CN210675767U - Double-station dispensing laminating machine - Google Patents
Double-station dispensing laminating machine Download PDFInfo
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- CN210675767U CN210675767U CN201921169145.9U CN201921169145U CN210675767U CN 210675767 U CN210675767 U CN 210675767U CN 201921169145 U CN201921169145 U CN 201921169145U CN 210675767 U CN210675767 U CN 210675767U
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Abstract
The utility model relates to an rigging machine technical field discloses a rigging machine is glued to duplex position point, and it includes dispensing mechanism, lower dispensing mechanism and two loading laminating mechanisms. The loading and attaching mechanism comprises an upper substrate loading assembly and a lower substrate loading assembly positioned above the lower substrate loading assembly. And the upper dispensing mechanism dispenses the upper substrate on the upper substrate loading assembly. The lower dispensing mechanism dispenses the lower substrate on the lower substrate loading assembly. The upper substrate loading assembly makes a turning motion to enable one side of the upper substrate loading assembly, which is loaded with the upper substrate, to be opposite to or back to the lower substrate loading assembly, and the upper substrate loading assembly can make a descending motion to be buckled with the lower substrate loading assembly. The lower substrate loading assembly can do lifting movement so as to enable the lower substrate to be attached to the upper substrate. The beneficial effects of the utility model are that accomplish the point of upper substrate through last dispensing mechanism and glue, lower dispensing mechanism accomplishes the point of infrabasal plate and glues, glues laminating with the point of upper substrate and infrabasal plate and handles to concentrate on a duplex position point and glue rigging machine, has improved machining efficiency.
Description
Technical Field
The utility model relates to an rigging machine technical field especially relates to a rigging machine is glued to duplex position point.
Background
The double-station dispensing laminating machine is widely applied to industrial production of touch screens, and laminating of two substrates of the touch screens is completed through the double-station dispensing laminating machine, so that laminating precision and working efficiency are greatly improved.
Present convertible duplex position point is glued rigging machine's structure includes and places the cavity down, on place the cavity, the upset driving piece, counterpoint driving piece and gluey mechanism, wherein, on place the cavity and install on the upset driving piece, and set up and place the cavity under, the upset driving piece can drive vacuum adsorption have the cavity of placing of upper substrate to carry out 180 degrees upsets, when the upper substrate upset is up, the point is glued the supplementary point of accomplishing the upper substrate of mechanism, when the upper substrate upset is down, just right of upper substrate and infrabasal plate, place the cavity under the cavity lock in the counterpoint driving piece drive, accomplish the laminating work of upper substrate and infrabasal plate. In order to avoid glue overflow when the upper substrate and the lower substrate are jointed, and avoid that glue is easy to flow out from the upper substrate in the overturning process due to too much glue dispensing amount to influence jointing only on the upper substrate. Usually, before the lower substrate is loaded to the lower placing chamber, an operator can use other devices to perform pre-dispensing treatment on the lower substrate, on one hand, dam surface glue is formed on the attaching surface of the lower substrate, so that the glue overflowing problem in the attaching process can be effectively prevented, and on the other hand, the problem that the single upper substrate possibly flows out due to excessive glue when dispensing on the upper substrate is also avoided. Because the convertible duplex position point that uses at present glues rigging machine and can only carry out point to the upper substrate and glue and handle, the operator need earlier carry out point with the infrabasal plate on other process equipment and glue the processing back, places the lower chamber of placing of convertible duplex position point glue rigging machine again and in order to accomplish laminating processing, this kind of processing mode is loaded down with trivial details relatively, needs to use more treatment facility, and the infrabasal plate that accomplishes the point still leads to the face glue on the infrabasal plate impaired and influence the use easily in the reprinting process.
Based on the above problems, it is urgently needed to provide a double-station dispensing and laminating machine, which can further improve the efficiency of dispensing and laminating of touch screens.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a rigging machine is glued to duplex position point can further improve touch-sensitive screen point and glue laminating machining efficiency.
To achieve the purpose, the utility model adopts the following technical proposal:
the utility model provides a pair of rigging machine is glued to duplex position point, it includes:
the two loading and attaching mechanisms are arranged side by side and comprise an upper substrate loading assembly for loading an upper substrate and a lower substrate loading assembly which is positioned below the upper substrate loading assembly and is used for loading a lower substrate;
the upper substrate loading assembly is configured to be capable of performing overturning motion so that one side of the upper substrate loading assembly, which is used for loading the upper substrate, is opposite to or back to the lower substrate loading assembly, and capable of performing descending motion so that the lower substrate loading assembly is buckled on the lower substrate loading assembly, and the lower substrate loading assembly is configured to be capable of performing lifting motion on the lower substrate so that the lower substrate loading assembly is jointed with the upper substrate of the upper substrate loading assembly;
the upper dispensing mechanism is arranged above the upper substrate loading assembly and used for dispensing the upper substrate on the upper substrate loading assembly;
and the lower dispensing mechanism is arranged above the lower substrate loading assembly and is used for dispensing the lower substrate on the lower substrate loading assembly.
