CN215970712U - Thermal print head - Google Patents
Thermal print head Download PDFInfo
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- CN215970712U CN215970712U CN202122655897.XU CN202122655897U CN215970712U CN 215970712 U CN215970712 U CN 215970712U CN 202122655897 U CN202122655897 U CN 202122655897U CN 215970712 U CN215970712 U CN 215970712U
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- glaze coating
- protective layer
- insulating substrate
- substrate
- layer
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Abstract
The utility model relates to the technical field of manufacturing of thermal printing heads, in particular to a thermal printing head capable of effectively improving the reliability of a product, which is provided with an insulating substrate, wherein a chamfer surface is arranged at the joint of the upper surface and the side surface of the insulating substrate, a heat storage glaze coating is arranged on the upper surface of the chamfer surface, a substrate glaze coating is arranged on the upper surface of the insulating substrate, a plurality of heating resistors are arranged on the heat storage glaze coating, electrode leads connected with the plurality of heating resistors are arranged on the surface of the substrate glaze coating and the heat storage glaze coating, an insulating protective layer and a conductive protective layer which cover the plurality of heating resistors and at least one part of the electrode leads and a resin protective layer which covers at least part of the electrode leads are also arranged, and the thermal printing head is characterized in that the substrate glaze coating and the heat storage glaze coating are partially overlapped along the length direction of the insulating substrate, so that the environmental tolerance of the thermal printing head is improved, and no significant adverse effect is caused on the printing effect.
Description
The technical field is as follows:
the utility model relates to the technical field of manufacturing of thermal printing heads, in particular to a thermal printing head capable of effectively improving the reliability of a product.
Background art:
as is known, in order to realize rapid peeling of a thermal transfer tape from a thermal print head, a corner of an insulating substrate in a length direction is ground into a chamfered surface, a thermal storage glaze coating is formed on the chamfered surface, a plurality of electrodes are disposed on the thermal storage glaze coating in the length direction of the insulating substrate, electrode leads connected to the electrodes are formed on the surfaces of the thermal storage glaze coating and the insulating substrate, and a protective layer is formed on the electrodes and the electrode leads.
In order to reduce the adverse effect caused by overlarge surface roughness of the insulating base plate or overlarge pinhole defect on the surface of the insulating base plate, a smooth substrate protective layer can be formed on the upper surface of the insulating base plate, but the conventional substrate glaze coating is not connected with the heat storage glaze coating. This results in that the substrate glaze coating is not used, or the substrate glaze coating is not connected to the heat storage glaze coating, so that at least a partial area of the surface of the ceramic substrate is not covered with the glaze coating, and the defects of the electrode lead and the protective layer which are not covered with the glaze coating area are increased, and the risk of failure of the thermal print head in a hot and humid use environment is increased.
The utility model content is as follows:
the utility model provides a thermal printing head which does not influence printing characteristics and has high tolerance even in a damp and hot use environment, aiming at the problem that the thermal printing head arranged on a heat storage glaze coating of a chamfered surface possibly fails in the damp and hot use environment due to insufficient design.
The utility model is achieved by the following measures:
the utility model provides a thermal print head, is equipped with insulating substrate, and the upper surface and the side department of meeting of insulating substrate are equipped with the chamfer face, the upper surface of chamfer face sets up the heat accumulation glaze coating, and insulating substrate's upper surface is equipped with the substrate glaze coating, sets up a plurality of heating resistor body on the heat accumulation glaze coating, sets up the electrode lead that is connected with a plurality of heating resistor body on substrate glaze coating surface and the heat accumulation glaze coating, still is equipped with the insulating protective layer and the electrically conductive protective layer that cover a plurality of heating resistor body and at least electrode lead partly and cover part electrode lead's resin protective layer at least, its characterized in that, substrate glaze coating and heat accumulation glaze coating partially overlap along insulating substrate length direction.
The chamfer surface is provided with a heat storage glaze coating along the length direction of the insulating substrate, an underlayer glaze coating is formed on the surface of a local area of the heat storage glaze coating, a heating resistor layer is formed on the upper surface of the insulating substrate, the chamfer surface of the insulating substrate, the heat storage glaze coating and the surface of the underlayer glaze coating in a sputtering mode, a plurality of heating resistors are formed on the heating resistor layer in a portrait plate making mode, and the heating resistors are made of metal ceramic materials containing tantalum and silicon.
