CN217293997U - Prevent temperature sensing of fish tail and beat printer head with base plate that generates heat - Google Patents

Abstract

The application provides a scratch-proof heating substrate for a thermal printing head, which solves the technical problem that the edge of the existing heating substrate for the thermal printing head is sharp and easily scratches a printing medium; the thermal storage ground coat comprises a strip-shaped insulating substrate and a thermal storage ground coat layer, wherein the strip-shaped insulating substrate is provided with an upper surface, a side surface and a chamfer surface which is provided with a certain angle with the upper surface along the length direction of the insulating substrate, the thermal storage ground coat layer is arranged on the chamfer surface along the length direction of the insulating substrate, and the distance between the thermal storage ground coat layer and the edge gap of the insulating substrate in the main printing direction is not less than 0.1 mm. The application is widely applied to the technical field of thermal printing.

Description

Prevent temperature sensing of fish tail and beat printer head with base plate that generates heat

Technical Field

The present invention relates to a thermal printhead, and more particularly, to a heat-generating substrate for a thermal printhead, which prevents scratches.

Background

In order to realize the rapid peeling of a printing medium and a thermal printing head, a corner in the length direction of an insulating substrate is ground to form a chamfer surface, a heat storage ground coat is formed on the chamfer surface, a plurality of heating resistors are arranged on the heat storage ground coat along the length direction of the insulating substrate, lead electrodes connected with the heating resistors are arranged on the surfaces of the substrate ground coat and the heat storage ground coat, and a plurality of protective layers are formed on the heating resistors and the lead electrodes.

For satisfying base plate size requirement, cut the processing to the base plate behind the protection film, because the heat accumulation base coat layer is the glass material, the edge can form sharp point after the cutting, can cause the fish tail to the printing medium when printing. In the prior art, the polishing treatment is usually used for removing, but the method causes more damage to the cut edge of the substrate, and reduces the product tolerance and the product stability.

Disclosure of Invention

In order to solve the above problems, the technical scheme adopted by the application is as follows: the heating substrate for the thermal printing head comprises a strip-shaped insulating substrate and a heat accumulation bottom glaze layer, wherein the strip-shaped insulating substrate is provided with an upper surface, a side surface and a chamfer surface which is provided with a certain angle with the upper surface along the length direction of the insulating substrate, the heat accumulation bottom glaze layer is partially arranged on the chamfer surface along the length direction of the insulating substrate, and the distance between the heat accumulation bottom glaze layer and the edge gap of the insulating substrate in the main printing direction is not less than 0.1 mm.

Preferably, a plurality of reserved gaps are formed in the thermal storage ground coat layer before cutting treatment along the length direction of the insulating substrate, and each reserved gap is not smaller than 0.2 mm.

Preferably, the thermal storage ground coat layer has a thickness of 20 to 60 μm and a width of 0.2mm to 1.0 mm.

Preferably, a substrate ground coat layer is at least partially provided on the upper surface of the insulating substrate, a plurality of heating resistors are provided on the thermal storage ground coat layer along the longitudinal direction of the substrate, lead electrodes connected to the heating resistors are provided on the surface portions of the substrate ground coat layer and the thermal storage ground coat layer, and an insulating protective layer is covered on the side surface, the chamfered surface, and a portion of the upper surface of the insulating substrate, the heating resistors, and at least a portion of the lead electrode surface.

Preferably, at least a part of the insulating protective layer is covered with a conductive protective layer.

Preferably, a resin protective layer is covered on at least a part of the lead electrode, the insulating protective layer, and a part of the conductive protective layer.

The beneficial effects of the utility model, reserve the clearance through control heat accumulation underglaze coat and insulating substrate edge, effectively avoid the substrate edge because the sharp pointed end that the cutting produced prevents to print the media by the fish tail, reduces heat accumulation underglaze coat stress influence simultaneously, improves the product and prints the quality, guarantees the product stability.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required to be used in the embodiments or the prior art description will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings may be obtained according to these drawings without inventive labor.

Fig. 1 is a schematic plan view of a heat-generating substrate for a thermal printhead according to an embodiment of the present invention;

FIG. 2 is a cross-sectional view taken at M2 of FIG. 1;

FIG. 3 is a cross-sectional view taken at M1 of FIG. 1;

FIG. 4 is a schematic plan view of a thermal storage ground coat layer on a heat-generating substrate in the prior art;

fig. 5 is a schematic plan view of the thermal storage ground coat layer on the heating substrate according to the embodiment of the present invention.

