 1, characterized in that the positioning assembly (41) comprises:
a CCD camera (411);
a camera mounting base (412), wherein the camera mounting base (412) is arranged on the upper attaching mechanism (2) and is connected with the CCD camera (411);
a first moving module (413), wherein the first moving module (413) is connected with the camera mounting base (412) and is used for enabling the CCD camera (411) to move along the X-axis direction or the Y-axis direction;
a second moving module (414), wherein the second moving module (414) is connected with the camera mounting base (412) and is used for enabling the CCD camera (411) to move along the Z-axis direction.
7. The laminating device according to claim 2, wherein a first window and a second window (211) are formed on the first adsorption carrying stage (21), and the positioning assembly (41) can respectively acquire the position information of the first workpiece and the second workpiece (100) in the sealed cavity through the first window; the second window (211) is convenient for manual observation of the condition in the sealed cavity.
8. The laminating device of claim 1, further comprising a suction mechanism, the suction mechanism comprising:
the vacuum pump is used for generating a vacuum environment for the sealed cavity;
and the vacuum baffle valve (51) is arranged on the upper laminating mechanism (2) and is respectively connected with the sealed cavity and the vacuum pump.
9. The laminating device according to any one of claims 1 to 8, further comprising a pre-curing mechanism disposed between the upper laminating mechanism (2) and the lower laminating mechanism (3) for pre-curing the semi-finished product.
10. The laminating device of claim 9, wherein the pre-curing mechanism comprises:
a pre-curing lamp (61), wherein the pre-curing lamp (61) is positioned on one side of the sealed cavity;
the guide piece (62) is installed on the upper attaching mechanism (2), the guide piece (62) can move in the Y-axis direction, and the pre-curing lamp (61) is connected with the guide piece (62).
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| CN202123396653.0U CN216597523U (en) | 2021-12-30 | 2021-12-30 | Laminating device |
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| CN202123396653.0U CN216597523U (en) | 2021-12-30 | 2021-12-30 | Laminating device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115352171A (en) * | 2022-10-21 | 2022-11-18 | 苏州优备精密智能装备股份有限公司 | High-precision vacuum laminating equipment and laminating method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115352171A (en) * | 2022-10-21 | 2022-11-18 | 苏州优备精密智能装备股份有限公司 | High-precision vacuum laminating equipment and laminating method thereof |
| CN115352171B (en) * | 2022-10-21 | 2023-01-24 | 苏州优备精密智能装备股份有限公司 | High-precision vacuum laminating equipment and laminating method thereof |
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