Optionally, the double-station dispensing and laminating machine further comprises two lower substrate displacement mechanisms;
and the lower substrate displacement mechanism is configured to drive the lower substrate loading assembly to move so as to enable the lower substrate loading assembly to correspond to the upper substrate loading assembly or enable the lower substrate loading assembly to correspond to the lower dispensing mechanism.
Optionally, the dispensing mechanism includes a dispensing assembly and a dispensing displacement assembly;
the upper dispensing assembly is arranged at the output end of the upper dispensing displacement assembly, the upper dispensing displacement assembly is configured to drive the upper dispensing assembly to move to any one position above the upper substrate loading assembly, and the upper dispensing assembly is used for dispensing the upper substrate.
Optionally, the lower dispensing mechanism includes a lower dispensing assembly and a lower dispensing displacement member;
the lower dispensing component is arranged at the output end of the lower dispensing displacement component, the lower dispensing displacement component is configured to drive the lower dispensing component to move to any one of the upper side of the lower substrate loading component, and the lower dispensing component is used for dispensing the lower substrate.
Optionally, the lower substrate loading assembly includes:
the lower substrate carrier is used for bearing the lower substrate;
and the lower substrate carrier lifting piece is in transmission connection with the lower substrate carrier and is configured to drive the lower substrate carrier to do lifting motion.
Optionally, the upper substrate loading assembly includes an alignment driving member configured to enable the upper substrate loaded by the upper substrate loading assembly to perform an elevating motion.
Optionally, a UV light source pre-curing assembly is disposed on the lower dispensing mechanism, and the UV light source pre-curing assembly is configured to pre-cure the glue dispensed on the lower substrate.
Optionally, a CCD calibration assembly is disposed on the lower dispensing mechanism, and the CCD calibration assembly is configured to calibrate a relative position of the lower dispensing mechanism and the lower substrate loading assembly.
Optionally, a distance measuring sensor is arranged on the lower dispensing mechanism, and the distance measuring sensor is configured to measure a distance between the distance measuring sensor and the lower substrate.
Optionally, one side of one of the loading and bonding mechanisms is correspondingly provided with a CCD alignment mechanism, and the CCD alignment mechanism is configured to calibrate the relative positions of the upper substrate loading assembly and the lower substrate loading assembly.
The beneficial effects of the utility model reside in that:
the utility model discloses a rigging machine during actual work is glued to duplex position point, the operator places the upper substrate in upper substrate loading assembly, and place the infrabasal plate in infrabasal plate loading assembly back, the upper substrate is just accomplishing the point to glue the mechanism and is glued to last point, the infrabasal plate is just accomplishing down the point to glue the mechanism and is glued, then the upper substrate loads the subassembly and is made the upper substrate just to the infrabasal plate by turning motion, then the upper substrate loads the subassembly and loads on the subassembly through the decline motion lock, and the infrabasal plate loads the subassembly and makes the infrabasal plate be the lifting motion, so that its and the upper substrate laminating that the upper substrate loaded the subassembly, in order to accomplish upper. The utility model discloses an go up the point gum machine and construct and accomplish the point of upper substrate and glue, lower point gum machine constructs and accomplishes the point of infrabasal plate and glue, handles the point of upper substrate and infrabasal plate and concentrates on a duplex position point to glue rigging machine in, has improved machining efficiency.
Drawings
Fig. 1 is one of the schematic structural diagrams of the double-station dispensing and laminating machine provided by the present invention;
fig. 2 is a second schematic structural view of a double-station dispensing and laminating machine provided by the present invention;
fig. 3 is a schematic view of a local structure of the hidden platform when the double-station dispensing and laminating machine of the present invention performs dispensing treatment;
fig. 4 is a schematic partial structural view of an upper substrate loading assembly according to the present invention;
fig. 5 is a schematic view of a partial structure of a lower substrate loading assembly and a lower dispensing mechanism provided in the present invention;
fig. 6 is a schematic structural diagram of the CCD alignment mechanism provided by the present invention.
