CN216545361U - Heating substrate for thermal printing head - Google Patents
Heating substrate for thermal printing head Download PDFInfo
- Publication number
- CN216545361U CN216545361U CN202123347612.2U CN202123347612U CN216545361U CN 216545361 U CN216545361 U CN 216545361U CN 202123347612 U CN202123347612 U CN 202123347612U CN 216545361 U CN216545361 U CN 216545361U
- Authority
- CN
- China
- Prior art keywords
- substrate
- protective layer
- heat
- insulating
- glaze coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model relates to the technical field of manufacturing of a thermal printing head, in particular to a heating substrate for the thermal printing head, which can effectively improve the service life of the printing head and the printing quality and is particularly suitable for arranging a heating resistor on the chamfered surface of an insulating substrate, a first substrate glaze coating is arranged on the side surface of the insulating substrate adjacent to the chamfer surface, a second substrate glaze coating is arranged on the upper surface of the insulating substrate adjacent to the chamfer surface, the first substrate glaze coating and the second substrate glaze coating are respectively at least partially overlapped with the heat storage glaze coating on the chamfer surface, the electrode lead is arranged along the upper surfaces of the substrate glaze coating and the heat storage glaze coating and is connected with the heating resistor, compared with the prior art, the problems of electrode lead defects caused by the rough and defective insulating substrate surface and insufficient compactness of the insulating protective layer are fundamentally avoided, and the environmental tolerance of the thermal printing head is improved.
Description
The technical field is as follows:
the utility model relates to the technical field of thermal printing head manufacturing, in particular to a heating substrate for a thermal printing head, which can effectively prolong the service life of the printing head and improve the printing quality and is particularly suitable for arranging a heating resistor on a chamfered surface of an insulating substrate.
The background art comprises the following steps:
it is known that, in order to realize the rapid peeling of a thermal transfer tape and a thermal print head, a corner in the length direction of an insulating substrate is ground into a chamfered surface, a thermal storage glaze coating is formed on the chamfered surface, a plurality of heating resistors are arranged on the thermal storage glaze coating along the length direction of the insulating substrate, electrode leads connected with the heating resistors are formed on the surfaces of the thermal storage glaze coating and the insulating substrate, and a protective layer is formed on the electrode leads.
In order to reduce the adverse effect caused by overlarge surface roughness of the insulating base plate or overlarge pinhole defect on the surface of the insulating base plate, a smooth substrate protective layer can be formed on the upper surface of the insulating base plate, but the conventional substrate glaze coating is not connected with the heat storage glaze coating. This results in that the substrate glaze coating is not used, or the substrate glaze coating is not connected to the heat storage glaze coating, so that at least a partial area of the surface of the ceramic substrate is not covered with the glaze coating, and the defects of the electrode lead and the protective layer which are not covered with the glaze coating area are increased, and the risk of failure of the thermal print head in a hot and humid use environment is increased.
The utility model content is as follows:
the utility model provides a heating substrate for a thermal printing head, which can effectively improve the service life and the printing quality of the printing head and is particularly suitable for arranging a heating resistor on a chamfer surface of an insulating substrate, aiming at the problem that the thermal printing head possibly fails in a damp and hot use environment due to the insufficient design of the heating resistor arranged on a thermal storage glaze coating of the chamfer surface in the prior art.
The utility model is achieved by the following measures:
a heating substrate for a thermal printing head is provided with a strip-shaped insulating substrate, the upper side edge of the insulating substrate is provided with a chamfer surface, a heat storage glaze coating is arranged on the chamfer surface, and a heating resistor is arranged on the heat storage glaze coating on the chamfer surface.
The heat storage glaze coating on the chamfer surface is arranged along the length direction of the insulating substrate, only part of the chamfer surface is provided with the heat storage glaze coating, the heat storage glaze coating is provided with a plurality of heating resistors along the length direction, the first substrate glaze coating and the second substrate glaze coating are also respectively arranged on the side surface and the upper surface of the insulating substrate along the length direction of the insulating substrate, and the first substrate glaze coating, the heat storage glaze coating and the second substrate glaze coating are partially overlapped in the length direction of the insulating substrate.
The utility model is provided with an insulating protective layer, wherein the insulating protective layer adopts a silicon oxide layer or a silicon oxynitride layer, and partially covers the heat storage glaze coating, the first substrate glaze coating and the heating resistor body and the electrode lead on the upper side of the second substrate glaze coating.
The utility model is also provided with a conductive protective layer which is positioned outside the insulating protective layer and is coated outside the plurality of heating resistors and at least part of the electrode leads by adopting a conductive material in a sputtering way.
The utility model is also provided with a resin protective layer arranged at the outermost side of the product, wherein the resin protective layer adopts printing ink containing epoxy resin, and part of the printing ink is printed and covered on the insulating protective layer, the conductive protective layer and the outer side of the substrate glaze coating.
