CN211222594U

CN211222594U - Heat-sensitive of chamfer structure beats printer head and uses base plate that generates heat

Info

Publication number: CN211222594U
Application number: CN201922050377.9U
Authority: CN
Inventors: 刘春林
Original assignee: Shandong Hualing Electronics Co Ltd
Current assignee: Shandong Hualing Electronics Co Ltd
Priority date: 2019-11-25
Filing date: 2019-11-25
Publication date: 2020-08-11
Anticipated expiration: 2029-11-25

Abstract

The utility model provides a heating substrate for a thermal printing head with a chamfer structure, which solves the problem that the grounding of a conductive protective film is damaged after the chamfer surface is formed on the heating substrate of the prior thermal printing head, it includes insulating substrate, insulating substrate's upper surface is equipped with the glaze coating, be equipped with the heating resistor layer on the glaze coating, the heating resistor layer includes a plurality of heating resistor body and first etching figure, be equipped with the electrode conductor layer on the local surface on heating resistor layer and the glaze coating, one side that insulating substrate's long direction is close to first etching figure forms the chamfer face, the local of glaze coating, the outside formation first protective layer on heating resistor body layer and the electrode conductor layer, the local of first protective layer, the chamfer face, insulating substrate's side and the local second protective layer that forms of insulating substrate lower surface, the utility model discloses can extensively be used for the thermal printing field.

Description

Heat-sensitive of chamfer structure beats printer head and uses base plate that generates heat

Technical Field

The utility model discloses the thermal printing field especially relates to a thermal printing head of chamfer structure is with base plate that generates heat.

Background

It is known that a heat-generating substrate for a thermal head is provided with a conductive protective layer on an upper surface, one side surface in a longitudinal direction, and a part of a lower surface, and the conductive protective layer is grounded to eliminate static charges generated during printing of the thermal head and to prevent damage to the thermal head due to static charge accumulation.

However, in some application scenarios, such as a label printer, the printing medium needs to be rotated before printing, so as to start printing at a relatively accurate starting position of each label, and the rectangular edge of the heating substrate of the thermal printing head in the longitudinal direction is prone to leave scratches on the printing medium; in order to solve the scratch problem of the heating substrate in the long direction to the printing medium, the heating substrate in the long direction is usually ground and removed to form a chamfer surface.

However, when the rectangular edge in the longitudinal direction of the heat generating substrate of the thermal printhead is polished and removed, the conductive protective layer provided on the heat generating substrate is also polished and removed, and thus the conductive protective layer and the grounding effect are destroyed, and the function of preventing the accumulation of static electricity is lost, which may cause the electrostatic destruction of the thermal printhead.

Disclosure of Invention

The utility model discloses be exactly to the destroyed problem of ground connection of current thermal printing head base plate that generates heat behind the formation chamfer face electric conductivity protection film, provide one kind and do not influence the thermal printing head of the chamfer structure of the ground connection effect of electric conductivity protection layer with the base plate that generates heat at being equipped with the chamfer face.

Therefore, the utility model discloses an insulating substrate, insulating substrate's upper surface is equipped with the glaze coating, be equipped with the heating resistor layer on the glaze coating, the heating resistor layer includes a plurality of heating resistor body and first etching figure, be equipped with the electrode conductor layer on the local surface on heating resistor layer and the glaze coating, one side that insulating substrate's long direction is close to first etching figure forms the chamfer face, the part of glaze coating, the outside formation first protective layer on heating resistor body layer and the electrode conductor layer, the part of first protective layer, the chamfer face, the side of insulating substrate and the local formation second protective layer of insulating substrate lower surface.

Preferably, the insulating substrate is a rectangular parallelepiped insulating substrate having a flat and long shape.

Preferably, the glaze coating is formed on the insulating substrate by printing and sintering.

Preferably, the heating resistor and the first etching pattern are formed by a photolithography method.

Preferably, the electrode wire layer includes an electrode wire and a second etching pattern, the second etching pattern is formed on the upper surface of the first etching pattern, and the electrode wire is formed on a part of the surface of the heating resistor and a part of the upper surface of the glaze coating.

Preferably, the first protective layer and the second protective layer are formed by sputtering.

Preferably, the first protective layer is an insulating material, and the second protective layer is a conductive material.

Preferably, the first etched pattern is not electrically connected to the electrode lead and the heating resistor.

Preferably, the second etched pattern is not electrically connected to the electrode lead and the heating resistor.

Preferably, the first etching pattern is made of the same material as that of the heating resistor, and the second etching pattern is made of the same material as that of the electrode lead.

The scheme of the utility model has the advantages that the chamfer surface is formed at one corner part in the length direction of the insulating substrate, the conductive protective layer is arranged at the part of the upper surface, the chamfer surface, one side surface and the part of the lower surface of the insulating substrate, and the protective layer of the lower surface is grounded, so that the anti-static effect of the heating substrate does not disappear due to the chamfer surface; the first etching graph and the second etching graph are arranged in the area, close to the chamfer face, on the surface of the insulating substrate, the adhesive force between the first protective layer and the insulating substrate and between the second protective layer and the insulating substrate are enhanced, the first protective layer and the second protective layer formed on the complex curved surface are prevented, and the protective layer is separated from the substrate due to insufficient adhesive force.