The electrode lead layer is formed on the upper surface of the insulating substrate, the chamfer surface of the insulating substrate, the heat storage glaze coating, the substrate glaze coating and the surface of the heating resistor body in a sputtering mode, the electrode lead layer is processed into the electrode lead connected with the heating resistor body in a portrait plate making mode, and the electrode lead is formed by adopting materials such as aluminum, aluminum alloy, tungsten-titanium alloy and the like.
According to the utility model, the upper surface, the side surface and the chamfered surface of the insulating substrate are provided with the insulating protective layer in a sputtering mode corresponding to the heat storage glaze coating, the substrate glaze coating, the heating resistor and the local area on the electrode lead, and the insulating protective layer is made of silicon oxide and silicon oxynitride layer.
The selected area on the insulating protective layer of the utility model adopts a sputtering mode to form a conductive protective layer, and the conductive protective layer adopts conductive materials, such as carbon-containing silicon carbide materials and the like.
The utility model forms the resin protective layer on the selected areas of the insulating protective layer, the conductive protective layer and the substrate glaze coating surface by adopting a printing mode, wherein the resin protective layer adopts the printing ink containing the epoxy resin.
The scheme of the utility model has the beneficial effects that the chamfer surface is formed at one corner part in the length direction of the insulating substrate, the heat storage glaze coating is formed on the chamfer surface, the substrate glaze coating is formed on the upper surface of the insulating substrate, the substrate glaze coating and the heat storage glaze coating are partially overlapped, the electrode lead and the insulating protective layer are arranged on the heat storage glaze coating and the substrate glaze coating, the problems of electrode lead defects caused by the rough and defective insulating substrate surface and insufficient compactness of the insulating protective layer are fundamentally avoided, and the environmental tolerance of the thermal printing head is improved. Moreover, the width of the overlapping region of the under glaze coating and the heat accumulation glaze coating and the thickness of the under glaze coating are limited within appropriate ranges, and the printing effect is not significantly adversely affected.
Drawings
FIG. 1 is a schematic cross-sectional view of the present invention.
Fig. 2 is a plan perspective view of a part of the heat generating substrate of the present invention.
Reference numerals: 1. an insulating substrate; 2. a heat storage glaze coating; 3. coating the substrate glaze; 4. a heating resistor body; 5. an electrode lead; 6. an insulating protective layer; 7. a conductive protective layer; 8. a resin protective layer; s1, insulating the upper surface of a substrate; s2, chamfering the surface of the insulating substrate; and S3, insulating the side surface of the substrate.
The specific implementation mode is as follows:
the following detailed description of embodiments of the utility model refers to the accompanying drawings.
Example 1:
as shown in fig. 1 and 2, the thermal print head according to this embodiment includes a flat and elongated insulating substrate 1, a chamfered surface S2 is formed by chamfering an intersecting edge portion of an upper surface S1 and a side surface S3 of the insulating substrate 1, a thermal storage glaze layer 2 is formed by printing and sintering at least a partial region of S2, and a base glaze layer 3 is formed on the partial region surfaces of S1 and the thermal storage glaze layer 2 by printing and sintering again.
A heating resistor layer is formed on the upper surface of the insulating substrate, the chamfered surface of the insulating substrate, the heat storage glaze coating 2 and the surface of the under glaze coating 30 in a sputtering mode, a plurality of heating resistors 4 are formed on the heating resistor layer in a portrait plate making mode, and the heating resistors 4 are preferably made of metal ceramic materials containing tantalum and silicon.
Electrode lead layers are formed on the upper surface of the insulating substrate, the chamfered surface of the insulating substrate, the heat storage glaze coating 2, the substrate glaze coating 3 and the surface of the heating resistor 4 in a sputtering mode, the electrode lead layers are processed into electrode leads 5 connected with the heating resistor in a portrait plate making mode, and the electrode leads can be made of materials such as aluminum, aluminum alloy, tungsten-titanium alloy and the like. The insulating protective layer 6 is formed by sputtering in selected regions of S1, S2, S3, the thermal storage glaze 2, the under glaze 3, the heating resistor 4, and the electrode lead 5, and the insulating protective layer 6 is made of an insulating material such as silicon oxide or silicon oxynitride.