The width of a partial overlapping area of the first substrate glaze coating or the second substrate glaze coating and the heat storage glaze coating arranged along the length direction of the insulating substrate is not more than 50% of the width of the heat storage glaze coating.
The thickness of the first substrate glaze coating and the second substrate glaze coating is not more than 50% of the thickness of the heat storage glaze coating.
The width of the conductive protection layer on the upper surface of the insulating substrate, which is intersected with the chamfer surface in parallel, is not more than the width of the insulating protection layer below the conductive protection layer.
The included angle formed by the chamfer surface of the insulating substrate and the upper surface of the insulating substrate is 145-165 degrees.
Compared with the prior art, the utility model has the advantages that the chamfer surface is formed at one corner part of the insulating substrate in the length direction, the heat storage glaze coating is formed on the chamfer surface, the substrate glaze coating is formed on the upper surface and the side surface of the insulating substrate, the substrate glaze coating on the upper surface, the substrate glaze coating on the side surface and the heat storage glaze coating are partially overlapped, the electrode lead and the insulating protective layer are arranged on the heat storage glaze coating and the substrate glaze coating, the problems of electrode lead defects caused by rough and defective insulating substrate surfaces and insufficient compactness of the insulating protective layer are fundamentally avoided, and the environmental tolerance of the thermal printing head is improved. Moreover, the width of the overlapping region of the under glaze coating and the heat accumulation glaze coating and the thickness of the under glaze coating are limited within appropriate ranges, and the printing effect is not significantly adversely affected.
Description of the drawings:
FIG. 1 is a schematic structural diagram of the present invention.
Reference numerals: the heat-storage ceramic electronic component comprises an insulating substrate 1, a heat-storage glaze coating 2, an upper surface under glaze coating 3a, a side surface under glaze coating 3b, a heating resistor 4, an electrode lead 5, an insulating protective layer 6, a conductive protective layer 7, a resin protective layer 8, an insulating substrate upper surface S1, a chamfered surface S2 and a side surface S3.
The specific implementation mode is as follows:
the utility model is further described below with reference to the accompanying drawings and examples.
Example 1:
as shown in fig. 1, this example includes a flat and long insulating substrate 1, the intersecting edge of the upper surface S1 and the side surface S3 of the insulating substrate 1 is chamfered to form a chamfered surface S2, a thermal storage glaze coating 2 is formed by printing and sintering at least a partial region on S2, a base glaze coating 3a (second base glaze coating) is formed on the upper surface of the partial region of S1 and the glaze coating 2 by printing and sintering again, and a base glaze coating 3b (first base glaze coating) is formed on the side surface of the partial region of S3 and the glaze coating 2;
forming a heating resistor layer on the surfaces of the heat storage glaze coatings 2 and the substrate glaze coatings 3a and 3b at S1 and S2 in a sputtering mode, forming a plurality of heating resistors 4 on the heating resistor layer in a portrait plate making mode, wherein the heating resistors 4 are made of metal ceramic materials containing tantalum and silicon;
forming electrode lead layers on the surfaces of the S1 and S2, the heat storage glaze coating 2, the substrate glaze coatings 3a and 3b and the heating resistor 4 in a sputtering mode, processing the electrode lead layers into electrode leads 5 connected with the heating resistor in a portrait plate making mode, wherein the electrode leads can be made of materials such as aluminum, aluminum alloy, tungsten-titanium alloy and the like;
in selected regions of S1, S2, S3, the thermal storage glaze layer 2, the under glaze layers 3a and 3b, the heating resistor 4, and the electrode lead 5, the insulating protective layer 6 is formed by sputtering, and the insulating protective layer 6 is made of an insulating material such as silicon oxide or silicon oxynitride.
A conductive protective layer 7 is formed on the insulating protective layer 6 by sputtering, and the conductive protective layer is made of a conductive material, such as a carbon-containing silicon carbide material.
And forming a resin protective layer 8 by printing on selected areas on the surfaces of the insulating protective layer 6, the conductive protective layer 7 and the substrate glaze coating 3a, wherein the resin protective layer can be made of ink containing epoxy resin.
According to the heating substrate for the thermal printing head, the heat storage glaze coating is formed on at least part of the chamfered surface of the heating substrate, the substrate glaze coating is formed on at least part of the upper surface and the side surface of the insulating substrate and on the surface of the heat storage glaze coating, the substrate glaze coating and the heat storage glaze coating are partially overlapped, the electrode lead and the insulating protective layer are formed on the heat storage glaze coating and the substrate glaze coating, the problems of electrode lead defects and insufficient compactness of the insulating protective layer caused by rough insulating substrate surface are solved, and the environmental tolerance of the thermal printing head is improved.