Drawings

Fig. 1 is a schematic view of a large-sized insulation substrate according to the present invention;

FIG. 2 is a schematic structural view of the present invention;

fig. 3 is a perspective plan view of the heating substrate according to the present invention.

The symbols in the drawings illustrate that:

11. a large-sized insulating substrate; l. dividing lines of the insulating substrate; 10. an insulating substrate; 20. coating a glaze layer; 30. a heat-generating resistor layer; 30a, a heating resistor body; 30b, first etching patterns; 40. an electrode lead layer; 40a. an electrode lead; 40b, second etching patterns; 50. a first protective layer; 60. and a second protective layer.

Detailed Description

The following describes in detail embodiments of the present invention with reference to the drawings.

As shown in fig. 1, 2 and 3, the utility model discloses a by a wide margin insulating substrate 11, by a wide margin insulating substrate 11 is cut apart into a plurality of insulating substrate 10 by parting line L, and insulating substrate 10 is the cuboid insulating substrate of flat rectangular shape, and the upper surface of insulating substrate 10 adopts the mode of printing sintering to be formed with glaze coating 20.

The heating resistor layer 30 is formed on the upper surface S1 of the glaze layer 20 by sputtering, and the plurality of heating resistors 30a and the first etched patterns 30b are formed on the heating resistor layer 30 by photolithography, and the first etched patterns 30b are formed of the same material as the heating resistors 30a.

Forming an electrode lead layer 40 on the upper surface S1 of the glaze layer 20 and a part of the heating resistor layer 30 by sputtering, and forming an electrode lead 40a and a second etching pattern 40b on the electrode lead layer 40 by a pattern making method, wherein the second etching pattern 40b is made of the same material as the electrode lead 40 a; the second etching pattern 40b is formed on the upper surface of the first etching pattern 30b, and the first etching pattern 30b is not electrically connected to the electrode lead 40a and the heating resistor 30 a; the electrode lead wire 40a is formed on a part of the surface of the heating resistor 30a and a part of the upper surface S1 of the enamel coating 20, and the second etched pattern 40b is not electrically connected to the electrode lead wire 40a and the heating resistor 30a.

Grinding one side of the insulating substrate 10 close to the first etching pattern 30b in the length direction to form a chamfered surface S2, wherein an included angle is formed between S1 and S2 and is set to be 190-220 degrees; the first protective layer 50 is formed on the part of the upper surface S1 of the glaze layer 20, outside the heating resistor 30a, the first etching pattern 30b, the electrode lead 40a, the second etching pattern 40b and the chamfered surface S2, the first protective layer 50 is formed by sputtering, and the first protective layer 50 is made of an insulating material.

The second protective layer 60 is formed on a part of the first protective layer 50, the heating resistor layer 30a, the electrode lead layer 40, the chamfered surface S2, the one side surface S3 of the insulating substrate 10, and a part of the lower surface S4 of the insulating substrate 10, the second protective layer 60 is formed by sputtering, and the second protective layer 60 is made of a conductive material and may be formed of carbon or silicon carbide.

The utility model provides a thermal printer head is with base plate that generates heat has set up the antistatic protective layer in the part of the upper surface of the base plate that generates heat, chamfer face, side, the part of lower surface, and the antistatic protective layer of lower surface passes through means ground connection, eliminates the static charge that the thermal printer head printing in-process produced, prevents that the thermal printer head from being destroyed by static.

However, the above description is only an embodiment of the present invention, and the scope of the present invention should not be limited thereto, so that the replacement of the equivalent components or the equivalent changes and modifications made according to the protection scope of the present invention should be covered by the claims of the present invention.

Claims

1. A heating substrate with a chamfer structure for a thermal printing head comprises an insulating substrate, wherein a glaze coating is arranged on the upper surface of the insulating substrate, and a heating resistor layer is arranged on the glaze coating.

2. A heat generating substrate for a thermal printhead having a chamfered structure as defined in claim 1, wherein the insulating substrate is a rectangular parallelepiped insulating substrate having a flat and elongated shape.

3. The heat generating substrate for a thermal print head having a chamfered structure according to claim 1, wherein the glaze layer is formed on the insulating substrate by printing and sintering.

4. The heat-generating substrate for a thermal head having a chamfered structure according to claim 1, wherein the heat-generating resistor and the first etching pattern are formed by a photolithography method.

5. The heat-generating substrate for a thermal head having a chamfered structure according to claim 1, wherein the electrode lead layer includes an electrode lead and a second etched pattern, the second etched pattern is formed on an upper surface of the first etched pattern, and the electrode lead is formed on a part of a surface of the heat-generating resistor and a part of an upper surface of the glaze layer.

6. The heat-generating substrate for a thermal head having a chamfered structure as claimed in claim 1, wherein the first protective layer and the second protective layer are formed by sputtering.

7. The heat generating substrate for a thermal head having a chamfered structure according to claim 1, wherein the first protective layer is an insulating material and the second protective layer is a conductive material.

8. The heat generating substrate for a thermal head having a chamfered structure according to claim 5, wherein the first etched pattern is not electrically connected to the electrode leads and the heat generating resistor.

9. A heat generating substrate for a thermal head having a chamfered structure according to claim 5, wherein the second etched pattern is not electrically connected to the electrode leads and the heat generating resistor.

10. A heat generating substrate for a thermal head having a chamfered structure according to claim 5, wherein the first etched pattern is made of the same material as a heat generating resistor and the second etched pattern is made of the same material as an electrode lead.