In the figure:
x-a first direction; y-a second direction; z-a third direction;
1-loading a fitting mechanism; 11-an upper substrate loading assembly; 111-an upper substrate stage; 112-aligning a driving piece; 113-a tumble drive; 114-a connecting frame; 14-lower substrate loading assembly; 141-lower substrate carrier; 142-lower substrate carrier lifter;
2, a glue dispensing mechanism is arranged; 21-dispensing the glue component; 22-dispensing a displacement component;
3-lower glue dispensing mechanism; 31-dispensing the glue component; 32-lower dispensing displacement member; 33-a UV light source pre-cure assembly; 34-a CCD calibration assembly;
4-lower substrate displacement mechanism; 41-lower substrate displacement guide; 42-lower substrate displacement drive;
5-CCD contraposition mechanism; 51-CCD contraposition component; 52-CCD displacement assembly; 521-a CCD first direction displacement member; 522-CCD linking bracket; 523-CCD second direction displacement piece;
6-a platform;
7-bracket.
Detailed Description
In order to make the technical problem solved by the present invention, the technical solution adopted by the present invention and the technical effect achieved by the present invention clearer, the technical solution of the present invention will be further explained by combining the drawings and by means of the specific implementation manner.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are used based on the orientations and the positional relationships shown in the drawings, and are only for convenience of description and simplification of operation, but do not indicate or imply that the referred device or element must have a specific orientation and a specific orientation configuration and operation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.
As shown in fig. 1 to 3, the double-station dispensing and pasting machine provided in this embodiment is mainly applied to an automated dispensing and pasting processing of an upper substrate and a lower substrate of a touch screen, where an X direction indicates a first direction, a Y direction indicates a second direction, and a Z direction indicates a third direction. The double-station glue dispensing laminating machine comprises a loading laminating mechanism 1, an upper glue dispensing mechanism 2 and a lower glue dispensing mechanism 3 which are arranged side by side, wherein the loading laminating mechanism 1, the upper glue dispensing mechanism 2 and the lower glue dispensing mechanism 3 are correspondingly arranged on a platform 6 and a support 7 of the double-station glue dispensing laminating machine.
The loading and bonding mechanism 1 includes an upper substrate loading unit 11 for loading an upper substrate and a lower substrate loading unit 14 located below the upper substrate loading unit 11 for loading a lower substrate. The upper substrate loading assembly 11 can perform a turning motion so that the side of the upper substrate loading assembly on which the upper substrate is loaded is opposite to or opposite to the lower substrate loading assembly 14, and the upper substrate loading assembly 11 can also perform a descending motion so that the upper substrate loading assembly is buckled on the lower substrate loading assembly 14. The lower substrate loading assembly 14 can lift the lower substrate to attach the loaded lower substrate to the upper substrate of the upper substrate loading assembly 11. Before the bonding process of the upper substrate and the lower substrate, the upper substrate and the lower substrate need to be respectively subjected to a dispensing process. The upper dispensing mechanism 2 is disposed above the upper substrate loading assembly 11, and the upper dispensing mechanism 2 can dispense the upper substrate on the upper substrate loading assembly 11. The lower dispensing mechanism 3 is disposed above the lower substrate loading assembly 14, and the lower dispensing mechanism 3 can dispense the lower substrate on the lower substrate loading assembly 14.
Compared with the existing double-station dispensing laminating machine, the embodiment is additionally provided with the automatic dispensing processing mechanism of the lower substrate, namely the lower dispensing mechanism 3, and the dispensing processing of the upper substrate and the lower substrate is centralized to be completed by the automatic processing of one double-station dispensing laminating machine, so that the working efficiency of the double-station dispensing laminating machine is improved, and the problem that the use is affected by the damage of the face adhesive on the lower substrate easily caused in the transferring process of the lower substrate after the dispensing processing of the upper substrate and the lower substrate by different devices in the prior art is solved.
To ensure that the upper substrate is stably loaded on the upper substrate loading unit 11 without being misaligned or falling down during the inversion process, and the lower substrate on the lower substrate loading unit 14 is not misaligned. In this embodiment, the positions of the upper substrate loading assembly 11 and the lower substrate loading assembly 14, where the upper substrate and the lower substrate are placed, are both provided with vacuum chucks, and the upper substrate and the lower substrate are respectively fixed on the upper substrate loading assembly 11 and the lower substrate loading assembly 14 in a vacuum adsorption manner.
In order to enable the upper substrate loading assembly 11 to flip and the lower substrate loading assembly 14 to move downward to be locked on the lower substrate loading assembly 14. As shown in fig. 3 and 4, the upper substrate loading assembly 11 of the present embodiment includes a connecting frame 114, an upper substrate stage 111 rotatably connected to the connecting frame 114, a flip driving member 113 drivingly connected to the upper substrate stage 111, and an alignment driving member 112 drivingly connected to the connecting frame 114. The connecting frame 114 is in a U shape, the upper substrate carrying platform 111 is in a plate shape, the connecting frame 114 can be installed in the U-shaped opening of the connecting frame 114 in an overturning mode, meanwhile, an overturning driving part 113 is coaxially arranged at the connecting position of the connecting frame 114 and the upper substrate carrying platform 111, the overturning driving part 113 is an overturning driving motor, the output end of the overturning driving motor is in transmission connection with the upper substrate carrying platform 111, the upper substrate carrying platform 111 is controlled and driven to overturn for 180 degrees in a reciprocating mode through the overturning driving motor, and therefore the lower substrate loading assembly 14 is directly or reversely arranged on one side of the upper substrate. In the present embodiment, the driving method of the alignment driving member 112 is a screw linear lifting driving, and includes a screw and a screw driving motor. The screw rod driving motor is arranged on the support 7, the output end of the screw rod driving motor is connected with the screw rod, the other end of the screw rod is in transmission connection with the connecting frame 114, the connecting frame 114 is driven to drive the upper substrate carrying platform 111 to do lifting motion along the third direction through the screw rod driving motor, and therefore the upper substrate carrying platform 111 can be buckled on the lower substrate loading assembly 14.
After the upper substrate stage 111 is fastened to the lower substrate loading assembly 14, the bonding process between the upper substrate and the lower substrate is further performed. As shown in fig. 3, in the present embodiment, the lower substrate loading assembly 14 includes a lower substrate carrier 141 and a lower substrate carrier lifter 142. The lower substrate carrier 141 is used for carrying a lower substrate. The lower substrate carrier lifter 142 is connected to the lower substrate carrier 141 in a transmission manner, and the lower substrate carrier lifter 142 can drive the lower substrate carrier 141 to move up and down. The lower substrate carrier lifting member 142 includes a lower substrate carrier lifting motor, a fixing base and a lifting platform, the lower substrate carrier lifting motor is fixed on the fixing base, the fixing base is fixed on the platform 6, an output end of the lower substrate carrier lifting motor is connected with the lifting platform in a transmission manner and drives the lifting platform to do lifting motion, the lifting platform is arranged right below the lower substrate carrier 141, and finally the lower substrate carrier 141 is pushed to do lifting motion through the lifting platform. When the bonding process is performed, the lift table is lifted, and the lower substrate carrier 141 loaded with the lower substrate is pushed to be lifted, thereby completing the bonding process of the upper substrate and the lower substrate. Since the structure of the lower substrate carrier lifting member 142 is the prior art, and the improvement point of the present embodiment is not described here, detailed description thereof is omitted.
Before the upper substrate and the lower substrate are bonded, in the present embodiment, the upper dispensing mechanism 2 can dispense the upper substrate on the upper substrate loading unit 11, and the lower dispensing mechanism 3 can dispense the lower substrate on the lower substrate loading unit 14. As shown in fig. 3 and 5, the upper dispensing mechanism 2 is installed on a side of the top of the bracket 7 close to the upper substrate loading assembly 11, the lower dispensing mechanism 3 is installed on a side of the bracket 7 opposite to the lower dispensing mechanism 3, and two lower substrate displacement mechanisms 4 are further respectively arranged on the platform 6 along the second direction in order to dispense the lower dispensing mechanism 3 on the lower substrate loading assembly 14. Wherein, a lower substrate loading assembly 14 is correspondingly arranged at the output end of a lower substrate displacement mechanism 4, and the lower substrate displacement mechanism 4 can drive the lower substrate loading assembly 14 to move so as to enable the lower substrate loading assembly 14 to correspond to the upper substrate loading assembly 11 or enable the lower substrate loading assembly to correspond to the lower dispensing mechanism 3. Specifically, the lower substrate displacement mechanism 4 includes a lower substrate displacement guide 41 disposed along the second direction and a lower substrate displacement driving member 42 for driving the lower substrate loading assembly 14 to move along the lower substrate displacement guide 41, the lower substrate displacement guide 41 includes a guide rail and a slider, the slider is slidably inserted into the guide rail, the lower substrate displacement mechanism 4 is fixedly mounted on the slider, and meanwhile, the lower substrate displacement driving member 42 is screw-driven, which comprises a lower substrate displacement motor and a lower substrate displacement screw rod, wherein the lower substrate displacement motor is fixedly arranged on a platform 6, the lower substrate displacement screw rod is in transmission connection with a lower substrate displacement mechanism 4, the lower base plate displacement screw rod is driven to rotate clockwise and anticlockwise through the clockwise and anticlockwise rotation of the lower base plate displacement motor, the lower substrate displacement mechanism 4 slides back and forth along the guide rail, so that the lower substrate loading assembly 14 can be switched back and forth between the position right below the upper substrate loading assembly 11 and the lower dispensing mechanism 3.