Claims (9)
1. A heating substrate for a thermal printing head is provided with a strip-shaped insulating substrate, the upper side edge of the insulating substrate is provided with a chamfer surface, a heat storage glaze coating is arranged on the chamfer surface, and a heating resistor is arranged on the heat storage glaze coating on the chamfer surface.
2. The heat-generating substrate for a thermal printhead according to claim 1, wherein the thermal storage glaze layer on the chamfered surface is provided along a longitudinal direction of the insulating substrate, the thermal storage glaze layer is provided only partially on the chamfered surface, the plurality of heat-generating resistors are provided on the thermal storage glaze layer along the longitudinal direction, the first substrate glaze layer and the second substrate glaze layer are also provided partially on the side surface and the upper surface of the insulating substrate along the longitudinal direction of the insulating substrate, respectively, and the first substrate glaze layer, the thermal storage glaze layer, and the second substrate glaze layer are partially overlapped on the insulating substrate along the longitudinal direction of the insulating substrate.
3. A heat-generating substrate for a thermal head according to claim 1, wherein an insulating protective layer is provided, and the insulating protective layer is a silicon oxide or silicon oxynitride layer and partially covers the heat-generating resistor body and the electrode leads on the upper side of the heat-accumulating glaze layer, the first substrate glaze layer, and the second substrate glaze layer.
4. A heat-generating substrate for a thermal head according to claim 3, further comprising a conductive protective layer, the conductive protective layer being located outside the insulating protective layer, and the conductive protective layer being formed by sputtering a conductive material onto the plurality of heat-generating resistors and at least a portion of the electrode leads.
5. A heat-generating substrate for a thermal head according to claim 4, further comprising a resin protective layer disposed on the outermost side of the product, wherein the resin protective layer is formed by printing an ink containing epoxy resin, and partially covers the insulating protective layer, the conductive protective layer and the outer side of the enamel coating.
6. A heat-generating substrate for a thermal head according to claim 1, wherein the width of a partially overlapped region of the first or second under-glaze layer and the thermal storage glaze layer disposed along the length of the insulating substrate is not more than 50% of the width of the thermal storage glaze layer.
7. A heat-generating substrate for a thermal head according to claim 1, wherein the thickness of the first and second under-glaze layers is not more than 50% of the thickness of the heat-accumulating glaze layer.
8. A heat generating substrate for a thermal head according to claim 4, wherein a width of the conductive protective layer on the upper surface of the insulating substrate intersecting the chamfered surface in parallel is not greater than a width of the insulating protective layer below the conductive protective layer.
9. A heat generating substrate for a thermal head according to claim 1, wherein an angle formed by the chamfered surface of the insulating substrate and the upper surface of the insulating substrate is 145 to 165 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123347612.2U CN216545361U (en) | 2021-12-28 | 2021-12-28 | Heating substrate for thermal printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123347612.2U CN216545361U (en) | 2021-12-28 | 2021-12-28 | Heating substrate for thermal printing head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216545361U true CN216545361U (en) | 2022-05-17 |
Family
ID=81558226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123347612.2U Active CN216545361U (en) | 2021-12-28 | 2021-12-28 | Heating substrate for thermal printing head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216545361U (en) |
-
2021
- 2021-12-28 CN CN202123347612.2U patent/CN216545361U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6923358B2 (en) | Manufacturing method of thermal print head and thermal print head | |
| CN1113468A (en) | Thermal head | |
| CN216545361U (en) | Heating substrate for thermal printing head | |
| US4742362A (en) | Thermal head | |
| WO2011092874A1 (en) | Thermal head | |
| US7876343B2 (en) | Thermal print head and method for manufacturing same | |
| JP2008230126A (en) | Thermal print head | |
| CN215970712U (en) | Thermal print head | |
| CN216545362U (en) | Heating substrate for thermal printing head | |
| CN217476895U (en) | Corrosion-resistant heating substrate for thermal printing head | |
| JP3993325B2 (en) | Thick film thermal print head and method of manufacturing the same | |
| CN211165964U (en) | Novel heat-sensitive printer head is with base plate that generates heat | |
| CN216330943U (en) | Heating substrate for thermal printing head | |
| US20170352486A1 (en) | Multilayer ceramic electronic component | |
| CN216659329U (en) | Heating substrate for thin film thermal printing head | |
| JP7385481B2 (en) | Manufacturing method of thermal print head | |
| EP2133207B1 (en) | Thermal head | |
| CN219096312U (en) | Heating substrate for thermal print head | |
| CN217415271U (en) | Good-reliability heating substrate for thermal printing head | |
| JP4166403B2 (en) | Gas sensor element and gas sensor including the same | |
| CN217435322U (en) | Heating substrate for anti-warping thermal sensitive printing head | |
| TWI824431B (en) | Mounting structure of chip components | |
| JPH04288244A (en) | Thermal head | |
| JP3172623B2 (en) | Thermal head | |
| EP3842242B1 (en) | Thermal head and thermal printer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |