CN216545362U - Heating substrate for thermal printing head - Google Patents
Heating substrate for thermal printing head Download PDFInfo
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- CN216545362U CN216545362U CN202123360329.3U CN202123360329U CN216545362U CN 216545362 U CN216545362 U CN 216545362U CN 202123360329 U CN202123360329 U CN 202123360329U CN 216545362 U CN216545362 U CN 216545362U
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- insulating substrate
- glaze coating
- glaze
- insulating
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Abstract
The utility model relates to the technical field of manufacturing of thermal print heads, in particular to a heating substrate for a thermal print head, wherein a heat storage glaze coating is partially arranged on a chamfer surface along the length direction of an insulating substrate, an upper surface substrate glaze coating is arranged on the upper surface of the insulating substrate, a side surface substrate glaze coating is arranged on the side surface of the insulating substrate adjacent to the chamfer surface, a plurality of heating resistors are arranged on the heat storage glaze coating, the surface of the substrate glaze coating and the heat storage glaze coating are provided with electrode leads connected with a plurality of heating resistors, and are also provided with an insulating protective layer, a conductive protective layer and a resin protective layer, wherein the insulating protective layer and the conductive protective layer cover the upper surface, the side surfaces and the set regions of the chamfer surface of the insulating substrate, as well as the plurality of heating resistors and the upper surface of part of the electrode lead, the resin protective layer covers part of the electrode lead, and covering the cut edge of the chamfered surface and the left and right edges of the upper surface of the insulating substrate adjacent to the chamfered surface in the width direction of the insulating substrate.
Description
The technical field is as follows:
the utility model relates to the technical field of thermal printing head manufacturing, in particular to a heating substrate for a thermal printing head, which can improve the printing quality and the service life of the thermal printing head with a heating resistor arranged on a chamfer surface of an insulating substrate.
Background art:
in order to realize quick peeling of a thermal transfer adhesive tape and a thermal printing head, a corner in the length direction of an insulating substrate is ground and processed into a chamfered surface, a thermal storage glaze coating is formed on the chamfered surface, a plurality of heating resistors are arranged on the thermal storage glaze coating along the length direction of the insulating substrate, electrode leads connected with the heating resistors are formed on the surfaces of the thermal storage glaze coating and the insulating substrate, and protective layers are formed on the heating resistors and the electrode leads.
In order to meet the size requirement of the substrate, the substrate is cut after the protective layer is prepared, burrs and sharp points are formed on the edge of the cut substrate, the cut substrate can scratch printing paper when being printed if the burrs and sharp points are not processed, the common processing method is grinding removal, but the grinding can cause larger damage to the cut edge of the substrate, and in a hot and humid use environment, the risk of failure of the thermal printing head can be increased, so that the environmental tolerance of the product is reduced.
The utility model content is as follows:
the utility model provides a heating substrate for a thermal printing head, which can not influence the printing performance and has high tolerance even in a damp and hot use environment, aiming at the problems of poor printing performance and failure in the damp and hot use environment caused by insufficient design of the thermal printing head with a corresponding printing component arranged on a heat storage glaze coating of a chamfered surface.
The utility model is achieved by the following measures:
the utility model provides a thermal printhead is with base plate that generates heat, has the insulating substrate of rectangular shape, is equipped with the chamfer face on the insulating substrate, and its characterized in that sets up the heat accumulation glaze coating along insulating substrate length direction part on the chamfer face, and the insulating substrate upper surface is equipped with upper surface substrate glaze coating, is equipped with side substrate glaze coating on the side that insulating substrate and chamfer face are adjacent, is equipped with a plurality of heating resistor body on the heat accumulation glaze coating, be equipped with the electrode lead that is connected with a plurality of heating resistor body on substrate glaze coating surface and the heat accumulation glaze coating, still be equipped with insulating protective layer, conductive protection layer and resin protection layer, wherein insulating protective layer and conductive protection layer cover insulating substrate upper surface, side, the settlement region of chamfer face and a plurality of heating resistor body and partial electrode lead upper surface, resin protection layer electrode lead to cover part upper surface along the cutting edge of insulating substrate width direction cover chamfer face and the insulating substrate upper surface left side adjacent with the chamfer face of insulating substrate upper surface, the insulating substrate upper surface of chamfer face covers the part of part, the part of part cover part of part is covered The right edge.
The substrate glaze coating on the upper surface, the substrate glaze coating on the side surface and the heat storage glaze coating on the chamfer surface of the insulating substrate are arranged along the length direction of the insulating substrate, the substrate glaze coating on the upper surface and the substrate glaze coating on the side surface are respectively at least partially overlapped with the heat storage glaze coating on the chamfer surface, and the width of the overlapped area is not more than 50% of the width of the heat storage glaze coating.