Furthermore, in the present embodiment, the upper dispensing mechanism 2 and the lower dispensing mechanism 3 are respectively provided as one, that is, one upper dispensing mechanism 2 is adopted to perform alternative dispensing on the upper substrates of the two upper substrate loading assemblies 11, and one lower dispensing mechanism 3 is adopted to perform an alternative dispensing design structure on the lower substrate loading assembly 14, so that the use efficiency of the upper dispensing mechanism 2 and the lower dispensing mechanism 3 is fully improved, and the design and manufacturing cost of the double-station dispensing laminating machine is reduced. In other embodiments, the upper dispensing mechanism 2 and the lower dispensing mechanism 3 may be respectively designed as two, such that one upper dispensing mechanism 2 dispenses an upper substrate on one upper substrate loading assembly 11 and one lower dispensing mechanism 3 dispenses a lower substrate on one lower substrate loading assembly 14.
Specifically, in order to realize the alternate dispensing of the upper substrates on the two upper substrate loading assemblies 11 by the upper dispensing mechanism 2. As shown in fig. 3, in the present embodiment, the dispensing mechanism 2 includes a dispensing assembly 21 and a dispensing displacement assembly 22. The upper dispensing assembly 21 is disposed at an output end of the upper dispensing displacement assembly 22, the upper dispensing displacement assembly 22 can drive the upper dispensing assembly 21 to move to a position above any one of the upper substrate loading assemblies 11, and the upper dispensing assembly 21 is used for dispensing the upper substrate.
The dispensing displacement assembly 22 includes a dispensing first direction displacement member and a dispensing second direction displacement member disposed on the dispensing first direction displacement member, and the dispensing assembly 21 is fixedly disposed at an output end of the dispensing second direction displacement member. The dispensing first direction displacement member is used for enabling the dispensing assembly 21 to move back and forth between the two upper substrate loading assemblies 11 along the first direction, and the dispensing second direction displacement member is used for enabling the dispensing assembly 21 to move along the second direction to be opposite to the upper substrate. The upper dispensing component 21 is provided with an upper dispensing head, and the upper dispensing head is used for dispensing the upper substrate. Since the structure of the dispensing assembly 21 in this embodiment is the prior art, the internal structure thereof is not further improved, and thus, the detailed description thereof is omitted.
Similarly, the lower substrates on the two lower substrate loading assemblies 14 are alternately dispensed by the lower dispensing mechanism 3. As shown in fig. 5, in the present embodiment, the lower dispensing mechanism 3 includes a lower dispensing assembly 31 and a lower dispensing displacement member 32. The lower dispensing assembly 31 is disposed at an output end of the lower dispensing displacement member 32, the lower dispensing displacement member 32 can drive the lower dispensing assembly 31 to move to a position above any one of the lower substrate loading assemblies 14, and the lower dispensing assembly 31 is used for dispensing the lower substrate. Wherein, the lower dispensing displacement member 32 comprises a lower dispensing first direction displacement member and a lower dispensing third direction displacement member, the lower dispensing first direction displacement member and the lower dispensing third direction displacement member are rodless linear cylinders, the lower dispensing first direction displacement member is fixedly arranged on the support 7 along the first direction, the lower dispensing third direction displacement member is fixedly arranged on an output end of the lower dispensing first direction displacement member, and the lower dispensing component 31 is fixedly arranged on the output end of the lower dispensing third direction displacement member. The lower dispensing first-direction displacement member is used for driving the lower dispensing third-direction displacement member and the lower dispensing assembly 31 to reciprocate between the two lower substrates along the first direction; the lower dispensing third-direction displacement member is used for driving the lower dispensing assembly 31 to move along the third direction so as to adjust the distance between the lower dispensing assembly 31 and the lower substrate in the height direction. Since the above structures in this embodiment all adopt the prior art, and the internal structure thereof is not further improved, further description thereof is omitted.
In addition, as shown in fig. 5, the lower dispensing mechanism 3 of the present embodiment is further provided with a UV light source pre-curing assembly 33, and the UV light source pre-curing assembly 33 can pre-cure the glue dispensed on the lower substrate. The UV light source pre-curing assembly 33 is a UV lamp, and a light source emitted by the UV lamp in the dispensing process synchronously pre-cures glue on the lower substrate.
Further, in order to realize that the lower dispensing assembly 31 can automatically perform position calibration before dispensing the lower substrate, as shown in fig. 5, in the present embodiment, the lower dispensing mechanism 3 is provided with a CCD calibration assembly 34, and the CCD calibration assembly 34 is used for calibrating the relative position between the lower dispensing mechanism 3 and the lower substrate loading assembly 14. The CCD calibration component 34 is a CCD camera, that is, the CCD camera is used for taking a picture, then the control system is used for calculating and analyzing the picture, and then the control system controls the lower dispensing first-direction displacement component and the corresponding lower substrate displacement mechanism 4 to perform appropriate displacement, so as to realize the calibration adjustment of the relative position between the lower dispensing component 31 and the lower substrate loading component 14 along the first direction and the second direction. Since the CCD automatic alignment technology is the prior art in the field, the present embodiment does not structurally improve the CCD automatic alignment technology, and only further applies the CCD automatic alignment technology to the present embodiment to achieve accurate alignment between the lower dispensing assembly 31 and the lower substrate loading assembly 14, so detailed descriptions of specific circuits, structures and connection relationships thereof are omitted.
In addition, because the thicknesses of the lower substrates are different in the continuous production process, when the actual dispensing process is performed, a certain deviation and variation may occur in the distance between the lower substrate and the dispensing assembly 31 along the third direction, i.e., the height direction, and the actual dispensing effect may be affected. In order to keep the distance between the lower substrate and the lower dispensing assembly 31 along the third direction substantially stable during the continuous processing, the dispensing stability and the dispensing effect are improved. Still fixed mounting has a range sensor on the lower dispensing mechanism 3 in this embodiment, the test end of range sensor just places the position of infrabasal plate to infrabasal plate loading assembly 14, the range sensor is used for measuring its and the infrabasal plate between the distance, when the actual distance that the range sensor measured surpassed the preset range, control system drive down dispensing assembly 31 down the dispensing third direction displacement piece drive down dispensing assembly 31 along the third direction do elevating movement, and then adjust the distance between infrabasal plate and the dispensing assembly 31 down to the preset within range, realize that infrabasal plate and dispensing assembly 31 keep basic stability along the distance of third direction. Specifically, the ranging sensor is a laser ranging sensor, the basic principle of which is to determine the target distance by measuring the time required for the laser to travel to and from the target. Since the laser ranging sensor is the prior art, the circuit, structure and connection relationship thereof are not described in detail.
In addition, when the lower substrate loading unit 14 moves below the upper substrate loading unit 11, the lower substrate loading unit 14 can be aligned with the upper substrate loading unit 11, thereby ensuring the accuracy of the bonding. As shown in fig. 3 and 6, in the present embodiment, one CCD alignment mechanism 5 is provided for each side of the loading and bonding mechanism 1, and the CCD alignment mechanism 5 is used to align the relative positions of the upper substrate loading unit 11 and the lower substrate loading unit 14.
As shown in fig. 6, the CCD alignment mechanism 5 includes a CCD alignment component 51 and a CCD displacement component 52, the CCD displacement component 52 is disposed at one side of the lower substrate loading component 14, the CCD alignment component 51 is disposed at an output end of the CCD displacement component 52 and located at one side of the lower substrate loading component 14, and the CCD displacement component 52 can drive the CCD alignment component 51 to move above the lower substrate loading component 14. Specifically, the CCD shifting assembly 52 includes a CCD first-direction shifter 521, a CCD connecting bracket 522, and a CCD second-direction shifter 523. The CCD second-direction displacement member 523 is fixedly installed on the platform 6, the CCD connecting bracket 522 is vertically and fixedly installed at the output end of the CCD second-direction displacement member 523, the CCD first-direction displacement member 521 is fixedly installed at the end portion of the CCD connecting bracket 522, and the CCD alignment assembly 51 is installed at the output end of the CCD first-direction displacement member 521. When the lower substrate loading assembly 14 moves below the upper substrate loading assembly 11, the CCD alignment mechanism 5 starts to perform alignment operation, the CCD second direction displacement member 523 drives the CCD alignment assembly 51 to move along the second direction between the lower substrate loading assembly 14 and the upper substrate loading assembly 11, further, the CCD first direction displacement member 521 drives the CCD alignment assembly 51 to move along the first direction to the position where the relative positions of the lower substrate loading assembly 14 and the upper substrate loading assembly 11 are calibrated, and in cooperation with the calculation and analysis of the control system, the corresponding lower substrate displacement mechanism 4 is driven to drive the lower substrate loading assembly 14 to move along the second direction, so as to calibrate the relative positions of the lower substrate loading assembly 14 and the upper substrate loading assembly 11, thereby realizing the accurate correspondence of the upper substrate and the lower substrate. After the position calibration, the CCD second direction shifter 523 and the CCD first direction shifter 521 further drive the CCD alignment assembly 51 to move out of the lower substrate loading assembly 14 and the upper substrate loading assembly 11 and stop at one side of the loading and bonding mechanism 1. The CCD alignment assembly 51 is also a CCD alignment camera, and the CCD second direction displacement member 523 and the CCD first direction displacement member 521 are rodless linear cylinders. Because the structure of the CCD alignment camera and the rodless linear cylinder are the prior art, the structure of the CCD alignment camera is not improved in any way in the embodiment, and the prior art is adopted, so that specific circuits, structures and connection relations of the CCD alignment camera are not repeated.
The double-station dispensing and laminating machine provided by the embodiment has the working process that:
1) the double-station dispensing and laminating machine is in an initial position, namely two lower substrate loading assemblies 14 are respectively positioned below the corresponding upper substrate loading assemblies 11, an operator manually feeds materials, places the upper substrate on an upper substrate carrying platform 111 of the upper substrate loading assembly 11, and places the lower substrate in a lower substrate carrier 14 of the lower substrate loading assembly 14;
2) the upper dispensing assembly 21 of the upper dispensing mechanism 2 alternately dispenses the two upper substrates under the driving of the upper dispensing displacement assembly 22. After the dispensing of the upper substrate by the dispensing assembly 21 is completed, the upper substrate is moved to a position avoiding the upper substrate loading assembly 11. Then, the turning driving member 113 drives the upper substrate carrying platform 111 to turn 180 degrees, so that the upper substrate subjected to the dispensing treatment faces downwards;
3) while the upper substrate is dispensing processed, the lower substrate displacement mechanism 41 drives the two lower substrate loading assemblies 14 to respectively move along the second direction to the side of the support 7 where the lower dispensing mechanism 3 is arranged and move to the position right below the lower dispensing mechanism 3, and the lower dispensing assemblies 31 of the lower dispensing mechanism 3 respectively dispense the two lower substrates alternately under the driving of the lower dispensing displacement member 32. After the lower dispensing assembly 31 finishes dispensing the lower substrate, the lower substrate displacement mechanism 41 drives the two lower substrate loading assemblies 14 to respectively move to the positions right below the upper substrate loading assembly 11 along the second direction;
4) after the dispensing process is completed on the upper substrate and the lower substrate loading assembly 14 moves to a position right below the upper substrate loading assembly 11, the alignment driving member 112 drives the upper substrate loading assembly 111 to vertically descend, so that the upper substrate loading assembly 11 is fastened on the lower substrate loading assembly 14;
5) the lower substrate carrier lifter 142 drives the lower substrate carrier 141 to perform vertical lifting movement, so that the upper substrate and the lower substrate are attached to each other, and the attachment processing is completed;
6) after the bonding process is completed, the lower substrate carrier lifter 142 drives the lower substrate carrier 141 to move vertically downward so as to reset the lower substrate carrier 141, and the alignment driver 112 drives the upper substrate loading assembly 111 to move vertically upward so as to disengage the upper substrate loading assembly 11 from the lower substrate loading assembly 14 and complete the resetting.
7) Finally, the operator takes out the finished product subjected to the dispensing and attaching process from the lower substrate loading unit 14 and further puts the upper substrate and the lower substrate to be processed, thereby completing the automatic dispensing and attaching process of the upper substrate and the lower substrate.
The above description is only for the preferred embodiment of the present invention, and for those skilled in the art, there are variations on the detailed description and the application scope according to the idea of the present invention, and the content of the description should not be construed as a limitation to the present invention.
Claims (10)
1. The utility model provides a rigging machine is glued to duplex position point which characterized in that includes:
two loading and bonding mechanisms (1) arranged side by side, wherein each loading and bonding mechanism comprises an upper substrate loading assembly (11) used for loading an upper substrate and a lower substrate loading assembly (14) which is positioned below the upper substrate loading assembly (11) and used for loading a lower substrate;
the upper substrate loading assembly (11) is configured to be capable of performing a turning motion so that one side of the upper substrate loading assembly faces or faces away from the lower substrate loading assembly (14), and is capable of performing a descending motion so as to be buckled on the lower substrate loading assembly (14), and the lower substrate loading assembly (14) is configured to be capable of performing a lifting motion on the lower substrate so as to be attached to the upper substrate of the upper substrate loading assembly (11);
the upper dispensing mechanism (2) is arranged above the upper substrate loading assembly (11) and is used for dispensing the upper substrate on the upper substrate loading assembly (11);
and the lower dispensing mechanism (3) is arranged above the lower substrate loading assembly (14) and is used for dispensing the lower substrate on the lower substrate loading assembly (14).