The symbols in the figures illustrate:

10. an insulating substrate; 20. a thermal storage ground coat layer; 30. a substrate ground coat layer; 40. a heating resistor body; 50. a wire electrode; 60. an insulating protective layer; 70. a conductive protective layer; 80. an organic resin layer; 90. cutting a line; s1, insulating the upper surface of a substrate; s2, chamfering the surface of the insulating substrate; and S3, insulating the side surface of the substrate.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

A heat-generating substrate for a thermal print head according to an embodiment of the present application will now be described.

Please refer to fig. 1, which is a schematic plan view of a heat-generating substrate for a thermal print head for preventing scratches. The scratch-proof heating substrate for the thermal printing head comprises a heat accumulation ground coat layer 20 which is provided with an upper surface S1, a side surface S3 and a part along the length direction of the insulating substrate 10 on the upper surface S1 along the length direction of the insulating substrate 10, wherein the gap between the heat accumulation ground coat layer 20 and the edge of the insulating substrate 10 in the main printing direction is not less than 0.1 mm. In other words, referring to fig. 5 in comparison with the prior art fig. 4, after the dicing process performed by the dicing line 90, the length of the cleaved thermal cover slip layer 20 in the main printing direction is less than the length of the insulating substrate 10 between the edges of the insulating substrate 10.

Therefore, no sharp point exists at the edge of the thermal storage ground coat layer 20, and the thermal storage ground coat layer does not need to be removed by grinding treatment, so that the tolerance and the stability of the product are improved; meanwhile, the influence of the stress of the thermal storage ground coat layer 20 is reduced, and the printing quality of the product is improved.

In an embodiment, the thermal storage ground coat layer 20 before cutting process is provided with a plurality of reserved gaps along the length direction of the insulating substrate 10, and each reserved gap is not less than 0.2mm, so as to effectively avoid the sharp point generated by the substrate edge due to cutting.

In one embodiment, the thickness of the thermal storage ground coat layer 20 is 20-60 μm, and the width is 0.2mm-1.0mm, so that the influence of stress on the thermal storage ground coat layer 20 is reduced, and the printing quality of the product is improved.

Further, referring to fig. 2 and 3, a ground coat layer 30 is provided at least partially on the upper surface of the insulating substrate 10, a plurality of heating resistors 40 are provided on the thermal storage ground coat layer 20 along the longitudinal direction of the insulating substrate 10, lead electrodes 50 connected to the heating resistors 40 are provided on the ground coat layer 30 and the thermal storage ground coat layer 20, and an insulating protective layer 60 is covered on the side surface S3, the chamfered surface S2, and a portion of the upper surface S1 of the insulating substrate 10, the heating resistors 40, and at least a portion of the lead electrodes 50.

Preferably, the conductive protective layer 70 is covered on at least a part of the insulating protective layer 60, and the resin protective layer 80 is covered on at least a part of the lead electrode 50, the insulating protective layer 60, and a part of the conductive protective layer 70.

Example 1

Referring to fig. 1, 2 and 3, the scratch-resistant heat-generating substrate for a thermal printhead of the present embodiment includes an insulating substrate 10 made of an aluminum oxide material, a chamfer surface S2 is formed at an intersection edge of an upper surface S1 and a side surface S3 of the insulating substrate 10, a thermal storage ground coat layer 20 is formed on at least a partial region of the chamfer surface S2 by screen printing and sintering, and the thermal storage ground coat layer 20 has a thickness of 20 to 60 μm and a width of 0.2mm to 1.0 mm. The pattern of the thermal storage ground coat layer 20 is provided with a plurality of gaps along the length direction of the insulating substrate 10 according to the substrate size requirement, and each gap is not less than 0.2mm, so that after cutting treatment, the gap between the thermal storage ground coat layer 20 and the edge of the insulating substrate 10 in the main printing direction is not less than 0.1 mm.

The ground glaze layer 30 is formed on a partial region of the upper surface S1 of the insulating substrate 10 by screen printing and sintering, and the thickness of the ground glaze layer 30 is set within the range of 5-20 μm.

By controlling the process conditions, sputtering the tantalum-silicon dioxide composite target by a sputtering method, forming a heating resistor layer on the upper surface S1 of the insulating substrate 10, the chamfer surface S2, the heat storage ground coat layer 20 and the substrate ground coat layer 30, wherein the thickness of the heating resistor layer is 30-400nm, and carrying out graphical processing by means of portrait plate making and etching to form a plurality of heating resistors 40.

On the upper surface S1 of the insulating substrate 10, the chamfered surface S2, the thermal storage ground coat layer 20, the substrate ground coat layer 30, and the surface of the heating resistor 40, a lead electrode layer having a thickness of 0.5 to 1 μm is formed by magnetron sputtering using a metal aluminum target. The photolithography plate for making the plate is designed and manufactured according to the information such as printing resolution, and the wire electrode 50 connected with a plurality of heating elements is formed by means of making the plate and etching.

An insulating protective layer 60 is formed on the surface of the partial region of the upper surface S1, the chamfered surface S2, the side surface S3 of the insulating substrate, the thermal storage glaze layer 20, the substrate glaze layer 30, the heating resistor 40, and the lead electrode 50 by using a silicon nitride-silicon oxide composite material as a target material and by a radio frequency magnetron sputtering method, and the thickness of the insulating protective layer 60 is 2 to 10 μm. The carbon-silicon carbide composite material is used as a target material, a magnetron sputtering method is adopted, a conductive protection layer 70 is formed on the local part of the insulating protection layer 60, and the thickness of the conductive protection layer 70 is 2-10 mu m.

An organic resin layer 80 is disposed on a portion of the lead electrode 50, a portion of the insulating protective layer 60, and a portion of the conductive protective layer 70 by a screen printing and curing process, and is used as a supplementary protection for the protective layer.

The utility model relates to a thermal printhead is with base plate that generates heat, through control heat accumulation overglaze layer 20 and 10 marginal preformed gaps of insulating substrate, effectively avoid the base plate edge because the sharp pointed end that the cutting produced prevents to print the media by the fish tail, reduces heat accumulation overglaze layer 20 stress simultaneously and influences, improves the product and prints the quality, guarantees the product stability.

The above-mentioned embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present application and are intended to be included within the scope of the present application.

Claims (6)

1. The utility model provides a thermal printhead that prevents fish tail is with base plate that generates heat, is including having upper surface, side and being equipped with the rectangular form insulating substrate of the chamfer face of certain angle along insulating substrate length direction with the upper surface, its characterized in that still includes edge on the chamfer face the heat accumulation under glaze layer that insulating substrate length direction part set up, heat accumulation under glaze layer is apart from in main direction of printing the marginal clearance of insulating substrate is not less than 0.1 mm.

2. A heat generating substrate for a thermal print head for preventing scratches as described in claim 1, wherein: the heat storage ground coat layer before cutting treatment is provided with a plurality of reserved gaps along the length direction of the insulating substrate, and each reserved gap is not smaller than 0.2 mm.

3. A heat generating substrate for a thermal head for preventing scratches as recited in claim 1, wherein: the thickness of the heat accumulation ground coat layer is 20-60 mu m, and the width is 0.2mm-1.0 mm.

4. A heat generating substrate for a thermal head for preventing scratches as recited in claim 1, 2 or 3, wherein: the insulating substrate is characterized in that a substrate ground coat layer is at least partially arranged on the upper surface of the insulating substrate, a plurality of heating resistors are arranged on the heat storage ground coat layer along the length direction of the substrate, lead electrodes connected with the heating resistors are arranged on the substrate ground coat layer and the surface part of the heat storage ground coat layer, and an insulating protective layer covers the side surface, the chamfer surface and the part of the upper surface of the insulating substrate, the heating resistors and at least one part of the lead electrode surface.

5. A heat generating substrate for a thermal head for preventing scratches as recited in claim 4, wherein: at least a part of the insulating protective layer is covered with a conductive protective layer.

6. A heat generating substrate for a thermal head for preventing scratches as recited in claim 5, wherein: and covering a resin protective layer on at least a part of the lead electrode, the insulating protective layer and a part of the conductive protective layer.

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