The thickness of the substrate glaze coating on the upper surface and the substrate glaze coating on the side surface of the insulating substrate is not more than 50% of the thickness of the heat storage glaze coating.
The width of the conductive protection layer on the upper surface of the insulating substrate, which is intersected with the chamfer surface in parallel, is not more than the width of the insulating protection layer below the conductive protection layer.
The included angle formed by the chamfer surface of the insulating substrate and the upper surface of the insulating substrate is 145-165 degrees.
The utility model has the advantages that the resin protective layer at the outermost layer of the insulating substrate completely covers the chamfered surface edge and the plane edge of the insulating substrate, the sharp point and defect problems of the edge of the insulating substrate are fundamentally avoided, the printing performance and the environmental tolerance of the thermal printing head are improved, and the thickness of the resin protective layer is limited in a proper range, so that the printing effect cannot be obviously influenced.
Description of the drawings:
FIG. 1 is a schematic plan view of the present invention.
Fig. 2 is a schematic cross-sectional view of the structure at position M1 in fig. 1.
Fig. 3 is a schematic cross-sectional view of the structure at position M2 in fig. 1.
Reference numerals: 1. an insulating substrate; 2. a heat storage glaze coating; 3a, coating the substrate glaze on the upper surface; 3b, coating a substrate glaze on the side surface; 4. a heating resistor body; 5. an electrode lead; 6. an insulating protective layer; 7. a conductive protective layer; 8. a resin protective layer; s1, insulating the upper surface of a substrate; s2, chamfering; and S3, side surface.
The specific implementation mode is as follows:
the utility model is further described below with reference to the accompanying drawings and examples.
Example 1:
as shown in fig. 2 and 3, this embodiment provides a heat-generating substrate for a thermal print head, which has a strip-shaped insulating substrate, wherein a chamfer surface S2 is provided on the insulating substrate 1, a thermal storage glaze coating 2 is partially provided on the chamfer surface S2 along the length direction of the insulating substrate 1, an upper surface substrate glaze coating 3a is provided on the upper surface of the insulating substrate 1, a side substrate glaze coating 3b is provided on the side surface of the insulating substrate 1 adjacent to the chamfer surface S2, a plurality of heat-generating resistors 4 are provided on the thermal storage glaze coating 2, electrode leads 5 connected to the plurality of heat-generating resistors 4 are provided on the substrate glaze coating surface and the thermal storage glaze coating 2, an insulating protective layer 6, a conductive protective layer 7 and a resin protective layer 8 are further provided, wherein the insulating protective layer 6 and the conductive protective layer 7 cover the upper surface, the side surface, the set region of the chamfer surface and the upper surfaces of the plurality of heat-generating resistors and part of the electrode leads, the resin protective layer 8 covers part of the electrode lead 5 and covers the cut edge of the chamfered surface S2 and the left and right edges of the upper surface of the insulating substrate 1 adjacent to the chamfered surface S2 in the width direction of the insulating substrate 1;
as shown in fig. 1, in the present example, the upper surface substrate glaze coating 3a, the side surface substrate glaze coating 3b and the heat storage glaze coating 2 of the chamfered surface S2 of the insulating substrate 1 are arranged along the length direction of the insulating substrate, the upper surface substrate glaze coating 3a and the side surface substrate glaze coating 3b are respectively at least partially overlapped with the heat storage glaze coating 2 of the chamfered surface S2, and the width of the overlapped region is not more than 50% of the width of the heat storage glaze coating; the thickness of the substrate glaze coating on the upper surface and the substrate glaze coating on the side surface of the insulating substrate is not more than 50% of the thickness of the heat storage glaze coating;
the width of the conductive protection layer on the upper surface of the insulating substrate, which is intersected with the chamfer surface in parallel, is not more than the width of the insulating protection layer below the conductive protection layer; the included angle formed between the chamfer surface of the insulating substrate and the upper surface of the insulating substrate is 145-165 degrees;
as shown in fig. 1, the present invention includes a flat and long insulating substrate 1, a chamfered surface S2 is formed by chamfering the intersecting edge portion of an upper surface S1 and a side surface S3 of the insulating substrate 10, a thermal storage glaze coating 2 is formed by printing and sintering at least a partial region on S2, an upper surface under glaze coating 3a is formed on the upper surface of the partial region of S1 and the thermal storage glaze coating 2 by printing and sintering again, and a side surface under glaze coating 3b is formed on the side surface S3 and the partial region side surface of the thermal storage glaze coating 2.
Forming a heating resistor layer on the surfaces of the heat storage glaze coatings 2 and the substrate glaze coatings 3a and 3b at S1 and S2 in a sputtering mode, forming a plurality of heating resistors 4 on the heating resistor layer in a portrait plate making mode, wherein the heating resistors 4 are made of metal ceramic materials containing tantalum and silicon;
forming electrode lead layers on the surfaces of the S1 and S2, the heat storage glaze coating 2, the substrate glaze coatings 3a and 3b and the heating resistor 4 in a sputtering mode, processing the electrode lead layers into electrode leads 5 connected with the heating resistor in a portrait plate making mode, wherein the electrode leads can be made of materials such as aluminum, aluminum alloy, tungsten-titanium alloy and the like;
forming an insulating protection layer 6 on selected areas of the heat storage glaze coating 2, the substrate glaze coatings 3a and 3b, the heating resistor 4 and the electrode lead 5 by sputtering in the steps of S1, S2 and S3, wherein the insulating protection layer 6 is made of an insulating material, such as silicon oxide, silicon oxynitride and the like;
forming a conductive protection layer 7 on the selected area of the insulating protection layer 6 by sputtering, wherein the conductive protection layer is made of a conductive material, such as a carbon-containing silicon carbide material;
in the selected region (specifically, the region covering the cutting edge of the substrate, including the chamfered edge of the substrate and the two side edges of the upper surface of the insulating substrate) on the surfaces of the insulating protective layer 6, the conductive protective layer 7 and the upper surface substrate glaze coating 3a, a resin protective layer 8 is formed by printing, and the resin protective layer can be made of ink containing epoxy resin.
According to the heating substrate for the thermal printing head, the resin protection layer on the outermost layer of the insulating substrate completely covers the chamfered surface edge and the plane edge of the substrate, so that the problems of sharp points and defects of the edge of the substrate are solved, and the printing performance and the environmental tolerance of the thermal printing head are improved.
Claims (5)
1. The utility model provides a thermal printhead is with base plate that generates heat, has the insulating substrate of rectangular shape, is equipped with the chamfer face on the insulating substrate, and its characterized in that sets up the heat accumulation glaze coating along insulating substrate length direction part on the chamfer face, and the insulating substrate upper surface is equipped with upper surface substrate glaze coating, is equipped with side substrate glaze coating on the side that insulating substrate and chamfer face are adjacent, is equipped with a plurality of heating resistor body on the heat accumulation glaze coating, be equipped with the electrode lead that is connected with a plurality of heating resistor body on substrate glaze coating surface and the heat accumulation glaze coating, still be equipped with insulating protective layer, conductive protection layer and resin protection layer, wherein insulating protective layer and conductive protection layer cover insulating substrate upper surface, side, the settlement region of chamfer face and a plurality of heating resistor body and partial electrode lead upper surface, resin protection layer electrode lead to cover part upper surface along the cutting edge of insulating substrate width direction cover chamfer face and the insulating substrate upper surface adjacent with the chamfer face The left and right edges of the face.
2. The heat-generating substrate for a thermal print head according to claim 1, wherein the upper-surface under-glaze layer, the side-surface under-glaze layer and the thermal-storage glaze layer of the chamfered surface of the insulating substrate are disposed along the length of the insulating substrate, and the upper-surface under-glaze layer and the side-surface under-glaze layer are respectively at least partially overlapped with the thermal-storage glaze layer of the chamfered surface, and the width of the overlapped region is not more than 50% of the width of the thermal-storage glaze layer.
3. A heat-generating substrate for a thermal head according to claim 1, wherein the thickness of the under-glaze coating and the side-glaze coating on the insulating substrate is not more than 50% of the thickness of the heat-accumulating glaze coating.
4. A heat generating substrate for a thermal head according to claim 1, wherein a width of the conductive protective layer on the upper surface of the insulating substrate is not larger than a width of the insulating protective layer under the conductive protective layer.
5. A heat generating substrate for a thermal head according to claim 1, wherein an angle formed by the chamfered surface of the insulating substrate and the upper surface of the insulating substrate is 145 to 165 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123360329.3U CN216545362U (en) | 2021-12-28 | 2021-12-28 | Heating substrate for thermal printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123360329.3U CN216545362U (en) | 2021-12-28 | 2021-12-28 | Heating substrate for thermal printing head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216545362U true CN216545362U (en) | 2022-05-17 |
Family
ID=81558481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123360329.3U Active CN216545362U (en) | 2021-12-28 | 2021-12-28 | Heating substrate for thermal printing head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216545362U (en) |
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2021
- 2021-12-28 CN CN202123360329.3U patent/CN216545362U/en active Active
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