Forming a conductive protection layer 7 on the selected area of the insulation protection layer 6 by sputtering,
the conductive protective layer is made of a material that can conduct electricity, such as a carbon-containing silicon carbide material.
And forming a resin protective layer 8 on selected areas on the surfaces of the insulating protective layer 6, the conductive protective layer 7 and the substrate glaze coating 3 in a printing mode, wherein the resin protective layer can be made of ink containing epoxy resin.
According to the heating substrate for the thermal printing head, the thermal storage glaze coating is formed on at least part of the chamfered surface of the heating substrate, the substrate glaze coating is formed on the upper surface of the insulating substrate and at least part of the thermal storage glaze coating, the substrate glaze coating and the thermal storage glaze coating are partially overlapped, the electrode lead and the insulating protective layer are formed on the thermal storage glaze coating and the substrate glaze coating, the problems of electrode lead defects and insufficient insulating protective layer compactness caused by rough insulating substrate surface are solved, and the environmental tolerance of the thermal printing head is improved.
Claims (7)
1. The utility model provides a thermal print head, is equipped with insulating substrate, and the upper surface and the side department of meeting of insulating substrate are equipped with the chamfer face, the upper surface of chamfer face sets up the heat accumulation glaze coating, and insulating substrate's upper surface is equipped with the substrate glaze coating, sets up a plurality of heating resistor body on the heat accumulation glaze coating, sets up the electrode lead that is connected with a plurality of heating resistor body on substrate glaze coating surface and the heat accumulation glaze coating, still is equipped with the insulating protective layer and the electrically conductive protective layer that cover a plurality of heating resistor body and at least electrode lead partly and cover part electrode lead's resin protective layer at least, its characterized in that, substrate glaze coating and heat accumulation glaze coating partially overlap along insulating substrate length direction.
2. The thermal print head according to claim 1, wherein the chamfered surface is provided with a thermal storage glaze coating along a length direction of the insulating substrate, a primer glaze coating is formed on a partial region surface of the thermal storage glaze coating, a heating resistor layer is formed on the upper surface of the insulating substrate, the chamfered surface of the insulating substrate, the thermal storage glaze coating and the primer glaze coating by sputtering, and a plurality of heating resistors are formed on the heating resistor layer by a portrait plate making method, and the heating resistors are made of a cermet material containing tantalum and silicon.
3. The thermal print head according to claim 1, wherein the electrode lead layer is formed on the upper surface of the insulating substrate, the chamfered surface of the insulating substrate, the thermal storage glaze coating, the under glaze coating, and the surface of the heating resistor by sputtering, and the electrode lead layer is processed into the electrode lead connected to the heating resistor by a portrait plate making method, and the electrode lead is formed of aluminum, an alloy of aluminum, or a tungsten-titanium alloy.
4. The thermal print head according to claim 1, wherein the insulating protective layer is formed by sputtering on the upper surface, the side surfaces and the chamfered surface of the insulating substrate corresponding to the thermal storage glaze layer, the under glaze layer, the heating resistor, and the local region on the electrode lead, and the insulating protective layer is made of silicon oxide or silicon oxynitride layer.
5. A thermal printhead according to claim 4, wherein the conductive protective layer is formed by sputtering at selected areas of the insulating protective layer, the conductive protective layer being a carbon-containing silicon carbide material.
6. A thermal print head according to claim 5 wherein the protective resin layer is printed over selected areas of the surfaces of the insulating protective layer, the conductive protective layer and the enamel layer of the substrate, the protective resin layer being selected from an epoxy-containing ink.
7. A thermal head according to claim 1, wherein a chamfered surface is formed at a corner portion in the longitudinal direction of the insulating substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122655897.XU CN215970712U (en) | 2021-10-29 | 2021-10-29 | Thermal print head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122655897.XU CN215970712U (en) | 2021-10-29 | 2021-10-29 | Thermal print head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215970712U true CN215970712U (en) | 2022-03-08 |
Family
ID=80511607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122655897.XU Active CN215970712U (en) | 2021-10-29 | 2021-10-29 | Thermal print head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215970712U (en) |
-
2021
- 2021-10-29 CN CN202122655897.XU patent/CN215970712U/en active Active
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