2. The double-station machine for glue dispensing and laminating according to claim 1, characterized in that it further comprises two lower substrate displacement mechanisms (4);
the lower substrate loading assembly (14) is correspondingly arranged at the output end of the lower substrate displacement mechanism (4), and the lower substrate displacement mechanism (4) is configured to drive the lower substrate loading assembly (14) to move so as to enable the lower substrate loading assembly to correspond to the upper substrate loading assembly (11) or enable the lower substrate loading assembly to correspond to the lower dispensing mechanism (3).
3. The double-station dispensing laminating machine according to claim 1, characterized in that the dispensing mechanism (2) comprises a dispensing assembly (21) and a dispensing displacement assembly (22);
the upper dispensing component (21) is arranged at the output end of the upper dispensing displacement component (22), the upper dispensing displacement component (22) is configured to drive the upper dispensing component (21) to move to any one position above the upper substrate loading component (11), and the upper dispensing component (21) is used for dispensing the upper substrate.
4. The double-station dispensing and laminating machine according to claim 1, wherein the lower dispensing mechanism (3) comprises a lower dispensing assembly (31) and a lower dispensing displacement member (32);
the lower dispensing component (31) is arranged at the output end of the lower dispensing displacement component (32), the lower dispensing displacement component (32) is configured to drive the lower dispensing component (31) to move to any one position above the lower substrate loading component (14), and the lower dispensing component (31) is used for dispensing the lower substrate.
5. The double-station dispensing machine according to claim 1, wherein the lower substrate loading assembly (14) comprises:
a lower substrate carrier (141) for carrying the lower substrate;
the lower substrate carrier lifting piece (142) is in transmission connection with the lower substrate carrier (141) and can drive the lower substrate carrier (141) to do lifting movement.
6. The double-station dispensing and laminating machine according to claim 1, wherein the upper substrate loading assembly (11) comprises an alignment driving member (112), and the alignment driving member (112) is configured to enable the upper substrate loaded by the upper substrate loading assembly (11) to perform an elevating motion.
7. The double-station dispensing laminating machine according to any of claims 1-6, wherein a UV light source pre-curing assembly (33) is disposed on the lower dispensing mechanism (3), the UV light source pre-curing assembly (33) being configured to pre-cure the glue dispensed on the lower substrate.
8. The double-station dispensing laminating machine according to any one of claims 1 to 6, characterized in that a CCD calibration assembly (34) is provided on said lower dispensing mechanism (3), said CCD calibration assembly (34) being configured to calibrate the relative position of said lower dispensing mechanism (3) and said lower substrate loading assembly (14).
9. The double-station dispensing laminating machine according to any of claims 1 to 6, characterized in that a distance measuring sensor is arranged on the lower dispensing mechanism (3) and is configured to measure the distance between the distance measuring sensor and the lower substrate.
10. The double-station dispensing and laminating machine according to any one of claims 1 to 6, characterized in that a CCD (charge coupled device) aligning mechanism (5) is provided on one side of one of said loading and laminating mechanisms (1), said CCD aligning mechanism (5) being configured to align the relative positions of said upper substrate loading assembly (11) and said lower substrate loading assembly (14).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921169145.9U CN210675767U (en) | 2019-07-24 | 2019-07-24 | Double-station dispensing laminating machine |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921169145.9U CN210675767U (en) | 2019-07-24 | 2019-07-24 | Double-station dispensing laminating machine |
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| CN210675767U true CN210675767U (en) | 2020-06-05 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113246587A (en) * | 2021-06-18 | 2021-08-13 | 江西华创触控科技有限公司 | Laminating machine |
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2019
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113246587A (en) * | 2021-06-18 | 2021-08-13 | 江西华创触控科技有限公司 | Laminating machine |
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Address after: 215321 building e, No.7 Huasong Road, high tech Zone, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Suzhou Ximeng Technology Co.,Ltd. Address before: 215321 building e, No.7 Huasong Road, high tech Zone, Kunshan City, Suzhou City, Jiangsu Province Patentee before: KUNSHAN SAMON AUTOMATIC TECHNOLOGY Co.,Ltd. |